Display panel, preparation method thereof and electronic equipment

Abstract

The embodiment of the invention discloses a display panel, a preparation method thereof and electronic equipment, and belongs to the technical field of display panels. The display panel comprises a substrate, a packaging layer and a blocking structure, wherein the packaging layer is located on one side of the substrate; the blocking structure is located between the substrate and the encapsulation layer. The blocking structures are distributed along at least part of the edge of the substrate; the blocking structure comprises at least one first isolation column, and the first isolation column is located in the non-display area. At least one side wall of the first isolation column comprises a crack induction surface, the crack induction surface comprises at least one of a concave surface and a convex surface, a gap is formed between the packaging layer and the side wall of the first isolation column, and at least part of the gap extends along the crack induction surface. After the crack cracks from the edge of the substrate to the crack induction surface, the packaging layer is easier to crack along the crack induction surface subsequently due to the influence of the crack induction surface. Therefore, the extending direction of the crack is changed, and the possibility that the crack directly extends along a straight line and crosses the blocking structure to enter the display area is reduced.

Description

Technical Field

[0001] This application relates to the field of electronic device manufacturing technology, and in particular to a display panel and its preparation method, and an electronic device. Background Technology

[0002] With the development of electronic technology, electronic devices have become increasingly widely used and have become indispensable tools in people's daily work and life. Display function is one of the basic functions of many electronic devices, realized by the display panel within the device.

[0003] Display panels typically consist of a substrate and an encapsulation layer, with the encapsulation layer formed on one side of the substrate. The encapsulation layer provides protection, isolating the panel from water, oxygen, and other elements in the environment, preventing their corrosion. However, the encapsulation layer is somewhat brittle and can crack in certain situations, such as during the cutting process of the display panel. Cracks generally appear at the edges of the display panel, extending away from the edge. The further the crack extends, the weaker its ability to isolate water and oxygen may become. Once a crack reaches the display area of ​​the display panel, the structure within that area is highly susceptible to corrosion from water and oxygen, leading to functional abnormalities. Summary of the Invention

[0004] This application provides a display panel, a method for manufacturing the same, and an electronic device, which can overcome the problems in related technologies. The technical solution is as follows:

[0005] In a first aspect, embodiments of this application provide a display panel, which includes a substrate, an encapsulation layer, and a barrier structure. The encapsulation layer is located on one side of the substrate, and the barrier structure is located between the substrate and the encapsulation layer and is distributed along at least a portion of the edge of the substrate.

[0006] The blocking structure includes at least one first isolation pillar located in a non-display area. At least one sidewall of the first isolation pillar includes a crack-inducing surface, which includes at least one of a concave surface and a convex surface. A gap is formed between the encapsulation layer and the sidewall of the first isolation pillar, and at least a portion of the gap extends along the crack-inducing surface.

[0007] Based on the above characteristics, there is a height difference between the surface of the first isolation pillar furthest from the substrate and the substrate surface. The shape of the encapsulation layer varies considerably along the two side walls of the first isolation pillar, and may even form wrinkles. This significant shape variation makes stress concentration more likely to occur in the encapsulation layer at the gaps. Areas with higher stress in the encapsulation layer are more prone to cracking, and the lack of support at the gaps provides space for minute deformations and cracking. These factors make it easier for the encapsulation layer to crack along the crack induction surface after the crack originates from the edge of the substrate, thus altering the direction of crack propagation.

[0008] As the crack continues to form along the crack-inducing surface, the stress in the encapsulation layer is continuously released. Once the stress is released to a certain extent, the encapsulation layer will stop cracking, and the crack length will no longer increase. Compared to a crack extending directly into the display area in a straight line, the crack-inducing surface, which includes at least one concave or convex surface, allows for a smaller decrease in distance between the crack and the display area even as the crack length increases. This means that the encapsulation layer may stop cracking before the crack extends into the display area, and the crack length will no longer increase. Therefore, compared to a crack extending directly into the display area in a straight line, a crack-inducing surface provides a longer crack extension path, allowing for more thorough stress release. This reduces the likelihood of the crack extending into the display area, thus mitigating the risk of water and oxygen erosion to the display area and extending the lifespan of the display panel.

[0009] In some examples, the sidewall of the first isolation pillar near the edge of the substrate includes the crack-inducing surface.

[0010] Based on the above characteristics, the crack will be affected by the crack induction surface before it crosses the first isolation pillar, thereby reducing the possibility of the crack crossing the first isolation pillar.

[0011] In some examples, the crack-inducing surface includes a plurality of concave surfaces and a plurality of convex surfaces, which are alternately distributed along the edge of the substrate.

[0012] Based on the above characteristics, during the crack formation process, the crack extends to the convex surface and continues to extend along the convex surface. If the stress of the encapsulation layer has not been sufficiently released and the crack continues to crack, the crack is likely to extend to the concave surface adjacent to the convex surface and continue to extend along the concave surface, so that the stress of the encapsulation layer can be further released.

[0013] In some examples, the crack-inducing surface satisfies at least one of the following:

[0014] The concave surface includes a first plane and a second plane that are opposite each other, and the angle between the first plane and the second plane is 30° to 150°.

[0015] The convex surface includes a third plane and a fourth plane that are opposite each other, and the included angle between the third plane and the fourth plane is 30° to 150°.

[0016] At least one of the concave surface and the convex surface is a curved surface.

[0017] Based on the above characteristics, the angle between the first and second planes is between 30° and 150°, which allows both planes to effectively guide the cracking of the encapsulation layer and change the direction of crack propagation. Furthermore, the change in propagation direction is quite significant, effectively reducing the risk of cracks entering the display area. The third and fourth planes function similarly to the first and second planes. By setting the concave surface as a curved surface, the crack's propagation direction gradually changes as it extends along the concave surface, making it easier for the crack to extend along the crack induction surface and better fulfilling its guiding role, thus causing the crack's propagation direction to gradually deviate from its original direction.

[0018] In some examples, the orthographic projection of the first isolation pillar onto the substrate surface is a broken line or a wavy line.

[0019] Based on the above features, crack-inducing surfaces can be arranged on both sides of the first isolation pillar to improve its ability to prevent cracks from extending to the display area. The convex surface on one side of the first isolation pillar corresponds to the concave surface on the other side, which can prevent the thickness of the first isolation pillar from being too large and increasing the width of the non-display area.

[0020] In other examples, the blocking structure includes a plurality of first isolation pillars, which are spaced apart sequentially along an edge away from the substrate. Using a plurality of first isolation pillars enhances the ability to block cracks, thereby further reducing the likelihood of cracks extending into the display area.

[0021] In other examples, the first projection of the first isolation pillar is located within the second projection of the first isolation pillar and does not overlap, the first projection of the first isolation pillar is the orthographic projection of a cross section of the first isolation pillar on the substrate surface, and the second projection of the first isolation pillar is the orthographic projection of the surface of the first isolation pillar away from the substrate on the substrate surface.

[0022] Based on the above characteristics, the sidewall of the first isolation pillar is not perpendicular to the surface of the substrate, but rather concave. During the fabrication of the encapsulation layer, it is difficult for the encapsulation layer to completely cover the sidewall of the first isolation pillar, resulting in a gap between the sidewall of the first isolation pillar and the encapsulation layer.

[0023] In some examples, the barrier structure further includes a second isolation pillar located on the side of the first isolation pillar away from the edge of the substrate. The second isolation pillar can further block water and oxygen, further reducing the risk of water and oxygen entering the display area.

[0024] In some examples, the display panel further includes a plurality of crack barriers embedded in the encapsulation layer. These crack barriers are distributed on at least one side of at least one first isolation pillar, along the extension direction of the first isolation pillar. The crack barriers prevent the propagation of cracks in the encapsulation layer, thus stopping further cracking. Cracks extending from the edge of the substrate towards the display area are stopped from extending further upon reaching the crack barrier. Through the combined action of the crack barriers and the crack-inducing surface, the risk of cracks extending into the display area can be further reduced.

[0025] As an example, the projections of the multiple crack barriers on the edge of the substrate are connected. The projection of a crack barrier on the edge of the substrate refers to the projection formed by a projection line perpendicular to the edge of the substrate and parallel to the substrate surface, projecting the crack barrier onto the edge of the substrate. The connection of the projections of multiple crack barriers on the edge of the substrate ensures that a crack originating at any location on the edge of the substrate has a relatively high probability of encountering a crack barrier during its propagation, thus being blocked by the crack barrier.

