Manufacturing apparatus, method of manufacturing display device, and electronic device

Abstract

Disclosed are a manufacturing apparatus for a display device, a method of manufacturing the display device, and an electronic device. The manufacturing apparatus for a display device includes: a pad assembly including a main body, a core member, and a pad coupled together, and configured to move in a vertical direction; and a clamp configured to receive at least a portion of the pad assembly. At least a portion of the core member is in a body accommodation area formed by the body, and the core member has an expanded opening covered by the pad and facing an inner surface of the pad.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0145219, filed on October 22, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] This disclosure relates to aspects of manufacturing apparatus for a display device, a method of manufacturing a display device using the manufacturing apparatus, and an electronic device including a display device. Background Technology

[0004] In recent years, with increasing interest in information display, research and development of display devices has been ongoing. Furthermore, as the application areas of display devices expand further, interest in flexible display devices is also increasing.

[0005] The display device may include a display panel and a window disposed on the display panel to protect it. To give the display device flexibility, the display panel and the window must be properly molded. Summary of the Invention

[0006] Embodiments of this disclosure provide a manufacturing apparatus for a display device, a method for manufacturing a display device using the manufacturing apparatus, and an electronic device including a display device, wherein a display panel and a cover window can be tightly attached to each other in the manufacturing apparatus.

[0007] Embodiments of this disclosure also provide a manufacturing apparatus for a display device, a method for manufacturing a display device using the manufacturing apparatus, and an electronic device including a display device, wherein molding processes for a display panel and a cover window can be suitably performed in the manufacturing apparatus.

[0008] According to one embodiment of this disclosure, a manufacturing apparatus for a display device includes: a pad assembly comprising a body, a core member, and a pad coupled together, and configured to move in a vertical direction; and a clamp configured to receive at least a portion of the pad assembly. At least a portion of the core member is located in a body receiving region formed by the body, and the core member has an extended opening covered by the pad and facing the inner surface of the pad.

[0009] According to one embodiment, the display device may include a display panel. The pad assembly may form an area where the display panel is disposed. At least a portion of the pad may be in the body receiving area, and at least another portion of the pad may extend around at least a portion of the outer surface of the core member that is not in the body receiving area.

[0010] According to one embodiment, the body, the core component, and the pad can be assembled together to form the pad assembly.

[0011] According to one embodiment, the manufacturing apparatus may further include a capping layer in the body receiving region between the body and the pad. The body, the core member, and the pad may be detachably coupled to each other.

[0012] According to one embodiment, the core member may have a core receiving region, and at least a portion of the pad may protrude and be in close contact with the inner surface of the core member in the core receiving region.

[0013] According to one embodiment, the core component may have a core base portion and a core edge portion integrally formed with each other. The core base portion may be located within the body receiving region, while the core edge portion may be located outside the body receiving region. The core base portion may have a shape and dimensions corresponding to the shape and dimensions of the body receiving region.

[0014] According to one embodiment, the core edge portion may be covered by a portion of the pad, and the extended opening may be formed in at least a portion of the core edge portion.

[0015] According to one embodiment, the core component may have an air injection opening and an air path fluidly connecting the air injection opening and the expansion opening.

[0016] According to one embodiment, the air path may have portions extending in multiple different directions.

[0017] According to one embodiment, the extended opening may include a plurality of extended openings. A first group of the plurality of extended openings may be located at the vertex region of the core edge portion.

[0018] According to one embodiment, the plurality of expansion openings may include a first expansion opening, a second expansion opening, and a third expansion opening facing different directions and located at different vertex regions in the vertex region. The first expansion opening, the second expansion opening, and the third expansion opening may be fluidly connected to the same air injection opening.

[0019] According to one embodiment, a second set of the plurality of extended openings may be formed on the side of the core edge portion.

[0020] According to one embodiment, the pad may include a pad base portion and a pad edge portion integrally formed with each other. The pad base portion may be located in the body receiving region between the body and the core member. The pad edge portion may not be located in the body receiving region and may not be covered by the body.

[0021] According to one embodiment, air supplied through the extended opening can push the inner surface of the pad, and the shape of the outer surface of the pad can be changed by the air pushing the inner surface of the pad.

[0022] According to one embodiment, the manufacturing apparatus may further include a movable member configured to move the pad assembly. The clamp may include a first clamp and a second clamp facing the first clamp, and the second clamp may have an inner surface with a curved shape to receive a cover window.

[0023] According to one embodiment of this disclosure, a method of manufacturing a display device includes: providing a pad assembly, a display panel, and a cover window, the pad assembly including a body, a core member, and a pad connected together, the display panel on the pad assembly, and the cover window facing the display panel; adjusting the shape of the pad; and molding the display panel and the cover window after adjusting the shape of the pad.

[0024] According to one embodiment, adjusting the shape of the pad may include expanding the portion of the pad not covered by the body by causing air supplied through an air path formed in the core member to push against the inner surface of the pad.

[0025] According to one embodiment, in adjusting the shape of the pad, a portion of the pad in the body-receiving area formed by the body may not be extended.

[0026] According to one embodiment, adjusting the shape of the pad may include determining whether the pad expands to a desired range based on the internal pressure of the pad and the external shape of the pad.

[0027] According to one embodiment, molding the display panel and the cover window may include: arranging the pad assembly in a first fixture and supporting the cover window in a second fixture adjacent to the first fixture; and molding the display panel and the cover window to correspond to the shape of the pad.

[0028] According to one embodiment of this disclosure, an electronic device includes: a processor configured to provide input image data; a display device configured to display an image based on the input image data and manufactured by the method; and a power supply configured to supply power to the display device.

[0029] According to one embodiment of the present disclosure, a manufacturing apparatus for a display device, a method for manufacturing a display device using the manufacturing apparatus, and an electronic device including a display device are provided, wherein a display panel and a cover window can be tightly attached to each other in the manufacturing apparatus.

