High-voltage isolation communication device and high-voltage power supply equipment

Abstract

The invention discloses a high-voltage isolation communication device and high-voltage power supply equipment, and relates to the technical field of wireless communication of power supply equipment. The high-voltage isolation communication device comprises a wireless communication module and an isolation module, the wireless communication module comprises two wireless signal transmission modules, and the two wireless signal transmission modules are oppositely arranged and used for sending and receiving wireless signals. The isolation module comprises two isolation pipes which are oppositely arranged, and the isolation pipes are made of electrical insulating materials and provided with closed ends and open ends; the two wireless signal transmission modules are arranged in the two isolation pipes in a one-to-one correspondence mode, and wireless signal transmission is carried out through the closed ends. Wherein the wall thicknesses of the two isolation pipes are configured to enable the withstand voltage value of the isolation module to be greater than a preset value. The high-voltage isolation communication device can realize the stability and reliability of communication signal transmission under high-voltage impact, and meets the isolation requirement under high-voltage level.

Description

Technical Field

[0001] This invention relates to the field of wireless communication technology for power supply equipment, and in particular to a high-voltage isolation communication device and a high-voltage power supply equipment. Background Technology

[0002] With the rapid development of artificial intelligence technology, the scale of AI data centers is expanding exponentially. To meet the massive computing power demands of training and inference for large language models (such as GPT-4), the scale of model parameters continues to increase, directly leading to an explosive growth in data center power consumption. Statistics show that the power demand of AI data centers is expected to double every 2 to 3 years, with the power consumption of a single AI data center cluster reaching tens to hundreds of megawatts, equivalent to the overall power consumption of a small city. For example, training GPT-4 consumes over 1 million kilowatt-hours of power in a single training session. Against this backdrop, power supply capacity has become a key constraint restricting the development of AI data centers.

[0003] To address these challenges, the industry has begun exploring new power supply technologies to improve energy efficiency, with high-voltage direct current (HVDC) transmission and solid-state transformers (SST) becoming important development directions. These technologies can increase power transmission efficiency from around 90% in traditional solutions to over 98%, significantly reducing transmission losses. However, with continuous breakthroughs in SST technology, its bus voltage has increased to a high voltage level of 34kV. Traditional optocouplers and digital isolators, due to their voltage withstand limits, can no longer meet the isolation requirements at high voltage levels. Summary of the Invention

[0004] The purpose of this invention is to provide a high-voltage isolation communication device and a high-voltage power supply equipment to achieve stability and reliability of communication signal transmission under high-voltage impact and meet the isolation requirements under high-voltage levels.

[0005] To achieve this objective, the present invention adopts the following technical solution: A high-voltage isolation communication device, comprising: A wireless communication module includes two wireless signal transmission modules, which are arranged opposite to each other and are used for transmitting and receiving wireless signals. An isolation module includes two opposing isolation tubes, each made of an electrically insulating material and having a closed end and an open end; two wireless signal transmission modules are respectively disposed inside the two isolation tubes and transmit wireless signals through the closed end. The wall thickness of the two isolation tubes is configured such that the pressure resistance of the isolation module is greater than a preset value.

[0006] As an optional feature of the high-voltage isolation communication device, the preset value is greater than or equal to 1kV.

[0007] As an optional embodiment of the high-voltage isolation communication device, the dielectric strength of the electrical insulation material is greater than 10kV / mm.

[0008] As an alternative to the high-voltage isolation communication device, the electrical insulation material is quartz glass or ceramic.

[0009] As an alternative to the high-voltage isolation communication device, the interior of the isolation tube is filled with encapsulating colloid, which is used to fix the wireless signal transmission module and fill the internal gaps.

[0010] As an optional feature of the high-voltage isolation communication device, the distance between the two isolation tubes is less than or equal to 1 cm.

[0011] As an optional solution for the high-voltage isolation communication device, the wireless signal transmission module includes an antenna, a circuit board, and pins. The antenna and the pins are respectively located at both ends of the circuit board. The antenna is located close to the closed end, and the pins extend from the open end to the outside of the isolation tube.