[0026] In some examples, the crack barriers on one side of the first isolation pillar are connected in sequence; or,

[0027] The crack blocking bodies on the same side of the first isolation column are distributed at intervals, and the crack blocking bodies on both sides of the first isolation column are distributed in a staggered manner.

[0028] Based on the above features, by distributing the crack blocking bodies on both sides of the first isolation pillar in a staggered manner, or by connecting the crack blocking bodies on one side of the first isolation pillar in sequence, it is possible to block cracks formed at any position on the edge of the substrate.

[0029] In some examples, the shape of the side of the crack barrier opposite to the crack-inducing surface is adapted to the shape of the crack-inducing surface. Shape adaptation includes identical, similar, or similar shapes.

[0030] Based on the above characteristics, when arranging the crack barrier, the crack barrier can be placed relatively close to the first isolation column, which can save space, reduce the width of the non-display area, and increase the screen ratio.

[0031] In some examples, the crack barrier satisfies at least one of the following:

[0032] The crack-blocking body contains water-absorbing particles;

[0033] The crack barrier is made of a water-absorbing material.

[0034] Based on the above characteristics, incorporating water-absorbing particles or using water-absorbing materials to prepare crack barriers can enable crack barriers to absorb water and prevent moisture from further penetrating into the display panel.

[0035] In some examples, the encapsulation layer has multiple filler grooves, and the crack barrier is located within these filler grooves, extending through the encapsulation layer in its thickness direction. The filler grooves extending through the encapsulation layer prevent cracks from crossing the crack barrier from the bottom of the filler groove, thus enhancing the crack barrier's ability to prevent cracks.

[0036] As an example, the encapsulation layer is made of inorganic materials, which have a high ability to isolate water and oxygen and are not corroded by water and oxygen themselves; and / or, the crack barrier is made of organic materials, which have strong toughness and can effectively block cracks in the encapsulation layer.

[0037] As an example, the substrate has a through-hole, and the edge of the substrate includes an inner edge and an outer edge, the inner edge surrounding the through-hole, and the blocking structure is distributed along the inner edge or the outer edge. The through-hole is used to arrange a camera module, a fingerprint module, etc. The blocking structure is arranged on the inner edge to block cracks generated at the inner edge, and arranged on the outer edge to block cracks generated at the outer edge.

[0038] In some examples, the display panel further includes an organic film layer located between the substrate and the encapsulation layer. A first portion of the organic film layer is located on the surface of the substrate, and a second portion of the organic film layer is located on the surface of the barrier structure away from the substrate, with the first and second portions spaced apart from each other. The height difference between the surface of the barrier structure away from the substrate and the substrate surface ensures that the organic film layer consists of several unconnected parts during fabrication. This helps prevent water and oxygen from the environment from eroding the display area along the organic film layer, thus extending the lifespan of the display panel.

[0039] Secondly, embodiments of this application also provide a method for manufacturing a display panel, which is used to manufacture any of the display panels described in the first aspect. The manufacturing method includes:

[0040] A barrier structure is formed on one side of the substrate, the barrier structure being distributed along at least a portion of the edge of the substrate, the barrier structure including at least one first isolation pillar located in a non-display area, and at least one sidewall of the first isolation pillar including a crack-inducing surface, the crack-inducing surface including at least one of a concave surface and a convex surface.

[0041] An encapsulation layer is formed on one side of the substrate, such that the barrier structure is located between the substrate and the encapsulation layer, and a gap is formed between the encapsulation layer and the sidewall of the first isolation pillar.

[0042] In some examples, after forming an encapsulation layer on one side of the substrate, the method further includes:

[0043] A plurality of filling grooves are formed in the encapsulation layer, the plurality of filling grooves being distributed on at least one side of at least one first isolation post, the plurality of filling grooves being distributed along the extending direction of the first isolation post;

[0044] A crack barrier is formed in the filling groove.

[0045] For example, the crack barrier is formed in the filling groove using an inkjet printing process.

[0046] Thirdly, embodiments of this application also provide an electronic device, which includes a display panel as described in the first aspect.

[0047] Based on the above characteristics, the crack-inducing surface of the first isolation pillar in the display panel makes it easier for the crack to extend along the crack-inducing surface after it starts from the edge of the substrate. This changes the direction of crack extension, reduces the possibility of the crack extending directly in a straight line and passing through the blocking structure to enter the display area, and helps to extend the service life of electronic devices. Attached Figure Description

[0048] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0049] Figure 2 This is a partial structural diagram of a display panel provided in an embodiment of this application;

[0050] Figure 3 This is a schematic diagram of the structure of a substrate provided in an embodiment of this application;

[0051] Figure 4 This is a partial top view of a display panel provided in an embodiment of this application;

[0052] Figure 5 yes Figure 4 Section I-I in the diagram;

[0053] Figure 6 This is a partial top view of a display panel provided in an embodiment of this application;

[0054] Figure 7 This is a partial top view of a display panel provided in an embodiment of this application;

[0055] Figure 8 This is a partial top view of a display panel provided in an embodiment of this application;

[0056] Figure 9 This is a partial top view of a display panel provided in an embodiment of this application;

[0057] Figure 10 This is a partial top view of a display panel provided in an embodiment of this application;

[0058] Figure 11 This is a partial top view of a display panel provided in an embodiment of this application;

[0059] Figure 12 This is a partial top view of a display panel provided in an embodiment of this application;

[0060] Figure 13 This is a partial top view of a display panel provided in an embodiment of this application;

[0061] Figure 14 This is a partial top view of a display panel provided in an embodiment of this application;

[0062] Figure 15 yes Figure 14 Schematic diagram of section II-II in the diagram;

[0063] Figure 16 This is a partial cross-sectional schematic diagram of a display panel provided in an embodiment of this application;

[0064] Figure 17 This is a partial top view of a display panel provided in an embodiment of this application;

[0065] Figure 18 This is a partial top view of a display panel provided in an embodiment of this application;

[0066] Figure 19 This is a partial top view of a display panel provided in an embodiment of this application;

[0067] Figure 20 This is a partial top view of a display panel provided in an embodiment of this application;

[0068] Figure 21 yes Figure 20 Section III-III in the diagram;

[0069] Figure 22 This is a partial top view of a display panel provided in an embodiment of this application;

[0070] Figure 23This is a partial top view of a display panel provided in an embodiment of this application;

[0071] Figure 24 This is a flowchart of a method for manufacturing a display panel provided in an embodiment of this application.

[0072] Legend

[0073] 10. Substrate 10a, Through hole 100, Edge 101, Inner edge 102, Outer edge

[0074] 1000, Display panel 1000a, Display area 1000b, Non-display area 1000c, Camera hole

[0075] 20. Encapsulation layer 20a, Crack 20b, Filler groove

[0076] 30. Isolation column

[0077] 40. Barrier structure 40a, Gap 41, First isolation pillar 410, Crack induction surface

[0078] 411, concave surface; 412, convex surface; 4111, first plane; 4112, second plane

[0079] 4113, Third plane; 4114, Fourth plane; 42, Second isolation pillar

[0080] 50. Crack barrier

[0081] 60. Organic film layer; 61. First part; 62. Second part Detailed Implementation

[0082] The terminology used in the embodiments section of this application is for illustrative purposes only and is not intended to limit the application. Unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," "third," and similar terms used in the patent application specification and claims of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including," and similar terms mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including" and their equivalents, and do not exclude other elements or objects. The terms "connected," "linked," and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up," "down," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0083] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device can be a device with display functionality, and can be, but is not limited to, a mobile phone, smartwatch, smart bracelet, tablet computer, PDA, laptop computer, or monitor. This embodiment uses a mobile phone as an example.

[0084] The electronic device includes a display panel 1000, which has a display area 1000a and a non-display area 1000b. In some display panels 1000, the non-display area 1000b surrounds the outer side of the display area 1000a. In this example, the display panel 1000 has a camera hole 1000c, a portion of the non-display area 1000b surrounds the outer side of the display area 1000a, and another portion of the non-display area 1000b surrounds the camera hole 1000c.

[0085] Figure 2 This is a partial structural schematic diagram of a display panel provided in an embodiment of this application. The location shown in the figure is the boundary between display area 1000a and non-display area 1000b. Figure 2 As shown, the display panel 1000 includes a substrate 10, an encapsulation layer 20, and isolation pillars 30. The encapsulation layer 20 is located on one side of the substrate 10. The encapsulation layer 20 is located in the display area 1000a and the non-display area 1000b. The isolation pillars 30 are located in the non-display area 1000b, and the encapsulation layer 20 covers the isolation pillars 30.

