Switching control scheme for wireless charging device

Abstract

The wireless charging pad may include: an H-bridge circuit; and a resonant tank electrically connected to the H-bridge circuit and the switch control circuit. The resonant tank may include a coil arranged for wireless power transfer. The switch control circuit may control the H-bridge circuit using both the first modulation and the second modulation. The first modulation includes two non-zero switching configurations and two different zero switching configurations. The second modulation includes two non-zero switching configurations and two different zero switching configurations different in order from the first modulation.

Description

Cross Reference to Related Applications

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 705,322, filed October 9, 2024, entitled “Switching Control Scheme for Wireless Charging Device”, and U.S. Patent Application No. 19 / 313,624, filed August 28, 2025, entitled “Switching Control Scheme for Wireless Charging Device”, the technical disclosures of which are incorporated herein by reference in their entirety. Technical Field

[0002] This disclosure relates to systems and methods for wireless charging. More specifically, embodiments of this disclosure relate to wireless charging and methods for controlling wireless charging circuit signals. Background Technology

[0003] Batteries are components of various battery-powered devices, equipment, or transportation platforms, such as electric vehicles, robots, electric bicycles, electric motorcycles, drones, and many other types of devices. Batteries can be paired with wireless charging devices and arranged to receive energy via electromagnetic coupling with the wireless charging device through a receiver pad. Specifically, the wireless charging device can use one or more internal coils to sense electromagnetic fields, and one or more corresponding receiver coils connected to the battery can capture these fields within a certain proximity to the charging device. Wireless charging presents a variety of technical challenges. Summary of the Invention

[0004] The systems, methods, and apparatuses disclosed herein each have several innovative embodiments, and no single embodiment is solely responsible for all the desired properties disclosed herein. Details of one or more embodiments of the subject matter described herein are set forth in the accompanying drawings and the following description.

[0005] In some aspects, the technology described herein relates to a wireless power transfer method comprising: controlling an H-bridge circuit of a grounding mat with a first modulation of the H-bridge configuration, the first modulation comprising two non-zero switching configurations and two distinct zero switching configurations, the two non-zero switching configurations comprising a positive switching configuration and a negative switching configuration; switching the control of the H-bridge circuit from the first modulation to a second modulation, the second modulation comprising two non-zero switching configurations and two distinct zero switching configurations in a different order than the first modulation; and using the H-bridge circuit to induce wireless power transfer from the grounding mat to a vehicle mat of a vehicle.

[0006] In some respects, the techniques described herein relate to a method in which the transition of an H-bridge circuit from a first modulation to a second modulation occurs in a timely manner during one of the two non-zero switching configurations.

[0007] In some respects, the techniques described herein relate to a method in which a first modulation sequentially controls an H-bridge circuit, wherein each transition between sequentially associated switching configurations involves a switch being turned on and a switch being turned off.

[0008] In some respects, the techniques described herein relate to a method in which both the first modulation and the second modulation correspond to the same output voltage waveform provided from the H-bridge circuit.

[0009] In some respects, the techniques described herein relate to a method in which a first modulation includes operating the H-bridge circuit in two non-zero switching configurations for a longer duration than operating in two different zero-switching configurations.

[0010] In some respects, the techniques described herein relate to a method in which a first modulation controls an H-bridge circuit in a first sequence, wherein a positive switching configuration follows a first zero-switching configuration of two different zero-switching configurations, and wherein a second modulation controls the H-bridge circuit in a second sequence, wherein a positive switching configuration follows a second zero-switching configuration of two different zero-switching configurations.

[0011] In some respects, the techniques described herein relate to a method in which a first modulation controls an H-bridge circuit in a first sequence, wherein a second zero-switching configuration of two different zero-switching configurations follows a positive switching configuration, and wherein a second modulation controls the H-bridge circuit in a second sequence, wherein a first zero-switching configuration of two different zero-switching configurations follows a positive switching configuration.

[0012] In some respects, the techniques described herein relate to a method in which the H-bridge circuit is controlled by a first modulation for at least 50% of the wireless charging cycle.

[0013] In some respects, the techniques described herein relate to a method that also includes switching the control of an H-bridge circuit from a second modulation to a third modulation, the third modulation comprising only the first zero-switching configuration of two non-zero-switching configurations and two different zero-switching configurations.

[0014] In some respects, the techniques described herein relate to a method that also includes switching the control of an H-bridge circuit from a second modulation to a fourth modulation, the fourth modulation including only the second zero-switching configuration of two non-zero-switching configurations and two different zero-switching configurations.

[0015] In some respects, the techniques described herein relate to a method that further includes determining, at least in part, based on a temperature associated with the H-bridge circuit, that the H-bridge circuit will transition from a first modulation to a second modulation, wherein, in response to this determination, transition control of the H-bridge circuit from the first modulation to the second modulation is performed.

[0016] In some respects, the techniques described herein relate to a method that also includes determining, at least in part, the frequency at which the H-bridge circuit controls the transition from a first modulation to a second modulation, based on a temperature associated with the H-bridge circuit.

[0017] In some aspects, the technology described herein relates to a method for wireless power transfer, the method comprising: controlling a switching circuit of a wireless charging pad with a first modulation configuring the switching circuit, the first modulation comprising two non-zero switching configurations and two distinct zero switching configurations, the two non-zero switching configurations comprising a positive switching configuration and a negative switching configuration; and switching the control of the switching circuit from the first modulation to a second modulation, the second modulation comprising two non-zero switching configurations and two distinct zero switching configurations in a different order than the first modulation; wherein the switching circuit receives a voltage associated with wirelessly receiving power from another wireless charging pad.

[0018] In some respects, the techniques described herein relate to a method in which the switching circuit transition from a first modulation to a second modulation is controlled to occur in a timely manner during one of two non-zero switching configurations.

[0019] In some aspects, the technology described herein relates to a wireless charging pad comprising: an H-bridge circuit; a resonant circuit electrically connected to the H-bridge circuit, the resonant circuit including coils arranged for wireless power transfer; and a switch control circuit configured to control the H-bridge circuit using both a first modulation and a second modulation, wherein the first modulation includes two non-zero switching configurations and two distinct zero switching configurations, and wherein the second modulation includes two non-zero switching configurations and two distinct zero switching configurations in a different order than the first modulation.

[0020] In some respects, the technology described herein relates to wireless charging pads, where the wireless charging pad is a ground plane.

[0021] In some respects, the technology described herein relates to wireless charging pads, where the wireless charging pad is a vehicle pad.

[0022] In some respects, the technology described herein relates to wireless charging pads configured for wireless power transfer associated with charging a vehicle’s battery pack, wherein the battery pack has an operating voltage in the range of 200 volts to 800 volts.

[0023] In some respects, the technology described herein relates to a wireless charging pad, wherein controlling the H-bridge circuit includes switching the control of the H-bridge circuit from a first modulation to a second modulation.

[0024] In some respects, the technology described herein relates to wireless charging pads, wherein the transition control of the H-bridge circuit from a first modulation to a second modulation occurs in a timely manner during one of the two non-zero switching configurations. Attached Figure Description

[0025] These and other features, aspects, and advantages of this disclosure have been described with reference to the accompanying drawings of certain embodiments. It should be understood that the drawings, which are incorporated into and form part of this specification, are for illustrative purposes only and are not drawn to scale.

[0026] Figure 1A An example wireless charging environment in which embodiments of the present disclosure may be implemented is illustrated.

[0027] Figure 1B The illustrations are of some embodiments according to this disclosure. Figure 1A A block diagram of an example wireless charging environment.

[0028] Figure 1C The illustration shows a grounding pad that can be used as a wireless charging device according to some embodiments of the present disclosure.

[0029] Figures 2A-2D The illustration shows an example circuit diagram of a wireless charging system according to some embodiments of the present disclosure.

[0030] Figure 3 An example block diagram of a wireless charging pad according to some embodiments of the present disclosure is illustrated.

[0031] Figures 4A-4D The figures illustrate some embodiments according to the present disclosure. Figure 3 Example switch configuration of the H-bridge circuit for a wireless charging pad.

