Preparation method of double-layer Z-block assembly and double-layer Z-block assembly

Abstract

The invention provides a preparation method of a double-layer Z-block assembly and the double-layer Z-block assembly. The method comprises the following steps: preparing a first Z-block body and a second Z-block body; preparing a plurality of filters, and carrying out film coating treatment on the plurality of filters; a plurality of filters are assembled on the first Z-block body and the second Z-block body; performing stacking and low-temperature bonding processing on the first Z-block body and the second Z-block body to obtain a double-layer Z-block body; and a micro lens array is integrated on the double-layer Z-block body, and the double-layer Z-block body is packaged, so that the double-layer Z-block assembly is obtained. According to the double-layer Z-block assembly provided by the embodiment of the invention, the limitation of four channels of a single-layer Z-block assembly is broken through; the double-layer Z-block assembly is designed in an integrated stacking manner, so that the integration level is greatly improved; according to the double-layer Z-block assembly provided by the embodiment of the invention, the plurality of filters are subjected to film coating treatment, so that the double-layer Z-block assembly has the characteristics of low optical loss and excellent transmission performance; according to the embodiment of the invention, independent multi-dimensional adjustment is not needed, so that the assembly process is reduced, and the yield is improved.

Description

Technical Field

[0001] This application relates to the field of optical communication technology, and in particular to a method for fabricating a dual-layer Z-block component. Background Technology

[0002] The Z-block component is the core optical device in the optical module. Through the combination of filters mounted on the inner wall of the inclined cavity, and the coated reflective and anti-reflective films, it forms a Z-shaped optical path by utilizing the principles of light refraction and reflection. This enables the screening and separation / merging of optical signals of different wavelengths, and is a key component in the optical module to realize multi-channel optical signal transmission.

[0003] Currently, the mainstream Z-block components in the industry are all single-layer structures with a single-clinometer glass block design, which can only achieve wavelength division processing for a maximum of 4 channels. Due to structural limitations, they suffer from technical problems such as limited channel count, low integration, complex assembly, and high optical loss in practical applications. Summary of the Invention

[0004] This application provides a method for fabricating a dual-layer Z-block component, aiming to solve the technical problems of existing single-layer Z-block components, such as limited channel number, low integration, complex assembly, and high optical loss.

[0005] In a first aspect, embodiments of this application provide a method for fabricating a dual-layer Z-block component, characterized in that the method includes:

[0006] Prepare the first Z-block body and the second Z-block body;

[0007] Multiple filter elements are prepared, and the multiple filter elements are coated.

[0008] The plurality of filters are assembled on the first Z-block body and the second Z-block body;

[0009] The first Z-block body and the second Z-block body are stacked and low-temperature bonded to obtain a double-layer Z-block body;

[0010] A microlens array is integrated on the dual-layer Z-block body, and the dual-layer Z-block body is encapsulated to obtain a dual-layer Z-block component.

[0011] Optionally, the preparation of the first Z-block body and the second Z-block body includes:

[0012] Optical glass is processed through cutting, grinding, and polishing to obtain a first Z-block blank and a second Z-block blank.

[0013] A double-layer oblique cavity was machined on the first Z-block blank and the second Z-block blank using laser etching process, and the surface of the oblique cavity was polished.

[0014] An anti-reflective film is deposited on the incident and exit surfaces of the first and second Z-block blanks, and a high-reflective film is deposited on the inner wall of the inclined cavity of the first and second Z-block blanks to obtain the first Z-block body and the second Z-block body.

[0015] Optionally, the preparation of multiple filter elements and the coating treatment of the multiple filter elements include:

[0016] Optical glass is processed using a cutting process to obtain multiple filters;

[0017] A wavelength division multiplexing film is deposited on one side of each filter using a magnetron sputtering process, and an antireflection film is deposited on the other side of each filter.