[0030] According to one embodiment of the present disclosure, a manufacturing apparatus for a display device, a method for manufacturing a display device using the manufacturing apparatus, and an electronic device including the display device may be provided, wherein molding processes for a display panel and a cover window may be suitably performed in the manufacturing apparatus. Attached Figure Description

[0031] The above and other aspects and features of this disclosure will become more apparent from the detailed description of embodiments thereof with reference to the accompanying drawings, in which:

[0032] Figure 1 A schematic perspective view illustrating a display device according to an embodiment;

[0033] Figure 2 A schematic cross-sectional view of a display device according to an embodiment is shown below;

[0034] Figure 3 A schematic perspective view of a pad assembly included in a manufacturing apparatus for a display device according to an embodiment is shown;

[0035] Figures 4 to 6 A schematic cross-sectional view of a pad assembly according to various embodiments is shown below;

[0036] Figure 7 for Figure 4 A schematic enlarged view of region EA1 in the diagram;

[0037] Figure 8 A schematic perspective view of a core component according to an embodiment is shown below;

[0038] Figure 9 and Figure 10 A schematic plan view of a core component according to an embodiment is shown below;

[0039] Figure 11 A flowchart illustrating the steps of a method for manufacturing a display device according to an embodiment;

[0040] Figures 12 to 14 A schematic diagram illustrating the steps of a method for manufacturing a display device according to an embodiment;

[0041] Figure 15 A schematic block diagram of an electronic device including a display device according to an embodiment is shown;

[0042] Figure 16 For example Figure 15 The diagram shown illustrates an example of an electronic device implemented as a smartphone; and

[0043] Figure 17 For example Figure 15 The diagram shows an example of an electronic device implemented as a tablet personal computer. Detailed Implementation

[0044] This disclosure can be modified in various ways and may take various forms. Therefore, although embodiments will be illustrated in the accompanying drawings and described in detail in the specification, it should be understood that this disclosure is not intended to be limited to the forms disclosed. Rather, this disclosure includes all modifications, equivalents, and substitutions within the spirit and scope of this disclosure.

[0045] It will be understood that when an element or layer is referred to as being "on" another element or layer, "connected to," or "linked to" another element or layer, it can be directly on, connected to, or linked to the other element or layer, or one or more intermediary elements or layers may be present. When an element or layer is referred to as being "directly on" another element or layer, "directly connected to," or "directly linked to" another element or layer, no intermediary element or layer is present. For example, when a first element is described as being "linked" or "connected" to a second element, the first element can be directly linked to or connected to the second element, or the first element can be indirectly linked to or connected to the second element via one or more intermediary elements.

[0046] In the figures, the dimensions of various elements, layers, etc., may be enlarged for clarity of illustration. The same reference numerals denote the same elements. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Furthermore, the word "may" as used in describing embodiments of this disclosure refers to "one or more embodiments of this disclosure." Expressions such as "at least one of" and "any one of" modify the entire column of elements when following a list of elements, and do not modify individual elements within the column. For example, the expression "at least one of a, b, and c" means only a, only b, only c, both a and b, both a and c, both b and c, all a, b, and c, or variations thereof. As used herein, the term "use" may be considered synonymous with the term "utilize." As used herein, the terms "substantially," "about," and similar terms are used as approximate terms rather than terms of degree and are intended to take into account the inherent variations in measurements or calculations that would be recognized by one of ordinary skill in the art.

[0047] It will be understood that while the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, areas, layers, and / or segments, these elements, components, areas, layers, and / or segments should not be limited by these terms. These terms are used to distinguish one element, component, area, layer, or segment from another. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, area, layer, or segment discussed below may be referred to as the second element, component, area, layer, or segment.

[0048] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” and “up” may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. It will be understood that these spatial relative terms are intended to encompass different orientations of the device in use or operation, in addition to those depicted in the figures. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features would then be oriented as “above” or “upon” other elements or features. Thus, the term “below” can encompass both above and below orientations. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly.

[0049] The terminology used herein is for the purpose of describing embodiments of this disclosure and is not intended to limit this disclosure. As used herein, the singular form “a” is also intended to include the plural form unless the context clearly indicates otherwise. It will be further understood that the terms “comprising” and / or “including” as used in this specification specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0050] Those skilled in the art will understand that, in view of the entirety of this disclosure, each suitable feature of the various embodiments of this disclosure may be combined in part or in whole or in combination with one another, and may be technically interlocked and operated in various suitable ways, and unless otherwise stated or implied, each embodiment may be implemented independently of one another or in combination with one another in any suitable way.

[0051] Furthermore, any numerical ranges disclosed and / or enumerated herein are intended to include all subranges with the same numerical precision contained within the enumerated ranges. For example, the range “1.0 to 10.0” is intended to include all subranges between (and including) the enumerated minimum value of 1.0 and the enumerated maximum value of 10.0, i.e., a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as 2.4 to 7.6. Any maximum numerical limit enumerated herein is intended to include all lower numerical limits contained therein, and any minimum numerical limit enumerated in this specification is intended to include all higher numerical limits contained therein. Accordingly, the applicant reserves the right to amend this specification, including the claims, to expressly enumerate any subranges contained within the scope expressly enumerated herein. All such ranges are intended to be inherently described in this specification such that any modifications made to expressly enumerate any such subranges will comply with the requirements of local patent law.

[0052] This disclosure relates to manufacturing apparatus for a display device, a method for manufacturing a display device using the manufacturing apparatus, and an electronic device including a display device. Hereinafter, a manufacturing apparatus for a display device, a method for manufacturing a display device using the manufacturing apparatus, and an electronic device including a display device according to an embodiment are described with reference to the accompanying drawings.

[0053] refer to Figure 1 and Figure 2 This describes a display device DD according to an embodiment.

[0054] Figure 1 A schematic perspective view of a display device according to an embodiment is shown. Figure 2 A schematic cross-sectional view of a display device according to an embodiment is shown below.

[0055] refer to Figure 1 and Figure 2 The display device DD may include a display panel DP, an adhesive layer ADS, and a cover window CW.

