Magnetic measurement exploring tube structure and directional logging-while-drilling instrument

Abstract

The invention relates to a magnetic measurement exploring tube structure and a directional logging-while-drilling instrument. The magnetic measurement exploring tube structure comprises an exploring tube framework, and a Z-axis accelerometer, a Y-axis accelerometer, an X-axis accelerometer, a three-axis fluxgate sensor and a single-axis MEMS gyro sensor are fixedly arranged on the exploring tube framework in sequence; an acquisition circuit board is also fixedly arranged on the probe tube framework; the acquisition circuit board is electrically connected with the Z-axis accelerometer, the Z-axis accelerometer is electrically connected with the Y-axis accelerometer, the Y-axis accelerometer is electrically connected with the X-axis accelerometer, the X-axis accelerometer is electrically connected with the three-axis fluxgate sensor and the single-axis MEMS gyro sensor, and the X-axis accelerometer is further used for being connected with a lower instrument through a Tbus. According to the magnetic measurement exploring tube structure, more measurement parameters can be obtained, so that a well track, an instrument tool face posture and the like can be obtained more accurately, and comprehensive and accurate data support can be provided for directional measurement while drilling.

Description

Technical Field

[0001] This invention belongs to the field of drilling directional instrument technology, specifically relating to a magnetic measurement probe structure and a drilling directional logging instrument. Background Technology

[0002] The measuring probe structure is a key core component in the field of directional drilling in petroleum engineering. Its primary function is to accurately measure the wellbore trajectory, specifically encompassing the real-time acquisition of three core parameters: inclination angle, azimuth angle, and tool face attitude. As the "eyes and compass" of underground drilling operations, this structure is an indispensable core component of the logging-while-drilling (LWD) system, directly determining the accuracy of trajectory measurement and the controllability of drilling operations. Through high-precision acquisition and transmission of these key parameters, the measuring probe provides continuous, real-time wellbore trajectory data to the surface control system, providing a reliable basis for operators to precisely control the drill bit's drilling direction. This effectively ensures that the wellbore extends strictly according to the preset design trajectory, significantly improving drilling efficiency and the success rate of first-time well completion. It also minimizes construction risks such as stuck pipe and lost drilling caused by trajectory deviations, providing core technical support for the safe and efficient implementation of petroleum directional drilling projects.

[0003] Existing measuring probe structures have limited measurement parameters, such as only triaxial accelerometer parameters, thus failing to obtain comprehensive wellbore trajectory information. Summary of the Invention

[0004] To address all or part of the aforementioned problems, the present invention aims to provide a magnetic measurement probe structure and a directional logging-while-drilling instrument. The magnetic measurement probe structure of the present invention can obtain more measurement parameters, thereby enabling more accurate acquisition of wellbore trajectory and instrument tool face attitude, thus providing more comprehensive and accurate data support for directional logging-while-drilling.

[0005] According to one aspect of the present invention, a magnetic measurement probe structure is provided, including a probe frame on which a Z-axis accelerometer, a Y-axis accelerometer, an X-axis accelerometer, a triaxial fluxgate sensor, and a single-axis MEMS gyroscope sensor are fixedly disposed.

[0006] Furthermore, the Z-axis accelerometer, Y-axis accelerometer, X-axis accelerometer, triaxial fluxgate sensor, and single-axis MEMS gyroscope sensor are sequentially fixed on the probe frame; a data acquisition circuit board is also fixed on the probe frame, and the Z-axis accelerometer is fixedly located downstream of the data acquisition circuit board; the data acquisition circuit board is electrically connected to the Z-axis accelerometer, the Z-axis accelerometer is electrically connected to the Y-axis accelerometer, the Y-axis accelerometer is electrically connected to the X-axis accelerometer, the X-axis accelerometer is electrically connected to the triaxial fluxgate sensor and the single-axis MEMS gyroscope sensor respectively, and the X-axis accelerometer is also used to connect to the lower instrument via the T-bus bus.

[0007] Furthermore, a first damping O-ring assembly is fitted on the probe frame on the left side of the Z-axis accelerometer and on the probe frame on the right side of the X-axis accelerometer. The first damping O-ring assembly is used to seal and connect with the outer cylinder of the probe frame.

[0008] Furthermore, the probe frame includes a sensor frame and a data acquisition board frame. The right end of the data acquisition board frame is provided with a first connecting part, and the left end of the sensor frame is provided with a second connecting part. The first connecting part and the second connecting part are threaded together. The data acquisition circuit board and the Z-axis accelerometer are fixedly mounted on the data acquisition board frame. The Y-axis accelerometer, the X-axis accelerometer, the three-axis fluxgate sensor, and the single-axis MEMS gyroscope sensor are fixedly mounted on the sensor frame.

[0009] Furthermore, the acquisition circuit board is encapsulated with a colloid and then interference-fitted into the mounting slot of the acquisition board frame. A limiting step is provided within the acquisition board frame; the left end of the Z-axis accelerometer is limited by the limiting step, and the right end of the Z-axis accelerometer is limited by a flange cover, which is threadedly connected to the first connecting part. Two first mounting slots with mutually perpendicular axes are provided on the sensor frame. The Y-axis accelerometer is fixed in the left first mounting slot by a first cover, and the X-axis accelerometer is fixed in the right first mounting slot by another first cover. Each first cover is fixedly connected to the sensor frame by four fixing screws.

