PCI-E module external system

Abstract

The invention provides a PCI-E module external system. The PCI-E module external system comprises an interface board installed in a server, an external upper rack case, an independent data line and a power line, wherein the independent data line and the power line are connected with the interface board and the external upper rack case. Signal amplification circuits are arranged on the interface board and a rear circuit board in the case, so that the PCI-E signals transmitted in a long distance are subjected to bidirectional amplification compensation, and the signal integrity is ensured. And the power line directly leads the internal power supply of the server to the upper rack case by adopting a USB Type-C interface, so that the power-on and power-off time sequences of the external module and the server host are strictly synchronized. The upper rack case is of a 1U standard structure, an internal slot is parallel to the bottom face, full-height or half-height PCI-E module installation is supported, and an active heat dissipation air channel is constructed in cooperation with a fan. The external deployment of the PCI-E module is realized, and the technical problems of signal attenuation, asynchronous power supply, difficulty in heat dissipation and the like in the external deployment are solved.

Description

Technical Field

[0001] This invention relates to the field of PCI-E module assembly technology, and more specifically, to an external PCI-E module system. Background Technology

[0002] PCI-E modules are cards that conform to the PCI-E specification and are installed in PCI-E slots on server or computer motherboards, primarily used to provide expansion capabilities for computers or servers. In current technological applications, PCI-E modules are deployed on servers in three main ways: First, the PCI-E module is directly installed inside the server chassis, integrated with the server in the rack; second, an extension cable is used to extend only the PCI-E signal lines to the outside of the server, with the PCI-E module powered by an external power supply; third, an extension cable is used to extend the PCI-E slot on the motherboard to the outside of the server, with the PCI-E module powered by the server.

[0003] However, all three existing deployment methods have significant technical drawbacks. For the first method, installing the modules inside the server, the modules are transferred, shipped, stored, and recycled as a whole, making them prone to inventory omissions and being recycled along with the modules. Furthermore, the limited internal space of server chassis imposes strict limitations on the size of PCI-E modules; for example, some servers only support half-height PCI-E modules. In addition, servers themselves generate considerable heat, and the PCI-E slots on the motherboard are often located close to the sides of the chassis, which is very detrimental to heat dissipation of the PCI-E modules. For the second method, using external power extension cables, the lack of a dedicated fixing structure allows PCI-E modules to be placed arbitrarily, posing a risk of loose connections or even detachment. Moreover, external power not only increases deployment complexity but also prevents the server from controlling the power-on and power-off of the PCI-E modules, easily leading to synchronization and timing issues. The third method, using extended cables, is problematic because PCI-E slot cables are quite wide (for example, the common PCI-EX8 slot cable is over 10 cm wide). Server chassis typically do not have holes wide enough to accommodate these cables, requiring the chassis to be opened for use. This limits the method to temporary or development / debugging scenarios and cannot meet the requirement that opening the chassis is not permitted in formal deployments.

[0004] Furthermore, existing technologies suffer from poor human-computer interaction. According to the PCI-E standard, only the fixed structural components of a PCI-E module can be exposed on the chassis surface, resulting in a very limited area that can only accommodate a small number of interfaces, indicator lights, or buttons. Moreover, because the fixed structural components are mounted on the rear panel of the chassis, they are not easily observed or operated by the user. Therefore, a new technical solution is urgently needed to address the aforementioned problems related to heat dissipation, mounting, power supply synchronization, and limited human-computer interaction. Summary of the Invention

[0005] The present invention aims to solve at least one of the aforementioned technical problems existing in the prior art.

[0006] Therefore, the present invention provides an external PCI-E module system.

[0007] This invention provides an external PCI-E module system, comprising: an interface board, connecting cables, and a rack-mount chassis; The interface board is installed inside the server. The interface board includes a circuit board, which has a PCI-E gold finger for inserting into the server slot, a signal interface for leading out PCI-E signals, and a power interface for leading out power. The rack-mount chassis is installed on an external rack. The rack-mount chassis has a rear circuit board inside. The rear circuit board has a standard PCI-E slot for external PCI-E module access, as well as signal interfaces and power interfaces corresponding to the interface board. The connection cable includes independent data cable and power cable, which are respectively connected to the signal interface and power interface between the interface board and the rack chassis, so as to synchronously lead out the PCI-E signal and power from inside the server to the rack chassis. Both the interface board and the rear circuit board are equipped with signal amplification circuits for bidirectional amplification and compensation of the PCI-E signals transmitted by the connection lines.

