Self-adaptive control method and system for laser drilling of PCB (Printed Circuit Board)
By optimizing the laser head movement path and clamping schedule using a genetic algorithm, and by inserting a buffer interval during the preheating time, the problem of resource waste and rhythm mismatch caused by unreasonable path planning in laser drilling technology is solved, thus achieving efficient laser drilling production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUIZHOU WEIJIAN CIRCUIT BOARD IND CO LTD
- Filing Date
- 2025-12-09
- Publication Date
- 2026-04-21
AI Technical Summary
Existing laser drilling technology cannot effectively cope with the diversity of processing tasks and real-time fluctuations in equipment status when facing complex production environments, resulting in resource waste and low production efficiency. In particular, when the laser head movement path is not planned reasonably, the problem of matching the rhythm between workpiece clamping and laser preheating with the drilling operation seriously affects the continuity and stability of production.
A genetic algorithm is used to optimize the laser head movement path sequence, calculate the Euclidean distance and movement time value, trigger parallel clamping operation, adjust the clamping scheduling sequence, and insert buffer intervals based on the laser preheating time to generate a rhythm matching schedule, thereby realizing the rational planning of the laser head movement path and the synchronous optimization of each part of the equipment.
It reduces waiting time and resource waste, improves the overall efficiency of laser drilling technology, enhances production efficiency and equipment operation continuity, and ensures the stability and efficiency of the processing.
Smart Images

Figure CN121900309A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of industrial control system technology for laser drilling of PCB boards, and particularly to an adaptive control method and system for laser drilling of PCB boards. Background Technology
[0002] In the field of modern electronics manufacturing, circuit board processing technology is a key pillar driving industrial upgrading and product performance improvement, and its importance is self-evident. Especially in the high-precision micro-hole processing, laser drilling technology has become an indispensable core process due to its high efficiency and precision. However, despite the rapid development in this field, existing methods still reveal significant shortcomings when facing complex production environments, particularly in the coordination of production rhythms and the flexibility of equipment resource utilization. They generally struggle to adapt to changing processing demands, thus limiting overall efficiency improvements.
[0003] Current technological solutions often fail to effectively cope with the diversity of processing tasks and real-time fluctuations in equipment status, especially when dealing with circuit boards of different specifications or multi-task parallel processing, lacking the ability to dynamically adjust processing paths and equipment operating rhythms. This limitation frequently leads to resource waste or disconnections in the production process, thereby affecting the continuity and stability of the production line.
[0004] Focusing on specific technical challenges, a prominent issue in laser drilling is how to rationally plan the laser head's movement path to reduce unnecessary movement time. Due to the irregular distribution of processing points, frequent movement of the laser head between different hole positions often increases time costs. This problem further leads to another key bottleneck: matching the rhythm of various equipment stages, such as workpiece clamping, laser preheating, and actual drilling operations. If the path planning is unreasonable, it can cause long waiting times in certain stages. For example, when the laser head moves to the next hole position, the workpiece may not be properly secured, or laser preheating may not be complete, disrupting the entire production rhythm and reducing equipment utilization. In a real-world business scenario, when processing a circuit board containing hundreds of micro-holes, if the laser head's movement path is not optimized, the movement time may far exceed the drilling time. The waiting time for workpiece clamping or preheating further lengthens the overall cycle, severely impacting production efficiency.
[0005] Therefore, how to rationally plan the laser head movement path in complex processing environments and simultaneously optimize the operating rhythm of each part of the equipment to reduce waiting time and resource waste has become a key issue in improving the overall efficiency of laser drilling technology. Summary of the Invention
[0006] This invention provides an adaptive control method and system for laser drilling of PCB boards, which enables rational planning of the laser head movement path in complex processing environments and simultaneously optimizes the operating rhythm of each part of the equipment to reduce waiting time and resource waste, thereby improving the overall efficiency of laser drilling technology.
[0007] This invention provides an adaptive control method for laser drilling on PCB boards, applicable to industrial control systems, including: Based on the position coordinate data of all microholes on the PCB circuit board, a genetic algorithm is used to iteratively optimize the access order of the laser head from the starting point to each hole position, and obtain the laser head movement path sequence. Based on the laser head movement path sequence, the Euclidean distance between adjacent holes is calculated, and based on the Euclidean distance and the laser head speed parameters, the movement time value of each movement segment is determined. If the movement time value exceeds the preset clamping preparation threshold, a parallel clamping operation is triggered. Based on the workpieces corresponding to the holes whose movement time values exceed the clamping preparation threshold, a clamping scheduling sequence is determined, wherein the clamping preparation threshold is the maximum time required for clamping the workpieces at the holes. Based on the remaining time interval in the clamping and scheduling sequence, and combined with the fixed duration required for laser preheating, the time to start the preheating module during the movement is calculated to obtain a list of preheating start times. Based on the preheating start timing list, the preheating completion time is determined, and based on the difference between the preheating completion time and the moving time value, the starting point of the drilling operation is synchronously calibrated to determine the target triggering time of the drilling operation. If the target triggering time does not overlap with the clamping scheduling sequence, a buffer interval is inserted in the non-overlapping time gap to determine the rhythm matching time schedule; The rhythm matching schedule is used to control the equipment for each stage of laser drilling on the PCB board.
[0008] According to the adaptive control method for laser drilling of PCB boards of the present invention, the step of calculating the Euclidean distance between adjacent hole positions based on the laser head movement path sequence, and determining the movement time value of each movement segment based on the Euclidean distance and the laser head speed parameters, includes: Based on the position data between adjacent holes in the laser head movement path sequence, the straight-line distance between each adjacent hole is calculated using the Euclidean distance formula to obtain the Euclidean distance between adjacent holes. Based on the Euclidean distance and combined with the laser head speed parameters, the theoretical movement time of each movement segment is calculated to obtain a time distribution table; If the theoretical movement time of any moving segment in the time distribution table exceeds the preset time threshold, the path sequence of the corresponding moving segment is locally adjusted to determine the updated distance value. Based on the updated distance value and the laser head speed parameter, the actual movement time of the corresponding moving segment is recalculated, the adjustment time value is determined, and the time distribution table is updated based on the adjustment time value. Based on the updated time distribution table, the time value range of each moving segment is determined. If there are moving segments with unbalanced time value ranges, the laser head moving path sequence is optimized to obtain a balanced path distribution. Based on the balanced path distribution and the laser head speed parameters, the movement time value is determined.
[0009] According to the adaptive control method for laser drilling of PCB boards of the present invention, if the movement time value exceeds a preset clamping preparation threshold, a parallel clamping operation is triggered. Based on the workpiece corresponding to the hole position where the movement time value exceeds the clamping preparation threshold, a clamping scheduling sequence is determined, including: If the movement time value exceeds the preset clamping preparation threshold, a parallel clamping operation is triggered, and the workpieces corresponding to the holes whose movement time values exceed the clamping preparation threshold are taken as workpieces that need to be processed in parallel. Based on the clamping requirement data corresponding to the workpiece combination, a suitable parallel clamping strategy is extracted from the pre-established scheduling rule base to determine the clamping scheduling scheme. Based on the clamping and scheduling scheme, the time window for the workpiece processing sequence of each hole position is reallocated to determine the optimized time matching data. Based on the optimized time matching data, a genetic algorithm is used to optimize the clamping scheduling scheme and determine the clamping scheduling sequence.
