Photovoltaic module and method and apparatus for manufacturing the same

Abstract

The application relates to a photovoltaic module and a preparation method and a preparation device thereof. The photovoltaic module comprises a cover plate, at least one cell string and an adhesive film, the adhesive film is located between the cover plate and the cell string, and the cover plate is connected with the cell string through the adhesive film; the adhesive film comprises a first sublayer, a second sublayer and a third sublayer which are arranged in layers; the first sublayer is located between the second sublayer and the cover plate, and the third sublayer is located between the second sublayer and the cell string; the first sublayer comprises a first base material layer and an ultraviolet absorber, the ultraviolet absorber is dispersed in the first base material layer, the ultraviolet absorber comprises at least one of a thermal quantum dot and an organic metal framework compound; the second sublayer comprises a second base material layer; and the third sublayer comprises a third base material layer and a microcapsule, the microcapsule is dispersed in the third base material layer, the microcapsule comprises a hot-melt shell and a repairing agent, and the repairing agent is filled in the interior of the hot-melt shell.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to photovoltaic modules and their preparation methods and equipment. Background Technology

[0002] Photovoltaic modules are the core components of solar power systems, achieving photoelectric conversion through the photovoltaic effect. A photovoltaic module typically includes photovoltaic cells, encapsulating films, and photovoltaic glass. Traditional photovoltaic modules experience significant UV degradation during use, meaning that direct ultraviolet light exposure to the cell surface causes a noticeable decline in cell performance. Some solar cells employ UV reflectors to reduce UV-induced performance degradation. However, these methods offer limited improvement in the UV resistance of photovoltaic modules and can also easily lead to a decrease in the initial efficiency of the module. Summary of the Invention

[0003] Therefore, it is necessary to provide a photovoltaic module and its preparation method and equipment. The photovoltaic module of this application can achieve good UV resistance while maintaining the initial efficiency of the photovoltaic module.

[0004] In a first aspect, this application provides a photovoltaic module, comprising: a cover plate, at least one battery string, and an encapsulating film, wherein the encapsulating film is located between the cover plate and the battery string, and the cover plate is connected to the battery string through the encapsulating film;

[0005] The adhesive film includes a first sublayer, a second sublayer, and a third sublayer stacked together; the first sublayer is located between the second sublayer and the cover plate, and the third sublayer is located between the second sublayer and the battery string;

[0006] The first sublayer includes a first substrate layer and an ultraviolet absorber, wherein the ultraviolet absorber is dispersed in the first substrate layer, and the ultraviolet absorber includes at least one of thermal sub-points and organometallic framework compounds;

[0007] The second sublayer includes a second substrate layer;

[0008] The third sublayer includes a third substrate layer and microcapsules. The microcapsules are dispersed in the third substrate layer. Each microcapsule includes a heat-fusible shell and a repair agent. The repair agent fills the interior of the heat-fusible shell. The repair agent includes at least one of a liquid repair agent and a gaseous repair agent. The gaseous repair agent includes an organosilane monomer, and the liquid repair agent includes an epoxy prepolymer.

[0009] In some embodiments, the melting temperature of the thermofusible shell is 150°C to 160°C.

[0010] In some embodiments, the thermal quantum dots include at least one of CdSe quantum dots, ZnS quantum dots, and CsPbBr3 quantum dots.

[0011] In some embodiments, the organometallic framework compound includes at least one of UiO-66 and MIL-125.

[0012] In some embodiments, the ultraviolet absorber accounts for 1% to 3% of the mass percentage of the first sublayer.

[0013] In some embodiments, the repair agent includes at least one of a liquid repair agent and a gaseous repair agent, the gaseous repair agent including an organosilane monomer, and the liquid repair agent including an epoxy prepolymer; the material of the thermofusible shell includes at least one of paraffin wax and polyurethane.

[0014] In some embodiments, the microcapsules have a particle size of 5 μm to 20 μm.

[0015] In some embodiments, the microcapsules constitute 3% to 5% of the mass of the third sublayer.

[0016] In some embodiments, the thickness of the thermoplastic shell is 0.5 μm to 1 μm.

[0017] In some embodiments, the materials of the first substrate layer, the second substrate layer, and the third substrate layer each independently include at least one of EVA and POE.

[0018] In some embodiments, the thickness of the first sublayer is 80 μm to 120 μm.

