Display device and method of manufacturing same

Abstract

A method of manufacturing a display module according to an embodiment may include: forming a color layer on a base substrate; and bonding the light source substrate to the color layer, in which the inorganic light emitting device is disposed on the light source substrate to face the color layer, and forming the color layer includes: disposing a color filter on the base substrate; disposing a low refractive index layer on the color filter; impressing the low refractive index layer; and disposing a color conversion material on the imprinted low refractive index layer.

Description

Technical Field

[0001] This disclosure relates to a display device including an inorganic light-emitting device and a method for manufacturing the display device. Background Technology

[0002] A display device is an output device that visually displays data information (e.g., characters, numbers, and images).

[0003] Typically, liquid crystal panels (LCDs) requiring backlighting or organic light-emitting diode (OLED) panels, which are composed of organic compound films that emit light in response to current, are widely used as display devices. However, LCDs suffer from slow response times and high power consumption, and require backlighting because they do not emit light themselves. Therefore, it is difficult to compact LCDs. Furthermore, although OLEDs do not require backlighting and can achieve thinness due to their self-illumination, they are prone to burn-in. This occurs when an OLED panel displays the same image for an extended period, and due to the short lifespan of subpixels, certain areas of the image remain unchanged after the image is switched to another. For these reasons, micro-LED (micro-LED or μLED) panels are being researched as a new alternative to LCDs and OLEDs. In these micro-LED panels, inorganic light-emitting devices are mounted on a substrate, and the inorganic light-emitting devices themselves function as pixels.

[0004] The micro light-emitting diode panel (hereinafter referred to as the micro LED panel) used as a flat panel display panel is configured with multiple inorganic LEDs, each of which has a size of 100 micrometers (μm) or smaller.

[0005] In addition to having excellent brightness, resolution, power consumption and durability, micro LED panels, as inorganic light-emitting devices, do not cause the burn-in phenomenon of OLEDs, which are self-emissive devices.

[0006] Compared to LCD panels that require backlighting, micro-LED panels offer better contrast, response time, and energy efficiency. Although both OLED and micro-LED have high energy efficiency, micro-LED, as an inorganic light-emitting device, has higher brightness, higher luminous efficiency, and longer lifespan than OLED.

[0007] In addition, micro LEDs can achieve substrate-level display modulation by arranging LEDs on a circuit board in units of pixels, and can provide various resolutions and screen sizes according to customer orders. Summary of the Invention

[0008] A display device and a method of manufacturing the display device are provided, the display device having improved optical efficiency by allowing a color conversion material to be set into a predetermined shape by imprinting a low refractive index layer.

[0009] The technical objectives that can be achieved by this disclosure are not limited to those described above, and other technical objectives not mentioned will be clearly understood by those skilled in the art based on the following description.

[0010] According to aspects of this disclosure, a method for manufacturing a display module in a plurality of display modules horizontally arranged in a matrix type in a display device may include: depositing a surface film on a substrate; forming a color layer on the surface film; and adhering a light source substrate on which inorganic light-emitting devices are disposed to the color layer to allow the inorganic light-emitting devices to face the color layer, wherein forming the color layer may include: depositing a black matrix on the surface film; depositing a color filter on the black matrix; depositing a low refractive index layer on the color filter and the black matrix; imprinting the low refractive index layer; and depositing a color conversion material on the imprinted low refractive index layer.

[0011] According to aspects of this disclosure, a display module in a display device comprising a plurality of display modules horizontally arranged in a matrix type may include: a substrate; an inorganic light-emitting device disposed on the substrate; a color layer through which light emitted from the inorganic light-emitting device passes, and the color layer including a first surface facing the inorganic light-emitting device and a second surface facing the opposite side of the first surface; and a surface film disposed on the color layer and including a surface in contact with the second surface of the color layer, wherein the color layer may include: a black matrix; color filters disposed between the black matrices; a low refractive index layer disposed on the color filters; and a color conversion material disposed on the low refractive index layer, wherein the low refractive index layer may be imprinted. Attached Figure Description

[0012] Figure 1 This is a perspective view of a display device according to an embodiment of the present disclosure.

[0013] Figure 2 This is an exploded perspective view showing the main components of a display device according to an embodiment of the present disclosure.

[0014] Figure 3 This is a rear perspective view of the display module of a display device according to an embodiment of the present disclosure.

[0015] Figure 4 This is a perspective view showing some components of a display module in a display device according to an embodiment of the present disclosure.

[0016] Figure 5 This is an enlarged cross-sectional view showing some components of a display module in a display device according to an embodiment of the present disclosure.

[0017] Figure 6 This is an enlarged cross-sectional view showing some components of a display module in a display device according to an embodiment of the present disclosure.

[0018] Figure 7 This is an enlarged cross-sectional view showing some components of a display module in a display device according to an embodiment of the present disclosure.

[0019] Figure 8 This is a flowchart illustrating the process of manufacturing a display module in a display device according to an embodiment of the present disclosure.

[0020] Figure 9 This is a flowchart illustrating the process of manufacturing the color layer of a display module in a display device according to an embodiment of the present disclosure.

[0021] Figure 10 This is a schematic diagram illustrating the process of manufacturing a display module in a display device according to an embodiment of the present disclosure.

[0022] Figure 11 This is a schematic diagram illustrating the process of manufacturing a display module in a display device according to an embodiment of the present disclosure.

[0023] Figure 12 This is a schematic diagram illustrating the process of manufacturing a display module in a display device according to an embodiment of the present disclosure.

[0024] Figure 13 This is a schematic diagram illustrating the process of manufacturing a display module in a display device according to an embodiment of the present disclosure.

[0025] Figure 14 This is a schematic diagram illustrating the process of manufacturing a display module in a display device according to an embodiment of the present disclosure.

[0026] Figure 15 This is a schematic diagram illustrating the process of manufacturing a display module in a display device according to an embodiment of the present disclosure.

[0027] Figure 16 This is a schematic diagram illustrating the process of manufacturing a display module in a display device according to an embodiment of the present disclosure.

[0028] Figure 17 This is a schematic diagram illustrating the process of manufacturing a display module in a display device according to an embodiment of the present disclosure.

[0029] Figure 18 This is a schematic diagram illustrating the process of manufacturing a display module in a display device according to an embodiment of the present disclosure.

[0030] Figure 19This is a schematic diagram illustrating the process of manufacturing a display module in a display device according to an embodiment of the present disclosure.

[0031] Figure 20 This is a graph used to illustrate the optical efficiency of a display device according to an embodiment of the present disclosure.

[0032] Figure 21 This is a graph used to illustrate the optical efficiency of a display device according to an embodiment of the present disclosure. Detailed Implementation

[0033] The configurations shown in the accompanying drawings and the embodiments described in this disclosure are merely examples. Therefore, it should be understood that various modifications that can replace the embodiments and drawings of this disclosure are also possible when this application is filed.

[0034] Throughout the accompanying drawings, similar reference numerals may be used for similar or related elements.

[0035] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. Unless the context otherwise requires, the singular form of a noun corresponding to an item may include one or more items. It will be understood that, when used in this specification, the terms “comprising,” “including,” “including,” and / or “comprising” indicate the presence of the stated feature, figure, step, operation, component, element, or combination thereof, but do not preclude the presence or addition of one or more other features, figures, steps, operations, components, elements, or combinations thereof.

[0036] In this disclosure, phrases such as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C” and “at least one of A, B or C” can include any one or all possible combinations of the items listed together in the corresponding phrases among these phrases.

[0037] As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0038] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements are not limited by these terms, and these terms are used only to distinguish one element from another. For example, a first element may be referred to as a second element without departing from the scope of this disclosure, and similarly, a second element may be referred to as a first element. The term “and / or” includes a combination of one or all of the items listed in the related list.

[0039] In this disclosure, the meaning of "identical" can include similar properties or similarity within a certain range. Additionally, the term "identical" means "substantially identical." "Substantially identical" should be understood as values ​​falling within the tolerance range of manufacturing errors or values ​​corresponding to differences within a meaningless range relative to a reference value being included within the range of "identical."

[0040] In the following description, the terms “front,” “rear,” “left,” and “right” are defined based on the accompanying drawings, and the shape and position of the components are not limited by these terms.

[0041] Embodiments of this disclosure are described in detail below with reference to the accompanying drawings.