[0010] According to the adaptive control method for laser drilling of PCB boards of the present invention, the step of calculating the time to start the preheating module during movement based on the remaining time interval in the clamping scheduling sequence and the fixed duration required for laser preheating, and obtaining a preheating start timing list, includes: Based on the sequence data in the clamping and scheduling sequence, the remaining time and time interval corresponding to each scheduling unit are extracted to obtain a preliminary set of time intervals; Based on the preliminary set of time intervals, a fixed duration required for laser preheating is obtained. If the time interval is greater than the fixed duration, the corresponding time period is determined to be available for preheating, and a list of available preheating time periods is determined. Based on the list of preheatable time periods, the movement status of each time period is obtained. If the movement status meets the preset stability conditions, the corresponding time period is determined to be suitable for activating the preheating module, and a set of candidate preheating opportunities is obtained. Based on the set of candidate preheating opportunities and the activation conditions of the laser preheating module, the priority of each candidate preheating opportunity is sorted to obtain a sorted list of activation opportunities. Based on the time point of each startup opportunity in the sorted startup opportunity list, and combined with the execution order of the clamping scheduling sequence, the preheating startup opportunity list is obtained.
[0011] According to the adaptive control method for laser drilling of PCB boards of the present invention, the step of determining the preheating completion time based on the preheating start timing list, and synchronously calibrating the start point of the drilling operation based on the difference between the preheating completion time and the moving time value, to determine the target trigger time of the drilling operation, includes: Based on the start and end times of each preheating event in the preheating start timing list, and combined with the movement time data recorded in the device log, the preheating completion time is determined. The time difference between the preheating completion time and the moving time value is calculated using a time series comparison method to obtain the deviation data between each preheating event and the moving event; Based on the time difference of the deviation data, the starting point of the drilling operation is synchronously calibrated, and the calibrated set of time points is output. Based on the calibrated set of time points, trigger times that meet the drilling conditions are extracted, and based on the trigger times and the control parameters of the drilling operation, a sequence of operation control instructions is generated. Based on the sequence of operation control instructions and the operating status of the drilling equipment, the target trigger time for the drilling operation is determined.
[0012] According to the adaptive control method for laser drilling of PCB boards of the present invention, if the target triggering time does not overlap with the clamping scheduling sequence, a buffer interval is inserted in the non-overlapping time gap to determine the rhythm matching time schedule, including: Extract the time point information corresponding to the target trigger time from the pre-established job record database, assign a timestamp to each job unit, and obtain the job trigger time set; Based on the clamping and scheduling sequence, the time schedule of each scheduling unit is read from the scheduling management system to obtain the scheduling task time sequence; The set of job trigger times is compared with the time periods in the clamping and scheduling sequence to determine whether there is any overlap in time intervals; If there is overlap, the overlapping interval is marked as a time conflict interval, and the time conflict interval is redistributed using a preset time adjustment rule to determine the time distribution; If the time distribution has no overlapping intervals, then identify the time gap between the job trigger time and the scheduling task time, insert a buffer interval in the time gap, and record the insertion position and duration of the buffer interval to obtain the buffered time period distribution. Based on the buffered time period distribution, a rhythm matching schedule including drilling operations, workpiece clamping scheduling, and dynamic buffer time is generated.
[0013] The adaptive control method for laser drilling of PCB boards according to the present invention further includes: Based on the rhythm matching schedule, the operating status information of the equipment is collected in real time, and the operating status information is compared with the rational state corresponding to the rhythm matching schedule to determine the deviation. Based on the aforementioned deviation, the movement time points in the rhythm matching schedule are updated to obtain updated time data; If the updated time data is significantly longer than the historical time, an evaluation of the updated time data is triggered to identify the key nodes affecting the time extension. Based on the key nodes, the processing path sequence in the rhythm matching timetable is optimized and calculated using a genetic algorithm to obtain the adjusted path scheme; If the adjusted path scheme meets the preset rhythm matching conditions, then the adjusted path scheme is applied to obtain the dynamically adjusted equipment operating status.
[0014] The present invention also provides an adaptive control system for laser drilling of PCB boards, comprising: The path sequence determination module is used to iteratively optimize the access order of the laser head from the starting point to each hole position based on the position coordinate data of all micro-holes on the PCB circuit board and a genetic algorithm to obtain the laser head movement path sequence. The movement time determination module is used to calculate the Euclidean distance between adjacent holes based on the laser head movement path sequence, and to determine the movement time value of each movement segment based on the Euclidean distance and the laser head speed parameters. The clamping scheduling determination module is used to trigger a parallel clamping operation if the movement time value exceeds a preset clamping preparation threshold, and to determine a clamping scheduling sequence based on the workpiece corresponding to the hole position whose movement time value exceeds the clamping preparation threshold, wherein the clamping preparation threshold is the maximum time required for clamping the workpiece at the hole position. The start-up timing determination module is used to calculate the time to start the preheating module during the movement based on the remaining time interval in the clamping scheduling sequence and the fixed duration required for laser preheating, and to obtain a list of preheating start-up timings. The trigger time determination module is used to determine the preheating completion time based on the preheating start timing list, and to synchronously calibrate the start point of the drilling operation based on the difference between the preheating completion time and the moving time value, so as to determine the target trigger time of the drilling operation. The rhythm matching time determination module is used to insert a buffer interval in the non-overlapping time gap if the target triggering time does not overlap with the clamping scheduling sequence, and to determine the rhythm matching time schedule. The rhythm matching schedule is used to control the equipment for each stage of laser drilling on the PCB board.