[0018] The wavelength division multiplexing (WDM) film exhibits a coating uniformity of ≥95% for wavelengths of 1271 nm, 1291 nm, 1311 nm, 1331 nm, 1351 nm, 1371 nm, 1391 nm, and 1411 nm.

[0019] Optionally, assembling the plurality of filters on the first Z-block body and the second Z-block body includes:

[0020] Multiple coated filters are attached to the inclined cavity inner walls of the first Z-block body and the second Z-block body at a preset spacing.

[0021] An optical adhesive is applied between adjacent filters to form an optical adhesive layer;

[0022] The first Z-block body and the second Z-block body with the attached filter are placed in a vacuum curing oven for curing.

[0023] Optionally, before performing the stacking and low-temperature bonding process on the first Z-block body and the second Z-block body, the method further includes:

[0024] A positioning boss is machined at the center of the upper surface of the first Z-block body using laser etching technology;

[0025] A positioning groove matching the positioning boss is machined at the center of the lower surface of the second Z-block body using laser etching technology.

[0026] Optionally, the first Z-block body and the second Z-block body are stacked, including:

[0027] An optical isolation layer is attached to the upper surface of the first Z-block body;

[0028] The second Z-block body is aligned with the positioning boss and the positioning groove, and covered above the chemical isolation layer to achieve the stacking arrangement between the first Z-block body and the second Z-block body;

[0029] The second Z-block body is disposed above the first Z-block body.

[0030] Optionally, integrating a microlens array on the dual-layer Z-block body includes:

[0031] The microlens array is bonded to the incident and exit surfaces of the double-layer Z-block body using optical adhesive;

[0032] The microlens array is integrated on the double-layer Z-block body by curing it in a vacuum environment at 60°C for 1 hour.

[0033] Optionally, the encapsulation of the dual-layer Z-block body to obtain a dual-layer Z-block component includes:

[0034] The dual-layer Z-block body is installed in a packaging shell, and an anti-static silicone buffer layer is filled inside the packaging shell;

[0035] The performance of the encapsulated dual-layer Z-block body was tested, and the test results were generated.

[0036] If the test results meet the preset conditions, a dual-layer Z-block component is obtained.

[0037] Optionally, the preset conditions include:

[0038] The insertion loss of a single channel of the encapsulated dual-layer Z-block body is less than or equal to 0.5 dB, and the average insertion loss of the 8 channels of the encapsulated dual-layer Z-block body is less than or equal to 0.42 dB.

[0039] The return loss of the encapsulated double-layer Z-block body is greater than or equal to 45 dB.

[0040] The inter-channel crosstalk corresponding to the encapsulated double-layer Z-block body is less than or equal to -60 dB;

[0041] The coupling efficiency of the encapsulated dual-layer Z-block body is greater than or equal to 90%.

[0042] After the encapsulated dual-layer Z-block body underwent high and low temperature cycle testing in an environment of -40℃ to 85℃, the change in insertion loss was less than or equal to 0.1 dB.

[0043] Secondly, embodiments of this application provide a dual-layer Z-block component, which is prepared according to the preparation method of the dual-layer Z-block component described above.

[0044] This application provides a method for fabricating a dual-layer Z-block component and the dual-layer Z-block component. The method includes: fabricating a first Z-block body and a second Z-block body; fabricating multiple filters and performing a coating process on the multiple filters; assembling the multiple filters on the first Z-block body and the second Z-block body; stacking and low-temperature bonding the first Z-block body and the second Z-block body to obtain a dual-layer Z-block body; integrating a microlens array on the dual-layer Z-block body and encapsulating the dual-layer Z-block body to obtain a dual-layer Z-block component. The dual-layer Z-block component provided in this application overcomes the limitation of the single-layer Z-block component's 4 channels. The dual-layer Z-block component in this application features an integrated stacked design, eliminating the need to splice multiple single-layer components and significantly improving integration. The dual-layer Z-block component in this application coats multiple filters to minimize interface reflection and material absorption loss, resulting in low optical loss and excellent transmission performance. In this application, the independent rhomboid prism is eliminated, and the filters are integrated in a stepped manner, eliminating the need for separate multi-dimensional adjustments, reducing assembly steps, and improving yield. Attached Figure Description

