A test system for planar lightwave circuit chips and optical receiver assemblies

Abstract

The embodiment of the application discloses a kind of plane optical waveguide circuit chip and optical receiving assembly test system, chip includes first beam splitter, modulation unit, second beam splitter and beam combination unit, wherein the first beam splitter is respectively connected with the input end of modulation unit and the input end of second beam splitter, the input end of first beam splitter is as the input end of the plane optical waveguide circuit chip;The output end of modulation unit and the output end of second beam splitter are respectively connected with the input end of beam combination unit, and the output end of beam combination unit is as the output end of the plane optical waveguide circuit chip.The embodiment of the application is integrated in the same plane optical waveguide circuit chip by first beam splitter, modulation unit, second beam splitter and beam combination unit, substantially simplify system structure, reduce equipment floor area, and then significantly test the stability and the comparability between channel, finally can effectively improve test efficiency and the accuracy of test result.

Description

Technical Field

[0001] This application belongs to the field of fiber optic sensing, specifically relating to a test system for a planar optical waveguide circuit chip and an optical receiving component. Background Technology

[0002] In the field of fiber optic communication and sensing, especially in fiber optic gyroscope systems, the PIN / FET optical receiver is one of the core components that determines the accuracy of the gyroscope. Its key performance parameters, such as noise, bandwidth, responsivity, and sensitivity, directly affect the overall performance of the system. Therefore, it is of great significance to conduct accurate, fast, and convenient testing of these parameters.

[0003] Currently, widely used optical path testing methods mainly rely on connecting multiple couplers and modulators to perform parallel beam splitting and testing of multiple optical receiving components. However, this traditional approach suffers from problems such as complex optical path structure, large footprint, high optical path loss, and poor beam splitting consistency, which limit testing efficiency and accuracy. Summary of the Invention

[0004] The purpose of this application is to provide a test system for planar optical waveguide circuit chips and optical receiving components, which can solve the problem that traditional solutions restrict the testing efficiency and accuracy of optical receiving components.

[0005] In a first aspect, embodiments of this application provide a planar optical waveguide circuit chip, the planar optical waveguide circuit chip comprising a first beam splitter, a modulation unit, a second beam splitter, and a beam combiner, wherein:

[0006] The first beam splitter is connected to the input terminal of the modulation unit and the input terminal of the second beam splitter, respectively, and the input terminal of the first beam splitter serves as the input terminal of the planar optical waveguide circuit chip.

[0007] The output of the modulation unit and the output of the second beam splitter are respectively connected to the input of the beam combining unit, and the output of the beam combining unit serves as the output of the planar optical waveguide circuit chip.

[0008] Optionally, the second beam splitter is connected to the beam combiner via a first bent waveguide, and the modulation unit is connected to the beam combiner via a second bent waveguide.

[0009] Optionally, the system further includes a third beam splitter. The modulation unit is connected to the second curved waveguide via the third beam splitter. The beam combining unit includes multiple beam combiners. Each output of the second beam splitter is connected to a first input of the beam combiner via the first curved waveguide. Each output of the third beam splitter is connected to a second input of the beam combiner via the second curved waveguide. The output of the beam combiner serves as the output of the beam combining unit.

[0010] Optionally, the number of output channels of the first beam splitter is less than the number of output channels of the second beam splitter and the third beam splitter, wherein the number of output channels of the second beam splitter and the third beam splitter are the same.

[0011] Optionally, the first beam splitter is a 1×2 beam splitter, and the second and third beam splitters are 1×8 beam splitters.

[0012] Optionally, the modulation unit includes a modulation waveguide and electrodes; the electrodes are located on both sides of the waveguide arm of the modulation waveguide.

[0013] Secondly, embodiments of this application provide a testing system for an optical receiving component, including a test signal source module, an optical receiving component module, a test module, and a planar optical waveguide circuit chip as described in the first aspect; the test signal source module is sequentially connected to the test module through the planar optical waveguide circuit chip and the optical receiving component module;

[0014] The test signal source module is connected to the input end of the first beam splitter of the planar optical waveguide circuit chip to generate an initial test signal;

[0015] The planar optical waveguide circuit chip is used to split and modulate the initial test signal to obtain a reference signal and a modulated signal, and to combine the reference signal and the modulated signal into a mixed signal.

