Co-extrusion molding production method for transparent electronic carrier tape of PC modified material
By using co-extrusion molding technology to prepare a transparent electronic carrier tape with a double-layer structure, the problems of unstable antistatic properties and oxidation corrosion were solved, achieving stable antistatic performance and transparency, thus meeting the needs of high-end electronic packaging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-01
- Publication Date
- 2026-04-14
AI Technical Summary
Existing electronic carrier tapes have unstable antistatic properties and cannot effectively prevent oxygen and moisture corrosion, leading to oxidation and corrosion of electronic components, as well as insufficient transparency and visibility.
A transparent electronic carrier tape with a double-layer structure is prepared by co-extrusion molding technology. The antistatic layer is formed by permanent antistatic agent and catalytic polymerization, and the adsorption layer is prepared by oxygen and moisture adsorbent, so as to achieve antistatic and anti-oxidation and corrosion functions.
It achieves stable antistatic properties, wear resistance and transparency, effectively preventing oxidation and corrosion of electronic components during storage and transportation, reducing the requirements for warehousing environment, and the material is environmentally friendly and pollution-free.
Smart Images
Figure CN121848638A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of polymer materials technology, specifically to a method for co-extruding and producing transparent electronic carrier tapes from modified PC materials. Background Technology
[0002] In the era of intelligent technology, semiconductor electronic components, chips, and precision electronic appliances place extremely high demands on electrostatic discharge (ESD) protection and packaging preservation conditions. Electronic carrier tapes, as key packaging materials carrying these precision components, are of paramount importance in terms of performance. Currently, electronic carrier tapes on the market are mainly divided into two categories: one is black antistatic carrier tape, which achieves antistatic properties by adding carbon black. However, its disadvantage is its opacity, making it impossible to visually inspect the packaged components, potentially leading to omissions or defective products, and the carbon black poses a risk of powder contamination. The other category is transparent antistatic carrier tape, which is achieved in two main ways: one is the "coating type," where an antistatic liquid is coated onto the surface of the molded transparent carrier tape. The antistatic layer obtained by this method is not resistant to friction and is prone to failure; the other is the "extraction type," which involves adding a hydrophilic antistatic agent to the material, relying on its expulsion to absorb moisture from the air to conduct electricity. This method has extremely unstable antistatic effects, is greatly affected by environmental humidity, and is prone to failure in dry environments. Furthermore, existing electronic carrier tapes are functionally limited, focusing solely on antistatic properties while neglecting the risk of oxidation and corrosion of electronic components caused by oxygen and moisture ingress during storage and transportation due to damaged packaging or inadequate sealing. This undoubtedly increases the stringent requirements for storage environments (such as constant humidity and oxygen), thereby raising costs. Therefore, there is an urgent need in the field for a multifunctional transparent electronic carrier tape and its manufacturing method that can simultaneously provide stable and permanent antistatic protection and actively defend against environmental oxygen and moisture corrosion. Summary of the Invention
[0003] The purpose of this invention is to provide a method for co-extruding transparent electronic carrier tapes made of modified PC. This invention's method for co-extruding transparent electronic carrier tapes made of modified PC produces a double-layer transparent electronic carrier tape with an antistatic layer and an adsorption layer. The antistatic layer on one side of the carrier tape possesses permanent antistatic properties, with a surface resistivity stable at 10^8-10^10 Ω. It is independent of environmental humidity, wear-resistant, and does not leach, providing reliable electrostatic protection for electronic components. The adsorption layer on the other side actively adsorbs oxygen and moisture, effectively preventing oxidation and corrosion of components due to packaging damage during storage, significantly reducing the requirements for the storage environment. The carrier tape has high overall light transmittance (≥75%), enabling visual inspection of packaged components. The entire product is environmentally friendly and pollution-free, with stable and non-degradable materials during production, exhibiting superior overall performance.
[0004] To achieve the above effects, the present invention provides the following technical solution: a method for co-extruding and producing transparent electronic carrier tapes from modified PC materials, comprising the following steps:
[0005] Step 1: Preparation of antistatic PC modified material: By weight, add 100 parts transparent PC resin, 0.5-5 parts permanent antistatic agent, 0.01-0.5 parts catalyst and 0.1-1 parts inhibitor to a reactor, and carry out catalytic polymerization reaction for 1-5 hours at a temperature of 200-300℃ and a pressure of 0.1-1MPa. After the reaction is completed, the material is purified to obtain antistatic PC modified material.
[0006] Step 2: Preparation of adsorbent PC modified material: By weight, 100 parts of transparent PC resin, 1-10 parts of oxygen adsorbent and 1-10 parts of moisture adsorbent are added to a twin-screw extruder and melt-blended at a temperature of 180-250℃ to obtain adsorbent PC modified material.