[0086] For example, the encapsulation layer 20 is made of an inorganic material. For instance, the encapsulation layer 20 may be made of silicon nitride, silicon oxide, or silicon oxynitride (SiN). x O y One or more of the materials can be formed using a deposition process. Inorganic materials have a good ability to isolate water and oxygen, and are not corroded by water and oxygen themselves.

[0087] In the display area 1000a, light-emitting units are also distributed on the surface of the substrate 10. The light-emitting units can be connected to the circuit structure on the surface of the substrate 10, such as to the driving circuit. Exemplarily, the light-emitting units may include at least one of organic light-emitting diodes (OLEDs), micro light-emitting diodes (Micro LEDs), and mini light-emitting diodes (Mini LEDs).

[0088] Taking a rectangular substrate 10 and a circular substrate 10 as examples, the substrate 10 is plate-shaped and has two relatively large opposing surfaces. One of these two surfaces serves as a bearing surface, supporting structures such as the isolation pillar 30 and the light-emitting unit. In the embodiments of this application, unless otherwise specified, the surface of the substrate 10 refers to the surface of the substrate 10 used to support structures such as the isolation pillar 30 and the light-emitting unit.

[0089] In the display area 1000a, the encapsulation layer 20 is located on the side of the light-emitting unit away from the substrate 10. For example, the encapsulation layer 20 can cover the surface of the light-emitting unit; or, for example, other film layers can be disposed between the encapsulation layer 20 and the light-emitting unit. The encapsulation layer 20 isolates the light-emitting unit from the external environment, thus protecting the light-emitting unit. For example, taking an organic light-emitting diode (OLED) as an example, the light-emitting layer in an OLED is usually made of organic materials. The light-emitting layer is prone to failure after being corroded by water and oxygen, leading to abnormal function of the light-emitting unit. In some display panels 1000, abnormal function of the light-emitting unit manifests as black spots appearing in the display area. The encapsulation layer 20 isolates the light-emitting unit from the external environment, preventing the light-emitting unit from being corroded by water, oxygen, etc., thereby extending the lifespan of the light-emitting unit.

[0090] The integrity of the encapsulation layer 20 structure has a significant impact on its ability to isolate water and oxygen. In some cases, cracks may form in the encapsulation layer 20, reducing its integrity. The display panel 1000 undergoes cutting during its fabrication process. For example, the display panel 1000 is usually not fabricated piece by piece, but rather a large block is cut to form multiple display panels 1000. Furthermore, some areas of the display panel 1000 may have holes cut into them. These holes can be used to house structures such as camera modules and fingerprint modules, as exemplified by the aforementioned camera hole 1000c.

[0091] Regardless of whether laser cutting or conventional cutting processes are used, cracks may form in the encapsulation layer 20 at the edge of the substrate 10, which is also the edge of the display panel 1000, after cutting. These cracks extend perpendicularly or approximately perpendicularly to the edge of the display panel 1000. This is because the material used to fabricate the encapsulation layer 20 is somewhat brittle, and even small deformations can easily cause cracking under stress. These cracks typically extend in a straight or near-straight line from the edge towards the display area 1000a. Cracks increase the risk of water and oxygen corrosion to the light-emitting units; the closer the cracks are to the display area 1000a, the greater the risk. Once the cracks extend beyond the isolation pillars 30 into the display area 1000a, the risk of water and oxygen corrosion increases significantly.

[0092] In other situations, such as when the edge of the substrate 10 is bumped or struck, the encapsulation layer 20 may also crack at its edge under the impact of external forces on the display panel 1000. The cutting and bumping scenarios mentioned in the embodiments of this application are merely examples, and may include any other scenarios that could lead to cracks in the encapsulation layer 20.

[0093] The display panel mentioned in the embodiments of this application can be a display panel with holes to house structures such as camera modules and fingerprint modules, or it can be a display panel without holes. Figure 3 This is a schematic diagram of the structure of a substrate provided in an embodiment of this application, such as... Figure 3As shown, the substrate 10 may have a through-hole 10a, and the edge 100 of the substrate 10 may include an inner edge 101 and an outer edge 102. In some examples, the substrate 10 may also not have a through-hole 10a, and the edge 100 of the substrate 10 may include an outer edge 102. The outer edge 102 forms the outline of the substrate 10, and the inner edge 101 forms the through-hole 10a. That is, for a display panel that does not require an opening, the substrate 10 may not have a through-hole 10a, and the substrate 10 has an outer edge 102; for a display panel that requires an opening, the substrate 10 has a through-hole 10a, and the substrate 10 has an outer edge 102 and an inner edge 101. Whether at the outer edge 102 or the inner edge 101, the encapsulation layer 20 may develop cracks. Although the isolation pillars 30 in the non-display area 1000b can block water and oxygen erosion to a certain extent, these cracks can easily cross the isolation pillars 30, rendering the isolation pillars 30 ineffective. As a result, the risk of water and oxygen erosion inside the display panel 1000 remains high.

[0094] Figure 4 This is a partial top view of a display panel provided in an embodiment of this application. The location shown in the figure is the boundary between the display area 1000a and the non-display area 1000b. Two cracks 20a are also schematically shown in the figure. Figure 5 yes Figure 4 Section I-I in the diagram, as shown Figure 5 As shown, the display panel includes a substrate 10, an encapsulation layer 20, and a barrier structure 40. The encapsulation layer 20 is located on one side of the substrate 10, and the barrier structure 40 is located between the substrate 10 and the encapsulation layer 20. The encapsulation layer 20 may cover the surface of the substrate 10 and the surface of the barrier structure 40 away from the substrate 10. (Refer to...) Figure 4 The blocking structure 40 is distributed along at least a portion of the edge 100 of the substrate 10.

[0095] The barrier structure 40 includes at least one first isolation post 41 located in the non-display area 1000b. At least one sidewall of the first isolation post 41 includes a crack-inducing surface 410, which includes at least one of a concave surface 411 and a convex surface 412. A gap 40a is formed between the encapsulation layer 20 and the sidewall of the first isolation post 41, at least a portion of which extends along the crack-inducing surface 410.

[0096] The first isolation pillar 41 extends along the edge 100 of the substrate 10. The first isolation pillar 41 has two opposite sidewalls, one sidewall being close to the edge 100 of the substrate 10 and the other sidewall being away from the edge 100 of the substrate 10, i.e., close to the display area 1000a. As an example, Figure 4The diagram shows a first isolation post 41, with both sidewalls of the first isolation post 41 including crack-inducing surfaces 410. The crack-inducing surfaces 410 include concave surfaces 411 and convex surfaces 412. Both sides of the first isolation post 41 have slots 40a extending along the first isolation post 41.

[0097] In this embodiment, by arranging a first isolation pillar 41 with a crack-inducing surface 410, the shape of the encapsulation layer 20 varies significantly at the two side walls of the first isolation pillar 41 due to the height difference between the surface of the first isolation pillar 41 away from the substrate 10 and the surface of the substrate 10, and may even form wrinkles. This significant shape variation results in greater stress in the encapsulation layer 20 at the two side walls of the first isolation pillar 41 than at other nearby locations; that is, the stress in the encapsulation layer 20 is greater at the gap 40a. Areas with higher stress in the encapsulation layer 20 are more prone to crack formation 20a. Furthermore, the encapsulation layer 20 lacks support at the gap 40a, providing space for minor deformation and cracking of the encapsulation layer 20. After the crack 20a extends from the edge 100 of the substrate 10 to the crack-inducing surface 410, the encapsulation layer 20 is more likely to crack along the crack-inducing surface 410. This alters the direction of crack 20a extension, reducing the possibility of crack 20a extending directly in a straight line, crossing the blocking structure 40, and entering the display area 1000a.

[0098] As crack 20a continues to form along the crack-inducing surface 410, the stress in the encapsulation layer 20 is continuously released. Once the stress is released to a certain extent, the encapsulation layer 20 stops cracking, and the length of crack 20a no longer increases. Compared to crack 20a extending directly along a straight line towards the display area 1000a, during the formation of crack 20a along the crack-inducing surface 410, since the crack-inducing surface 410 includes at least one of a concave surface 411 and a convex surface 412, even though the distance between crack 20a and the display area 1000a is still gradually decreasing, the degree to which the distance between crack 20a and the display area 1000a decreases is smaller if crack 20a increases by the same length. This allows the encapsulation layer 20 to stop cracking before crack 20a extends to the display area 1000a, and the length of crack 20a no longer increases, thereby reducing the possibility of crack 20a extending to the display area 1000a. This helps reduce the risk of water and oxygen erosion to the structure of the display area 1000a and extends the service life of the display panel.

