Lamp driving plate welding structure

Abstract

The invention relates to a lamp drive plate welding structure, and belongs to the technical field of LED display screen welding. The lamp drive board welding structure comprises a circuit board, a first bonding pad, a solder resist ink layer and a supporting column. And the circuit board is provided with a through hole penetrating through the component mounting surface and the light-emitting unit mounting surface. The first bonding pad is arranged on the component mounting surface and surrounds the through hole, and the solder resist ink layer covers one side surface, deviating from the circuit board, of the first bonding pad. The solder resist ink layer is provided with a window, the window is used for exposing a local area of the first bonding pad so as to form a welding area which is not communicated with the through hole, and the supporting column and the first bonding pad are correspondingly arranged. The solder resist ink layer separates the welding area from the through hole, so that when the supporting column and the welding area are welded through the solder, the solder resist ink layer limits scaling powder of the solder to flow towards the direction of the through hole, the solder is effectively prevented from flowing to the light-emitting unit mounting surface along the through hole, the risk that the surface of a bonding pad of the light-emitting unit mounting surface is polluted is reduced, and the reliability of the light-emitting unit mounting surface is improved. And the detection first pass yield and the overall production efficiency are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED display screen welding, in particular to a lamp driving plate welding structure. BACKGROUND

[0002] The core component of an LED display screen is an LED lamp driving plate, which is a display component completed by soldering a patch to a PCB circuit board. One side of the lamp driving plate is attached with electronic components such as ICs (hereinafter referred to as IC side) for driving and lighting LED beads, and the other side is attached with LED beads for displaying pictures (hereinafter referred to as LED side). In order to facilitate the installation and fixation of the lamp driving plate and the display screen box, a support structure such as a copper column or an iron block is usually welded on the IC side of the PCB.

[0003] In the traditional scheme, the copper column is usually welded through a solder pad provided on the PCB, and a through hole is provided at the center of the solder pad for pre-positioning the copper column. During the welding process, the solder tin melts and spreads in the solder pad area. Since the periphery of the solder pad is a continuous copper sheet structure, the solder tin material will spread along the copper sheet, and at the same time push the flux in the solder to flow to the other side of the PCB through the through hole, thereby entering the LED side.

[0004] After the flux flows to the LED side, it is easy to cover the solder pad and its peripheral area of the LED side, changing the optical properties of the solder pad surface, resulting in an increase in false alarm rate during the SPI solder paste detection process after the production of the solder paste, affecting the production efficiency and yield. In order to avoid the above problems, some traditional schemes change the through hole to a blind hole, but the blind hole needs to be processed one by one, which is low in processing efficiency and high in cost, and is difficult to meet the needs of large-scale production. SUMMARY

[0005] The purpose of the present application is to solve the technical problem that the flux in the solder tin material easily flows to the LED side of the PCB during the welding process of the support column and the lamp plate.

[0006] In order to solve the above technical problem, the present application provides a lamp driving plate welding structure, comprising: a circuit board comprising a component mounting surface and a light emitting unit mounting surface arranged oppositely; a through hole provided on the circuit board and penetrating through the component mounting surface and the light emitting unit mounting surface; a first solder pad arranged on the component mounting surface and surrounding the through hole; a solder resist ink layer covering one side of the first solder pad away from the circuit board; a window is opened on the solder resist ink layer, the window is used to expose a local area of the first solder pad to form a welding area not communicating with the through hole; a support column corresponding to the first solder pad; wherein the solder resist ink layer separates the welding area and the through hole from each other, so that when the support column and the welding area are welded by solder, the solder resist ink layer limits the flow of the solder to the direction of the through hole.

[0007] In some embodiments of the present application, a plurality of windows are arranged on the solder resist ink layer, and the plurality of windows are arranged at intervals to form a plurality of dispersed soldering areas on the first pad, each of the soldering areas being isolated from the through hole by the solder resist ink layer.