[0045] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 This is a flowchart of a method for fabricating a dual-layer Z-block component provided in an embodiment of this application. Detailed Implementation

[0047] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0048] See Figure 1 , Figure 1 This is a flowchart illustrating a method for fabricating a dual-layer Z-block component according to an embodiment of this application, as shown below. Figure 1 As shown, the method includes the following steps:

[0049] Step 101: Prepare the first Z-block body and the second Z-block body.

[0050] Step 102: Prepare multiple filter sheets and perform coating treatment on the multiple filter sheets.

[0051] Step 103: Assemble the plurality of filters on the first Z-block body and the second Z-block body.

[0052] Step 104: Stack and low-temperature bonding process is performed on the first Z-block body and the second Z-block body to obtain a double-layer Z-block body.

[0053] Step 105: Integrate a microlens array on the dual-layer Z-block body and encapsulate the dual-layer Z-block body to obtain a dual-layer Z-block component.

[0054] It should be noted that the first Z-block body and the second Z-block body have the same structure and size. Both are flat block structures made of K9 optical glass, and each has a 45-degree double-layer inclined cavity on one side to form an independent 4-channel Z-shaped optical path.

[0055] Optionally, the dimensions of each layer of the first Z-block body and the second Z-block body are: 18 mm in length, 10 mm in width, and 2 mm in thickness.

[0056] It should be noted that the above-mentioned microlens array is a 2-row, 4-column circular microlens array made of optical glass. The microlenses have a diameter of 1 mm, a center-to-center distance of 2 mm, a focal length of 2 mm, and a coaxiality greater than or equal to -0.005 mm and less than or equal to 0.005 mm.

[0057] This application provides a method for fabricating a dual-layer Z-block component and the dual-layer Z-block component. The method includes: fabricating a first Z-block body and a second Z-block body; fabricating multiple filters and performing a coating process on the multiple filters; assembling the multiple filters on the first Z-block body and the second Z-block body; stacking and low-temperature bonding the first Z-block body and the second Z-block body to obtain a dual-layer Z-block body; integrating a microlens array on the dual-layer Z-block body and encapsulating the dual-layer Z-block body to obtain a dual-layer Z-block component. The dual-layer Z-block component provided in this application overcomes the limitation of the single-layer Z-block component's 4 channels. The dual-layer Z-block component in this application features an integrated stacked design, eliminating the need to splice multiple single-layer components and significantly improving integration. The dual-layer Z-block component in this application coats multiple filters to minimize interface reflection and material absorption loss, resulting in low optical loss and excellent transmission performance. In this application, the independent rhomboid prism is eliminated, and the filters are integrated in a stepped manner, eliminating the need for separate multi-dimensional adjustments, reducing assembly steps, and improving yield.

[0058] Optionally, the preparation of the first Z-block body and the second Z-block body includes:

[0059] Optical glass is processed through cutting, grinding, and polishing to obtain a first Z-block blank and a second Z-block blank.

[0060] A double-layer oblique cavity was machined on the first Z-block blank and the second Z-block blank using laser etching process, and the surface of the oblique cavity was polished.

[0061] An anti-reflective film is deposited on the incident and exit surfaces of the first and second Z-block blanks, and a high-reflective film is deposited on the inner wall of the inclined cavity of the first and second Z-block blanks to obtain the first Z-block body and the second Z-block body.