[0032] Figures 5A-5B The diagram illustrates a switch configuration scheme for controlling an H-bridge circuit.

[0033] Figures 6A-6B Examples of switching configuration schemes for controlling an H-bridge circuit according to some embodiments of the present disclosure are illustrated.

[0034] Figure 7 The diagram illustrates a switching configuration scheme with a non-smooth transition between two modulation schemes.

[0035] Figure 8 The illustration shows a switching configuration scheme that smoothly transitions between two modulation schemes according to an embodiment of the present disclosure.

[0036] Figure 9 An example diagram of a switch control circuit connected to a switch according to an embodiment of the present disclosure is shown. Detailed Implementation

[0037] The following detailed description of certain embodiments presents various descriptions of specific embodiments. However, the innovations described herein can be embodied in many different ways, such as those defined and covered by the claims. Reference is made in this specification to the accompanying drawings, wherein the same reference numerals and / or terms may indicate the same or functionally similar elements. It should be understood that the elements shown in the drawings are not necessarily drawn to scale. Furthermore, it should be understood that some embodiments may include more elements than shown in the drawings and / or a subset of the elements shown in the drawings. Additionally, some embodiments may incorporate any suitable combination of features from two or more drawings. The headings provided herein are for convenience only and do not necessarily affect the scope or meaning of the claims. introduce

[0038] Various aspects of this disclosure relate to systems and methods for wirelessly charging battery packs via wireless power transfer. More specifically, this disclosure relates to alternating modulation schemes for controlling circuitry of a wireless charging device designed to charge a battery pack. Illustratively, the circuitry of the wireless charging device may include circuitry means for generating an AC signal by inverting a direct current (DC) signal into an alternating current (AC) signal. Such circuitry means may have a bridge topology, such as an H-bridge. In some embodiments, the circuitry means may include a plurality of switches. Controlling the operation of each of these switches can invert the DC signal into an AC signal. For example, by opening or closing each switch of the circuitry means, the DC signal (e.g., the input signal of the H-bridge) can be inverted to a positive, negative, or zero voltage. Generally, the DC signal may be the input power of the wireless charging device and is received from an external source such as a wall-mounted power outlet, a solar cell (one or more), etc.

[0039] In various embodiments, wireless charging devices can be used to charge vehicles, such as electric vehicles with battery packs. In these embodiments, the wireless charging device can be implemented as a grounding mat or a vehicle mat. For example, a grounding mat can be located under a vehicle mat of an electric vehicle to charge the electric vehicle. A wireless charging DC / DC converter (also referred to as a combined DC / DC power converter) can include a DC / AC inverter in the grounding mat and an AC / DC rectifier in the vehicle mat. Power can be wirelessly transferred from the grounding mat to the vehicle grounding mat. In some embodiments, the vehicle mat can also transfer wireless power based on receiving DC signals from the vehicle's battery pack. For example, the vehicle mat can receive DC signals from the battery pack and convert the DC signals into AC signals.

[0040] Wireless charging devices can be used to wirelessly charge vehicles in a variety of operating environments or conditions. In wireless charging of electric vehicles, low cost, high density, and operation over a wide range of ambient temperatures can be important. For example, the hotspot temperature in semiconductor devices (such as the device bridge included in a wireless charging device) can be a limiting factor for one or more of the total device die area, thermal management system, or associated cost, weight, and volume.

[0041] To address at least some of the aforementioned technical problems, embodiments of this disclosure relate to methods for reducing hotspot temperatures in semiconductor devices. More specifically, some embodiments of this disclosure provide methods for reducing hotspot temperatures in semiconductor devices by balancing the temperatures between semiconductor devices. The methods disclosed herein can balance power losses in semiconductor devices, which can be important in wireless charging operations.

[0042] In some embodiments, the switch control circuit can be configured to control the switching mechanism of the switches included in the H-bridge circuit of the wireless charging device. Each switch in the H-bridge circuit can include a semiconductor device, such as a metal-oxide-semiconductor field-effect transistor (MOSFET). Controlling the switching mechanism can balance the heat generated from each switch, particularly body diode conduction losses, as well as switching losses, which can primarily be turn-off losses under zero-voltage switching. For example, during operation of the wireless charging device, the on-time, off-current, and / or losses of the switches can be balanced. Therefore, temperature and power consumption between switches can be balanced without generating hotspot temperatures on some switches, and the highest temperature associated with the switches can be reduced. Experiments indicate that using the switching method disclosed herein, the temperature on hotspots is reduced by more than 10°C.

[0043] In the various embodiments disclosed herein, the switch control circuit can control a first and a second switch arranged in the first half-bridge of the H-bridge circuit to switch between an open and a closed state. The switch control circuit can also control a third and a fourth switch arranged in the second half-bridge of the H-bridge circuit so that they do not switch. For example, the switch control circuit can control the H-bridge circuit to operate in a first switch configuration and a second switch configuration. In the first switch configuration, the first switch is closed, the second switch is open, the third switch is closed, and the fourth switch is open. Upon transitioning from the first configuration to the second switch configuration, the first switch is open, the second switch is closed, the third switch remains closed, and the fourth switch remains open.

[0044] In some embodiments, the switch control circuitry can generate a modulated waveform to control the switches in the H-bridge. Such a modulated waveform can be generated by balancing the switching operations of the switches in the H-bridge. For example, each switch of the H-bridge can be turned on or off twice in each cycle of the modulated waveform, such that during a first state of the cycle, the second and fourth switches can be closed (the first and third switches are open); during a second state of the cycle, the first and fourth switches can be closed (the second and third switches are open); during a third state of the cycle, the first and third switches can be closed (the second and fourth switches are open); and during a fourth state of the cycle, the second and third switches can be closed (the first and fourth switches are open). In some examples, the balancing or alternation between different schemes (e.g., different states) can occur over various durations (e.g., longer timescales). Example timescales for balancing or alternating between different schemes can include milliseconds, seconds, minutes, or hours. Therefore, each switch operation in the modulated waveform can be balanced, and hot spot temperatures can be reduced by balancing heat generation and power consumption between the switches. The above-described modulated waveform is provided as an example, and this disclosure discloses various modulated waveforms that can provide a balance of heat generation and power consumption between switches.

[0045] Some embodiments of this disclosure also provide modulation schemes that can provide a smooth transition between two different modulation waveforms. For example, the switch control circuit can be configured to transition from a first modulation waveform to a second modulation waveform when the output voltage of the H-bridge circuit is positive or negative, by preventing a transition when the output voltage of the H-bridge is zero. This modulation waveform transition scheme provides a smooth transition, thereby reducing and / or eliminating overvoltage or current transients in the resonant circuit of the wireless charging device. For example, a transition occurring at the zero output voltage of the H-bridge can cause a transient change in the output voltage from zero to negative or from zero to positive. Such a voltage change can cause an overvoltage or current voltage to be applied from the H-bridge circuit to the resonant circuit.

[0046] Although various aspects will be described with reference to illustrative embodiments and combinations of features, those skilled in the art will understand that the examples and combinations of features are illustrative in nature and should not be construed as limiting. More specifically, aspects of this application are applicable to various types of vehicle charging mechanisms, power supplies, interfaces, etc. Furthermore, although specific H-bridge circuit diagrams for charging batteries and / or battery packs at different voltage levels will be described, such illustrative H-bridge circuit diagrams should not be interpreted as limiting. Therefore, those skilled in the art will understand that aspects of this application are not necessarily limited to applications in any particular type of vehicle, vehicle charging infrastructure, communication or illustrative interaction between the vehicle, owner / user, and wireless battery charging system. Overview of wireless charging

[0047] In general, inductive charging (often referred to as wireless charging) is a form of wireless power transfer. Inductive charging uses electromagnetic induction to generate or otherwise supply power to devices without requiring physical electrical connections. Specifically, various devices can be placed near charging stations or inductive pads without the need for precise alignment or electrical contact, physical docking, plugs, etc. These devices include, but are not limited to, vehicles, manufacturing equipment, consumer electronics, and medical devices.