[0056] The display device DD may include a pixel PXL. The pixel PXL can provide (e.g., emit) light and may include one or more subpixels.

[0057] The display device DD may have a display area DA that forms a pixel PXL, and a non-display area NDA that does not form a pixel PXL.

[0058] The display area DA can be formed in various areas of the display device DD (e.g., it can have various sizes and shapes on the display device DD). For example, the display area DA can have a main display area DA-M and a side display area DA-S.

[0059] The main display area DA-M can be a flat area. For example, the main display area DA-M can have a generally flat surface. The main display area DA-M can be generally parallel to the plane on which the base layer (e.g., substrate) forming the display device DD is disposed.

[0060] The plane defined in this specification may be based on the plane of the substrate (e.g., a substrate) on which the display device DD is formed, and may be defined as a plane extending on a first direction DR1 and a second direction DR2 that intersects (e.g., crosses) the first direction DR1. According to one embodiment, the third direction DR3 may be the thickness direction of the substrate (e.g., a substrate) on which the display device DD is formed, and the third direction DR3 may be the light emission direction of the display device DD.

[0061] The side display area DA-S may be located at the periphery of the main display area DA-M. The side display area DA-S may be formed in at least a portion of the bent or curved area of ​​the display device DD. For example, the display device DD may be bent from a first side to a fourth side, and the side display area DA-S may include a first side display area DA-S1 formed on the first side, a second side display area DA-S2 formed on the second side, a third side display area DA-S3 formed on the third side, and a fourth side display area DA-S4 formed on the fourth side. According to one embodiment, the side display area DA-S may be a bezel area that provides light (e.g., light can be emitted from it).

[0062] The non-display area NDA can be located in the peripheral portion of the display area DA. The non-display area NDA can be an area that does not recognize light (e.g., does not emit light).

[0063] According to one embodiment, a non-display area NDA may be formed in at least a portion of the area where the display device DD is bent. For example, the non-display area NDA may be disposed between adjacent side display areas DA-S. The non-display area NDA may be formed at each vertex (or corner) of the display device DD. For example, the non-display area NDA may include a first non-display area NDA1 adjacent to a first vertex of the main display area DA-M, a second non-display area NDA2 adjacent to a second vertex of the main display area DA-M, a third non-display area NDA3 adjacent to a third vertex of the main display area DA-M, and a fourth non-display area NDA4 adjacent to a fourth vertex of the main display area DA-M. However, the extent to which the non-display area NDA is formed is not limited to the specific example.

[0064] The display panel DP can be configured to emit light. The display panel DP can include various light sources. For example, the display panel DP can be an organic light-emitting panel that includes organic light-emitting elements, or it can be an inorganic light-emitting panel that includes inorganic light-emitting elements (e.g., micro light-emitting diodes (LEDs)). However, this disclosure is not limited to the specific examples.

[0065] The display panel DP may have flexible properties. For example, at least a portion of the display panel DP can be bent. According to one embodiment, the display panel DP may include a relatively flexible substrate. The substrate may include polyimide, etc., but this disclosure is not limited thereto.

[0066] The display panel DP may have a panel bending region BA-DP. For example, the display panel DP may be bent in the panel bending region BA-DP and may have a curved cross-sectional shape. According to one embodiment, the panel bending region BA-DP may be formed on one or more sides of the display panel DP. For example, the panel bending region BA-DP may be formed on each of the top, bottom, left, and right sides of the display panel DP.

[0067] According to one embodiment, the display panel DP may have a downwardly bent shape. For example, a convex section may be formed on the front surface of the display panel DP (e.g., the surface of the display panel DP facing the cover window CW), and a concave section may be formed on the rear surface of the display panel DP (e.g., the other surface of the display panel DP not facing the cover window CW).

[0068] The adhesive layer ADS can connect the display panel DP and the cover window CW to each other. The adhesive layer ADS can be located between the display panel DP and the cover window CW, and can have a cross-sectional shape corresponding to the upper surface of the display panel DP and the lower surface of the cover window CW.

[0069] The adhesive layer ADS may include various light-transmitting adhesive materials. For example, the adhesive layer ADS may include an optically clear adhesive (OCA) film, an optically clear resin (OCR), or a pressure-sensitive adhesive (PSA) film. However, this disclosure is not limited thereto.

[0070] The cover window (CW) can be disposed on the adhesive layer (ADS). The cover window (CW) may include various materials configured to transmit light and adapted to protect the display panel (DP) disposed beneath the cover window (CW).

[0071] The cover window CW may have a window bending area BA-CW. For example, the cover window CW may be bent within the window bending area BA-CW and may have a curved cross-sectional shape.

[0072] The cover window CW may have a downwardly bent shape. For example, a convex section may be formed on the front surface of the cover window CW, and a concave section may be formed on the rear surface of the cover window CW.

[0073] Panel bending area BA-DP and window bending area BA-CW may include Figure 1 The side display area DA-S and the non-display area NDA shown are (e.g., they may overlap). For example, at least a portion of the display device DD may be bent, and the display device DD may or may not provide light in the bent area.

[0074] According to one embodiment, because the display device DD has a bent shape, the display device DD can be applied to various electronic devices and can provide a display device DD with improved user aesthetics and convenience.

[0075] refer to Figures 3 to 10 This describes a manufacturing apparatus for a display device DD according to one embodiment. For ease of description, content that may be repeated or substantially similar to the above description is briefly described or omitted.

[0076] Figure 3 A schematic perspective view of a pad assembly included in a manufacturing apparatus for a display device according to an embodiment is shown. Figures 4 to 6A schematic cross-sectional view of a pad assembly according to various embodiments is shown below. Figure 4 and Figure 5 For along Figure 3 A schematic cross-sectional view of the line A-A' in the diagram. Figure 6 For along Figure 3 A schematic cross-sectional view taken by line B-B' in the diagram. Accordingly, Figures 4 to 6 The diagram shows the core base portion CR-B, the core edge portion CR-E of the core component CR, and the portion of the pad assembly PAS adjacent to the core base portion CR-B and the core edge portion CR-E. Figure 7 for Figure 4 A schematic enlarged view of region EA1 in the diagram. Figure 8 A schematic perspective view of a core component according to an embodiment is shown below. Figure 9 and Figure 10 A schematic plan view of a core component according to one embodiment is shown.

