Cutting method, cutting device, electronic device, and storage medium of faraday component
By integrating cutting and sharpening devices into the cutting equipment, automatically detecting and switching tool wear, and calibrating the cutting start position using microscopic images, the problem of reduced cutting quality caused by tool wear is solved, achieving efficient and precise Faraday component cutting.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENYANG HEYAN TECH CO LTD
- Filing Date
- 2026-03-30
- Publication Date
- 2026-07-03
AI Technical Summary
In existing technologies, when cutting Faraday components, tool wear leads to a decrease in cutting quality, and the positional accuracy is difficult to guarantee during the switching of cutting equipment, affecting efficiency and product quality.
By setting up cutting and sharpening devices in the cutting equipment, the tool wear is automatically detected and switched during the cutting process. Combined with microscopic images to calibrate the cutting start position, a cutting-sharpening cycle operation is realized, which is compatible with Faraday components of different specifications.
It improves cutting efficiency and product quality, extends tool life, reduces material consumption, and ensures cutting accuracy and consistency.
Smart Images
Figure CN121928684B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of cutting device technology, and in particular to a method, cutting equipment, electronic device and storage medium for cutting Faraday components. Background Technology
[0002] Faraday modules are core components in the manufacture of optical communication devices such as optical isolators and optical circulators. With the development of AI technology and the accelerated construction of data centers, the market demand for high-speed optical modules has surged, leading to a significant increase in the demand for cutting and processing Faraday modules. These crystalline materials are characterized by high hardness (Mohs hardness approximately 7.5-8), high brittleness, and significant anisotropy, making them sensitive to tool wear during cutting and processing, and the difficulty of cutting varies significantly depending on the crystal orientation.
[0003] Currently, semiconductor dicing machines face the major challenge of declining cutting quality due to tool wear when cutting hard and brittle materials such as Faraday chips. Existing technologies typically address this issue through the following methods: first, dispersing cutting stress through a layered dicing process to reduce the force on the tool per pass and extend tool life; second, employing a multi-blade spindle design to improve efficiency by having multiple grinding wheels operate simultaneously; and third, implementing a tool management system for unified management of multiple tools. However, none of these solutions effectively solve the problems of edge chipping and rough cut surfaces caused by continuous tool wear during the cutting process.
[0004] In actual production, operators often need to judge the timing of tool sharpening based on experience, manually interrupting the cutting operation to sharpen the tools, or using a method of forcibly changing tools after a fixed number of passes. The former relies on manual experience, making it difficult to guarantee the accuracy of judgment, and frequent start-stop cycles affect efficiency; the latter is prone to over-sharpening (wasting tool life) or under-sharpening (leading to a decrease in cutting quality). In addition, the cutting equipment needs to be repositioned after sharpening, and the positional accuracy is difficult to guarantee, which can easily lead to cumulative errors. Summary of the Invention
[0005] The purpose of this invention is to provide a method, equipment, electronic device and storage medium for cutting Faraday components, which can realize automatic switching between cutting and grinding.
[0006] The embodiments of the present invention are implemented as follows:
[0007] In a first aspect, embodiments of this application disclose a method for cutting a Faraday component, the cutting method comprising:
[0008] The Faraday component to be cut and the grinding device are fixed on the operating table of the cutting equipment respectively;
[0009] The cutting parameters of the cutting equipment are set according to the thickness of the Faraday component to be cut and the required cutting size, and the cutting start position of the Faraday component is marked to perform the cutting operation;
[0010] During the cutting operation, if the cutting device meets the sharpening trigger condition, the cutting device is controlled to switch between the actual cutting position of the Faraday component and the sharpening device until the cutting operation is completed; wherein, the actual cutting position includes the current cutting position and the next cutting position.
[0011] In a possible implementation, the triggering condition includes:
[0012] A cutting blade number threshold is set based on the material hardness of the Faraday component and the wear rate of the cutting equipment; wherein the cutting blade number threshold is inversely proportional to the material hardness and the wear rate, respectively.
[0013] When the number of cutting blades reaches the threshold, the sharpening operation is triggered.