[0099] In this embodiment of the application, an organic light-emitting diode (OLED) display panel is used as an example. That is, the light-emitting unit of the display area 1000a of the display panel may include an organic light-emitting diode. By reducing the risk of organic light-emitting diodes being corroded by water and oxygen, the service life of the display panel is extended.

[0100] In other possible implementations, the display panel can also be other types of display panels, where the light-emitting unit does not include organic light-emitting diodes (OLEDs), for example, the light-emitting unit includes micro-LEDs. Even though micro-LEDs are less sensitive to water and oxygen than organic light-emitting diodes, reducing the likelihood of crack 20a extending to the display area 1000a helps to mitigate the potential adverse effects of environmental substances such as water and oxygen on micro-LEDs. For example, the environment of micro-LEDs near crack 20a extending to the display area 1000a differs significantly from that of micro-LEDs far from crack 20a. Over time, the degree of aging will differ, resulting in differences in display performance and thus affecting the display panel's performance. This example only uses micro-LEDs; the same principle can be applied to other light-emitting units to reduce the potential adverse effects of environmental substances such as water and oxygen.

[0101] Furthermore, even if the light-emitting units in the display panel are completely immune to substances such as water and oxygen, and their performance remains unchanged after long-term exposure to the environment, reducing the likelihood of crack 20a extending to display area 1000a, thereby minimizing or even eliminating the crack 20a extending to display area 1000a, can also reduce the impact of crack 20a on the light emitted from display area 1000a, thus improving the display effect of the display panel. For example, the light emitted by the light-emitting units near crack 20a may change in propagation direction and brightness after illuminating crack 20a, thus affecting the display effect.

[0102] In the embodiments of this application, when describing the relationship between the blocking structure 40 and the edge 100 of the substrate 10, the focus is on the blocking structure 40 and the edge 100 adjacent to the blocking structure 40. For example, for a substrate 10 having an outer edge 102 and an inner edge 101, if the blocking structure 40 is arranged along the outer edge 102, when describing the relationship between the blocking structure 40 and the edge 100 of the substrate 10, the edge 100 of the substrate 10 refers to the outer edge 102; if the blocking structure 40 is arranged along the inner edge 101, when describing the relationship between the blocking structure 40 and the edge 100 of the substrate 10, the edge 100 of the substrate 10 refers to the inner edge 101; if the display panel has more than one hole, for example, two holes are opened to arrange a camera module and a fingerprint module respectively, the substrate 10 may have two through holes 10a and two inner edges 101, and the blocking structure 40 is arranged around one of the through holes 10a. When describing the relationship between the blocking structure 40 and the edge 100 of the substrate 10, the edge 100 of the substrate 10 refers to the inner edge 101, and is the inner edge 101 of the through hole 10a adjacent to the blocking structure 40.

[0103] The blocking structure 40 can be distributed along the outer edge 102 of the substrate 10, or along the inner edge 101 of the substrate 10. Alternatively, a portion of the blocking structure 40 can be distributed along the outer edge 102 of the substrate 10, and another portion of the blocking structure 40 can be distributed along the inner edge 101 of the substrate 10. When the blocking structure 40 is arranged at the outer edge 102, it can block the crack 20a generated at the outer edge 102. When it is arranged at the inner edge 101, it can block the crack 20a at the inner edge 101.

[0104] The blocking structure 40 can be distributed along a portion of the inner edge 101 or around the inner edge 101; the blocking structure 40 can be distributed along a portion of the outer edge 102 or around the outer edge 102.

[0105] When the blocking structures 40 are distributed around the perimeter, the shape formed by the blocking structures 40 can depend on the shape of the edge 100 of the substrate 10. If the through hole 10a is circular, the blocking structures 40 arranged along the inner edge 101 can form a circle; if the through hole 10a is rectangular, the blocking structures 40 arranged along the inner edge 101 can form a rectangle; if the substrate 10 is circular, the blocking structures 40 arranged along the outer edge 102 can form a circle; if the substrate 10 is rectangular, the blocking structures 40 arranged along the outer edge 102 can form a rectangle.

[0106] exist Figure 4 and Figure 5 In the example shown, both sidewalls of the first isolation pillar 41 include crack-inducing surfaces 410. Both sides of the first isolation pillar 41 have gaps 40a. This ensures that even if the crack-inducing surface 410 on the side of the first isolation pillar 41 closest to the edge 100 of the substrate 10 does not prevent the continued extension of part of the crack 20a, the crack-inducing surface 410 on the side of the first isolation pillar 41 furthest from the edge 100 of the substrate 10 can prevent the crack 20a from extending beyond the first isolation pillar 41.

[0107] In some other possible implementations, the first isolation pillar 41 may also have only one sidewall including the crack-inducing surface 410, and correspondingly, the gap 40a is only on the side where the crack-inducing surface 410 is located. Since the crack-inducing surface 410 is located on either side of the first isolation pillar 41, the subsequent extension direction of the crack 20a may change if the encapsulation layer 20 cracks to the crack-inducing surface 410 during the formation of the crack 20a, reducing the possibility of the crack 20a extending to the display area 1000a, the crack-inducing surface 410 can be provided on either side of the first isolation pillar 41.

[0108] As an example, the sidewall of the first isolation pillar 41 near the edge 100 of the substrate 10 includes a crack-inducing surface 410. This causes the crack 20a to be affected by the crack-inducing surface 410 before crossing the first isolation pillar 41 during the formation of the crack 20a, thereby reducing the probability that the crack 20a will cross the first isolation pillar 41.

[0109] Figure 6 This is a partial top view of a display panel according to an embodiment of this application. The figure shows a portion of one edge 100 of the substrate 10 and a portion of the first isolation pillar 41. Figure 6 As shown, the crack-inducing surface 410 of the first isolation pillar 41 may include multiple concave surfaces 411, which are sequentially distributed along the edge 100 of the substrate 10. Multiple cracks may form on the edge 100 of the substrate 10, and each crack forms at a different location. By arranging multiple concave surfaces 411 along the edge 100 of the substrate 10, cracks formed at any location on the edge 100 can be blocked by the concave surfaces 411, reducing the possibility of cracks entering the display area 1000a.

[0110] like Figure 6 As shown, the concave surface 411 includes a first plane 4111 and a second plane 4112 facing each other, and the included angle between the first plane 4111 and the second plane 4112 is 30° to 150°. In the embodiments of this application, the first plane 4111 and the second plane 4112 are both part of the sidewall of the first isolation column 41, and do not refer to planes that can extend infinitely in a geometric sense.

[0111] In this example, the first plane 4111 and the second plane 4112 are connected. The included angle between the first plane 4111 and the second plane 4112 can refer to the included angle formed when the first plane 4111 and the second plane 4112 are connected; or it can refer to the included angle formed when the first plane 4111 and the second plane 4112 are not connected, but are extended to intersect.

[0112] The angle between the first plane 4111 and the second plane 4112 is between 30° and 150°, which allows both the first plane 4111 and the second plane 4112 to effectively guide the cracking of the encapsulation layer 20 and change the direction of crack extension. Furthermore, the change in the direction of extension is quite significant, which can significantly reduce the risk of cracks entering the display area 1000a. Taking the first plane 4111 as an example, the smaller the angle between the first plane 4111 and the original direction of crack extension, the easier it is for the crack to extend along the first plane 4111 after the encapsulation layer 20 cracks from the edge 100 to the first plane 4111, meaning the direction of extension is more easily changed. The smaller the angle between the first plane 4111 and the original direction of crack extension, the greater the reduction in distance between the crack and the display area 1000a for the same length of extension along the first plane 4111. Setting the included angle between the first plane 4111 and the second plane 4112 to 30° to 150° can make the included angle between the first plane 4111 and the original extension direction of the crack, and the included angle between the second plane 4112 and the original extension direction of the crack, both moderate. This avoids one of the first plane 4111 and the second plane 4112 having a moderate included angle with the original extension direction of the crack, while the other has an included angle that is too large or too small.

[0113] As an example, the angle between the first plane 4111 and the second plane 4112 is 60° to 120°.