[0077] Manufacturing equipment for a display device (DD) may include process facilities for molding a display panel (DP) and a cover window (CW). For example, manufacturing equipment for a display device (DD) according to one embodiment may include a pad assembly (PAS).

[0078] The pad assembly (PAS) can provide an area for mounting (or setting or arranging) the display panel DP during the molding process used for the display panel DP. For example, the display panel DP can be molded to correspond to the shape of the upper surface of the pad assembly (PAS).

[0079] The pad assembly (PAS) may include the body (BD), the core component (CR), and the pad (PD).

[0080] According to one embodiment, the body BD, core member CR, and pad PD can form a kit. For example, the body BD, core member CR, and pad PD can be connected to each other. The body BD, core member CR, and pad PD can form a pad assembly PAS.

[0081] According to one embodiment, the core component CR can be provided (e.g., disposed or arranged) in the body receiving area AC-B formed by the body BD.

[0082] According to one embodiment, at least a portion of the pad PD may be provided (e.g., disposed or arranged) in the core receiving region AC-C formed by the core member CR (refer to, for example) Figure 6Accordingly, the pad PD can be stably coupled to the core member CR. For example, the pad PD may have a protruding portion PRU projecting downward from a central region, and the protruding portion PRU of the pad PD may be provided (e.g., disposed or received) in the core receiving region AC-C. The protruding portion PRU of the pad PD may be in close contact (e.g., may contact the inner surface of the core member CR forming the core receiving region AC-C). In this embodiment, the bonding state between the pad PD and the core member CR can be stably maintained even when the shape of the pad PD expands through an air injection process. For example, even if the edge portion PD-E of the pad expands, at least a portion of the pad PD in the core receiving region AC-C can still be maintained, and the risk of the bonding state between the pad PD and the core member CR being released can be reduced.

[0083] According to one embodiment, the core receiving region AC-C may be a region surrounded by at least a portion of the core member CR. For example, the core receiving region AC-C may be surrounded by a core base portion CR-B and a core edge portion CR-E, and each of the core base portion CR-B and the core edge portion CR-E may include an inner surface facing the core receiving region AC-C.

[0084] At least another portion of the pad PD may surround (e.g., extend around) the outer surface of the core member CR (e.g., at least a portion of the core member CR that is not in the body receiving region AC-B), and thus the pad PD may be in close contact with the outer surface of the core member CR.

[0085] According to one embodiment, the body BD, core member CR, and pad PD can be assembled with each other to form a pad assembly PAS. In this embodiment, the body BD, core member CR, and pad PD can be tightly coupled (e.g., bonded) to each other. However, this disclosure is not limited thereto. According to another embodiment, the body BD, core member CR, and pad PD can be detachably coupled (e.g., detachably connected) to each other, such that they remain separable from each other to form the pad assembly PAS.

[0086] The body BD can form the lower portion of the pad assembly PAS. The body BD can comprise a relatively rigid material. Accordingly, the body BD can stably support the lower portion of the core member CR and the pad PD.

[0087] The main body BD may include (or may form) a main body receiving region AC-B. For example, the main body BD may include a main body side portion SD-B that forms the main body receiving region AC-B. The main body side portion SD-B may surround a region (e.g., may extend around it) and may form a main body receiving region AC-B that opens in one direction.

[0088] The core member CR may form the central portion of the pad assembly PAS. At least a portion of the core member CR may be provided in the body receiving region AC-B, and at least another portion of the core member CR may not be provided in the body receiving region AC-B.

[0089] The core component CR may include a core base portion CR-B and a core edge portion CR-E. The core base portion CR-B and the core edge portion CR-E may be integral and may be formed integrally.

[0090] The core base portion CR-B can form the lower part of the core component CR. When the core component CR and the main body BD are connected to each other, the core base portion CR-B can be set in the main body receiving area AC-B.

[0091] The core base portion CR-B may have a shape and size corresponding to the shape and size of the body receiving area AC-B, such that when a part of the pad PD is located between the core member CR and the body side portion SD-B, the core member CR can be tightly connected to the body BD.

[0092] For example (see example) Figure 4 When the pad assembly PAS is formed, one surface of the pad PD may be adjacent to the core base portion CR-B (e.g., directly adjacent), and the other surface of the pad PD may be adjacent to the body side portion SD-B (e.g., directly adjacent).

[0093] In another embodiment (see example) Figure 5 The pad assembly PAS may further include a capping layer CAP disposed between the core member CR (or pad PD) and the body BD (e.g., the body-side portion SD-B). In one embodiment, the capping layer CAP may be located in the body receiving region AC-B. In this embodiment, when the pad assembly PAS is formed, one surface of the pad PD may be adjacent to (e.g., directly adjacent to) the core base portion CR-B in the body receiving region AC-B, another surface of the pad PD may be adjacent to (e.g., directly adjacent to) one surface of the capping layer CAP, and another surface of the capping layer CAP may be adjacent to (e.g., directly adjacent to) the body-side portion SD-B.

[0094] According to one embodiment, when... Figure 5When the pad assembly PAS shown further includes a capping layer CAP, the body BD, core member CR, and pad PD can be joined to be interchangeable to form the pad assembly PAS. For example, in order for the body BD, core member CR, and pad PD to be interchangeable, the body BD, core member CR, and pad PD should not be in too close contact with each other. However, in order for the pad assembly PAS to have a robust structure, the body BD, core member CR, and pad PD should be stably joined. According to one embodiment, when the pad assembly PAS is formed, the capping layer CAP may be located between the pad PD and the body BD, and therefore, the body BD, core member CR, and pad PD can be joined to be interchangeable and can be in close contact with each other.

