Perovskite crystalline silicon laminated solar cell module and preparation method thereof

Abstract

The invention relates to a perovskite crystalline silicon laminated solar cell module and a preparation method thereof, and the preparation method comprises the steps: providing a first prefabricated member, sealing a crystalline silicon cell through a first sealing element in the first prefabricated member, fixing the crystalline silicon cell on a first cover plate, and arranging a first sub-sealing element on one side, deviating from the first cover plate, of the first sealing element; providing a second prefabricated member, wherein the second prefabricated member comprises a second sub-sealing element which covers the surface of the perovskite cell and fixes the perovskite cell on a second cover plate; and stacking the first prefabricated member and the second prefabricated member, and heating and laminating at a first preset temperature to form the solar cell module. The perovskite cell is arranged in the second prefabricated member through the second sub-sealing element, and the first prefabricated member and the second prefabricated member are stacked and hot-pressed to form the solar cell module, so that the reliability of the solar cell module is improved.

Description

Technical Field

[0001] This disclosure relates to the field of solar cell technology, specifically to a perovskite-silicon tandem solar cell module and its fabrication method. Background Technology

[0002] Perovskite-silicon tandem photovoltaic (PV) modules are power generation units formed by mechanically stacking perovskite thin-film solar cells with independent circuits and crystalline silicon solar cells. Perovskite-silicon tandem PV modules utilize the different spectral response characteristics of perovskite and crystalline silicon to improve the utilization efficiency of the solar spectrum and increase the power generation of the PV module.

[0003] In related technologies, due to the sensitivity of perovskite materials to moisture, photovoltaic modules containing perovskite cells place higher demands on the moisture permeability of the encapsulating film. Thermoplastic polyolefin (TPO) films are non-crosslinked encapsulating films with high light transmittance, low moisture permeability, and low-temperature lamination processes. They do not release small molecules during long-term aging, making them suitable for perovskite cell encapsulation. In existing perovskite-silicon tandem photovoltaic modules using TPO films as a single material, single-junction perovskite modules are designed with low current and multiple parallel structures, resulting in low hot spot temperatures. TPO materials hardly soften during photovoltaic module power generation, hence they are currently the primary material used for single-junction perovskite modules. However, in perovskite tandem photovoltaic modules, the crystalline silicon end uses a multiple series structure to match the high voltage characteristics of perovskite. When hot spots occur, the high temperature can easily lead to localized high temperatures, causing the TPO material to soften and weakening the encapsulation effect. Summary of the Invention

[0004] The purpose of this disclosure is to provide a perovskite-silicon tandem solar cell module and its fabrication method. The fabrication method involves placing a crystalline silicon cell within a first preform via a first sealing element and a first sub-sealing element, and placing a perovskite cell within a second preform via a second sub-sealing element. The first and second preforms are then stacked and hot-pressed to form a solar cell module, thereby improving the reliability of the solar cell module and at least partially solving the aforementioned technical problems.

[0005] To achieve the above objectives, the first aspect of this disclosure provides a method for fabricating a perovskite-silicon tandem solar cell module, comprising:

[0006] A first preform is provided, the first preform including a first cover plate, a first sealing element, a crystalline silicon cell and a first sub-sealing element, the crystalline silicon cell being disposed on one side of the first cover plate, the first sealing element sealing the crystalline silicon cell and fixing the crystalline silicon cell to the first cover plate, and the first sub-sealing element being disposed on the side of the first sealing element opposite to the first cover plate. A second preform is provided, the second preform including a second cover plate, a perovskite cell disposed on one side of the second cover plate, and a second sub-sealing element covering the surface of the perovskite cell; The first preform and the second preform are stacked, wherein the crystalline silicon cell and the perovskite cell are located between the first cover plate and the second cover plate; The first preform and the second preform are heat-laminated to bond the first sealing element to the second sub-sealing element; The first and second sub-sealing elements are made of thermoplastic materials, while the first sealing element is made of thermosetting material.

[0007] Optionally, the method for preparing the first preform includes: A thermosetting first adhesive film layer, a crystalline silicon cell, and a composite adhesive film layer are stacked sequentially on one side of the first cover plate, wherein the composite adhesive film layer is a pre-formed adhesive film layer consisting of a thermosetting second adhesive film layer and a thermoplastic third adhesive film layer. Hot pressing causes the first adhesive film layer and the second adhesive film layer to crosslink and cure to form the first sealing element, and the third adhesive film layer forms the first sub-sealing element.

[0008] Optionally, the method for preparing the second preform includes: Perovskite solar cells and a thermoplastic fourth adhesive film layer are stacked sequentially on one side of the second cover plate; The second preform is formed by thermal lamination, wherein the fourth adhesive film layer forms the second sub-sealing element.

[0009] Optionally, the thermal lamination temperature for fabricating the solar cell module from the first preform and the second preform is a first preset temperature, the thermal lamination temperature for fabricating the first preform is a second preset temperature, and the thermal lamination temperature for fabricating the second preform is a third preset temperature. Wherein, the first preset temperature is greater than the melting temperature of the third adhesive layer and the fourth adhesive layer, the second preset temperature is greater than the minimum crosslinking curing temperature of the first adhesive layer and the second adhesive layer, the third preset temperature is greater than the melting temperature of the fourth adhesive layer, and the first preset temperature and the third preset temperature are less than the second preset temperature.

[0010] Optionally, the first preset temperature and the third preset temperature are less than or equal to 120°C; and / or The second preset temperature is greater than or equal to 140℃.

[0011] Optionally, the third adhesive layer and the fourth adhesive layer are made of the same material.