[0016] The optical receiving component module is connected to the beam combining unit of the planar optical waveguide circuit chip, and is used to convert the mixed signal into a target test signal;

[0017] The test module determines the test results of the optical receiving component based on the target test signal.

[0018] Optionally, it also includes a signal generator; the signal generator is connected to the planar optical waveguide circuit chip.

[0019] Optionally, the optical receiving component module includes multiple optical receiving components and an array of optical fibers; the input end of the optical receiving component is connected to the beam combining unit of the planar optical waveguide circuit chip through the array of optical fibers, and the output end of the optical receiving component is connected to the test module.

[0020] Optionally, the test module includes a separation unit and a test unit; the input terminal of the separation unit is connected to the optical receiving component module, and the output terminal of the separation unit is connected to the test unit.

[0021] In this embodiment, by integrating the first beam splitter, modulation unit, second beam splitter, and beam combiner into the same planar optical waveguide circuit chip, and using a fixed-cascade architecture where the first beam splitter connects the modulation unit and the second beam splitter respectively, and the modulation unit and the second beam splitter are jointly connected to the beam combiner, this can replace the complex optical path formed by multiple discrete couplers and modulators cascaded through fiber optic patch cords in the traditional solution. This integrated design eliminates a large number of fiber optic splices and connectors at the physical level, thereby greatly simplifying the system structure, reducing the equipment footprint, and fundamentally overcoming the defects of high optical path loss and poor beam splitting consistency caused by the inherent differences of discrete components and multi-node connections in the traditional solution. This significantly improves the stability of the test and the comparability between channels, and ultimately effectively improves the test efficiency and the accuracy of the test results. Attached Figure Description

[0022] Figure 1 This is a system block diagram of a multi-channel full-temperature testing system for a traditional optical receiving component.

[0023] Figure 2 This is a schematic diagram of the structure of a planar optical waveguide circuit chip provided in an embodiment of this application;

[0024] Figure 3 This is a structural block diagram of a test system for an optical receiving component provided in an embodiment of this application;

[0025] Figure 4 This is a system block diagram of a test system for an optical receiving component provided in an embodiment of this application.

[0026] Reference numerals: 1. Planar optical waveguide circuit chip; 11. First beam splitter; 12. Modulation unit; 121. Modulation waveguide; 122. Electrode; 13. Second beam splitter; 14. Beam combiner unit; 141. Beam combiner; 15. Third beam splitter; 16. First bent waveguide; 17. Second bent waveguide; 2. Test signal source module; 3. Optical receiving component module; 31. Optical receiving component; 32. Arrayed optical fiber; 4. Test module; 41. Separation unit; 42. Test unit; 5. Signal generator; 11'. 1×2 coupler; 12'. MZ intensity modulator; 13'. 1×8 coupler; 141'. 2×1 coupler. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0029] The following description, in conjunction with the accompanying drawings, details the test system for the planar optical waveguide circuit chip and optical receiving component provided in this application through specific embodiments and application scenarios.

[0030] Reference Figure 1 This is a system block diagram of a traditional multi-channel full-temperature testing system for optical receiver components. Its optical path consists of discrete test signal source module 2, MZ intensity modulator 12', multiple 1×2 couplers 11', 1×8 couplers 13', and 2×1 couplers 141' cascaded via fusion or connectors. Each 2×1 coupler 141' is connected to each optical receiver component 31 under test. Subsequently, each optical receiver component 31 converts the received optical signal into an electrical signal and outputs it to a separation unit 41 to separate it into various test units 42. The test unit 42 includes an oscilloscope, a 6.5-digit multimeter, and a video millivoltmeter. This discrete architecture results in a long optical path and numerous connection nodes, making the system structure complex and occupying a large area. Furthermore, each node introduces additional insertion loss and reflection, leading to a large cumulative optical path loss. Simultaneously, the inherent performance differences between the multiple discrete couplers directly result in poor splitting consistency across test channels. These problems collectively restrict the stability of the test and the comparability between channels, ultimately severely impacting test efficiency and the accuracy of test results.

[0031] Reference Figure 2 This is a schematic diagram of the structure of a planar optical waveguide circuit chip provided in an embodiment of this application, including a first beam splitter 11, a modulation unit 12, a second beam splitter 13, and a beam combiner 14, wherein:

[0032] The first beam splitter 11 is connected to the input terminal of the modulation unit 12 and the input terminal of the second beam splitter 13, respectively, and the input terminal of the first beam splitter 11 serves as the input terminal of the planar optical waveguide circuit chip 1.