[0010] Furthermore, the acquisition board frame has a first wire hole, the acquisition circuit board is electrically connected to the Z-axis accelerometer through a wire harness passing through the first wire hole, the Z-axis accelerometer is electrically connected to the Y-axis accelerometer through a wire harness passing through a hole in the sensor frame, the sensor frame has a groove, and the Y-axis accelerometer is electrically connected to the X-axis accelerometer through a wire harness passing through the groove.

[0011] Furthermore, the sensor frame is provided with a second wire-passing hole and a third wire-passing hole. The X-axis accelerometer is electrically connected to the triaxial fluxgate sensor through a wire harness passing through the second wire-passing hole. The X-axis accelerometer is also electrically connected to the single-axis MEMS gyroscope sensor through a wire harness passing through the second wire-passing hole and the third wire-passing hole in sequence. The sensor frame is also provided with a wire storage slot for storing excess wire harnesses. The second wire-passing hole is n-shaped.

[0012] Furthermore, a fluxgate processing circuit board is also fixed on the sensor frame. The X-axis accelerometer, the triaxial fluxgate sensor, and the fluxgate processing circuit board are fixed on the same side of the sensor frame, and the single-axis MEMS gyroscope sensor is disposed on the other side of the sensor frame. The sensor frame is provided with a circuit board slot, and the fluxgate processing circuit board is disposed in the circuit board slot by interference fit. The sensor frame is provided with a second mounting slot and a third mounting slot. The fluxgate sensor is fixed in the second mounting slot by a second pressure cover, and the single-axis MEMS gyroscope sensor is fixed in the mounting slot by a third pressure cover. The second pressure cover and the third pressure cover are respectively fixed to the sensor frame by fixing screws.

[0013] Furthermore, wall grooves are provided on both sides of the sensor frame of the fluxgate processing circuit board, and a fourth mounting groove is provided at the lower end of the sensor frame. The Tbus bus connected to the X-axis accelerometer passes through the second wire hole and splits into two strands. One strand is connected to the 15-pin plug through one of the wall grooves, and the other strand is connected to the 15-pin plug through the other wall groove. The 15-pin plug is fixed in the fourth mounting groove with screws. The 15-pin plug is used to connect to the lower instrument.

[0014] Furthermore, the probe frame also includes a power board frame. The left end of the power board frame is fitted with the acquisition board frame via a hole-shaft clearance. The power board frame and the acquisition board frame are fixedly connected by connecting screws. A 21-pin plug is fixedly installed at the right end of the power board frame, and a 21-pin socket is fixedly installed at the left end of the acquisition board frame. The 21-pin plug and the 21-pin socket are electrically connected via a plug-in connection. The 21-pin socket is electrically connected to the acquisition circuit board. A power circuit board is fixedly installed inside the power board frame and is electrically connected to the 21-pin plug. A first connector is fixedly connected to the left end of the power board frame. The first connector is electrically connected to the power circuit board and is also used to connect to an upper instrument.

[0015] Furthermore, the power board frame has a first side groove, and the acquisition board frame has a second side groove. Both the first and second side grooves are used for wiring harnesses. The power circuit board is encapsulated with colloid and then interference-fitted into the mounting groove of the power board frame. A third set of shock-absorbing O-rings is fitted on the power board frame to the left of the 21-pin plug, and a fourth set of shock-absorbing O-rings is fitted on the acquisition board frame to the right of the 21-pin socket. Both the third and fourth sets of shock-absorbing O-rings are used for sealing connection with the outer cylinder of the probe frame.

[0016] The present invention also provides a logging-while-drilling (LWD) instrument, which includes the magnetic measurement probe structure described in any one of the above-mentioned embodiments.

[0017] As can be seen from the above technical solution, the magnetic measurement probe structure and drilling directional logging instrument provided by the present invention have the following beneficial effects: The magnetic measurement probe structure of the present invention adopts a "7-axis" measurement mode, which can obtain more measurement parameters, thereby more accurately acquiring wellbore trajectory and instrument tool face attitude, thus providing more comprehensive and accurate data support for drilling-while-directed measurement. The power circuit board and the acquisition circuit board of the magnetic measurement probe structure of the present invention are both encapsulated with gray colloid. By controlling the width of the encapsulated part to be greater than the width of their respective mounting slots, the power circuit board and the acquisition circuit board are fixed, which has the advantages of being firmly and simply fixed. In addition, the encapsulated colloid can also play a role in shock absorption. The power board frame and the acquisition board frame of the magnetic measurement probe structure of the present invention are fixedly connected by connecting screws, which makes it easy to calibrate the components on the sensor frame and the acquisition board frame after the power board frame is removed. The sensor frame and the acquisition board frame also adopt threaded connection that is easy to disassemble and install, which makes it easy to replace the sensor frame or the acquisition board frame. The magnetic measurement probe structure of this invention, through the symmetrical arrangement of wall grooves, makes the Tbus bus almost perfectly symmetrically arranged on the sensor skeleton, thereby offsetting the induced magnetic field generated by the current to a certain extent and reducing the influence of the magnetic field on the measurement accuracy of the fluxgate sensor; and the arrangement of the fluxgate sensor, fluxgate processing circuit board and X-axis accelerometer saves wiring space and makes it easier to arrange the wire harness. Attached Figure Description