[0008] The external PCI-E module system according to the above-described technical solution of the present invention may also have the following additional technical features: In the above technical solution, the interface board is fixed to the back-end board slot of the server by a full-height or half-height structural component; the power interface on the interface board is a USB Type-C interface, which is used to carry the DC power output by the server through the power cable.

[0009] In the above technical solution, the signal interface on the interface board and the signal interface on the rear circuit board adopt the SFF-8643 interface; the data line in the connecting line is a shielded cable adapted to the SFF-8643 interface.

[0010] In the above technical solution, the rack chassis is also equipped with a front circuit board, which is electrically connected to an external PCI-E module; the front circuit board integrates a touch screen controller, which communicates with the external PCI-E module through a serial port to realize the expansion of human-computer interaction.

[0011] In the above technical solution, the front circuit board is also provided with an adapter circuit for leading out the USB interface, network port, indicator light signal and serial port signal of the external PCI-E module to the front panel of the rack chassis.

[0012] In the above technical solution, the internal bottom plate of the rack chassis is provided with pre-embedded fixing nuts for installing the rear circuit board and fixing external PCI-E modules of different sizes.

[0013] In the above technical solution, the rear panel of the rack chassis is provided with a chassis lock, which cooperates with the chassis cover to realize the opening or locking of the chassis.

[0014] In the above technical solution, the rack chassis is equipped with a cooling fan, and the left and right side walls of the rack chassis are provided with hollowed-out heat dissipation channels.

[0015] In the above technical solution, the insertion direction of the standard PCI-E slot on the rear circuit board is parallel to the bottom surface of the rack chassis, so as to support the installation of full-height or half-height external PCI-E modules in the rack chassis.

[0016] In the above technical solution, the rack-mounted chassis is a standard rack-mounted structure with a height of 1U and a width of 19 inches. The rack-mounted chassis directly obtains the internal power supply of the server through the power cable to achieve synchronization of the power-on and power-off timing between the external PCI-E module and the server host.

[0017] In summary, due to the adoption of the above-mentioned technical features, the beneficial effects of the present invention are: This invention designs an external rack-mounted PCI-E module structure system, which separates the PCI-E module from the server and fixes it in a standard rack. It mainly consists of three parts: the server-side interface board, the intermediate connecting cable, and the external rack-mounted chassis. This effectively solves the technical problems in the prior art, such as limited deployment of PCI-E modules, severe signal attenuation, asynchronous power supply, and difficulty in human-computer interaction.

[0018] Specifically, the beneficial effects of this invention include: First, the invention incorporates signal amplification circuits at both ends (transmitting end) of the interface board and the rear circuit board of the rack-mount chassis. Through a bidirectional signal amplification mechanism, it effectively compensates for signal attenuation caused by long-distance connection lines, ensuring that high-bandwidth PCI-E 3.0 x8 communication can still be supported even with extended deployments, guaranteeing the integrity and stability of signal transmission. Second, the invention uses an independent power cable with a USB Type-C interface to directly draw power from inside the server to the rack-mount chassis, achieving power domain binding between the external PCI-E module and the server host. This ensures consistency in the power-on and power-off sequence at the physical level, avoiding the risk of device identification failure or data loss that might result from independent external power supply. Furthermore, the invention adopts a standard-height rack-mount chassis structure, coupled with internal slots parallel to the bottom surface, enabling compatibility with PCI-E modules of various sizes, including full-height and half-height. This breaks the strict limitations on board size within servers and facilitates standardized asset inventory and management in the data center, preventing module omissions or subsequent recycling. Furthermore, this invention integrates a touchscreen controller and adapter circuitry on the front circuit board of the rack-mount chassis, bringing the network ports, USB ports, and indicator lights of the PCI-E module to the front panel of the chassis. It also adds interactive features such as a touchscreen display, significantly improving the difficulty of operating and observing traditional module interfaces located at the back of the chassis, thus enriching the human-computer interaction experience. Finally, this external structure constructs an active cooling airflow through an independent cooling fan and perforated channels in the chassis side wall, effectively solving the problem of poor heat dissipation of the PCI-E module within a crowded server chassis and improving the reliability of equipment operation.

[0019] Additional aspects and advantages of the invention will become apparent in the following description or may be learned by practice of the invention. Attached Figure Description

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the structure of an external PCI-E module system according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the internal structure of the rack-mounted chassis in an external PCI-E module system according to an embodiment of the present invention; Figure 3 This is a circuit diagram of the signal amplification circuit in an external PCI-E module system according to an embodiment of the present invention.