[0062] In this embodiment, high-purity K9 optical glass is selected and processed into a flat blank with a length of 18 mm, a width of 10 mm, and a thickness of 2 mm through precision cutting, grinding, and polishing. A 45-degree double oblique cavity is processed on one side of the blank using laser etching. The surface of the oblique cavity is polished to a roughness of less than or equal to Ra 0.02 micrometers. Optionally, an anti-reflective film is deposited on the incident and exit surfaces of the first and second Z-block bodies, and a high-reflective film is deposited on the inner wall of the oblique cavity, with the coating thickness error controlled within ±5 nanometers.

[0063] In other words, the first Z-block body and the second Z-block body have the same structure and size. Both are flat block structures made of K9 optical glass, with a 45-degree double oblique cavity on one side to form an independent 4-channel Z-shaped optical path.

[0064] In this embodiment, a stacked design of two Z-block bodies with 45-degree dual oblique cavities is adopted. Each Z-block body is an independent 4-channel structure, and the whole achieves 8-channel wavelength division processing, breaking through the channel number limitation. The two oblique cavities are precisely aligned, and the optical paths are parallel and do not cross. There is no need to splice multiple single-layer components, which greatly improves the integration.

[0065] In this embodiment, an anti-reflection film is deposited on the incident and exit surfaces of the first and second Z-block blanks, a high-reflection film is deposited on the inner wall of the inclined cavity, and an anti-reflection film is deposited on the interlayer isolation layer, thereby reducing the interface reflection loss of the optical signal from the source and reducing the overall insertion loss.

[0066] Optionally, the preparation of multiple filter elements and the coating treatment of the multiple filter elements include:

[0067] Optical glass is processed using a cutting process to obtain multiple filters;

[0068] A wavelength division multiplexing film is deposited on one side of each filter using a magnetron sputtering process, and an antireflection film is deposited on the other side of each filter.

[0069] The wavelength division multiplexing (WDM) film exhibits a coating uniformity of ≥95% for wavelengths of 1271 nm, 1291 nm, 1311 nm, 1331 nm, 1351 nm, 1371 nm, 1391 nm, and 1411 nm.

[0070] In this embodiment, K9 optical glass is selected as the substrate and cut into square filters with dimensions of 3 mm, 2 mm and 0.5 mm. A wavelength division multiplexing film is deposited on one side of the filter and an anti-reflection film is deposited on the other side using a magnetron sputtering process.

[0071] Optionally, assembling the plurality of filters on the first Z-block body and the second Z-block body includes:

[0072] Multiple coated filters are attached to the inclined cavity inner walls of the first Z-block body and the second Z-block body at a preset spacing.

[0073] An optical adhesive is applied between adjacent filters to form an optical adhesive layer;

[0074] The first Z-block body and the second Z-block body with the attached filter are placed in a vacuum curing oven for curing.

[0075] In this embodiment, four coated filter sheets are attached to the inclined cavity inner wall of the first Z-block body and the second Z-block body at a preset stepped spacing. Optionally, the spacing is 0.3 mm. High-transmittance optical adhesive is coated between adjacent filter sheets to form an optical adhesive layer 0.05 mm thick. The first Z-block body and the second Z-block body with the attached filter sheets are placed in a vacuum curing oven and cured at 80°C for 2 hours to achieve integrated bonding between the filter sheets and the body. After curing, no delamination or bubbles are found.

[0076] In this embodiment, four filters are mounted in a stepped manner along the optical path direction on the inner wall of the inclined cavity of each body layer. A 0.05 mm thick optical adhesive layer is formed by coating adjacent filters with high-transmittance optical adhesive, which is cured in a vacuum environment to achieve integrated bonding. Wavelength division multiplexing (WDM) films for different wavelengths are deposited on the incident side of the filters, and antireflection films are deposited on the transmission side. The independent rhomboid prism in the traditional structure is eliminated. The four filters of each Z-block body layer are mounted in a stepped manner along the inner wall of the inclined cavity, and adjacent filters are bonded by optical adhesive layers. One side of the filter is coated with a WDM film, and the other side is coated with an antireflection film, which reduces the use of core components and simplifies the coating and mounting processes.