[0008] In some embodiments of the present application, the plurality of soldering areas are uniformly distributed at intervals along the circumference of the through hole, and the soldering areas are separated by the solder resist ink layer.

[0009] In some embodiments of the present application, the number of the soldering areas is 3-8.

[0010] In some embodiments of the present application, an annular window is arranged on the solder resist ink layer to form a circular ring-shaped soldering area on the first pad, and the soldering area is coaxially arranged with the through hole.

[0011] In some embodiments of the present application, the area of the first pad is larger than the area of the bottom surface of the support column facing the circuit board.

[0012] In some embodiments of the present application, the support column comprises a column body and a positioning portion, the positioning portion is arranged at one end of the column body close to the circuit board and protrudes towards the circuit board, and the positioning portion can be accommodated in the through hole to position the support column on the circuit board.

[0013] In some embodiments of the present application, the soldering material comprises solder paste and flux, the solder paste is arranged in the soldering area and between the support column and the first pad, and the flux is distributed around the connection area between the support column and the circuit board.

[0014] In some embodiments of the present application, the circuit board comprises a glass fiber layer and copper foil layers arranged on both sides of the glass fiber layer respectively, the copper foil layer corresponding to the component mounting surface of the circuit board is etched to form a component circuit, and the copper foil layer corresponding to the light emitting unit mounting surface of the circuit board is etched to form a light emitting unit circuit.

[0015] In some embodiments of the present application, a component surface ink is arranged on the component mounting surface of the circuit board, the component surface ink covers the component circuit and exposes the first pad at a position corresponding to the support column, and a light emitting unit surface ink is arranged on the light emitting unit mounting surface of the circuit board, the light emitting unit surface ink covers the light emitting unit circuit and exposes the second pad at a position corresponding to the light emitting unit for soldering the light emitting unit.

[0016] According to the above technical solution, the present application has the following beneficial effects: The application provides a lamp drive board welding structure, wherein a first solder pad is arranged around a through hole on a component mounting surface of a circuit board, a solder resist ink layer covers the first solder pad, a window is formed on the solder resist ink layer, the window is used for exposing a partial area of the first solder pad to form a welding area which is not communicated with the through hole, and the welding area is separated from the through hole in structure. When the support column is welded with the first solder pad, the solder resist ink layer effectively limits the flow path of the solder, thereby inhibiting the solder from moving towards the through hole, and the solder can only spread in the welding area. The application effectively prevents the flux in the solder from flowing to the light emitting unit mounting surface through the through hole, reduces the risk of the solder pad surface of the light emitting unit mounting surface being polluted by the flux, reduces the probability of misjudgment in the optical detection process after the tin paste printing of the LED surface, improves the detection pass rate and overall production efficiency. Meanwhile, the welding reliability and the control of manufacturing cost are considered under the premise of not changing the through hole positioning structure. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 Fig. 1 is a schematic diagram of the three-dimensional structure of the lamp drive board.

[0018] Figure 2 Fig. 4 is a schematic diagram of the structure in which the first solder pad is arranged on the circuit board.

[0019] Figure 3 Fig. 5 is a schematic diagram of the cross-sectional structure when the circuit board is welded with the support column.

[0020] Figure 4 Fig. 6 is a schematic diagram of the cross-sectional structure of the circuit board. Figure 3

[0021] Figure 5

[0022] Figure 6 Fig. 9 is a schematic diagram of the distribution of the welding area on the first solder pad in an embodiment.

[0023] Figure 7 Fig. 10 is a schematic diagram of the distribution of the welding area on the first solder pad in another embodiment.