[0042] Figure 1 This is a perspective view of a display device according to an embodiment of the present disclosure. Figure 2 This is an exploded perspective view showing the main components of a display device according to an embodiment of the present disclosure. Figure 3 This is a rear perspective view of the display module of a display device according to an embodiment of the present disclosure. Figure 4 This is a perspective view showing some components of a display module in a display device according to an embodiment of the present disclosure. Figure 5 This is an enlarged cross-sectional view showing some components of a display module in a display device according to an embodiment of the present disclosure.

[0043] Some components of the display device 1 (including the plurality of inorganic light-emitting devices 50 shown in the figures) may be micro-components with a size of a few micrometers (μm) to a few hundred micrometers (μm), and for ease of description, some components (e.g., the plurality of inorganic light-emitting devices 50, etc.) are shown in an enlarged size.

[0044] Display device 1 can be a device for displaying information and data such as characters, numbers, graphics, and images, and display device 1 can be a television (TV), a personal computer (PC), a mobile device, a digital signage, etc.

[0045] refer to Figure 1 and Figure 2 According to embodiments of the present disclosure, the display device 1 may include a display panel 20 for displaying images, a power supply (not shown) for supplying power to the display panel 20, a main board 25 for controlling the overall operation of the display panel 20, a frame 15 for supporting the display panel 20, and a rear cover 10 covering the rear side of the frame 15.

[0046] The display panel 20 may include a plurality of display modules 30A to 30P, a driver board (not shown) for driving the display modules 30A to 30P, and a timing controller (TCON) board for generating timing signals required to control the respective display modules 30A to 30P.

[0047] The back cover 10 can support the display panel 20. The back cover 10 can be placed on the floor by a bracket (not shown), or mounted on a wall by a hanger (not shown), etc.

[0048] Multiple display modules 30A to 30P can be arranged adjacent to each other along the top, bottom, left, and right directions. The multiple display modules 30A to 30P can be arranged in an M*N matrix type. In the current embodiment, 16 display modules 30A to 30P can be provided and arranged in a 4*4 matrix type. However, the number and arrangement of the multiple display modules 30A to 30P are not limited to these.

[0049] Multiple display modules 30A to 30P can be mounted on the frame 15. The multiple display modules 30A to 30P can be mounted on the frame 15 using various known methods (e.g., by magnetic force of a magnet, mechanical fixing structures, etc.). The rear cover 10 can be coupled to the rear side of the frame 15, and the rear cover 10 can form the rear appearance of the display device 1.

[0050] The back cover 10 may include a metallic material. Therefore, the heat generated from the multiple display modules 30A to 30P and the frame 15 can be effectively conducted to the back cover 10, thereby improving the heat dissipation performance of the display device 1.

[0051] In this way, the display device 1 according to the embodiments of the present disclosure can realize a large screen by tiling multiple display modules 30A to 30P.

[0052] Unlike the embodiments of this disclosure, each of the plurality of display modules 30A to 30P can be applied to different display devices. For example, each of the display modules 30A to 30P can be installed in various electronic products or electronic devices that require a display (e.g., wearable devices, portable devices, and handheld devices), and, as in the embodiments of this disclosure, the plurality of display modules 30A to 30P can be assembled and arranged in a matrix type for application to display devices such as PC monitors, high-definition TVs, signage, and electronic displays.

[0053] Multiple display modules 30A to 30P can have the same configuration. Therefore, the following description of the display modules can be applied to all other display modules in the same way.

[0054] In the following text, since the multiple display modules 30A to 30P have the same configuration, the multiple display modules 30A to 30P will be described based on the first display module 30A.

[0055] For example, to avoid repetitive descriptions, the main components of each of the multiple display modules 30A to 30P will be described as display module 30, substrate 40 and surface film 70.

[0056] Additionally, the first display module 30A among the plurality of display modules 30A to 30P, and the second display module 30E located adjacent to the first display module 30A in the second direction Y, or the third display module 30B located adjacent to the first display module 30A in the third direction Z, will be described as needed.

[0057] As an example, the first display module 30A among the plurality of display modules 30A to 30P can be of quadrilateral type. However, the first display module 30A can be of rectangular type or square type.

[0058] Therefore, the first display module 30A may include edges 31, 32, 33 and 34 formed along the upper, lower, left and right directions relative to the first direction X as the forward direction.

[0059] For example, the left-right direction of the display device 1 (which is orthogonal to the first direction X toward the forward direction of the display device 1) is called the second direction Y, and the up-down direction of the display device 1 (which is orthogonal to the first direction X and the second direction Y) is called the third direction Z.

[0060] refer to Figure 3 and Figure 4 The side wiring 46 may extend along the third direction Z via the chamfered portion 49 and the side surface 45 of the substrate 40 toward the rear surface 43 of the substrate 40, but is not limited thereto.

[0061] However, the side wiring 46 may extend along the second direction Y via the chamfered portion 49 and side surface 45 of the substrate 40 positioned along the second direction Y toward the rear surface 43 of the substrate 40.

[0062] According to embodiments of this disclosure, the side wiring 46 may extend along the edge E of the substrate 40 corresponding to the upper edge 32 and the lower edge 34 of the first display module 30A, but is not limited thereto.

[0063] However, the side wiring 46 may extend along the edge E of the substrate 40 corresponding to at least two of the four edges 31, 32, 33 and 34 of the first display module 30A.

[0064] The upper wiring layer (not shown) can be connected to the side wiring 46 via the upper connection pad (not shown) formed at the edge E of the substrate 40.

[0065] Side wiring 46 may extend along the side surface 45 of substrate 40 and connect to the back wiring layer 43b formed on the back surface 43.

[0066] An insulating layer 43c covering the back wiring layer 43b can be formed on the back wiring layer 43b in the direction facing the back surface of the substrate 40.

[0067] The display device 1 may include a plurality of inorganic light-emitting devices 50. The plurality of inorganic light-emitting devices 50 may be electrically connected sequentially to an upper wiring layer (not shown), a side wiring layer 46 and a rear wiring layer 43b.

[0068] Additionally, the first display module 30A may include a driving circuit board 80 for electrically controlling a plurality of inorganic light-emitting devices 50 mounted on the mounting surface 41. The driving circuit board 80 may be a printed circuit board. The driving circuit board 80 may be located on the rear surface 43 of the substrate 40 in the first direction X. The driving circuit board 80 may be located on a metal plate 60 adhered to the rear surface 43 of the substrate 40.

[0069] The first display module 30A may include a flexible film 81 that connects the driving circuit board 80 to the rear wiring layer 43b, so as to electrically connect the driving circuit board 80 to a plurality of inorganic light-emitting devices 50.

[0070] More specifically, one end of the flexible film 81 may be located on the rear surface 43 of the substrate 40 and connected to the rear connection pad 43d which is electrically connected to the plurality of inorganic light-emitting devices 50.

[0071] The rear connection pad 43d can be electrically connected to the rear wiring layer 43b. Therefore, the rear connection pad 43d can electrically connect the rear wiring layer 43b to the flexible film 81.

[0072] Since the flexible film 81 is electrically connected to the rear connection pad 43d, the flexible film 81 can transmit power and electrical signals from the drive circuit board 80 to multiple inorganic light-emitting devices 50.

[0073] The flexible membrane 81 can be formed into flexible flat cables (FFC), chips on membranes (COF), etc.

[0074] The flexible membrane 81 may include a first flexible membrane 81a and a second flexible membrane 81b positioned in an upward and downward direction relative to a first direction X which is the forward direction.

[0075] However, the first flexible membrane 81a and the second flexible membrane 81b can be positioned along the left and right directions relative to the first direction X, or along at least two of the up, down, left and right directions.

[0076] Multiple second flexible membranes 81b can be provided, but are not limited to this. However, a single second flexible membrane 81b can be provided, and multiple first flexible membranes 81a can be provided.

[0077] The first flexible film 81a can transmit data signals from the drive circuit board 80 to the substrate 40. The first flexible film 81a can be COF.

[0078] The second flexible film 81b can transfer power from the drive circuit board 80 to the substrate 40. The second flexible film 81b can be an FFC.

[0079] However, the first flexible membrane 81a and the second flexible membrane 81b can be formed in opposite directions.

[0080] Although not shown, the drive circuit board 80 can be electrically connected to the motherboard 25 (see Figure 2 The motherboard 25 can be located behind the frame 15, and the motherboard 25 can be connected to the drive circuit board 80 via a cable (not shown) behind the frame 15.

[0081] The metal plate 60 can contact the substrate 40. The metal plate 60 can be adhered to the substrate 40 via a back adhesive tape 61 located between the back surface 43 of the substrate 40 and the metal plate 60 (see [link]). Figure 5 ).