[0077] Optionally, before performing the stacking and low-temperature bonding process on the first Z-block body and the second Z-block body, the method further includes:

[0078] A positioning boss is machined at the center of the upper surface of the first Z-block body using laser etching technology;

[0079] A positioning groove matching the positioning boss is machined at the center of the lower surface of the second Z-block body using laser etching technology.

[0080] In this embodiment, a semi-cylindrical positioning boss is machined at the center of the straight side on the upper surface of the first Z-block body using laser etching process, and a matching positioning groove is machined at the corresponding position on the lower surface of the second Z-block body. The dimensional error between the boss and the groove is greater than or equal to -0.001 mm and less than or equal to 0.001 mm.

[0081] It should be understood that the first Z-block body mentioned above is also called the lower Z-block body, and the second Z-block body is also called the upper Z-block body. The outer diameter of the positioning boss and the positioning groove mentioned above is 0.8 mm, the inner diameter is 0.78 mm, the height and depth are 0.2 mm, and the fitting accuracy is greater than or equal to -0.003 mm and less than or equal to 0.003 mm.

[0082] Optionally, the first Z-block body and the second Z-block body are stacked, including:

[0083] An optical isolation layer is attached to the upper surface of the first Z-block body;

[0084] The second Z-block body is aligned with the positioning boss and the positioning groove, and covered above the chemical isolation layer to achieve the stacking arrangement between the first Z-block body and the second Z-block body;

[0085] The second Z-block body is disposed above the first Z-block body.

[0086] Optionally, the aforementioned optical isolation layer is quartz glass with a thickness of 0.1 mm to 0.3 mm, preferably 0.2 mm, coated with antireflective film on both sides, and a transmittance of ≥99.8%.

[0087] In this embodiment, an interlayer optical isolation layer is tightly bonded to the upper surface of the first Z-block body. The second Z-block body is then precisely aligned with the positioning boss and groove, and placed over the isolation layer. By tightly bonding the isolation layer between the first and second Z-block bodies, the oblique cavity optical path area of ​​both layers is completely covered, achieving physical isolation of the upper and lower optical paths and lossless transmission of optical signals, thus avoiding interlayer crosstalk. Furthermore, the stacked double-layer structure is placed in a low-temperature bonding furnace and bonded at 120°C and a low vacuum of 10⁻³ Pa for 3 hours. After bonding, the bonding surface is found to be free of bubbles and cracks, and the bonding strength is greater than or equal to 50 MPa.

[0088] In this embodiment, matching semi-cylindrical positioning bosses and positioning grooves are designed on the flat sides of the two Z-block bodies to achieve rapid and accurate alignment of the two bodies. Then, a low-temperature bonding process is used to achieve seamless bonding. The bonding surface is free of bubbles and stress, ensuring the parallelism of the optical path and the stability of the structure.

[0089] Optionally, integrating a microlens array on the dual-layer Z-block body includes:

[0090] The microlens array is bonded to the incident and exit surfaces of the double-layer Z-block body using optical adhesive;

[0091] The microlens array is integrated on the double-layer Z-block body by curing it in a vacuum environment at 60°C for 1 hour.

[0092] In this embodiment, the microlens array is bonded to the incident and exit faces of the double-layer Z-block body using a high-transmittance optical adhesive. An optical alignment device is used to ensure that the coaxiality of the microlens array with the incident / exit ports of the optical path is greater than or equal to -0.005 mm and less than or equal to 0.005 mm. After bonding, the array is cured in a vacuum environment at 60°C for 1 hour to complete the integration of the microlens array.

[0093] Optionally, the above-mentioned microlens array is an array with an integrated incident end and an exit end. The microlens array is a 2-row, 4-column circular microlens array made of optical glass, with a diameter of 1 mm, a center-to-center distance of 2 mm, and a focal length of 2 mm.