[0014] In a possible implementation, the calibration of the cutting start position includes:
[0015] Obtain microscopic images of the Faraday component;
[0016] The first and second vertices of the Faraday component are obtained based on the microscopic image;
[0017] The cutting blade of the cutting device is controlled to move directly above the first vertex or the second vertex, and the cutting direction of the cutting blade is controlled to be parallel to the first line connecting the first vertex and the second vertex.
[0018] The cutting blade is controlled to move a first predetermined distance along a first direction, which serves as the starting position for cutting; wherein the first direction is perpendicular to the first line.
[0019] In a possible implementation, the calibration of the sharpening starting position of the sharpening device includes:
[0020] Obtain a microscopic image of the grinding device;
[0021] The third and fourth vertices of the sharpening device are obtained based on the microscopic image;
[0022] Control the cutting blade to move directly above the third vertex or the fourth vertex, and control the cutting direction of the cutting blade to be parallel to the second line connecting the third vertex and the fourth vertex;
[0023] The cutting blade is controlled to move a second predetermined distance along a second direction, which serves as the starting position for sharpening; wherein the second direction is perpendicular to the second line.
[0024] In a possible implementation, the cutting operation includes a first cutting mode, the first cutting mode including:
[0025] The Faraday component and the sharpening device are respectively fixed in the first bearing area of the operating table;
[0026] The cutting blade is controlled to cut the Faraday component along a direction parallel to the first connecting line. When the cutting is completed at the current cutting position, the cutting blade is controlled to move a third predetermined distance along the first direction as the next cutting position. The above cutting process is repeated until the cutting in that direction is completed.
[0027] Rotate the Faraday component by a first preset angle within the plane of the first bearing area to change the relative position of the cutting blade and the Faraday component;
[0028] The cutting blade is controlled to cut the Faraday component along the first direction. When the cutting is completed at the current cutting position, the cutting blade is controlled to move a fourth predetermined distance along the direction of the first connecting line as the next cutting position. This cutting process is repeated until the cutting in this direction is completed.
[0029] In a possible implementation, the cutting operation further includes a second cutting mode, the second cutting mode comprising:
[0030] The Faraday component and the sharpening device are respectively fixed in the first bearing area;
[0031] The cutting blade is controlled to cut the Faraday component along a direction parallel to the first connecting line. When the cutting is completed at the current cutting position, the cutting blade is controlled to move a third predetermined distance along the first direction as the next cutting position. The above cutting process is repeated until the cutting in that direction is completed.
[0032] The Faraday component is transferred from the first bearing area to the second bearing area of the operating table, and the Faraday component is fixed in the second bearing area. The cutting blade is moved to the second bearing area, and the Faraday component is rotated by a second preset angle in the plane of the second bearing area to change the relative position of the cutting blade and the Faraday component.
[0033] The cutting blade is controlled to cut the Faraday component along the first direction, and when the cutting is completed along the current cutting position, the cutting blade is controlled to move a fourth preset distance along the direction of the first connecting line as the next cutting position; the cutting process is repeated until the cutting in this direction is completed, wherein the included angle between the first bearing area and the second bearing area is a third preset angle.
[0034] Secondly, embodiments of this application also disclose a cutting device, comprising:
[0035] Cutting blades, used for cutting Faraday components;
[0036] A cutting spindle is equipped with the cutting blade and drives the cutting blade to move and rotate.
[0037] The controller is used to execute the control process of the above cutting method;
[0038] A sharpening device for sharpening the cutting blade;
[0039] An operating table for detachably mounting the Faraday assembly and the grinding device.
[0040] In a possible implementation, the top surface of the operating table is provided with a first bearing area, and the Faraday component and the sharpening device are respectively detachably fixed at different positions in the first bearing area.
[0041] In a possible implementation, the top surface of the operating table is further provided with a second bearing area, and the Faraday component is detachably fixed to the second bearing area, wherein the included angle between the first bearing area and the second bearing area is a third preset angle.
[0042] Thirdly, embodiments of this application disclose an electronic device, including a processor and a memory, wherein the memory stores a computer program, and the processor is used to execute the computer program to implement the control process in the above-described cutting method.
[0043] Fourthly, embodiments of this application also disclose a storage medium storing a computer program, which, when executed on a processor, implements the control process in the above-described cutting method.