[0082] The metal plate 60 can be formed from a metallic material with high thermal conductivity. For example, the metal plate 60 can be formed from aluminum.

[0083] Heat generated from the thin-film transistor (TFT) layer 44 and the plurality of inorganic light-emitting devices 50 mounted on the substrate 40 can be transferred along the rear surface 43 of the substrate 40 to the metal plate 60 via the rear adhesive tape 61.

[0084] Therefore, the heat generated from the substrate 40 can be effectively transferred to the metal plate 60, and the temperature of the substrate 40 can be prevented from rising above a certain temperature.

[0085] Multiple display modules 30A to 30P can be located at various positions within an M*N matrix. Display modules 30A to 30P can be moved independently. In this case, each of the display modules 30A to 30P can include a metal plate 60 to maintain a certain level of heat dissipation, regardless of the display module's position.

[0086] Multiple display modules 30A to 30P can be arranged in various M*N matrix types to form screens of various sizes for display device 1. Therefore, compared with heat dissipation by a single metal plate configured for temporary heat dissipation, the overall heat dissipation performance of display device 1 can be improved by including multiple metal plates 60 in each of the display modules 30A to 30P for heat dissipation according to embodiments of the present disclosure.

[0087] When a single metal plate is located inside the display device 1, a portion of the metal plate may not be located in a position corresponding to the location of some display modules, and a portion of the metal plate may be located in a position where no display modules are installed in the front-back direction. In this case, the heat dissipation efficiency of the display device 1 may deteriorate.

[0088] Since the metal plate 60 is disposed at each of the display modules 30A to 30P, all display modules 30A to 30P can dissipate heat through the metal plate 60 regardless of their position, which improves the overall heat dissipation performance of the display device 1.

[0089] The metal plate 60 can be configured as a quadrilateral type that substantially corresponds to the shape of the substrate 40.

[0090] The substrate 40 may have an area at least equal to or greater than that of the metal plate 60. The substrate 40 and the metal plate 60 may be positioned side by side along a first direction X. In this case, the four edges of the substrate 40, which is rectangular, may correspond to the four edges of the metal plate 60 relative to the center of the substrate 40 and the metal plate 60, or the four edges of the substrate 40 may be positioned outward from the four edges of the metal plate 60 relative to the center of the substrate 40 and the metal plate 60.

[0091] The four edges E of the substrate 40 can be positioned outward from the four edges of the metal plate 60. For example, the area of ​​the substrate 40 can be larger than the area of ​​the metal plate 60.

[0092] As heat is transferred to each of the display modules 30A to 30P, the substrate 40 and the metal plate 60 can thermally expand. However, since the metal plate 60 has a larger coefficient of thermal expansion than the substrate 40, the expansion value of the metal plate 60 can be greater than that of the substrate 40.

[0093] In this case, where the four edges E of the substrate 40 correspond to the four edges of the metal plate 60 or are positioned inward from the four edges of the metal plate 60, the edges of the metal plate 60 can protrude outward from the substrate 40.

[0094] Therefore, due to the thermal expansion of the metal plates 60 of each of the display modules 30A to 30P, the gaps between the display modules 30A to 30P may become irregular, thus increasing the visibility of some seams and causing a deterioration in the overall image quality of the display panel 20.

[0095] However, when the four edges E of the substrate 40 are positioned outward from the four edges of the metal plate 60, the metal plate 60 will not protrude outward from the four edges E of the substrate 40 despite thermal expansion of the substrate 40 and the metal plate 60. Therefore, the display modules 30A to 30P can maintain a constant gap.

[0096] In addition, in order to maintain a constant gap between the display modules 30A to 30P, the front side of the frame 15 supporting the display modules 30A to 30P can have material properties similar to those of the substrate 40. For example, the display modules 30A to 30P can be adhered to the front side of the frame 15.

[0097] According to embodiments of this disclosure, the area of ​​substrate 40 can substantially correspond to the area of ​​metal plate 60. Therefore, heat generated from substrate 40 can be dissipated uniformly over the entire area of ​​substrate 40 without being isolated in some areas.

[0098] The metal plate 60 can be adhered to the rear surface 43 of the substrate 40 by the back adhesive tape 61.

[0099] The back adhesive tape 61 can be configured to correspond in size to the metal plate 60. For example, the area of ​​the back adhesive tape 61 can correspond to the area of ​​the metal plate 60. The metal plate 60 can be generally quadrilateral, and correspondingly, the back adhesive tape 61 can also be quadrilateral.

[0100] The edge of the back adhesive tape 61 may correspond to the edge of the metal plate 60, which is of the rectangular type, relative to the center of the metal plate 60 and the back adhesive tape 61.

[0101] Therefore, the metal plate 60 and the back adhesive tape 61 can be easily manufactured as a coupling assembly, which helps to improve the manufacturing efficiency of the display device 1.

[0102] For example, by adhering the post-adhesive tape 61 to the metal plate and then cutting the metal plate and the post-adhesive tape 61 together into preset units, multiple processes can be reduced.

[0103] The heat generated from the substrate 40 can be transferred to the metal plate 60 via the back adhesive tape 61. Therefore, the back adhesive tape 61 can adhere the metal plate 60 to the substrate 40 and transfer the heat generated from the substrate 40 to the metal plate 60.

[0104] Therefore, the post-adhesive tape 61 may include a material with high heat dissipation properties.

[0105] Basically, the post-adhesive tape 61 may include an adhesive material for adhering the substrate 40 to the metal plate 60.

[0106] Furthermore, the post-adhesive tape 61 may include a material with high heat dissipation properties, rather than a conventional adhesive material. Therefore, the post-adhesive tape 61 can efficiently transfer heat between the substrate 40 and the metal plate 60.

[0107] In addition, the adhesive material of the post-adhesive tape 61 can be a material with higher heat dissipation performance than the adhesive material that forms a common adhesive.

[0108] Materials with high heat dissipation performance are those that can efficiently transfer heat due to their high thermal conductivity, high heat transfer performance, and low specific heat.

[0109] For example, the post-adhesive tape 61 may include, but is not limited to, a graphite material. However, the post-adhesive tape 61 may be a common material with high heat dissipation properties.

[0110] The back adhesive tape 61 can have a higher flexibility than the substrate 40 and the metal plate 60. Therefore, the back adhesive tape 61 can be formed of a material with adhesiveness, heat dissipation properties, and high flexibility. The back adhesive tape 61 can be a substrate-free double-sided tape. As described above, since the back adhesive tape 61 is a substrate-free tape, it can be a single layer without any substrate between the side adhered to the substrate 40 and the other side adhered to the metal plate 60 to support both sides.

[0111] Since the backing tape 61 does not include a substrate, it can be free of any materials that might impede heat transfer, thus improving heat dissipation performance. However, the backing tape 61 is not limited to substrate-free double-sided tapes, and can be a heat-dissipating tape with higher heat dissipation performance than ordinary double-sided tapes.

[0112] To absorb any external forces transmitted from the substrate 40 and the metal plate 60, the post-adhesive tape 61 can be formed of a highly flexible material. More specifically, the flexibility of the post-adhesive tape 61 can be greater than that of the substrate 40 and the metal plate 60.

[0113] Therefore, although heat is transferred to the substrate 40 and the metal plate 60, and thus the external force generated by the dimensional changes of the substrate 40 and the metal plate 60 is transferred to the back adhesive tape 61, the back adhesive tape 61 itself can deform to prevent the external force from being transferred to other components.

[0114] The adhesive tape 61 may have a preset thickness in the first direction X. When the metal plate 60 expands due to heat transfer or contracts due to cooling, the metal plate 60 may expand or contract in the first direction X and in directions orthogonal to the first direction X. Accordingly, external force may be transferred to the substrate 40.

[0115] Since the metal plate 60 is formed to have a size corresponding to the substrate 40 and to cover the entire rear surface 43 of the substrate 40, as described above, the fixing member 82 can be located on the rear surface of the metal plate 60, but is not limited thereto.

[0116] However, the fixing member 82 can be located on the rear surface 43 of the substrate 40. In this case, the substrate 40 can be directly adhered to the frame 15 via the fixing member 82.

[0117] Unlike the embodiments disclosed herein, the metal plate 60 may cover only a region of the rear surface 43 of the substrate 40, and the fixing member 82 may adhere to another region of the rear surface 43 of the substrate 40 that is not covered by the metal plate 60.

[0118] The fixing component 82 can be, for example, double-sided tape.