[0024] The reference signs are explained as follows: 10, circuit board; 101, glass fiber layer; 11, through hole; 12, component mounting surface; 13, light emitting unit mounting surface; 14, component surface ink; 15, light emitting unit surface ink; 20, first solder pad; 21, welding area; 30, solder resist ink layer; 31, window; 40, support column; 41, column body; 42, positioning part; 50, solder; 51, tin paste; 52, flux; 60, second solder pad. DETAILED DESCRIPTION

[0025] ​​The features and advantages of the present application will become more apparent from the detailed description set forth below. It should be understood, however, that the description set forth in the following description is intended as a description of various embodiments of the present application and is not intended to limit the scope of the application to the precise embodiments described. Modifications and variations are possible in light of the above teachings. It is also to be understood that, wherever aspects are described in the following description, alternative aspects can be devised in light of what is disclosed and described.

[0026] In the description of the present application, the indication of direction or positional relationship (such as up, down, left, right, front and back, etc.) in the embodiments shown in the drawings is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated mechanism or element must have a particular orientation, be constructed and operated in a particular orientation. These descriptions are appropriate when these elements are in the positions shown in the drawings. If the positions of these elements change, the indications of these directions also change accordingly.

[0027] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0028] The support column of the traditional LED lamp drive board is usually directly soldered through the solder pad arranged on the PCB. In the soldering process, the soldering tin melts and spreads in the solder pad area. Since the periphery of the solder pad is a continuous copper sheet structure, the flux in the soldering tin material will flow to the other side of the PCB through the through hole, thereby changing the optical properties of the solder pad surface, causing the false alarm rate to increase in the SPI solder paste detection process, affecting production efficiency and yield.

[0029] Therefore, with reference to Figures 1 to 7 The embodiment provides a lamp drive board soldering structure which comprises a circuit board 10, a first solder pad 20, a solder resist ink layer 30 and a support column 40.

[0030] The circuit board 10 comprises oppositely arranged component mounting surfaces 12 (IC surfaces) and light emitting unit mounting surfaces 13 (LED surfaces). The through hole 11 penetrating through the component mounting surface 12 and the light emitting unit mounting surface 13 is arranged on the circuit board 10. The first solder pad 20 is arranged on the component mounting surface 12 and surrounds the through hole 11. The solder resist ink layer 30 is arranged on the side of the first solder pad 20 away from the circuit board 10. The window 31 is arranged on the solder resist ink layer 30, and the window 31 is used for exposing the local area of the first solder pad 20 to form the soldering area 21 which is not communicated with the through hole 11. The support column 40 is arranged corresponding to the first solder pad 20.

[0031] The solder resist ink layer 30 separates the soldering area 21 from the through hole 11, so that when the support column 40 is soldered to the soldering area 21 by the solder 50, the solder resist ink layer 30 limits the flow of the solder 50 to the through hole 11.

[0032] Specifically, the through hole 11 is formed in the predetermined position of the circuit board 10, which penetrates the component mounting surface 12 and the light emitting unit mounting surface 13, and is used for the assembly and positioning of the support column 40. The first solder pad 20 is arranged around the through hole 11 on the component mounting surface 12 of the circuit board 10, and the inner edge of the first solder pad 20 is connected to the hole wall of the through hole 11.

[0033] The outer surface of the first solder pad 20 is covered with a layer of solder resist ink layer 30, which can be formed by printing or spraying process and adheres to the surface of the first solder pad 20 after solidification treatment. The support column 40 is arranged on one side of the component mounting surface 12 and corresponds to the first solder pad 20. The solder 50 is arranged between the support column 40 and the component mounting surface 12 for soldering, and the solder 50 includes the solder paste 51 for direct soldering and the flux 52.

[0034] At least one window 31 is formed in the solder resist ink layer 30 corresponding to the position of the first solder pad 20, and the window 31 only exposes the local area of the first solder pad 20, thereby forming an independent soldering area 21 on the first solder pad 20. The soldering area 21 is mutually staggered with the through hole 11 in the plane projection, and is not in communication with the through hole 11 in structure, so that the soldering area 21 and the through hole 11 are effectively isolated by the solder resist ink layer 30. The solder resist ink layer 30 belongs to a non-wetting material, and is slightly higher in spatial height than the surface of the first solder pad 20, so that a "hydrophobic" dam is formed in front of the solder 50. The liquid solder 50 is constrained in the soldering area 21 defined by the window 31 under the action of tension, so that it cannot cross the ink barrier, thereby reducing the entry of the flux 52 into the through hole 11, thereby eliminating the risk of the flux 52 flowing down to the LED surface through the through hole 11, and ensuring the cleanliness of the light emitting unit mounting surface 13.