[0018] Figure 1 This is a front view of a magnetic measurement probe structure according to an embodiment of the present invention; Figure 2 This is a left view of a magnetic measurement probe structure according to an embodiment of the present invention; Figure 3 for Figure 1 Corresponding AA-direction sectional view; Figure 4 for Figure 1 Corresponding CC-direction sectional view; Figure 5 for Figure 1 The corresponding DD-direction sectional view; Figure 6 for Figure 1 Corresponding EE section view; Figure 7 for Figure 2 Corresponding BB-direction sectional view; Figure 8 This is a bottom view of a magnetic measurement probe structure according to an embodiment of the present invention; Figure 9 This is a top view of a magnetic measurement probe structure according to an embodiment of the present invention; Figure 10 for Figure 1 A magnified view of a section at point M; Figure 11 for Figure 10 The corresponding FF section view; Figure 12 for Figure 10 Corresponding GG-direction sectional view; Figure 13 for Figure 3 A magnified view of a portion of point N in the middle; Figure 14 This is a cross-sectional view of the acquisition board frame; Figure 15 This is a schematic diagram of the sensor skeleton. Detailed Implementation

[0019] To better understand the purpose, structure, and function of this invention, a magnetic measurement probe structure of this invention will be described in further detail below with reference to the accompanying drawings.

[0020] like Figure 1 , Figure 3 , Figure 7 As shown, it illustrates a magnetic measurement probe structure according to an embodiment of the present invention, including a probe frame, on which an X-axis accelerometer 9, a Y-axis accelerometer 8, a Z-axis accelerometer 6, a three-axis fluxgate sensor 12, and a single-axis MEMS gyroscope sensor 13 are fixedly mounted.

[0021] Specifically, in this embodiment of the invention, the probe frame is fixedly equipped with an X-axis accelerometer 9, a Y-axis accelerometer 8, a Z-axis accelerometer 6, a three-axis fluxgate sensor 12, and a single-axis MEMS gyroscope sensor 13. The X-axis accelerometer 9, Y-axis accelerometer 8, and Z-axis accelerometer 6 are used to measure the gravity components of the X, Y, and Z axes, respectively. Here, the X, Y, and Z axes are the three coordinate axes of a three-dimensional Cartesian coordinate system established according to the right-hand rule. The three-axis fluxgate sensor 12 is used to measure the magnetic components of each coordinate axis. The single-axis MEMS gyroscope sensor 13 is mainly used to measure the rotational speed of the drill pipe in situations where magnetic measurement is disturbed, such as in non-non-magnetic regions. Therefore, this embodiment of the invention adopts a "7-axis" measurement mode, which can obtain more measurement parameters, thereby more accurately acquiring wellbore trajectory and instrument tool face attitude, thus providing more comprehensive and accurate data support for drilling-while-directional measurement. The "non-non-zone" generally refers to several specific occasions when the well inclination is large, such as 0 degrees, 90 degrees, 180 degrees, 270 degrees, and 360 degrees. When drilling at these azimuths, magnetic measurements using fluxgate sensors are subject to interference, especially when measuring drill pipe rotation speed. This embodiment adopts a "7-axis" measurement mode including a single-axis MEMS gyroscope sensor 13, so that drill pipe rotation speed can be measured using the single-axis MEMS gyroscope sensor 13 in the non-non-zone. Thus, this embodiment can effectively solve the problem of inaccurate measurement caused by magnetic measurement interference.

[0022] Among them, such as Figure 3 , Figure 7 As shown, the Z-axis accelerometer 6, Y-axis accelerometer 8, X-axis accelerometer 9, triaxial fluxgate sensor 12, and single-axis MEMS gyroscope sensor 13 are sequentially fixed on the probe frame; the probe frame is also fixedly mounted with a data acquisition circuit board 5, and the Z-axis accelerometer 6 is fixedly mounted downstream of the data acquisition circuit board 5; the data acquisition circuit board 5 and the Z-axis accelerometer 6 are electrically connected, the Z-axis accelerometer 6 and the Y-axis accelerometer 8 are electrically connected, the Y-axis accelerometer 8 and the X-axis accelerometer 9 are electrically connected, the X-axis accelerometer 9 is electrically connected to the triaxial fluxgate sensor 12 and the single-axis MEMS gyroscope sensor 13 respectively, and the X-axis accelerometer 9 is also used to connect to the lower instrument via the Tbus bus.

[0023] Among them, such as Figure 2 As shown, a first set of damping O-rings is fitted onto the probe frame on the left side of the Z-axis accelerometer 6 and the probe frame on the right side of the X-axis accelerometer 9. These first set of damping O-rings are used for a sealed connection with the outer cylinder of the probe frame. Figure 13 As shown, the first damping O-ring group here includes a first damping O-ring 14 and a second damping O-ring 15. The diameter of the first damping O-ring 14 is larger than the diameter of the second damping O-ring 15. All the first damping O-rings 14 and the second damping O-rings 15 here are used for sealing connection with the outer cylinder of the probe frame.