[0012] Optionally, the first sealing element is POE, EVA, PVB or a combination thereof, and the first sub-sealing element and the second sub-sealing element are TPO.

[0013] In a second aspect, this disclosure provides a perovskite-silicon tandem solar cell module, which is prepared by the method described above.

[0014] Through the above technical solution, the crystalline silicon cell is encapsulated in the first preform using a first sealing element and a first sub-sealing element in the preparation method of this disclosure, and the perovskite cell is encapsulated in the second preform using a second sub-sealing element in the preparation method of this disclosure. Then, the first preform and the second preform are stacked and hot-pressed, and the first sealing element and the second sub-sealing element are bonded together to form a perovskite crystalline silicon solar cell module. In this way, when the perovskite crystalline silicon tandem solar cell module experiences hot spot effect, the encapsulation can be kept stable and does not soften, reducing the risk of encapsulation material delamination caused by high and low temperature cycling and improving the reliability of the perovskite crystalline silicon tandem solar cell module.

[0015] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the accompanying drawings...

[0017] Figure 1 This is a flowchart of a method for fabricating a perovskite-silicon tandem solar cell module provided in an exemplary embodiment of this disclosure.

[0018] Figure 2 This is a schematic diagram of a perovskite-silicon tandem solar cell module provided in an exemplary embodiment of this disclosure.

[0019] Figure 3 This is a schematic diagram of the molding process of a perovskite-silicon tandem solar cell module provided in an exemplary embodiment of this disclosure.

[0020] Figure 4 This is a schematic diagram of the first preform provided in an exemplary embodiment of this disclosure.

[0021] Figure 5 This is a schematic diagram of the first preform forming process provided in an exemplary embodiment of this disclosure.

[0022] Figure 6 This is a schematic diagram of the second preform provided in an exemplary embodiment of this disclosure.

[0023] Figure 7 This is a schematic diagram of the second preform forming process provided in an exemplary embodiment of this disclosure.

[0024] Figure 8 This is a schematic diagram of the structure of a perovskite-silicon tandem solar cell module including edge sealing adhesive provided in an exemplary embodiment of this disclosure.

[0025] Explanation of reference numerals in the attached figures 100 - First preform; 101 - First cover plate; 102 - First sealing element; 103 - Crystalline silicon cell; 104 - First sub-sealing element; 105 - First adhesive film layer; 106 - Composite adhesive film layer; 107 - Second adhesive film layer; 108 - Third adhesive film layer; 200 - Second preform; 201 - Second cover plate; 202 - Perovskite cell; 203 - Second sub-sealing element; 204 - Fourth adhesive film layer; 300 - Perovskite-crystalline silicon tandem solar cell module; 400 - Second sealing element; 500 - Edge sealing adhesive. Detailed Implementation

[0026] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0027] In this disclosure, unless otherwise stated, directional terms such as "inner" and "outer" refer to the inner and outer contours of the corresponding components; "far" and "near" refer to the corresponding structure or component being away from or near another structure or component. Furthermore, the terms "first," "second," etc., used in this disclosure are for distinguishing one element from another and do not have sequential or importance implications. Additionally, in the following description, when referring to the accompanying drawings, unless otherwise explained, the same reference numerals in different drawings denote the same or similar elements. The above definitions are for explanation and illustration only and should not be construed as limiting this disclosure.

[0028] Because perovskite materials are sensitive to moisture, photovoltaic modules containing perovskite cells place higher demands on the moisture permeability of the encapsulating film. Thermoplastic polyolefin (TPO) films are non-crosslinked encapsulating films with high light transmittance, low moisture permeability, and low-temperature lamination processes. They do not release small molecules during long-term aging, making them suitable for encapsulating perovskite cells. The inventors discovered that existing methods using TPO films as a single material to encapsulate perovskite-crystalline silicon tandem photovoltaic modules have some problems. For example, there are material compatibility issues between TPO materials and crystalline silicon cells. Specifically, single-junction perovskite modules are designed with low current and multiple parallel structures, resulting in low hot spot temperatures. TPO films hardly soften during photovoltaic module power generation; therefore, TPO films are currently the primary encapsulating material for single-junction perovskite modules. However, in perovskite tandem photovoltaic modules, the crystalline silicon end adopts a multi-series structure to match the high voltage characteristics of perovskite. When hot spots occur, the hot spot temperature is high, which can easily lead to local high temperature, causing the TPO film to soften and cure, greatly increasing the sealing risk.

[0029] To achieve the above objectives, such as Figures 1 to 8 As shown, in a first aspect, this disclosure provides a method for fabricating a perovskite-silicon tandem solar cell module, comprising: S10, Provide the first prefabricated component 100.

[0030] Among them, such as Figure 4 As shown, the first preform 100 includes a first cover plate 101, a first sealing element 102, a crystalline silicon cell 103, and a first sub-sealing element 104. The crystalline silicon cell 103 is disposed on one side of the first cover plate 101. The first sealing element 102 seals the crystalline silicon cell 103 and fixes the crystalline silicon cell 103 to the first cover plate 101. The first sub-sealing element 104 is disposed on the side of the first sealing element 102 away from the first cover plate 101.

[0031] S20, Provide a second prefabricated component 200.

[0032] Among them, such as Figure 6 As shown, the second preform 200 includes a second cover plate 201, a perovskite cell 202 disposed on one side of the second cover plate 201, and a second sub-sealing element 203 covering the surface of the perovskite cell 202 and fixing the perovskite cell 202 to the second cover plate 201.

