Secondary battery manufacturing apparatus

Abstract

According to an exemplary embodiment, an apparatus for manufacturing a secondary battery is provided. The apparatus includes: a first mask jig pressing a first surface of a lead tab assembly of a battery cell and including a first opening exposing the first surface; a first splash adsorption device attached to the first mask jig; and a scanner head for irradiating the lead tab assembly with a laser beam to melt the lead tab assembly.

Description

Technical Field

[0001] This disclosure relates to an apparatus for manufacturing secondary batteries.

[0002] This application claims the benefit of Korean Patent Application No. 10-2024-0032305, filed on March 7, 2024, the disclosure of which is incorporated herein by reference. Background Technology

[0003] Unlike primary batteries, secondary batteries can be charged and discharged multiple times. They are widely used as a power source for various wireless devices, including mobile phones, laptops, and cordless vacuum cleaners. In recent years, the primary use of secondary batteries has shifted from mobile devices to mobility, as improvements in energy density and economies of scale have significantly reduced the manufacturing cost per unit capacity of secondary batteries and increased the range of battery electric vehicles (BEVs) to be comparable to that of fuel cell vehicles.

[0004] To keep pace with the rapidly growing demand for rechargeable batteries used in mobility, cell manufacturers face significant capital expenditures. To maximize the return on their capital investments, companies are looking to increase production line productivity and are conducting research to improve yield and increase overall output. Summary of the Invention

[0005] Technical issues

[0006] The technical challenge of this disclosure is to provide a production apparatus for manufacturing secondary batteries.

[0007] Technical solution

[0008] According to an exemplary embodiment of this disclosure addressing the aforementioned challenges, an apparatus for manufacturing a secondary battery is provided. The apparatus includes: a first mask fixture for pressing a first surface of a lead tab connector of a battery cell and including a first opening exposing the first surface; a first spatter adsorption device coupled to the first mask fixture; and a scanner head configured to irradiate the lead tab connector with a laser beam to melt the lead tab connector.

[0009] The first splash adsorption device is configured to apply a first magnetic field to the first opening.

[0010] The strength of the first magnetic field in the central portion of the first opening is different from the strength of the first magnetic field in the edge portion of the first opening.

[0011] The strength of the first magnetic field in the central portion of the first opening is less than the strength of the first magnetic field in the edge portion of the first opening.

[0012] The first splash adsorption device includes a first magnetic field generating rod and a second magnetic field generating rod configured to generate the first magnetic field.

[0013] The direction of the first current applied to the first magnetic field generating rod is opposite to the direction of the second current applied to the second magnetic field generating rod.

[0014] At the center of the first opening, the magnetic field generated by the first magnetic field generating rod is canceled out by the magnetic field generated by the second magnetic field generating rod.

[0015] The device further includes: a second mask clamp for pressing a second surface of the lead tab connector opposite to the first surface of the lead tab connector and including a second opening for exposing the second surface; and a second splatter adsorption device coupled to the second mask clamp.

[0016] The second splash adsorption device is configured to apply a second magnetic field to the second opening.

[0017] The strength of the second magnetic field in the central portion of the second opening is different from the strength of the second magnetic field in the edge portion of the second opening.

[0018] The strength of the second magnetic field in the central portion of the second opening is less than the strength of the second magnetic field in the edge portion of the second opening.

[0019] The second splash adsorption device includes a third magnetic field generating rod and a fourth magnetic field generating rod configured to generate the second magnetic field.

[0020] The direction of the third current applied to the third magnetic field generating rod is opposite to the direction of the fourth current applied to the fourth magnetic field generating rod.

[0021] At the center of the second opening, the magnetic field generated by the third magnetic field generating rod is canceled out by the magnetic field generated by the fourth magnetic field generating rod.

[0022] According to an exemplary embodiment, a secondary battery manufacturing apparatus is provided. The apparatus includes: a first mask fixture for pressing a first surface of a lead tab connector of a battery cell and including a first opening exposing the first surface; a second mask fixture for pressing a second surface of the lead tab connector opposite to the first surface of the lead tab connector and including a second opening exposing the second surface; a second spatter adsorption device coupled to the second mask fixture; and a scanner head configured to irradiate the first surface of the lead tab connector with a laser beam to melt the lead tab connector.