[0094] In this embodiment, a 2-row, 4-column microlens array corresponding to the 8-channel optical path is set on the incident and exit surfaces of the dual-layer Z-block body. The array fits seamlessly with the end surfaces of the dual-layer Z-block body. The focal length of the microlens is precisely matched with the size of the active area of ​​the photodetector, without the need for separate adjustment. This achieves precise focusing and collimation of the optical signal, improving coupling efficiency and assembly yield.

[0095] Optionally, the encapsulation of the dual-layer Z-block body to obtain a dual-layer Z-block component includes:

[0096] The dual-layer Z-block body is installed in a packaging shell, and an anti-static silicone buffer layer is filled inside the packaging shell;

[0097] The performance of the encapsulated dual-layer Z-block body was tested, and the test results were generated.

[0098] If the test results meet the preset conditions, a dual-layer Z-block component is obtained.

[0099] Optionally, the preset conditions include:

[0100] The insertion loss of a single channel of the encapsulated dual-layer Z-block body is less than or equal to 0.5 dB, and the average insertion loss of the 8 channels of the encapsulated dual-layer Z-block body is less than or equal to 0.42 dB.

[0101] The return loss of the encapsulated double-layer Z-block body is greater than or equal to 45 dB.

[0102] The inter-channel crosstalk corresponding to the encapsulated double-layer Z-block body is less than or equal to -60 dB;

[0103] The coupling efficiency of the encapsulated dual-layer Z-block body is greater than or equal to 90%.

[0104] After the encapsulated dual-layer Z-block body underwent high and low temperature cycle testing in an environment of -40℃ to 85℃, the change in insertion loss was less than or equal to 0.1 dB.

[0105] In this embodiment, the assembled dual-layer Z-block body is installed into an aluminum alloy encapsulation shell, and the interior is filled with an anti-static silicone buffer layer to complete the overall encapsulation. The encapsulated component is subjected to performance testing, and the test indicators include insertion loss, return loss, channel crosstalk, coupling efficiency, etc. After passing the test, it is a finished product, and the dual-layer Z-block component is obtained.

[0106] The aforementioned packaging shell measures 20 mm in length, 12 mm in width, and 4.5 mm in thickness, adapting to the miniaturization requirements of optical modules. The shell is made of aluminum alloy and is a flat shell designed to fit the dual-layer Z-block body, with an internal anti-static and vibration-damping silicone buffer layer.

[0107] In this embodiment, the encapsulation shell encapsulates the double-layer Z-block body, the interlayer optical isolation layer, and the microlens array as a whole, exposing only the incident and emitting ends of the microlens array, ensuring the mechanical stability and environmental adaptability of the component, and adapting to the internal assembly requirements of the optical module.

[0108] This application also provides a dual-layer Z-block component, which is prepared according to the preparation method of the dual-layer Z-block component described above.

[0109] The dual-layer Z-block component provided in this application embodiment can simultaneously perform wavelength splitting or multiplexing of 8 wavelength optical signals. Its working principle is uniformly based on wavelength selection and transmission of a Z-shaped optical path, specifically including the following methods:

[0110] Wavelength division principle: Multi-wavelength mixed optical signals are vertically injected into the integrated microlens array at the input end. After being precisely focused by the microlenses, they enter the 4-channel Z-shaped optical paths of the first Z-block body and the second Z-block body respectively. The optical signals propagate in the inner wall of the inclined cavity, and after being reflected by the high-reflection film, they pass through the stepped-mounted filters in sequence. Each filter selects the optical signal of the corresponding wavelength, and the optical signals of the remaining wavelengths continue to be reflected. The 8 single-wavelength optical signals after selection are collimated by the microlens array at the output end and then output, completing the wavelength division process.