[0119] refer to Figure 5 Each of the plurality of display modules 30A to 30P may include a substrate 40 and a plurality of inorganic light-emitting devices 50 mounted on the substrate 40. The substrate 40 may be a light source substrate 40. The plurality of inorganic light-emitting devices 50 may be mounted on a mounting surface 41 of the substrate 40 facing a first direction X. The mounting surface 41 may be a first surface. Additionally, the mounting surface 41 may be located on a first side of the substrate 40, and a metal plate 60 may be located on a second side of the substrate 40, the second side being opposite to the first side. For ease of description, in Figure 5 In the diagram, the thickness of the substrate 40 in the first direction X is shown as exaggerated. The first direction X can be the forward direction.

[0120] The substrate 40 may be quadrilateral. Each of the plurality of display modules 30A to 30P may be quadrilateral, as described above, and accordingly, the substrate 40 may also be quadrilateral.

[0121] The substrate 40 can be rectangular or square.

[0122] Therefore, for example, in the first display module 30A, the substrate 40 may include four edges E formed along the upper, lower, left, and right directions relative to the first direction X as the forward direction, corresponding to the edges 31, 32, 33, and 34 of the first display module 30A (see...). Figure 4 ).

[0123] The substrate 40 may include a substrate body 42, a mounting surface 41 forming one side of the substrate body 42, a rear surface 43 forming the other side of the substrate body 42 and opposite to the mounting surface 41, and a side surface 45 located between the mounting surface 41 and the rear surface 43.

[0124] The side surface 45 can form the side ends of the substrate 40 in the second direction Y and the third direction Z, which are orthogonal to the first direction X.

[0125] The substrate 40 may include a chamfered portion 49 formed between the mounting surface 41 and the side surface 45 and between the rear surface 43 and the side surface 45.

[0126] The chamfered portion 49 can prevent the substrates from colliding with each other and being damaged when multiple display modules 30A to 30P are arranged.

[0127] The edge E of the substrate 40 may include a side surface 45 and a chamfered portion 49.

[0128] The substrate 40 may include a TFT layer 44 formed on the substrate body 42 to drive the inorganic light-emitting device 50. The substrate body 42 may include a glass substrate. For example, the substrate 40 may include a chip-on-glass (COG) type substrate 40. On the substrate 40, a first pad electrode 44a and a second pad electrode 44b for electrically connecting the inorganic light-emitting device 50 to the TFT layer 44 may be formed.

[0129] The TFTs constituting TFT layer 44 are not limited to a specific structure or type, and can be configured as one or more embodiments. For example, the TFTs of TFT layer 44 according to embodiments of the present disclosure can be implemented as low-temperature polycrystalline silicon (LTPS) TFTs, oxide TFTs, silicon (polycrystalline silicon or amorphous silicon) TFTs, organic TFTs, graphene TFTs, etc.

[0130] In addition, depending on the substrate body 42 of the substrate 40 which is set as a silicon wafer, the TFT layer 44 can be replaced with a complementary metal-oxide-semiconductor (CMOS) type, an n-type metal-oxide-semiconductor field-effect transistor (MOSFET), or a p-type MOSFET.

[0131] Multiple inorganic light-emitting devices 50 can be formed from inorganic materials and can include inorganic light-emitting devices with width, length, and height dimensions ranging from a few micrometers (μm) to tens of micrometers (μm). Micro-inorganic light-emitting devices can have shorter side lengths of 100 micrometers (μm) or less in width, length, and height. For example, inorganic light-emitting devices 50 can be picked up from a sapphire or silicon wafer and then transferred directly onto a substrate 40. Multiple inorganic light-emitting devices 50 can be picked up and transferred by an electrostatic method using an electrostatic head or by an imprinting method using a flexible polymer material such as polydimethylsiloxane (PDMS) or silicon as the head.

[0132] Multiple inorganic light-emitting devices 50 can be light-emitting structures including an n-type semiconductor 58a, an active layer 58c, a p-type semiconductor 58b, a first contact electrode 57a, and a second contact electrode 57b.

[0133] Although not shown, either the first contact electrode 57a or the second contact electrode 57b can be electrically connected to the n-type semiconductor 58a, and the other can be electrically connected to the p-type semiconductor 58b.

[0134] The first contact electrode 57a and the second contact electrode 57b can be flip-chip types that are horizontally arranged in the same direction (opposite to the light emission direction).

[0135] Each inorganic light-emitting device 50 may include a light-emitting surface 54, a side surface 55, and a bottom surface 56 opposite to the light-emitting surface 54, which are positioned in the first direction X when mounted on the mounting surface 41, wherein a first contact electrode 57a and a second contact electrode 57b may be formed on the bottom surface 56.

[0136] For example, the first contact electrode 57a and the second contact electrode 57b of the inorganic light-emitting device 50 can be opposite to the light-emitting surface 54. Therefore, the first contact electrode 57a and the second contact electrode 57b can be positioned in opposite directions to the light-emitting direction.

[0137] The first contact electrode 57a and the second contact electrode 57b can face the mounting surface 41 and are electrically connected to the TFT layer 44. In addition, the light-emitting surface 54 that radiates light through it can be positioned in the opposite direction to the positioning direction of the first contact electrode 57a and the second contact electrode 57b.

[0138] Therefore, the light generated by the active layer 58c can be radiated in the first direction X through the light-emitting surface 54 without being interfered with by the first contact electrode 57a and the second contact electrode 57b.

[0139] For example, the first direction X can be defined as the direction in which the luminescent surface 54 is positioned to radiate light.

[0140] The first contact electrode 57a and the second contact electrode 57b can be electrically connected to the first pad electrode 44a and the second pad electrode 44b formed on the mounting surface 41 of the substrate 40, respectively.

[0141] The inorganic light-emitting device 50 can be directly connected to the first pad electrode 44a and the second pad electrode 44b through the anisotropic conductive layer 47 or a bonding material such as solder.

[0142] An anisotropic conductive layer 47 can be formed on the substrate 40 to mediate electrical connections between the first contact electrode 57a and the second contact electrode 57b and the first pad electrode 44a and the second pad electrode 44b. The anisotropic conductive layer 47 can be formed by coating anisotropic conductive adhesive onto a protective film and has a structure in which conductive spheres 47a are distributed in the adhesive resin. Each conductive sphere 47a can be a conductive sphere surrounded by a thin insulating film, and the conductive sphere 47a can electrically connect a conductor to another conductor due to the rupture of the insulating film caused by pressure.

[0143] The anisotropic conductive layer 47 may include an anisotropic conductive film (ACF) in the form of a film and an anisotropic conductive paste (ACP) in the form of a paste.

[0144] In embodiments of this disclosure, the anisotropic conductive layer 47 may be configured as an anisotropic conductive film.

[0145] Therefore, when multiple inorganic light-emitting devices 50 are mounted on the substrate 40, the insulating film of the conductive ball 47a may be broken due to the pressure applied to the anisotropic conductive layer 47, so the first contact electrode 57a and the second contact electrode 57b of the inorganic light-emitting device 50 can be electrically connected to the first pad electrode 44a and the second pad electrode 44b of the substrate 40.

[0146] Although not shown, multiple inorganic light-emitting devices 50 can be mounted on the substrate 40 using solder (not shown) instead of the anisotropic conductive layer 47. The inorganic light-emitting devices 50 can be bonded to the substrate 40 by performing a reflow process after the inorganic light-emitting devices 50 are arranged on the substrate 40.

[0147] The anisotropic conductive layer 47 can be formed to have a dark color. For example, the anisotropic conductive layer 47 can absorb external light, making the substrate 40 appear black, thereby improving the contrast of the image. The anisotropic conductive layer 47 with a dark color can complement the light-absorbing layer 44c formed on the entire mounting surface 41 of the substrate 40.

[0148] The display device 1 may include a plurality of inorganic light-emitting devices 50. The plurality of inorganic light-emitting devices 50 may include blue light-emitting devices 50. For example, all of the plurality of inorganic light-emitting devices 50 may be blue inorganic light-emitting devices 50, but this is not a limitation. However, the inorganic light-emitting devices 50 may also be red light-emitting devices 50 and green light-emitting devices 50.