[0033] The output of the modulation unit 12 and the output of the second beam splitter 13 are respectively connected to the input of the beam combining unit 14, and the output of the beam combining unit 14 serves as the output of the planar optical waveguide circuit chip 1.

[0034] In the planar lightwave circuit chip (PLC chip) of this application embodiment, the optical signal is input from the input end of the first beam splitter 11 and split into two paths: one path is transmitted to the modulation unit 12 for modulation processing, and the other path is transmitted to the second beam splitter 13 for branching processing. The optical signal modulated by the modulation unit 12 and the optical signal branched by the second beam splitter 13 are respectively input to the beam combining unit 14, and then combined by the beam combining unit 14 and output from its output end. Through the cascaded connection relationship of splitting first and then modulating, and splitting in parallel and then combining, the planar lightwave circuit chip realizes the functions of distributing, modulating, routing and combining the input optical signal in a single chip, without relying on external discrete devices for fiber optic cascading, thereby greatly simplifying the optical path structure, reducing insertion loss and node loss, and fundamentally ensuring the homogeneity and channel consistency among the multiple output optical signals.

[0035] Specifically, since the planar optical waveguide circuit chip 1 includes an MZ (Mach-Zehnder) modulator (modulation waveguide 121), electro-optic materials are required to achieve stable and high-performance electro-optic modulation across the entire temperature range. Preferably, the PLC chip can be fabricated using lithium niobate thin film material. It should be noted that lithium tantalate thin film material can also be used to fabricate PLC chips, but its electro-optic modulation effect is slightly inferior to that of lithium niobate thin film material.

[0036] In one embodiment of this application, the second beam splitter 13 is connected to the beam combiner 14 via a first curved waveguide 16, and the modulation unit 12 is connected to the beam combiner 14 via a second curved waveguide 17.

[0037] Reference Figure 4 This is a schematic diagram of the structure of a planar optical waveguide circuit chip provided in an embodiment of this application.

[0038] In traditional discrete optical path solutions, the intersections of different optical paths introduce additional losses, resulting in poor uniformity of the output optical signal. To overcome this problem, the embodiments of this application employ a bent waveguide structure in the chip design to compensate for the losses at the optical path intersections, thereby achieving more uniform multi-path optical output. By integrating different waveguide beam splitting structures and electro-optic modulation structures, this solution realizes complete functions such as beam splitting and modulation on a single chip, exhibiting significant advantages such as small size, high integration, and good beam splitting uniformity.

[0039] Specifically, the first bent waveguide 16 and the second bent waveguide 17 are used to route the optical signals output from the second beam splitter 13 and the modulation unit 12 to the beam combiner 14, respectively. By optimizing the curvature radius, waveguide width, and length of the bent waveguides, the non-uniform loss caused by the difference in the number of intersections and bending times of different optical paths can be effectively compensated, so that each optical signal has highly consistent optical power and phase characteristics when it arrives at the beam combiner 14. This design does not require additional optical compensation devices and can achieve on-chip calibration of optical path uniformity within the chip, further improving the consistency of multi-channel output signals and the overall test accuracy of the system.

[0040] In one embodiment of this application, a third beam splitter 15 is further included. The modulation unit 12 is connected to the second curved waveguide 17 through the third beam splitter 15. The beam combining unit 14 includes a plurality of beam combiners 141. Each output terminal of the second beam splitter 13 is connected to a first input terminal of a beam combiner 141 through the first curved waveguide 16. Each output terminal of the third beam splitter 15 is connected to a second input terminal of a beam combiner 141 through the second curved waveguide 17. The output terminal of the beam combiner 141 serves as the output terminal of the beam combining unit 14.

[0041] like Figure 2 As shown, the beam combining unit 14 includes multiple beam combiners 141. Figure 2 The bundle combiner 141 is not repeatedly identified in the middle.