[0111] Working principle of wave combining: Eight single-wavelength optical signals are perpendicularly injected into the corresponding microlenses of the incident end microlens array, and after being focused, they enter the 4-channel Z-shaped optical path of the first Z-block body and the second Z-block body; after each wavelength optical signal is transmitted through the filter and reflected by the inner wall of the inclined cavity, it is combined into a multi-wavelength mixed optical signal at the optical path exit, and then output after being collimated by the exit end microlens array, thus completing the wave combining process.

[0112] Interlayer isolation principle: Throughout the transmission process, the interlayer optical isolation layer completely separates the upper and lower optical paths, avoiding crosstalk between the two optical signals. Furthermore, the optimized layout of each film layer (anti-reflection film, anti-reflection film, high-reflection film) minimizes interface reflection and material absorption loss of the optical signal, ensuring transmission performance.

[0113] It should be understood that the dual-layer Z-block component provided in this application embodiment can have the same technical effects as the preparation method of the dual-layer Z-block component described above.

[0114] It should be understood that the bilayer Z-block module prepared by the method provided in the embodiments of this application, through structural innovation and process optimization, has significant technical and mass production advantages compared with the existing single-layer Z-block module, as follows:

[0115] 1. Doubled number of channels to meet high-speed requirements: The dual-layer oblique cavity stacking structure achieves 8-channel wavelength division processing, breaking through the limitation of 4 channels in single-layer Z-block components, and is adapted to the application requirements of 100G and above high-speed optical modules. Moreover, the optical paths are parallel and do not cross, and the isolation between channels is high.

[0116] 2. High integration and miniaturization: The dual-layer structure is an integrated stacked design, eliminating the need to splice multiple single-layer components. The overall package size is only 20 mm, 12 mm, and 4.5 mm, which is comparable to traditional 4-channel single-layer Z-block components, greatly improving the integration and conforming to the development trend of miniaturization and high density of optical devices.

[0117] 3. Low optical loss and excellent transmission performance: Combining Yilutong optical coating technology, the incident and exit surfaces, interlayer isolation layers and filters are optimized in all dimensions to minimize interface reflection and material absorption loss. The single-channel insertion loss is less than or equal to 0.5 dB, which is far superior to existing single-layer components.

[0118] 4. Simplified assembly and improved yield: The independent rhomboid prism is eliminated, the filter is integrated in a stepped manner, and the microlens array is an integrated design of 2 rows and 4 columns, which eliminates the need for separate multi-dimensional adjustment, reduces assembly steps, and can increase the yield to over 95% during mass production.

[0119] 5. Process compatibility and easy mass production: All structural designs are based on mature low-temperature bonding, filter stacking and bonding, optical coating and optical path calibration technologies. No new process equipment is required. They can be directly integrated into existing production lines to achieve large-scale mass production and reduce production costs.

[0120] 6. Stable structure and strong environmental adaptability: The positioning boss and positioning groove are precisely aligned, and the double-layer body is seamlessly bonded by low temperature bonding. The structure is not loose, and the encapsulation shell has built-in anti-static and anti-vibration buffer layer. The performance does not significantly decrease after high and low temperature cycle and vibration test, making it suitable for complex industrial application environments.

[0121] 7. High scalability and adaptability to more channels: It can be further expanded into a three-layer or four-layer structure to achieve wavelength division processing of 12 or 16 channels. Only the number of filters and the layout of the microlens array need to be adjusted, which has good scalability.

[0122] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0123] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0124] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A method for fabricating a dual-layer Z-block component, characterized in that, The method includes: Prepare the first Z-block body and the second Z-block body; Multiple filter elements are prepared, and the multiple filter elements are coated. The plurality of filter chips are assembled on the first Z-block body and the second Z-block body; The first Z-block body and the second Z-block body are stacked and low-temperature bonded to obtain a double-layer Z-block body; A microlens array is integrated on the dual-layer Z-block body, and the dual-layer Z-block body is encapsulated to obtain a dual-layer Z-block component.