[0015] This invention provides an adaptive control method and system for laser drilling of PCB boards. Addressing the logical problems of low production efficiency and process interruptions caused by non-optimal laser head paths, disconnection between movement time and workpiece clamping, and inaccurate preheating timing in traditional drilling operations, the method collects micro-hole coordinates and uses a genetic algorithm to iteratively optimize the laser head access sequence, generating a movement path sequence. Then, it calculates the Euclidean distance and speed parameters between adjacent holes to determine the movement time value. If the movement time value exceeds the clamping threshold, parallel operations are triggered to adjust the clamping scheduling sequence. Simultaneously, the remaining time interval is extracted to determine the preheating start timing, synchronously calibrating the drilling trigger time and inserting buffer intervals to avoid disconnection. Ultimately, it achieves a complete rhythm matching of path optimization, clamping and preheating synchronization, and dynamic adjustment, improving the continuity and production efficiency of drilling operations and reducing waiting time losses. This invention enables the rational planning of laser head movement paths in complex processing environments and simultaneously optimizes the operating rhythm of each stage of the equipment to reduce waiting time and resource waste, thereby improving the overall efficiency of laser drilling technology. Attached Figure Description
[0016] Figure 1 This is one of the flowcharts of the adaptive control method for laser drilling of PCB boards provided in the embodiments of the present invention; Figure 2 This is the second flowchart of the adaptive control method for laser drilling of PCB boards provided in this embodiment of the invention; Figure 3 This is the third flowchart of the adaptive control method for laser drilling of PCB boards provided in this embodiment of the invention; Figure 4 This is the fourth flowchart of the adaptive control method for laser drilling of PCB boards provided in the embodiments of the present invention; Figure 5 This is the fifth flowchart of the adaptive control method for laser drilling of PCB boards provided in the embodiments of the present invention; Figure 6 This is the sixth flowchart of the adaptive control method for laser drilling of PCB boards provided in this embodiment of the invention; Figure 7 This is the seventh flowchart of the adaptive control method for laser drilling of PCB boards provided in this embodiment of the invention. Detailed Implementation
[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0018] Reference Figure 1 This invention provides an adaptive control method for laser drilling of PCB boards, applied to an industrial control system, comprising the following steps: Step 100: Based on the position coordinate data of all micro-holes on the PCB circuit board, a genetic algorithm is used to iteratively optimize the access order of the laser head from the starting point to each hole position to obtain the laser head movement path sequence. First, the position coordinates of all micro-holes on the PCB circuit board to be processed are acquired. These position coordinates constitute the basic spatial information for planning the laser head's motion path. Then, a genetic algorithm is used to optimize the motion sequence of the laser head, starting from a set initial position and sequentially visiting each hole. The genetic algorithm, by simulating natural selection and genetic mechanisms, encodes possible path sequences as individuals in a population. During the iteration process, it continuously evaluates performance indicators such as the total travel distance or time for each path, and uses genetic operators such as selection, crossover, and mutation to continuously generate and filter better path solutions.
[0019] The genetic algorithm gradually improves path performance through multiple iterations. Each iteration tends to retain path sequences with shorter travel distances or higher efficiency, while exploring new potential optimization directions, thus effectively avoiding getting trapped in local optima. Ultimately, the genetic algorithm converges to a laser head movement path sequence that is approximately optimal or significantly optimized globally, where the optimal order in which the laser head visits each micropore is included.
[0020] Step 200: Based on the laser head moving path sequence, calculate the Euclidean distance between adjacent holes, and based on the Euclidean distance and the laser head speed parameters, determine the moving time value of each moving segment; After obtaining the laser head movement path sequence using a genetic algorithm, the abstract path sequence is transformed into a series of specific, continuous movement segments based on the optimal access order within the sequence. Each movement segment represents the linear travel of the laser head between two adjacent apertures. Based on the coordinates of any two adjacent apertures in the laser head movement path sequence, the Euclidean distance between them is calculated, thus quantifying the spatial positional relationship into a geometric length value.
[0021] After obtaining the Euclidean distance for each segment, it needs to be combined with the laser head's velocity parameters, which are the laser head's rated movement speed during the positioning process. These velocity parameters are typically determined by the device's mechanical characteristics and control system, and are either a known constant or within a controllable range. By dividing the Euclidean distance of each movement segment by the corresponding laser head velocity parameter, the time required to complete that segment can be derived, i.e., the movement time value for each segment. This calculation process is repeated throughout the entire path sequence, assigning a specific movement time value to each movement segment. Ultimately, the entire laser head movement process is deconstructed into a quantified, time-sequential chain of movement tasks.
[0022] Step 300: If the movement time value exceeds a preset clamping preparation threshold, a parallel clamping operation is triggered. Based on the workpieces corresponding to the holes whose movement time values exceed the clamping preparation threshold, a clamping scheduling sequence is determined, wherein the clamping preparation threshold is the maximum time required for clamping the workpieces at the holes. After calculating the movement time of the laser head between each hole position, the movement time value is compared in real time with a preset clamping preparation threshold. This clamping preparation threshold is defined as the maximum time that may be required to complete all necessary clamping operations, such as fixing and calibrating a workpiece (e.g., a sub-board or a specific material block), on the PCB worktable. If a calculated movement time value exceeds this clamping preparation threshold, it indicates that the idle time spent by the laser head during this movement is sufficient to accommodate a complete clamping preparation operation. Therefore, a parallel clamping operation command is automatically triggered. This clamping operation command utilizes the idle time window while the laser head is moving and has not yet reached the next hole position to prepare for clamping the workpiece corresponding to a specific hole position in advance.
[0023] Specifically, based on the target hole positions corresponding to all movement segments exceeding the threshold, the associated workpiece information is analyzed, and an optimal clamping schedule sequence is dynamically determined. This clamping schedule sequence reflects which longer movement time should be used to prioritize clamping which subsequent workpiece, ensuring that the workpiece is ready when the laser head needs to process the hole positions in the future, thus avoiding the stagnation time of the laser head waiting for clamping after completing the current task.
[0024] Step 400: Based on the remaining time interval in the clamping and scheduling sequence, and combined with the fixed duration required for laser preheating, calculate the time to start the preheating module during the movement, and obtain a list of preheating start times; After obtaining the clamping and scheduling sequence, the laser preheating and switching process begins. Laser modules often require a fixed, incompressible startup time to reach stable processing power and beam quality from standby. To eliminate the pure waiting time caused by this preheating process, it is embedded into existing time gaps. The remaining, unused time intervals on the laser head's movement time axis are analyzed, and these remaining time intervals are compared and fitted with the fixed duration required for laser preheating. Within a sufficiently long and continuous remaining time interval, the latest possible startup time is found, ensuring that the laser preheating process starting from this moment can be completed smoothly just before the laser head reaches the next target hole position and drilling begins.
[0025] By using this reverse calculation, the optimal time to activate the laser preheating module is determined for each eligible movement segment. Ultimately, all these calculated time points are compiled into a preheating activation timing list, ensuring that the laser is in optimal condition every time it needs to operate, eliminating the additional time overhead caused by waiting for preheating.
[0026] Step 500: Based on the preheating start timing list, determine the preheating completion time, and based on the difference between the preheating completion time and the moving time value, synchronously calibrate the starting point of the drilling operation to determine the target triggering time of the drilling operation. After obtaining the list of preheating start-up times to guide the laser's early activation, the estimated completion time for each preheating command is further calculated. This preheating completion time is the landmark point at which the laser equipment reaches a stable operating state and is ready. However, the actual execution of the processing action also depends on the physical movement of the laser head; it must have moved into position and stabilized above the target hole. Therefore, the entire control logic needs to consider both energy readiness and mechanical positioning simultaneously.
[0027] To achieve this goal, the calculated preheating completion time is compared with the previously determined movement time of the laser head to the corresponding hole position. The difference between the preheating completion time and the movement time is calculated, whereby the difference characterizes the relative speed between energy preparation and mechanical movement. If the preheating completion time is earlier than the laser head movement time, it indicates that the laser needs a short wait; conversely, it indicates that there is a time leeway in the movement process. Based on this difference, the drilling start point for each hole position is synchronously calibrated. This calibration process is used to determine the target trigger time for performing the drilling operation. This target trigger time is the earliest possible time point determined after calculation, ensuring that both are ready. Ultimately, this step eliminates any potential waiting time caused by sequential operations (i.e., moving to the point first, then starting preheating), allowing the drilling operation to be triggered immediately, either the moment the laser head arrives at the hole position or the moment the laser completes preheating, provided that the other is also ready.