[0044] The embodiments of this application have the following beneficial effects:
[0045] In this embodiment of the Faraday component cutting method, the Faraday component and the grinding device are fixedly mounted on the operating table. Both cutting and grinding operations can be performed on the operating table, reducing the intermediate steps in the cutting-grinding switching process and improving processing efficiency. Cutting parameters are set according to the thickness of the Faraday component and the target cutting size, and the cutting start position is calibrated. This allows for adaptation to Faraday components of different specifications, ensuring basic cutting accuracy. When the blade reaches a preset wear condition, the system automatically switches to the grinding device for grinding. After grinding, the system either resets to the current cutting path or steps to the next cutting position based on the completion of the current cutting path, forming a "cutting-grinding" cyclic operation mode. This mode not only avoids quality problems such as uneven blade edges and excessive product perpendicularity caused by continued cutting, ensuring stable quality of the cut particles, but also significantly reduces the wear rate of the cutting blade, extending its service life and reducing the cost of expensive consumables. Simultaneously, it achieves continuous and efficient cutting operations, balancing the quality, efficiency, and economy of Faraday component processing. Attached Figure Description
[0046] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and therefore should not be considered as a limitation on the scope of protection of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0047] Figure 1 A schematic diagram of the cutting equipment in this embodiment is shown;
[0048] Figure 2 A schematic diagram of the "strip cutting" process in this embodiment is shown;
[0049] Figure 3 A schematic diagram of the "granular cutting" process in this embodiment is shown.
[0050] Icons: 1. Control panel; 11. First bearing area; 12. Second bearing area; 2. Faraday component; 3. Grinding device. Detailed Implementation
[0051] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.
[0052] The components of the embodiments of this application described and illustrated in the accompanying drawings can be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of this application provided in the drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0053] In the following, the terms “comprising,” “having,” and their cognates, which may be used in various embodiments of this application, are intended only to indicate a particular feature, number, step, operation, element, component, or combination thereof, and should not be construed as excluding, firstly, the presence of one or more other features, numbers, steps, operations, elements, components, or combinations thereof, or adding the possibility of one or more features, numbers, steps, operations, elements, components, or combinations thereof.
[0054] Furthermore, the terms "first," "second," and "third" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.
[0055] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which the various embodiments of this application pertain. Terms (such as those defined in commonly used dictionaries) shall be interpreted as having the same meaning as in their contextual meaning in the relevant technical field and shall not be construed as having an idealized or overly formal meaning, unless clearly defined in the various embodiments of this application.
[0056] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0057] First Embodiment
[0058] Please refer to Figures 1 to 3 This embodiment provides a method for cutting a Faraday component, which includes the following steps:
[0059] Step S1: Fix the Faraday component 2 to be cut and the grinding device 3 on the operating table 1 of the cutting equipment (shown in the figure);
[0060] In step S1, the Faraday component 2 to be cut and the sharpening device 3 for sharpening are fixed at designated positions on the operating table 1. This fixing and installation process can be completed manually or automatically by automated equipment (such as a robotic arm). The Faraday component 2 in this step is pre-processed, and this processing mainly includes: gluing the sheet → fixing the Faraday rotating sheet → gluing the glass slide;
[0061] a. Attaching the slide: Take the required Faraday rotation slide from the warehouse, check and confirm the Faraday rotation slide, place the Faraday rotation slide on a horizontal fixture (such as the top surface of operating table 1 or the top surface of other horizontal plates), apply UV glue to the surface of the Faraday rotation slide using a dispensing machine, and then attach the glass slide to the glued surface of the Faraday rotation slide, ensuring that the center point of the Faraday rotation slide and the glass slide are aligned;
[0062] b. Fix the Faraday rotator: Place the calibrated Faraday rotator into the fixture and press it for 10-15 seconds, then place it in the UV light box and irradiate it with a UV lamp for 25 seconds.