[0033] S30, stack the first preform 100 and the second preform 200.

[0034] The crystalline silicon cell 103 and the perovskite cell 202 are located between the first cover plate 101 and the second cover plate 201.

[0035] S40, The first preform 100 and the second preform 200 are thermally laminated to form a perovskite crystalline silicon tandem solar cell module 300.

[0036] The first sub-sealing element 104 and the second sub-sealing element 203 are made of thermoplastic material, and the first sealing element 102 is made of thermosetting material.

[0037] Through the above technical solution, in the preparation method of this disclosure, the crystalline silicon cell 103 is encapsulated in the first preform 100 by the first sealing element 102 and the first sub-sealing element 104, and the perovskite cell 202 is encapsulated in the second preform 200 by the second sub-sealing element 203. The first preform 100 and the second preform 200 are then stacked and hot-pressed to form a perovskite-crystalline silicon tandem solar cell module 300. This disclosure utilizes a thermosetting first sealing element 102 to encapsulate the crystalline silicon cell, and a thermoplastic second sub-sealing element 203 to encapsulate the perovskite cell. Thermosetting resin materials are cross-linked resins, possessing good heat resistance and a low coefficient of thermal expansion, capable of withstanding the outdoor operating temperature of the crystalline silicon cell 103, reducing the risk of encapsulation material delamination on the crystalline silicon side due to high and low temperature cycling, and enhancing the reliability of the crystalline silicon cell encapsulation. The second sub-sealing element 203 can be a thermoplastic resin. Because thermoplastic materials contain fewer additives, they can prevent the encapsulation material from releasing excessive harmful substances into the perovskite material. In this disclosure, the first sealing element 102 and the second sealing element 203 are connected by the first sub-sealing element 104 of the first preform 100. Both the first sub-sealing element 104 and the second sub-sealing element 203 are thermoplastic materials with good material compatibility, which is beneficial to the connection strength of the first preform 100 and the second preform 200.

[0038] To prepare the first preform 100, please refer to some possible embodiments. Figure 5The method for preparing the first preform 100 includes: sequentially stacking a thermosetting first adhesive film layer 105, a crystalline silicon cell 103, and a composite adhesive film layer 106 on one side of a first cover plate 101, wherein the composite adhesive film layer 106 is an integral film preformed from at least a thermosetting second adhesive film layer 107 and a thermoplastic third adhesive film layer 108; and thermally laminating the first adhesive film layer 105 and the second adhesive film layer 107 to crosslink and cure them, wherein the first adhesive film layer 105 and the second adhesive film layer 107 cure to form a first sealing element 102, and the third adhesive film layer 108 forms a first sub-sealing element 104. The first adhesive film layer 105 and the second adhesive film layer 107 are uncured thermosetting materials. When heated to the crosslinking curing temperature, the crosslinking agent added to the thermosetting adhesive film initiates an irreversible crosslinking reaction, and the first adhesive film layer 105 and the second adhesive film layer 107 cure to form the thermosetting first sealing element 102. The composite adhesive film layer 106 can be pre-formed from an uncrosslinked and cured second adhesive film layer 107 and a third adhesive film layer 108. More specifically, the composite adhesive film layer 106 can be prepared by co-extrusion of an uncrosslinked and cured second adhesive film layer 107 and a third adhesive film layer 108. In this embodiment, the second adhesive film layer 107 and the third adhesive film layer 108 are pre-prepared into an integral film, that is, the third adhesive film layer 108 is laminated together before the second adhesive film layer 107 is crosslinked and cured, so that the second adhesive film layer 107 and the third adhesive film layer 108 can still maintain good adhesion after curing.

[0039] For example, such as Figure 4 and Figure 5 As shown, in Figure 4 and Figure 5 In the process of hot lamination to prepare the first preform 100, the first cover plate 101 is located at the bottom, and the first adhesive film layer 105, the crystalline silicon cell 103, and the composite adhesive film layer 106 are arranged sequentially from bottom to top. The second adhesive film layer 107 of the composite adhesive film layer 106 is close to the crystalline silicon cell 103, and the third adhesive film layer 108 is far away from the crystalline silicon cell 103. The first cover plate 101, the first adhesive film layer 105, the crystalline silicon cell 103, and the composite adhesive film layer 106 are hot-laminated into the first preform 100 in a vacuum lamination apparatus. In order to maintain uniform stress on the adhesive film, a flat plate can be covered on the surface of the composite adhesive film layer 106 so that the adhesive film can obtain a flat surface after hot lamination.

[0040] In other embodiments, during thermal lamination, the composite adhesive film layer 106, the crystalline silicon cell 103, the first adhesive film layer 105, and the first cover plate 101 may be stacked from bottom to top.

[0041] In some possible implementations, the first adhesive layer 105 and the second adhesive layer 107 may be made of the same or different materials. Exemplarily, the first adhesive layer 105 and the second adhesive layer 107 may each be individually selected from one or both of POE and EVA. Preferably, the first adhesive layer 105 and the second adhesive layer 107 are both made of POE.

[0042] In some possible implementations, such as Figure 6 and Figure 7 As shown, the preparation method of the second preform 200 includes: sequentially stacking a perovskite solar cell 202 and a thermoplastic fourth adhesive film layer 204 on one side of a second cover plate 201; and hot laminating to form the second preform 200, wherein the fourth adhesive film layer 204 forms a second sub-sealing element 203. The second cover plate 201 supports the perovskite solar cell 202 and the fourth adhesive film layer 204, and the fourth adhesive film layer 204 encapsulates the perovskite solar cell 202 to facilitate the formation of the second preform 200. The second preform 200 is stacked with the first preform 100, and during the hot lamination process, the third adhesive film layer 108 in the first preform 100 and the fourth adhesive film layer 204 in the second preform 200 fuse together, so that the first preform 100 and the second preform 200 are bonded to each other. Both the third adhesive film layer 108 and the fourth adhesive film layer 204 are thermoplastic films, and their melting and solidification are reversible physical processes.