[0012] As an optional embodiment of the high-voltage isolation communication device, the axial length of the isolation tube is at least greater than half the length of the circuit board; Alternatively, the axial length of the isolation tube is greater than or equal to the length of the circuit board, so as to completely house the circuit board inside the isolation tube.

[0013] As an optional solution for the high-voltage isolation communication device, the antenna is a surface-emitting antenna, which is vertically mounted on the end face of the circuit board; Alternatively, the antenna is a side-emitting antenna, which is mounted on the surface of the circuit board.

[0014] As an optional solution for the high-voltage isolation communication device, an insulating bracket is also included, which has at least two mounting positions for fixing and supporting the two isolation pipes.

[0015] A high-voltage power supply device, comprising: High-voltage side circuit and low-voltage side circuit located at different potentials; As described in any of the above embodiments, in the high-voltage isolation communication device, two wireless signal transmission modules are arranged opposite to each other in the wireless communication module. One of the wireless signal transmission modules is electrically connected to the high-voltage side circuit, and the other wireless signal transmission module is electrically connected to the low-voltage side circuit. The high-voltage isolation communication device is used for signal communication between the high-voltage side circuit and the low-voltage side circuit.

[0016] The beneficial effects of this invention are: The high-voltage isolation communication device provided by this invention encloses two wireless signal transmission modules in two isolation tubes made of electrically insulating material. This physically isolates the modules from external high-voltage environments, dust, oil, moisture, etc. Signals are transmitted via coupling through the sealed ends. The sealed ends are chemically stable and not prone to aging. Furthermore, the entire transmission path has no mechanical contacts or vulnerable photoelectric conversion interfaces, resulting in higher long-term reliability. Utilizing the inherent high dielectric strength of the electrically insulating material, the withstand voltage of the isolation modules is superimposed by adjusting the wall thickness of the two isolation tubes. This can be flexibly adjusted by increasing the wall thickness or selecting high dielectric strength materials to meet the isolation requirements of high-voltage scenarios above 1kV. This overcomes the bottleneck of the withstand voltage limits of traditional optocoupler isolators and digital isolators, achieving reliable electrical isolation at high voltage levels.

[0017] The high-voltage power supply equipment provided by this invention uses the aforementioned high-voltage isolation communication device to realize signal communication between the high-voltage side circuit and the low-voltage side circuit. Under the premise of ensuring high voltage resistance and safety, it realizes reliable bidirectional signal transmission between the high-voltage side circuit and the low-voltage side circuit, which greatly reduces the cost of high-voltage power supply equipment and is conducive to the large-scale promotion and application of high-voltage power supply technology in scenarios such as AI data centers. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the principle of the high-voltage isolation communication device with unidirectional communication mode provided in Embodiment 1 of the present invention; Figure 2 This is a schematic diagram of the high-voltage isolation communication device with bidirectional communication mode provided in Embodiment 1 of the present invention; Figure 3 This is a schematic diagram of the hidden insulating support structure of the high-voltage isolation communication device with a surface-emitting antenna provided in Embodiment 1 of the present invention; Figure 4 This is a schematic diagram of the structure of a wireless communication module with a surface-emitting antenna provided in Embodiment 1 of the present invention; Figure 5 This is a schematic diagram of the structure of the wireless communication module with a side-emitting antenna provided in Embodiment 1 of the present invention; Figure 6 This is a schematic diagram of the high-voltage isolation communication device provided in Embodiment 1 of the present invention; Figure 7 This is a structural diagram of the insulating support provided in Embodiment 1 of the present invention; Figure 8 This is a schematic diagram of the high-voltage power supply equipment provided in Embodiment 2 of the present invention.