[0063] c. Bonding the glass slide: Wipe the glass plate clean with lint-free paper and alcohol, then place the glass plate on a high-temperature plate and set the temperature to 100°C + / - 5°C. Apply an appropriate amount of paraffin wax to the corresponding area of the glass plate with a wax stick, and then bond the fixed Faraday rotation plate to the glass plate (the slide surface is bonded to the glass plate). Press it flat with a cotton swab, and finally remove the glass plate from the high-temperature plate and let it cool.
[0064] The Faraday rotatable pieces are assembled into a Faraday assembly through the process of gluing, fixing, and bonding glass slides. After the above operations are completed, the following steps are performed.
[0065] Step S2: Set the cutting parameters of the cutting equipment according to the thickness of the Faraday component 2 to be cut and the required cutting size, and mark the cutting start position of the Faraday component 2 to perform the cutting operation;
[0066] In step S2, the cutting parameters need to be set according to the thickness of the Faraday component 2 and the required cutting size. These parameters include cutting power, spindle speed, feed rate, and blade thickness. For example, if the thickness of the Faraday component 2 is 10mm and the cutting size is 5mm × 5mm, the cutting power can be set to 80W, the spindle speed to 15000RPM-25000RPM, the feed rate to 0.2mm / s-0.3mm / s, and the blade thickness to 0.05mm-0.07mm. After setting the cutting parameters, the starting position of the cutting of the Faraday component 2 needs to be calibrated, and then the cutting operation can be performed.
[0067] Step S3: During the cutting operation, if the cutting equipment meets the sharpening trigger condition, the cutting equipment is controlled to switch between the actual cutting position of the Faraday component 2 and the sharpening device 3 until the cutting operation is completed; wherein, the actual cutting position includes the current cutting position and the next cutting position;
[0068] Because Faraday rotator blades are made of a relatively hard material, based on actual cutting experience, the blades typically become dull after about 5-7 cuts. Continuing to cut will result in uneven cutting edges and excessive deviations in the perpendicularity of the product's sides. In addition, Faraday rotator blades are relatively expensive and small in size (generally 11mm×11mm). When using these blades to cut particles (which are usually quite small), the blades used are very thin (0.05mm-0.08mm thick) to cut more particles, which leads to the blades wearing out more easily.
[0069] In step S3, during the cutting process, the cutting status of the cutting equipment is continuously monitored. This can be done by accumulating the number of cuts made by the cutting blades using a counter, or by collecting the wear level of the cutting blades using a camera. When the set sharpening trigger condition is met, it indicates that the cutting blades have reached the preset wear condition. If the cutting operation continues, it will affect the cutting quality of the product and accelerate the wear of the cutting blades. At this time, the cutting blades need to be moved from the actual cutting position and moved to the sharpening device 3 for sharpening. After the cutting blades are sharpened to a satisfactory level, the cutting blades are moved back to the actual cutting position to continue the cutting operation. By executing the cutting-sharpening cutting mode in this way, the cutting quality of the particles can be guaranteed, while avoiding accelerated wear of the cutting blades and extending their service life.
[0070] Furthermore, the actual cutting position mentioned above includes the current cutting position and the next cutting position. If the cutting blade triggers the sharpening condition before completing the cutting of the current cutting path, the cutting blade needs to be reset to the current cutting path after sharpening and continue cutting. If the cutting blade triggers the sharpening condition after completing the cutting of the current cutting path, the cutting blade will step a certain distance according to the preset cutting size after sharpening and then perform the cutting operation.
[0071] Furthermore, if the blade radius, angle, and straightness meet the standards, as do the surface roughness, integrity, and lack of defects, and the actual Faraday cutting effect and stability meet the standards, then the blade grinding is deemed qualified. The cutting blade can then be moved from the grinding device 3 to the cutting position, thereby enabling stable high-precision cutting of the Faraday rotating blade.
[0072] In a preferred embodiment, the triggering conditions in step S3 include:
[0073] Step S301: Based on the material hardness of Faraday component 2 and the wear rate of the cutting equipment, set the cutting blade number threshold; wherein, the cutting blade number threshold is inversely proportional to the material hardness and the wear rate, respectively.