[0043] For example, the third adhesive layer 108 and the fourth adhesive layer 204 are made of the same material. Preferably, the third adhesive layer 108 and the fourth adhesive layer 204 are TPO.

[0044] In some embodiments, the heat lamination temperature for bonding the first preform 100 and the second preform 200 is a first preset temperature T1, the heat lamination temperature for preparing the first preform 100 is a second preset temperature T2, and the heat lamination temperature for preparing the second preform 200 is a third preset temperature T3. The first preset temperature T1 is greater than the melting temperature of the third adhesive layer 108 and the fourth adhesive layer 204, the second preset temperature T2 is greater than the minimum curing temperature of the first adhesive layer 105 and the second adhesive layer 107, the third preset temperature T3 is greater than the melting temperature of the fourth adhesive layer 204, and the first preset temperature T1 and the third preset temperature T3 are less than the second preset temperature T2.

[0045] The perovskite-silicon tandem solar cell module 300 disclosed herein is fabricated via a stepwise thermal lamination method. Specifically, the crystalline silicon cell 103 and the perovskite cell 202 are sealed at different temperatures. More specifically, the sealing temperature of the crystalline silicon cell 103 is higher than that of the perovskite cell 202, which facilitates the release of additives in the encapsulant film of the crystalline silicon cell 103 and reduces the diffusion of additives into the perovskite cell. The perovskite cell 202 is encapsulated at a lower temperature, and the connection process between the first preform 100 and the second preform 200 is also performed at a lower temperature, which helps stabilize the perovskite material.

[0046] By separately packaging the crystalline silicon cell 103 and the perovskite cell 202, sealing the perovskite cell 202 at a relatively low temperature and the crystalline silicon cell 103 at a relatively high temperature, and then connecting them at a relatively low temperature, the perovskite cell 202 is thermally laminated at a low temperature to prevent high temperatures from affecting its stability. The crystalline silicon cell 103 is laminated at a higher temperature to promote the removal of additives from the thermosetting adhesive film, reducing damage to the perovskite cell 202 from additives. Therefore, embodiments of this disclosure expand the range of materials that can be selected for the crystalline silicon side.

[0047] In some possible implementations, the first preset temperature T1 is less than or equal to 120°C. For example, the first preset temperature can be 120°C, 119°C, 115°C, etc., thereby preventing excessively high temperatures from causing the perovskite solar cell 202 structure to decompose by limiting the first preset temperature to less than or equal to 120°C. Optionally, the lower limit of the first preset temperature T1 can be, for example, greater than or equal to 110°C, and the first sub-sealing element 104 and the second sub-sealing element 203 have good flow properties, facilitating the removal of air bubbles.

[0048] In some feasible embodiments, to facilitate the manufacture of the second preform 200, the second preset temperature T2 is greater than or equal to 140°C. For example, the second preset temperature T2 can be 140°C, 141°C, 145°C, 150°C, etc. By limiting the second preset temperature to greater than or equal to 140°C, a higher temperature helps to promote the release of additives within the adhesive film while maintaining the ability to initiate the melting flow and cross-linking curing of the first adhesive film layer 105 and the second adhesive film layer 107. Optionally, to ensure cross-linking quality, component reliability, and production efficiency, the second preset temperature T2 can be, for example, less than or equal to 160°C.

[0049] The first sub-sealing element 104 and the second sub-sealing element 203 have good light transmittance, low water vapor transmittance and high bonding strength.

[0050] For example, the light transmittance of the first sub-sealing element 104 and the second sub-sealing element 203 is ≥88%. For example, the light transmittance of the first sub-sealing element 104 and the second sub-sealing element 203 can be 88%, 89%, 90%, etc. By limiting the light transmittance of the first sub-sealing element 104 and the second sub-sealing element 203, more light can pass through the first sub-sealing element 104 and the second sub-sealing element 203 to be absorbed and generate electricity in the crystalline silicon cell 103.

[0051] For example, the water vapor permeability of the first sub-sealing element 104 and the second sub-sealing element 203 is ≤3g / m 2 / day, the water vapor throughput of the first sub-sealing element 104 and the second sub-sealing element 203 can be 3g / m³. 2 / day, 2.9g / m 2 / day, 2.8g / m 2 / day, 2.7g / m 2 / day, 2.6g / m 2 By limiting the water vapor permeability of the first sub-sealing element 104 and the second sub-sealing element 203, moisture can be effectively isolated, reducing the interference of moisture on the perovskite solar cell 202 in the second preform 200 when the first preform 100 and the second preform 200 are laminated.

[0052] For example, the bonding strength of the first sub-sealing element 104 and the second sub-sealing element 203 is ≥100N / cm. The bonding strength of the first sub-sealing element 104 and the second sub-sealing element 203 can be 100N / cm, 101N / cm, 105N / cm, etc. By limiting the bonding strength of the first sub-sealing element 104 and the second sub-sealing element 203, the high bonding strength requirement can be met. When the first preform 100 and the second preform 200 are laminated, the bonding of the first preform 100 and the second preform 200 is guaranteed to be reliable, so that the structure of the perovskite crystalline silicon tandem solar cell module 300 is stable.