[0048] According to aspects of this application, an inductive charging system is configured to transfer energy via inductive coupling between components. The illustrative charging system includes a transfer component, which can be configured as a charging station or charging pad. A charging pad for wirelessly transferring power to a vehicle can be referred to as a grounding pad. Alternating current (AC) from a power source (e.g., an input current) passes through an induction coil in the charging station or charging pad. Based on the input current, moving charges passing through the induction coil (e.g., the grounding pad coil) generate (or induce) a magnetic field. Illustratively, the magnetic field strength can fluctuate at least partially according to variations or fluctuations in the amplitude of the input current. The varying magnetic field generates AC in an induction coil on a receiving device (e.g., the vehicle grounding pad coil). The induced AC in the receiving device can then be converted to direct current (DC) by a rectifier. Finally, the receiving vehicle may include additional charging components and / or systems that utilize the converted DC to charge a battery system, provide operating power, or a combination thereof.

[0049] When the illustrative inductive charging system uses resonant inductive coupling components / techniques, a greater distance can be achieved between the grounding pad and the vehicle pad coil. More specifically, in some embodiments, capacitors can be connected to each induction coil to create two LC circuits with a specific resonant frequency. The frequency of the alternating current is matched to the resonant frequency. Furthermore, considering peak efficiency, the matched frequency can be further selected based on the typical distance between the transmitting and receiving devices. Additionally, for energy transfer efficiency purposes, other materials can be used for the receiver coil, such as silver-plated copper or sometimes aluminum, to minimize weight and reduce resistance.

[0050] Figure 1A This is a diagram illustrating an environment 100 for implementing an inductive wireless charging system according to various aspects of this application. Environment 100 can illustratively correspond to commercial implementations, such as parking lots, parking kiosks, charging booths, etc. Environment 100 can also correspond to private or other non-commercial implementations, such as private residences. As an illustrative example, an implementation of an inductive wireless charging system in a non-commercial implementation may include a grounding pad 102 configured to generate a variable magnetic field according to an inductive charging method. Similarly, as... Figure 1AAs shown, the grounding pad 102 (also referred to as the transmitting component) may correspond to a separate component operable to be mounted or placed on the floor 104 or another flat surface. In some other embodiments, the grounding pad 102 may be integrated or combined with other devices or components.

[0051] The grounding pad 102 can be connected to one or more power sources, such as utility inputs, real-time power sources (e.g., solar or wind power), energy storage batteries, or combinations thereof. As described herein, the power source is configured to provide input AC power. The grounding pad 102 can be connected to the power source via a direct electrical connection 106, such as via a junction box 108 located on a wall surface 118.

[0052] like Figure 1A As shown, in one embodiment, the grounding pad 102 corresponds to a shape factor that allows wireless charging of a vehicle with a vehicle pad coil at a location on the floor 104. The grounding pad 102 may have a shape factor that allows the vehicle to be positioned directly above the top surface of the grounding pad 102. Illustratively, the dimensions of the grounding pad 102 (e.g., the height and width of the grounding pad 102) may be configured such that the distance between the top surface of the grounding pad 102 and the bottom surface of the vehicle meets specific criteria, such as a minimum distance between the grounding pad coil and the vehicle pad coil, a maximum distance between the grounding pad coil and the vehicle pad coil, etc. In some embodiments, the vehicle pad and / or grounding pad 102 (or a combination thereof) may be configured with additional components for adjusting (e.g., static and / or dynamic adjustment) such distances or otherwise changing the relative orientation between the grounding pad 102 and the vehicle.

[0053] In some embodiments, grounding pad 102 may be configured to charge a vehicle's battery pack, wherein the battery pack may have a nominal voltage exceeding 200 volts (e.g., a nominal voltage of approximately 350 volts or 355 volts) and a maximum voltage of 400 volts. In some embodiments, grounding pad 102 may be configured to provide 800 volts of DC power. In some embodiments, grounding pad 102 may provide a voltage in the range of approximately 200 volts to 800 volts. Grounding pad 102 may wirelessly deliver sufficient power to charge the battery pack with such voltages.

[0054] Figure 1BThe illustration shows a block diagram of an environment 100, including a wireless charging device 111 (e.g., a grounding pad 102) that wirelessly communicates with a vehicle 112, such as via an inductively based magnetic field. The wireless charging device 111 is also connected to one or more energy sources 110. Although the wireless charging device 111 is shown as having a direct connection to the energy source 110, at least some portion of the input AC power may be provided via wireless transmission methods. Furthermore, in embodiments with multiple power sources, the environment may also include various switching components to enable energy selection from a single energy source 110 or a combination of energy sources 110.

[0055] Figure 1C The illustration shows a device that can be used as a wireless charging device 111 (such as...). Figure 1B A block diagram of grounding pad 102 (shown). Grounding pad 102 may include at least one grounding pad coil 122 for generating a magnetic field from an input current supplied by energy source 110. Figure 1C As shown, the input current can be provided by direct electrical connection 106.

[0056] In some embodiments, the grounding pad 102 may further include various sensor components 124A, 124B, 124C, and 124D related to the charging process. For illustration, sensor components 124A, 124B, 124C, and 124D may be configured for various functions, such as vehicle 112 detection, object detection, distance measurement to the vehicle, environmental sensors (e.g., temperature sensors, humidity sensors), pressure sensors, etc. In one embodiment, sensor components 124A, 124B, 124C, and 124D may include radar sensors. Sensor components 124A, 124B, 124C, and 124D may include logic and processing components related to the charging process, including operation measurement results, operation control, safety measurement results, communication components, etc. Wireless charging system with H-bridge circuit

[0057] Figures 2A-2D The diagram illustrates the circuit of the example wireless charging system 200A-200D. Figures 2A-2D As shown, each of the wireless charging systems 200A-200D may include a grounding pad (e.g., grounding pad 102) and a vehicle pad attached to or otherwise integrated with the vehicle. For example, the grounding pad of wireless charging system 200A may include capacitor 212A, H-bridge circuit 202A, and resonant circuit 204A, such as... Figure 2A As shown. For example, as Figure 2A As shown, the vehicle electrode plate of the wireless charging system 200A may include a capacitor 214A, an H-bridge circuit 208A, and a resonant circuit 206A. In some embodiments, the power can be drawn from a power source ( Figure 2A(Not shown in the image) is transmitted to the vehicle's battery pack via H-bridge circuit 202A, resonant circuit 204A, resonant circuit 206A, and H-bridge circuit 208A. Figure 2A (Not shown in the diagram). This power transfer may include wireless power transfer from coil L1 of the grounding pad to coil L2 of the vehicle pad. Any wireless charging system 200A-200D can be implemented based on any suitable principles and advantages disclosed herein.

[0058] Figure 2A The diagram illustrates the circuit of a 200A wireless charging system. Figure 2A As shown, the wireless charging system 200A corresponds to an LCC-LCC circuit architecture. As illustrated, the wireless charging system 200A includes a capacitor 212A, an H-bridge circuit 202A, a resonant circuit 204A, a resonant circuit 206A, an H-bridge circuit 208A, and a capacitor 214A. In the LCC-LCC circuit architecture, the inductor L... f1 and capacitor C f1 C1 is coupled between the H-bridge circuit 202A and the ground pad coil L1 in the ground pad, and the inductor L... f2 and capacitor C f2 C2 is coupled between the H-bridge circuit 208A and the vehicle mat coil L2 in the vehicle mat.

[0059] Figure 2B The diagram illustrates the circuit of the wireless charging system 200B. (For example...) Figure 2B As shown, the wireless charging system 200B corresponds to an LCC series circuit architecture. As illustrated, the wireless charging system 200B includes a capacitor 212B, an H-bridge circuit 202B, a resonant circuit 204B, a resonant circuit 206B, an H-bridge circuit 208B, and a capacitor 214B. In the LCC series circuit architecture, the inductor L... f1 and capacitor C f1 C1 is coupled between H-bridge circuit 202A and ground pad coil L1 in ground pad, and series capacitor C2 is coupled between H-bridge circuit 208A and vehicle pad coil L2 in vehicle pad.