[0035] Please refer to Figure 2 In some embodiments, the circuit board 10 can include a glass fiber layer 101 and copper foil layers arranged on both sides of the glass fiber layer 101 respectively. The copper foil layer corresponding to the component mounting surface 12 of the circuit board 10 is etched to form a component circuit, and the copper foil layer corresponding to the light emitting unit mounting surface 13 of the circuit board 10 is etched to form a light emitting unit circuit.

[0036] In particular, the circuit board 10 can be formed by selecting a glass fiber composite material with appropriate thickness as the base material layer, which has good insulation and mechanical strength for carrying the circuit structure. Then, a copper foil layer is covered on both sides of the glass fiber layer to form a double-sided copper foil layer structure of the circuit board 10. The thickness of the copper foil can be selected according to the design requirements, and is generally used to carry the current and welding heat of the components. Subsequently, the copper foil is firmly pressed to both sides of the glass fiber layer 101 through a hot pressing and bonding process to form a preliminary composite board. After the pressing is completed, the composite board is surface cleaned and pretreated to ensure that the copper foil surface is free of oil stains, oxides and impurities, and to improve the accuracy and reliability of the subsequent etching process.

[0037] Then, according to the design requirements of the lamp driver board, an etching mask is formed on the copper foil layer corresponding to the component mounting surface 12 using a photoetching or screen printing process, and the mask covers the areas of the copper foil that do not need to be retained. The composite board is placed in a chemical etching solution, and the copper foil not covered by the mask is dissolved by the etching solution to form the circuit pattern of the component mounting surface 12. Similarly, on the copper foil layer corresponding to the light emitting unit mounting surface 13, the light emitting unit circuit pattern is formed using the corresponding mask and etching process. After etching, the mask is removed and the surface of the circuit board 10 is cleaned and dried to obtain the circuit board 10 with double-sided circuits.

[0038] It should be understood that the shape of the first solder pad 20 in the embodiment can also be etched from the copper foil layer on the circuit board 10.

[0039] Please refer to Figure 3 In some embodiments, the component mounting surface 12 of the circuit board 10 is covered with a component surface ink 14 (IC surface ink), which covers the component circuit and exposes the first solder pad 20 at the positions corresponding to the support columns 40. The light emitting unit mounting surface 13 of the circuit board 10 is covered with a light emitting unit surface ink 15 (LED surface ink), which covers the light emitting unit circuit and exposes the second solder pad 60 at the positions corresponding to the light emitting units for welding the light emitting units.

[0040] The component surface ink 14 can be selected from epoxy-based, photosensitive or thermosetting solder mask ink materials, which have good insulation, high temperature resistance and chemical stability. For example, Figure 2 and Figure 3As shown, the component surface ink 14 covers the non-soldered areas of the component circuit, protecting the circuit from solder 50 contamination. Specifically, the component surface ink 14 only creates openings for the first pad 20 at the locations corresponding to the support pillar 40 to ensure the support pillar 40 can be soldered. It should be understood that the solder resist ink layer 30 and the component surface ink 14 can be made of the same material and can be applied in the same operating step. The light-emitting unit mounting surface 13 is covered with light-emitting unit surface ink 15, which is made of the same material as the component surface ink 14. The light-emitting unit surface ink 15 covers the non-soldered areas of the light-emitting unit circuit and creates openings at the corresponding LED chip soldering locations to expose the second pad 60 for subsequent LED chip soldering.