[0095] The core edge portion CR-E can form the upper part of the core member CR. When the core member CR is connected to the body BD, the core edge portion CR-E may not be covered by the body BD (e.g., the body side portion SD-B).

[0096] The core edge portion CR-E may not be provided inside the body receiving region AC-B (e.g., it may be outside the body receiving region AC-B) and may be exposed outside the body receiving region AC-B. For example, the core edge portion CR-E may protrude in one direction.

[0097] According to one embodiment, the core member CR may include an extended opening OP-E. The extended opening OP-E may be formed in at least a portion of the core edge portion CR-E. The extended opening OP-E may be directly adjacent to the inner surface of the pad PD (e.g., the pad edge portion PD-E). The extended opening OP-E may be covered by the pad PD (e.g., the pad edge portion PD-E). The extended opening OP-E may face the inner surface of the pad PD (e.g., the pad edge portion PD-E).

[0098] The extended opening OP-E can be fluidly connected to the air path AP and the air injection opening OP-I (e.g., fluidly communicated with them).

[0099] An extended opening OP-E may include multiple extended opening OP-Es. The number of extended opening OP-Es is not limited. Extended opening OP-Es may be formed in the vertex region CN of the core edge portion CR-E and in the region adjacent to the vertex region CN.

[0100] According to one embodiment, the core member CR may include an air injection opening OP-I. The air injection opening OP-I may be formed in at least a portion of the core base portion CR-B. The air injection opening OP-I may be formed in the lower portion of the core member CR.

[0101] The air injection opening OP-I can be fluidly connected to an external air injection component (e.g., a pump, etc.) and can receive air.

[0102] According to one embodiment, the core component CR may include an air path AP. The air path AP may be fluidly connected between an air injection opening OP-I and an expansion opening OP-E. Accordingly, air supplied through the air injection opening OP-I may be provided to the expansion opening OP-E via the air path AP.

[0103] The air path AP may include portions extending in two or more directions. For example, a portion of the air path AP may extend in a direction from the lower portion to the upper portion of the pad assembly PAS (e.g., along the direction along which the body side portion SD-B extends). Another portion of the air path AP may extend in a direction from the center to the edge of the pad assembly PAS (e.g., along the direction along which the lower portion of the body BD extends). Accordingly, air supplied from the lower portion of the pad assembly PAS may be supplied to the extended opening OP-E formed at the opposite upper edge adjacent to the pad edge portion PD-E.

[0104] The pad PD can form the upper portion of the pad assembly PAS. A portion of the pad PD can be disposed in the core receiving region AC-C, at least another portion of the pad PD can be disposed on the core edge portion CR-E, and at least yet another portion of the pad PD can be disposed on the core base portion CR-B and disposed in the body receiving region AC-B. According to one embodiment, the pad PD may include a material such as silicon, but this disclosure is not limited thereto.

[0105] The pad PD may include a pad base portion PD-B and a pad edge portion PD-E. The pad base portion PD-B and the pad edge portion PD-E may be integral and may be formed integrally.

[0106] The pad base portion PD-B can form the lower portion of the pad PD. When the pad assembly PAS is formed, the pad base portion PD-B can cover the outer surface of the core base portion CR-B and can be disposed in the body receiving area AC-B. The pad base portion PD-B can be disposed in the body receiving area AC-B between the body BD (e.g., the body side portion SD-B) and the core member CR (e.g., the core base portion CR-B).

[0107] The pad base portion PD-B may have a shape corresponding to the shape of the outer surface of the core base portion CR-B. Accordingly, the pad base portion PD-B may be in close contact with the core base portion CR-B.

[0108] The foundation portion PD-B may be adjacent (e.g., directly adjacent) to the inner surface of the main body BD (e.g., the main body side portion SD-B). Accordingly, the area where the foundation portion PD-B is located may be limited by the main body BD.

[0109] The pad edge portion PD-E may form the upper part of the pad PD. When the pad assembly PAS is formed, the pad edge portion PD-E may form the uppermost part. The pad edge portion PD-E may not be covered by the main body BD, core member CR, etc. In one embodiment, the pad edge portion PD-E may not be within the main body receiving area AC-B.

[0110] When performing a molding process for the display panel DP, a pad edge portion PD-E can be formed as the base on which the display panel DP is disposed. At least a portion of the pad edge portion PD-E can be bent. Accordingly, during the manufacturing process of the display device DD, the display panel DP can be molded to correspond to the shape of the pad edge portion PD-E.

[0111] The pad edge portion PD-E can cover the outer surface of the core edge portion CR-E. When the pad assembly PAS is formed, the pad edge portion PD-E can be in close contact with the core edge portion CR-E.

[0112] The pad edge portion PD-E may not be covered by the main body BD (e.g., the main body side portion SD-B), and at least a portion of the pad edge portion PD-E may be adjacent to (e.g., directly adjacent to) the upper edge of the main body BD (e.g., the main body side portion SD-B). At least a portion of the pad edge portion PD-E may form the outermost portion of the pad assembly PAS and may be exposed. Accordingly, the area where the pad edge portion PD-E can be disposed may not be limited by the main body BD.

[0113] According to one embodiment, at least a portion of the pad PD may not be covered by the body BD. Accordingly, the shape of at least a portion of the pad PD can change when air is supplied to the inner surface of the pad PD through the extended opening OP-E. See later. Figures 7 to 10 This will be described in more detail.

[0114] refer to Figures 7 to 10 The shape of the pad PD can be changed, and therefore, the outer surface of the pad PD can be expanded.

[0115] For ease of description, Figures 7 to 10 In the diagram, the airflow (e.g., airflow) supplied through the air injection opening OP-I is illustrated by the arrow. For example, in Figure 7 In the diagram, airflow in the air path AP is indicated by solid arrows. Figures 8 to 10 In the diagram, the airflow discharged through the expanded opening OP-E is indicated by a solid arrow. Figure 9 In the diagram, the airflow that extends outwards after being discharged through the expanded opening OP-E is indicated by the dashed arrow.