[0060] Figure 2C The diagram illustrates the circuit of the wireless charging system 200C. Figure 2C As shown, the wireless charging system 200C corresponds to a series LCC circuit architecture. As illustrated, the wireless charging system 200C includes a capacitor 212C, an H-bridge circuit 202C, a resonant circuit 204C, a resonant circuit 206C, an H-bridge circuit 208C, and a capacitor 214C. In the series LCC circuit architecture, the series capacitor C1 is coupled between the H-bridge circuit 202A and the grounding coil L1 in the grounding pad, and the inductor L... f2 and capacitor Cf2 C2 is coupled between the H-bridge circuit 208A and the vehicle mat coil L2 in the vehicle mat.

[0061] Figure 2D The diagram illustrates the circuit of the 200D wireless charging system. Figure 2D As shown, the wireless charging system 200D corresponds to a series-to-series circuit architecture. As illustrated, the wireless charging system 200D includes a capacitor 212D, an H-bridge circuit 202D, a resonant circuit 204D, a resonant circuit 206D, an H-bridge circuit 208D, and a capacitor 214D. In the series-to-series circuit architecture, series capacitor C1 is coupled between the H-bridge circuit 202A and the grounding coil L1 in the grounding pad, and series capacitor C2 is coupled between the H-bridge circuit 208A and the vehicle pad coil L2 in the vehicle pad. Example wireless charging pad

[0062] Figure 3 An example wireless charging pad 300 according to some embodiments of the present disclosure is illustrated. The wireless charging pad 300 includes an H-bridge circuit 322, a resonant circuit 324, and a switch control circuit 326. The wireless charging pad 300 can charge a vehicle's battery pack over a relatively wide voltage range by switching the H-bridge circuit 322. Any suitable principles and advantages of the wireless charging pad 300 can be derived from... Figures 1A-1C Implemented in any suitable environment that combines the principles and advantages of [the principle / principle].

[0063] The wireless charging pad 300 can be implemented on any grounding mat or vehicle mat of the wireless charging systems 200A-200D to extend the operable voltage range and / or improve wireless charging efficiency. For example, the wireless charging board 300 can be the grounding plate and / or vehicle board of any wireless charging system 200A-200D. In some embodiments, the H-bridge circuit 322 can correspond to any of H-bridge circuits 202A, 208A, 202B, 208B, 202C, 208C, 202D, and 208D. The resonant circuit 324 can correspond to any of resonant circuits 204A, 206A, 204B, 206B, 204C, 206C, 204D, and 206D. The H-bridge circuit 322 is an example switching circuit. Any other suitable switching circuit can be used based on any suitable principles and advantages disclosed herein. Such switching circuits may include half-bridge circuits.

[0064] like Figures 4A-4DAs shown, the H-bridge circuit 322 may include switches 322-1, 322-2, 322-3, and 322-4. In some embodiments, instead of periodically switching each of switches 322-1, 322-2, 322-3, and 322-4, the switch control circuit 326 may control some of the switches 322-1, 322-2, 322-3, and 322-4 to periodically switch between open and closed states, and control some of the switches 322-1, 322-2, 322-3, and 322-4 to remain open or closed without switching. Thus, the switch control circuit 326 can adjust the switching state according to the desired state. Figures 6A-6B and Figure 8 The modulation scheme shown is used to configure switches 322-1-322-4 to allow the wireless charging pad 300 to charge the battery pack over a wider voltage range.

[0065] Switch control circuit 326 can provide control signals to control the switching state of H-bridge circuit 322 (e.g., Figures 4A-4D (Switches 322-1 to 322-4). The switch control circuit 326 can be implemented by any suitable circuit arrangement to control the state of the switches of the H-bridge circuit 322. When the switches of the H-bridge circuit 322 have gates (e.g., the switches are FETs or IGBTs), the switch control circuit 326 can provide control signals to the gates of the H-bridge. In such examples, the switch control circuit 326 can be referred to as a gate drive circuit. Example H-bridge switch configuration

[0066] Figures 4A-4D An example switch configuration of an H-bridge circuit 322 that can be controlled by a switch control circuit 326 according to some embodiments of the present disclosure is shown. Figure 4A The H-bridge circuit 322 is shown to be configured as a switch configuration 410 by the switch control circuit 326, which may be referred to as the positive configuration. Figure 4B The H-bridge circuit 322 is shown to be configured as a switch configuration 420 by the switch control circuit 326, which may be referred to as a negative configuration. Figure 4C The H-bridge circuit 322 is shown to be configured as a switch configuration 430 by the switch control circuit 326, which may be referred to as a zero-1 configuration. Figure 4D The H-bridge circuit 322 is shown to be configured as a switch configuration 440 by the switch control circuit 326, which may be referred to as the zero-2 configuration.

[0067] The H-bridge circuit 322 includes four switching switches: 322-1 (also referred to herein as "AP"), 322-2 (also referred to herein as "AN"), 322-3 (also referred to herein as "BN"), and 322-4 (also referred to herein as "BP"). These switches can be any suitable switches for power electronic devices, such as the n-type field-effect transistors disclosed herein arranged to exchange sufficient voltage for wireless charging. In some applications, the H-bridge circuit 322 may include metal-oxide-semiconductor field-effect transistors (MOSFETs). Alternatively or additionally, the H-bridge circuit 322 may include insulated-gate bipolar transistors (IGBTs). The H-bridge circuit 322 may include a first half-bridge and a second half-bridge. The first half-bridge may include switches 322-1 and 322-2. The second half-bridge may include switches 322-3 and 322-4.

[0068] like Figure 4A As shown, in switch configuration 410 (e.g., the positive configuration), switch 322-1 is closed, switch 322-2 is open, switch 322-3 is closed, and switch 322-4 is open. Figure 4B As shown, in switch configuration 420 (e.g., negative configuration), switch 322-1 is open, switch 322-2 is closed, switch 322-3 is open, and switch 322-4 is closed. Figure 4C As shown (e.g., configuration 01), in switch configuration 430, switch 322-1 is open, switch 322-2 is closed, switch 322-3 is closed, and switch 322-4 is open. Figure 4D As shown, in switch configuration 440 (e.g., zero 2 configuration), switch 322-1 is closed, switch 322-2 is open, switch 322-3 is open, and switch 322-4 is closed. Example H-bridge switch configuration

[0069] Figures 5A-5B Two examples of modulation schemes, modulation scheme 1 and modulation scheme 2, are shown. Modulation schemes 1 and 2 can be used as control waveforms for H-bridge circuits. Modulation schemes 1 and 2 can be applied to H-bridge circuits implemented in grounding mats or vehicle mats. For example, refer to... Figures 5A-5B The H-bridge circuit discussed can be any suitable H-bridge circuit in a wireless charging system (e.g., Figures 2A-2D (Any one of the H-bridge circuits 202A-202D or 208A-208D). Additionally, refer to... Figures 4A-4D The switching configurations of the H-bridge circuit are described (configurations 410-440).

[0070] Figure 5A The application of H-bridge circuits 202A-202D (such as...) is shown. Figures 2A-2D(as shown) or 208A-208D (as shown) Figures 2A-2D Examples of conceptual operating waveforms are shown below. For illustrative purposes, the output voltage and current waveforms of the H-bridge circuit implemented in the grounding mat are represented as V1 and I1, respectively. Furthermore, the output voltage and current waveforms of the H-bridge circuit implemented in the vehicle mat are represented as V2 and I2, respectively.

[0071] Figure 5B Map the states of the H-bridge circuit to modulation scheme 1 and modulation scheme 2. For example... Figure 5B As shown, each of modulation scheme 1 and modulation scheme 2 generates a periodic waveform with four different states 510-540. (As...) Figure 5B As shown, states 510, 520, 530, and 540 can be referred to as zero, positive, zero, and negative states, respectively. In some embodiments, modulation scheme 1 and modulation scheme 2 can be implemented using various switching configurations corresponding to each state.