[0074] In step S301, different models of Faraday rotator blades generally have different hardness. A suitable cutting device is selected based on the model of the Faraday rotator blade and the different cutting sizes. The size and wear resistance of the cutting blades of different models of cutting devices are generally different. Generally speaking, the greater the material hardness of the Faraday component 2, the greater the wear rate and the greater the wear of the cutting blade, thus requiring an increase in the sharpening frequency. Therefore, the pre-set number of cutting blades should be set lower accordingly.
[0075] Step S302: When the number of cutting blades reaches the cutting blade threshold, a sharpening operation is triggered. For example, for a Faraday component 2 with high material hardness and a cutting blade with a fast wear rate, the cutting blade threshold can be set to five blades; for a Faraday component with slightly lower material hardness and a cutting blade with a slightly slower wear rate, the cutting blade threshold can be set to seven blades. When the accumulated number of cutting blades reaches this threshold, the cutting blade is moved from its current cutting position to the sharpening device 3 for sharpening.
[0076] The determination of the starting position for cutting Faraday component 2 in step S2 includes:
[0077] refer to Figure 2 First, obtain a microscopic image of Faraday component 2 by manually placing Faraday component 2 under a microscope.
[0078] The first and second vertices of Faraday component 2, namely points A and B, are obtained based on microscopic images;
[0079] Control the cutting blade of the cutting device to move it directly above the first vertex or the second vertex, and control the cutting direction of the cutting blade to be parallel to the first line connecting the first vertex and the second vertex, i.e., line segment AB;
[0080] The cutting blade is controlled to move a first set distance along a first direction as the starting position for cutting; wherein the first direction is perpendicular to the first line; after cutting is completed at the starting position, the cutting blade is controlled to move a first set distance along the first direction as the next cutting position.
[0081] In addition, the sharpening device 3 also has a sharpening starting position. Both the sharpening device 3 and the Faraday component 2 have a rectangular cross-section. The calibration process of the two is similar and will not be described in detail here.
[0082] The cutting operation in step S2 or step S3 includes a first cutting mode and a second cutting mode. The two cutting modes are selected according to the type of product to be cut. The cutting surface of the product obtained by cutting according to the first cutting mode is a vertical surface, and the cutting surface of the product obtained by cutting according to the second cutting mode is a bevel with a certain angle.
[0083] Specifically, the first cutting mode includes the following steps:
[0084] Step A1: The Faraday assembly 2 and the sharpening device 3 are respectively fixed to the first bearing area 11 of the operating table 1. In this step, the Faraday assembly 2 and the sharpening device 3 are detachably fixed on the first bearing area 11. For example, the Faraday assembly 2 and the sharpening device 3 can be detachably installed on the first bearing area 11 through a vacuum adsorption device (not shown in the figure). Simultaneously, the Faraday assembly 2 and the sharpening device 3 are located at different positions in the first bearing area 11.
[0085] Step A2: Control the cutting blade to cut the Faraday component 2 along a direction parallel to the first connecting line. When the cutting is completed at the current cutting position, control the cutting blade to move a third predetermined distance along the first direction as the next cutting position. Repeat the above cutting process until the cutting in that direction is completed. In this step, after the above installation process is completed, control the cutting blade to cut along a direction parallel to the straight line AB. When the current cutting position is completed (for example, reaching the preset grooving depth and cutting depth), control the cutting blade to move a third predetermined distance along the first direction as the next cutting position. After repeating this cutting process, a Faraday component 2 with multiple strip structures on the surface is obtained, thus completing the "strip cutting" of the Faraday component 2.
[0086] Step A3: Rotate Faraday component 2 by a first preset angle within the plane of the first bearing area 11 to change the relative position of the cutting blade and Faraday component 2. In this step, after the "strip cutting" of Faraday component 2 is completed, it is necessary to rotate Faraday component 2 within the plane. After rotating by the first preset angle, the relative position of Faraday component 2 and the cutting blade is changed, thereby enabling the "granular cutting" of Faraday component 2. The following examples all use a rotation angle of 90° (clockwise). The orientation references for each point after rotating Faraday component 2 by 90° are as follows. Figure 3 As shown.
[0087] Step A4: Control the cutting blade to cut the Faraday component 2 along the first direction, and when the cutting is completed at the current cutting position, control the cutting blade to move a fourth set distance along the direction of the first connecting line as the next cutting position; repeat this cutting process until the cutting in this direction is completed.