[0053] Of course, in some possible implementations, the light transmittance of the first sub-sealing element 104 and the second sub-sealing element 203 can be 88%, and the water vapor transmission rate can be 3 g / m³. 2 / day, bonding strength ≥100N / cm; the light transmittance of the first sub-sealing element 104 and the second sub-sealing element 203 can be 89%, and the water vapor transmission rate can be 2.8g / m 2 / day, bond strength ≥105N / cm.

[0054] It is understood that the light transmittance, water vapor transmission rate, and bonding strength values ​​of the first sub-sealing element 104 and the second sub-sealing element 203 described above are illustrative. In other embodiments, the light transmittance values ​​of the first sub-sealing element 104 and the second sub-sealing element 203 can also be any other value with a light transmittance ≥ 88%, and the water vapor transmission rate values ​​of the first sub-sealing element 104 and the second sub-sealing element 203 can also be water vapor transmission rate ≤ 3g / m 2 Other values ​​for / day, and the bond strength values ​​for the first sub-sealing element 104 and the second sub-sealing element 203, can also be any other values ​​among those with a bond strength ≥100N / cm.

[0055] In some possible implementations, the first sealing element 102 can be POE, EVA, or a combination thereof, and the first sub-sealing element 104 and the second sub-sealing element 203 can be TPO. For example, the first sealing element 102 can be made of POE. POE has strong weather resistance, outstanding resistance to ultraviolet aging and damp heat aging, and excellent water vapor barrier properties, which can effectively protect the crystalline silicon cell 103 from moisture corrosion, improve module life, and has good resistance to PID (potential-induced degradation), reducing the risk of module power degradation and making it suitable for high-voltage photovoltaic modules. In addition, by using POE for the first sealing element 102, and considering that POE is a cross-linked cured material, the cured POE has good heat resistance and a low coefficient of thermal expansion, reducing the risk of delamination of the encapsulation material due to high and low temperature cycling, and enhancing the reliability of the first preform 100 and the perovskite crystalline silicon tandem solar cell module 300.

[0056] Of course, the above-described implementation of the first sealing element 102 using POE is illustrative. In other implementations, the first sealing element 102 can also be EVA. EVA has lower cost, mature technology, strong adhesion, good compatibility with the first cover plate 101 and the crystalline silicon cell 103, stable structure after encapsulation, and high light transmittance, which can maximize the transmission of sunlight and reduce the impact on the cell conversion efficiency. Alternatively, the first sealing element 102 can be a mixture of POE and EVA, i.e., EPE. EPE combines the high adhesion of EVA and the weather resistance of POE, with balanced overall performance. Its anti-aging and anti-PID performance is better than that of ordinary EVA. Thus, the crystalline silicon cell 103 can be encapsulated by EPE, thereby making the cost of the first preform 100 lower than that of pure POE, balancing performance and economy.

[0057] To accommodate the perovskite cell 202 and the perovskite-silicon tandem solar cell module 300 formed by laminating the first preform 100 and the second preform 200, both the first sub-sealing element 104 and the second sub-sealing element 203 are TPO (Transfer-Polyester Composite). TPO is suitable for encapsulating the perovskite cell 202. During the fabrication of the second preform 200, the second sub-sealing element 203 is set as TPO and thermally laminated at a third preset temperature T3 to seal the perovskite cell 202 and bond it to the second cover plate 201. When the first preform 100 and the second preform 200 are laminated at a first preset temperature T1 to prepare a perovskite crystalline silicon tandem solar cell module 300, by setting the first sub-sealing element 104 as TPO, the first sub-sealing element 104 of the first preform 100 and the second sub-sealing element 203 of the second preform 200 can be fused together at the first preset temperature T1 to form the second sealing element 400 of the sealed perovskite cell 202. In this way, the first preform 100 and the second preform 200 can be firmly connected.

[0058] In some possible implementations, the perovskite-silicon tandem solar cell module 300 is formed by heating and laminating at a first preset temperature T1, and further includes the following step: applying an edge sealant 500 to the circumferential edge of the laminated part after heating and lamination to form the perovskite-silicon tandem solar cell module 300. For example... Figure 8 As shown, the edge sealing adhesive 500 can further prevent moisture and oxygen from penetrating from the edge, avoiding hydrolysis and oxidative degradation of the perovskite solar cell 202. Furthermore, it can form a double seal with the first sealing element 102 and the second sealing element 400, combining internal bonding seal and edge sealing, thus improving the reliability of the perovskite crystalline silicon tandem solar cell module 300. It is understood that the aforementioned edge sealing adhesive can be one or more combinations of butyl rubber, silicone sealant, and polyurethane adhesive.

[0059] Furthermore, in some possible embodiments, the first preform 100 further includes: a functional film layer disposed between the crystalline silicon cell 103 and the perovskite cell 202; wherein the functional film layer includes at least one of an insulating film layer, a light transfer film layer, and a cutoff film layer. For example, by providing an insulating film layer between the crystalline silicon cell 103 and the perovskite cell 202, the insulating film layer can provide insulation, thereby preventing leakage between the perovskite cell 202 and the crystalline silicon cell 103. Of course, a light transfer film layer can also be provided between the crystalline silicon cell 103 and the perovskite cell 202. By providing the light transfer film layer, the wavelength of light transmitted through the perovskite cell 202 is changed, increasing the light absorption rate of the crystalline silicon cell 103. In addition, a cutoff film layer can also be provided between the crystalline silicon cell 103 and the perovskite cell 202 to reduce the amount of light that could affect the reliability of the crystalline silicon cell 103 reaching the crystalline silicon cell 103. It should be noted that the insulating film layer, light transfer film layer and cut-off film layer in the above-mentioned functional film layers can be a combination of one or more, and this disclosure does not make specific limitations.