[0072] In some embodiments, in modulation scheme 1, it can be achieved by... Figure 4C In switch configuration 430, an H-bridge is configured to generate state 510. In configuration 430, switches 322-2 (AN) and 322-3 (BN) are turned on, and switches 322-1 (AP) and 322-4 (BP) are turned off. Then, switch 322-2 (AN) can be turned off, and switch 322-1 (AP) can be turned on to transition from state 510 corresponding to switch configuration 430 to state 520 corresponding to switch configuration 410. State 520 can be referred to as the positive state. In the positive state, the H-bridge is in... Figure 4A Positive switch configuration 410. In positive switch configuration 410, switches 322-1 (AP) and 322-3 (BN) are turned on, and switches 322-2 (AN) and 322-4 (BP) are turned off.

[0073] Then, switch 322-1 (AP) can be turned off, and switch 322-2 (AN) can be turned on to transition from state 520 (positive state with switch configuration 410) to state 530 (positive state with switch configuration 410). Figure 4C The switch configuration 430 is in the zero-1 state.

[0074] Then, switch 322-3 (BN) can be turned off, and switch 322-4 (BP) can be turned on to transition from state 530 (a zero-1 state with switch configuration 430) to state 540. For example, state 540 can be referred to as a negative state, and is transitioned by... Figure 4BThe negative switch configuration 420 uses an H-bridge circuit to generate the modulation scheme. In the negative switch configuration 420, switches 322-2 (AN) and 322-4 (BP) are turned on, and switches 322-1 (AP) and 322-3 (BN) are turned off. Modulation scheme 1 can be continuously generated by sequentially repeating states 510-540.

[0075] like Figure 5B As further shown, by using modulation scheme 2, for example, by controlling the switching configuration of the H-bridge circuit based on modulation scheme 2, it is possible to generate Figure 5A The same waveform is shown. In modulation scheme 2, it can be achieved by... Figure 4D In the zero-2 switch configuration 440, an H-bridge is configured to generate state 510. In the zero-2 switch configuration 440, switches 322-1 (AP) and 322-4 (BP) are turned on, and switches 322-2 (AN) and 322-3 (BN) are turned off.

[0076] Then, switch 322-4 (BP) can be turned off, and switch 322-3 (BN) can be turned on, to transition from state 510 corresponding to switch configuration 440 to positive state 520 corresponding to switch configuration 410. In state 520, the H-bridge circuit can be configured in... Figure 4A In the positive switch configuration 410, switches 322-1 (AP) and 322-3 (BN) are turned on, and switches 322-2 (AN) and 322-4 (BP) are turned off.

[0077] Then, switch 322-3 (BN) can be turned off, and switch 322-4 (BP) can be turned on to transition from state 520 (positive state with switch configuration 410) to state 530 (positive state with switch configuration 410). Figure 4D The switch configuration 440 is in the zero-2 state.

[0078] Then, switch 322-1 (AP) can be turned off, and switch 322-2 (AN) can be turned on to transition from state 530 (state 02 with switch configuration 440) to state 540, i.e., the negative state. The negative state can be transitioned via... Figure 4B The negative switch configuration 420 is implemented by configuring an H-bridge. In the negative switch configuration 420, switches 322-2 (AN) and 322-4 (BP) are turned on, and switches 322-1 (AP) and 322-3 (BN) are turned off. Corresponding to modulation scheme 2, modulation scheme 2 can be continuously generated by sequentially repeating states 510-540.

[0079] In some scenarios, based on the switch configurations of modulation schemes 1 and 2, one or more switches in the H-bridge circuit may have higher temperatures, such as hot spots, than other switches during their operation. For example, modulation scheme 1 can cause hot spot temperatures on switches 322-2 (AN) and 322-3 (BN). For instance, switch 322-2 (AN) is turned on during states 510, 530, and 540, and switch 322-3 (BN) is turned on during states 510, 520, and 530. Therefore, the temperatures of switches 322-2 (AN) and 322-3 (BN) can be higher than those of other switches. Furthermore, switches 322-2 (AN) and 322-3 (BN) can consume more power compared to other switches. Additionally, during modulation scheme 2, switch 322-1 (AP) is turned on during states 510, 520, and 530, and switch 322-4 (BP) is turned on during states 510, 530, and 540. Therefore, switches 322-1 (AP) and 322-4 (BP) can have higher temperatures than other switches, and can consume more power compared to other switches. These configurations used to control the H-bridge circuit may have technical limitations associated with the hotspot temperature of a particular switch or a combination of switches. Example H-bridge switch configuration

[0080] Figures 6A-6B Two examples of modulation schemes, modulation scheme 3 and modulation scheme 4, are shown. Modulation schemes 3 and 4 can be used as control waveforms for H-bridge circuits. Modulation schemes 3 and 4 can be applied to H-bridge circuits implemented in grounding mats or vehicle mats. For example, see... Figures 6A-6B The H-bridge circuit discussed can be any suitable H-bridge circuit in a wireless charging system (e.g., Figures 2A-2D (Any one of the H-bridge circuits 202A-202D or 208A-208D). (Refer to...) Figures 4A-4D The switching configurations of the H-bridge circuit are described (configurations 410-440).

[0081] and Figures 5A-5B Compared to modulation schemes 1 and 2, Figures 6A-6B Modulation schemes 3 and 4 can provide thermal balance (and power consumption balance) between switches 322-1 and 322-4. This thermal balance can be achieved by balancing conduction losses between the switches, where the exchange current levels between switches 322-1 and 322-4 can have different current levels. For example, in Figures 5A-5BIn modulation scheme 1, each cycle (e.g., states 510-540) generates hotspot temperatures on switches 322-2 (AN) and 322-3 (BN). As another example, modulation scheme 2 generates hotspot temperatures on switches 322-1 (AP) and 322-4 (BP) in each cycle. For example, by balancing the on-time of each switch in the H-bridge circuit, Figures 6A-6B The modulation scheme can provide thermal equilibrium (and balanced power consumption) between switches 322-1 to 322-4. Therefore, power consumption between the switches can be balanced, and hotspot temperatures can be significantly reduced. For example, compared to modulation schemes 1 and 2, the hotspot temperatures corresponding to modulation schemes 3 and 4 can result in a reduction of more than 10 degrees Celsius. In some examples, modulation schemes 3 and 4 can also provide a temperature reduction of more than 10 degrees Celsius at the hotspot compared to when no modulation scheme is applied.

[0082] Figure 6A The application of H-bridge circuits 202A-202D (such as...) is shown. Figures 2A-2D (as shown) or H-bridge circuit 208A-208D (such as) Figures 2A-2D Examples of conceptual operating waveforms are shown below. For illustrative purposes, the output voltage and current waveforms of the H-bridge circuit implemented in the grounding mat are represented as V1 and I1, respectively. Furthermore, the output voltage and current waveforms of the H-bridge circuit implemented in the vehicle mat are represented as V2 and I2, respectively.

[0083] Can be used Figure 6B Modulation schemes 3 and 4, as described in the text, generate modulated waveforms. For example... Figure 6A As shown, each modulation scheme 3 or 4 can generate the same modulation waveform. In modulation scheme 4, there are different zero levels following the positive and negative states, relative to modulation scheme 3. In some embodiments, modulation schemes 3 and 4 can be used alternately and sequentially during the charging operation of the grounding pad or vehicle pad. In some embodiments, multiple cycles of modulation scheme 3 can be used during the charging operation of the grounding pad or vehicle pad, followed by multiple cycles of modulation scheme 4.

[0084] Figure 6B Map the states of the H-bridge circuit to modulation scheme 3 and modulation scheme 4. For example... Figure 6B As shown, each of modulation schemes 3 and 4 generates a periodic waveform with four different states 610-640. (As...) Figure 6B As shown, states 610, 620, 630, and 640 can be referred to as zero, positive, zero, and negative states, respectively. In some embodiments, modulation scheme 3 and modulation scheme 4 can be formed by various switch configurations corresponding to each state.

[0085] In modulation scheme 3, state 610 corresponds to... Figure 4C The zero-1 switch configuration 430 configures an H-bridge circuit. In the zero-1 configuration 430, switches 322-2 (AN) and 322-3 (BN) are turned on, and switches 322-1 (AP) and 322-4 (BP) are turned off.