[0019] In some embodiments, the thickness of the second sublayer is 100 μm to 150 μm.

[0020] In some embodiments, the thickness of the third sublayer is 60 μm to 100 μm.

[0021] Secondly, this application provides a method for preparing a photovoltaic module, comprising the following steps:

[0022] A third sublayer, a second sublayer, and a first sublayer are sequentially stacked on the surface of a battery string. The first sublayer includes a first substrate layer and an ultraviolet absorber, wherein the ultraviolet absorber is dispersed in the first substrate layer and the ultraviolet absorber includes at least one of a thermal sub-point and an organometallic framework compound. The second sublayer includes a second substrate layer. The third sublayer includes a third substrate layer and microcapsules, wherein the microcapsules are dispersed in the third substrate layer and the microcapsules include a heat-fusible shell and a repair agent, wherein the repair agent fills the interior of the heat-fusible shell.

[0023] A cover plate is placed on the surface of the first sub-layer opposite to the battery string to obtain a pre-finished product;

[0024] The pre-finished product is laminated to form an adhesive film layer from the first sub-layer, the second sub-layer, and the third sub-layer. The cover plate is connected to the battery string through the adhesive film.

[0025] Thirdly, this application provides a photovoltaic module manufacturing apparatus, comprising:

[0026] A film-setting device is used to sequentially deposit a third sublayer, a second sublayer, and a first sublayer on the surface of a battery string; the first sublayer includes a first substrate layer and an ultraviolet absorber, the ultraviolet absorber being dispersed in the first substrate layer, the ultraviolet absorber including at least one of a thermal sub-point and an organometallic framework compound; the second sublayer includes a second substrate layer; the third sublayer includes a third substrate layer and microcapsules, the microcapsules being dispersed in the third substrate layer, the microcapsules including a heat-fusible shell and a repair agent, the repair agent filling the interior of the heat-fusible shell;

[0027] A cover plate setting device is used to set a cover plate on the surface of the first sub-layer opposite to the battery string to obtain a pre-finished product;

[0028] A lamination device is used to laminate the pre-finished product to form an adhesive film layer from the first sub-layer, the second sub-layer, and the third sub-layer, and the cover plate is connected to the battery string through the adhesive film.

[0029] The aforementioned photovoltaic module employs a film connecting the cover plate and the cell string, comprising a first sublayer, a second sublayer, and a third sublayer stacked together. The first sublayer, located near the cover plate, includes an ultraviolet absorber; the third sublayer, located near the cell string, includes microcapsules; and the second sublayer, situated between the first and second sublayers, serves as a transitional connecting layer. When the photovoltaic module is exposed to ultraviolet light during use, the heat-absorbing particles or metal-organic framework compounds in the first sublayer act as ultraviolet absorbers, converting the ultraviolet light into heat energy. When this heat is transferred to the third sublayer, it causes the thermofusible shell of the microcapsules to melt and rupture, releasing the repair agent within. This repair agent diffuses to the surface of the cell string, enabling in-situ passivation repair of dangling bonds and microscopic defects on the cell surface. This improves the UV resistance of the photovoltaic module while also providing active repair to enhance its initial efficiency. In other words, the photovoltaic module of this application achieves good UV resistance while maintaining good initial efficiency. Attached Figure Description

[0030] Figure 1 A partial structural schematic diagram of a photovoltaic module provided in one embodiment of this application;

[0031] Figure 2 This is a schematic diagram of the structure of a photovoltaic module provided in one embodiment of this application.

[0032] Explanation of reference numerals in the attached figures:

[0033] 10-Battery string; 20-Adhesive film; 21-First sublayer; 22-Second sublayer; 23-Third sublayer; 30-Cover plate; 40-Adhesive layer; 50-Backplate. Detailed Implementation

[0034] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, a detailed description of specific embodiments of this application is provided below. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0036] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0037] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0038] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0039] In the accompanying drawings, the thicknesses of layers, films, regions, substrates, etc., are exaggerated for clarity. Throughout the specification, the same reference numerals refer to the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it may be directly on the other element or there may be intervening elements. Conversely, when an element is referred to as being "directly on" another element, there are no intervening elements.