[0060] This disclosure specifically provides a method for fabricating a perovskite-silicon tandem solar cell module, providing a first preform 100. The first preform 100 includes a first cover plate 101, a POE encapsulant layer (first encapsulant layer 105) located in front of the first cover plate 101, a crystalline silicon cell 103 located in front of the POE encapsulant layer (first encapsulant layer 105), and a composite encapsulant layer 106 located in front of the crystalline silicon cell 103. The composite encapsulant layer 106 includes a facing direction towards the crystalline silicon cell 103. The POE film layer (second film layer 107) and the TPO film layer (third film layer 108) facing away from the crystalline silicon cell 103 are hot-pressed at a second preset temperature T2 to form a first preform 100. At this time, the POE film layer (first film layer 105) and the POE film layer (second film layer 107) are cured to form a first sealing element 102 that seals the crystalline silicon cell 103, and the TPO film layer (third film layer 108) is cured to form a first sub-sealing element 104. A second preform 200 is provided, the second preform 200 including a second cover plate 201, a perovskite cell 202 formed on the surface of the second cover plate 201, and a TPO film layer (fourth film layer 204) covering the surface of the perovskite cell 202. The second preform 200 is formed by hot pressing at a third preset temperature T3, and the TPO film layer (fourth film layer 204) forms a second sub-sealing element 203 that seals the perovskite cell 202. The second preform 200 and the first preform 100 are stacked, with the crystalline silicon cell 103 and the perovskite cell 202 located between the first cover plate 101 and the second cover plate 201. At a first preset temperature T1, thermal lamination is performed to bond the first sub-sealing element 104 to the second sub-sealing element 203. The first sub-sealing element 104 in the first preform 100 and the second sub-sealing element 203 in the second preform 200 cross-link and fuse with each other at the first preset temperature T1 to form the second sealing element 400.

[0061] In the perovskite-silicon tandem solar cell module 300, the crystalline silicon cell 103 is sealed with a POE film. Compared to related technologies that use TPO film exclusively, this reduces the use of high-cost materials and improves the material compatibility between the crystalline silicon cell 103 and the sealing element. Furthermore, the perovskite cell 202 and the crystalline silicon cell 103 are separately packaged into preforms. The perovskite cell 202 is packaged at a low-temperature environment favorable to perovskite materials, while the crystalline silicon cell 103 is packaged at a relatively higher temperature. During high-temperature lamination of the POE film, additives such as peroxides that could negatively affect the perovskite cell 202 are expelled, preventing the release of harmful substances that could damage the perovskite cell 202. The first sub-sealing element 104 of the first preform 100 and the second sub-sealing element 203 of the second preform 200 are laminated and fused together at a low temperature.

[0062] Furthermore, it is understood that the second cover plate 201 can be transparent glass, allowing light to pass through during photovoltaic module operation, enter the perovskite cell 202, and be partially absorbed, while long-wavelength light passing through the perovskite cell 202 enters the crystalline silicon cell 103 and is absorbed. The first cover plate 101 can be glass, providing mechanical protection and blocking moisture.

[0063] In a second aspect, this disclosure provides a perovskite-silicon tandem solar cell module 300, which is fabricated using the aforementioned method for fabricating a perovskite-silicon tandem solar cell module. It is understood that the aforementioned perovskite-silicon tandem solar cell module 300 incorporates all the beneficial effects of the aforementioned method for fabricating a perovskite-silicon tandem solar cell module 300.

[0064] In some possible implementations, such as Figure 2As shown, the perovskite crystalline silicon tandem solar cell module 300 may include a first cover plate 101, and a first sealing element 102, a second sealing element 400, and a second cover plate 201 stacked sequentially on one side of the first cover plate 101. The perovskite crystalline silicon tandem solar cell module 300 also includes a crystalline silicon cell 103 sealed inside the first sealing element 102, and a perovskite cell 202 sealed and fixed on the second cover plate 201 by the second sealing element 400. The first sealing element 102 is a thermosetting material and the second sealing element 400 is a thermoplastic material.

[0065] The aforementioned perovskite-silicon tandem solar cell module 300 is formed by stacking and heating a first preform 100 and a second preform 200 at a first preset temperature T1. Wherein, as... Figure 4 and Figure 5 As shown, the first preform 100 includes a first cover plate 101, a first sealing element 102, a crystalline silicon cell 103, and a first sub-sealing element 104. The crystalline silicon cell 103 is disposed on one side of the first cover plate 101. The first sealing element 102 seals the crystalline silicon cell 103 and fixes the crystalline silicon cell 103 to the first cover plate 101. The first sub-sealing element 104 is disposed on the side of the first sealing element 102 away from the first cover plate 101. During the preparation of the first preform 100, the first cover plate 101, the first adhesive film layer 105, the crystalline silicon cell 103 and the composite adhesive film layer 106 are stacked sequentially. The composite adhesive film layer 106 is at least preformed into an integral adhesive film layer by the second adhesive film layer 107 and the third adhesive film layer 108. The first preform 100 is formed by hot pressing at the second preset temperature T2. During the hot pressing process, the first adhesive film layer 105 and the second adhesive film layer 107 are cured to form the first sealing element 102, and the third adhesive film layer 108 forms the first sub-sealing element 104. The first preset temperature T1 is lower than the second preset temperature T2.