[0041] like Figure 4 As shown, in this embodiment, the component mounting surface 12 (IC surface) of the circuit board 10 is entirely covered with component surface ink 14 to insulate and protect the non-soldering areas of the component circuit. Only the first pad 20 is exposed at the position corresponding to the support post 40 to meet the soldering requirements of the support post 40. Furthermore, a solder resist ink layer 30 is provided on the first pad 20. The solder resist ink layer 30 exposes the soldering area 21 only through partial openings, thereby further defining the soldering area 21 to guide the spread of the solder 50 and restrict its flow towards the via 11. At the same time, the light-emitting unit mounting surface 13 (LED surface) of the circuit board 10 is covered with light-emitting unit surface ink 15 to protect the non-soldering areas of the light-emitting unit circuit. Only the second pad 60 is exposed at the position corresponding to the light-emitting unit for subsequent LED chip soldering.

[0042] Please see Figure 3 and Figure 5 In some embodiments, the support post 40 includes a post body 41 and a positioning part 42. The positioning part 42 is disposed at one end of the post body 41 near the circuit board 10 and protrudes toward the circuit board 10; the positioning part 42 can be accommodated in the through hole 11 to position the support post 40 on the circuit board 10.

[0043] Specifically, the support column 40 can be made of brass or iron, and plated with a solderable coating (copper, nickel, and tin) for later installation and fixation of the lamp drive board to the cabinet of the display screen. The support column 40 can include an upper column body 41 and a lower positioning portion 42. The column body 41 serves as a support main body, and the end face of the bottom thereof can be welded to the welding area 21. The positioning portion 42 is axially protruded at one end of the column body 41 close to the circuit board 10, and has a cross-sectional diameter smaller than that of the positioning through hole 11 pre-set on the circuit board 10. When the positioning portion 42 of the support column 40 is inserted into the through hole 11, the accurate pre-positioning of the support column 40 in the plane direction of the circuit board 10 is achieved through the radial limiting of the hole wall, effectively preventing the deviation or inclination of the support column 40 caused by the disturbance of the molten solder during the welding process.

[0044] Referring to Figure 3 In some embodiments, the solder paste 51 of the solder 50 is arranged in the welding area 21 and between the support column 40 and the first solder pad 20, and the flux 52 is distributed around the connection area between the support column 40 and the circuit board 10.

[0045] Specifically, the solder paste 51 is spot-coated in the welding area 21 and between the support column 40 and the first solder pad 20. During the welding process, after the support column 40 is pre-positioned through the through hole 11, the bottom thereof corresponds to the first solder pad 20, and the solder paste 51 is between the support column 40 and the first solder pad 20. During the welding process, the metallic tin in the solder paste 51 is melted and solidly connected to the surfaces of the first solder pad 20 and the support column 40, thereby forming a stable and reliable metallic welding connection therebetween to achieve the mechanical fixation of the support column 40 to the circuit board 10. The flux 52 is arranged around the support column 40, and mainly plays a role in reducing the surface tension of the molten solder, promoting the wetting and spreading of the solder during the welding process.

[0046] In the present embodiment, the non-welding area of the first solder pad 20 is covered by the solder mask ink layer 30, and only the welding area 21 not in communication with the through hole 11 is formed through the window 31. The spreading range of the solder paste 51 in the molten state is limited by the material properties of the solder mask ink layer 30, so that the solder is mainly concentrated in the welding area 21 and is not easy to diffuse towards the through hole 11.

[0047] Referring to Figure 2 and Figure 3 In some embodiments, the area of the first solder pad 20 is greater than the bottom surface area of the side of the support column 40 facing the circuit board 10.

[0048] Specifically, the first solder pad 20 extends outward relative to the bottom of the support column 40 in the planar dimension to form a circumferential allowance. That is, the first solder pad 20 is not limited to the area where the soldering area 21 is located, but is an area of a larger disc, so that the adhesion between the first solder pad 20 and the glass fiber layer 101 is stronger. The stress of the soldering interface can be dispersed to a larger range of the glass fiber layer 101 of the circuit board 10 through the first solder pad 20, avoiding stress concentration in a local area, thereby effectively reducing the risk of the first solder pad 20 being pulled off.