[0019] In the picture: 1. Wireless communication module; 11. Wireless signal transmitting module; 12. Wireless signal receiving module; 13. Wireless signal transceiver module; 1011. Surface-emitting antenna; 1012. Side-emitting antenna; 102. Circuit board; 1021. Positioning block; 103. Pin; 2. Isolation module; 21. Isolation tube; 3. Insulating bracket; 31. Mounting position; 32. Divider plate; 33. Weight reduction hole; 4. Low-voltage side circuit; 5. High-voltage side circuit; 51. Driver; 52. Power switching transistor. Detailed Implementation

[0020] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0021] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0022] Unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and connections within two components or interactions between two components. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0023] Unless otherwise expressly specified and limited, "above" or "below" a second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of a second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" of a second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0024] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0025] Example 1: like Figures 1-3 As shown, this embodiment provides a high-voltage isolation communication device suitable for signal transmission in high-voltage scenarios of 1kV and above. By adopting a module-level physical isolation structure, the material and wall thickness of the isolation tube 21 can be flexibly configured according to actual needs, thereby effectively meeting the isolation requirements of 10kV, 34kV, 50kV and even higher voltage levels.

[0026] The high-voltage isolation communication device includes a wireless communication module 1 and an isolation module 2. The wireless communication module 1 includes two wireless signal transmission modules arranged opposite each other for transmitting and receiving wireless signals. The isolation module 2 includes two oppositely arranged isolation tubes 21, which are made of electrically insulating material. The two wireless signal transmission modules are correspondingly housed within the two isolation tubes 21, transmitting wireless signals through their closed ends.

[0027] In this embodiment, the two wireless signal transmission modules can be configured into one-way communication mode or two-way communication mode according to application requirements. Specifically, when the system only requires one-way signal transmission, such as... Figure 1 As shown, one of the two wireless signal transmission modules is configured as a wireless signal transmitting module 11, and the other is configured as a wireless signal receiving module 12. The wireless signal receiving module 12 receives the signal from the wireless signal transmitting module 11, realizing one-way communication; when the system requires two-way interaction, such as... Figure 2 As shown, the two wireless signal transmission modules can be configured as wireless signal transceiver modules 13 with both sending and receiving functions, and the two can achieve bidirectional communication. Through the above-mentioned configurable communication modes, it is possible to flexibly adapt to the needs of different application scenarios. For example, in scenarios where only status monitoring is required, one-way communication can be used to simplify system design, while in scenarios requiring real-time control, bidirectional communication can be used to achieve command issuance and status feedback.

[0028] The wall thickness of the two isolation tubes 21 is configured such that the withstand voltage of the isolation module 2 is greater than a preset value. Specifically, the preset value is greater than or equal to 1kV and can be extended to 10kV, 34kV, 50kV or higher voltage levels.

[0029] To achieve the required withstand voltage, the isolation tube 21 is made of an electrically insulating material with high dielectric strength. The dielectric strength of the electrically insulating material is typically obtained through standard testing; for example, the dielectric strength of the electrically insulating material is greater than 10 kV / mm. The electrically insulating material can be quartz glass or ceramic; quartz glass has a dielectric strength greater than 30 kV / mm, while special ceramics can reach over 90 kV / mm in a thin sheet state. Of course, the electrically insulating material can also be a high-performance engineering plastic.

[0030] During the design phase, based on the target pressure resistance value V and the safety factor S (typically 1.5–3 to account for material inhomogeneity, aging, and environmental factors), the required minimum total wall thickness d can be calculated. min =(V×S) / E d E d Let be the dielectric strength of the material. Since this device uses a structure with two isolation tubes 21 connected in series, the voltage borne by each isolation tube 21 is not simply halved. The actual electric field distribution depends on the relative position and spacing of the two isolation tubes 21, as well as the dielectric constant of the material. In approximate analysis, it can be conservatively assumed that each isolation tube 21 must independently bear the entire voltage; therefore, the wall thickness of each isolation tube 21 should meet the calculated value mentioned above. Alternatively, through electric field simulation optimization, the air gap between the two isolation tubes 21 can be used to share the voltage, thereby appropriately reducing the wall thickness.

[0031] For example, if the isolation module 2 is required to withstand a voltage of not less than 34kV, and an alumina ceramic with a dielectric strength of 20kV / mm is selected, taking a safety factor of 2, then the required wall thickness of a single isolation tube 21 is (34kV×2) / 20kV / mm = 3.4mm. Considering actual processing and assembly, the wall thickness can be designed to be 4mm to ensure long-term reliability. If a material with higher dielectric strength (such as quartz glass, 30kV / mm) is selected, the wall thickness can be reduced to about 2.3mm under the same conditions. For higher voltages such as 50kV, the wall thickness can be increased accordingly or a multi-layer composite structure can be selected.