[0088] In step A4, refer to Figure 3 After Faraday component 2 rotates 90°, the first direction is along the X-axis, and the line AB is along the Y-axis. First, the starting position of the cut needs to be calibrated. The calibration process is as follows:
[0089] First, obtain a microscopic image of Faraday component 2 by manually placing Faraday component 2 under a microscope.
[0090] Points A and D of Faraday component 2 were obtained based on microscopic images;
[0091] Control the cutting blade of the cutting equipment to move directly above points A and D, and control the cutting direction of the cutting blade to be parallel to the direction of line segment AD;
[0092] Control the cutting blade to move a fifth predetermined distance along a direction parallel to AB, which serves as the starting position for cutting;
[0093] After calibration, the cutting blade is controlled to cut the Faraday component 2 along the starting position. When the cutting is completed at the current cutting position, the cutting blade is controlled to move a second set distance along the direction of the first line (AB) as the next cutting position. This cutting process is repeated until the cutting in this direction is completed, and the Faraday component 2 with a granular surface structure is finally obtained.
[0094] The second cutting mode differs from the first cutting mode in that, after completing steps A1 and A2, the Faraday component 2 is transferred from the first support area 11 to the second support area 12 and rotated 90° clockwise. Then, step A4 is completed, thereby completing the cutting operation of the Faraday component 2. Since there is an angle between the first support area 11 and the second support area 12, when the cutting blade cuts the Faraday component 2 located in the second support area 12, the resulting cutting surface is an angled bevel, thus obtaining different types of cut products. The included angle between the first support area 11 and the second support area 12 is determined according to the parameters of the desired product. For example, if a cut product with a cutting surface angle of 7° is desired, the included angle between the first support area 11 and the second support area 12 is 7°.
[0095] Furthermore, the first, second, third, fourth, and fifth set distances mentioned above are determined based on the cutting dimensions. For example, without considering cutting losses (i.e., the reduction of Faraday vane material caused by the cutting blade slotting), a Faraday vane with a size of 10mm × 10mm (length and width) is cut into 25 pieces of 2mm × 2mm (length and width). Four cutting lines need to be cut horizontally (X-axis) and vertically (Y-axis) respectively. In this case, the first, second, third, fourth, and fifth set distances are all set to 2mm, and the indirection between each pair of adjacent grinding grooves of the corresponding grinding device 3 is also set to 2mm.
[0096] In some embodiments, the first bearing area 11 is provided with designated locations, which are two pre-defined areas. For example, refer to... Figure 1 In the first cutting mode, Faraday component 2 is fixedly installed at the center of the left side of the first bearing area 11, and sharpening device 3 is fixedly installed at the center of the right side of the first bearing area 11. The sharpening position corresponds one-to-one with the cutting position and is located on the same horizontal line. During the cutting-sharpening switching process, the cutting spindle drives the cutting blade directly along the horizontal line connecting the centers of the two (Faraday component 2 and sharpening device 3), without needing to traverse a complex series of straight lines. In the second cutting mode, Faraday component 2 is fixedly installed at the center of the second bearing area 12, and the center of sharpening device 3 is on the same straight line as the center of the second bearing area 12. This straight line can be decomposed into a horizontal line along the X-axis and a vertical line along the Z-axis. During the cutting-sharpening switching process, the cutting spindle moves along the horizontal line along the X-axis and the vertical line along the Z-axis, again without needing to traverse a complex series of straight lines. Furthermore, the distance between the Faraday component 2 and the sharpening device 3 can be adapted to the two cutting modes. In the first cutting mode, the Faraday component 2 and the sharpening device 3 are both located in the first bearing area 11, and the distance between them can be set to be relatively small, such as five steps along the X-axis. In the second cutting mode, the Faraday component 2 and the sharpening device 3 are located in the second bearing area 12 and the first bearing area 11, respectively, and the distance between them can be set to be slightly larger, such as eight steps along the X-axis.