[0023] The second splash adsorption device is configured to apply a second magnetic field to the second opening.

[0024] The strength of the second magnetic field in the central portion of the second opening is different from the strength of the second magnetic field in the edge portion of the second opening.

[0025] The strength of the second magnetic field in the central portion of the second opening is less than the strength of the second magnetic field in the edge portion of the second opening.

[0026] The second splash adsorption device includes a third magnetic field generating rod and a fourth magnetic field generating rod configured to generate the second magnetic field.

[0027] The direction of the third current applied to the third magnetic field generating rod is opposite to the direction of the fourth current applied to the fourth magnetic field generating rod.

[0028] At the center of the second opening, the magnetic field generated by the third magnetic field generating rod is canceled out by the magnetic field generated by the fourth magnetic field generating rod.

[0029] Beneficial effects

[0030] A secondary battery manufacturing apparatus according to an exemplary embodiment of this disclosure includes a spatter adsorption device configured to adsorb spatter generated during the welding of electrode-tab connectors. Therefore, the maintenance cycle, such as cleaning cycle, of the secondary battery manufacturing apparatus can be extended, and production output can be increased.

[0031] The effects obtainable from the exemplary embodiments of this disclosure are not limited to those mentioned above, and other effects not mentioned can be clearly derived and understood by those skilled in the art from the following description. That is, those skilled in the art can also derive unintended effects from practicing the exemplary embodiments of this disclosure. Attached Figure Description

[0032] Figure 1 This is a diagram illustrating a secondary battery manufacturing apparatus according to an exemplary embodiment.

[0033] Figure 2 This is a diagram illustrating the effectiveness of a secondary battery manufacturing apparatus according to an exemplary embodiment.

[0034] Figure 3 This is a diagram illustrating a secondary battery manufacturing apparatus according to another exemplary embodiment. Detailed Implementation

[0035] Preferred embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. It should be noted that the terms and words used in this specification and claims should not be interpreted in their ordinary or dictionary meaning, but rather on the basis of the principle that the inventor can define the concepts of the disclosed terms that he considers best suited to describe his work, in a meaning and concept consistent with the technical concept of the present disclosure.

[0036] Therefore, it should be understood that the embodiments described herein and the configurations shown in the accompanying drawings are merely the most preferred embodiments of this disclosure, and not an exhaustive list of the technical concepts of this disclosure, and various equivalents and modifications may exist that can replace them at the time of submission.

[0037] Furthermore, in describing this disclosure, detailed descriptions of relevant known configurations or features are omitted where such descriptions would obscure the essence of this disclosure.

[0038] Because embodiments of this disclosure are provided to explain this disclosure more fully to those skilled in the art, the shapes and dimensions of the components in the drawings may be exaggerated, omitted, or illustrated for clarity. Therefore, the dimensions or proportions of each component do not necessarily indicate its actual size or proportion.

[0039] (First Implementation)

[0040] Figure 1 This is a diagram illustrating a secondary battery manufacturing apparatus according to an exemplary embodiment.

[0041] Reference Figure 1 The secondary battery manufacturing apparatus 100 may include a scanner head 110, a first mask fixture 120, a second mask fixture 130, and a first splatter adsorption device 140.

[0042] The secondary battery manufacturing apparatus 100 can be configured to process electrode-tab couplings (LTCs) of battery cells (BCs). The secondary battery manufacturing apparatus 100 can be configured to perform laser welding. The secondary battery manufacturing apparatus 100 can be configured to weld the electrode tabs (ETs) and electrode leads (ELs) of the electrode-tab couplings (LTCs) of battery cells (BCs). Welding via a welding beam (WB) can be keyhole welding. Welding of the electrode tabs (ETs) and electrode leads (ELs) can include irradiating the welding beam (WB) along a desired weld line in a spiral shape.