[0042] In this embodiment, the reference optical signal from the first beam splitter 11 is split into multiple paths by the second beam splitter 13, and each path is routed to the first input terminal of each beam combiner 141 via the first curved waveguide 16. The modulated optical signal from the modulation unit 12 is split into multiple paths by the third beam splitter 15, and each path is routed to the second input terminal of each beam combiner 141 via the second curved waveguide 17. Each beam combiner 141 combines the received reference optical signal and the modulated optical signal into one, forming a mixed optical signal output. Through the parallel cascade architecture of splitting the reference optical path and the modulated optical path separately and then combining them one by one according to the channel, the chip realizes high-density and high-consistency on-chip generation of multi-channel mixed test optical signals on a single substrate.

[0043] Specifically, the first curved waveguide 16 and the second curved waveguide 17 are optimized for different topological layouts of the reference optical path and the modulation optical path, respectively. By precisely designing the bending radius, waveguide length and number of intersections, the loss difference of the two optical signals on the transmission path is compensated, so that the reference light and the modulation light arriving at the same combiner 141 have balanced optical power and stable phase relationship. This design ensures high uniformity and high coherence of the multi-channel output mixed signal at the chip level, laying a solid signal foundation for subsequent high-precision testing.

[0044] In one embodiment, the specific method for compensating two optical signals includes: for the optical path with shorter length and fewer crossover points (such as the reference optical path), the transmission length of the curved waveguide is increased to match the total optical path of the other path (such as the modulation optical path), thereby compensating for the phase difference caused by the difference in transmission distance; at the same time, for the optical path with fewer crossover points, the path topology of the curved waveguide is designed to introduce additional waveguide length to simulate the crossover point loss, so that the total loss of the two optical signals when they reach the beam combining unit is basically the same; in addition, by precisely controlling the curvature radius and waveguide width of the curved waveguide, the phase change of the optical signal at the bend is adjusted to ensure that the two optical signals have a stable phase relationship when beam combining.

[0045] Combination Figure 2 To illustrate, a reference optical signal from the second beamsplitter 13 can be directly transmitted to the combiner 141, with no intersections and a short transmission distance. However, a modulated optical signal from the third beamsplitter 15 needs to pass through seven intersections to reach the same combiner 141. Due to waveguide transmission loss and intersection loss, to ensure that the two optical signals entering the combiner 141 have comparable optical power and the same phase, the transmission distance of the reference optical path (i.e., the transmission path from the second beamsplitter 13 to the combiner 141) needs to be appropriately increased by designing the path length of the first curved waveguide. This adjusts its loss and phase to achieve optimal matching with the modulated optical path (the transmission path from the third beamsplitter 15 to the combiner 141).

[0046] In one embodiment, the bundle combiner 141 can be a 2×1 bundle combiner.

[0047] In one embodiment of this application, the number of output channels of the first beam splitter 11 is less than the number of output channels of the second beam splitter 13 and the third beam splitter 15, and the number of output channels of the second beam splitter 13 and the third beam splitter 15 are the same.

[0048] In this embodiment, the second beam splitter 13 and the third beam splitter 15 have the same number of output channels to ensure that the number of channels in the reference optical path and the modulation optical path are strictly matched, so that the two input signals of each beam combiner 141 correspond one-to-one in space. At the same time, in order to ensure that the subsequent reference light and modulation light are homologous, the number of output channels of the first beam splitter 11 is less than that of the second beam splitter 13 and the third beam splitter 15. This allows the first beam splitter 11 to split the input optical signal into two paths, one to the modulation unit 12 and the other to the second beam splitter 13. The number of its output channels is independent of the total number of channels required for subsequent multi-channel parallel testing. While ensuring the homologity of the two optical signals, the scale and complexity of the first-stage beam splitter of the chip are effectively controlled, avoiding unnecessary device redundancy and additional losses.

[0049] In one embodiment, the first beam splitter 11 is a 1×2 beam splitter, and the second beam splitter 13 and the third beam splitter 15 are 1×8 beam splitters.

[0050] In one embodiment of this application, the modulation unit 12 includes a modulation waveguide 121 and an electrode 122; the electrode 122 is located on both sides of the waveguide arm of the modulation waveguide 121.

[0051] like Figure 2 As shown, the modulation unit 12 includes a modulation waveguide 121 for conducting and modulating optical signals, and electrodes 122 for applying a modulation electric field. The electrodes are generally arranged on both sides of the two waveguide arms of the modulation waveguide 121, with a distance of 2-4 μm between them. This is a proximity coupling structure, not a direct attachment. By applying a modulation signal, the phase of the light is changed using the electro-optic effect of the lithium niobate crystal (the material used to fabricate the planar optical waveguide circuit chip 1), thereby achieving modulation.