[0028] Step 600: If the target triggering time does not overlap with the clamping scheduling sequence, then insert a buffer interval in the non-overlapping time gap to determine the rhythm matching time schedule. This step performs conflict detection, specifically checking whether the target drilling trigger time for each hole location overlaps with the parallel clamping schedule. If an overlap occurs, it means that drilling and clamping, two mutually exclusive physical operations, need to be performed simultaneously, which is unreasonable. When no overlap is detected between the target trigger time and the clamping operation sequence, there appears to be no conflict. However, further consideration reveals that these non-overlapping time gaps are natural transition zones between different processes. To ensure a smooth workflow and prevent any haste or waiting caused by micro-timing fluctuations or equipment response delays, buffer intervals are inserted into these non-overlapping gaps. By inserting buffer intervals, the originally independently optimized time nodes are transformed into a globally synchronized and seamlessly connected time schedule.
[0029] The resulting rhythm matching schedule is essentially a unified set of instructions that coordinates all aspects of the entire PCB laser drilling process, including the laser head's movement trajectory, the workpiece clamping sequence, the laser preheating timing, and the drilling operation triggering time. This rhythm matching schedule ensures that path optimization in physical space can be seamlessly translated into efficient and stable execution in the time dimension, directly driving the collaborative work of the entire laser drilling equipment.
[0030] This invention provides an adaptive control method for laser drilling of PCB boards. Addressing the logical problems of low production efficiency and process interruptions caused by non-optimal laser head paths, disconnection between movement time and workpiece clamping, and inaccurate preheating timing in traditional drilling operations, this method collects micro-hole coordinates and uses a genetic algorithm to iteratively optimize the laser head access sequence, generating a movement path sequence. Then, it calculates the Euclidean distance and speed parameters between adjacent holes to determine the movement time value. If the movement time value exceeds the clamping threshold, parallel operations are triggered to adjust the clamping scheduling sequence. Simultaneously, the remaining time interval is extracted to determine the preheating start timing, synchronously calibrating the drilling trigger time and inserting buffer intervals to avoid disconnection. Ultimately, this achieves a complete rhythm matching of path optimization, clamping and preheating synchronization, and dynamic adjustment, improving the continuity and production efficiency of drilling operations and reducing waiting time losses. This invention enables the rational planning of laser head movement paths in complex processing environments and simultaneously optimizes the operating rhythm of each stage of the equipment to reduce waiting time and resource waste, thereby improving the overall efficiency of laser drilling technology.
[0031] In one embodiment, please refer to Figure 2 The step of calculating the Euclidean distance between adjacent apertures based on the laser head movement path sequence, and determining the movement time value for each movement segment based on the Euclidean distance and the laser head speed parameters, includes: Step 201: Based on the position data between adjacent holes in the laser head movement path sequence, calculate the straight-line distance between each adjacent hole using the Euclidean distance formula to obtain the Euclidean distance between adjacent holes; Step 202: Based on the Euclidean distance and combined with the laser head speed parameters, calculate the theoretical movement time of each movement segment to obtain a time distribution table; Step 203: If the theoretical movement time of any moving segment in the time distribution table exceeds the preset time threshold, the path sequence of the corresponding moving segment is locally adjusted to determine the updated distance value. Step 204: Based on the updated distance value and the laser head speed parameter, recalculate the actual movement time of the corresponding moving segment, determine the adjustment time value, and update the time distribution table based on the adjustment time value; Step 205: Based on the updated time distribution table, determine the time range of each moving segment. If there are moving segments with unbalanced time ranges, optimize the laser head moving path sequence to obtain a balanced path distribution. Step 206: Based on the equalized path distribution and the laser head speed parameters, determine the movement time value.
[0032] After determining the laser head's movement path sequence, the linear Euclidean distance between adjacent holes is first calculated based on their coordinates, thus quantifying the spatial path into specific distance data. Then, combined with the laser head's constant speed parameter, the theoretical movement time for each movement segment in the path is calculated, forming a preliminary time distribution table. This table describes the temporal characteristics of the entire processing. Subsequently, to ensure stable and efficient production cycle time, if the theoretical time of any movement segment in the time distribution table exceeds the time range, it indicates a potential efficiency bottleneck in that segment. Fine-tuning of the local path sequence is then performed on these specific time-out segments, such as adjusting the order of waypoints to avoid unnecessary large-span movements, thereby generating updated distance values.
[0033] Based on the updated distance values, the actual movement time of these adjusted segments is recalculated, and the original time distribution table is updated accordingly with the resulting adjusted time values. Then, for the updated time distribution table, the time value range distribution of each movement segment is analyzed. If segments with unbalanced time values are found—that is, some segments take too long while others are too short, leading to frequent device start-ups and shutdowns or unstable rhythms—the laser head movement path sequence is further optimized for time balancing, ultimately resulting in a more uniform and smooth path distribution in the time dimension. Based on this balanced path distribution, and combined with speed parameters, the reliable time value for each movement segment is finally determined, providing an optimized time benchmark for scheduling subsequent parallel operations such as clamping and preheating.
[0034] For example, when processing the laser head's movement path sequence to calculate the movement time between adjacent holes, the specific calculation and analysis can be achieved as follows. Assume the laser head's movement path sequence consists of three hole coordinate points: A(0,0), B(3,4), and C(6,0), and the laser head's movement speed is 5 units per second. First, calculate the Euclidean distance between adjacent holes. For the distance from A to B, the Euclidean distance is calculated using Euclidean formula as follows:
[0035] Where is the Euclidean distance between any two points. Let the coordinates of a point be , Let A be the coordinates of another point. Therefore, using the above formula, the distance from A to B is calculated to be 5 units; similarly, the distance from B to C is 5 units. Next, combining the laser head speed parameters, the time for each movement segment is calculated. The time formula is distance divided by speed, so the movement time from A to B is 5 / 5 = 1 second, and the movement time from B to C is also 5 / 5 = 1 second. Through the above calculations, the specific time values for each movement segment are 1 second and 1 second respectively. Further analysis shows that if there is a processing dwell time in the path (e.g., 0.5 seconds for processing each hole), then the total time needs to be added to the dwell time, that is, the total time is the movement time of 2 seconds plus the dwell time of 1.5 seconds (3 holes × 0.5 seconds), totaling 3.5 seconds.
[0036] In this embodiment, by introducing a dynamic optimization mechanism that combines local adjustment and global balancing, the real-time performance and adaptive capability are significantly improved. Furthermore, by pursuing a balanced distribution of time values, the movement of the laser head is made smoother and the rhythm is more stable.
[0037] In one embodiment, please refer to Figure 3 If the movement time value exceeds a preset clamping preparation threshold, a parallel clamping operation is triggered. Based on the workpiece corresponding to the hole position where the movement time value exceeds the clamping preparation threshold, a clamping scheduling sequence is determined, including: Step 301: If the movement time value exceeds the preset clamping preparation threshold, a parallel clamping operation is triggered, and the workpieces corresponding to the holes whose movement time values exceed the clamping preparation threshold are taken as workpieces that need to be processed in parallel. Step 302: Based on the clamping requirement data corresponding to the workpiece combination, extract the appropriate parallel clamping strategy from the pre-established scheduling rule library and determine the clamping scheduling scheme. Step 303: Based on the clamping and scheduling scheme, the time window for the workpiece processing sequence of each hole position is reallocated to determine the optimized time matching data. Step 304: Based on the optimized time matching data, the clamping scheduling scheme is optimized using a genetic algorithm to determine the clamping scheduling sequence.