[0032] The isolation tube 21 can be cylindrical or square in shape, and its shape will affect the actual withstand voltage. Sharp angles or pointed edges should be avoided in the design to reduce electric field concentration. The electric field distribution can be verified through finite element simulation to ensure that the maximum field strength is lower than the material's safe operating field strength. After manufacturing, the isolation tube 21 can be subjected to withstand voltage tests, such as power frequency withstand voltage or DC withstand voltage tests, to confirm that its actual withstand voltage capability meets the preset requirements.

[0033] Through the above material selection, wall thickness calculation, structural optimization and testing verification, those skilled in the art can flexibly configure the wall thickness of the isolation tube 21 according to the specific voltage level to achieve stable and reliable ultra-high voltage withstand isolation.

[0034] This high-voltage isolation communication device uses two isolation tubes 21 made of electrical insulating material to enclose two wireless signal transmission modules, physically isolating them from the external high-voltage environment, dust, oil, moisture, etc., resulting in higher long-term reliability. Utilizing the inherent high dielectric strength of the electrical insulating material, the withstand voltage of the isolation module 2 is superimposed by adjusting the wall thickness of the two isolation tubes 21. This can be flexibly adjusted by increasing the wall thickness or selecting high dielectric strength materials, thus meeting the isolation requirements of high-voltage scenarios above 1kV. This overcomes the bottleneck of the withstand voltage limits of traditional optocoupler isolators and digital isolators, achieving reliable electrical isolation at high voltage levels.

[0035] In one embodiment, the interior of the isolation tube 21 is filled with an encapsulating colloid, which is used to fix the wireless signal transmission module and fill the internal gaps. After curing, the encapsulating colloid forms an elastic or rigid integral filling layer, tightly bonding the wireless signal transmission module to the inner wall of the isolation tube 21. This effectively absorbs and buffers external mechanical stress, ensuring that the wireless signal transmission module maintains a stable spatial position and electrical connection under strong vibration environments for a long time. In addition, the encapsulating colloid fills the internal gaps, eliminating internal air gaps and improving the electric field distribution. The encapsulating colloid raises the internal insulation strength to a level comparable to that of the isolation tube 21 body material, avoiding overall withstand voltage failure caused by internal air ionization, enabling the isolation module 2 to operate stably at higher voltages for a long time. On the other hand, the encapsulating colloid forms a physical sealing barrier, eliminating the intrusion path of moisture, dust, and corrosive gases, ensuring that the internal module and high-voltage interface are in a dry, clean, and stable environment for a long time, further improving withstand voltage and long-term reliability.

[0036] Specifically, the encapsulating colloid can be silicone or epoxy resin.

[0037] In one embodiment, the distance between the two isolation tubes 21 is less than or equal to 1 cm. The distance between the two isolation tubes 21 is determined based on the transmit power, operating frequency, and dielectric properties of the isolation tube material of the wireless signal transmission module. While ensuring stable transmission of the communication signal, the spacing is configured to be as small as possible to suppress spatial radiation interference and improve transmission efficiency. For example, for RF transceiver modules operating at 2.4 GHz or higher, the spacing is preferably 1 mm to 5 mm; for transmission modules using near-field coupling, the spacing can be further reduced to less than 1 mm.

[0038] Two wireless signal transmission modules transmit wireless signals through a closed end. The closed end blocks potential breakdown paths and creepage distances, ensuring electrical isolation safety. Since the signal penetrates the closed end wirelessly, no physical penetrations are needed inside or outside the isolation tube 21. The high-voltage side wireless signal transmission module no longer needs to rely on batteries or complex isolated power supplies to draw power from the high-voltage bus; it can be wirelessly powered from the low-voltage side through the same isolation barrier, further simplifying the high-voltage side circuit design and reducing system cost and size. Furthermore, the wireless signal transmission modules are pre-assembled and fixed inside the isolation tube 21 from the open end, forming an independent semi-finished component. During assembly, simply fix the two such semi-finished components with their open ends facing outwards and their closed ends facing each other. During production, each packaged semi-finished component can be tested individually beforehand, and qualified semi-finished components can be selected for final assembly, reducing the overall assembly complexity and facilitating large-scale industrial production.