[0066] like Figure 6 and Figure 7As shown, the second preform 200 includes a second cover plate 201, a perovskite solar cell 202 disposed on one side of the second cover plate 201, and a second sub-sealing element 203 covering the surface of the perovskite solar cell 202 and fixing the perovskite solar cell 202 to the second cover plate 201. During the fabrication of the second preform 200, the perovskite solar cell 202 and a fourth adhesive film layer 204 are sequentially stacked on one side of the second cover plate 201, and then heated and laminated at a third preset temperature T3 to form the second preform 200. Subsequently, when the first preform 100 and the second preform 200 are stacked and heated at a first preset temperature T1 to form a perovskite crystalline silicon tandem solar cell module 300, the first sub-sealing element 104 and the second sub-sealing element 203 are fused to form a second sealing element 400. Thus, the crystalline silicon cell 103 is encapsulated by the first sealing element 102, the perovskite cell 202 is encapsulated by the second sealing element 400, and the perovskite crystalline silicon tandem solar cell module 300 is formed by laminating the first cover plate 101 and the second cover plate 201.

[0067] In some possible implementations, the first sealing element 102 can be a thermosetting material, and the second sealing element 400 can be a thermoplastic material. That is, the first adhesive layer 105 and the second adhesive layer 107 can be thermosetting materials, and the third adhesive layer 108 and the fourth adhesive layer 204 can be thermoplastic materials. For example, the first adhesive layer 105 and the second adhesive layer 107 can be thermosetting resin materials. Thermosetting resin materials are cross-linked curing materials, which have good heat resistance and low coefficient of thermal expansion after curing. Compared with thermoplastic materials, they have better material compatibility with crystalline silicon, thereby reducing the risk of delamination of the encapsulation material due to high-temperature cycling and enhancing the reliability of the encapsulation. The third adhesive layer 108 and the fourth adhesive layer 204 can be made of thermoplastic resin materials. The fusion and curing of thermoplastic resin materials are reversible. The third adhesive layer 108 and the fourth adhesive layer 204 have relatively low melting temperatures. When the first preform 100 and the second preform 200 are laminated to form a perovskite crystalline silicon tandem solar cell module 300, hot lamination can be performed at low temperatures, protecting the perovskite cell 202 inside the second preform 200. Both the third adhesive layer 108 and the fourth adhesive layer 204 are thermoplastic resin materials, and the two materials have high compatibility. Therefore, when the first preform 100 and the second preform 200 are laminated at a first preset temperature T1, the third adhesive layer 108 in the first preform 100 and the fourth adhesive layer 204 in the second preform 200 can be well bonded.

[0068] In some possible implementations, the light transmittance of the third film layer 108 and the fourth film layer 204 is ≥88%. By limiting the light transmittance of the third film layer 108 and the fourth film layer 204, more light can pass through the third film layer 108 and the fourth film layer 204 to be absorbed and generate electricity in the crystalline silicon cell 103.

[0069] In some possible embodiments, the water vapor permeability of the third film layer 108 and the fourth film layer 204 is ≤3 g / m³. 2 / day, by limiting the water vapor permeability of the third film layer 108 and the fourth film layer 204, moisture can be effectively isolated, reducing the interference of moisture on the perovskite solar cell 202 in the second preform 200 when the first preform 100 and the second preform 200 are laminated.

[0070] In some possible implementations, the bonding strength between the third adhesive layer 108 and the fourth adhesive layer 204 is ≥100 N / cm. By limiting the bonding strength of the third adhesive layer 108 and the fourth adhesive layer 204, the high bonding strength requirement can be met, ensuring a reliable bond between the first preform 100 and the second preform 200 when they are laminated, thus stabilizing the structure of the perovskite crystalline silicon tandem solar cell module 300.

[0071] In some possible implementations, such as Figure 8 As shown, the perovskite-silicon tandem solar cell module 300 also includes an edge sealant 500, which is located between the first cover plate 101 and the second cover plate 201, and is disposed at the circumferential edges of the first sealing element 102 and the second sealing element 400. By providing the edge sealant 500 at the edges, moisture and oxygen are further prevented from penetrating from the edges, reducing the risk of hydrolysis and oxidative degradation of the perovskite cell 202. In addition, it can form a double seal with the first sealing element 102 and the second sealing element 400, combining internal bonding seal and edge sealing, thereby improving the reliability of the solar cell module 300.

[0072] It is understood that the aforementioned edge sealing adhesive 500 can be one or more of butyl rubber, silicone sealant, and polyurethane adhesive.

[0073] In some possible implementations, the first sealing element 102 is POE, EVA, or a combination thereof, and the second sealing element 400 is TPO. The first sub-sealing element 104 and the second sub-sealing element 203 are TPO. In this case, the corresponding first sealing element 102 is formed by cross-linking and curing a first adhesive film layer 105 and a second adhesive film layer 107, which can be POE film, EVA film, or a combination thereof; while the second sealing element 400 is formed by fusing the first sub-sealing element 104 and the second sub-sealing element 203, the first sub-sealing element 104 is formed by a corresponding third adhesive film layer 108, and the second sub-sealing element 203 is formed by a fourth adhesive film layer 204, which are TPO films.

[0074] In some possible implementations, since the third adhesive layer 108 and the fourth adhesive layer 204 are TPO adhesive films, the third adhesive layer 108 on the first preform 100 and the fourth adhesive layer 204 on the second preform 200 can be laminated and fused together to form a second sealing element 400. This can both bond the first preform 100 and the second preform 200 and form the second sealing element 400 to encapsulate the perovskite cell 202, thus producing a perovskite crystalline silicon tandem solar cell module 300.