[0052] One optical signal from the first beam splitter 11 is input to the modulation waveguide 121. Simultaneously, the electrode 122 generates a corresponding modulation electric field based on the externally input modulation electrical signal. This electric field acts on the modulation waveguide 121, changing the physical characteristics (such as phase or intensity) of the optical signal passing through the waveguide based on the electro-optic effect, thereby completing the loading of the electrical signal into an optical signal and generating a modulated optical signal. The modulated optical signal is then output from the modulation waveguide 121 and returned to the third beam splitter 15 for further processing.

[0053] To fully utilize the excellent electro-optic effect of lithium niobate thin film materials, electrodes along the Y direction can be fabricated on the X-cut Y-transmitted modulation waveguide, so that the applied modulation electric field direction is parallel to the Z-axis of the crystal. This allows the maximum electro-optic coefficient γ33 of the lithium niobate crystal to achieve the most efficient electro-optic phase modulation, resulting in higher electro-optic modulation efficiency and bandwidth.

[0054] Specifically, X-cutting refers to the X-axis of the lithium niobate crystal being perpendicular to the chip surface, facilitating the placement of electrodes on both sides of the waveguide; Y-propagation refers to the propagation of the optical signal along the Y-axis of the lithium niobate crystal. The electrodes are arranged along the Y-direction on both sides of the modulation waveguide 121, and the resulting modulation electric field after applying voltage is parallel to the Z-axis (optical axis) of the lithium niobate crystal. Since the lithium niobate crystal has the largest electro-optic coefficient γ33, this electric field direction can fully utilize the γ33 coefficient, making the refractive index change linearly related to the electric field strength, thereby achieving the highest electro-optic modulation efficiency and the largest modulation bandwidth.

[0055] Preferably, electrode 122 can be a high-frequency gold electrode. In MZ intensity modulators, high-frequency electrodes specifically refer to electrode systems designed for high-speed radio frequency signals (typically ≥10GHz), employing traveling-wave electrode structures, and used to achieve wide-bandwidth electro-optic modulation. For MZ modulators, especially high-frequency traveling-wave electrodes, the selection of materials needs to comprehensively consider multiple factors such as electrical, thermal, and chemical properties, process compatibility, and long-term reliability; therefore, gold is preferred. Gold has extremely low resistivity, excellent oxidation resistance, and good thermal conductivity, which can meet the stringent requirements of high-frequency modulation for signal transmission efficiency and device stability.

[0056] Reference Figure 3 This is a structural block diagram of a test system for an optical receiving component provided in an embodiment of this application. Specifically, it includes: a test signal source module 2, an optical receiving component module 3, a test module 4, and the aforementioned planar optical waveguide circuit chip 1; the test signal source module 2 is sequentially connected to the test module 4 through the planar optical waveguide circuit chip 1, the optical receiving component module 3, and the test module 4.

[0057] The test signal source module 2 is connected to the input terminal of the first beam splitter 11 of the planar optical waveguide circuit chip 1, and is used to generate an initial test signal;

[0058] The planar optical waveguide circuit chip 1 is used to split and modulate the initial test signal to obtain a reference signal and a modulated signal, and to combine the reference signal and the modulated signal into a mixed signal.

[0059] The optical receiving component module 3 is connected to the beam combining unit 14 of the planar optical waveguide circuit chip 1, and is used to convert the mixed signal into a target test signal;

[0060] The test module 4 determines the test result of the optical receiving component 31 based on the target test signal.

[0061] like Figure 3As shown in this embodiment, the test signal source module 2 refers to the light source that generates the initial test signal (optical signal). The initial test signal is input to the first beam splitter in the planar optical waveguide circuit chip 1, which splits the initial test signal to generate a reference signal and an optical signal to be modulated from the same source. One of the beams is then modulated to generate a modulated signal. Finally, the beam combining unit 14 in the planar optical waveguide circuit chip 1 combines the reference signal and the modulated signal into a mixed signal and outputs it. This mixed signal is then sent to the optical receiving component module 3. The optical receiving component module 3 operates in a set full-temperature environment. The multiple optical receiving components 31 contained therein convert the received mixed optical signal into the corresponding target test signal (electrical signal). Finally, the test module 4 receives these electrical signals, processes and analyzes them to determine the performance test results (full-temperature test results) of each optical receiving component 31 (PIN-FET component) within the full-temperature range.