[0039] Wireless communication module 1 can be a microwave or millimeter wave radio frequency communication module, and the two are wirelessly coupled and transmitted through radio frequency signals.

[0040] In this embodiment, as Figures 3-5 As shown, the wireless signal transmission module includes an antenna, a circuit board 102, and pins 103. The antenna and pins 103 are respectively located at both ends of the circuit board 102, with the antenna positioned close to the closed end and the pins 103 extending from the open end to the outside of the isolation tube 21. The two wireless signal transmission modules transmit signals through the closed end of the isolation tube 21 via near-field coupling or far-field radiation. When using radio frequency (RF) technology, signal transmission does not require photoelectric conversion, resulting in lower power consumption. Furthermore, the RF transceiver antenna and chip can be integrated into the miniaturized circuit board 102, facilitating encapsulation within the isolation tube 21. This also provides a foundation for subsequent power supply to the high-voltage side via wireless power transmission.

[0041] Furthermore, a gap of more than 1 mm is left between the circuit board 102 and the inner wall of the isolation tube 21. By leaving a gap of more than 1 mm, the surface of the circuit board 102 is separated from the inner wall of the isolation tube 21, so that the discharge path between the two needs to be longer. This forces the surface discharge (i.e., creepage) to cross the gap, thereby increasing the equivalent creepage distance and improving the surface flashover voltage.

[0042] Specifically, a positioning block 1021 with a large outer diameter is provided at one end of the circuit board 102 near the closed end. The antenna is fixed on the positioning block 1021. The positioning block 1021 cooperates with the inner wall of the isolation tube 21 to realize the positioning of the wireless signal transmission module in the isolation tube 21. After positioning, silicone or epoxy resin is filled into the interior of the isolation tube 21. The filling material flows into the gap between the circuit board 102 and the inner wall of the isolation tube 21, completely covering all surfaces of the circuit board 102, including the sides and back, to eliminate internal air gaps.

[0043] Pin 103 is used to solder or plug into devices on the high-voltage side or low-voltage side to achieve electrical connection between the wireless signal transmission module and the high-voltage side or low-voltage side.

[0044] Radio frequency (RF) transmission uses electromagnetic waves to transmit signals, with a spatial magnetic or electric field as the transmission medium. The transmission channel is reversible, allowing for both forward and reverse (from the low-voltage side to the high-voltage side) energy transmission. By adding a power transmitting coil on the low-voltage side, the same pair of antennas or coupling structures can power the wireless communication module 1 and its connected sensors on the high-voltage side simultaneously, enabling battery-free and unisolated power supply operation on the high-voltage side. Furthermore, the RF transceiver chip and antenna can be highly integrated, eliminating the need for expensive processes such as fiber optic connectors and fiber optic splicing, making it suitable for mass automated production and highly compatible with the cost-sensitive requirements of AI data centers and SST modules. Additionally, RF transmission eliminates optoelectronic devices and the LED aging problem; moreover, the entire RF link has no physical contact points, is unaffected by dust or oil contamination, and offers higher reliability in harsh high-voltage environments.

[0045] In other embodiments, the wireless communication module 1 can also be an optical fiber communication module. Specifically, the optical fiber communication module includes an electro-optical converter, a photoelectric converter, and an optical fiber cable. One end of the optical fiber cable passes through the closed end of the isolation tube 21 and connects to the internal electro-optical converter or photoelectric converter, or a sealed structure is provided at the closed end for the optical fiber cable to pass through. The electro-optical converter and photoelectric converter in the two isolation tubes 21 realize signal transmission through the optical fiber cable. Compared with the traditional optical fiber being directly exposed to the high-voltage side, the present invention places the optical fiber communication module inside the isolation tube 21, utilizing the physical strength of the isolation tube 21 to share the high-voltage stress. The optical fiber only serves as a signal transmission medium and does not bear the withstand voltage function.

[0046] It should be noted that although fiber optic methods can also achieve high voltage isolation, they are more expensive, consume more power, and cannot solve the problem of power supply on the high-voltage side.