[0114] Figure 7 This is a partial top view structural diagram of a display panel provided in an embodiment of this application. For example... Figure 7 As shown, in this example, the concave surface 411 includes a first plane 4111 and a second plane 4112 that are not directly connected. The first plane 4111 and the second plane 4112 intersect after being extended.

[0115] Figure 8 This is a partial top view of a display panel according to an embodiment of this application. The figure shows a portion of one edge 100 of the substrate 10 and a portion of the first isolation pillar 41. Figure 8 As shown, in this example, the crack-inducing surface 410 of the first isolation pillar 41 may include a plurality of convex surfaces 412, which are sequentially distributed along the edge 100 of the substrate 10. The convex surfaces 412 may include opposing third planes 4113 and fourth planes 4114, the included angle between which can be 30° to 150°. The principle and function of this crack-inducing surface 410 in guiding cracks to change their extension direction are similar to... Figure 7 The crack-inducing surface 410 shown is similar.

[0116] Figure 9This is a partial top view structural diagram of a display panel provided in an embodiment of this application. For example... Figure 9 As shown, in this example, the crack-inducing surface 410 includes a plurality of concave surfaces 411 and a plurality of convex surfaces 412, with the concave surfaces 411 and convex surfaces 412 alternately distributed along the edge 100 of the substrate 10.

[0117] During the crack formation process, some concave surfaces 411 may not have been affected by the crack extension. Figure 9 As shown in the example, during crack formation, the crack extends to the convex surface 412 and continues to extend along it. If the stress in the encapsulation layer 20 is not sufficiently released and cracking continues, the crack can easily extend to the concave surface 411 adjacent to the convex surface 412 and continue to extend along it, allowing the stress in the encapsulation layer 20 to be further released. Therefore, alternating the concave surface 411 and the convex surface 412 along the edge 100 of the substrate 10 helps to further reduce the risk of cracks extending to the display area 1000a.

[0118] Adjacent concave surfaces 411 and convex surfaces 412 can be spaced apart. The smaller the distance between adjacent concave surfaces 411 and convex surfaces 412, the easier it is for a crack extending along the convex surface 412 to extend to the adjacent concave surface 411 and continue to extend along the concave surface 411 before the stress has been sufficiently released. In some examples, the distance between adjacent concave surfaces 411 and convex surfaces 412 can be 0, that is, adjacent concave surfaces 411 and convex surfaces 412 can be connected.

[0119] Figure 10 This is a partial top view of a display panel according to an embodiment of this application. The figure shows a portion of one edge 100 of the substrate 10 and a portion of the first isolation pillar 41. Figure 10 As shown, in this example, the crack-inducing surface 410 of the first isolation pillar 41 includes a plurality of concave surfaces 411, which are curved surfaces.

[0120] Since the concave surface 411 is curved, the direction of the crack gradually changes as it extends along the concave surface 411, making it easier for the crack to extend along the crack induction surface 410. This causes the direction of the crack to gradually deviate from the original direction of extension, which helps to further reduce the risk of the crack entering the display area 1000a.

[0121] In some examples, the concave surface 411 is an arc surface, and the orthographic projection of the arc surface onto the surface of the substrate 10 is a circular arc with a central angle of 30° to 150°. Within this angle range, when the crack extends to the arc surface, at the two ends of the arc, the angle between the original extension direction of the crack and the tangent at that location is moderate, so that it is not too difficult for the crack to change to extend along the concave surface 411 due to an excessively large angle.

[0122] For example, the concave surface 411 is an arc surface, and the central angle corresponding to the orthographic projection of the arc surface onto the surface of the substrate 10 is 60°~120° or 60°~150°.

[0123] Figure 11 This is a partial top view of a display panel according to an embodiment of this application. The figure shows a portion of one edge 100 of the substrate 10 and a portion of the first isolation pillar 41. Figure 11 As shown, in this example, the crack-inducing surface 410 of the first isolation pillar 41 includes multiple convex surfaces 412, which are sequentially distributed along the edge 100 of the substrate 10. The convex surfaces 412 are curved. The principle and function of this crack-inducing surface 410 in guiding cracks to change their extension direction are similar to... Figure 10 The crack-inducing surface 410 shown is similar.

[0124] Figure 12 This is a partial top view structural diagram of a display panel provided in an embodiment of this application. For example... Figure 12 As shown, in this example, the crack-inducing surface 410 includes a plurality of concave surfaces 411 and a plurality of convex surfaces 412. The concave surfaces 411 and convex surfaces 412 are alternately distributed along the edge 100 of the substrate 10, and both the concave surfaces 411 and convex surfaces 412 are curved surfaces.

[0125] and Figure 9 Similar to the example shown, during the crack formation process, the crack extends to the convex surface 412 and continues to extend along the convex surface 412. If the stress of the encapsulation layer 20 has not been sufficiently released and continues to crack, the crack can subsequently extend to the concave surface 411 adjacent to the convex surface 412 and continue to extend along the concave surface 411, so that the stress of the encapsulation layer 20 can be further released.

[0126] Adjacent concave surfaces 411 and convex surfaces 412 can be spaced apart or connected. In some examples, adjacent concave surfaces 411 and convex surfaces 412 can be connected and tangent, which allows the direction of crack propagation to change more smoothly.

[0127] exist Figures 6-12 In the examples shown, the structure of the crack-inducing surface 410 is described using only the sidewall of the first isolation pillar 41 near the edge 100 of the substrate 10 as an example. In examples where the sidewall of the first isolation pillar 41 away from the edge 100 of the substrate 10 includes the crack-inducing surface 410, the structure of the crack-inducing surface 410 of the sidewall of the first isolation pillar 41 away from the edge 100 of the substrate 10 can be referred to Figures 4 to 12 The crack-inducing surface 410 shown in the example; in the example where the two side walls of the first isolation pillar 41 each include a crack-inducing surface 410, the structure of the crack-inducing surface 410 on the two side walls of the first isolation pillar 41 can also be referred to Figures 4 to 12 The crack-inducing surface 410 shown in the example will not be described in detail here.

[0128] Reference Figure 4 As shown in the example, the orthographic projection of the first isolation pillar 41 onto the surface of the substrate 10 is a broken line.

[0129] In this example, the two side walls of the first isolation pillar 41 each include a crack-inducing surface 410, and the concave surface 411 and convex surface 412 of the two crack-inducing surfaces 410 correspond one-to-one. The thickness of the first isolation pillar 41 is the distance between the two side walls of the first isolation pillar 41, which is the line width of the broken line. Since the length of the first isolation pillar 41 is much larger than its thickness, the orthographic projection of the first isolation pillar 41 onto the surface of the substrate 10 can be regarded as a line.

[0130] Figure 13 This is a partial top view structural diagram of a display panel provided in an embodiment of this application. For example... Figure 13 As shown, in this example, the orthographic projection of the first isolation pillar 41 onto the surface of the substrate 10 is a wavy line.

[0131] In this example, the two side walls of the first isolation pillar 41 each include a crack-inducing surface 410, and the concave surface 411 and convex surface 412 of the two crack-inducing surfaces 410 are also in one-to-one correspondence with... Figure 5 The difference in the example shown is the shape of the concave surface 411 and the convex surface 412.

[0132] The first isolation pillar 41 is configured as a zigzag or wavy shape, so that crack induction surfaces 410 can be arranged on both sides of the first isolation pillar 41 to improve the ability to prevent cracks from extending to the display area 1000a. The convex surface 412 on one side of the first isolation pillar 41 corresponds to the concave surface 411 on the other side, which can prevent the thickness of the first isolation pillar 41 from being too large and increasing the width of the non-display area 1000b.

[0133] Figure 14 This is a partial top view structural diagram of a display panel provided in an embodiment of this application. For example... Figure 14 As shown, in this example, the blocking structure 40 includes a plurality of first isolation pillars 41, which are distributed sequentially at intervals along the edge 100 away from the substrate 10.

[0134] The ability of a single first isolation pillar 41 to prevent cracks from extending to the display area 1000a is limited. By increasing the number of first isolation pillars 41, the ability to block cracks can be improved by using multiple first isolation pillars 41, which helps to further reduce the possibility of cracks extending to the display area 1000a.

[0135] like Figure 14 As shown, the blocking structure 40 may further include a second isolation post 42, which is located on the side of the first isolation post 41 away from the edge 100 of the substrate 10.