[0075] Of course, in some possible implementations, for example, the first sealing element 102 can be POE and the second sub-sealing element 203 can be TPO; the first sealing element 102 can be EVA and the second sub-sealing element 203 can be TPO; the first sealing element 102 can be EPE, which is made by a three-layer co-extrusion process of EVA, POE and EVA, and the second sub-sealing element 203 can be TPO.

[0076] It is understood that the above-mentioned first sub-sealing element 104, which can be a TPO structure, is illustrative. In other embodiments, the first sub-sealing element 104 can also be made of other materials. The melting temperature of the first sub-sealing element 104 is the same as or similar to that of the material of the second sub-sealing element 203 in the second preform 200. That is, when the first preform 100 and the second preform 200 are hot-laminated, the corresponding third adhesive film layer 108 in the first preform 100 can be fused together with the fourth adhesive film layer 204 in the second preform 200. Of course, the first sealing element 102 can be a POE film, EVA film, or EPE film structure, which is illustrative. In other embodiments, the first sealing element 102 can also be made of other film materials.

[0077] In some possible embodiments, the solar cell further includes a functional film layer disposed between the crystalline silicon cell 103 and the perovskite cell 202; wherein the functional film layer includes at least one of an insulating film layer, a light transfer film layer, and a cutoff film layer. For example, an insulating film layer can be disposed between the crystalline silicon cell 103 and the perovskite cell 202 to provide insulation, thereby preventing short circuits between the perovskite cell 202 and the crystalline silicon cell 103. Of course, a light transfer film layer can also be disposed between the crystalline silicon cell 103 and the perovskite cell 202 to change the wavelength of light transmitted through the perovskite cell 202, thereby increasing the light absorption rate of the crystalline silicon cell 103. In addition, a cutoff film layer can also be disposed between the crystalline silicon cell 103 and the perovskite cell 202 to reduce the amount of light reaching the crystalline silicon cell 103 that could affect its reliability.

[0078] It should be noted that the insulating film layer, light transfer film layer and cut-off film layer in the above-mentioned functional film layers can be a combination of one or more, and this disclosure does not make specific limitations.

[0079] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0080] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0081] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A method for fabricating a perovskite-silicon tandem solar cell module, characterized in that, include: A first preform is provided, the first preform including a first cover plate, a first sealing element, a crystalline silicon cell and a first sub-sealing element, the crystalline silicon cell being disposed on one side of the first cover plate, the first sealing element sealing the crystalline silicon cell and fixing the crystalline silicon cell to the first cover plate, and the first sub-sealing element being disposed on the side of the first sealing element opposite to the first cover plate. A second preform is provided, the second preform including a second cover plate, a perovskite cell disposed on one side of the second cover plate, and a second sub-sealing element covering the surface of the perovskite cell; The first preform and the second preform are stacked, wherein the crystalline silicon cell and the perovskite cell are located between the first cover plate and the second cover plate; The first preform and the second preform are heat-laminated to bond the first sealing element to the second sub-sealing element; The first and second sub-sealing elements are made of thermoplastic materials, while the first sealing element is made of thermosetting material.

2. The method for preparing a perovskite-silicon tandem solar cell module according to claim 1, characterized in that, The method for preparing the first preform includes: A thermosetting first adhesive film layer, a crystalline silicon cell, and a composite adhesive film layer are stacked sequentially on one side of the first cover plate, wherein the composite adhesive film layer is a pre-formed adhesive film layer consisting of a thermosetting second adhesive film layer and a thermoplastic third adhesive film layer. Thermal lamination causes the first adhesive film layer and the second adhesive film layer to crosslink and cure to form the first sealing element, and the third adhesive film layer forms the first sub-sealing element.

3. The method for preparing a perovskite-silicon tandem solar cell module according to claim 2, characterized in that, The method for preparing the second preform includes: Perovskite solar cells and a thermoplastic fourth adhesive film layer are stacked sequentially on one side of the second cover plate; The second preform is formed by thermal lamination, wherein the fourth adhesive film layer forms the second sub-sealing element.

4. The method for preparing a perovskite-silicon tandem solar cell module according to claim 3, characterized in that, The thermal lamination temperature for fabricating the solar cell module from the first preform and the second preform is a first preset temperature, the thermal lamination temperature for fabricating the first preform is a second preset temperature, and the thermal lamination temperature for fabricating the second preform is a third preset temperature. Wherein, the first preset temperature is greater than the melting temperature of the third adhesive layer and the fourth adhesive layer, the second preset temperature is greater than the minimum crosslinking curing temperature of the first adhesive layer and the second adhesive layer, the third preset temperature is greater than the melting temperature of the fourth adhesive layer, and the first preset temperature and the third preset temperature are less than the second preset temperature.

5. The method for preparing a perovskite-silicon tandem solar cell module according to claim 4, characterized in that, The first preset temperature and the third preset temperature are less than or equal to 120°C; and / or The second preset temperature is greater than or equal to 140℃.

6. The method for preparing a perovskite-silicon tandem solar cell module according to claim 3, characterized in that, The third adhesive layer and the fourth adhesive layer are made of the same material.

7. The method for preparing a perovskite-silicon tandem solar cell module according to claim 1, characterized in that, The first sealing element is POE, EVA, PVB or a combination thereof, and the first sub-sealing element and the second sub-sealing element are TPO.

8. A perovskite-silicon tandem solar cell module, characterized in that, Prepared using the method described in any one of claims 1-7.

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