[0047] In one embodiment, continue to refer to Figure 3 The axial length of the isolation tube 21 is at least half the length of the circuit board 102; or, the axial length of the isolation tube 21 is greater than or equal to the length of the circuit board 102, so as to completely house the circuit board 102 inside the isolation tube 21. The pins 103 of the circuit board 102 extend from the open end of the isolation tube 21, and the main body of the circuit board 102 and the antenna disposed thereon are covered by the isolation tube 21. The effective coverage length of the isolation tube 21 determines the creepage distance between the high-voltage side along the surface of the circuit board 102 and the low-voltage side pins 103, which can be approximately equal to the axial length of the isolation tube 21.

[0048] By limiting the length of the isolation tube 21 to at least half the length of the circuit board 102, the area on the circuit board 102 with the highest voltage and most concentrated electric field is effectively covered. The inner wall of the isolation tube 21 and the surface of the circuit board 102 together form a creepage path, limiting the risk of discharge to the covered area and achieving withstand voltage through path extension. At the same time, allowing part of the circuit board 102 to be exposed provides more operating space for soldering pins 103 or connectors, which is suitable for scenarios requiring frequent insertion and removal.

[0049] The length of the isolation tube 21 is greater than or equal to the length of the circuit board 102, maximizing the creepage distance. The end of the circuit board 102 is hidden inside the isolation tube 21 or is flush with the open end. There are no high-voltage conductors of the circuit board 102 near the open end, avoiding the discharge hazard of a three-junction point formed at the intersection of the edge of the circuit board 102, the open end of the isolation tube 21, and the air. This results in higher reliability and suitability for harsh environments with fixed installations.

[0050] In one embodiment, such as Figure 4 As shown, the antenna is a surface-emitting antenna 1011, which is vertically mounted on the end face of the circuit board 102, with its radiating surface facing the closed end of the isolation tube 21. Specifically, the surface-emitting antenna 1011 is vertically mounted on the front end face of the positioning block 1021, so that the surface-emitting antennas 1011 in the two oppositely arranged isolation tubes 21 form a face-to-face spatial arrangement, that is, their radiating surfaces face each other directly, so as to realize the axial wireless signal coupling transmission. When the spacing between the isolation tubes 21 is small, this face-to-face near-field alignment can reduce transmission loss and improve signal transmission efficiency.

[0051] Furthermore, a positioning groove is provided on the front end face of the positioning block 1021, and the opposite side walls of the main body of the surface-emitting antenna 1011 are provided with concave portions. The surface-emitting antenna 1011 is inserted into the positioning groove through the concave portions to achieve positioning. Then, the surface-emitting antenna 1011 is mechanically fixed and electrically connected to the circuit board 102 by welding.

[0052] The 1011 surface-emitting antenna has a large radiating surface. Even if there are slight positional deviations during assembly, as long as the two antennas remain roughly face to face, the signal strength attenuation is small, which improves mass production consistency.

[0053] In one embodiment, such as Figure 5As shown, the antenna is a side-emitting antenna 1012, which is mounted parallel to the surface of the circuit board 102. When the side-emitting antenna 1012 is fixed, it is horizontally soldered to the upper or lower surface of the positioning block 1021. The opposite sides of the two side-emitting antennas 1012 are the radiating surfaces. The side-emitting antennas 1012 in the two oppositely arranged isolation tubes 21 form a side-to-side spatial layout, that is, the radiating surfaces of the two are directly opposite each other in the horizontal direction, so as to realize wireless signal coupling transmission under radial offset.

[0054] Setting the antenna parallel to the surface of the circuit board 102 ensures that the antenna and the RF circuit on the circuit board 102 are on the same plane, shortening the RF trace distance, reducing the impact of parasitic parameters caused by vias, and facilitating impedance matching and integrity design of high-frequency signals.

[0055] like Figure 6 and Figure 7 As shown, the high-voltage isolation communication device provided in this embodiment also includes an insulating bracket 3. The insulating bracket 3 has at least two mounting positions 31 for fixing and supporting the two isolation tubes 21. The insulating bracket 3 achieves relative fixation and support of the two isolation tubes 21, ensuring that the distance between the closed ends is fixed. At the same time, the vibration energy is dissipated onto the insulating bracket 3, rather than concentrated on weak parts such as the pins 103, ensuring the stability of electrical performance and avoiding communication failures caused by changes in position.