[0038] After the equalization of movement time is completed, the decision-making and scheduling phase for parallel clamping begins. First, the movement time value of each movement segment is compared with a preset clamping preparation threshold. When a movement time value is detected to cover the complete clamping time of a workstation, a parallel clamping operation is triggered. The workpieces associated with the target hole positions corresponding to the timed-out movement segments are identified as potential parallel processing objects, and all workpieces corresponding to the target hole positions are grouped as workpieces requiring parallel processing. Then, based on the specific clamping requirements data of this workpiece group, the most suitable parallel clamping strategy is extracted and selected from a pre-established scheduling rule base containing multiple optimization objectives. This parallel clamping strategy can include multiple factors such as workpiece priority, clamping tool availability, and material flow smoothness, thereby generating a preliminary clamping scheduling scheme.
[0039] Subsequently, based on the clamping scheduling scheme, the processing timeline was further refined. For each clamping hole and its workpiece, the time window was reallocated and embedded to ensure that parallel clamping operations could be inserted into the idle time window of the laser head movement without conflicting with drilling operations, thus generating optimized time-matching data. To further improve the quality of the scheduling scheme, a genetic algorithm was introduced to globally optimize the clamping scheduling scheme. Based on the time-matching data, this genetic algorithm iteratively evolves to find the optimal workpiece clamping sequence and timing arrangement, outputting a clamping scheduling sequence with the highest efficiency and fewest conflicts at the global level.
[0040] For example, to obtain each determined movement time value and perform time window matching to meet the clamping requirements of subsequent hole positions, assume there is a set of processing equipment and workpieces. The movement time between equipment is calculated using a path planning algorithm. The movement time from equipment A to equipment B is 3.5 minutes, and from equipment B to equipment C is 2.2 minutes. These time values are generated based on historical data and real-time distance calculations. The algorithm uses Dijkstra's shortest path algorithm to ensure that the movement time is accurate to 0.1 minutes. Next, for the clamping requirements of subsequent hole positions, a time window is generated according to the processing sequence. For example, if workpiece 1 needs to be processed on equipment B, the time window is from the 5th to the 10th minute. The movement time is matched with the time window, and it is calculated whether the movement time meets the window constraint. If the 3.5-minute movement time from equipment A to B plus the current time of 4 minutes results in an arrival time of 7.5 minutes, which falls within the window, then the match is successful; otherwise, it is recorded as a mismatch. Subsequently, a clamping preparation threshold of 2.0 minutes is set. If the movement time exceeds this threshold (e.g., 3.5 minutes from A to B is greater than 2.0 minutes), a parallel clamping operation is triggered, automatically invoking the scheduling module to generate parallel task instructions. This synchronizes the clamping preparation with the movement operation, reducing overall wasted time. Finally, the clamping scheduling sequence is adjusted based on the parallel operation. For example, the original sequence was that workpiece 1 was clamped and processed on equipment B. Now, it is adjusted so that workpiece 1 completes its movement on equipment A while equipment B starts clamping preparation in advance, generating a new sequence: workpiece 1's movement and clamping are parallel, and the expected total time is reduced from 10 minutes to 8.5 minutes.
[0041] In this embodiment, by introducing a rule-based dynamic strategy selection and secondary optimization, and through the optimization of a genetic algorithm, the clamping sequence and the movement path are ensured to achieve deep coordination on the timeline, thereby minimizing the production cycle time, converting equipment idle time into valuable production preparation time, and improving the utilization rate of production resources.
[0042] In one embodiment, please refer to Figure 4 Based on the remaining time interval in the clamping and scheduling sequence, and combined with the fixed duration required for laser preheating, the time to activate the preheating module during movement is calculated, resulting in a preheating activation timing list, including: Step 401: Based on the sequence data in the clamping scheduling sequence, extract the remaining time and time interval corresponding to each scheduling unit to obtain a preliminary set of time intervals; Step 402: Based on the preliminary set of time intervals, obtain the fixed duration required for laser preheating. If the time interval is greater than the fixed duration, determine that the corresponding time period can be used for preheating and determine the list of preheatable time periods. Step 403: Based on the list of preheatable time periods, obtain the movement status of each time period. If the movement status meets the preset stability conditions, determine that the corresponding time period is suitable for activating the preheating module, and obtain a set of candidate preheating opportunities. Step 404: Based on the candidate preheating timing set and combined with the start-up conditions of the laser preheating module, sort the priority of each candidate preheating timing to obtain a sorted start-up timing list. Step 405: Based on the time point of each startup opportunity in the sorted startup opportunity list, and combined with the execution order of the clamping scheduling sequence, the preheating startup opportunity list is obtained.
[0043] After obtaining the clamping schedule sequence, the laser preheating stage is scheduled. This step aims to seamlessly embed the laser preheating stage into the existing time frame. First, the clamping schedule sequence is parsed to extract the remaining unoccupied time intervals after each scheduling unit has completed its execution, resulting in a preliminary set of time intervals. These time intervals constitute the time resource pool for parallel operations.
[0044] Next, each time interval in the initial set of time intervals is compared with the fixed duration required by the laser preheating module to identify which time intervals are long enough to complete a full preheating process, thus determining a list of preheatable time intervals. However, the physical state of the laser head within this time window also needs to be considered. Therefore, the laser head movement state corresponding to these preheatable time intervals is further analyzed. When the movement meets preset stability conditions, such as uniform motion or being in a stable trajectory segment, the time interval is confirmed as suitable for activating the preheating module, resulting in a set of candidate preheating opportunities.
[0045] Next, based on the laser preheating module's activation conditions, which include factors such as energy efficiency, equipment lifespan, and timing urgency, all candidate activation times in the candidate preheating timing set are comprehensively evaluated and prioritized, resulting in a list of activation times arranged in the optimal order. Finally, this prioritized activation timing list is aligned and integrated with the execution order of the clamping scheduling sequence on the timeline. This allows for the calculation of when each preheating command should be issued, generating a preheating activation timing list to guide execution.
[0046] For example, the remaining time intervals are extracted from the adjusted clamping schedule sequence, and combined with the fixed duration required for laser preheating, it is determined whether to start the preheating module during the movement, ultimately generating a preheating start timing list. The specific implementation method can be achieved through the following logic and algorithm. First, assume that the clamping schedule sequence contains multiple workpiece movement time nodes. For example, the movement time of workpiece A from position 1 to position 2 is 5.5 seconds, the movement time of workpiece B from position 2 to position 3 is 3.2 seconds, and the fixed preheating duration of the laser preheating module is 2.0 seconds. By reading the schedule sequence data, each movement time interval is extracted and stored as a time list, such as [5.5, 3.2, 4.0]. Next, the list is traversed, comparing the relationship between each time interval and the preheating duration. The algorithm logic is: if the movement time interval is greater than or equal to the preheating duration, the preheating module can be started during the movement; otherwise, it must wait until the movement is completed before starting.