2. The method according to claim 1, characterized in that, The preparation of the first Z-block body and the second Z-block body includes: Optical glass is processed through cutting, grinding, and polishing to obtain a first Z-block blank and a second Z-block blank. A double-layer oblique cavity was machined on the first Z-block blank and the second Z-block blank using laser etching process, and the surface of the oblique cavity was polished. An anti-reflective film is deposited on the incident and exit surfaces of the first and second Z-block blanks, and a high-reflective film is deposited on the inner wall of the inclined cavity of the first and second Z-block blanks to obtain the first Z-block body and the second Z-block body.

3. The method according to claim 1, characterized in that, The preparation of multiple filter elements and the coating treatment of the multiple filter elements include: Optical glass is processed using a cutting process to obtain multiple filters; A wavelength division multiplexing film is deposited on one side of each filter using a magnetron sputtering process, and an antireflection film is deposited on the other side of each filter. The wavelength division multiplexing (WDM) film exhibits a coating uniformity of ≥95% for wavelengths of 1271 nm, 1291 nm, 1311 nm, 1331 nm, 1351 nm, 1371 nm, 1391 nm, and 1411 nm.

4. The method according to claim 1, characterized in that, Assembling the plurality of filters on the first Z-block body and the second Z-block body includes: Multiple coated filters are attached to the inclined cavity inner walls of the first Z-block body and the second Z-block body at a preset spacing. An optical adhesive is applied between adjacent filters to form an optical adhesive layer; The first Z-block body and the second Z-block body with the attached filter are placed in a vacuum curing oven for curing.

5. The method according to claim 1, characterized in that, Before performing the stacking and low-temperature bonding process on the first Z-block body and the second Z-block body, the method further includes: A positioning boss is machined at the center of the upper surface of the first Z-block body using laser etching technology; A positioning groove matching the positioning boss is machined at the center of the lower surface of the second Z-block body using laser etching technology.

6. The method according to claim 5, characterized in that, Stacking the first Z-block body and the second Z-block body includes: An optical isolation layer is attached to the upper surface of the first Z-block body; The second Z-block body is aligned with the positioning boss and the positioning groove, and covered above the chemical isolation layer to achieve the stacking arrangement between the first Z-block body and the second Z-block body; The second Z-block body is disposed above the first Z-block body.

7. The method according to claim 1, characterized in that, The integration of a microlens array on the dual-layer Z-block body includes: The microlens array is bonded to the incident and exit surfaces of the double-layer Z-block body using optical adhesive; The microlens array is integrated on the double-layer Z-block body by curing it in a vacuum environment at 60°C for 1 hour.

8. The method according to claim 1, characterized in that, The encapsulation of the dual-layer Z-block body to obtain a dual-layer Z-block component includes: The dual-layer Z-block body is installed in a packaging shell, and an anti-static silicone buffer layer is filled inside the packaging shell; The performance of the encapsulated dual-layer Z-block body was tested, and the test results were generated. If the test results meet the preset conditions, a dual-layer Z-block component is obtained.

9. The method according to claim 8, characterized in that, The preset conditions include: The insertion loss of a single channel of the encapsulated dual-layer Z-block body is less than or equal to 0.5 dB, and the average insertion loss of the 8 channels of the encapsulated dual-layer Z-block body is less than or equal to 0.42 dB. The return loss of the encapsulated double-layer Z-block body is greater than or equal to 45 dB. The inter-channel crosstalk corresponding to the encapsulated double-layer Z-block body is less than or equal to -60 dB; The coupling efficiency of the encapsulated dual-layer Z-block body is greater than or equal to 90%. After the encapsulated dual-layer Z-block body underwent high and low temperature cycle testing in an environment of -40℃ to 85℃, the change in insertion loss was less than or equal to 0.1 dB.

10. A dual-layer Z-block component, characterized in that, The dual-layer Z-block component is prepared by the method for preparing a dual-layer Z-block component according to any one of claims 1-9.

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