[0062] Reference Figure 4 This is a system block diagram of a test system for an optical receiving component provided in an embodiment of this application.

[0063] In one embodiment of this application, a signal generator 5 is also included; the signal generator 5 is connected to the planar optical waveguide circuit chip 1.

[0064] like Figure 4 As shown in this embodiment, the test system further includes a signal generator 5, which is connected to the planar optical waveguide circuit chip 1. An initial test signal (optical signal) from the test signal source module 2 is input to the planar optical waveguide circuit chip 1. Simultaneously, the signal generator 5 generates and outputs a modulated electrical signal to the planar optical waveguide circuit chip 1. The planar optical waveguide circuit chip 1 receives the target test signal and the modulated electrical signal, loads the modulated electrical signal onto an optical carrier to form a modulated optical signal (modulated signal), and combines this modulated optical signal with a reference optical signal (reference signal) to obtain a mixed signal (optical signal). Finally, the multiple optical signals output by the planar optical waveguide circuit chip 1 are transmitted to the optical receiving component module 3.

[0065] Specifically, the signal generator 5 is connected to the electrodes in the planar optical waveguide circuit chip 1 and applies a modulated electrical signal to the planar optical waveguide circuit chip 1.

[0066] Traditional testing systems typically employ multiple discrete fiber optic couplers cascaded via flanges, resulting in inherent drawbacks such as high optical path loss, large space occupation, and poor test consistency. This application's embodiment achieves system miniaturization by integrating key functions such as couplers and intensity modulators onto a single PLC chip. This solution fundamentally overcomes the limitations of traditional fiber optic connections, eliminating numerous discrete fibers and connectors, thus offering significant advantages such as simple optical path structure, convenient assembly, and low overall loss. Furthermore, it ensures high accuracy and consistency in testing at the physical level.

[0067] In one embodiment of this application, the optical receiving component module 3 includes a plurality of optical receiving components 31 and an array of optical fibers 32; the input end of the optical receiving component 31 is connected to the beam combining unit 14 of the planar optical waveguide circuit chip 1 through the array of optical fibers 32, and the output end of the optical receiving component 31 is connected to the test module 4.

[0068] like Figure 3 As shown, the optical receiving component module 3 includes multiple optical receiving components 31 for converting optical signals into electrical signals, and an array of optical fibers 32 for distributing multiple optical signals in parallel to each optical receiving component 31.

[0069] Specifically, the fiber array (FA) contains multiple independent optical fibers precisely arranged in space. Its input end is aligned and coupled to the output waveguide array of the combining unit 14 of the planar optical waveguide circuit chip 1. The end of each output fiber is directly connected to the optical input port of a corresponding optical receiving component 31 through an optical fiber connector. By maintaining a strict one-to-one correspondence in both spatial arrangement and physical connection, the fiber array 32 can transmit the multiple mixed optical signals generated by the planar optical waveguide circuit chip 1 to each corresponding optical receiving component 31 without loss and independently. The optical receiving component converts the mixed signal into the target test signal and outputs it to the test module 4, thereby realizing true multi-channel parallel testing.

[0070] In one embodiment of this application, the test module 4 includes a separation unit 41 and a test unit 42; the input terminal of the separation unit 41 is connected to the optical receiving component module 3, and the output terminal of the separation unit 41 is connected to the test unit 42.

[0071] like Figure 3 As shown, the test module 4 includes a separation unit 41 for processing the raw electrical signal and a test unit 42 for calculating performance parameters.

[0072] Specifically, the target test signal from each optical receiving component 31 in the optical receiving component module 3 is input to the separation unit 41. The separation unit 41 separates each composite electrical signal into AC and DC signal components through filtering or synchronous detection, and outputs them to the test unit. Subsequently, the test unit 42 receives these separated signal components and calculates the key performance parameters of the corresponding optical receiving component 31 at various temperature points across the entire temperature range, such as responsivity, bandwidth, sensitivity, and equivalent noise power, based on a preset algorithm, ultimately generating complete full-temperature test results. It should be noted that the test unit 42 includes test equipment such as an oscilloscope, a 6.5-digit multimeter, and a video millivoltmeter.