[0007] Step 3, Co-extrusion molding: The antistatic PC modified material and the adsorption PC modified material are respectively added to the two extruders of the co-extrusion molding machine, and co-extruded through the co-extrusion die at a temperature of 200-280℃ to form a transparent electronic carrier tape, wherein one side of the transparent electronic carrier tape is an antistatic layer and the other side is an adsorption layer.
[0008] Furthermore, the permanent antistatic agent is a polymeric permanent antistatic agent selected from at least one of polyether amide, polyether ester amide, and ionic liquid.
[0009] Furthermore, the catalyst is an organometallic catalyst, selected from at least one of organotin compounds and titanates.
[0010] Furthermore, the inhibitor is a heat stabilizer selected from at least one of phosphites and hindered phenols.
[0011] Furthermore, the oxygen adsorbent is a transparent oxygen adsorbent selected from at least one of iron-based nanocomposites and cobalt-based complexes.
[0012] Furthermore, the moisture adsorbent is a transparent desiccant selected from at least one of nano silica gel, molecular sieve, and montmorillonite.
[0013] Furthermore, in step one, the purification process includes filtration, washing, and drying steps.
[0014] Furthermore, in step three, the co-extrusion molding speed is 5-20 meters per minute, and the thickness of the formed transparent electronic carrier tape is 0.1-0.5 mm.
[0015] Furthermore, the surface resistance of the antistatic layer of the transparent electron carrier is 10^8-10^10 Ω, and the light transmittance is ≥75%.
[0016] Furthermore, the transparent electronic carrier tape is used to encapsulate electronic components, and the adsorption layer can adsorb oxygen and moisture to prevent the electronic components from corroding.
[0017] This invention provides a method for co-extruding and producing transparent electronic carrier tapes from modified PC materials, which has the following advantages:
[0018] (1) This invention successfully manufactures a transparent electronic carrier tape with a dual-layer functional structure through co-extrusion molding technology. One of the antistatic layers is based on a permanent antistatic PC material modified by catalytic polymerization, which achieves a stable, efficient and environmentally independent antistatic function. Its surface resistance is stable at 10^8-10^10Ω, never precipitates, and is resistant to friction, ensuring that electronic components are protected from electrostatic damage during handling and transportation. At the same time, the high transparency makes the components visible, which is convenient for detection and identification.
[0019] (2) The other side of the transparent electronic carrier tape of the present invention has the ability to actively adsorb oxygen and moisture. This functional layer can continuously absorb oxygen and water vapor that enters due to slight damage or slow leakage of the packaging during the storage of electronic components, fundamentally reducing the risk of oxidation and electrochemical corrosion of internal components, thereby greatly reducing the requirements for dryness and sealing of the storage environment, expanding the applicable scenarios and saving storage costs.
[0020] (3) Through precise raw material formulation and process control, the present invention ensures that the final product has dual protection functions while maintaining excellent optical performance, with a light transmittance of over 75%, perfectly realizing "visual" packaging and taking into account both functionality and ease of operation.
[0021] (4) The carrier material prepared by the present invention does not contain carbon black and will not produce black powder pollution. At the same time, the functional additives used meet the environmental protection RoHS requirements. The material has good stability throughout the production process, does not degrade, and has no carbon buildup at the die opening. It realizes green, efficient, and stable continuous production. The product meets the dual standards of environmental protection and high reliability of the modern electronics industry. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the process for co-extruding a transparent electronic carrier tape using PC modified material according to the present invention. Detailed Implementation
[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to specific embodiments.
[0024] This invention provides a technical solution; please refer to [link / reference]. Figure 1 :
[0025] Example 1:
[0026] This embodiment is implemented as follows, based on the method described above:
[0027] Step 1: Preparation of antistatic PC modified material
[0028] By weight, 100 parts of transparent PC resin (brand name: LEXAN141R), 2 parts of permanent antistatic agent (polyether amide, brand name: PebaxMH1657), 0.1 parts of catalyst (organotin compound, brand name: Fascat4100) and 0.3 parts of inhibitor (phosphite, brand name: Irgafos168) were added to the reactor.
[0029] The catalytic polymerization reaction was carried out at a temperature of 250℃ and a pressure of 0.5MPa for 3 hours.
[0030] After the reaction is completed, purification treatment is carried out: first, the impurities are removed by filtration, then the material is washed with deionized water, and finally vacuum dried at 80°C for 4 hours to obtain antistatic PC modified material.