[0136] By setting the first isolation pillar 41, the stress of the encapsulation layer 20 has been well released. Even if some cracks cross the first isolation pillar 41 and reach between the first isolation pillar 41 and the second isolation pillar 42, allowing water and oxygen to enter the display panel, the second isolation pillar 42 can block water and oxygen, preventing water and oxygen from entering the display area 1000a and affecting the light-emitting unit.

[0137] In some examples, the first projection of the first isolation pillar 41 is located within the second projection of the first isolation pillar 41, and the first and second projections do not overlap. Here, the first projection of the first isolation pillar 41 is the orthographic projection of a cross section of the first isolation pillar 41 onto the surface of the substrate 10, and the second projection of the first isolation pillar 41 is the orthographic projection of the surface of the first isolation pillar 41 away from the substrate 10 onto the surface of the substrate 10.

[0138] As an example, Figure 15 yes Figure 14 A schematic diagram of section II-II in the diagram. (See diagram below.) Figure 15 As shown, the cross-section of the first isolation pillar 41 is trapezoidal, with the trapezoid inverted, meaning the upper base of the trapezoid is close to the substrate 10, and the lower base is away from the substrate 10. The lower base of the trapezoid corresponds to the surface of the first isolation pillar 41 that is away from the substrate 10. It can be seen that the orthographic projection of the cross-section of the first isolation pillar 41 at any height onto the surface of the substrate 10 will not exceed the edge of the second projection. This shape of the first isolation pillar 41 makes it difficult for the encapsulation layer 20 to completely cover the sidewall of the first isolation pillar 41 during the fabrication of the encapsulation layer 20, resulting in a gap 40a between the sidewall of the first isolation pillar 41 and the encapsulation layer 20.

[0139] As another example Figure 16 This is a partial cross-sectional schematic diagram of a display panel provided in an embodiment of this application, such as... Figure 16 As shown, the middle of the cross-section of the first isolation pillar 41 is concave inward. It can be seen that the height of the first isolation pillar 41, when projected onto the surface of the substrate 10 at the concave cross-section, does not exceed the edge of the second projection. This cross-sectional shape of the first isolation pillar 41 makes it difficult for the encapsulation layer 20 to completely cover the sidewall of the first isolation pillar 41 during fabrication, thus forming a gap 40a between the sidewall of the first isolation pillar 41 and the encapsulation layer 20.

[0140] In some examples, the first isolation pillar 41 may be made of a single material, for example, Figure 15 In the example shown, the first isolation pillar 41 can be made of polyimide; in other examples, the first isolation pillar 41 can also be a multilayer structure, that is, the first isolation pillar 41 can include multiple layers stacked together, and the materials used to make adjacent layers can be different. For example, Figure 16In the example shown, the first isolation pillar 41 may comprise three stacked layers, with the top and bottom layers made of different materials than the middle layers. For example, the top and bottom layers may be made of metallic Ti, and the middle layer may be made of metallic Al. Because metallic Ti and metallic Al have different etching resistance, metallic Al is etched faster during the etching process, resulting in a different cross-section of the first isolation pillar 41. Figure 16 The shape shown.

[0141] Figure 17 This is a partial top view structural diagram of a display panel provided in an embodiment of this application. For example... Figure 17 As shown, in this example, the display panel also includes a plurality of crack barriers 50 embedded in the encapsulation layer 20. The plurality of crack barriers 50 are distributed on at least one side of at least one first isolation post 41, and the plurality of crack barriers 50 are distributed along the extending direction of the first isolation post 41.

[0142] The crack barrier 50 is used to prevent the extension of cracks in the encapsulation layer 20, thus stopping the encapsulation layer 20 from continuing to crack. During crack formation, the crack extends from the edge 100 of the substrate 10 towards the display area 1000a. Upon reaching the crack barrier 50, it is blocked by the crack barrier 50 and stops extending further. Through the combined action of the crack barrier 50 and the crack inducing surface 410, the risk of cracks extending to the display area 1000a can be further reduced.

[0143] The toughness of the material used to prepare the crack barrier 50 can be higher than that of the material used to prepare the encapsulation layer 20, so that the toughness of the crack barrier 50 can be higher than that of the encapsulation layer 20. When a crack formed by the cracking of the encapsulation layer 20 extends to the crack barrier 50, the crack barrier 50, having higher toughness than the encapsulation layer 20, is less likely to crack, thus preventing further crack formation and achieving the purpose of preventing cracking.

[0144] For example, the crack barrier 50 is made of an organic material. Organic materials are highly resilient and can effectively block cracks in the encapsulation layer 20.

[0145] For example, the crack blocker 50 can be made of one or more of aliphatic polyester, aliphatic polyurethane, aromatic polyurethane, polyimide resin, epoxy resin, siloxane resin and acrylic resin, and can be formed by inkjet printing process.

[0146] The crack blocking elements 50 can be distributed on the side of the first isolation pillar 41 near the edge 100 of the substrate 10, or on the side of the first isolation pillar 41 away from the edge 100 of the substrate 10. Multiple crack blocking elements 50 can be distributed on at least one side of at least one first isolation pillar 41; that is, multiple crack blocking elements 50 can be distributed on the same side of the first isolation pillar 41, or some crack blocking elements 50 can be distributed on one side of the first isolation pillar 41, and some crack blocking elements 50 can be distributed on the other side of the first isolation pillar 41. When the display panel includes multiple first isolation pillars 41, crack blocking elements 50 can be distributed on one or both sides of one first isolation pillar 41, or crack blocking elements 50 can be distributed on one or both sides of each of the plurality of first isolation pillars 41.

[0147] In this embodiment of the application, statements describing the positional relationship between the crack blocker 50 and the first isolation pillar 41, such as "the crack blocker 50 is distributed on one side of the first isolation pillar 41", "the crack blocker 50 is distributed on the side of the first isolation pillar 41 near the edge 100 of the substrate 10", "the crack blocker 50 is distributed on the side of the first isolation pillar 41 away from the edge 100 of the substrate 10", "the crack blocker 50 is distributed on one side of the first isolation pillar 41", "the crack blocker 50 is distributed on both sides of the first isolation pillar 41", or similar statements, all describe the positional relationship between the crack blocker 50 and the first isolation pillar 41 adjacent to the crack blocker 50. For example, in one possible implementation, the blocking structure 40 includes two first isolation pillars 41, which are distributed sequentially from the edge 100 of the substrate 10 toward the display area 1000a. A crack blocking body 50 is distributed between the two first isolation pillars 41. A crack blocking body 50 is also distributed between the edge 100 of the substrate 10 and the first isolation pillar 41 closer to the edge 100 of the substrate 10. No crack blocking body 50 is distributed between the first isolation pillar 41 closer to the display area 1000a and the display area 1000a. In this case, crack blocking bodies 50 are distributed on both sides of the first isolation pillar 41 closer to the edge 100 of the substrate 10, and crack blocking bodies 50 are distributed on only one side of the first isolation pillar 41 closer to the display area 1000a.

[0148] In some examples, multiple crack barriers 50 are connected in projection onto the edge 100 of the substrate 10.

[0149] The projection of the crack blocker 50 onto the edge 100 of the substrate 10 refers to the projection formed by the crack blocker 50 being projected onto the edge 100 of the substrate 10 by projection lines that are perpendicular to the edge 100 of the substrate 10 and parallel to the surface of the substrate 10.

[0150] At the edge 100 of the substrate 10, the location of crack initiation is often difficult to predict. Although the range affected by a single crack block 50 is limited, in this embodiment, by connecting the projections of multiple crack blocks 50 onto the edge 100 of the substrate 10, a crack generated at any position on the edge 100 of the substrate 10 has a relatively high probability of encountering a crack block 50 during its extension process, thereby being blocked by the crack block 50 and stopping its further extension.

[0151] As an example, such as Figure 17 As shown, the crack blocking bodies 50 on the same side of the first isolation pillar 41 are distributed at intervals, and the crack blocking bodies 50 on both sides of the first isolation pillar 41 are distributed in a staggered manner.

[0152] exist Figure 17 In the shown state, the crack blocking bodies 50 on both sides of the first isolation pillar 41 are projected to the left onto the edge 100 of the substrate 10. It can be seen that the projections of multiple crack blocking bodies 50 are connected. By staggering the distribution of the crack blocking bodies 50 on both sides of the first isolation pillar 41, the gap between adjacent crack blocking bodies 50 located on the same side of the first isolation pillar 41 can be blocked by crack blocking bodies 50 located on the other side of the first isolation pillar 41.