[0043] The electrode lead EL can be the output terminal of the battery cell BC. The battery cell BC can include a housing, electrode assembly, electrolyte, and electrode lead EL. The electrode tab ET can be connected to the electrode assembly. The housing can be one of a bag-shaped housing, a cylindrical housing, and a square housing. The electrode assembly can be one of a wound type and a stacked type. The wound type electrode assembly can include a positive electrode, a negative electrode, and a separator inserted between the positive and negative electrodes in a wound structure. The stacked type electrode assembly can include multiple positive electrodes and multiple negative electrodes stacked in sequence, and multiple separators inserted between the multiple positive electrodes and multiple negative electrodes.

[0044] As the energy density of the battery cell BC increases, the electrode leads EL and electrode tabs ET can be joined via pre-welding using ultrasound and main welding using a laser beam. Therefore, before being processed by the secondary battery manufacturing apparatus 100, the electrode leads EL and electrode tabs ET of the electrode tab connector LTC can be joined by methods such as ultrasonic welding. However, this is not a limitation; the electrode leads EL and electrode tabs ET of the electrode tab connector LTC may not be processed by a pre-welding process and may include laminated structures that are not welded together.

[0045] The scanner head 110 may be coupled to or include a beam source. The beam source may be a laser (Light Amplification by Stimulated Emission of Radiation) device. The beam source may be configured to generate a welding beam WB. The welding beam WB may be a laser beam. According to an exemplary embodiment, the welding beam WB may be near-infrared. According to an exemplary embodiment, the wavelength of the welding beam WB may be in the range of about 750 nm to about 2500 nm. According to an exemplary embodiment, the wavelength of the welding beam WB may be about 1070 nm.

[0046] In one example, the beam source can be a solid-state laser device, such as a semiconductor laser, an Nd:YAG laser, a Ti-Sapphire laser, or a fiber laser. In another example, the beam source can be a liquid laser, such as a pigmented laser device. In yet another example, the beam source can be a gaseous laser device, such as a helium-neon laser, a carbon dioxide laser, an excimer laser, etc.

[0047] The welding beam WB generated by the beam source can be coupled to the scanner head 110. According to an exemplary embodiment, the welding beam WB can be transmitted to the scanner head 110 via any of free-space optics, optical integrated circuits, and optical fibers.

[0048] The first mask fixture 120 can be configured to pressurize the first surface S1 of the electrode tab connector LTC. The first mask fixture 120 may include a first opening 120OP that exposes the first surface S1 of the electrode tab connector LTC.

[0049] The second mask fixture 130 can be configured to pressurize the second surface S2 of the electrode tab connector LTC. The second mask fixture 130 may include a second opening 130OP that exposes the second surface S2 of the electrode tab connector LTC.

[0050] When the electrode tab connector LTC is pressurized by the first mask fixture 120 and the second mask fixture 130, the contact between the electrode lead EL and the electrode tab ET is maintained when the electrode tab connector LTC is processed by the welding beam WB. This can prevent migration between the electrode lead EL and the electrode tab ET and improve the reliability of secondary battery manufacturing.

[0051] As a non-limiting example, the first opening 120OP and the second opening 130OP may have an elliptical planar shape. The first opening 120OP can expose the area to be soldered on the first surface S1 of the electrode tab connector LTC, and the second opening 130OP can expose the area to be soldered on the second surface S2 of the electrode tab connector LTC.

[0052] According to an exemplary embodiment, the first splatter adsorption device 140 may be coupled to the first mask fixture 120. According to an exemplary embodiment, the first splatter adsorption device 140 may be located within the first opening 120OP of the first mask fixture 120.

[0053] The first splash adsorption device 140 may include a first magnetic field generating rod 141 and a second magnetic field generating rod 143. The first splash adsorption device 140 may be configured to apply a magnetic field to a first opening 120OP. The magnetic field applied to the first opening 120OP by the first splash adsorption device 140 may be referred to as the first magnetic field.