[0049] Referring to Figure 6 In some embodiments, the solder resist ink layer 30 is provided with a plurality of windows 31. The plurality of windows 31 are arranged at intervals to form a plurality of dispersed soldering areas 21 on the first solder pad 20, and each soldering area 21 is isolated from the through hole 11 by the solder resist ink layer 30.

[0050] Specifically, the solder resist ink layer 30 covers the outer surface of the first solder pad 20 and is provided with a plurality of windows 31 corresponding to the first solder pad 20, so that a plurality of soldering areas 21 are formed on the first solder pad 20, which are dispersed and not connected to each other. Each soldering area 21 is isolated from the through hole 11 by the adjacent solder resist ink layer 30.

[0051] In the soldering process, the solder paste 51 is filled in each soldering area 21 and partially contacts the support column 40 to form a plurality of solder joints. By dispersing the connection area into a plurality of soldering areas 21, not only can the risk of the flux 52 in the solder 50 entering the through hole 11 be further reduced, but also a plurality of stress points can be formed during soldering, so that the connection force between the support column 40 and the circuit board 10 is more evenly distributed, and the stress concentration problem caused by single-point soldering is reduced.

[0052] Referring to Figure 6 In some embodiments, the plurality of soldering areas 21 are uniformly and evenly distributed along the circumference of the through hole 11, and are separated by the solder resist ink layer 30 between adjacent soldering areas 21.

[0053] Specifically, the soldering areas 21 are uniformly and evenly arranged along the circumference of the through hole 11, so that the distribution of the solder paste 51 on the circumference of the first solder pad 20 is more uniform and symmetrical, avoiding the situation that the solder 50 is concentrated and accumulated in a local area, so that the soldering force between the support column 40 and the circuit board 10 tends to be uniform in the circumferential direction. The uniform distribution of the soldering areas 21 can effectively reduce the possibility of the support column 40 being tilted or deviated after soldering, and improve the stability and consistency of the installation position of the support column 40.

[0054] Furthermore, the solder resist ink layer 30 forms a spacing belt between the adjacent soldering areas 21, so that the soldering areas 21 are not connected in the circumferential and radial directions, thereby forming a plurality of exhaust channels connected to the outer edge between the soldering areas 21 or outside the soldering areas 21.

[0055] During the soldering process of the support column 40, since the first solder pad 20 is divided by the solder resist ink layer 30, the interval area formed between the soldering areas 21 provides a multi-directional and dispersed outward discharge path for the gas, so that the gas generated during the soldering process can be released to the outside of the through hole 11 along the gap between the soldering areas 21, instead of relying on the through hole 11 as the only exhaust passage. At this time, the pushing effect of the gas generated during the soldering process on the molten solder paste 51 and the flux 52 is significantly weakened, further avoiding the risk of a large amount of flux 52 passing through the through hole 11.

[0056] Please refer to Figure 6 In some embodiments, the number of soldering areas 21 can be set to 3-8.

[0057] Specifically, the number of soldering areas 21 can be selected according to the diameter of the support column 40. For example, when the diameter of the support column 40 is small, the number of soldering areas 21 can be set to 3, and the three soldering areas 21 are arranged in an equilateral triangle along the circumference of the through hole 11. The shape of each soldering area 21 can be rectangular, fan-shaped or arc-shaped, and the contact force of the support column 40 and the circuit board 10 is evenly distributed at three points. As shown in Figure 6 The number of soldering areas 21 can also be set to 4, which can be arranged at equal intervals along the circumference of the through hole 11, and the shape of the soldering area 21 can be rectangular.

[0058] When the number of soldering areas 21 is 5-8, the size and shape of the soldering area 21 can be adjusted according to the shape and size of the bottom of the support column 40, and the soldering area 21 can be a fan-shaped, polygonal or slightly arc-shaped special-shaped area to adapt to the contact surface of the support column 40 base.