[0021] in, Figures 1 to 3 The correspondence between the reference numerals and component names in the attached drawings is as follows: 1. Server; 2. Rack-mounted chassis; 11. Interface board; 21. Front circuit board; 22. External PCI-E module; 23. Rear circuit board; 24. Cooling fan; 31. Data cable; 32. Power cord. Detailed Implementation

[0022] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0023] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.

[0024] The following reference Figures 1 to 3 This describes an external PCI-E module system provided according to some embodiments of the present invention.

[0025] Some embodiments of this application provide an external PCI-E module system.

[0026] This disclosure addresses the technical problems in existing technologies, such as limited space, poor heat dissipation, and difficulty in inventory management when PCI-E modules are deployed inside servers, as well as severe signal attenuation, asynchronous power supply, and poor human-computer interaction when deployed externally. The first embodiment of this invention provides an external PCI-E module system. This system mainly comprises three core components: an interface board installed inside the server, a connection cable for long-distance transmission, and an external rack-mount chassis installed on the server rack.

[0027] First, please refer to Figure 1 (Overall connection diagram) This diagram illustrates the overall architecture of the external PCI-E module system provided by this invention. Through a physically separated design, this system extends the PCI-E functionality, originally located on the server motherboard, to a more external location. Figure 2 It is housed in an external, independent standard chassis, as shown.

[0028] The interface board serves as the signal source and power acquisition point for the entire external system. The main body of the interface board comprises a multilayer printed circuit board (PCB) and a metal structural component for mounting. The bottom of the circuit board features gold fingers compliant with the PCI-E specification, which are used to insert into standard PCI-E slots on server motherboards. In one specific embodiment, the gold fingers support the PCI-E 3.0 protocol and are backward compatible with the PCI-E 2.0 / 1.0 protocol, with a channel width designed to be x8 or x16 to adapt to server motherboards with different bandwidth requirements.

[0029] To accommodate the rear panel heights of different server chassis models, the interface board is equipped with replaceable mounting components. In some embodiments, these components include metal panels in both full-height and half-height versions. When the server is a standard 4U chassis, the full-height component is used to secure the interface board to the server's rear panel slot, supporting vertical installation of full-height PCI-E modules (which occupies the most space). The 4U chassis can also accommodate horizontal installation of full-height PCI-E modules, vertical installation of half-height PCI-E modules, and horizontal installation of half-height PCI-E modules, all requiring less space. When the server is a standard 2U chassis, the half-height component is used to secure the interface board to the server's rear panel slot, supporting vertical installation of half-height PCI-E modules. Similarly, the 2U chassis can accommodate both horizontal installation of full-height and half-height PCI-E modules. This design ensures that the interface board is physically compatible with the vast majority of general-purpose servers on the market.

[0030] The main function of the interface board is to bring out the PCI-E differential signals and power from the server motherboard. Two key interfaces are located at the output of the circuit board: a signal interface and a power interface. Regarding the signal interface, to ensure impedance matching and shielding during the extraction of high-frequency signals, in one specific embodiment, the signal interface on the interface board adopts the SFF-8643 (Mini-SASHD) interface. The SFF-8643 interface features high density and high bandwidth, and is typically used for SAS connections on storage servers. However, its excellent signal integrity characteristics make it very suitable for carrying high-speed differential pairs of the PCI-E protocol. This interface internally defines multiple sets of differential signal pins, corresponding to the PCI-E transmit (TX) and receive (RX) data channels, as well as sideband signals such as reference clock, reset signal, and wake-up signal.

[0031] Regarding the power interface, the interface board needs to draw power from the server's internal components and transmit it to the external chassis. Although the PCI-E slot itself provides 12V power, to handle high-power loads and ensure ease of connection, in one specific embodiment, the power interface on the interface board uses a USB Type-C interface. It should be noted that this Type-C interface is not used for transmitting USB protocol data, but rather leverages the excellent current-carrying capacity and physical connection reliability of the Type-C connector. The interface board uses circuit wiring to converge the 12V DC power obtained from the gold fingers to the power pin (VBUS) and ground pin (GND) of the Type-C interface. In one specific embodiment, to meet the power consumption requirements of high-performance PCI-E modules (such as encryption / decryption cards and AI accelerator cards), this power interface and its associated circuitry are designed to support a maximum power output of 200W.