[0116] According to one embodiment, air supplied through the air injection opening OP-I can move along the air path AP and can push the inner surface of the pad PD (e.g., the pad edge portion PD-E) through the expansion opening OP-E. As the inner surface of the pad edge portion PD-E is pushed, the outer surface of the pad PD can expand.

[0117] According to one embodiment, the expansion opening OP-E may have multiple expansion openings OP-E (e.g., a first group) disposed in the vertex region CN of the core member CR (e.g., the core edge portion CR-E). For example, the expansion opening OP-E may include a first to a third expansion opening facing three different directions in the vertex region CN of the core member CR (e.g., at different vertex regions in the vertex region CN). The first to third expansion openings may be fluidly connected to an air injection opening OP-I (e.g., the same air injection opening OP-I). Because the first to third expansion openings can provide air in different directions in relatively adjacent regions, the outer surface of the pad PD can be more noticeably expanded in the vertex region CN.

[0118] According to one embodiment, the air supplied through the expanded opening OP-E can diffuse outward and push the inner surface of the pad PD. At this time, the air supplied through the expanded opening OP-E can diffuse around the side SD of the core member CR. Correspondingly, the outer surface of the pad PD can be substantially expanded.

[0119] According to one embodiment, the expansion openings OP-E can be formed not only in the vertex region CN of the core member CR, but also in each of the side portions SD. In one embodiment, a second set of the plurality of expansion openings OP-E can be located at the side portion SD of the core edge portion CR-E. In this embodiment, air supplied through the expansion openings OP-E can push the inner surface of the pad PD not only in the vertex region CN, but also in the side portion SD, and therefore, the pad PD can expand more effectively. According to one embodiment, the expansion openings OP-E formed adjacent to the side portion SD can also be fluidly connected to the air injection openings OP-I.

[0120] The pad PD can have different shapes depending on whether an air supply operation is performed. According to one embodiment, the pad PD (e.g., the pad edge portion PD-E) may have a first outer surface S1 and / or a second outer surface S2. For example, the pad PD may have a first outer surface S1 that is not relatively extended by air supplied along the air path AP, and may have a second outer surface S2 that is relatively extended by air supplied along the air path AP. For reference, in Figure 7 The extended appearance of the outer surface shape of the middle pad PD is indicated by the dashed arrow.

[0121] According to one embodiment, air supplied through the expanded opening OP-E can push the portion of the pad PD (e.g., the pad edge portion PD-E) not covered by the body BD. For example, the pad PD can be expanded by air in an area not restricted by the body BD. For example, the outer surface shape of the pad base portion PD-B can remain substantially unchanged, while the outer surface shape of the pad edge portion PD-E can be changed.

[0122] According to one embodiment, the shape of the expanded pad PD can be determined based on the amount of air injected and a shape prepared in advance before the expansion of the pad PD. For example, whether the shape of the pad PD is appropriately expanded can be determined by comprehensively evaluating the internal pressure of the pad PD used to determine the amount of air injected and the shape that can be observed from the outside.

[0123] According to one embodiment, the pad PD can be a structure having a curved portion (e.g., a predetermined curved portion) for molding the display panel DP. According to one embodiment, the pad PD can have a shape that can be adjusted by air injection. Accordingly, the curved portion of the display panel DP can be precisely controlled.

[0124] Furthermore, according to one embodiment, the pad PD may have an outer surface shape that expands through the air, thus having a distinct (e.g., smooth) curved shape in the edge regions (e.g., around the apex), and stably supporting the display panel DP when it is placed on the pad PD.

[0125] Accordingly, the display panel DP can be in substantially close contact with the outer surface of the pad PD, including its apex. Consequently, the risk of the display panel DP and the pad PD not being in close contact with each other (e.g., the risk of an air layer existing between the display panel DP and the pad PD, warping, etc.) can be substantially reduced.

[0126] refer to Figures 11 to 14 This describes a method for manufacturing a display device DD according to an embodiment using a manufacturing apparatus for a display device DD according to an embodiment. For ease of description, content that may be repeated or substantially similar to the above content is briefly described or omitted.

[0127] Figure 11 This is a schematic flowchart illustrating the steps of a method for manufacturing a display device according to an embodiment. Figures 12 to 14 This is a schematic diagram illustrating the steps of a method for manufacturing a display device DD according to an embodiment. For ease of description, the adhesive layer ADS is... Figures 12 to 14 Although not shown in the diagram, the adhesive layer ADS can be positioned between the display panel DP and the cover window CW during the manufacturing process. For example, the adhesive layer ADS can be disposed on the display panel DP and also below the cover window CW.

[0128] refer to Figure 11A method for manufacturing a display device DD according to one embodiment may include: providing a pad assembly, a display panel and a cover window (S200); adjusting the shape of the pad (S400); and molding the display panel and the cover window (S600).

[0129] refer to Figure 11 and Figure 12 In providing the pad assembly, display panel and cover window (S200), the display panel DP and cover window CW can be provided around the manufacturing equipment for the display device DD.

[0130] According to one embodiment, the manufacturing apparatus for the display device DD may include a pad assembly PAS, and may further include a moving member MP, a first clamp LJ, and a second clamp UJ. Additionally, the manufacturing apparatus for the display device DD may further include an external air injection member (e.g., a pump, etc.) configured to inject air through an air injection opening OP-I.

[0131] A movable member MP can be configured to move the pad assembly PAS in a vertical direction. The movable member MP can move the pad assembly PAS in the operating direction DR-O. The movable member MP can move the pad assembly PAS in a direction from the first clamp LJ toward the second clamp UJ. The movable member MP can be a support member and can support the lower portion of the pad assembly PAS. At least a portion of the movable member MP can be disposed in an opening passing through at least a portion of the first clamp LJ. The movable member MP can be implemented by an actuator such as a servo motor or a cylinder, but this disclosure is not limited thereto.