[0024] Specifically, since the X-axis accelerometer 9, Y-axis accelerometer 8, and Z-axis accelerometer 6 used to measure the gravity component are more sensitive to downhole vibrations, the vibrations transmitted through the cylinder to the probe frame will have a significant impact on the measurements of the X-axis accelerometer 9, Y-axis accelerometer 8, and Z-axis accelerometer 6. In this embodiment, the first damping O-ring 14 and the second damping O-ring 15 serve to dampen vibrations, thereby reducing the impact of vibrations transmitted through the cylinder to the probe frame on the accelerometers. In specific implementation, for example, one first damping O-ring 14 and two second damping O-rings 15 are fitted on the probe frame to the left of the Z-axis accelerometer 6, and one first damping O-ring 14 and two second damping O-rings 15 are fitted on the probe frame to the right of the X-axis accelerometer 9.

[0025] Among them, such as Figure 1 , Figure 2 , Figure 14 As shown, the probe frame includes a sensor frame 3 and a data acquisition board frame 2. The right end of the data acquisition board frame 2 is provided with a first connecting part 26, and the left end of the sensor frame 3 is provided with a second connecting part. The first connecting part 26 and the second connecting part are threaded together. The data acquisition circuit board 5 and the Z-axis accelerometer 6 are fixedly mounted on the data acquisition board frame 2. The Y-axis accelerometer 8, the X-axis accelerometer 9, the three-axis fluxgate sensor 12, and the single-axis MEMS gyroscope sensor 13 are fixedly mounted on the sensor frame 3.

[0026] Specifically, the probe frame includes a sensor frame 3 and a data acquisition board frame 2. A Z-axis accelerometer 6 is fixedly mounted on the data acquisition board frame 2, while a Y-axis accelerometer 8, an X-axis accelerometer 9, a three-axis fluxgate sensor 12, and a single-axis MEMS gyroscope sensor 13 are fixedly mounted on the sensor frame 3. The data acquisition board frame 2 and the sensor frame 3 are connected by a threaded connection between a first connecting part 26 and a second connecting part, facilitating the disassembly of both frames and enabling individual calibration or replacement of components on each.

[0027] Regarding the connection between the acquisition circuit board 5 and the acquisition board frame 2: the acquisition circuit board 5 is encapsulated with a colloid and then interference-fitted into the mounting groove of the acquisition board frame 2. That is, the acquisition circuit board 5 is encapsulated with gray colloid, and the encapsulated structure is interference-fitted into the mounting groove of the acquisition board frame 2. The width of the encapsulated structure is 1-2mm larger than the width of the mounting groove of the acquisition board frame 2, thereby achieving interference fit and fixation between the two. In addition, the colloid encapsulating the acquisition circuit board 5 has a good shock absorption effect.

[0028] Regarding the fixing of X-axis accelerometer 9, Y-axis accelerometer 8, and Z-axis accelerometer 6: (e.g.) Figure 1 , Figure 10 , Figure 13 , Figure 14 , Figure 15 As shown, a limiting step 27 is provided inside the acquisition board frame 2. The left end of the Z-axis accelerometer 6 is limited by the limiting step 27, and the right end of the Z-axis accelerometer 6 is limited by the flange cover 7. The flange cover 7 is threadedly connected to the first connecting part 26. Two first mounting slots 311 with mutually perpendicular axes are provided on the sensor frame 3. The Y-axis accelerometer 8 is fixed in the first mounting slot 311 on the left by the first cover 10, and the X-axis accelerometer 9 is fixed in the first mounting slot 311 on the right by the other first cover 10. Each first cover 10 is fixedly connected to the sensor frame 3 by four fixing screws 21.

[0029] Specifically, the Z-axis accelerometer 6 is placed inside the acquisition plate frame 2. The left end of the Z-axis accelerometer 6 is limited by the limiting step 27 of the acquisition plate frame 2, and the right end of the Z-axis accelerometer 6 is fixed by the flange cover 7. The flange cover 7 is fixedly connected to the acquisition plate frame 2 at this location. Specifically, the first connecting part 26 at the right end of the acquisition plate frame 2 is threadedly connected to both the flange cover 7 and the second connecting part. Furthermore, regarding the Y-axis accelerometer 8 and X-axis accelerometer 9 on the sensor frame 3, both the Y-axis accelerometer 8 and the X-axis accelerometer 9 are installed in the first mounting slot 311 of the sensor frame 3 and are respectively fixed by the first cover 10. The first cover 10 is fixed to the sensor frame 3 by four M2.5×10 fixing screws 21.

[0030] For the electrical connection of the accelerometer: such as Figure 10 , Figure 11 As shown, the acquisition board frame 2 has a first wire hole 22. The acquisition circuit board 5 is electrically connected to the Z-axis accelerometer 6 through the wire harness passing through the first wire hole 22. The Z-axis accelerometer 6 is electrically connected to the Y-axis accelerometer 8 through the wire harness passing through the hole on the sensor frame 3. The sensor frame 3 has a groove 33. The Y-axis accelerometer 8 is electrically connected to the X-axis accelerometer 9 through the wire harness passing through the groove 33.