[0054] As used herein, horizontal and vertical are defined relative to the welding beam WB. The direction substantially parallel to the direction in which the welding beam WB propagates toward the lead tab connector LTC is called the vertical direction, and the direction substantially perpendicular to the direction in which the welding beam WB propagates toward the lead tab connector LTC is called the horizontal direction.

[0055] According to an exemplary embodiment, a first current can be applied to a first magnetic field generating rod 141, and a second current can be applied to a second magnetic field generating rod 143. Therefore, the first magnetic field generating rod 141 and the second magnetic field generating rod 143 can be configured to apply a magnetic field induced by the first current and the second current to a first opening 120OP.

[0056] Here, in the central portion of the first opening 120OP, the magnetic field generated by the first magnetic field generating rod 141 can be opposite to the magnetic field generated by the second magnetic field generating rod 143. In the central portion of the first opening 120OP, the magnetic field strength generated by the first magnetic field generating rod 141 can be substantially the same as the magnetic field strength generated by the second magnetic field generating rod 143.

[0057] According to an exemplary embodiment, the strength of the first magnetic field at the central portion (more specifically, the horizontal central portion) of the first opening 120OP may be different from the strength of the first magnetic field at the edge portion of the first opening 120OP. According to an exemplary embodiment, the strength of the first magnetic field at the central portion (more specifically, the horizontal central portion) of the first opening 120OP may be less than the strength of the first magnetic field at the edge portion of the first opening 120OP. According to an exemplary embodiment, in the central portion of the first opening 120OP, the magnetic field generated by the first magnetic field generating rod 141 can cancel the magnetic field generated by the second magnetic field generating rod 143.

[0058] Here, the edge portion of the first opening 120OP may be a portion horizontally spaced apart from the central portion of the first opening 120OP. More specifically, the edge portion of the first opening 120OP may be a portion spaced apart from the central portion of the first opening 120OP in the spacing direction between the first magnetic field generating rod 141 and the second magnetic field generating rod 143.

[0059] According to an exemplary embodiment, a non-zero first magnetic field at the center of the first opening 120OP can deflect the welding beam WB, thereby reducing the straightness of the welding beam WB. If the straightness of the welding beam is impaired, the welding beam may be irradiated at a portion of the welding line that differs from the pre-designed welding line, which may compromise the reliability of secondary battery manufacturing. According to an exemplary embodiment, even when the first magnetic field is applied to the first opening 120OP via the first spatter adsorption device 140, the magnetic fields generated by the first magnetic field generating rod 141 and the second magnetic field generating rod 143 can cancel each other out at the central portion of the first opening 120OP, or the strength of the first magnetic field can be relatively reduced, which can improve the reliability of secondary battery manufacturing.

[0060] Figure 2 This is a diagram illustrating the effectiveness of a secondary battery manufacturing apparatus 100 according to an exemplary embodiment.

[0061] Reference Figure 2 Welding via the welding beam WB can be keyhole welding, and a keyhole KH can be formed in the lead tab connector LTC by irradiation with the welding beam WB. Spatter SPT can be generated from the keyhole KH.

[0062] If spatter (SPT) adheres to the first mask fixture 120, the processing reliability via the welding beam (WB) may be compromised, and the first mask fixture 120 needs to be cleaned when the contamination level exceeds a threshold condition. Typically, the cleaning intervals of the first mask fixture 120 are relatively short compared to the maintenance intervals of other components (e.g., oscillator replacement intervals), leading to poor throughput in secondary battery manufacturing.

[0063] According to an exemplary embodiment, the first splatter adsorption device 140 can be configured to adsorb splatter particles (SPT). The first splatter adsorption device 140 can prevent or otherwise mitigate splatter adhesion to the mask jig 120. Therefore, the cleaning interval of the first mask jig 120 can be extended, and the yield of secondary battery manufacturing can be increased.

[0064] (Second Implementation)

[0065] Figure 3 This is a figure illustrating a secondary battery manufacturing apparatus 101 according to an exemplary embodiment.