[0059] Please refer to Figure 6 Each window 31 extends outward along the radial direction of the first solder pad 20 to the outer edge of the first solder pad 20, so that the outer edge of the soldering area 21 is tangent to the outer edge of the first solder pad 20. This structure can make the gas and volatile matter generated in the soldering area 21 preferentially discharge along the direction of the outer edge of the first solder pad 20, avoiding being forced to move in the direction of the through hole 11, thereby further reducing the tendency of the flux 51 in the solder 50 to flow in the direction of the through hole 11.

[0060] Please refer to Figure 7 In other embodiments, the solder resist ink layer 30 can also be provided with an annular window 31 to form a circular ring-shaped soldering area 21 on the first solder pad 20. The soldering area 21 is coaxially arranged with the through hole 11.

[0061] Specifically, the solder resist ink layer 30 covers the surface of the first pad 20, and an annular window 31 is formed on the solder resist ink layer 30, so that the first pad 20 forms a continuous annular welding area 21 in the area corresponding to the window 31. The center of the annular welding area 21 is coaxially arranged with the center of the through hole 11 on the circuit board 10, so that the welding area 21 is structurally arranged around the through hole 11 and maintains a predetermined interval with the through hole 11, thereby avoiding direct communication between the welding area 21 and the through hole 11. During the welding process, the bottom of the support column 40 corresponds to and fits the annular welding area 21, the solder 50 is applied to the annular welding area 21, and after melting by reflow soldering or selective soldering process, a continuous and stable welding connection is formed between the support column 40 and the first pad 20.

[0062] Since the annular welding area 21 is continuously distributed in the circumferential direction, the welding seam formed after welding has good continuity and consistency in the circumferential direction, so that the support column 40 can evenly share the load in the circumferential direction when stressed, effectively avoiding problems such as uneven stress, local stress concentration, and inclination or deviation of the support column 40 caused by single-point welding or dispersed welding. However, it should be noted that the annular welding area 21 mainly provides uniform and continuous welding force conditions, and cannot form an exhaust passage towards the outside.

[0063] Of course, in other embodiments, based on the structure or stress requirement of the bottom of the support column 40, a plurality of additional welding areas 21 in the form of sectors, rectangles or other irregular shapes can be locally added inside or outside the annular welding area 21, so as to maintain the overall uniformity of the annular force while further enhancing the local stress points or adapting to the structure of the support column 40 in different forms.

[0064] In summary, the lamp driving board welding structure provided in the embodiment has the first pad 20 arranged around the through hole 11 on the component mounting surface 12 of the circuit board 10, the solder resist ink layer 30 covers the first pad 20, and the window 31 is formed on the solder resist ink layer 30. The window 31 is used to expose a local area of the first pad 20 to form a welding area 21 that is not in communication with the through hole 11, so that the welding area 21 is structurally separated from the through hole 11. When the support column 40 is welded with the first pad 20, the solder resist ink layer 30 effectively limits the flow path of the solder 50, thereby inhibiting the flux 52 in the solder 50 from moving towards the through hole 11, so that the solder 50 can only spread within the welding area 21. This effectively prevents the flux 52 in the solder 50 from flowing along the through hole 11 to the light emitting unit mounting surface 13, reduces the risk of the solder pad surface of the light emitting unit mounting surface 13 being contaminated by the flux 52 in the solder 50, reduces the probability of false judgment caused by the flux 52 in the solder 50 in the LED face printing and optical detection process, and improves the detection pass rate and overall production efficiency. At the same time, without changing the predetermined positioning structure of the through hole 11, the welding reliability and the control of the manufacturing cost are considered.