[0073] Specifically, in the full-temperature testing system, the light emitted by the light source enters the planar optical waveguide circuit chip 1 and is split into two paths by the 1×2 first beam splitter 11. One path directly enters the 1×8 second beam splitter 13, and the other path passes through the modulation waveguide 121. The signal generator 5 modulates the transmitted optical signal through the electrode 122. The modulated signal enters the 1×8 third beam splitter 15. The two signals are combined in the 2×1 beam combiner 141 and output through the optical fiber into the PIN-FET component. The modulation AC signal and DC signal are separated by the separation unit 41 and input to different devices for parameter testing such as no-light voltage, light-light voltage, bandwidth, and responsivity.

[0074] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0075] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0076] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A planar optical waveguide circuit chip (1), characterized in that, The planar optical waveguide circuit chip (1) includes a first beam splitter (11), a modulation unit (12), a second beam splitter (13), a beam combiner (14), and a third beam splitter (15), wherein: The first beam splitter (11) is connected to the input terminal of the modulation unit (12) and the input terminal of the second beam splitter (13), respectively. The input terminal of the first beam splitter (11) serves as the input terminal of the planar optical waveguide circuit chip (1). The output of the modulation unit (12) and the output of the second beam splitter (13) are respectively connected to the input of the beam combining unit (14), and the output of the beam combining unit (14) serves as the output of the planar optical waveguide circuit chip (1). The second beam splitter (13) is connected to the beam combiner (14) through the first curved waveguide (16), and the modulation unit (12) is connected to the beam combiner (14) through the second curved waveguide (17). The modulation unit (12) is connected to the second curved waveguide (17) through the third beam splitter (15). The beam combining unit (14) includes a plurality of beam combiners (141). Each output end of the second beam splitter (13) is connected to the first input end of a beam combiner (141) through the first curved waveguide (16). Each output end of the third beam splitter (15) is connected to the second input end of a beam combiner (141) through the second curved waveguide (17). The output end of the beam combiner (141) serves as the output end of the beam combining unit (14).

2. The planar optical waveguide circuit chip (1) according to claim 1, characterized in that, The number of output channels of the first beam splitter (11) is less than the number of output channels of the second beam splitter (13) and the third beam splitter (15), and the number of output channels of the second beam splitter (13) and the third beam splitter (15) are the same.

3. The planar optical waveguide circuit chip (1) according to claim 2, characterized in that, The first beam splitter (11) is a 1×2 beam splitter, and the second beam splitter (13) and the third beam splitter (15) are 1×8 beam splitters.

4. The planar optical waveguide circuit chip (1) according to claim 1, characterized in that, The modulation unit (12) includes a modulation waveguide (121) and electrodes (122); the electrodes (122) are located on both sides of the waveguide arm of the modulation waveguide (121).

5. A testing system for an optical receiving component, characterized in that, It includes a test signal source module (2), an optical receiving component module (3), a test module (4), and a planar optical waveguide circuit chip (1) as described in any one of claims 1-4; the test signal source module (2) is connected to the test module (4) in sequence through the planar optical waveguide circuit chip (1) and the optical receiving component module (3); The test signal source module (2) is connected to the input terminal of the first beam splitter (11) of the planar optical waveguide circuit chip (1) to generate an initial test signal; The planar optical waveguide circuit chip (1) is used to split and modulate the initial test signal to obtain a reference signal and a modulated signal, and to combine the reference signal and the modulated signal into a mixed signal. The optical receiving component module (3) is connected to the beam combining unit (14) of the planar optical waveguide circuit chip (1) to convert the mixed signal into a target test signal; The test module (4) determines the test result of the optical receiving component (31) based on the target test signal.

6. The testing system according to claim 5, characterized in that, It also includes a signal generator (5); the signal generator (5) is connected to the planar optical waveguide circuit chip (1).

7. The testing system according to claim 5, characterized in that, The optical receiving component module (3) includes multiple optical receiving components (31) and an array of optical fibers (32); the input end of the optical receiving component (31) is connected to the beam combining unit (14) of the planar optical waveguide circuit chip (1) through the array of optical fibers (32), and the output end of the optical receiving component (31) is connected to the test module (4).

8. The testing system according to claim 5, characterized in that, The test module (4) includes a separation unit (41) and a test unit (42); the input end of the separation unit (41) is connected to the optical receiving component module (3), and the output end of the separation unit (41) is connected to the test unit (42).

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