[0132] The first clamp LJ may be a lower clamp. The first clamp LJ may support the lower outer shape of the manufacturing equipment for the display device DD and may have an upper surface for contacting a portion of the second clamp UJ. The first clamp LJ may form a space (e.g., a first space) that can receive (or accommodate) the pad assembly PAS and the display panel DP. A portion of the pad assembly PAS may be provided (e.g., disposed or arranged) in the first clamp LJ.

[0133] The second clamp UJ may be an upper clamp. The second clamp UJ may support the upper outer shape of the manufacturing equipment for the display device DD and may have a lower surface for contacting a portion of the first clamp LJ. The second clamp UJ may form a space (e.g., a second space) that can receive (or accommodate) a cover window CW. According to one embodiment, when performing process steps, at least a portion of the pad assembly PAS may be disposed in the space formed by the second clamp UJ.

[0134] The first clamp LJ and the second clamp UJ may face each other. The second clamp UJ may have a curved surface on which a cover window CW may be disposed. For example, the inner surface of the second clamp UJ may have a curved shape corresponding to the shape of the cover window CW.

[0135] In step S200, a display panel DP may be provided, and the display panel DP may be disposed on the upper surface of a pad PD having a first outer surface S1. In step S200, the pad PD may have an unextended shape.

[0136] In step S200, the cover window CW may be disposed and supported on the inner surface of the second clamp UJ. The cover window CW may be disposed facing the upper surface of the display panel DP. According to one embodiment, in step S200, the first clamp LJ and the second clamp UJ may be provided to be spaced apart from each other.

[0137] refer to Figure 11 and Figure 13 In adjusting the shape of the pad (S400), the outer surface of the pad PD can be expanded.

[0138] In step S400, air supplied through the air injection opening OP-I can move along the air path AP and push the inner surface of the pad PD through the expansion opening OP-E. Accordingly, the pad PD may have a second outer surface S2 that is expanded compared to the first outer surface S1. At this time, because a portion of the pad PD is disposed within the body BD, the expansion of the portion of the pad PD disposed within the body BD can be limited, and only the portion of the pad PD not disposed within the body BD can be expanded. In step S400, the portion of the pad PD not covered by the body BD can be expanded by causing air supplied through the air path AP formed in the core member CR to push the inner surface of the pad PD.

[0139] In step S400, the outer surface shape of the pad PD can be adjusted to have a shape suitable for molding the display panel DP. For example, the pad PD may not be excessively bent, and the pad PD may not excessively face the lower portion.

[0140] In step S400, it can be determined whether the outer surface of the pad PD has expanded to an appropriate extent. For example, the external shape of the pad PD (e.g., outer surface shape) can be observed to determine whether the pad PD has an appropriate (e.g., predetermined) shape. Additionally, the internal pressure of the pad PD can be measured to determine whether the pad PD has expanded to the expected extent. Accordingly, air can be injected through the air path AP until the pad PD has the appropriate shape.

[0141] refer to Figure 11 and Figure 14 In the molded display panel and cover window (S600), the display panel DP and cover window CW can be molded to correspond to the shape of the pad PD and can be connected to each other.

[0142] In step S600, since the adhesive layer ADS is located between the display panel DP and the cover window CW, the display panel DP and the cover window CW can be connected to each other.

[0143] In step S600, the pad assembly PAS can be moved in the operating direction DR-O by the moving member MP, and the second clamp UJ can be moved downward.

[0144] In step S600, the first clamp LJ and the second clamp UJ can be adjacent to each other (e.g., in contact with each other), and the range of movement of the cover window CW and the display panel DP can be limited. Accordingly, the cover window CW and the display panel DP can be connected within the appropriate operating range.

[0145] In step S600, the upper surface of the pad PD can push the lower surface of the display panel DP, and the second clamp UJ can push the upper surface of the cover window CW. Accordingly, the display panel DP and the cover window CW can be molded with a curved surface shape similar to that of the pad PD and can be connected to each other.

[0146] As described above, the shape of the pad PD can be adjusted before performing the substantial molding process for the display panel DP, and therefore, the molding and attachment process between the display panel DP and the cover window CW can be strictly performed.

[0147] Subsequently, according to one embodiment, the first clamp LJ and the second clamp UJ may be spaced apart from each other (e.g., movable apart), and a display device DD including a display panel DP and a cover window CW can be provided.

[0148] Hereinafter, an electronic device 1000 including a display device DD according to an embodiment is described.

[0149] Figure 15 A schematic block diagram of an electronic device including a display device is shown according to an embodiment. Figure 16 For example Figure 15 The diagram shown illustrates an example of an electronic device implemented as a smartphone. Figure 17 For example Figure 15 The diagram shows an example of an electronic device implemented as a tablet personal computer.

[0150] refer to Figures 15 to 17 The electronic device 1000 may include a processor 1010, a memory device 1020, a storage device 1030, an input / output device 1040, a power supply 1050, and a display device 1060. The display device 1060 may be... Figure 1 The display device DD is shown in the figure. Additionally, the electronic device 1000 may further include several ports configured to communicate with a graphics card, sound card, memory card, USB device, etc., or with other systems. In one embodiment, as... Figure 16 As shown, the electronic device 1000 can be implemented as a smartphone. In another embodiment, as... Figure 17As shown, the electronic device 1000 can be implemented as a tablet PC. However, the electronic device 1000 is not limited to this. For example, the electronic device 1000 can be implemented as a mobile phone, video phone, smart tablet, smartwatch, vehicle navigation device, computer monitor, laptop computer, head-mounted display device, etc.

[0151] Processor 1010 can perform specific calculations or tasks. According to one embodiment, processor 1010 can be a microprocessor, central processing unit, application processor, etc. Processor 1010 can be connected to other components via address bus, control bus, data bus, etc. According to one embodiment, processor 1010 can also be connected to an expansion bus, such as a peripheral component interconnect (PCI) bus. According to one embodiment, processor 1010 can provide input image data to display device 1060, and therefore, display device 1060 can display images based on the input image data provided from processor 1010.