[0031] Step 2: Preparation of adsorbent PC modified material
[0032] By weight, 100 parts of transparent PC resin (as above), 5 parts of oxygen adsorbent (iron-based nanocomposite material, brand: OxyGuard) and 5 parts of moisture adsorbent (nano silica gel, brand: Syloid244) were added to a twin-screw extruder (model: TS-35).
[0033] The adsorbed PC modified material was obtained by melt blending at a temperature of 220℃, a screw speed of 200 rpm, and a residence time of 2 minutes.
[0034] Step 3: Co-extrusion molding
[0035] The above-mentioned antistatic PC modified material and adsorption PC modified material were respectively added to the two extruders of the co-extrusion molding machine (model: JC-500).
[0036] Co-extrusion molding was performed using a co-extrusion die at a temperature of 240℃ and a co-extrusion speed of 10 meters per minute to form a transparent electronic carrier tape with a thickness of 0.3 mm. The antistatic layer and the adsorption layer each accounted for half of the thickness (0.15 mm each).
[0037] Comparative Examples: Prior Art
[0038] Existing technologies employ traditional single-layer PC electronic carrier tape production methods, which lack antistatic and adsorption functions. The specific implementation is as follows:
[0039] Transparent PC resin (brand name: LEXAN141R) was directly added to a single-screw extruder (model: SJ-45).
[0040] A transparent electronic carrier tape with a thickness of 0.3 mm was obtained by melt extrusion at a temperature of 220℃ and a molding speed of 10 m / min.
[0041] Performance testing methods
[0042] To compare the performance of the present invention with that of the prior art, the following tests were conducted:
[0043] Surface resistance: The surface resistance of the carrier tape was measured using a surface resistance tester (model: EST121) according to standard ASTM D257, and the average value of 5 points was taken.
[0044] Transmittance: The transmittance of the carrier tape was measured using a transmittance tester (model: Haze-GardPlus) according to standard ASTM D1003, and the average value of 3 samples was taken.
[0045] Oxygen adsorption rate: The carrier sample (size 10cm×10cm) was placed in a sealed container with an initial oxygen concentration of 21% and placed at 25℃ for 24 hours. The change in oxygen concentration was measured using an oxygen sensor (model: O2S-FR-T2) and the oxygen adsorption amount per unit weight of carrier was calculated (mL / g·day).
[0046] Moisture adsorption rate: The carrier sample (weighing about 1g) was placed in a constant temperature and humidity chamber (model: HWT-80) at 25℃ and 90%RH. After 24 hours, the weight change was measured, and the amount of moisture adsorbed per unit weight of carrier (mg / g·day) was calculated.
[0047] Rust prevention test: The same electronic components (IC chip, model: ATmega328) were packaged in a carrier tape and placed in a constant temperature and humidity chamber (conditions: 85℃, 85%RH) for 1000 hours. After that, the rust on the surface of the components was checked. The rust level was divided into: no rust, slight rust (rust spot area <5%), and severe rust (rust spot area ≥5%).
[0048] Test data table:
[0049] Table 1 below shows the test results of Embodiment 1 of the present invention and the comparative embodiment (prior art):
[0050] Table 1:
[0051] Test Project Comparative Examples (Prior Art) Embodiment 1 of the present invention Surface resistivity (Ω) >10^13 (insulation) 5×10^9 Light transmittance (%) 85 80 Oxygen adsorption rate (mL / g·day) 0 0.5 Moisture adsorption rate (mg / g·day) 0 0.3 Rust resistance test (85℃ / 85%RH, 1000 hours) Severe corrosion No rust
[0052] Data comparison and analysis:
[0053] The test data shows that Embodiment 1 of the present invention is significantly superior to the comparative embodiment in several key performance indicators, as detailed below:
[0054] Antistatic properties: The surface resistivity of the carrier tape of this invention is 5 × 10^9 Ω, which is within the design range of this invention (10^8-10^10 Ω), exhibiting good antistatic ability and effectively preventing damage to electronic components from static electricity accumulation. In contrast, the surface resistivity of the comparative embodiment is >10^13 Ω, classifying it as an insulating material that is prone to static electricity generation, leading to breakdown or failure of electronic components.
[0055] Transparency: The light transmittance of the carrier tape of this invention is 80%, which is slightly lower than the 85% of the comparative embodiment, but still meets the requirement of ≥75% light transmittance of claim 9, and does not affect the transparency and visibility of the electronic carrier tape. The slight decrease in light transmittance is due to the addition of antistatic agents and adsorbents, but practical transparency is maintained through optimized formulation and process.