[0149] The inorganic light-emitting device 50 may include a first inorganic light-emitting device 51, a second inorganic light-emitting device 52, and a third inorganic light-emitting device 53. The third inorganic light-emitting device 53 may be located between the first inorganic light-emitting device 51 and the second inorganic light-emitting device 52. However, the inorganic light-emitting device 50 may be referred to by a name different from the one described in the examples above. For instance, the inorganic light-emitting device located between the first inorganic light-emitting device 51 and the third inorganic light-emitting device 52 may be the second inorganic light-emitting device 53. Alternatively, the inorganic light-emitting device located between the second inorganic light-emitting device 51 and the third inorganic light-emitting device 52 may be the first inorganic light-emitting device 53.

[0150] The first inorganic light-emitting device 51, the second inorganic light-emitting device 52, and the third inorganic light-emitting device 53 can be arranged in a row at a preset interval as in the embodiments of this disclosure, or they can be arranged in another shape such as a triangle.

[0151] The display device 1 may further include a color layer 100. The color layer 100 can convert the color of light emitted from the inorganic light-emitting device 50. The color layer 100 may be located between the surface film 70 and the inorganic light-emitting device 50. For example, the color layer 100 may be located between the surface film 70 and the adhesive layer 200 in the first direction X. The color layer 100 may be located in front of the inorganic light-emitting device 50.

[0152] Color layer 100 may include optical layers 110, 120, and 130. Optical layers 110, 120, and 130 can diffuse light emitted from inorganic light-emitting device 50 in the forward direction X. For example, optical layers 110, 120, and 130 can diffuse light emitted from inorganic light-emitting device 50 towards surface film 70. Optical layers 110, 120, and 130 may also be referred to as light diffusion layers 110, 120, and 130.

[0153] Color layer 100 may include resins 111 and 121 and color conversion materials 112 and 122. Resins 111 and 121 may be mixed with color conversion materials 112 and 122. Resins 111 and 121 may be transparent. Resins 111 and 121, or mixtures of resins 111 and 121 with color conversion materials 112 and 122, may be disposed within optical layers 110, 120, and 130.

[0154] Light emitted from the inorganic light-emitting device 50 can be color-converted by passing through color-converting materials 112 and 122. For example, color-converting materials 112 and 122 may include quantum dots 112 and 122. However, the types of color-converting materials 112 and 122 are not limited to this.

[0155] Optical layers 110, 120, and 130 may include a first optical layer 110, a second optical layer 120, and a third optical layer 130. The first optical layer 110 may correspond to a first inorganic light-emitting device 51, the second optical layer 120 may correspond to a second inorganic light-emitting device 52, and the third optical layer 130 may correspond to a third inorganic light-emitting device 53.

[0156] For example, light emitted from the first inorganic light-emitting device 51 can pass through the first optical layer 110. Light passing through the first optical layer 110 can be diffused and / or emitted in the forward direction (see...). Figure 6 For example, light passing through the first optical layer 110 can exhibit a Lambertian emission pattern. The first optical layer 110 can be a first color conversion layer 110. Light passing through the first color conversion layer 110 can display a first color. For example, the inorganic light-emitting device 50 can be a blue inorganic light-emitting device. In this case, the first color can be green. For example, the first color conversion layer 110 can be a green conversion layer.

[0157] Resin 111 and quantum dot 112 can be located in the first color conversion layer 110. Quantum dot 112 can be located in resin 111. The quantum dot 112 located in the first color conversion layer 110 can convert light passing through the first color conversion layer 110 into green light. Light passing through the first color conversion layer 110 can display color by being absorbed in the quantum dot 112 and then emitted from the quantum dot 112, and this light can be emitted in all directions. Therefore, light passing through the first color conversion layer 110 can exhibit a Lambertian emission mode and be emitted in the forward direction. The quantum dot 112 in the first color conversion layer 110 can be a first quantum dot 112.

[0158] Additionally, for example, light emitted from the second inorganic light-emitting device 52 can pass through the second optical layer 120. Light passing through the second optical layer 120 can be diffused and / or emitted in a forward direction (see...). Figure 6 For example, light passing through the second optical layer 120 can exhibit a Lambertian emission mode. The second optical layer 120 can be a second color conversion layer 120. Light passing through the second color conversion layer 120 can display a second color. For example, in the case where the inorganic light-emitting device 50 is a blue inorganic light-emitting device 50, the second color can be red. For example, the second color conversion layer 120 can be a red conversion layer.

[0159] Resin 121 and quantum dots 122 may also be located in the second color conversion layer 120. Quantum dots 122 may be located in resin 121. Quantum dots 122 located in the second color conversion layer 120 can convert light passing through the second color conversion layer 120 into red light. Light passing through the second color conversion layer 120 can display color by being absorbed in quantum dots 122 and then emitted from quantum dots 122, and this light can be emitted in all directions. Therefore, light passing through the second color conversion layer 120 can exhibit a Lambertian emission mode and be emitted in the forward direction. Quantum dots 122 in the second color conversion layer 120 may be second quantum dots 122.

[0160] Additionally, for example, light emitted from the third inorganic light-emitting device 53 can pass through the third optical layer 130 (see...). Figure 6 The third optical layer 130 can be a scattering layer 130. Light passing through the scattering layer 130 can be diffused and / or emitted in a forward direction. Resin can also be located inside the scattering layer 130. Details regarding the scattering layer 130 will be described later.

[0161] Color layer 100 and inorganic light-emitting device 50 can form a pixel. For example, multiple inorganic light-emitting devices 50, a first color conversion layer 110, a second color conversion layer 120, and a scattering layer 130 can form a pixel. In this case, each pair of the first inorganic light-emitting device 51 and the first color conversion layer 110, the second inorganic light-emitting device 52 and the second color conversion layer 120, and the third inorganic light-emitting device 53 and the scattering layer 130 can form a sub-pixel. For example, the first inorganic light-emitting device 51 and the first color conversion layer 110 can form a green sub-pixel, the second inorganic light-emitting device 52 and the second color conversion layer 120 can form a red sub-pixel, and the third inorganic light-emitting device 53 and the scattering layer 130 can form a blue sub-pixel.

[0162] Color layer 100 may further include a position guide 140. Position guide 140 can guide the positions of the first color conversion layer 110, the second color conversion layer 120, and the scattering layer 130. Position guide 140 can position the first color conversion layer 110, the second color conversion layer 120, and the scattering layer 130 in the correct positions. Position guide 140 can guide resins 111, 121, and 131 (see...). Figure 6 ), quantum dots 112 and 122 and scattering particle 132 (see Figure 6 The position guide 140 may be formed of an organic material and include a dark color. For example, the position guide 140 may be gray. The position guide 140 may be formed of a material with low transmittance. For example, the position guide 140 may be formed of a material with high light absorption or high reflectance. Therefore, the position guide 140 may absorb and / or reflect light traveling toward the position guide 140 from the light diffused by the first color conversion layer 110, the second color conversion layer 120, and the scattering layer 130. The position guide 140 may also be referred to as a partition wall 140.

[0163] The positioning guide 140 may be located between the surface film 70 and the inorganic light-emitting device 50. For example, the positioning guide 140 may be located between the black matrix 90 and the adhesive layer 200 in the first direction X.

[0164] The display device 1 may also include a black matrix 90. For example, the color layer 100 may include a black matrix 90. The black matrix 90 may absorb external light and improve contrast. For example, the black matrix 90 may be located between the position guide 140 and the surface film 70 in the first direction X. A color filter 150 may be located between the black matrices 90.

[0165] The display device 1 may also include a color filter 150. For example, the color filter 150 may be located between the surface film 70 and each of the optical layers 110, 120 and 130 along a first direction X. The color filter 150 may be located between the black matrices 90 in a second direction Y or a third direction Z.

[0166] Color filter 150 can remove noise from light emitted in the forward direction from optical layers 110, 120 and 130. For example, inorganic light-emitting device 50 can be a blue inorganic light-emitting device 50, and color filter 150 can remove light in the blue light that has not been converted by color conversion layers 110 and 120.

[0167] For example, color filter 150 may include a first color filter 151, a second color filter 152, and a third color filter 153. The first color filter 151 removes noise from light emitted from the first color conversion layer 110 in the forward direction. For example, light passing through the first color conversion layer 110 may be green light having a first wavelength, displaying green, and the first color filter 151 may remove light having other wavelengths (or different ranges) different from the first wavelength displaying green. The second color filter 152 removes noise from light emitted from the second color conversion layer 120 in the forward direction. For example, light passing through the second color conversion layer 120 may be red light having a second wavelength, displaying red, and the second color filter 152 may remove light having other wavelengths (or different ranges) different from the second wavelength displaying red. The third color filter 153 removes noise from light emitted from the scattering layer 130 in the forward direction. For example, the light emitted by the inorganic light-emitting device 50 can be blue light with a third wavelength that displays blue, and the third color filter 153 can remove light with other wavelengths (or different ranges) that are different from the third wavelength that displays blue.