[0040] Reference Figure 1As shown, one embodiment of this application provides a photovoltaic module, including: a cover plate 30, at least one cell string 10, and an encapsulating film 20. The encapsulating film 20 is located between the cover plate 30 and the cell string 10, and the cover plate 30 is connected to the cell string 10 through the encapsulating film 20. The encapsulating film 20 includes a first sublayer 21, a second sublayer 22, and a third sublayer 23 stacked together. The first sublayer 21 is located between the second sublayer 22 and the cover plate 30, and the third sublayer 23 is located between the second sublayer 22 and the cell string 10. The first sublayer 21 includes a first substrate layer and a UV layer. An ultraviolet absorber is dispersed in a first substrate layer, and the ultraviolet absorber includes at least one of thermal sub-dots and organometallic framework compounds; a second sub-layer 22 includes a second substrate layer; a third sub-layer 23 includes a third substrate layer and microcapsules, the microcapsules being dispersed in the third substrate layer, the microcapsules including a heat-fusible shell and a repair agent, the repair agent filling the interior of the heat-fusible shell; the repair agent includes at least one of a liquid repair agent and a gaseous repair agent, the gaseous repair agent including an organosilane monomer, and the liquid repair agent including an epoxy prepolymer.

[0041] In the aforementioned photovoltaic module, a film 20 comprising a first sublayer 21, a second sublayer 22, and a third sublayer 23 is used to connect the cover plate 30 and the cell string 10. The first sublayer 21 is located near the cover plate 30 and includes an ultraviolet absorber; the third sublayer 23 is located near the cell string 10 and includes microcapsules; and the second sublayer 22 is located between the first and second sublayers 21 as a transition layer. When the photovoltaic module is exposed to ultraviolet light during use, the heat-absorbing particles or metal-organic framework compounds in the first sublayer 21 act as ultraviolet absorbers, absorbing ultraviolet light and converting it into heat energy. When this heat is transferred to the third sublayer 23, it causes the thermofusible shell of the microcapsules to melt and rupture, releasing the repair agent inside. This repair agent diffuses to the surface of the cell string 10, enabling in-situ passivation repair of dangling bonds and microscopic defects on the cell surface. This improves the UV resistance of the photovoltaic module and also allows for active repair, thereby increasing the initial efficiency of the photovoltaic module. That is, the photovoltaic module of this application can achieve good UV resistance while taking into account the initial efficiency of the photovoltaic module.

[0042] In some embodiments, the melting temperature of the thermofusible shell is 150°C to 160°C.

[0043] Within the aforementioned melting temperature range of the thermoplastic shell, the thermoplastic shell is easily melted by the heat emitted by the UV absorber. If the melting temperature of the thermoplastic shell is too high, it will be difficult to melt. If the melting temperature of the thermoplastic shell is too low, it will easily melt during the lamination process, leading to the loss of the repair agent and thus affecting the UV resistance performance of the photovoltaic module. Optionally, the melting temperature of the thermoplastic shell is 150℃, 151℃, 152℃, 153℃, 154℃, 155℃, 156℃, 157℃, 158℃, 159℃, or 160℃, or the melting temperature of the thermoplastic shell can be within the range between any two of the above melting temperatures.

[0044] In some embodiments, the thermal quantum dots include at least one of CdSe quantum dots, ZnS quantum dots, and CsPbBr3 quantum dots; the organometallic framework compound includes at least one of UiO-66 and MIL-125.

[0045] In some of these implementations, the thermal sub-dots have a core-shell structure.

[0046] In some embodiments, the particle size of the thermal sub-dots is 5 nm to 10 nm.

[0047] Optionally, the particle size of the thermal sub-dots is 5nm, 6nm, 7nm, 8nm, 9nm or 10nm, or the particle size of the thermal sub-dots can be within the range of any two of the above particle sizes.

[0048] In some embodiments, the organometallic framework compound is a porous crystal.

[0049] In some embodiments, the pore size of the organometallic framework compound is 0.8 nm to 1.2 nm.

[0050] Optionally, the pore size of the organometallic framework compound is 0.8 nm, 0.85 nm, 0.9 nm, 0.95 nm, 1 nm, 1.05 nm, 1.1 nm, 1.15 nm or 1.2 nm, or the pore size of the organometallic framework compound may be within the range of any two of the above pore sizes.

[0051] In some embodiments, the particle size of the organometallic framework compound is 100 nm to 500 nm.

[0052] Optionally, the particle size of the organometallic framework compound is 100 nm, 150 nm, 200 nm, 250 nm, 300 nm, 350 nm, 400 nm, 450 nm or 500 nm, or the particle size of the organometallic framework compound may be within the range of any two of the above particle sizes.