[0031] Specifically, the wiring harness extending from the acquisition circuit board 5 is connected to the Z-axis accelerometer 6 through the first wire hole 22 provided on the acquisition board frame 2. The wiring harness connected to the Z-axis accelerometer 6 is connected to the Y-axis accelerometer 8 through the hole opened on the sensor frame 3. The wiring harness extending from the Y-axis accelerometer 8 is electrically connected to the X-axis accelerometer 9 through the groove 33 provided on the sensor frame 3.

[0032] Regarding the electrical connections between the X-axis accelerometer 9, the triaxial fluxgate sensor 12, and the single-axis MEMS gyroscope sensor 13: (e.g.) Figure 12 , Figure 15As shown, the sensor frame 3 has a second wire hole 34 and a third wire hole 310. The X-axis accelerometer 9 is electrically connected to the triaxial fluxgate sensor 12 through a wire harness passing through the second wire hole 34. The X-axis accelerometer 9 is electrically connected to the single-axis MEMS gyroscope sensor 13 through a wire harness passing through the second wire hole 34 and the third wire hole 310 in sequence.

[0033] Specifically, the wiring harness extending from the X-axis accelerometer 9 connects to the fluxgate sensor 12 via a second wire-through hole 34 on the sensor frame 3; the wiring harness extending from the X-axis accelerometer 9 connects to the single-axis MEMS gyroscope sensor 13 via the second wire-through hole 34 and the third wire-through hole 310 on the sensor frame 3. Wherein, as... Figure 6 As shown, the sensor frame 3 is also provided with a wire storage groove 32, which is used to store excess wires. Specifically, the wires extending from the X-axis accelerometer 9 extend to the wire storage groove 32 through the second wire hole 34 and the third wire hole 310 opened on the sensor frame 3, and finally pass through the wire storage groove 32 to connect to the single-axis MEMS gyroscope sensor 13. The wires passing through the wire storage groove 32 can be fixed in the wire storage groove 32 with RTV3145 glue.

[0034] Regarding the second wire hole 34 on the sensor frame 3, such as Figure 12 As shown, its shape is n-shaped. The advantages of its n-shaped design are: it can have a larger cross-sectional area without damaging the pressure-bearing wall surface of the groove of the first damping O-ring 14 and the second damping O-ring 15 on the sensor frame 3, so as to accommodate more wire harnesses. It ensures that the pressure-bearing wall surface of the groove of the first damping O-ring 14 and the second damping O-ring 15 is not damaged, which is conducive to pressure-bearing and shock absorption, and protects the first damping O-ring 14 and the second damping O-ring 15 from being scratched.

[0035] Among them, such as Figure 7 , Figure 15 As shown, a fluxgate processing circuit board 11 is also fixed on the sensor frame 3. The X-axis accelerometer 9, the three-axis fluxgate sensor 12, and the fluxgate processing circuit board 11 are fixed on the same side of the sensor frame 3, and the single-axis MEMS gyroscope sensor 13 is set on the other side of the sensor frame 3. A circuit board groove 35 is provided on the sensor frame 3, and the fluxgate processing circuit board 11 is interference-fitted in the circuit board groove 35. A second mounting groove 36 and a third mounting groove 37 are provided on the sensor frame 3. The fluxgate sensor 12 is fixed in the second mounting groove 36 by a second pressure cover, and the single-axis MEMS gyroscope sensor 13 is fixed in the mounting groove 37 by a third pressure cover. The second pressure cover and the third pressure cover are respectively fixed on the sensor frame 3 by fixing screws 21.

[0036] Specifically, on the sensor frame 3, the fluxgate sensor 12 and the fluxgate processing circuit board 11 are connected to... XThe axial accelerometers 9 are arranged in the same direction, that is, on the same side of the sensor frame 3, while the single-axis MEMS gyroscope sensor 13 is arranged on the other side of the sensor frame 3, thus saving wiring space and making it easier to arrange the wiring harness. For the fluxgate processing circuit board 11, for example, it is set in the circuit board groove 35 by interference fit after being potted with glue. The glue setting here can also play a role in shock absorption. For the fluxgate sensor 12, it is fixed in the second mounting groove 36 by the second pressure cover; for the single-axis MEMS gyroscope sensor 13, it is fixed in the mounting groove 37 by the third pressure cover. The second pressure cover and the third pressure cover are respectively fixed to the sensor frame 3 by, for example, four M2.5×10 fixing screws 21.

[0037] Regarding the connection between the X-axis accelerometer 9 and the lower instrument: (e.g.) Figure 8 , Figure 15 As shown, the sensor skeletons 3 on both sides of the fluxgate processing circuit board 11 are provided with wall grooves 31. The lower end of the sensor skeleton 3 is provided with a fourth mounting groove. The Tbus bus connected to the X-axis accelerometer 9 passes through the second wire hole 34 and splits into two strands. One strand is connected to the 15-pin plug 17 through one of the wall grooves 31, and the other strand is connected to the 15-pin plug 17 through the other wall groove 31. The 15-pin plug 17 is fixed in the fourth mounting groove with screws. The 15-pin plug 17 is used to connect to the lower instrument.