[0047] For a movement time of 5.5 seconds, which is greater than 2.0 seconds, it is recorded as "startable," and the start time is calculated to be 0.5 seconds after the movement begins (leaving a 0.5-second safety buffer). Similarly, a movement time of 3.2 seconds, which is also greater than 2.0 seconds, is also recorded as "startable," with the start time being 0.2 seconds after the movement begins. However, if a movement time is 1.5 seconds, which is less than 2.0 seconds, it is recorded as "not startable," and preheating must be arranged after the movement ends. Through this item-by-item analysis, a list of preheating start times is generated, such as ["Start 0.5 seconds after workpiece A begins movement", "Start 0.2 seconds after workpiece B begins movement", "Start after workpiece C ends movement"].
[0048] This embodiment achieves the ultimate utilization of fragmented time resources, transforming previously idle micro-hour sequence windows into valuable equipment preparation time; and by introducing motion stability judgment and multi-target priority sorting, it improves efficiency while ensuring the stability of the processing process and the service life of the laser equipment.
[0049] In one embodiment, please refer to Figure 5 The process of determining the preheating completion time based on the preheating start timing list, and synchronously calibrating the start point of the drilling operation based on the difference between the preheating completion time and the movement time value, to determine the target trigger time of the drilling operation, includes: Step 501: Based on the start and end times of each preheating event in the preheating start timing list, and combined with the movement time data recorded in the device log, determine the preheating completion time; Step 502: Calculate the time difference between the preheating completion time and the moving time value using a time series comparison method to obtain the deviation data between each preheating event and the moving event; Step 503: Based on the time difference value of the deviation data, the starting point of the drilling operation is synchronously calibrated, and the calibrated set of time points is output. Step 504: Extract the trigger time that meets the drilling conditions based on the calibrated set of time points, and generate a sequence of operation control instructions based on the trigger time and the control parameters of the drilling operation. Step 505: Based on the operation control command sequence and the operating status of the drilling equipment, determine the target trigger time for the drilling operation.
[0050] After generating the preheating start-up timing list, based on the start and end times of each preheating event in the list and combined with the actual movement time data recorded in the equipment log, the estimated preheating completion time of the laser after each start-up is calculated, thus transforming the start-up command event into a ready state time point. Then, using a time series comparison method, this preheating completion time is compared with the movement time value of the laser head moving to the corresponding aperture position, and the time difference between the two is calculated. This yields the deviation data between each preheating event and movement event, reflecting the relative positional relationship between the energy ready and mechanically in place states on the time axis.
[0051] Based on this deviation data, a dynamic synchronous calibration is performed on the theoretical starting point of the drilling operation to fine-tune the drilling trigger timing. This ensures that the two prerequisites—stable laser head positioning and stable laser output—are simultaneously met, resulting in a calibrated set of time points. Subsequently, all trigger times that meet the drilling conditions are extracted from this calibrated set. Based on these trigger times, and combined with control parameters such as the power and pulse frequency required for the drilling operation, a time-stamped sequence of operation control commands is generated to directly drive the equipment. Finally, the final triggering of the operation control command sequence is confirmed by combining the real-time operating status feedback of the drilling equipment. For example, the target trigger time for the drilling operation can be determined and issued, and processing can be started, provided that the real-time operating status of the drilling equipment meets the operating conditions.
[0052] For example, in the management of preheating start-up timing for drilling operations, the system first automatically obtains a list of preheating start-up times. Assuming the list contains three time points: 08:00:00, 08:10:00, and 08:20:00, these times are uploaded in real-time by equipment sensors to the central control system. The time is converted into timestamps in seconds for processing; for example, 08:00:00 corresponds to a timestamp of 28800 seconds. Then, the start point of the drilling operation is synchronously calibrated. Assuming the initial planned start time of the drilling operation is 08:15:00, corresponding to a timestamp of 29700 seconds, an algorithm iterates through the preheating time list to find the closest preheating point that is earlier than the start time, namely 08:10:00 (timestamp 29400 seconds). This is used as a benchmark for calibration, calculating the time difference as 29700 - 29400 = 300 seconds, ensuring that the drilling operation starts after preheating is complete. Next, the difference between the movement time and the preheating completion time is calculated. Assuming it takes 200 seconds for the equipment to move from the standby position to the drilling position, and the preheating completion time is 120 seconds after 08:10:00, i.e., 08:12:00 (timestamp 29520 seconds), the difference is 29700 - 29520 - 200 = 280 seconds. This difference is greater than 0, indicating a waiting time that can be optimized. Finally, the precise trigger time for the drilling operation is determined based on the difference. If the difference is greater than or equal to 0, the trigger time is the planned start time of 08:15:00; if it is less than 0, it is delayed until after preheating and movement are completed, resulting in 08:15:00 in this case. This time is automatically sent to the drilling equipment control module to ensure the operation is executed on time.
[0053] In this embodiment, a calibration mechanism based on real-time deviation effectively eliminates the delay caused by timing accumulation error and equipment response uncertainty, thereby improving the accuracy and overall efficiency of the process.
[0054] In one embodiment, please refer to Figure 6 If the target triggering time does not overlap with the clamping scheduling sequence, a buffer interval is inserted in the non-overlapping time gap to determine the rhythm matching time schedule, including: Step 601: Extract the time point information corresponding to the target trigger time from the pre-established job record database, assign a timestamp to each job unit, and obtain a set of job trigger times; Step 602: Based on the clamping scheduling sequence, read the time arrangement of each scheduling unit from the scheduling management system to obtain the scheduling task time sequence; Step 603: Compare the set of job trigger times with the time periods in the clamping and scheduling sequence to determine whether there is any overlap in time intervals; Step 604: If there is overlap, the overlapping interval is marked as a time conflict interval, and the time conflict interval is redistributed using a preset time adjustment rule to determine the time distribution; Step 605: If the time distribution has no overlapping intervals, identify the time gap between the job trigger time and the scheduling task time, insert a buffer interval in the time gap, and record the insertion position and duration of the buffer interval to obtain the buffered time period distribution. Step 606: Based on the buffered time period distribution, generate a rhythm matching schedule that includes drilling operations, workpiece clamping scheduling, and dynamic buffer time.
[0055] First, time point information corresponding to the trigger times of all drilling targets is extracted from a pre-established job record database, and each drilling job unit is assigned a timestamp, thus obtaining a set of job trigger times. Based on the clamping scheduling sequence, the specific time arrangements for each clamping task are read from the scheduling management system, forming a parallel scheduling task time sequence. Subsequently, the set of job trigger times is compared with the time sequence of the clamping scheduling sequence to detect any overlap in time intervals between the job trigger times and the task time intervals in the clamping scheduling sequence. Such overlap means that the two physical processes of laser drilling and workpiece clamping are scheduled to be executed simultaneously, which will cause irreconcilable equipment conflicts. When time interval overlap is detected, these overlapping intervals are marked as time conflict intervals, and the execution time of the conflicting parties is redistributed according to preset time adjustment rules, such as prioritizing processing continuity or fine-tuning according to task priority, until a conflict-free time distribution is obtained.