[0056] Adsorption performance: The carrier tape of this invention exhibits significant oxygen adsorption rates (0.5 mL / g·day) and moisture adsorption rates (0.3 mg / g·day), while the comparative embodiment shows no adsorption function. This is attributed to the oxygen and moisture adsorbents in the adsorption layer, which effectively remove oxygen and moisture from the encapsulation environment, preventing oxidation and corrosion of electronic components.
[0057] Rust resistance: In a stringent damp heat test (85°C / 85%RH, 1000 hours), the electronic components packaged with the carrier tape of this invention showed no rust, while the comparative examples exhibited severe rust. This demonstrates the protective effect of the adsorption layer of this invention, extending the service life of the electronic components.
[0058] In summary, this invention achieves multifunctional integration by combining an antistatic layer and an adsorption layer within a transparent electronic carrier tape through co-extrusion molding. Existing technologies typically employ single materials or post-processing methods (such as coating with an antistatic coating), but cannot simultaneously achieve both antistatic and adsorption functions, and may affect transparency. This invention optimizes the performance of the modified material through a catalytic polymerization reaction in step one and melt blending in step two, ensuring the feasibility of co-extrusion molding. The transparent electronic carrier tape provided by this invention possesses both antistatic and anti-corrosion functions, improving the reliability and security of electronic packaging. Test data clearly demonstrates its advantages in surface resistivity, adsorption capacity, and anti-corrosion, meeting the needs of high-end electronic packaging and possessing significant industrial application value.
[0059] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A method for co-extruding and producing transparent electronic carrier tape from modified PC material, characterized in that, Includes the following steps: Step 1: Preparation of antistatic PC modified material: By weight, add 100 parts transparent PC resin, 0.5-5 parts permanent antistatic agent, 0.01-0.5 parts catalyst and 0.1-1 parts inhibitor to a reactor, and carry out catalytic polymerization reaction for 1-5 hours at a temperature of 200-300℃ and a pressure of 0.1-1MPa. After the reaction is completed, the material is purified to obtain antistatic PC modified material. Step 2: Preparation of adsorbent PC modified material: By weight, 100 parts of transparent PC resin, 1-10 parts of oxygen adsorbent and 1-10 parts of moisture adsorbent are added to a twin-screw extruder and melt-blended at a temperature of 180-250℃ to obtain adsorbent PC modified material. Step 3, Co-extrusion molding: The antistatic PC modified material and the adsorption PC modified material are respectively added to the two extruders of the co-extrusion molding machine, and co-extruded through the co-extrusion die at a temperature of 200-280℃ to form a transparent electronic carrier tape, wherein one side of the transparent electronic carrier tape is an antistatic layer and the other side is an adsorption layer.
2. The method for co-extruding and producing transparent electronic carrier tape from PC modified material according to claim 1, characterized in that, The permanent antistatic agent is a polymeric permanent antistatic agent selected from at least one of polyether amide, polyether ester amide, and ionic liquid.
3. The method for co-extruding and producing transparent electronic carrier tape from PC modified material according to claim 1, characterized in that, The catalyst is an organometallic catalyst, selected from at least one of organotin compounds and titanates.
4. The method for co-extruding and producing transparent electronic carrier tape from PC modified material according to claim 1, characterized in that, The inhibitor is a heat stabilizer selected from at least one of phosphites and hindered phenols.
5. The method for co-extruding and producing transparent electronic carrier tape of PC modified material according to claim 1, characterized in that, The oxygen adsorbent is a transparent oxygen adsorbent, selected from at least one of iron-based nanocomposites and cobalt-based complexes.
6. The method for co-extruding and producing transparent electronic carrier tape from PC modified material according to claim 1, characterized in that, The moisture adsorbent is a transparent desiccant, selected from at least one of nano silica gel, molecular sieve, and montmorillonite.
7. The method for co-extruding and producing a transparent electronic carrier tape from PC modified material according to claim 1, characterized in that, In step one, the purification process includes filtration, washing, and drying steps.
8. The method for co-extruding and producing a transparent electronic carrier tape from PC modified material according to claim 1, characterized in that, In step three, the co-extrusion speed is 5-20 meters per minute, and the thickness of the resulting transparent electronic carrier tape is 0.1-0.5 mm.
9. The method for co-extruding and producing a transparent electronic carrier tape from PC modified material according to claim 1, characterized in that, The surface resistance of the antistatic layer of the transparent electron carrier is 10^8-10^10 Ω, and the light transmittance is ≥75%.
10. The method for co-extruding and producing a transparent electronic carrier tape from PC modified material according to claim 1, characterized in that, The transparent electronic carrier tape is used to encapsulate electronic components, and the adsorption layer can adsorb oxygen and moisture to prevent the electronic components from corroding.