[0097] Second Embodiment
[0098] This application embodiment also provides a cutting device, including a cutting blade (not shown in the figure), a cutting spindle (not shown in the figure), a controller (not shown in the figure), a sharpening device 3, and an operating table 1. The cutting blade is used to cut the Faraday component 2 and can be made of diamond material to improve wear resistance. The end of the cutting spindle is used to mount the cutting blade and can drive the cutting blade to move and rotate. The cutting spindle is generally horizontally set, and in this embodiment, a single-axis structure is preferred. The controller is communicatively connected to the cutting spindle and the sharpening device 3 to realize the control process in the first embodiment, thereby realizing the automation of the above-mentioned cutting-sharpening process. The sharpening device 3 is used to sharpen the cutting blade. The sharpening device 3 includes a sharpening plate with multiple sharpening grooves. Each sharpening groove corresponds one-to-one with the sharpening position and the cutting position. When the cutting blade is moved into the corresponding sharpening groove and the cutting blade is controlled to rotate, the surface of the cutting blade contacts the inner wall of the sharpening groove, thereby completing the automatic sharpening. The operating table is used to detachably fix the Faraday component 2 and the sharpening device 3. For example, the above-mentioned detachable fixing can be achieved by a vacuum adsorption device.
[0099] Furthermore, the top surface of the operating table 1 is provided with a first bearing area 11 and a second bearing area 12. The Faraday component 2 and the grinding device 3 are respectively installed in different positions of the first bearing area 11. The second bearing area 12 is used to install the Faraday component 2 after "strip cutting". There is an angle between the first bearing area 11 and the second bearing area 12, so as to obtain different types of cut products.
[0100] Third Embodiment
[0101] This application also provides an electronic device including a processor and a memory. The memory stores a computer program, and the processor executes the computer program to implement the control process in the cutting method described in any one of the first embodiments. By implementing the control logic through a software program, the computer device can flexibly adapt to different cutting process requirements and is easy to upgrade and maintain.
[0102] Fourth embodiment
[0103] This application also provides a storage medium storing a computer program that, when executed on a processor, implements the control process in the cutting method described in any one of the first embodiments. This storage medium can exist independently of the device and can be used to provide control software to various cutting devices, promoting the dissemination and application of the technical solution.
[0104] The processor can be an integrated circuit chip with signal processing capabilities. The processor can be a general-purpose processor, including at least one of a Central Processing Unit (CPU), Graphics Processing Unit (GPU), Network Processor (NP), Digital Signal Processor (DSP), Application-Specific Integrated Circuit (ASIC), Field-Programmable Gate Array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. The general-purpose processor can be a microprocessor or any conventional processor, capable of implementing or executing the methods, steps, and logic block diagrams disclosed in the embodiments of this application.
[0105] The memory can be, but is not limited to, Random Access Memory (RAM), Read Only Memory (ROM), Programmable Read-Only Memory (PROM), Erasable Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM), etc. The memory is used to store computer programs, and the processor can execute the computer programs accordingly after receiving execution instructions.
[0106] This application also provides a readable storage medium for storing the computer program used in the aforementioned computer device. For example, the computer-readable storage medium may include, but is not limited to, various media capable of storing program code, such as a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.
[0107] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can also be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings show the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that, in alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, and combinations of blocks in the block diagram and / or flowchart, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.
[0108] In addition, the functional modules or units in the various embodiments of this application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.
[0109] If the aforementioned functions are implemented as software functional modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a smartphone, personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0110] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application.