[0056] After successfully eliminating all conflicts, unused micro-time gaps between job triggering and scheduling tasks were further identified. To improve system stability and fault tolerance, buffer intervals were inserted into these gaps, and the insertion position and duration of each buffer were recorded, ultimately forming a buffered time period distribution. Finally, based on this buffered time period distribution, the three key elements of drilling operations, workpiece clamping scheduling, and dynamic buffer time were integrated to generate a global, highly coordinated rhythm matching schedule.
[0057] In this embodiment, the risk of equipment interference is eliminated through an automated conflict detection and intelligent resolution mechanism, ensuring safe and smooth production. Since the rhythm matching schedule essentially contains a dynamic buffer elastic system, it can effectively improve the stability of the production cycle and the lifespan of the equipment.
[0058] In one embodiment, please refer to Figure 7 It also includes: Step 700: Based on the rhythm matching schedule, collect the operating status information of the equipment in real time, compare the operating status information with the rational state corresponding to the rhythm matching schedule, and determine the deviation. Step 800: Based on the deviation, update the movement time points in the rhythm matching time schedule to obtain updated time data; Step 900: If the updated time data is significantly longer than the historical time, an evaluation of the updated time data is triggered to determine the key nodes affecting the time extension. Step 1000: Based on the key nodes, optimize the processing path sequence in the rhythm matching timetable using a genetic algorithm to obtain the adjusted path scheme; Step 1100: If the adjusted path scheme meets the preset rhythm matching conditions, then apply the adjusted path scheme to obtain the dynamically adjusted equipment operating status.
[0059] Firstly, real-time monitoring of the production site is conducted, continuously collecting actual operating status information of key equipment such as laser heads and clamping mechanisms based on a rhythm-matching schedule. This real-world operating status information can be compared with the ideal state predicted by the schedule at the millisecond level to determine the deviations. For example, whether the laser head is moving slightly slower due to mechanical resistance, or whether clamping takes slightly longer due to differences in parts. When a deviation is detected, the first-level response is initiated. Based on these deviations, the movement time points in the rhythm-matching schedule are updated. For example, the start time of subsequent tasks can be slightly delayed to obtain updated time data. This updated time data ensures that the schedule aligns with the current actual situation, maintaining smooth production.
[0060] If the updated time data shows a significant overall increase compared to historical records, a root cause analysis process is triggered. This process evaluates the updated time data to determine which critical node is influencing the time extension, thus identifying the critical node. Then, based on the identified critical node, the genetic algorithm is invoked again to optimize the underlying processing path sequence upon which the rhythm matching schedule depends. By altering the laser head's movement path, the newly discovered efficiency barrier is fundamentally overcome, resulting in an adjusted path scheme.
[0061] Finally, a verification process is conducted. If the verification results show that the adjusted path scheme can meet the preset rhythm matching conditions, such as a shorter overall processing cycle and a more balanced time distribution, then the adjusted path scheme is applied. At this point, by acquiring the dynamically adjusted equipment operating status, a new round of monitoring-adjustment cycle is initiated, forming a continuously self-improving intelligent production system.
[0062] This embodiment proposes an adaptive control system that can cope with uncertainty and continuously self-optimize, thereby improving the robustness and intelligence of production.
[0063] The adaptive control system for laser drilling of PCB boards provided by the present invention is described below. The adaptive control system for laser drilling of PCB boards described below can be referred to in correspondence with the adaptive control method for laser drilling of PCB boards described above.
[0064] The present invention also provides an adaptive control system for laser drilling of PCB boards, comprising: The path sequence determination module is used to iteratively optimize the access order of the laser head from the starting point to each hole position based on the position coordinate data of all micro-holes on the PCB circuit board and a genetic algorithm to obtain the laser head movement path sequence. The movement time determination module is used to calculate the Euclidean distance between adjacent holes based on the laser head movement path sequence, and to determine the movement time value of each movement segment based on the Euclidean distance and the laser head speed parameters. The clamping scheduling determination module is used to trigger a parallel clamping operation if the movement time value exceeds a preset clamping preparation threshold, and to determine a clamping scheduling sequence based on the workpiece corresponding to the hole position whose movement time value exceeds the clamping preparation threshold, wherein the clamping preparation threshold is the maximum time required for clamping the workpiece at the hole position. The start-up timing determination module is used to calculate the time to start the preheating module during the movement based on the remaining time interval in the clamping scheduling sequence and the fixed duration required for laser preheating, and to obtain a list of preheating start-up timings. The trigger time determination module is used to determine the preheating completion time based on the preheating start timing list, and to synchronously calibrate the start point of the drilling operation based on the difference between the preheating completion time and the moving time value, so as to determine the target trigger time of the drilling operation. The rhythm matching time determination module is used to insert a buffer interval in the non-overlapping time gap if the target triggering time does not overlap with the clamping scheduling sequence, and to determine the rhythm matching time schedule. The rhythm matching schedule is used to control the equipment for each stage of laser drilling on the PCB board.
[0065] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. An adaptive control method for laser drilling on PCB boards, characterized in that, Applications in industrial control systems, including: Based on the position coordinate data of all microholes on the PCB circuit board, a genetic algorithm is used to iteratively optimize the access order of the laser head from the starting point to each hole position, and obtain the laser head movement path sequence. Based on the laser head movement path sequence, the Euclidean distance between adjacent holes is calculated, and based on the Euclidean distance and the laser head speed parameters, the movement time value of each movement segment is determined. If the movement time value exceeds the preset clamping preparation threshold, a parallel clamping operation is triggered. Based on the workpieces corresponding to the holes whose movement time values exceed the clamping preparation threshold, a clamping scheduling sequence is determined, wherein the clamping preparation threshold is the maximum time required for clamping the workpieces at the holes. Based on the remaining time interval in the clamping and scheduling sequence, and combined with the fixed duration required for laser preheating, the time to start the preheating module during the movement is calculated to obtain a list of preheating start times. Based on the preheating start timing list, the preheating completion time is determined, and based on the difference between the preheating completion time and the moving time value, the starting point of the drilling operation is synchronously calibrated to determine the target triggering time of the drilling operation. If the target triggering time does not overlap with the clamping scheduling sequence, a buffer interval is inserted in the non-overlapping time gap to determine the rhythm matching time schedule; The rhythm matching schedule is used to control the equipment for each stage of laser drilling on the PCB board.