[0032] One of the core technological innovations of this invention lies in solving the signal attenuation problem caused by external extension cables. The PCI-E 3.0 signal rate is as high as 8GT / s, and ordinary passive extension cables experience severe insertion loss and inter-symbol interference when their length exceeds tens of centimeters, leading to link training failure. To address this, this invention integrates signal amplification circuits on both the interface board and the rear circuit board of the rack-mounted chassis (described later), forming a bidirectional amplification and compensation mechanism.

[0033] Specifically, such as Figure 3 (Diagram of bidirectional signal amplification) As shown, the signal amplification circuit includes independent channels for the transmitting and receiving directions. On one side of the interface board, the TX signal from the server motherboard, after passing through the gold fingers, first enters the signal amplification chip (such as a Redriver or Retimer chip). This chip performs equalization processing on the signal, compensating for losses caused by the motherboard traces, and pre-emphasizes the signal to enhance the high-frequency components so that the signal can "break through" subsequent long-distance connection lines. Only after processing is the signal sent to the SFF-8643 interface for transmission. Similarly, the signal sent from the rack chassis (the TX signal from the transmitting end of the rear circuit board) will first undergo signal shaping and clock recovery by the transmitting end's amplification circuit before being sent to the SFF-8643 interface receiving end of the interface board.

[0034] In one specific embodiment, the signal amplification circuit employs a linear repeater chip with adaptive equalization. This chip can be configured via the SMBus bus or by configuring its gain parameters via external resistors to match specific attenuation values ​​caused by different lengths of connection lines. This dual-ended amplification design significantly extends the effective transmission distance of the entire external system, sufficient to support cross-rack connection deployments.

[0035] The connector cable is used to connect the server-side interface board to the external rack-mount chassis. To avoid electromagnetic interference from high-current power lines affecting high-speed differential signals, this invention innovatively adopts a separate cable design, meaning the connector cable consists of a separate data cable and a separate power cable.

[0036] The data line is responsible for transmitting PCI-E signals. In one specific embodiment, the data line is a high-frequency shielded cable (Mini SAS bidirectional shielded cable) adapted to the SFF-8643 interface. The cable contains multiple sets of twisted pairs, each with an independent aluminum foil shielding layer, and the outermost layer is wrapped with a copper braided mesh shielding layer. This multi-layered shielding structure effectively resists external electromagnetic radiation and prevents internal differential signals from radiating to the outside.

[0037] The power cable is responsible for transmitting DC power. In one specific embodiment, both ends of the power cable are USB Type-C male connectors, and the wire core uses large-diameter oxygen-free copper wire to reduce line resistance and voltage drop, ensuring that the cable does not overheat and the voltage remains stable when transmitting 200W of power. By physically separating the power and signal, not only is signal quality improved, but cable maintenance and replacement are also made more flexible.

[0038] The rackmount chassis serves as the host environment for external PCI-E modules. In one specific embodiment, the rackmount chassis is designed as a standard rackmount structure with a standard 1U height (approximately 44.45mm) and 19-inch width. This standardized size design allows the device to be seamlessly installed in any standard server rack, resulting in an aesthetically pleasing and tidy appearance while facilitating asset management.

[0039] The rear circuit board is installed in the rear section of the rack-mount chassis. This rear circuit board is the core hub of the chassis, featuring SFF-8643 signal interfaces and Type-C power interfaces corresponding to the interface boards. PCI-E signals from the connecting cables enter the rear circuit board and undergo secondary processing (receive equalization and transmit pre-emphasis) through onboard signal amplification circuitry to compensate for losses during cable transmission.

[0040] The rear circuit board features a standard PCI-E slot for inserting external PCI-E modules (such as password cards, acquisition cards, etc.). Since the rack-mount chassis is only 1U high, while a standard full-height PCI-E card is much taller than 1U, it cannot be inserted vertically as in a desktop computer. To resolve this space constraint, in one specific embodiment, the standard PCI-E slot on the rear circuit board is designed to be parallel to the bottom surface of the rack-mount chassis (i.e., horizontal insertion, also known as horizontal mounting). This design ensures that the PCI-E module lies flat on the chassis floor after insertion. It is understood that a 1U chassis is also suitable for horizontal insertion of half-height PCI-E modules.