[0152] The memory device 1020 may store data used to perform operations of the electronic device 1000. The memory device 1020 may serve as the working memory and / or buffer memory of the processor 1010. For example, the memory device 1020 may include one or more volatile memory devices, such as dynamic random access memory (DRAM) devices, static random access memory (SRAM) devices, and mobile DRAM devices.

[0153] Storage device 1030 can receive control signals or data from processor 1010 and can store data. Storage device 1030 may include one or more non-volatile storage devices that retain data even when electronic device 1000 is turned off. In some embodiments, storage device 1030 may include solid-state drive (SSD), hard disk drive (HDD), CD-ROM, etc.

[0154] Input / output device 1040 may include input devices such as a keyboard, keypad, touchpad, touchscreen, and mouse, and output devices such as a speaker and printer. According to one embodiment, display device 1060 may be included in input / output device 1040.

[0155] Power supply 1050 provides power to the application that operates electronic device 1000. For example, power supply 1050 may be a power management integrated circuit (PMIC). According to one embodiment, power supply 1050 may supply power to display device 1060.

[0156] The display device 1060 can display images corresponding to the visual information of the electronic device 1000. The display device 1060 can be connected to other components via a bus or other communication links.

[0157] As described above, although this disclosure has been described with reference to embodiments herein, those skilled in the art or of ordinary skill in the art will understand that various modifications and changes may be made to this disclosure without departing from the spirit and technical field of the disclosure as described in the appended claims.

[0158] Therefore, the technical scope of this disclosure should not be limited to what is described in the detailed description of the specification, but should be defined by the claims and their equivalents.

Claims

1. A manufacturing apparatus for a display device, the manufacturing apparatus comprising: A pad assembly, comprising a body, a core member, and a pad joined together, and configured to move in the vertical direction; as well as A clamp is configured to receive at least a portion of the pad assembly. At least a portion of the core component is located in the body-receiving region formed by the body, and The core member has an extended opening that is covered by the pad and faces the inner surface of the pad.

2. The manufacturing equipment according to claim 1, wherein the display device includes a display panel. The pad assembly forms the area where the display panel is arranged. At least a portion of the pad is located in the body receiving area, and At least another portion of the pad extends around the outer surface of at least a portion of the core member that is not in the body receiving area.

3. The manufacturing apparatus of claim 1, wherein the body, the core member, and the pad are assembled together to form the pad assembly.

4. The manufacturing apparatus of claim 1, further comprising a capping layer in the body receiving region between the body and the pad. The body, the core component, and the pad are detachably coupled to each other.

5. The manufacturing apparatus of claim 1, wherein the core member forms a core receiving region, and At least a portion of the pad protrudes and is in close contact with the inner surface of the core member in the core receiving area.

6. The manufacturing apparatus of claim 1, wherein the core member has a core base portion and a core edge portion integrally formed with each other. The core base portion is located within the body housing region, while the core edge portion is not located within the body housing region. The core base portion has a shape and size that correspond to the shape and size of the body accommodating area.

7. The manufacturing apparatus of claim 6, wherein the core edge portion is covered by a portion of the pad, and The extended opening is formed in at least a portion of the core edge portion.

8. The manufacturing apparatus of claim 7, wherein the core component has an air injection opening and an air path fluidly connecting the air injection opening and the expansion opening.

9. The manufacturing apparatus of claim 8, wherein the air path has portions extending in a plurality of different directions.

10. The manufacturing apparatus of claim 8, wherein the expanded opening comprises a plurality of expanded openings, and The first group of the plurality of extended openings is located at the apex region of the core edge portion.

11. The manufacturing apparatus of claim 10, wherein the plurality of expansion openings includes a first expansion opening, a second expansion opening, and a third expansion opening facing different directions and located at different vertex regions in the vertex region, and The first expansion opening, the second expansion opening, and the third expansion opening are fluidly connected to the same air injection opening.

12. The manufacturing apparatus of claim 10, wherein the second set of the plurality of extended openings is located on the side of the core edge portion.

13. The manufacturing apparatus according to any one of claims 1 to 12, wherein the pad has a pad base portion and a pad edge portion integrally formed therewith. The pad base portion is located in the main body receiving area between the main body and the core member, and The edge portion of the pad is not located within the body's accommodating area and is not covered by the body.

14. The manufacturing apparatus of claim 13, wherein air supplied through the expanded opening pushes the inner surface of the pad, and The shape of the outer surface of the pad changes in response to the air pushing the inner surface of the pad.

15. The manufacturing apparatus according to any one of claims 1 to 12, further comprising a movable member configured to move the pad assembly. The clamp includes a first clamp and a second clamp facing the first clamp, and The second clamp has an inner surface that has a curved shape at the location where the cover window is to be installed.

16. A method of manufacturing a display device, the method comprising: A pad assembly, a display panel, and a cover window are provided. The pad assembly includes a body, a core member, and a pad connected together. The display panel is on the pad assembly, and the cover window faces the display panel. Adjust the shape of the pad; as well as After adjusting the shape of the pad, the display panel and the cover window are molded.

17. The method of claim 16, wherein adjusting the shape of the pad comprises: The portion of the pad not covered by the body is expanded by pushing the inner surface of the pad with air supplied through an air path formed in the core member, and During the adjustment of the shape of the pad, the portion of the pad in the body-receiving area formed by the body does not expand.

18. The method of claim 16, wherein adjusting the shape of the pad comprises: Whether the pad extends to the expected range is determined based on the internal pressure of the pad and the external shape of the pad.

19. The method of claim 16, wherein molding the display panel and the cover window comprises: The first clamp disposed below the pad assembly and the second clamp supporting the cover window are placed adjacent to each other; as well as The display panel and the cover window are molded to correspond to the shape of the pad.

20. An electronic device comprising: The processor is configured to provide input image data; The display device is configured to display an image based on the input image and is manufactured by the method according to any one of claims 16 to 19; as well as A power supply is configured to supply power to the display device.

Images