[0066] Reference Figure 3 The secondary battery manufacturing apparatus 101 may include a scanner head 110, a first mask fixture 120, a second mask fixture 130, a first splatter adsorption device 140, and a second splatter adsorption device 150.

[0067] The scanner head 110, the first mask fixture 120, the second mask fixture 130, and the first splatter adsorption device 140 are in conjunction with the reference. Figure 1 The descriptions are essentially the same, so repeated descriptions of them are omitted.

[0068] According to an exemplary embodiment, the second splatter adsorption device 150 can be coupled to the second mask fixture 130. According to an exemplary embodiment, the second splatter adsorption device 150 can be located within the second opening 130OP of the second mask fixture 130.

[0069] The second splash adsorption device 150 may include a third magnetic field generating rod 151 and a fourth magnetic field generating rod 153. The second splash adsorption device 150 may be configured to apply a magnetic field to the second opening 130OP. The magnetic field applied to the second opening 130OP by the second splash adsorption device 150 may be referred to as the second magnetic field.

[0070] According to an exemplary embodiment, a third current can be applied to the third magnetic field generating rod 151, and a fourth current can be applied to the fourth magnetic field generating rod 153. Therefore, the third magnetic field generating rod 151 and the fourth magnetic field generating rod 153 can be configured to apply magnetic fields induced by the third current and the fourth current to the second opening 130OP.

[0071] In this case, in the central portion of the second opening 130OP, the magnetic field generated by the third magnetic field generating rod 151 can be opposite to the magnetic field generated by the fourth magnetic field generating rod 153. In the central portion of the second opening 130OP, the magnetic field strength generated by the third magnetic field generating rod 151 can be substantially the same as the magnetic field strength generated by the fourth magnetic field generating rod 153.

[0072] According to an exemplary embodiment, the strength of the second magnetic field at the central portion of the second opening 130OP may differ from the strength of the second magnetic field at the edge portion of the second opening 130OP. According to an exemplary embodiment, the strength of the second magnetic field in the central portion of the second opening 130OP may be less than the strength of the second magnetic field in the edge portion of the second opening 130OP. According to an exemplary embodiment, in the central portion of the second opening 130OP, the magnetic field generated by the third magnetic field generating rod 151 can cancel the magnetic field generated by the fourth magnetic field generating rod 153. The definitions of the central and edge portions of the second opening 130OP follow substantially the same manner as the definitions of the central and edge portions of the first opening 120OP, therefore, repeated descriptions of them are omitted.

[0073] According to an exemplary embodiment, a non-zero second magnetic field at the central portion of the second opening 130OP can deflect the welding beam WB, thereby reducing the straightness of the welding beam WB. If the straightness of the welding beam is impaired, the welding beam may be irradiated at a location different from the pre-designed welding line, which may compromise the reliability of secondary battery manufacturing.

[0074] According to an exemplary embodiment, although the second splash adsorption device 150 applies a second magnetic field to the second opening 130OP, in the central portion of the second opening 130OP, the magnetic field generated by the third magnetic field generating rod 151 and the magnetic field generated by the fourth magnetic field generating rod 153 also cancel each other out, or the strength of the second magnetic field is relatively reduced, which can improve the reliability of secondary battery manufacturing.

[0075] The present disclosure has been described in more detail above with reference to the accompanying drawings and embodiments. However, it should be understood that the configurations shown in the drawings or the embodiments described herein are merely one embodiment of the present disclosure and do not represent all the technical concepts of the present disclosure. Various equivalents and modifications may exist that can replace them at the time of submission of this disclosure.

Claims

1. A secondary battery manufacturing apparatus, the secondary battery manufacturing apparatus comprising: A first mask fixture is used to press a first surface of the lead tab connector of the battery cell and includes a first opening that exposes the first surface. A first splash adsorption device is connected to the first mask fixture; as well as A scanner head configured to direct a laser beam onto the lead tab connector to melt the lead tab connector.

2. The secondary battery manufacturing apparatus according to claim 1, wherein, The first splash adsorption device is configured to apply a first magnetic field to the first opening.