[0065] While the application has been described with reference to several exemplary embodiments, it is to be understood that the use of other words or terms such as "preferably," "according to an embodiment," and "in one embodiment" is intended to not limit the specification or claims unless other wise explicitly so stated. Because the application can be implemented in many ways, the application should not be construed as limited to the embodiments set forth herein; rather, these embodiments are merely descriptive and illustrative of the scope and spirit of the present application as defined by the following claims. All changes and modifications that come within the meaning and range of equivalents of the claims are to be embraced within the scope thereof as generally afforded by the appended claims and previous and related art.

Claims

1. A lamp driver board welding structure, characterized in that, include: The circuit board (10) includes a component mounting surface (12) and a light-emitting unit mounting surface (13) disposed opposite to each other; the circuit board (10) is provided with a through hole (11) penetrating the component mounting surface (12) and the light-emitting unit mounting surface (13); A first pad (20) is disposed on the component mounting surface (12) and arranged around the through hole (11); A solder resist ink layer (30) covers one side of the first pad (20) away from the circuit board (10); the solder resist ink layer (30) has a window (31) for exposing a local area of ​​the first pad (20) to form a soldering area (21) that is not connected to the through hole (11). A support column (40) is provided corresponding to the first pad (20); The solder resist ink layer (30) separates the welding area (21) from the through hole (11), so that when the support column (40) and the welding area (21) are welded by solder (50), the solder resist ink layer (30) restricts the solder (50) from flowing towards the through hole (11).

2. The lamp driver board welding structure according to claim 1, characterized in that, The solder resist ink layer (30) has a plurality of windows (31) arranged at intervals to form a plurality of dispersed soldering areas (21) on the first solder pad (20). Each soldering area (21) is isolated from the through hole (11) by the solder resist ink layer (30).

3. The lamp driver board welding structure according to claim 2, characterized in that, The plurality of welding zones (21) are evenly spaced along the circumference of the through hole (11), and adjacent welding zones (21) are separated by the solder resist ink layer (30).

4. The lamp driver board welding structure according to claim 3, characterized in that, The number of welding zones (21) is 3-8.

5. The lamp driver board welding structure according to claim 1, characterized in that, An annular window (31) is provided on the solder resist ink layer (30) to form an annular soldering area (21) on the first solder pad (20), and the soldering area (21) is arranged coaxially with the through hole (11).

6. The lamp driver board welding structure according to claim 1, characterized in that, The area of ​​the first pad (20) is larger than the area of ​​the bottom surface of the support column (40) facing the circuit board (10).

7. The lamp driver board welding structure according to claim 1, characterized in that, The support column (40) includes a column body (41) and a positioning part (42). The positioning part (42) is disposed at one end of the column body (41) near the circuit board (10) and protrudes toward the circuit board (10). The positioning part (42) can be accommodated in the through hole (11) to position the support column (40) on the circuit board (10).

8. The lamp driver board welding structure according to claim 1, characterized in that, The solder (50) includes solder paste (51) and flux (52). The solder paste (51) is disposed in the soldering area (21) and located between the support post (40) and the first pad (20). The flux (52) is distributed around the connection area between the support post (40) and the circuit board (10).

9. The lamp driver board welding structure according to claim 1, characterized in that, The circuit board (10) includes a fiberglass layer (101) and copper foil layers respectively disposed on both sides of the fiberglass layer (101). The copper foil layer corresponding to the component mounting surface (12) of the circuit board (10) is etched to form a component circuit, and the copper foil layer corresponding to the light-emitting unit mounting surface (13) of the circuit board (10) is etched to form a light-emitting unit circuit.

10. The lamp driver board welding structure according to claim 9, characterized in that, The component mounting surface (12) of the circuit board (10) is covered with component surface ink (14), which covers the component circuit and exposes the first pad (20) at the position corresponding to the support post (40). The light-emitting unit mounting surface (13) of the circuit board (10) is covered with light-emitting unit surface ink (15). The light-emitting unit surface ink (15) covers the light-emitting unit circuit and exposes the second pad (60) at the position corresponding to the light-emitting unit for soldering the light-emitting unit.

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