[0053] In some embodiments, the ultraviolet absorber accounts for 1% to 3% of the mass percentage of the first sublayer 21.

[0054] When the mass percentage of the UV absorber in the first sublayer 21 is too low, the improvement in the UV resistance performance of the photovoltaic module is not significant. When the mass percentage of the UV absorber in the first sublayer 21 is too high, it may affect the light transmittance of the encapsulant film 20, thereby affecting the initial efficiency of the photovoltaic module. Within the aforementioned range of the mass percentage of the UV absorber in the first sublayer 21, it is easier to achieve good UV resistance performance while also considering the initial efficiency of the photovoltaic module. Optionally, the mass percentage of the UV absorber in the first sublayer 21 can be 1%, 1.2%, 1.4%, 1.6%, 1.8%, 2%, 2.2%, 2.4%, 2.6%, 2.8%, or 3%, or the mass percentage of the UV absorber in the first sublayer 21 can also be within any two of the above percentages.

[0055] In some embodiments, the repair agent includes at least one of a liquid repair agent and a gaseous repair agent, wherein the gaseous repair agent includes an organosilane monomer and the liquid repair agent includes an epoxy prepolymer; the material of the heat-fusible shell includes at least one of paraffin wax and polyurethane.

[0056] In some embodiments, the microcapsules have a particle size of 5 μm to 20 μm.

[0057] Within the aforementioned microcapsule particle size range, the microcapsules achieve better dispersion in the third sublayer 23. Simultaneously, this reduces the impact of the microcapsules on the light transmittance of the film 20. Optionally, the microcapsule particle size can be 5 μm, 8 μm, 10 μm, 12 μm, 15 μm, 18 μm, or 20 μm, or the microcapsule particle size can be within any two of the aforementioned ranges.

[0058] In some embodiments, the microcapsules constitute 3% to 5% of the mass of the third sublayer 23.

[0059] When the mass percentage of microcapsules in the third sublayer 23 is too low, the in-situ passivation repair effect on dangling bonds and microscopic defects on the cell surface is not significant. When the mass percentage of microcapsules in the third sublayer 23 is too high, it may affect the light transmittance of the encapsulant film 20, thereby affecting the initial efficiency of the photovoltaic module. Within the aforementioned range of the mass percentage of microcapsules in the third sublayer 23, it is convenient to achieve good UV resistance while taking into account the initial efficiency of the photovoltaic module. Optionally, the mass percentage of microcapsules in the third sublayer 23 can be 3%, 3.2%, 3.4%, 3.6%, 3.8%, 4%, 4.2%, 4.4%, 4.6%, 4.8%, or 5%, or the mass percentage of microcapsules in the third sublayer 23 can also be within the range of any two of the above percentages.

[0060] In some embodiments, the thickness of the heat-fusible shell is 0.5 μm to 1 μm.

[0061] Optionally, the thickness of the heat-fusible shell is 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm or 1 μm, or the thickness of the heat-fusible shell may be within any two of the above thicknesses.

[0062] In some embodiments, the materials of the first substrate layer, the second substrate layer, and the third substrate layer each independently include at least one of EVA and POE.

[0063] In some embodiments, the thickness of the first sublayer 21 is 80 μm to 120 μm.

[0064] Optionally, the thickness of the first sublayer 21 is 80μm, 85μm, 90μm, 95μm, 100μm, 105μm, 110μm, 115μm or 120μm, or the thickness of the first sublayer 21 may be within any two of the above thicknesses.

[0065] In some embodiments, the thickness of the second sublayer 22 is 100 μm to 150 μm.

[0066] Optionally, the thickness of the second sublayer 22 is 100μm, 105μm, 110μm, 115μm, 120μm, 125μm, 130μm, 135μm, 140μm, 145μm or 150μm, or the thickness of the second sublayer 22 may be within any two of the above thicknesses.

[0067] In some embodiments, the thickness of the third sublayer 23 is 60 μm to 100 μm.

[0068] Optionally, the thickness of the third sublayer 23 is 60μm, 65μm, 70μm, 75μm, 80μm, 85μm, 90μm, 95μm or 100μm, or the thickness of the third sublayer 23 may be within the range of any two of the above thicknesses.