Claims
1. A method for cutting a Faraday component, characterized in that, The cutting method includes: The Faraday component to be cut and the grinding device are fixed on the operating table of the cutting equipment respectively; The cutting parameters of the cutting equipment are set according to the thickness of the Faraday component and the required cutting size, and the cutting start position of the Faraday component is marked to perform the cutting operation; During the cutting operation, if the cutting device meets the sharpening trigger condition, the cutting device is controlled to switch between the actual cutting position of the Faraday component and the sharpening device until the cutting operation is completed; wherein, the actual cutting position includes the current cutting position and the next cutting position; The calibration of the cutting start position includes: Obtain microscopic images of the Faraday component; The first and second vertices of the Faraday component are obtained based on the microscopic image; The cutting blade of the cutting device is controlled to move directly above the first vertex or the second vertex, and the cutting direction of the cutting blade is controlled to be parallel to the first connecting line, wherein the first connecting line is the line connecting the first vertex and the second vertex; The cutting blade is controlled to move a first predetermined distance along a first direction, which serves as the cutting start position; wherein the first direction is perpendicular to the first connecting line. The cutting operation includes a second cutting mode, the second cutting mode including: The Faraday component and the sharpening device are respectively fixed in the first bearing area of the operating table; The cutting blade is controlled to cut the Faraday component along a direction parallel to the first connecting line. When the cutting is completed at the current cutting position, the cutting blade is controlled to move a third predetermined distance along the first direction as the next cutting position. The cutting process is repeated until the cutting in that direction is completed. The Faraday component is transferred from the first bearing area to the second bearing area of the operating table, and the Faraday component is fixed in the second bearing area. The cutting blade is moved to the second bearing area, and the Faraday component is rotated by a second preset angle in the plane of the second bearing area to change the relative position of the cutting blade and the Faraday component. The cutting blade is controlled to cut the Faraday component along the first direction, and when the cutting is completed along the current cutting position, the cutting blade is controlled to move a fourth preset distance along the direction of the first connecting line as the next cutting position; the cutting process is repeated until the cutting in this direction is completed, wherein the included angle between the first bearing area and the second bearing area is a third preset angle.
2. The method for cutting a Faraday component according to claim 1, characterized in that, The triggering conditions include: A cutting blade number threshold is set based on the material hardness of the Faraday component and the wear rate of the cutting equipment; wherein the cutting blade number threshold is inversely proportional to the material hardness and the wear rate, respectively. When the number of cutting blades reaches the threshold, the sharpening operation is triggered.
3. The method for cutting a Faraday component according to claim 2, characterized in that, The calibration of the starting position of the sharpening device includes: Obtain a microscopic image of the grinding device; The third and fourth vertices of the sharpening device are obtained based on the microscopic image; Control the cutting blade to move directly above the third vertex or the fourth vertex, and control the cutting direction of the cutting blade to be parallel to the second line connecting the third vertex and the fourth vertex; The cutting blade is controlled to move a second predetermined distance along a second direction, which serves as the starting position for sharpening; wherein the second direction is perpendicular to the second line.
4. The method for cutting a Faraday component according to claim 3, characterized in that, The cutting operation further includes a first cutting mode, the first cutting mode including: The Faraday component and the sharpening device are respectively fixed in the first bearing area; The cutting blade is controlled to cut the Faraday component along a direction parallel to the first connecting line. When the cutting is completed at the current cutting position, the cutting blade is controlled to move a third predetermined distance along the first direction as the next cutting position. The cutting process is repeated until the cutting in that direction is completed. Rotate the Faraday component by a first preset angle within the plane of the first bearing area to change the relative position of the cutting blade and the Faraday component; The cutting blade is controlled to cut the Faraday component along the first direction. When the cutting is completed at the current cutting position, the cutting blade is controlled to move a fourth predetermined distance along the direction of the first connecting line as the next cutting position. The cutting process is repeated until the cutting in that direction is completed.
5. A cutting device, characterized in that, include: Cutting blades, used for cutting Faraday components; A cutting spindle is equipped with the cutting blade and drives the cutting blade to move and rotate. A controller is configured to perform the control process of the cutting method as described in any one of claims 1 to 4; A sharpening device for sharpening the cutting blade; An operating table for detachably mounting the Faraday assembly and the grinding device.
6. The cutting device according to claim 5, characterized in that, The top surface of the operating table is provided with a first bearing area, and the Faraday component and the grinding device are respectively detachably fixed at different positions in the first bearing area.
7. The cutting device according to claim 6, characterized in that, The top surface of the operating table is also provided with a second bearing area, and the Faraday component is detachably fixed to the second bearing area, wherein the included angle between the first bearing area and the second bearing area is a third preset angle.
8. An electronic device, characterized in that, It includes a processor and a memory, the memory storing a computer program, and the processor executing the computer program to implement the control process in the cutting method according to any one of claims 1-4.
9. A storage medium, characterized in that, It stores a computer program that, when executed on a processor, implements the control process in the cutting method according to any one of claims 1-4.