[0041] This parallel mounting method, combined with the ample internal space of the chassis, allows for perfect compatibility with PCI-E modules of various sizes. In one specific embodiment, the system supports all standard PCI-E cards of full height and full length, full height and half length, half height and full length, and half height and half length. To secure these cards of different sizes, multiple matrix-arranged pre-embedded fixing nuts are pre-installed on the internal base plate of the chassis. Users can select the corresponding nut holes according to the actual length of the inserted module and the mounting hole position, and use studs or clamps to firmly lock the PCI-E module to the chassis base plate, thereby preventing the module from loosening due to transportation vibration.

[0042] In existing technologies, external devices often use independent power adapters. This leads to a serious problem: if the server powers on first but the external device is not powered on, the server BIOS will report an error or even hang because it cannot detect the device; or the external device will continue to run idle after the server is powered off. This invention completely solves this problem through a special power supply architecture.

[0043] In one specific embodiment, the rack-mount chassis itself does not have a built-in AC-DC power module; all its power is drawn directly from the server's internal components via a USB Type-C power cable. This establishes a physical "power domain binding" relationship. When the server is powered on, the server motherboard powers on, and the interface board immediately receives 12V power, which is instantly transmitted to the rack-mount chassis via the connection cable, causing the external PCI-E module to start. This process is completely synchronized with the timing of the module being plugged into the motherboard. Similarly, when the server is powered off, the interface board de-energizes, and the external chassis also de-energizes. This design achieves strict synchronization between the power-on and power-off timing of the external PCI-E module and the server host, without requiring any additional software control or complex power management protocols.

[0044] To address the problems of traditional PCI-E module interfaces being located at the back of the chassis, resulting in inconvenient operation and limited interaction methods, this invention features a front circuit board at the front of the rack-mount chassis. The front circuit board is connected to the rear circuit board or PCI-E modules via flexible cables or board-to-board connectors.

[0045] The front board is not merely a simple interface adapter board; it also features intelligent control capabilities. In one specific embodiment, a microcontroller (MCU) is integrated on the front board as a touchscreen controller. This controller communicates with an external PCI-E module via a serial port (UART / RS232). Many high-end PCI-E modules (such as encryption machines) have internal debug serial ports. By connecting to this port, the controller on the front board can read the module's operating status (such as temperature, load, key status, etc.) and display this information on the touchscreen integrated on the front panel of the chassis. Users can also input commands via the touchscreen, which the controller converts into serial commands and sends to the PCI-E module, thus enabling out-of-band management independent of the server operating system.

[0046] In addition, the front board also includes an adapter circuit for signal extension. In one specific embodiment, if the external PCI-E module itself has a USB interface, RJ45 network port, or status indicator light, it can be connected to the front board via internal cables. The front board then rearranges these interfaces and brings them out to the front panel of the rack enclosure. This allows maintenance personnel to easily insert UKeys, connect network cables, or monitor device status from the front of the rack (cold aisle) without having to go to the back of the rack.

[0047] Because PCI-E modules (especially high-performance computing cards or high-frequency trading cards) generate a lot of heat during operation, and the rack-mount chassis has a compact 1U structure, heat dissipation design is crucial. This invention constructs an active cooling airflow channel inside the rack-mount chassis.

[0048] In one specific embodiment, the left and right side walls of the rack-mounted chassis have arrayed perforated heat dissipation channels (air inlets and exhaust outlets). A high-speed turbo fan or axial fan module is installed on one side of the chassis (usually the intake side). A rear circuit board powers the fans and adjusts their speed based on temperature sensor feedback. Cool air is drawn in from one side of the chassis, flows horizontally across the surface of the horizontally mounted PCI-E modules, carries away heat, and is exhausted from the other side. This side-inlet / side-outlet airflow design utilizes the lateral space of the rack, avoiding potential obstruction of the rack doors by the front and rear airflow, and also preventing hot air from flowing back into the server's air intake.

[0049] In terms of physical security, to prevent theft or unauthorized operation of expensive PCI-E modules (such as core encryption components), a chassis lock is installed on the rear panel of the rack enclosure. In one specific embodiment, this chassis lock employs a mechanical rotary latch structure, with the latch engaging with the latch on the chassis cover. When locked, the chassis cover cannot be slid open, thus blocking the physical contact path between the internal circuit boards and modules. Combined with the lock on the rack's own door, this constitutes a double layer of physical security protection.

[0050] In one specific embodiment, the workflow of this system is as follows: Physical connection: Install the interface board with the full-height or half-height bracket into the server PCI-E slot; install the PCI-E module flat into the rear circuit board slot in the rack chassis and secure it with nuts; connect the relevant adapter cables on the front circuit board; connect the interface board to the rack chassis using data and power cables.