[0069] Reference Figure 2 As shown, in some embodiments, the photovoltaic module further includes a backsheet 50 and an adhesive layer 40, the adhesive layer 40 being located between the backsheet 50 and the battery string 10, the backsheet 50 being connected to the battery string 10 via the adhesive layer 40; the adhesive layer 40 being disposed on the surface of the battery string 10 facing away from the adhesive film 20.

[0070] Another embodiment of this application provides a method for preparing a photovoltaic module, comprising the following steps:

[0071] A third sublayer 23, a second sublayer 22, and a first sublayer 21 are sequentially stacked on the surface of the battery string 10. The first sublayer 21 includes a first substrate layer and an ultraviolet absorber, the ultraviolet absorber being dispersed in the first substrate layer, and the ultraviolet absorber including at least one of thermal electrons and an organometallic framework compound. The second sublayer 22 includes a second substrate layer. The third sublayer 23 includes a third substrate layer and microcapsules, the microcapsules being dispersed in the third substrate layer, the microcapsules including a heat-fusible shell and a repair agent, and the repair agent filling the interior of the heat-fusible shell.

[0072] A cover plate 30 is provided on the surface of the first sub-layer 21 opposite to the battery string 10 to obtain a pre-finished product;

[0073] The pre-finished product is laminated to form a film 20 layer consisting of the first sub-layer 21, the second sub-layer 22, and the third sub-layer 23. The cover plate 30 is connected to the battery string 10 through the film 20.

[0074] In some embodiments, the lamination process is controlled at a temperature lower than the melting temperature of the thermofusible shell.

[0075] Another embodiment of this application provides a photovoltaic module manufacturing apparatus, comprising:

[0076] The adhesive film 20 setting device is used to sequentially set a third sub-layer 23, a second sub-layer 22, and a first sub-layer 21 on the surface of the battery string 10; the first sub-layer 21 includes a first substrate layer and an ultraviolet absorber, the ultraviolet absorber being dispersed in the first substrate layer, the ultraviolet absorber including at least one of thermal electrons and an organometallic framework compound; the second sub-layer 22 includes a second substrate layer; the third sub-layer 23 includes a third substrate layer and microcapsules, the microcapsules being dispersed in the third substrate layer, the microcapsules including a heat-fusible shell and a repair agent, the repair agent filling the interior of the heat-fusible shell;

[0077] The cover plate 30 setting device sets the cover plate 30 on the surface of the first sub-layer 21 opposite to the battery string 10 to obtain a pre-finished product;

[0078] The lamination device is used to laminate the pre-finished product, so that the first sub-layer 21, the second sub-layer 22 and the third sub-layer 23 form a film 20 layer, and the cover plate 30 is connected to the battery string 10 through the film 20.

[0079] The following are specific examples:

[0080] Example 1

[0081] In Example 1, the photovoltaic module consists of, from bottom to top, a backsheet 50, an EVA adhesive layer 40, a TOPCon cell string 10, a third sublayer 23, a second sublayer 22, a first sublayer 21, and a glass cover 30. The third sublayer 23 is made of POE substrate, with microcapsules dispersed within it. The microcapsules comprise 4% of the mass of the third sublayer 23, have a particle size of 10 μm, a heat-fusible shell made of paraffin wax with a thickness of 0.8 μm, and a repair agent made of organosilane monomers. The thickness of the third sublayer 23 is 80 μm. The second sublayer 22 is made of EVA with a thickness of 120 μm. The first sublayer 21 is made of EVA substrate, with ultraviolet absorbers dispersed within it. The ultraviolet absorbers comprise 2% of the mass of the first sublayer 21, are CdSe quantum dots, and have a thickness of 100 μm.

[0082] Example 2

[0083] The structure of the photovoltaic module in Example 2 is roughly the same as that in Example 1, except that the ultraviolet absorber is a UiO-66 organometallic framework compound.

[0084] Example 3

[0085] The structure of the photovoltaic module in Example 3 is roughly the same as that in Example 1, except that the microcapsules account for 3% of the mass of the third sublayer 23 and the ultraviolet absorber accounts for 1% of the mass of the first sublayer 21.

[0086] Example 4

[0087] The structure of the photovoltaic module in Example 4 is roughly the same as that in Example 1, except that the microcapsules account for 5% of the mass of the third sublayer 23 and the ultraviolet absorber accounts for 3% of the mass of the first sublayer 21.