[0086] Then, switch 322-2 (AN) can be turned off, and switch 322-1 (AP) can be turned on to transition from state 610 to state 620. State 620 can be referred to as the positive state, and is achieved through... Figure 4A The positive switch configuration 410 is implemented using an H-bridge circuit. In the positive switch configuration 410, switches 322-1 (AP) and 322-3 (BN) are turned on, and switches 322-2 (AN) and 322-4 (BP) are turned off.

[0087] Then, switch 322-3 (BN) can be turned off, and switch 322-4 (BP) can be turned on to transition from state 620 (positive state) to state 630, corresponding to... Figure 4D The zero-2 switch configuration 440. In the zero-2 switch configuration 440, switches 322-1 (AP) and 322-4 (BP) are turned on, and switches 322-2 (AN) and 322-3 (BN) are turned off.

[0088] Then, switch 322-1 (AP) can be turned off, and switch 322-2 (AN) can be turned on to transition from state 630 (state 02) to state 640, having the characteristics of... Figure 4B The negative state is implemented by switch configuration 420. In switch configuration 420, switches 322-2 (AN) and 322-4 (BP) are turned on, and switches 322-1 (AP) and 322-3 (BN) are turned off. In some applications, modulation scheme 3 can be continuously generated by sequentially repeating states 610-640.

[0089] like Figure 6B As further shown, by using modulation scheme 4, for example, by controlling the switching configuration of the H-bridge circuit based on modulation scheme 4, it is possible to generate Figure 6A The same waveform shown. In modulation scheme 4, it can be achieved by... Figure 4D In the zero-2 switch configuration 440, an H-bridge is configured to generate state 610. Then, switch 322-4 (BP) can be turned off, and switch 322-3 (BN) can be turned on to transition from state 610 to state 620. This can be achieved by... Figure 4A The positive switch configuration 410 is used for implementation. Then, switch 322-1 (AP) can be turned off, and switch 322-2 (AN) can be turned on to transition from state 620 (positive state) to... Figure 4CThe zero-1 switch configuration is 430. Then, switch 322-3 (BN) can be turned off, and switch 322-4 (BP) can be turned on to transition from state 630 (zero-1 switch configuration 430) to state 640, i.e. Figure 4B The negative switch configuration 420. In some applications, modulation scheme 4 can be continuously generated by sequentially repeating states 610-640. The switch control circuit 326 can control the H-bridge circuit with one or more cycles of modulation scheme 3, followed by one or more cycles of modulation scheme 4.

[0090] In some embodiments, such as Figures 6A-6B As shown, modulation schemes 3 and 4 can balance the on-time of switches 322-1 to 322-4, where switches 322-1 to 322-4 are turned on. For example, each switch can be turned on twice in a single cycle of the modulation waveform. Therefore, the temperature of each switch can be balanced without significantly increasing the hot spot temperature on one or more switches.

[0091] like Figure 6A and Figure 6B As further shown, when current i1 is at current level Isw 2, a transition between states 610 and 620 can occur. Furthermore, when current i1 is at current level Isw 1, a transition between states 620 and 630 can occur. Additionally, when current i1 is at current level Isw 2, a transition between states 630 and 640 can occur. Figure 6B As shown in modulation scheme 3, switch 322-1 can be turned on at current level Isw 2 (during the transition between states 610 and 620), switch 322-3 can be turned on at current level Isw 1 (during the transition between states 620 and 630), and switch 322-2 can be turned on at current level Isw 2 (during the transition between states 630 and 640). Since current level Isw 1 is higher than current level Isw 2, the power consumption at switch 322-3 (e.g., by switching off switch 322-3 and turning on switch 322-4 at the transition between states 620 and 630) can be different from (e.g., higher than) other transitions (e.g., the transition between states 610 and 620 and between states 630 and 640). Therefore, the temperatures of switches 322-3 and 322-4 can be different from (e.g., higher than) the temperatures of switches 322-1 and 322-2.

[0092] like Figure 6BModulation scheme 4 further illustrates that switch 322-4 is turned off at current level Isw 2 (during the transition between states 610 and 620), switch 322-2 can be turned on at current level Isw 1, and switch 322-1 can be turned off at current level Isw 1 (during the transition between states 620 and 630), and switch 322-3 can be turned off at current level Isw 2 (during the transition between states 630 and 640). Since current level Isw 1 is higher than current level Isw 2, the switches turned off at Isw 1 (e.g., switches 322-1 and 322-2) should have higher switching losses. Therefore, the temperatures of switches 322-1 and 322-2 can be higher than the temperatures of switches 322-3 and 322-4. Alternating modulation schemes 3 and 4 can further balance the temperatures between switches 322-1 and 322-4.

[0093] This disclosure does not limit the order in which modulation schemes 3 or 4 are applied, and modulation schemes 3 and 4 can be applied in any order depending on the specific application. In some embodiments, modulation scheme 3 may occupy between 0% and 100% of the wireless charging cycle. In other embodiments, modulation scheme 4 may occupy between 0% and 100% of the wireless charging cycle. Although Figure 6B The illustration shows that the duration of states 620 and 640 is longer than that of states 610 and 630, but in other embodiments, the duration of states 610 and 630 may be longer than that of states 620 and 640. Example waveform with alternating modulation

[0094] As mentioned above, modulation schemes 3 and 4 (such as Figures 6A-6B (As shown) can be applied alternately in sequence. In some embodiments, the transition between modulation schemes 3 and 4 can begin during a positive state 620 or a negative state 640. Initiating the transition between modulation schemes during a positive state 620 or a negative state 640 can advantageously provide a smooth transition between modulation schemes 3 and 4.

[0095] Figure 7 Example waveforms are shown during zero-switching configuration, associated with switching H-bridge circuits using modulation schemes 3 and 4 with transitions. Figure 7 The pulse width modulation (PWM) counter signals 702A and 702B are shown. Figure 7 Furthermore, Figure 6AThe modulated waveforms shown can be generated by sequentially applying modulation scheme 4 and modulation scheme 3. For example, waveforms 704A, 704B, 706B, and 706A are applied to switches 322-1 (AP), 322-2 (AN), 322-3 (BN), and 322-4 (BP), respectively. Applying these waveforms to H-bridge circuit 322 generates modulated waveform 708 at the output of the H-bridge circuit. As shown in waveform 708, the switching configuration associated with modulation scheme 4 is first applied (e.g., configured by applying waveforms 704A, 704B, 706A, and 706B to the corresponding switches in the H-bridge circuit). For example, sequentially applying configurations corresponding to 440, 410, 430, 420, and 440 (in... Figures 4A-4D The exchange configuration (shown in the diagram) generates states 610, 620, 630, 640, and 610 respectively (in the diagram). Figure 6B The bridge output voltage is shown in the figure.

[0096] like Figure 7 As further shown, the transition from modulation scheme 3 (from modulation scheme 4) can begin during state 610 (e.g., zero state). When the transition occurs at point 710, there is a relatively short period during which all switches (e.g., switches 322-1, 322-2, 322-3, and 322-4) are turned off, causing a positive voltage transient at the bridge output. This type of transition can be non-smooth, and it can cause an additional voltage to be applied to the resonant circuit, as shown during duration 720 (e.g., resonant circuits 204A-D included in the grounding pad or resonant circuits 206A-206D included in the vehicle mat). This additional voltage and current can drive undesirable overvoltages or currents into the resonant circuit, which can lead to shortened electronic component life and / or damage to electronic components.

[0097] Figure 8 The diagram illustrates the waveforms associated with the H-bridge circuit using modulation schemes 3 and 4, showing transitions during non-zero switching configurations. (As shown...) Figure 8 As shown in waveform 808, the modulation scheme can generate a smooth transition between modulation schemes 4 and 3. This type of smooth transition does not introduce any additional voltage and current drive into the resonant circuit.