[0038] Specifically, after extending from the X-axis accelerometer 9, the T-bus bus passes through the second wire hole 34 on the sensor frame 3 and splits into two identical strands. These two strands are connected to the 15-pin connector 17 via wall grooves 31 on both sides of the sensor frame 3. The 15-pin connector 17 is fixed in the fourth mounting slot of the sensor frame 3 by two screws. Furthermore, the advantage of splitting the T-bus bus into two identical strands arranged parallel to each other along the wall grooves 31 is that when the T-bus bus connects to a lower-level instrument with high power, the current flowing through the T-bus bus is generally large. This large current generates an induced magnetic field. Since the T-bus bus is very close to the fluxgate sensor 12, the induced magnetic field generated by the load current inevitably affects the measurement of the fluxgate sensor 12. However, this embodiment, through the design of the wall grooves 31 on both sides, makes the T-bus bus almost perfectly symmetrically arranged on the sensor frame 3, which can, to a certain extent, offset the induced magnetic field generated by the current. Combined with the developed compensation algorithm, the measurement accuracy of the fluxgate sensor 12 can be guaranteed.

[0039] Among them, such as Figure 3 , Figure 9As shown, the probe frame also includes a power board frame 1. The left ends of the power board frame 1 and the acquisition board frame 2 are fitted with a hole shaft clearance. The power board frame 1 and the acquisition board frame 2 are fixedly connected by connecting screws 20. A 21-pin plug 18 is fixedly installed on the right end of the power board frame 1, and a 21-pin socket 19 is fixedly installed on the left end of the acquisition board frame 2. The 21-pin plug 18 and the 21-pin socket 19 are electrically connected by a plug-in connection. The 21-pin socket 19 is electrically connected to the acquisition circuit board 5. A power circuit board 4 is fixedly installed inside the power board frame 1. The power circuit board 4 is electrically connected to the 21-pin plug 18. A first connector 16 is fixedly connected to the left end of the power board frame 1. The first connector 16 is electrically connected to the power circuit board 4 and is also used to connect to the upper instrument.

[0040] The probe frame of this invention includes a power board frame 1, a data acquisition board frame 2, and a sensor frame 3. The power board frame 1 and the data acquisition board frame 2 are connected at their left ends via a clearance fit, and are fixedly connected by, for example, eight M3×8 connecting screws 20. The data acquisition board frame 2 and the sensor frame 3 are threaded together. The fixed connection of the power board frame 1 and the data acquisition board frame 2 via connecting screws 20 has the following advantages: when calibrating the sensor accuracy, the power board frame 1 can be removed, leaving only the data acquisition board frame 2 and the sensor frame 3 and their corresponding installed structures. Calibration testing can then be performed, thus solving the problem of calibration and testing difficulties caused by excessive probe length.

[0041] Regarding the electrical connections between the three components: A first connector 16 is provided at the left end of the power board frame 1, which is electrically connected to the upper instrument and the power circuit board 4. A 21-pin plug 18 is fixedly provided at the right end of the power board frame 1, and the power circuit board 4 is electrically connected to the 21-pin plug 18. A 21-pin socket 19 is fixedly provided at the left end of the acquisition board frame 2. The 21-pin plug 18 and the 21-pin socket 19 are electrically connected via a connector. The 21-pin socket 19 is electrically connected to the acquisition circuit board 5 on the acquisition board frame 2. The acquisition circuit board 5 on the acquisition board frame 2 and the Z-axis... Accelerometer 6 is electrically connected to the Z-axis accelerometer 6 on the acquisition board frame 2 and the Y-axis accelerometer 8 on the sensor frame 3. The Y-axis accelerometer 8 on the sensor frame 3 is electrically connected to the X-axis accelerometer 9. The X-axis accelerometer 9 on the sensor frame 3 is electrically connected to the 15-pin connector 17. The X-axis accelerometer 9 is electrically connected to the three-axis fluxgate sensor 12 and the single-axis MEMS gyroscope sensor 13 respectively. The Tbus bus extends from the X-axis accelerometer 9 and is electrically connected to the 15-pin connector 17. The sensor frame 3 is connected to the lower instrument through the 15-pin connector 17 on it.

[0042] The power board frame 1 has a mounting slot. The power circuit board 4 is encapsulated with gray colloid and fixed to the mounting slot of the power board frame 1 by interference fit. Specifically, the overall width of the encapsulated material is 1-2mm wider than the mounting slot on the power board frame 1, thus fixing the encapsulated structure to the mounting slot by interference fit, and the colloid has good shock absorption effect. Furthermore, as... Figure 4 As shown, the power board frame 1 has a first side groove 101, such as... Figure 5 As shown, the acquisition plate frame 2 has a second side groove 201. Both the first side groove 101 and the second side groove 201 are used to lay wire harnesses. The wire harnesses in the first side groove 101 and the second side groove 201 are fixed by RTV3145 gel.

[0043] The power board frame 1 has a first side groove 101, and the acquisition board frame 2 has a second side groove 201. Both the first side groove 101 and the second side groove 201 are used for wiring harnesses. The power circuit board 4 is installed in the mounting groove of the power board frame 1 after being encapsulated with adhesive and then interference-fitted. Figure 2 As shown, a second set of shock-absorbing O-rings 153 is fitted onto the upper end of the power board frame 1; a third set of shock-absorbing O-rings 151 is fitted onto the power board frame 1 to the left of the 21-pin plug 18; a fourth set of shock-absorbing O-rings 152 is fitted onto the acquisition board frame 2 to the right of the 21-pin socket 19; and a fifth set of shock-absorbing O-rings 154 is fitted onto the lower end of the power circuit board 3. The second, third, fourth, and fifth sets of shock-absorbing O-rings 153, 151, 152, and 154 are all used for sealing connection with the outer cylinder of the probe frame. The inclusion of these sets improves the reliability of the connection.