[0088] Example 5

[0089] The structure of the photovoltaic module in Example 5 is roughly the same as that in Example 1, except that the microcapsules account for 4.5% of the mass of the third sublayer 23 and the ultraviolet absorber accounts for 2.5% of the mass of the first sublayer 21.

[0090] Comparative Example 1

[0091] The structure of the photovoltaic module in Comparative Example 1 is roughly the same as that in Example 1, except that only EVA film 20 is used between the glass cover 30 and the battery string 10.

[0092] Comparative Example 2

[0093] The structure of the photovoltaic module in Comparative Example 2 is roughly the same as that in Example 1, except that it does not have a first sublayer 21.

[0094] Comparative Example 3

[0095] The structure of the photovoltaic module in Comparative Example 3 is roughly the same as that in Example 1, except that it does not have a third sublayer 23.

[0096] Comparative Example 4

[0097] The structure of the photovoltaic module in Comparative Example 4 is roughly the same as that in Example 1, except that the third sublayer 23 is a POE substrate without microcapsules.

[0098] Photovoltaic performance and UV resistance performance were tested on the photovoltaic modules in Examples 1-5 and Comparative Examples 1-4. The conditions and methods for the UV resistance performance test are as follows:

[0099] 1. Testing equipment: UV aging test chamber.

[0100] 2. Testing standard: Refer to the "UV pretreatment test" in IEC 61215 standard and strengthen it.

[0101] 3. Test conditions:

[0102] Ultraviolet light source: UVA-340 lamp tube, spectral range 295-365nm.

[0103] Test duration: 1000 hours in total.

[0104] Loop condition: Use an 8-hour loop.

[0105] Irradiation period (4h): Maintained at a constant temperature of 60℃ with a constant W / m². 2 @340nm ultraviolet irradiance.

[0106] Condensation section (4h): Turn off the UV lamps, maintain the temperature at 50℃, and keep the relative humidity inside the chamber at 85% to form condensation on the surface of the components.

[0107] Test samples: For each set of examples and comparative examples, at least 3 miniature components of standard size (e.g., 156mm × 156mm) were prepared, and the average value was taken.

[0108] 4. Testing Procedure:

[0109] Before testing, a solar simulator was used under standard test conditions (STC: 25℃, AM1.5G, 1000W / m²). 2 The initial values ​​of the photoelectric performance of all components were measured.

[0110] Place the components in an aging chamber and run the above cycle for a total of 1000 hours.

[0111] After the test, the component was removed and allowed to rest in a standard environment for 24 hours before its photoelectric performance was measured again.

[0112] Efficiency decay rate (%) = (initial efficiency - aging efficiency) / initial efficiency × 100%.

[0113] The test results are shown in the table below:

[0114]

[0115] Test Result Analysis:

[0116] Comparing the test results of each embodiment and comparative example, the overall efficiency degradation rate of the photovoltaic modules in Embodiments 1 to 5 is better than that of the photovoltaic modules in Comparative Examples 1 to 4, indicating that the photovoltaic modules of this application can achieve better UV resistance. Specifically, Comparative Example 2 lacks the first sublayer 21, resulting in severe degradation, proving that the UV absorption layer is the first line of defense against light-induced degradation. Comparative Example 3 lacks the third sublayer 23, and Comparative Example 4 lacks self-healing function: the degradation rate of Comparative Example 4 is 2.99%, significantly higher than the 0.96% of Embodiment 1, indicating that self-healing function, and not just POE material, is crucial for resisting performance degradation caused by hygrothermal stress. Comparative Example 3 experiences even more severe degradation due to the absence of POE's better moisture barrier properties.

[0117] Comparing the test structures of each embodiment, it can be seen that the low concentration in Embodiment 3 is insufficient in protection, the high concentration in Embodiment 4 may result in poor performance due to aggregation or decreased light transmittance, and Embodiments 1 and 5 show the best balance.

[0118] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0119] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims, and the specification and drawings can be used to interpret the content of the claims.