[0056] The insulating bracket 3 is made of insulating materials such as engineering plastics. It has high insulation resistance and dielectric strength, and can provide mechanical support without interfering with the original electric field distribution. It can also help extend the creepage distance and further improve the overall withstand voltage level.

[0057] Specifically, the two mounting positions 31 of the insulating bracket 3 respectively snap-fit ​​and position the two isolation tubes 21, and a partition plate 32 is provided between the two isolation tubes 21. The partition plate 32 is located between the closed ends of the two isolation tubes 21, and the thickness and dielectric constant of the partition plate 32 are configured not to affect the wireless signal transmission in the two isolation tubes 21.

[0058] Furthermore, the partition plate 32 may have a hollow area or a thin-walled structure to further reduce the obstruction or reflection of wireless signals; or, a preset gap may be maintained between the partition plate 32 and the closed ends of the two isolation tubes 21 to form an air coupling channel, ensuring that wireless signals can penetrate smoothly by near-field coupling or radiation.

[0059] The bottom of the insulating bracket 3 is provided with weight reduction holes 33 corresponding to each mounting position 31, so that the insulating bracket 3 can play a stable supporting role without causing a significant increase in the overall weight of the high-voltage isolation communication device, thus achieving a lightweight design.

[0060] The wireless communication module 1 and isolation module 2 in the high-voltage isolation communication device provided in this embodiment are not limited to one set, but can be configured as multiple sets according to actual needs. When multiple sets of wireless communication module 1 and isolation module 2 are configured in a one-to-one correspondence, the multiple sets of isolation tubes 21 can also be fixed by an insulating bracket 3. That is, multiple mounting positions 31 are provided on the insulating bracket 3, and every two mounting positions 31 are arranged opposite each other for installing the two isolation tubes 21 that constitute one set of isolation modules 2. The multiple sets of isolation tubes 21 are integrated into one unit by the insulating bracket 3, making the structure of the high-voltage isolation communication device more compact and smaller.

[0061] Example 2: like Figure 8 As shown, this embodiment provides a high-voltage power supply device, including a high-voltage side circuit 5 and a low-voltage side circuit 4 located at different potentials, and a high-voltage isolation communication device provided in Embodiment 1. Two wireless signal transmission modules are arranged opposite each other in the wireless communication module 1. One wireless signal transmission module is electrically connected to the high-voltage side circuit 5, and the other wireless signal transmission module is electrically connected to the low-voltage side circuit 4. The high-voltage isolation communication device is used for signal communication between the high-voltage side circuit 5 and the low-voltage side circuit 4. By applying the aforementioned high-voltage isolation communication device to achieve signal communication between the high-voltage side circuit 5 and the low-voltage side circuit 4, reliable bidirectional signal transmission between the high-voltage side circuit 5 and the low-voltage side circuit 4 is achieved while ensuring high voltage withstand safety. This significantly reduces the cost of the high-voltage power supply device and is conducive to the large-scale application of high-voltage power supply technology in scenarios such as AI data centers.

[0062] Specifically, the control commands from the controller in the low-voltage side circuit 4 are converted into wireless signals by the wireless signal transmitting module 11. These wireless signals penetrate the closed end of the corresponding isolation tube 21, pass through the gap between the two isolation tubes 21, and then penetrate the closed end of another isolation tube 21. They are received by the wireless signal transceiver module 13 and converted back into electrical signals, which are then transmitted to the driver 51 in the high-voltage side circuit 5. The driver 51 receives low-voltage logic signals from the wireless communication module 1 at its input side and generates negative and positive voltages at its output side, providing drive current to the power switch 52. The HV in the high-voltage side circuit 5 represents the high-voltage power supply, typically 1200V, 3300V, 10kV, 34kV, or 50kV. Isolation protects the expensive controller in the low-voltage side circuit 4 and ensures the safety of operators. Conversely, operating status parameters or control requirements in the high-voltage side circuit 5 can also be transmitted back to the low-voltage side circuit 4 along the same path. During this process, the two isolation tubes 21 jointly withstand the huge potential difference between the high-voltage side and the low-voltage side to achieve ultra-high withstand voltage isolation, while the wireless signal penetrates the closed end to complete the transmission of information.