[0168] The substrate 40 may include a light-absorbing layer 44c for absorbing external light and improving contrast. The light-absorbing layer 44c may be formed on the entire mounting surface 41 of the substrate 40. The light-absorbing layer 44c may be formed between the TFT layer 44 and the anisotropic conductive layer 47.

[0169] Each of the plurality of display modules 30A to 30P may include a surface film 70 disposed on a mounting surface 41 along a first direction X to cover the mounting surface 41 of the plurality of display modules 30A to 30P, the inorganic light-emitting device 50 and / or the color layer 100.

[0170] Multiple surface films 70 can be formed on multiple display modules 30A to 30P respectively along the first direction X.

[0171] After a surface film 70 is applied to each of the plurality of display modules 30A to 30P, the plurality of display modules 30A to 30P can be assembled together. In the example of the first display module 30A and the second display module 30E among the plurality of display modules 30A to 30P, a first surface film can be formed on the mounting surface 41 of the first display module 30A, and a second surface film can be formed on the mounting surface 41 of the second display module 30E.

[0172] The surface film 70 can cover the substrate 40 and protect the substrate 40 from external forces or external water.

[0173] The surface film 70 may include multiple layers (not shown), which may be functional films with optical properties.

[0174] The display device 1 may include an adhesive layer 200 for adhering the surface film 70 to the mounting surface 41 of the substrate 40.

[0175] Additionally, each of the plurality of display modules 30A to 30P may include a rear adhesive tape 61 disposed between the rear surface 43 of the substrate 40 and the metal plate 60 to adhere the rear surface 43 to the metal plate 60.

[0176] The back adhesive tape 61 can be a double-sided adhesive tape, but is not limited to this. However, the back adhesive tape 61 can be an adhesive layer, rather than an adhesive tape. For example, the back adhesive tape 61 is not limited to an adhesive tape as an example of a medium for adhering the back surface 43 of the substrate 40 to the metal plate 60, and can be one of a variety of media.

[0177] Multiple inorganic light-emitting devices 50 can be electrically connected to pixel drive wiring (not shown) formed on mounting surface 41 and an upper wiring layer (not shown) extending through side surface 45 of substrate 40 and formed as pixel drive wiring (not shown).

[0178] An upper wiring layer (not shown) may be formed below the anisotropic conductive layer 47. The upper wiring layer (not shown) may be electrically connected to side wiring 46 formed on the side surface 45 of the substrate 40. Side wiring 46 may be in the form of a thin film (see [link to documentation]). Figure 4 ).

[0179] Figure 6 This is an enlarged cross-sectional view showing some components of a display module in a display device according to an embodiment of the present disclosure. Figure 6 It is shown schematically. Figure 5 Enlarged views of some of the components are shown.

[0180] refer to Figure 6In the display device 1 according to the embodiment, each of the display modules 30A to 30P may include an inorganic light-emitting device 50 and a color layer 100. Light emitted from the inorganic light-emitting device 50 may travel toward the color layer 100.

[0181] Color layer 100 may include a scattering layer 130. Resin 131 and scattering particles 132 may be disposed inside the scattering layer 130. Resin 131 may be mixed with scattering particles 132 inside the scattering layer 130. Scattering particles 132 may scatter light emitted from inorganic light-emitting device 50 in a forward direction. For example, light emitted from third inorganic light-emitting device 50 may collide with scattering particles 132 to form a large emission angle in the forward direction.

[0182] For example, light emitted from the inorganic light-emitting device 50 may be absorbed in and / or reflected from the position guide 140, or for another reason, the light emission pattern may be attenuated, resulting in a reduced viewing angle. However, light passing through the first color conversion layer 110 and the second color conversion layer 120 may be absorbed in the quantum dots 112 and 122 and then emitted in all directions. Therefore, light passing through the first color conversion layer 110 and the second color conversion layer 120 can exhibit a Lambertian emission pattern to have a wide viewing angle. For example, the viewing angle of light emitted from the first inorganic light-emitting device 51 and the second inorganic light-emitting device 52 can be increased.

[0183] Furthermore, light passing through the scattering layer 130 can collide with scattering particles 132 to improve the light emission pattern. For example, a portion of the light emitted from the third inorganic light-emitting device 53 can pass through the scattering layer 130, and another portion of the light can be absorbed in and / or reflected from the position guide 140. Similar to the quantum dots 112 and 122 that improve the light emission pattern, scattering particles 132 can scatter the incident light. For example, scattering particles 132 can collide with light entering the scattering layer 130 to give the light a wide viewing angle in the forward direction. For example, the viewing angle of light emitted from the third inorganic light-emitting device 53 can be increased. Therefore, the user can view the display device 1 with reduced color coordinate distortion based on the viewing angle relative to the display device 1.

[0184] The scattering particles 132 may include TiO2, ZnO, ZrO2, and Al2O3. For example, multiple scattering particles 132 may be provided, and the corresponding scattering particles 132 may be formed from TiO2, ZnO, ZrO2, and Al2O3. Alternatively, the multiple scattering particles 132 may include at least one of TiO2, ZnO, ZrO2, or Al2O3, and furthermore, N scattering particles 132 may be divided into N / 4 groups, each formed from TiO2, ZnO, ZrO2, or Al2O3. However, the composition of the scattering particles 132 is not limited to the examples described above.

[0185] In addition, each scattering particle 132 can have a size from 100 nm to 500 nm. However, the size of each scattering particle 132 is not limited to the example above.

[0186] Furthermore, the content of scattering particles 132 can be in the range of 2 wt% to 10 wt%. For example, scattering particles 132 can be mixed with resin, wherein (weight of scattering particles) / (weight of scattering particles + weight of resin) = 2 wt% to 10 wt%. However, the content of scattering particles 132 is not limited to the above example.

[0187] With the position guide 140 positioned above the surface film 70, a color layer 100 including a scattering layer 130 can be fabricated. For example, the scattering layer 130 can be formed by coating a solution of scattering particles obtained by mixing resin 131 with scattering particles 132 and then curing the scattering particle solution. The color layer 100 including the scattering layer 130 can then be rotated 180 degrees and adhered, coupled, and / or attached to the inorganic light-emitting device 50 and the anisotropic conductive layer 47 via the adhesive layer 200.

[0188] Figure 7 This is an enlarged cross-sectional view showing some components of a display module in a display device according to an embodiment of the present disclosure. Figure 7 It is shown schematically. Figure 5 Enlarged views of some of the components are shown.

[0189] refer to Figure 7 The first color conversion layer 110 and / or the second color conversion layer 120 in the display device 1 according to an embodiment are shown. Alternatively, at least one of the first color conversion layer 110 or the second color conversion layer 120 is shown.

[0190] The color filter 150 may include a transparent low-refractive-index layer 101 formed of a low-refractive-index material such as resins 111 and 121, and a quantum dot layer 102 formed of color conversion materials 112 and 122.

[0191] In a display device, according to embodiments of the present disclosure, the low-refractive-index layer 101 may be formed such that the low-refractive-index layer 101 is deeply imprinted (or has the maximum depth) at a point corresponding to the central portion of the color filter. For example, the refractive layer 101 may be imprinted in a prism shape. In embodiments, the depth of a given point of the quantum dot layer 102 may be inversely proportional to the distance of said point from the central portion of the color filter 150 in a direction perpendicular to the X direction. The formation of the low-refractive-index layer 101 will be described later.

[0192] Light emitted from the inorganic light-emitting device 50 in the forward direction can pass through the quantum dot layer 102 and exhibit the Lambertian emission mode of quantum dots 112 and 122. For example, light emitted from the first inorganic light-emitting device 51 and / or the second inorganic light-emitting device 52 can be absorbed in quantum dots 112 and 122 and then emitted in all directions.

[0193] According to an embodiment, a quantum dot layer 102 may be formed in the lower portion of color conversion layers 110 and 120 and / or color layer 100. The ratio of the thickness of the quantum dot layer 102 to the thickness of the color conversion layers 110 and 120 and / or color layer 100 may be in the range of 0.2 to 1. Since the quantum dot layer 102 is located in the lower portion of the color conversion layers 110 and 120, a portion of the light emitted from the quantum dot layer 102 may be absorbed in the position guide 140, and another portion of the light not absorbed in the position guide 140 may be emitted in the forward direction. Therefore, the emission angle of the light emitted from the color conversion layers 110 and 120 may be reduced.