[0153] Figure 18 This is a partial top view structural diagram of a display panel provided in an embodiment of this application. For example... Figure 18 As shown, in this example, the crack blocking bodies 50 on the same side as the first isolation pillar 41 are also spaced apart, and... Figure 17 The differences in the example shown include the shape of the surface of the crack barrier 50 near the first isolation pillar 41.

[0154] Figure 19 This is a partial top view of a display panel provided in an embodiment of this application. As another example, such as... Figure 19 As shown, the crack blocking bodies 50 on one side of the first isolation column 41 are connected in sequence.

[0155] In this example, the crack blocking bodies 50 on one side of the first isolation pillar 41 are connected in sequence to form a long strip structure extending along the edge 100 of the substrate 10, which can block cracks formed at any position on the edge 100 of the substrate 10.

[0156] Figure 20 This is a partial top view structural diagram of a display panel provided in an embodiment of this application. For example... Figure 20 As shown, in this example, the crack blocking bodies 50 on one side of the first isolation pillar 41 are also connected in sequence, and... Figure 19 The differences in the example shown include the shape of the surface of the crack barrier 50 near the first isolation pillar 41.

[0157] exist Figures 17-20 In the example shown, the shape of the side of the crack barrier 50 opposite to the crack induction surface 410 is adapted to the shape of the crack induction surface 410.

[0158] Shape matching includes, but is not limited to, having the same, similar, or similar shape to the crack-inducing surface 410.

[0159] The crack barrier 50 may be arranged opposite to the crack induction surface 410. The shape of the side of the crack barrier 50 opposite to the crack induction surface 410 includes, but is not limited to, shapes that are the same as, similar to or similar to the shape of the crack induction surface 410.

[0160] The shape of the crack-inducing surface 410 includes, but is not limited to, the shapes mentioned in the foregoing examples, and the shape of the side of the crack-blocking body 50 opposite to the crack-inducing surface 410 also includes, but is not limited to, the shapes mentioned in the foregoing examples.

[0161] Since the shape of the side of the crack block 50 opposite to the crack induction surface 410 is adapted to the shape of the crack induction surface 410, the crack block 50 can be placed relatively close to the first isolation column 41, which can save space, reduce the width of the non-display area 1000b, and increase the screen ratio.

[0162] In some examples, the crack barrier 50 is made of a water-absorbing material.

[0163] A crack barrier 50 is prepared using a water-absorbing material, enabling it to absorb moisture and block water vapor. When a crack extends to the crack barrier 50, the moisture content within the crack is reduced under its influence, further lowering the risk of moisture entering the display area 1000a.

[0164] As an example, the crack barrier 50 may contain water-absorbing particles.

[0165] By incorporating water-absorbing particles into the crack barrier 50, the crack barrier 50 can also absorb moisture and block water vapor. The ability of the crack barrier 50 to absorb moisture and block water vapor can be adjusted by changing the amount of water-absorbing particles or the material used to prepare the water-absorbing particles.

[0166] Figure 21 yes Figure 20 Section III-III diagram, as shown Figure 21 As shown, the encapsulation layer 20 has a plurality of filling grooves 20b, and the crack block 50 is located in the filling grooves 20b. In the thickness direction of the encapsulation layer 20, the filling grooves 20b penetrate the encapsulation layer 20.

[0167] By arranging the crack barrier 50 by setting a filling groove 20b that penetrates the encapsulation layer 20, cracks can be prevented from crossing the crack barrier 50 from the bottom of the filling groove 20b, which helps to improve the crack barrier 50's ability to block cracks.

[0168] like Figure 21 As shown, the display panel may further include an organic film layer 60, which is located between the substrate 10 and the encapsulation layer 20. A first portion 61 of the organic film layer 60 is located on the surface of the substrate 10, and a second portion 62 of the organic film layer 60 is located on the surface of the barrier structure 40 away from the substrate 10. The first portion 61 and the second portion 62 are spaced apart from each other.

[0169] The organic film layer 60 is located in the display area 1000a and the non-display area 1000b, and can be a film layer formed during the fabrication of the structure located within the display area 1000a in the display panel. For example, in a display panel where the light-emitting unit includes organic light-emitting diodes (OLEDs), when fabricating the light-emitting layer of the OLEDs, a single organic film layer 60 is typically formed on one side of the substrate 10. The portion of the organic film layer 60 located in the display area 1000a is fabricated as the light-emitting layer, and the portion shown in the figure is the portion of the organic film layer 60 located in the non-display area 1000b. The height difference between the surface of the blocking structure 40 away from the substrate 10 and the surface of the substrate 10 makes the organic film layer 60 consist of several unconnected parts during the fabrication process. This helps to prevent water and oxygen in the environment from corroding the display area 1000a along the organic film layer 60, thus extending the lifespan of the display panel.

[0170] At the bottom of the filling groove 20b, the crack barrier 50 may not be in contact with the organic film layer 60. For example, the organic film layer 60 may have a clearance hole at the position corresponding to the bottom of the filling groove 20b, meaning that a portion of the organic film layer 60 can be removed. The crack barrier 50 is located in the clearance hole and is spaced apart from the hole wall. By separating the crack barrier 50 from the organic film layer 60, water and oxygen from the environment can be prevented from penetrating into the organic film layer 60 through the crack barrier 50.

[0171] In the example where the barrier structure 40 includes multiple first isolation pillars 41 or also includes second isolation pillars 42, since each first isolation pillar 41 and each second isolation pillar 42 can block water and oxygen from entering the display area 1000a, even if the crack barrier 50 comes into contact with the organic film layer 60, the whole structure still has a good effect of blocking water and oxygen from entering the display area 1000a. Thus, there is no need to set clearance holes in the organic film layer 60, making the preparation simple and convenient.

[0172] In other examples, the filling groove 20b may not penetrate through the encapsulation layer 20, so that the encapsulation layer 20 can be used to separate the crack barrier 50 and the organic film layer 60, preventing water and oxygen from penetrating into the organic film layer 60 through the crack barrier 50.

[0173] Figure 22 This is a partial top view of a display panel provided in an embodiment of this application. Figure 22 The diagram shows an enlarged view of the display panel at the camera hole 1000c. This example only uses camera hole 1000c as an example; the structure at camera hole 1000c can also be applied to other through-holes in the display panel, such as the fingerprint hole for a fingerprint module. Figure 22 As shown, in this example, the barrier structure 40 is distributed along the inner edge 101. The barrier structure 40 includes a first isolation pillar 41 and a plurality of second isolation pillars 42. Both the first isolation pillar 41 and the second isolation pillar 42 are annular and are concentrically arranged. The orthographic projection of the first isolation pillar 41 onto the surface of the substrate 10 is a broken line. Crack blocking bodies 50 are distributed on both sides of the first isolation pillar 41. In other examples, the barrier structure 40 may also include two or more first isolation pillars 41, with the plurality of first isolation pillars 41 concentrically arranged.

[0174] Figure 23 This is a partial top view of a display panel provided in an embodiment of this application, as shown in the diagram. Figure 23 As shown, in this example, the blocking structure 40 is distributed along the inner edge 101. This example is similar to... Figure 22 The differences in the example shown include the shape of the first isolation pillar 41 and the shape of the crack barrier 50.

[0175] Because the diameter of the camera hole 1000c in the display panel is usually small, the curvature of the inner edge 101 is relatively large. During the manufacturing process of the display panel, after the camera hole 1000c is formed using processes such as laser cutting, the stress at the inner edge 101 will be relatively high, making it more prone to crack formation. By arranging a blocking structure 40 around the camera hole 1000c, the risk of cracks generated at the camera hole 1000c extending to the display area 1000a can be greatly reduced.

[0176] Figure 24 This is a flowchart illustrating a method for fabricating a display panel according to an embodiment of this application. This fabrication method can be used to fabricate... Figures 4 to 23 Any of the display panels shown. For example... Figure 24 As shown, the preparation method includes:

[0177] In step S10, a blocking structure 40 is formed on one side of the substrate 10.

[0178] The blocking structure 40 is distributed along at least a portion of the edge 100 of the substrate 10. The blocking structure 40 includes at least one first isolation pillar 41 located in the non-display area 1000b. At least one sidewall of the first isolation pillar 41 includes a crack-inducing surface 410, which includes at least one of a concave surface 411 and a convex surface 412.

[0179] The specific structure of the blocking structure 40 can be referred to in the aforementioned example, and will not be repeated here.

[0180] In step S12, an encapsulation layer 20 is formed on one side of the substrate 10, such that the barrier structure 40 is located between the substrate 10 and the encapsulation layer 20.