[0063] The high-voltage power supply equipment provided in this embodiment can be widely used in various high-voltage power electronic devices, especially in fields such as AI data center power supply systems, high-end medical equipment power supply, new energy vehicles and charging facilities, smart grid distribution terminals, and rail transit traction converters. In these applications, it can not only achieve reliable signal transmission between high and low voltage sides, but also provide a stable operating potential reference for low-voltage circuits such as high-voltage side monitoring and driving. It solves the problem that traditional optocoupler or fiber optic solutions are difficult to balance high voltage resistance, low cost, and high reliability in ultra-high voltage environments, providing key technical support for the intelligentization and miniaturization of high-voltage systems.

[0064] The above description is only a preferred embodiment of the present invention. For those skilled in the art, there will be changes in the specific implementation and application scope based on the ideas of the present invention. The content of this specification should not be construed as a limitation of the present invention.

Claims

1. A high-voltage isolation communication device, characterized in that, include: The wireless communication module (1) includes two wireless signal transmission modules, which are arranged opposite to each other for transmitting and receiving wireless signals. The isolation module (2) includes two isolation tubes (21) arranged opposite to each other. The isolation tubes (21) are made of electrically insulating material and have a closed end and an open end. The two wireless signal transmission modules are arranged in the two isolation tubes (21) in a one-to-one correspondence and transmit wireless signals through the closed end. The wall thickness of the two isolation tubes (21) is configured such that the pressure resistance of the isolation module (2) is greater than a preset value.

2. The high-voltage isolation communication device according to claim 1, characterized in that, The preset value is greater than or equal to 1kV.

3. The high-voltage isolation communication device according to claim 1, characterized in that, The dielectric strength of the electrical insulating material is greater than 10 kV / mm.

4. The high-voltage isolation communication device according to claim 3, characterized in that, The electrical insulating material is quartz glass or ceramic.

5. The high-voltage isolation communication device according to claim 1, characterized in that, The interior of the isolation tube (21) is filled with encapsulating colloid, which is used to fix the wireless signal transmission module and fill the internal gaps.

6. The high-voltage isolation communication device according to claim 1, characterized in that, The distance between the two isolation tubes (21) is less than or equal to 1 cm.

7. The high-voltage isolation communication device according to any one of claims 1-6, characterized in that, The wireless signal transmission module includes an antenna, a circuit board (102), and pins (103). The antenna and the pins (103) are respectively located at both ends of the circuit board (102). The antenna is located close to the closed end, and the pins (103) extend from the open end to the outside of the isolation tube (21).

8. The high-voltage isolation communication device according to claim 7, characterized in that, The axial length of the isolation tube (21) is at least half the length of the circuit board (102); Alternatively, the axial length of the isolation tube (21) is greater than or equal to the length of the circuit board (102) so as to completely house the circuit board (102) inside the isolation tube (21).

9. The high-voltage isolation communication device according to claim 7, characterized in that, The antenna is a surface-emitting antenna (1011), which is vertically mounted on the end face of the circuit board (102); Alternatively, the antenna is a side-emitting antenna (1012), which is mounted parallel to the surface of the circuit board (102).

10. The high-voltage isolation communication device according to any one of claims 1-6, characterized in that, It also includes an insulating bracket (3) having at least two mounting positions (31) for fixing and supporting the two isolation tubes (21).

11. A high-voltage power supply device, characterized in that, include: High-voltage side circuit (5) and low-voltage side circuit (4) located at different potentials; According to any one of claims 1-10, in the wireless communication module (1), two wireless signal transmission modules are arranged opposite to each other, one of which is electrically connected to the high-voltage side circuit (5) and the other is electrically connected to the low-voltage side circuit (4). The high-voltage isolation communication device is used for signal communication between the high-voltage side circuit (5) and the low-voltage side circuit (4).

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