[0194] The brightness of light emitted from red and green subpixels can be reduced less than that of light scattered from blue subpixels, resulting in brightness differences that produce color coordinate distortion that depends on the viewing angle.

[0195] According to the embodiment, since the emission angle of the light emitted from the color conversion layers 110 and 120 can be reduced, the brightness difference between sub-pixels can be reduced, and color coordinate distortion can be reduced.

[0196] After the surface film 70 is placed below the color layer 100, a resin solution composed of resins 111 and 121 can be coated onto it. Figure 7 The color conversion layers 110 and 120 are then coated with a quantum dot solution. After curing the resin solution, a quantum dot solution of resins 111 and 121 mixed with quantum dots 112 and 122 can be additionally coated. The quantum dot solution can be coated into the color conversion layers 110 and 120 to have a thickness smaller than the final thickness of the color conversion layers 110 and 120. Afterward, a process for immediately curing the quantum dot solution can be performed.

[0197] Then, the color layer 100, including the color conversion layers 110 and 120, can be rotated 180 degrees and adhered, coupled and / or attached to the inorganic light-emitting device 50 and the anisotropic conductive layer 47 by the adhesive layer 200.

[0198] Quantum dots 112 and 122 may be offset to one side within color conversion layers 110 and 120. For example, quantum dots 112 and 122 may be positioned adjacent to adhesive layer 200 and / or inorganic light-emitting device 50. For example, quantum dots 112 and 122 may be located at the rear of color conversion layers 110 and 120. The ratio d2 / d1 of the thickness d2 of quantum dot layer 102, on which quantum dots 112 and 122 are disposed, to the thickness d1 of color conversion layers 110 and 120 may be in the range of 0.2 to 1.

[0199] In the color conversion layers 110 and 120, different types of structures can be formed, such as a quantum dot layer 102 in which resins 111 and 121 are mixed with quantum dots 112 and 122, and a resin layer in which only resins 111 and 121 are disposed. The quantum dot layer 102 can be located at the lower part of the color conversion layers 110 and 120.

[0200] As described above, a portion of the light emitted from the quantum dot layer 102 located below the color conversion layers 110 and 120 can be absorbed in the position guide 140, and another portion of the light not absorbed in the position guide 140 can be emitted in the forward direction. Therefore, the emission angle of the light emitted from the color conversion layers 110 and 120 can be reduced. The display device 1 according to the embodiment can reduce the difference between the emission angle of light emitted from red and / or green sub-pixels and the emission angle of light emitted from blue sub-pixels, thereby reducing color coordinate distortion dependent on the viewing angle.

[0201] Meanwhile, by configuring red / green color filter layers with different types of structures, including a transparent resin layer (upper part) and a quantum dot layer (lower part), the travel path of the converted light emitted from the lower quantum dot layer can be restricted. In this way, by changing the structure of the color filter, the emission angle of the red / green light emitted from the display device 1 can be reduced.

[0202] Figure 8 This is a flowchart illustrating the process of manufacturing a display module in a display device according to an embodiment of the present disclosure. Figure 9 This is a flowchart illustrating the process of manufacturing the color layer of a display module in a display device according to an embodiment of the present disclosure. Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 , Figure 15 , Figure 16 , Figure 17 , Figure 18 and Figure 19 This is a schematic diagram illustrating the process of manufacturing a display module in a display device according to an embodiment of the present disclosure.

[0203] For ease of description, the following description will be made based on the following: the layer provided with resins 111 and 121 is a low refractive index layer 101, and quantum dots 112 and 122 are color conversion materials 112 and 122. Additionally, as will be described later, the low refractive index layer 101 may be formed of a material having a low refractive index (e.g., resins 111 and 121).

[0204] refer to Figure 8 and Figure 10 The method of manufacturing a display module 30 in a display device according to an embodiment may include preparing a substrate 300 (801). The substrate 300 may include a first surface 300a and a second surface 300b opposite to the first surface 300a. For example, the substrate 300 may be configured such that the first surface 300a faces upward and the second surface 300b is supported by a flat floor, etc. For example, the substrate 300 may be a glass substrate.

[0205] refer to Figure 8 and Figure 11 The method for manufacturing the display module 30 in the display device according to the embodiment may further include forming a surface film (803) on a substrate 300. The surface film 70 may be formed on a first surface 300a of the substrate 300. For example, the surface film 70 may be directly applied (laminated) onto the first surface 300a of the substrate 300. In this case, the thickness of the surface film 70 may be 100 micrometers (μm) or less.

[0206] refer to Figure 8 , Figure 9 and Figure 12 The method of manufacturing the display module 30 in the display device according to the embodiment may further include forming a color layer 100 (805) on the surface film 70. The color layer 100 may be formed on a first surface (not shown) of the surface film 70. For example, the color layer 100 may be applied directly to the first surface (not shown) of the surface film 70.

[0207] In the display device according to the embodiment, forming a color layer 100 may include providing a black matrix 90 (901) on a surface film 70. The color layer 100 may include the black matrix 90. The black matrix 90 may be formed on a first surface (not shown) of the surface film 70. For example, the black matrix 90 may be formed directly on the first surface (not shown) of the surface film 70.

[0208] The black matrix 90 may include a first surface 90a and a second surface 90b opposite to the first surface 90a. For example, the first surface 90a faces upward and the second surface 90b faces downward to allow the black matrix 90 to contact the first surface (not shown) of the surface film 70.

[0209] refer to Figure 8 , Figure 9 and Figure 13 In the display device according to the embodiment, forming the color layer 100 may further include forming color filters 150 (903) between the black matrices 90. The color filters 150 may be formed between the spaced-apart black matrices 90. The color filters 150 may be formed on a first surface (not shown) of the surface film 70. For example, the color filters 150 may be formed directly on the first surface (not shown) of the surface film 70.

[0210] The color filter 150 may include a first surface 150a and a second surface 150b opposite to the first surface 150a. For example, the first surface 150a faces upward and the second surface 150b faces downward to contact the first surface (not shown) of the surface film 70.

[0211] refer to Figure 8 , Figure 9 and Figure 14 In the display device according to the embodiment, forming the color layer 100 may further include disposing a low refractive index layer 101 (905) on the black matrix 90 and the color filter 150. The low refractive index layer 101 may be formed on the first surface 90a of the black matrix 90 and the first surface 150a of the color filter 150. For example, the low refractive index layer 101 may be directly applied to the first surface 90a of the black matrix 90 and the first surface 150a of the color filter 150.

[0212] The low refractive index layer 101 may be formed of a material having a low refractive index of about 1.2 to 1.4 (e.g., a resin or a resin containing hollow silica). However, the low refractive index layer 101 may also include other materials having a low refractive index.

[0213] refer to Figure 8 , Figure 9 and Figure 15 In the display device according to the embodiment, forming the color layer 100 may include imprinting (907) the low refractive index layer 101.

[0214] The low refractive index layer 101 can be embossed using a frame with an embossed pattern. In this case, among the low refractive index layers 101 on the black matrix 90 and the color filter 150, the low refractive index layer 101 at the center of the color filter 150 can be embossed the deepest. For example, the low refractive index layer 101 at the center of the color filter 150 can be embossed into a prism shape.

[0215] refer to Figure 8 , Figure 9 and Figure 16In the display device according to the embodiment, forming the color layer 100 may include: after imprinting the low refractive layer 101, removing the low refractive layer 101 on the black matrix 90 to allow the low refractive layer 101 to be located on the color filter 150 (907).

[0216] The low-refractive-index layer 101 on the black matrix 90 can be removed by performing a photolithography process.

[0217] refer to Figure 8 , Figure 9 and Figure 17 In the display device according to the embodiment, forming the color layer 100 may further include providing a position guide 140 on the black matrix 90 to guide the position (909) of the color filter 150.

[0218] The position guide 140 can be set on the black matrix 90 as follows: the position guide 140 is set on the black matrix 90 and the low refractive index layer 101, and then the position guide 140 on the low refractive index layer 101 is removed by photolithography. Therefore, the color filter 150 can be located between the position guides 140.

[0219] refer to Figure 8 , Figure 9 and Figure 18 In the display device according to the embodiment, forming the color layer 100 may include providing color conversion materials 112 and 122 (911) on the imprinted low refractive index layer 101.

[0220] Color conversion materials 112 and 122 are provided on the low refractive index layer 101 deeply imprinted at the center. The color conversion materials 112 and 122 can be configured in a prism shape.