2. The adaptive control method for laser drilling of PCB boards according to claim 1, characterized in that, The step of calculating the Euclidean distance between adjacent apertures based on the laser head movement path sequence, and determining the movement time value for each movement segment based on the Euclidean distance and the laser head speed parameters, includes: Based on the position data between adjacent holes in the laser head movement path sequence, the straight-line distance between each adjacent hole is calculated using the Euclidean distance formula to obtain the Euclidean distance between adjacent holes. Based on the Euclidean distance and combined with the laser head speed parameters, the theoretical movement time of each movement segment is calculated to obtain a time distribution table; If the theoretical movement time of any moving segment in the time distribution table exceeds the preset time threshold, the path sequence of the corresponding moving segment is locally adjusted to determine the updated distance value. Based on the updated distance value and the laser head speed parameters, the actual movement time of the corresponding moving segment is recalculated, the adjustment time value is determined, and the time distribution table is updated based on the adjustment time value. Based on the updated time distribution table, the time value range of each moving segment is determined. If there are moving segments with unbalanced time value ranges, the laser head moving path sequence is optimized to obtain a balanced path distribution. Based on the balanced path distribution and the laser head speed parameters, the movement time value is determined.
3. The adaptive control method for laser drilling of PCB boards according to claim 1, characterized in that, If the movement time value exceeds a preset clamping preparation threshold, a parallel clamping operation is triggered. Based on the workpiece corresponding to the hole position where the movement time value exceeds the clamping preparation threshold, a clamping scheduling sequence is determined, including: If the movement time value exceeds the preset clamping preparation threshold, a parallel clamping operation is triggered, and the workpieces corresponding to the holes whose movement time values exceed the clamping preparation threshold are taken as workpieces that need to be processed in parallel. Based on the clamping requirement data corresponding to the workpiece combination, a suitable parallel clamping strategy is extracted from the pre-established scheduling rule base to determine the clamping scheduling scheme. Based on the clamping and scheduling scheme, the time window for the workpiece processing sequence of each hole position is reallocated to determine the optimized time matching data. Based on the optimized time matching data, a genetic algorithm is used to optimize the clamping scheduling scheme and determine the clamping scheduling sequence.
4. The adaptive control method for laser drilling of PCB boards according to claim 1, characterized in that, Based on the remaining time interval in the clamping and scheduling sequence, and combined with the fixed duration required for laser preheating, the time to activate the preheating module during movement is calculated, resulting in a preheating activation timing list, including: Based on the sequence data in the clamping and scheduling sequence, the remaining time and time interval corresponding to each scheduling unit are extracted to obtain a preliminary set of time intervals; Based on the preliminary set of time intervals, a fixed duration required for laser preheating is obtained. If the time interval is greater than the fixed duration, the corresponding time period is determined to be available for preheating, and a list of available preheating time periods is determined. Based on the list of preheatable time periods, the movement status of each time period is obtained. If the movement status meets the preset stability conditions, the corresponding time period is determined to be suitable for activating the preheating module, and a set of candidate preheating opportunities is obtained. Based on the set of candidate preheating opportunities and the activation conditions of the laser preheating module, the priority of each candidate preheating opportunity is sorted to obtain a sorted list of activation opportunities. Based on the time point of each startup opportunity in the sorted startup opportunity list, and combined with the execution order of the clamping scheduling sequence, the preheating startup opportunity list is obtained.
5. The adaptive control method for laser drilling of PCB boards according to claim 1, characterized in that, The process of determining the preheating completion time based on the preheating start timing list, and synchronously calibrating the start point of the drilling operation based on the difference between the preheating completion time and the movement time value, to determine the target trigger time of the drilling operation, includes: Based on the start and end times of each preheating event in the preheating start timing list, and combined with the movement time data recorded in the device log, the preheating completion time is determined. The time difference between the preheating completion time and the moving time value is calculated using a time series comparison method to obtain the deviation data between each preheating event and the moving event; Based on the time difference of the deviation data, the starting point of the drilling operation is synchronously calibrated, and the calibrated set of time points is output. Based on the calibrated set of time points, trigger times that meet the drilling conditions are extracted, and based on the trigger times and the control parameters of the drilling operation, a sequence of operation control instructions is generated. Based on the sequence of operation control instructions and the operating status of the drilling equipment, the target trigger time for the drilling operation is determined.
6. The adaptive control method for laser drilling of PCB boards according to claim 1, characterized in that, If the target triggering time does not overlap with the clamping scheduling sequence, a buffer interval is inserted in the non-overlapping time gap to determine the rhythm matching time schedule, including: Extract the time point information corresponding to the target trigger time from the pre-established job record database, assign a timestamp to each job unit, and obtain the job trigger time set; Based on the clamping and scheduling sequence, the time schedule of each scheduling unit is read from the scheduling management system to obtain the scheduling task time sequence; The set of job trigger times is compared with the time periods in the clamping and scheduling sequence to determine whether there is any overlap in time intervals; If there is overlap, the overlapping interval is marked as a time conflict interval, and the time conflict interval is redistributed using a preset time adjustment rule to determine the time distribution; If the time distribution has no overlapping intervals, then identify the time gap between the job trigger time and the scheduling task time, insert a buffer interval in the time gap, and record the insertion position and duration of the buffer interval to obtain the buffered time period distribution. Based on the buffered time period distribution, a rhythm matching schedule including drilling operations, workpiece clamping scheduling, and dynamic buffer time is generated.
7. The adaptive control method for laser drilling of PCB boards according to claim 1, characterized in that, Also includes: Based on the rhythm matching schedule, the operating status information of the equipment is collected in real time, and the operating status information is compared with the rational state corresponding to the rhythm matching schedule to determine the deviation. Based on the aforementioned deviation, the movement time points in the rhythm matching schedule are updated to obtain updated time data; If the updated time data is significantly longer than the historical time, an evaluation of the updated time data is triggered to identify the key nodes affecting the time extension. Based on the key nodes, the processing path sequence in the rhythm matching timetable is optimized and calculated using a genetic algorithm to obtain the adjusted path scheme; If the adjusted path scheme meets the preset rhythm matching conditions, then the adjusted path scheme is applied to obtain the dynamically adjusted equipment operating status.
8. An adaptive control system for laser drilling on PCB boards, characterized in that, include: The path sequence determination module is used to iteratively optimize the access order of the laser head from the starting point to each hole position based on the position coordinate data of all micro-holes on the PCB circuit board and a genetic algorithm to obtain the laser head movement path sequence. The movement time determination module is used to calculate the Euclidean distance between adjacent holes based on the laser head movement path sequence, and to determine the movement time value of each movement segment based on the Euclidean distance and the laser head speed parameters. The clamping scheduling determination module is used to trigger a parallel clamping operation if the movement time value exceeds a preset clamping preparation threshold, and to determine a clamping scheduling sequence based on the workpiece corresponding to the hole position whose movement time value exceeds the clamping preparation threshold, wherein the clamping preparation threshold is the maximum time required for clamping the workpiece at the hole position. The start-up timing determination module is used to calculate the time to start the preheating module during the movement based on the remaining time interval in the clamping scheduling sequence and the fixed duration required for laser preheating, and to obtain a list of preheating start-up timings. The trigger time determination module is used to determine the preheating completion time based on the preheating start timing list, and to synchronously calibrate the start point of the drilling operation based on the difference between the preheating completion time and the moving time value, so as to determine the target trigger time of the drilling operation. The rhythm matching time determination module is used to insert a buffer interval in the non-overlapping time gap if the target triggering time does not overlap with the clamping scheduling sequence, and to determine the rhythm matching time schedule. The rhythm matching schedule is used to control the equipment for each stage of laser drilling on the PCB board.