[0098] Figure 8 The pulse width modulation counter signals 802A and 802B are shown. For example... Figure 8 As further shown, modulation scheme 4 and modulation scheme 3 can be applied sequentially to generate... Figure 6AThe modulation waveforms are shown. For example, waveforms 804A, 804B, 806B, and 806A are applied to switches 322-1 (AP), 322-2 (AN), 322-3 (BN), and 322-4 (BP), respectively. Waveforms 804A, 804B, 806B, and 806A can represent signals generated by switch control circuit 326 for controlling switches 322-1 (AP), 322-2 (AN), 322-3 (BN), and 322-4 (BP). Applying these waveforms to H-bridge circuit 322 generates modulation waveform 808 at the output of H-bridge circuit. As shown in waveform 808, the waveforms corresponding to configurations 440, 410, 430, 420, 440, and 510 are applied sequentially (in...). Figures 4A-4D The switch configuration shown generates bridge output voltages corresponding to states 610, 620, 630, 640, 610, and 620, respectively. Figure 8 As further shown, the transition from modulation scheme 3 (from modulation scheme 4) can begin during state 620 (e.g., a non-zero state). Figure 8 Furthermore, the transition to modulation scheme 3 (from modulation scheme 4) can occur after the zero state (e.g., 610 or 630). Therefore, after the transition at point 810, the positive state (e.g., corresponding to...) Figures 5A-5B The configuration 410 (duration 820) can follow a zero state.

[0099] In some embodiments, a smooth transition at point 810 can be generated by delaying the application of modulation scheme 3 until the zero state of modulation scheme 4 is completed. As a result of the delay, the application of modulation scheme 3 can achieve a smooth transition at point 810 by avoiding driving overvoltage and overcurrent into the resonant circuit. Example scenario for managing exchange configuration control logic

[0100] As described above, the switch control circuit 326 can control the switching of the H-bridge circuit to generate various modulation schemes 1-4. In some embodiments, the switch control circuit 326 can configure the H-bridge circuit to one or more switching configuration sequences based on the modulation scheme using various control logics. For example, a processor or any other suitable circuit device can implement the switch control circuit 326 to process various inputs and / or data to determine transitions between modulation schemes (e.g., transitions between modulation scheme 3 and modulation scheme 4), transition frequencies during wireless charging, and how to achieve smooth transitions, such as... Figure 8 The transition is shown in the diagram. In some examples, the switch control circuit 326 can control the switch based on monitoring results of one or more operating parameters of the ground and / or vehicle mat, such as operating temperature, power level, etc.

[0101] Figure 9An example embodiment of a switch control circuit 326 connected to an H-bridge circuit 322 is illustrated. In some embodiments, the switch control circuit 326 may be implemented in the grounding pad and control switch of the H-bridge circuit 322 to implement a switching configuration of one or more modulation schemes, such as one or more modulation schemes 1-4. In some embodiments, the switch control circuit 326 may be implemented in a vehicle mat and control the switching of the H-bridge circuit 322 by alternating between modulation scheme 3 and modulation scheme 4.

[0102] like Figure 9 As shown, the switch control circuit 326 may include a main processing circuit device 902 and a gate driver 904. The main processing circuit device 902 may include a processor and a memory to process various inputs and / or data to determine transitions between modulation schemes (e.g., a transition between modulation scheme 3 and modulation scheme 4), transition frequencies during wireless charging, and how to achieve smooth transitions (e.g., ...). Figure 8 The main processing circuitry 902 may include any suitable processor and memory (as shown in the diagram). The gate driver 904 may be configured to drive one or more input signals to control the switches. In some examples, the gate driver 904 may include various components to generate input power for controlling each switch, and these components may include, but are not limited to, amplifiers.

[0103] In some operations of the switch control circuit 326, the switch control circuit 326 can determine whether to exchange / switch between modulation schemes 1 and 2, modulation schemes 3 and 4, or modulation schemes 1, 2, 3, and 4. The switch control circuit 326 can determine the frequency of exchange between these modulation schemes. The switch control circuit 326 can determine the switching between modulation schemes based on the unbalanced temperature and its effects. The unbalanced temperature can be derived from one or more operating points, including battery voltage level, ground pad DC voltage level, coupling coefficient, power level, tank current of the ground pad and vehicle pad, inductance estimation results of the ground pad and vehicle pad, etc., and / or temperature from the component's temperature sensor.

[0104] The main processing circuitry 902 may be referred to as a controller. In some embodiments, the main processing circuitry 902 may be configured to execute one or more of various logics, such as logic for determining whether to perform a transition, the frequency of transitions (e.g., the number of transitions), or determining mechanisms for implementing smooth transitions (e.g., delaying transitions occurring in non-zero states). For example, the controller may determine whether to perform a transition in modulation scheme 1-2 or 3-4 or 1, 2, 3, and 4 (e.g., Figures 5A-5B as well as Figure 6A and Figure 6BThe exchange / transition between modulation schemes (as shown) and the frequency of the exchange between these modulation schemes. This determination can be based on unbalanced temperature and its effects, which can be derived from the operating point, including one or more of the following: battery voltage level, junction box voltage level, coupling coefficient, power level, tank current of grounding pad and vehicle pad, inductance estimate of grounding pad and / or vehicle pad, or temperature from the component's temperature sensor.

[0105] In various embodiments, as disclosed herein, the switch control circuit 326 can be configured to manage the switching configuration to generate a smooth transition during the transition between modulation scheme 4 and modulation scheme 3. Figure 8 The diagram illustrates a modulation waveform 808 that smoothly transitions between modulation scheme 4 and modulation scheme 3. For example, the switch control circuit 326 can be configured to switch (e.g., transition) modulation scheme 4 to modulation scheme 3 after a zero state (e.g., 610 or 630). Therefore, after point 810 (e.g., the transition point), the positive state (corresponding to...)... Figures 5A-5B Configuration 410) can follow a zero state. In some embodiments, the switch control circuit 326 can delay the application of modulation scheme 3 until the zero state of modulation scheme 4 is completed. As a result of the delay, the application of modulation scheme 3 can be smoothly transitioned at point 810 by avoiding driving overvoltage and overcurrent into the resonant circuit.

[0106] The foregoing disclosure is not intended to limit this disclosure to the precise form disclosed or a particular field of use. Therefore, it is conceivable that various alternative embodiments and / or modifications to this disclosure, whether expressly described or implied herein, are possible. Embodiments of this disclosure have been thus described, and those skilled in the art will recognize that changes in form and detail may be made without departing from the scope of this disclosure. Therefore, this disclosure is limited only by the claims.

[0107] It should be understood that not all objectives or advantages may be achieved according to any particular example described herein. Therefore, for example, those skilled in the art will recognize that some examples may operate in a manner that achieves or optimizes one or more advantages taught herein, without necessarily achieving other objectives or advantages taught or suggested herein.

[0108] All the processes described herein can be embodied in software code modules executed by a computing system, including a computer or processor, and are fully automated through these software code modules. The code modules can be stored on any type of non-transitory computer-readable medium or other computer storage device. Some or all of the methods can be embodied in dedicated computer hardware.

[0109] Based on this disclosure, many other variations different from those described herein will be apparent. For example, depending on the example, some actions, events, or functions of any algorithm described herein may be performed in a different order, may be added, combined, or omitted entirely (e.g., not all described actions or events are necessary for the practice of the algorithm). Furthermore, in some examples, actions or events may be performed concurrently, rather than sequentially, for example, through multithreading, interrupt handling, or multiple processors or processor cores, or on other parallel architectures. Moreover, different tasks or processes may be performed by different machines and / or computing systems that can work together.

[0110] The various illustrative logic blocks and modules described with reference to the examples disclosed herein can be implemented or executed by a machine such as a processing unit or processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. The processor may be a microprocessor, but alternatively, it may be a controller, a microcontroller, or a state machine, a combination thereof, etc. The processor may include circuitry that processes computer-executable instructions. In some examples, the processor includes an FPGA or other programmable device that performs logical operations without processing computer-executable instructions. The processor may also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, multiple microprocessors, a microprocessor incorporating a DSP core, or any other such configuration. Although the description herein is primarily directed to digital technologies, the processor may also primarily comprise analog components. The computing environment may include any type of computer system, including but not limited to microprocessor-based computer systems, mainframe computers, digital signal processors, portable computing devices, device controllers, or computing engines within devices, etc.