[0181] The encapsulation layer 20 may cover the surface of the substrate 10 and the surface of the barrier structure 40 away from the substrate 10. A gap 40a is provided between the encapsulation layer 20 and the sidewall of the first isolation pillar 41, at least a portion of which extends along the crack induction surface 410.

[0182] For example, the encapsulation layer 20 can be formed by deposition.

[0183] When preparing a display panel with crack blocking body 50, steps S14 and S16 can be added after step S12.

[0184] As an example, in step S14, a plurality of filling grooves 20b are formed in the encapsulation layer 20.

[0185] The plurality of filling grooves 20b are distributed on at least one side of at least one first isolation post 41, and the plurality of filling grooves 20b are distributed along the extending direction of the first isolation post 41.

[0186] For example, the filling groove 20b can be formed by processes such as etching.

[0187] In step S16, a crack barrier 50 is formed in the filling groove 20b.

[0188] For example, the crack barrier 50 can be formed using an inkjet printing process. The materials used can be, but are not limited to, one or more of aliphatic polyesters, aliphatic polyurethanes, aromatic polyurethanes, polyimide resins, epoxy resins, siloxane resins, and acrylic resins.

[0189] For a display panel with a through hole, such as a camera hole 1000c, after step S16, the display panel can be punched to create the camera hole 1000c.

[0190] During the fabrication of the display panel, the holes on the surface of the display panel are pre-designed, including their positions and outlines. In other words, the positions and outlines of the through-holes 10a are pre-determined on the surface of the substrate 10. When forming the blocking structure 40 at the inner edge 101, even though the through-holes 10a have not yet been fabricated and the inner edge 101 has not yet been formed, the pre-determined positions and outlines of the through-holes 10a can still be used as a reference to fabricate the blocking structure 40, allowing it to be distributed along the inner edge 101. Similarly, when arranging the blocking structure 40 along the outer edge 102, even though the display panel has not yet been cut and the outer edge 102 has not yet been formed, the cutting position and cutting trajectory are pre-determined. The cutting trajectory can still be used as a reference to fabricate the blocking structure 40, allowing it to be distributed along the outer edge 102.

[0191] The above description is merely one embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, It includes a substrate (10), an encapsulation layer (20) and a barrier structure (40), the encapsulation layer (20) being located on one side of the substrate (10), and the barrier structure (40) being located between the substrate (10) and the encapsulation layer (20) and distributed along at least a portion of the edge (100) of the substrate (10). The blocking structure (40) includes at least one first isolation post (41) located in the non-display area (1000b). At least one sidewall of the first isolation post (41) includes a crack-inducing surface (410), which includes at least one of a concave surface (411) and a convex surface (412). The encapsulation layer (20) has a gap (40a) between itself and the sidewall of the first isolation post (41), at least a portion of which extends along the crack-inducing surface (410).

2. The display panel according to claim 1, characterized in that, The sidewall of the first isolation pillar (41) near the edge (100) of the substrate (10) includes the crack-inducing surface (410).

3. The display panel according to claim 1 or 2, characterized in that, The crack-inducing surface (410) includes a plurality of concave surfaces (411) and a plurality of convex surfaces (412), the concave surfaces (411) and the convex surfaces (412) being alternately distributed along the edge (100) of the substrate (10).

4. The display panel according to any one of claims 1 to 3, characterized in that, The crack-inducing surface (410) satisfies at least one of the following: The concave surface (411) includes a first plane (4111) and a second plane (4112) that are opposite each other, and the included angle between the first plane (4111) and the second plane (4112) is 30° to 150°. The convex surface (412) includes a third plane (4113) and a fourth plane (4114) that are opposite each other, and the included angle between the third plane (4113) and the fourth plane (4114) is 30° to 150°. At least one of the concave surface (411) and the convex surface (412) is a curved surface.

5. The display panel according to any one of claims 1 to 4, characterized in that, The orthographic projection of the first isolation pillar (41) on the surface of the substrate (10) is a broken line or a wavy line.

6. The display panel according to any one of claims 1 to 5, characterized in that, The barrier structure (40) includes a plurality of first isolation pillars (41), which are distributed sequentially at intervals along the edge (100) away from the substrate (10).

7. The display panel according to any one of claims 1 to 6, characterized in that, The first projection of the first isolation pillar (41) is located within the second projection of the first isolation pillar (41) and does not overlap. The first projection of the first isolation pillar (41) is the orthographic projection of a cross section of the first isolation pillar (41) on the surface of the substrate (10). The second projection of the first isolation pillar (41) is the orthographic projection of the surface of the first isolation pillar (41) away from the substrate (10) on the surface of the substrate (10).

8. The display panel according to any one of claims 1 to 7, characterized in that, The barrier structure (40) further includes a second isolation post (42), which is located on the side of the first isolation post (41) away from the edge (100) of the substrate (10).

9. The display panel according to any one of claims 1 to 8, characterized in that, It also includes a plurality of crack blockers (50) embedded in the encapsulation layer (20), the plurality of crack blockers (50) being distributed on at least one side of at least one first isolation post (41), the plurality of crack blockers (50) being distributed along the extension direction of the first isolation post (41).

10. The display panel according to claim 9, characterized in that, The plurality of crack-blocking bodies (50) are connected by projections onto the edge (100) of the substrate (10).

11. The display panel according to claim 10, characterized in that, The crack-blocking bodies (50) on one side of the first isolation column (41) are connected in sequence; or, The crack blocking bodies (50) on the same side of the first isolation column (41) are distributed at intervals, and the crack blocking bodies (50) on both sides of the first isolation column (41) are distributed in a staggered manner.

12. The display panel according to any one of claims 9 to 11, characterized in that, The shape of the side of the crack block (50) opposite to the crack induction surface (410) is adapted to the shape of the crack induction surface (410).

13. The display panel according to any one of claims 9 to 12, characterized in that, The crack barrier (50) satisfies at least one of the following: The crack barrier (50) contains water-absorbing particles; The crack barrier (50) is made of a water-absorbing material.

14. The display panel according to any one of claims 9 to 13, characterized in that, The encapsulation layer (20) has a plurality of filling grooves (20b), and the crack block (50) is located in the filling grooves (20b). In the thickness direction of the encapsulation layer (20), the filling grooves (20b) penetrate the encapsulation layer (20).

15. The display panel according to any one of claims 9 to 14, characterized in that, The encapsulation layer (20) is made of inorganic material; and / or the crack barrier (50) is made of organic material.

16. The display panel according to any one of claims 1 to 15, characterized in that, The substrate (10) has a through hole (10a), and the edge (100) of the substrate (10) includes an inner edge (101) and an outer edge (102). The inner edge (101) surrounds the through hole (10a), and the blocking structure (40) is distributed along the inner edge (101) or the outer edge (102).

17. The display panel according to any one of claims 1 to 16, characterized in that, It also includes an organic film layer (60) located between the substrate (10) and the encapsulation layer (20), a first portion (61) of the organic film layer (60) located on the surface of the substrate (10), and a second portion (62) of the organic film layer (60) located on the surface of the barrier structure (40) away from the substrate (10), with the first portion (61) and the second portion (62) spaced apart from each other.

18. A method for manufacturing a display panel, characterized in that, include: A barrier structure (40) is formed on one side of a substrate (10), the barrier structure (40) being distributed along at least a portion of the edge (100) of the substrate (10), the barrier structure (40) including at least one first isolation pillar (41) located in a non-display area (1000b), at least one sidewall of the first isolation pillar (41) including a crack-inducing surface (410), the crack-inducing surface (410) including at least one of a concave surface (411) and a convex surface (412); An encapsulation layer (20) is formed on one side of the substrate (10), such that the barrier structure (40) is located between the substrate (10) and the encapsulation layer (20), and a gap (40a) is formed between the encapsulation layer (20) and the sidewall of the first isolation pillar (41), at least a portion of which extends along the crack induction surface (410).

19. The preparation method according to claim 18, characterized in that, After forming an encapsulation layer (20) on one side of the substrate (10), the method further includes: A plurality of filling grooves (20b) are formed in the encapsulation layer (20), the plurality of filling grooves (20b) being distributed on at least one side of at least one first isolation post (41), the plurality of filling grooves (20b) being distributed along the extending direction of the first isolation post (41); A crack barrier (50) is formed in the filling groove (20b).

20. An electronic device, characterized in that, Includes the display panel as described in any one of claims 1 to 17.

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