[0044] Regarding the magnetic measurement probe structure of this embodiment: it adopts a "7-axis" measurement mode, which can obtain more measurement parameters, thereby more accurately acquiring wellbore trajectory and instrument tool face attitude, thus providing more comprehensive and accurate data support for drilling-while-directional measurement; both the power circuit board 3 and the acquisition circuit board 5 are encapsulated with gray colloid, and by controlling the width of the encapsulated part to be greater than the width of their respective mounting slots, the power circuit board 3 and the acquisition circuit board 5 are fixed, which has the advantages of firm and simple fixing, and the encapsulated colloid also plays a role in shock absorption; the power board frame 1 and the acquisition board frame 2 are fixedly connected by connecting screws 20, which facilitates the calibration of the components on the sensor frame 3 and the acquisition board frame 2 after the power board frame 1 is removed, and the sensor frame 3 and the acquisition board frame 2 also adopt threaded connections that are easy to disassemble and install. This facilitates the replacement of the sensor frame 3 or the acquisition board frame 2; the first and second shock-absorbing O-rings 14 and 15 serve to reduce vibration, thereby reducing the impact of vibration transmitted through the cylinder to the probe frame on the accelerometer; the design of the n-shaped second wire hole 34 provides a larger channel area for the wire harness, allowing more wire harnesses to pass through while protecting the first and second shock-absorbing O-rings 14 and 15 from being scratched by the wire harnesses; the symmetrical wall grooves 31 ensure that the Tbus bus is arranged almost symmetrically on the sensor frame 3, thereby offsetting the induced magnetic field generated by the current to a certain extent and reducing the impact of the magnetic field on the measurement accuracy of the fluxgate sensor 12; and the arrangement of the fluxgate sensor 12, the fluxgate processing circuit board 11, and the X-axis accelerometer 9 saves wiring space and makes it easier to arrange the wire harnesses.

[0045] Furthermore, this invention also provides a logging-while-drilling (LWD) instrument, which includes the magnetic measurement probe structure of any of the above embodiments.

[0046] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application should have the ordinary meaning as understood by one of ordinary skill in the art to which this invention pertains.

[0047] Furthermore, the terms "a," "two," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly defined.

[0048] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and specification of the present invention. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A magnetic measuring probe structure, characterized in that, The device includes a probe frame, on which are fixedly mounted a Z-axis accelerometer (6), a Y-axis accelerometer (8), an X-axis accelerometer (9), a three-axis fluxgate sensor (12), and a single-axis MEMS gyroscope sensor (13).

2. The magnetic measuring probe structure according to claim 1, characterized in that, The Z-axis accelerometer (6), Y-axis accelerometer (8), X-axis accelerometer (9), three-axis fluxgate sensor (12), and single-axis MEMS gyroscope sensor (13) are sequentially fixed on the probe frame; a data acquisition circuit board (5) is also fixed on the probe frame, and the Z-axis accelerometer (6) is fixed downstream of the data acquisition circuit board (5); the data acquisition circuit board (5) and the Z-axis accelerometer (6) are electrically connected, the Z-axis accelerometer (6) and the Y-axis accelerometer (8) are electrically connected, the Y-axis accelerometer (8) and the X-axis accelerometer (9) are electrically connected, the X-axis accelerometer (9) is electrically connected to the three-axis fluxgate sensor (12) and the single-axis MEMS gyroscope sensor (13) respectively, and the X-axis accelerometer (9) is also used to connect to the lower instrument via the Tbus bus.

3. The magnetic measuring probe structure according to claim 2, characterized in that, A first damping O-ring assembly is fitted on the probe frame to the left of the Z-axis accelerometer (6) and on the probe frame to the right of the X-axis accelerometer (9). The first damping O-ring assembly is used to seal and connect with the outer cylinder of the probe frame.

4. The magnetic measuring probe structure according to claim 2, characterized in that, The probe frame includes a sensor frame (3) and a data acquisition board frame (2). The right end of the data acquisition board frame (2) is provided with a first connecting part (26), and the left end of the sensor frame (3) is provided with a second connecting part. The first connecting part (26) and the second connecting part are threaded together. The data acquisition circuit board (5) and the Z-axis accelerometer (6) are fixedly mounted on the data acquisition board frame (2). The Y-axis accelerometer (8), the X-axis accelerometer (9), the three-axis fluxgate sensor (12), and the single-axis MEMS gyroscope sensor (13) are fixedly mounted on the sensor frame (3).

5. The magnetic measuring probe structure according to claim 4, characterized in that, The acquisition circuit board (5) is encapsulated with colloid and then interference-fitted into the mounting groove of the acquisition board frame (2). The acquisition board frame (2) is provided with a limiting step (27). The left end of the Z-axis accelerometer (6) is limited by the limiting step (27), and the right end of the Z-axis accelerometer (6) is limited by the flange cover (7). The flange cover (7) is threadedly connected to the first connecting part (26). The sensor frame (3) has two first mounting grooves (311) with mutually perpendicular axes. The Y-axis accelerometer (8) is fixed in the first mounting groove (311) on the left side by the first cover (10), and the X-axis accelerometer (9) is fixed in the first mounting groove (311) on the right side by the other first cover (10). Each first cover (10) is fixedly connected to the sensor frame (3) by four fixing screws (21).