[0111] Elements of the methods, processes, routines, or algorithms described in conjunction with the embodiments disclosed herein may be directly embodied in hardware, software modules executed by a processor device, or a combination of both. Software modules may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, removable disk, CD-ROM, or any other form of non-transitory computer-readable storage medium. Exemplary storage media may be coupled to the processor device, enabling the processor device to read information from and write information to the storage medium. Alternatively, the storage medium may be integrated into the processor device. The processor device and storage medium may reside in an ASIC. The ASIC may reside in a user terminal. Alternatively, the processor device and storage medium may reside as discrete components in the user terminal.

[0112] The processes described herein or illustrated in the accompanying drawings may be initiated in response to events, such as according to a predetermined or dynamically determined schedule, at the request of a user or system administrator, or in response to other events. When such a process is initiated, a set of executable program instructions stored on one or more non-transitory computer-readable media (e.g., hard disk drives, flash memory, removable media, etc.) may be loaded into the memory (e.g., RAM) of a server or other computing device. The executable instructions may then be executed by the hardware-based computer processor of the computing device. In some embodiments, these processes, or portions thereof, may be implemented serially or in parallel on multiple computing devices and / or multiple processors.

[0113] Unless otherwise stated, conditional language such as “can,” “could,” “might,” or “may” is understood in context to generally convey that some examples include certain features, elements, and / or steps, while others do not. Therefore, such conditional language is generally not intended to imply that features, elements, and / or steps are examples in any way, or that examples must include logic for determining whether such features, elements, and / or steps are included in any particular example or will be executed in any particular example, with or without user input or prompts.

[0114] Unless otherwise specifically stated, disjunctive language such as the phrase “at least one of X, Y, or Z” should generally be understood in context, and the items, terms, etc., used to represent that they may be X, Y, or Z or any combination thereof (e.g., X, Y, and / or Z). Therefore, such disjunctive language is generally not intended to, nor should it, imply that some examples require the presence of at least one of X, at least one of Y, or at least one of Z.

[0115] Any process descriptions, elements, or blocks in the flowcharts described herein and / or illustrated in the accompanying drawings should be understood as potentially representing modules, segments, or code portions, including executable instructions for specific logical functions or elements during implementation. Alternative examples are included within the scope of the examples described herein, wherein elements or functions may be omitted, performed out of the order shown or discussed, including substantially simultaneously or in reverse order, depending on the functions involved, as will be understood by those skilled in the art.

[0116] It should be emphasized that various variations and modifications can be made to the above examples, and their elements should be understood as other acceptable examples. All such modifications and variations are intended to be included within the scope of this disclosure.

[0117] Any process descriptions, elements, or blocks in the flowcharts described herein and / or illustrated in the accompanying drawings should be understood as potentially representing modules, segments, or code portions, including executable instructions for specific logical functions or elements during implementation. Alternative implementations are included within the scope of the examples described herein, wherein elements or functions may be omitted, performed out of the order shown or discussed, including substantially simultaneously or in reverse order, depending on the functions involved, as will be understood by those skilled in the art.

[0118] Unless otherwise expressly stated, articles such as “a” or “an” should generally be interpreted as including one or more of the described items. Therefore, phrases such as “devices configured to…” are intended to include one or more of the described devices. Such one or more described devices may also be configured together to perform the stated description. For example, “processors configured to perform descriptions A, B, and C” could include a first processor configured to perform description A working in conjunction with a second processor configured to perform descriptions B and C.

Claims

1. A method for wireless power transfer, the method comprising: The H-bridge circuit of the grounding pad is controlled by a first modulation of the H-bridge configuration, the first modulation including two non-zero switching configurations and two different zero switching configurations, the two non-zero switching configurations including a positive switching configuration and a negative switching configuration; The control of the H-bridge circuit is switched from the first modulation to a second modulation, the second modulation including the two non-zero switching configurations and the two different zero switching configurations, which have a different sequence from the first modulation; and The H-bridge circuit is used to induce wireless power transfer from the grounding pad to the vehicle's vehicle mat.

2. The method of claim 1, wherein the transition of the H-bridge circuit from the first modulation to the second modulation is controlled to occur in a timely manner during one of the two non-zero switching configurations.

3. The method of claim 1, wherein the first modulation sequentially controls the H-bridge circuit, wherein each transition between switching configurations associated with the sequence involves a switch being turned on and a switch being turned off.

4. The method of claim 1, wherein the first modulation and the second modulation both correspond to the same output voltage waveform provided from the H-bridge circuit.

5. The method of claim 1, wherein the first modulation comprises operating the H-bridge circuit in the two non-zero switching configurations for a longer duration or a shorter duration than operating in the two different zero switching configurations.

6. The method of claim 1, wherein the first modulation controls the H-bridge circuit in a first order, wherein the positive switching configuration follows a first zero-switching configuration of the two different zero-switching configurations, and wherein the second modulation controls the H-bridge circuit in a second order, wherein the positive switching configuration follows a second zero-switching configuration of the two different zero-switching configurations.

7. The method of claim 1, wherein the first modulation controls the H-bridge circuit in a first order, wherein in the first order, a second zero-switching configuration of the two different zero-switching configurations follows the positive switching configuration, and wherein the second modulation controls the H-bridge circuit in a second order, wherein in the second order, a first zero-switching configuration of the two different zero-switching configurations follows the positive switching configuration.

8. The method of claim 1, wherein the H-bridge circuit is controlled by the first modulation during at least 50% of the wireless charging cycle.

9. The method of claim 1, further comprising switching the control of the H-bridge circuit from the second modulation to a third modulation, the third modulation comprising only the first zero-switching configuration of the two non-zero-switching configurations and the two different zero-switching configurations.

10. The method of claim 9, further comprising switching control of the H-bridge circuit from the second modulation to a fourth modulation, the fourth modulation including the two non-zero switching configurations and only the second zero switching configuration of the two different zero switching configurations.

11. The method of claim 1, further comprising determining, at least in part, based on a temperature associated with the H-bridge circuit, that the H-bridge circuit will switch from the first modulation to the second modulation, wherein the switching control of the H-bridge circuit from the first modulation to the second modulation is performed in response to the determination.

12. The method of claim 11, further comprising determining, at least in part, the frequency of the transition control of the H-bridge circuit from the first modulation to the second modulation based on the temperature associated with the H-bridge circuit.

13. A method for wireless power transfer, the method comprising: The switching circuit of the wireless charging pad is controlled by a first modulation comprising two non-zero switching configurations and two distinct zero switching configurations, the two non-zero switching configurations including a positive switching configuration and a negative switching configuration; and The control of the switching circuit is switched from the first modulation to the second modulation, the second modulation including the two non-zero switch configurations and the two different zero switch configurations that are different from the first modulation sequence; The switching circuit receives a voltage associated with wirelessly receiving power from another wireless charging pad.

14. The method of claim 13, wherein the transition of the switching circuit from the first modulation to the second modulation is controlled to occur in a timely manner during one of the two non-zero switching configurations.

15. A wireless charging pad, comprising: H-bridge circuit; A resonant circuit, which is electrically connected to the H-bridge circuit, includes a coil arranged for wireless power transfer; as well as A switch control circuit configured to control the H-bridge circuit using both a first modulation and a second modulation. The first modulation includes two non-zero switch configurations and two different zero switch configurations, and the second modulation includes the two non-zero switch configurations and the two different zero switch configurations in a different order from the first modulation.

16. The wireless charging pad according to claim 15, wherein the wireless charging pad is a ground plane.

17. The wireless charging pad according to claim 15, wherein the wireless charging pad is a vehicle plate.

18. The wireless charging pad of claim 15, wherein the wireless charging pad is configured for wireless power transfer associated with charging a battery pack of a vehicle, and wherein the battery pack has an operating voltage in the range of 200 volts to 800 volts.

19. The wireless charging pad of claim 15, wherein controlling the H-bridge circuit includes switching the control of the H-bridge circuit from the first modulation to the second modulation.

20. The wireless charging pad of claim 19, wherein the transition of the H-bridge circuit from the first modulation to the second modulation is controlled to occur in a timely manner during one of the two non-zero switching configurations.

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