3. The secondary battery manufacturing apparatus according to claim 2, wherein, The strength of the first magnetic field in the central portion of the first opening is different from the strength of the first magnetic field in the edge portion of the first opening.

4. The secondary battery manufacturing apparatus according to claim 2, wherein, The strength of the first magnetic field in the central portion of the first opening is less than the strength of the first magnetic field in the edge portion of the first opening.

5. The secondary battery manufacturing apparatus according to claim 2, wherein, The first splash adsorption device includes a first magnetic field generating rod and a second magnetic field generating rod configured to generate the first magnetic field.

6. The secondary battery manufacturing apparatus according to claim 5, wherein, The direction of the first current applied to the first magnetic field generating rod is opposite to the direction of the second current applied to the second magnetic field generating rod.

7. The secondary battery manufacturing apparatus according to claim 5, wherein, At the center of the first opening, the magnetic field generated by the first magnetic field generating rod is canceled out by the magnetic field generated by the second magnetic field generating rod.

8. The secondary battery manufacturing apparatus according to claim 1, further comprising: A second mask fixture is used to press against a second surface of the lead tab connector opposite to the first surface of the lead tab connector and includes a second opening that exposes the second surface. as well as The second splash adsorption device is connected to the second mask fixture.

9. The secondary battery manufacturing apparatus according to claim 8, wherein, The second splash adsorption device is configured to apply a second magnetic field to the second opening.

10. The secondary battery manufacturing apparatus according to claim 9, wherein, The strength of the second magnetic field in the central portion of the second opening is different from the strength of the second magnetic field in the edge portion of the second opening.

11. The secondary battery manufacturing apparatus according to claim 9, wherein, The strength of the second magnetic field in the central portion of the second opening is less than the strength of the second magnetic field in the edge portion of the second opening.

12. The secondary battery manufacturing apparatus according to claim 9, wherein, The second splash adsorption device includes a third magnetic field generating rod and a fourth magnetic field generating rod configured to generate the second magnetic field.

13. The secondary battery manufacturing apparatus according to claim 12, wherein, The direction of the third current applied to the third magnetic field generating rod is opposite to the direction of the fourth current applied to the fourth magnetic field generating rod.

14. The secondary battery manufacturing apparatus according to claim 12, wherein, At the center of the second opening, the magnetic field generated by the third magnetic field generating rod is canceled out by the magnetic field generated by the fourth magnetic field generating rod.

15. A secondary battery manufacturing apparatus, the secondary battery manufacturing apparatus comprising: A first mask fixture is used to press a first surface of the lead tab connector of the battery cell and includes a first opening that exposes the first surface. A second mask fixture is used to press against a second surface of the lead tab connector opposite to the first surface of the lead tab connector and includes a second opening that exposes the second surface. The second splash adsorption device is connected to the second mask fixture; as well as A scanner head configured to irradiate a laser beam onto the first surface of the lead tab connector to melt the lead tab connector.

16. The secondary battery manufacturing apparatus according to claim 15, wherein, The second splash adsorption device is configured to apply a second magnetic field to the second opening.

17. The secondary battery manufacturing apparatus according to claim 16, wherein, The strength of the second magnetic field in the central portion of the second opening is different from the strength of the second magnetic field in the edge portion of the second opening.

18. The secondary battery manufacturing apparatus according to claim 16, wherein, The strength of the second magnetic field in the central portion of the second opening is less than the strength of the second magnetic field in the edge portion of the second opening.

19. The secondary battery manufacturing apparatus according to claim 16, wherein, The second splash adsorption device includes a third magnetic field generating rod and a fourth magnetic field generating rod configured to generate the second magnetic field.

20. The secondary battery manufacturing apparatus according to claim 19, wherein, The direction of the third current applied to the third magnetic field generating rod is opposite to the direction of the fourth current applied to the fourth magnetic field generating rod.

21. The secondary battery manufacturing apparatus according to claim 19, wherein, At the center of the second opening, the magnetic field generated by the third magnetic field generating rod is canceled out by the magnetic field generated by the fourth magnetic field generating rod.

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