[0051] Power-on startup: The server starts up, and the server power is transmitted through the interface board and Type-C cable to the rear circuit board of the rack chassis, which in turn powers the PCI-E modules, front circuit board, and fans. The system achieves synchronous power-on.

[0052] Signal initialization: The server motherboard sends a PCI-E reference clock and reset signal, which are amplified by the interface board, transmitted through the SFF-8643 cable, and reach the PCI-E module. The module completes the reset and begins link training.

[0053] Link establishment: With compensation from the bidirectional signal amplification circuit, both parties complete rate negotiation and establish a high-speed PCI-E 3.0 x8 communication link. The operating system recognizes the device.

[0054] Operation and Interaction: Users can normally access the PCI-E module functions on the server side. Simultaneously, they can view the module status via the touchscreen on the front of the chassis, or operate peripherals via the USB / Ethernet ports on the front panel. The cooling fan operates continuously to maintain the internal temperature of the chassis.

[0055] Power outage: Shut down the server, disconnect the power supply, and shut down the external system simultaneously.

[0056] Through the specific structural and circuit design described above, this invention not only realizes the physical externalization of the PCI-E module, but also performs system-level optimization in multiple dimensions such as electrical performance, synchronization logic, heat dissipation environment and human-computer interaction.

[0057] In this specification, the illustrative expressions of the terms used do not necessarily refer to the same embodiments or examples. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0058] Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this invention shall be included within the scope of protection of this invention.

Claims

1. An external PCI-E module system, characterized in that, include: Interface board, connecting cables, and rack-mount chassis; The interface board is installed inside the server. The interface board includes a circuit board, which has a PCI-E gold finger for inserting into the server slot, a signal interface for leading out PCI-E signals, and a power interface for leading out power. The rack-mount chassis is installed on an external rack. The rack-mount chassis has a rear circuit board inside. The rear circuit board has a standard PCI-E slot for external PCI-E module access, as well as signal interfaces and power interfaces corresponding to the interface board. The connection cable includes independent data cable and power cable, which are respectively connected to the signal interface and power interface between the interface board and the rack chassis, so as to synchronously lead out the PCI-E signal and power from inside the server to the rack chassis. Both the interface board and the rear circuit board are equipped with signal amplification circuits for bidirectional amplification and compensation of the PCI-E signals transmitted by the connection lines.

2. The external PCI-E module system according to claim 1, characterized in that, The interface board is fixed to the back-end board slot of the server via a full-height or half-height structural component; the power interface on the interface board is a USB Type-C interface, which is used to carry the DC power output by the server through the power cable.

3. The external PCI-E module system according to claim 1, characterized in that, The signal interfaces on the interface board and the signal interfaces on the rear circuit board adopt the SFF-8643 interface; the data lines in the connecting lines are shielded cables adapted to the SFF-8643 interface.

4. The external PCI-E module system according to claim 1, characterized in that, The rack-mount chassis also includes a front circuit board, which is electrically connected to an external PCI-E module. The front circuit board integrates a touch screen controller, which communicates with the external PCI-E module via a serial port to extend human-computer interaction.

5. The external PCI-E module system according to claim 4, characterized in that, The front circuit board is also equipped with an adapter circuit for leading out the USB interface, network port, indicator light signals and serial port signals of the external PCI-E module to the front panel of the rack chassis.

6. The external PCI-E module system according to claim 1, characterized in that, The internal base plate of the rack chassis is equipped with pre-embedded fixing nuts for installing the rear circuit board and fixing external PCI-E modules of different sizes.

7. The external PCI-E module system according to claim 1, characterized in that, The rear panel of the rack-mounted chassis is equipped with a chassis lock, which works in conjunction with the chassis cover to open or lock the chassis.

8. The external PCI-E module system according to claim 1, characterized in that, The rack-mount chassis is equipped with a cooling fan, and the left and right side walls of the rack-mount chassis are provided with perforated heat dissipation channels.

9. The external PCI-E module system according to claim 1, characterized in that, The standard PCI-E slot on the rear circuit board is inserted in a direction parallel to the bottom surface of the rack-mount chassis to support the installation of full-height or half-height external PCI-E modules within the rack-mount chassis.

10. The external PCI-E module system according to claim 1, characterized in that, The rack-mount chassis is a standard rack-mount structure with a height of 1U and a width of 19 inches. The rack-mount chassis directly obtains power from the server's internal power supply through the power cable to achieve synchronization of the power-on and power-off timing between the external PCI-E module and the server host.

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