[0221] refer to Figure 8 , Figure 9 and Figure 19 The method of manufacturing a display module 30 in a display device according to an embodiment may include attaching a light source substrate 40 on which an inorganic light-emitting device 50 is disposed to a color layer 100 to allow the inorganic light-emitting device 50 to face the color layer 100 (807).

[0222] The light source substrate 40 can be adhered to the color layer 100 such that the light-emitting surface 54 of each of the plurality of inorganic light-emitting devices 50 faces each other with the first surface 100a of the optical layers 110, 120 and 130. In this case, the light-emitting surface 54 of the inorganic light-emitting device 50 can face downwards.

[0223] Due to the low-refractive-index layer 101 imprinted into a predetermined shape and the color-conversion materials 112 and 122 disposed on the imprinted low-refractive-index layer 101, through Figure 8 and Figure 9 Display devices manufactured using advanced technology can have improved optical efficiency in terms of the light emitted from the light-emitting device 50.

[0224] Figure 20 and Figure 21 This is a graph used to illustrate the optical efficiency of a display device according to an embodiment of the present disclosure.

[0225] and Figure 20 Compared to the case shown in (a) where color conversion materials 112 and 122 are provided without imprinting the low refractive index layer 101, it can be seen that the case where the low refractive index layer 101 is imprinted into a prism shape or the like, and then color conversion materials 112 and 122 are provided on the low refractive index layer 101 (e.g.) Figure 20 As shown in (b), the proportion of light that propagates forward without being completely reflected is higher.

[0226] like Figure 21 (a) and Figure 21 As shown in (b), in the layers provided with conversion materials 112 and 122, the proportion of light absorbed by the position guide 140 at positions C and D (dashed lines) can be increased. However, as Figure 21 (c) and Figure 21 As shown in (d), when the low refractive index layer 101 is configured in a prism shape or the like, light refracted by the refractive index of the low refractive index layer 101 can propagate forward (solid line) without being absorbed by the position guide 140, thereby improving optical efficiency.

[0227] According to embodiments of this disclosure, a method for manufacturing a display module in a display device, comprising a plurality of display modules arranged horizontally in a matrix type, may include: depositing a surface film on a substrate; forming a color layer on the surface film; and adhering a light source substrate on which inorganic light-emitting devices are disposed to the color layer, such that the inorganic light-emitting devices face the color layer. The formation of the color layer may include: depositing a black matrix on the surface film; depositing a color filter on the black matrix; depositing a low-refractive-index layer on the color filter and the black matrix; imprinting the low-refractive-index layer; and depositing a color conversion material on the imprinted low-refractive-index layer.

[0228] According to this disclosure, optical efficiency can be improved by allowing the color conversion material to be set into a predetermined shape by imprinting a low refractive index layer.

[0229] Imprinting a low-refractive-index layer can include imprinting the low-refractive-index layer at its deepest point at the center of the color filter.

[0230] Imprinting a low-refractive-index layer can include: imprinting the low-refractive-index layer at the center of the color filter into a prism shape.

[0231] Forming a color layer may include: removing the low-refractive-index layer on the black matrix after imprinting the low-refractive-index layer and before setting the color conversion material, so as to set the low-refractive-index layer on the color filter.

[0232] Forming a color layer may also include: after setting a low refractive index layer and before setting a color conversion material on the low refractive index layer, setting a positioning guide on the black matrix to guide the position of the color filter.

[0233] Color filters can be located between position guides.

[0234] The low refractive index layer can be formed from resin or resin containing hollow silica.

[0235] The thickness of the surface film can be equal to or less than 100 μm.

[0236] According to embodiments of this disclosure, a display module in a display device comprising a plurality of display modules arranged horizontally in a matrix type may include: a substrate; an inorganic light-emitting device disposed on the substrate; a color layer through which light emitted from the inorganic light-emitting device passes, and the color layer including a first surface facing the inorganic light-emitting device and a second surface facing the opposite side of the first surface; and a surface film disposed on the color layer and including a surface in contact with the second surface of the color layer, wherein the color layer may include: a black matrix; color filters disposed between the black matrices; a low refractive index layer disposed on the color filters; and a color conversion material disposed on the low refractive index layer, wherein the low refractive index layer may be imprinted.

[0237] The low-refractive-index layer at the center of the color filter can be imprinted most deeply.

[0238] The low-refractive-index layer at the center of the color filter can be imprinted into a prism shape.

[0239] The color layer may also include a position guide set on the black matrix to guide the position of the color filter.

[0240] The low refractive index layer can be formed from resin or resin containing hollow silica.

[0241] The thickness of the surface film can be equal to or less than 100 μm.

[0242] According to aspects of this disclosure, a display device and a method of manufacturing the display device can improve optical efficiency by allowing a color conversion material to be set into a predetermined shape by imprinting a low refractive index layer.

[0243] The effects achievable by this disclosure are not limited to those described above, and those skilled in the art to which this disclosure pertains will clearly understand other effects not mentioned above based on the above description.

[0244] Although embodiments of the present disclosure have been described with reference to the accompanying drawings, those skilled in the art will understand that other specific modifications can be readily made without departing from the technical spirit or essential characteristics of the present disclosure. Therefore, the foregoing embodiments should be considered illustrative rather than restrictive in all respects.

Claims

1. A method for manufacturing a display module, the method comprising: A color layer is formed on the substrate; as well as The light source substrate is adhered to the color layer. The inorganic light-emitting device is located on the light source substrate, and the inorganic light-emitting device faces the color layer. The formation of the color layer includes: A color filter is disposed on the substrate; A low refractive index layer is disposed on the color filter; Imprinting of the low-refractive-index layer; and Color conversion material is applied to an imprinted low-refractive-index layer.

2. The method according to claim 1, wherein, Imprinting the low-refractive-index layer includes: imprinting the low-refractive-index layer at the deepest point corresponding to the center of the color filter.

3. The method according to claim 2, wherein, The formation of the color layer further includes: after imprinting the low refractive index layer and before setting the color conversion material, removing the portion of the imprinted low refractive index layer corresponding to the position of the black matrix, such that the remaining portion of the imprinted low refractive index layer is located on the color filter.

4. The method according to claim 3, wherein, Forming the color layer further includes: after setting the low refractive index layer and before setting the color conversion material on the low refractive index layer, setting a position guide on the black matrix to guide the position of the color conversion material.

5. The method according to claim 4, wherein, The color filters are located between the black matrices.

6. The method according to claim 1, wherein, The low refractive index layer is formed of resin or resin containing hollow silica.

7. The method according to claim 1, further comprising: Before forming the color layer, a surface film is disposed on the substrate such that the surface film is between the color layer and the substrate, wherein the thickness of the surface film is equal to or less than 100 μm.

8. A display module, comprising: Substrate; Inorganic light-emitting device, on the substrate; as well as A color layer through which light emitted from the inorganic light-emitting device passes, the color layer comprising a first surface facing the inorganic light-emitting device and a second surface opposite to the first surface. The color layer further includes: Color filters; A low refractive index layer is placed on the color filter; and Color conversion material, on the low refractive index layer, and The low-refractive-index layer is embossed.

9. The display module according to claim 8, wherein, The low-refractive-index layer is deeply imprinted at a position corresponding to the center of the color filter.

10. The display module according to claim 9, wherein, The color layer also includes a position guide located on the black matrix to guide the position of the color conversion material.

11. The display module according to claim 8, wherein, The low refractive index layer is formed of resin or resin containing hollow silica.

12. The display module according to claim 8, further comprising a surface film on the second surface of the color layer, in, The thickness of the surface film is equal to or less than 100 μm.

13. The display module according to claim 8, in, The color conversion material includes a quantum dot layer, and The depth of the quantum dot layer decreases as the distance from the center of the color filter increases.

14. The display module according to claim 9, wherein, The low-refractive-index layer is embossed into a prism shape.

15. A display module, comprising: Substrate; Inorganic light-emitting device, on the substrate; as well as A color layer through which light emitted from the inorganic light-emitting device passes, the color layer comprising a first surface facing the inorganic light-emitting device and a second surface opposite to the first surface. The color layer further includes: Color filters; A black matrix, at least partially surrounding the color filter; A low refractive index layer is placed on the color filter; and Color conversion material, at least partially on the low refractive index layer, The low-refractive-index layer is deeply imprinted at a point corresponding to the center of the color filter. The color conversion material is in contact with the color filter and the low refractive index layer, and The depth of the color conversion material decreases as the distance from the center of the color filter increases.

Images