Claims

1. A photovoltaic module, characterized in that, include: The package includes a cover plate, at least one battery string, and an adhesive film located between the cover plate and the battery string, with the cover plate connected to the battery string via the adhesive film. The adhesive film includes a first sublayer, a second sublayer, and a third sublayer stacked together; the first sublayer is located between the second sublayer and the cover plate, and the third sublayer is located between the second sublayer and the battery string; The first sublayer includes a first substrate layer and an ultraviolet absorber, wherein the ultraviolet absorber is dispersed in the first substrate layer, and the ultraviolet absorber includes at least one of thermal sub-points and organometallic framework compounds; The second sublayer includes a second substrate layer; The third sublayer includes a third substrate layer and microcapsules. The microcapsules are dispersed in the third substrate layer. Each microcapsule includes a heat-fusible shell and a repair agent. The repair agent fills the interior of the heat-fusible shell. The repair agent includes at least one of a liquid repair agent and a gaseous repair agent. The gaseous repair agent includes an organosilane monomer, and the liquid repair agent includes an epoxy prepolymer.

2. The photovoltaic module according to claim 1, characterized in that, The melting temperature of the thermofusible shell is 150℃~160℃.

3. The photovoltaic module according to claim 2, characterized in that, The thermal quantum dots include at least one of CdSe quantum dots, ZnS quantum dots, and CsPbBr3 quantum dots; and / or, The organometallic framework compound includes at least one of UiO-66 and MIL-125.

4. The photovoltaic module according to claim 1, characterized in that, The ultraviolet absorber accounts for 1% to 3% of the mass percentage of the first sublayer.

5. The photovoltaic module according to claim 1, characterized in that, The material of the thermofusible shell includes at least one of paraffin and polyurethane.

6. The photovoltaic module according to claim 1, characterized in that, The microcapsules have a particle size of 5 μm to 20 μm; and / or, the microcapsules account for 3% to 5% of the mass of the third sublayer; and / or, the thickness of the thermofusible shell is 0.5 μm to 1 μm.

7. The photovoltaic module according to any one of claims 1 to 6, characterized in that, The materials of the first substrate layer, the second substrate layer, and the third substrate layer each independently include at least one of EVA and POE.

8. The photovoltaic module according to any one of claims 1 to 6, characterized in that, The thickness of the first sublayer is 80 μm to 120 μm; and / or, The thickness of the second sublayer is 100μm~150μm; And / or, The thickness of the third sublayer is 60μm~100μm.

9. A method for manufacturing a photovoltaic module, characterized in that, Includes the following steps: A third sublayer, a second sublayer, and a first sublayer are sequentially stacked on the surface of a battery string. The first sublayer includes a first substrate layer and an ultraviolet absorber, wherein the ultraviolet absorber is dispersed in the first substrate layer and includes at least one of a thermal sub-point and an organometallic framework compound. The second sublayer includes a second substrate layer. The third sublayer includes a third substrate layer and microcapsules, wherein the microcapsules are dispersed in the third substrate layer and each microcapsule includes a heat-fusible shell and a repair agent, wherein the repair agent fills the interior of the heat-fusible shell. The repair agent includes at least one of a liquid repair agent and a gaseous repair agent, wherein the gaseous repair agent includes an organosilane monomer and the liquid repair agent includes an epoxy prepolymer. A cover plate is placed on the surface of the first sub-layer opposite to the battery string to obtain a pre-finished product; The pre-finished product is laminated to form an adhesive film layer from the first sub-layer, the second sub-layer, and the third sub-layer. The cover plate is connected to the battery string through the adhesive film.

10. A photovoltaic module manufacturing apparatus, characterized in that, include: A film setting device is used to sequentially set a third sublayer, a second sublayer, and a first sublayer on the surface of a battery string; The first sublayer includes a first substrate layer and an ultraviolet absorber, wherein the ultraviolet absorber is dispersed in the first substrate layer, and the ultraviolet absorber includes at least one of thermal sub-points and organometallic framework compounds; the second sublayer includes a second substrate layer; the third sublayer includes a third substrate layer and microcapsules, wherein the microcapsules are dispersed in the third substrate layer, and the microcapsules include a heat-fusible shell and a repair agent, wherein the repair agent fills the interior of the heat-fusible shell; the repair agent includes at least one of a liquid repair agent and a gaseous repair agent, wherein the gaseous repair agent includes an organosilane monomer, and the liquid repair agent includes an epoxy prepolymer; A cover plate setting device is used to set a cover plate on the surface of the first sub-layer opposite to the battery string to obtain a pre-finished product; A lamination device is used to laminate the pre-finished product to form an adhesive film layer from the first sub-layer, the second sub-layer, and the third sub-layer, and the cover plate is connected to the battery string through the adhesive film.

Images