6. The magnetic measuring probe structure according to claim 4, characterized in that, The acquisition board frame (2) has a first wire hole (22). The acquisition circuit board (5) is electrically connected to the Z-axis accelerometer (6) through a wire harness passing through the first wire hole (22). The Z-axis accelerometer (6) is electrically connected to the Y-axis accelerometer (8) through a wire harness passing through a hole on the sensor frame (3). The sensor frame (3) has a groove (33). The Y-axis accelerometer (8) is electrically connected to the X-axis accelerometer (9) through a wire harness passing through the groove (33).

7. The magnetic measuring probe structure according to claim 4, characterized in that, The sensor frame (3) is provided with a second wire hole (34) and a third wire hole (310). The X-axis accelerometer (9) is electrically connected to the triaxial fluxgate sensor (12) through a wire harness passing through the second wire hole (34). The X-axis accelerometer (9) is electrically connected to the single-axis MEMS gyroscope sensor (13) through a wire harness passing through the second wire hole (34) and the third wire hole (310) in sequence. The sensor frame (3) is also provided with a wire storage groove (32) for storing excess wire harnesses. The second wire hole (34) is n-shaped.

8. The magnetic measuring probe structure according to claim 7, characterized in that, A fluxgate processing circuit board (11) is also fixed on the sensor frame (3). The X-axis accelerometer (9), the three-axis fluxgate sensor (12) and the fluxgate processing circuit board (11) are fixed on the same side of the sensor frame (3). The single-axis MEMS gyroscope sensor (13) is set on the other side of the sensor frame (3). A circuit board groove (35) is provided on the sensor frame (3). The fluxgate processing circuit board (11) is set in the circuit board groove (35) by interference fit. A second mounting groove (36) and a third mounting groove (37) are opened on the sensor frame (3). The fluxgate sensor (12) is fixed in the second mounting groove (36) by the second pressure cover. The single-axis MEMS gyroscope sensor (13) is fixed in the mounting groove (37) by the third pressure cover. The second pressure cover and the third pressure cover are respectively fixed on the sensor frame (3) by fixing screws (21).

9. The magnetic measuring probe structure according to claim 8, characterized in that, Wall grooves (31) are provided on both sides of the sensor frame (3) of the fluxgate processing circuit board (11). A fourth mounting groove is provided at the lower end of the sensor frame (3). The Tbus bus connected to the X-axis accelerometer (9) passes through the second wire hole (34) and splits into two strands. One strand is connected to the 15-pin plug (17) through one of the wall grooves (31), and the other strand is connected to the 15-pin plug (17) through the other wall groove (31). The 15-pin plug (17) is fixed in the fourth mounting groove by screws. The 15-pin plug (17) is used to connect to the lower instrument.

10. The magnetic measuring probe structure according to claim 4, characterized in that, The probe frame also includes a power board frame (1). The power board frame (1) and the left end of the acquisition board frame (2) are fitted with a hole shaft clearance. The power board frame (1) and the acquisition board frame (2) are fixedly connected by connecting screws (20). A 21-pin plug (18) is fixedly provided on the right end of the power board frame (1). A 21-pin socket (19) is fixedly provided on the left end of the acquisition board frame (2). The 21-pin plug (18) and the 21-pin socket (19) are electrically connected by plugging. The 21-pin socket (19) is electrically connected to the acquisition circuit board (5). A power circuit board (4) is fixedly provided inside the power board frame (1). The power circuit board (4) is electrically connected to the 21-pin plug (18). A first connector (16) is fixedly connected to the left end of the power board frame (1). The first connector (16) is electrically connected to the power circuit board (4). The first connector (16) is also used to connect to the upper instrument.

11. The magnetic measuring probe structure according to claim 10, characterized in that, The power board frame (1) has a first side groove (101), and the acquisition board frame (2) has a second side groove (201). Both the first side groove (101) and the second side groove (201) are used for wiring harnesses. The power circuit board (4) is installed in the mounting groove of the power board frame (1) after being encapsulated with colloid. The upper end of the power board frame (1) is also fitted with a second shock-absorbing O-ring group (153). The power circuit board (4) is located on the left side of the 21-pin plug (18). The plate frame (1) is fitted with a third shock-absorbing O-ring group (151), the acquisition plate frame (2) on the right side of the 21-pin socket (19) is fitted with a fourth shock-absorbing O-ring group (152), and the lower end of the power circuit board (3) is fitted with a fifth shock-absorbing O-ring group (154). The second shock-absorbing O-ring group (153), the third shock-absorbing O-ring group (151), the fourth shock-absorbing O-ring group (152) and the fifth shock-absorbing O-ring group (154) are all used to seal and connect with the outer cylinder of the probe frame.

12. A logging-while-drilling directional logging instrument, characterized in that, The magnetic measurement probe structure includes any one of claims 1-11.

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