SOC chip temperature protection method and system in intelligent driving field

Abstract

The invention provides a temperature protection method and system in the field of intelligent driving, relates to the technical field of vehicle intelligent driving control, and solves the technical problems that an existing intelligent driving SOC chip is single in over-temperature protection strategy and is not combined with a driving scene, so that the chip is frequently over-heated, the service life is shortened, and the driving experience is affected. The method comprises the following steps: acquiring a current vehicle driving scene, wherein the driving scene comprises a vehicle driving preparation scene, a driving scene and a driving scene; and based on the current vehicle driving scene, the temperature of the SOC chip is controlled according to different preset rules. According to the method, hardware does not need to be newly added, meaningless heat production of the SOC chip is reduced through a scenarized power control strategy, the over-temperature fault occurrence rate is reduced, the service life of the chip is prolonged, and meanwhile the operation safety and driving experience of the intelligent driving system are guaranteed.

Description

Technical Field

[0001] This invention relates to the field of vehicle intelligent driving control technology, and in particular to a method for protecting the temperature of a SOC chip in the field of intelligent driving. Background Technology

[0002] In the field of intelligent driving, environmental perception elements are integrated into the hardware of the intelligent driving forward-facing camera mounted above the vehicle's windshield. Among these, the SOC chip is the core component for realizing environmental perception. This SOC chip is a high-power chip, and it is highly susceptible to overheating under prolonged use of the intelligent driving system and when the vehicle is exposed to high temperatures and direct sunlight.

[0003] The current industry strategy for over-temperature protection of SOC chips is to set a fixed over-temperature threshold (approximately 123°C), simply monitor the temperature of the SOC chip, and when the chip temperature reaches this threshold, the MCU chip directly performs a forced power-down operation on the SOC chip, while the vehicle's instrument panel illuminates the relevant fault lights for the intelligent driving system.

[0004] The existing technology has obvious technical defects: First, it does not formulate differentiated protection strategies based on the actual driving scenarios of the vehicle. For example, when the vehicle is in P gear and the intelligent driving function is not in use, the SOC chip still continues to operate and generate heat, causing the chip to frequently reach the over-temperature threshold and resulting in a high over-temperature failure rate. Second, a sudden power-off of the SOC chip will cause a direct loss of intelligent driving environment perception information. If the vehicle is in motion, this will affect driving safety, and the frequent illumination of the malfunction indicator lamp will interfere with the driver's judgment and reduce the driving experience. Third, the single power-off strategy does not consider the gradual cooling requirements of the chip, and repeated sudden cooling and heating will shorten the lifespan of the SOC chip.

[0005] Therefore, there is an urgent need for a method that combines actual vehicle driving scenarios to achieve refined temperature protection of SOC chips, reducing unnecessary heat generation by chips and lowering the over-temperature failure rate without adding new hardware, while ensuring the operational safety of intelligent driving systems. Summary of the Invention

[0006] This invention aims to solve at least one of the technical problems existing in the prior art, and proposes a method and system for temperature protection of SOC chips in the field of intelligent driving.

[0007] In a first aspect, embodiments of the present invention provide a method for temperature protection of a SOC chip in the field of intelligent driving, comprising:

[0008] Obtain the current vehicle driving scenario, which includes the vehicle preparation driving scenario, the driving scenario, and;

[0009] Based on the current vehicle driving scenario, the temperature of the SOC chip is controlled according to different preset rules.

[0010] Furthermore, if the current vehicle driving scenario is a vehicle preparing to drive scenario, the methods for controlling the SOC chip temperature include:

[0011] After the vehicle is powered on, the MCU chip monitors its own temperature in real time to obtain the MCU chip temperature.

[0012] The system determines whether the MCU chip temperature is lower than a preset first temperature threshold. If the MCU chip temperature is lower than the preset first temperature threshold, the MCU chip will not activate the SOC chip, and will record the fault code generated by the failure to activate the SOC chip, and will not trigger the fault light display on the vehicle instrument panel. If the MCU chip temperature is not lower than the preset first temperature threshold, the MCU chip will normally activate the SOC chip, enabling the SOC chip to operate and realize intelligent driving environment perception.

[0013] Continuously monitor the temperature change of the MCU chip. When the temperature of the MCU chip rises from below the first temperature threshold to above or equal to the first temperature threshold, determine whether to activate the SOC chip based on the usage requirements of the intelligent driving function.

[0014] Furthermore, if the current vehicle driving scenario is a scenario where the vehicle has completed its journey, the methods for controlling the SOC chip temperature include:

[0015] Monitor vehicle gear shifting signals. When the vehicle gear is detected to shift from D or R to P or N, start a timer and monitor the MCU chip temperature in real time.

[0016] Determine whether the P or N gear holding time exceeds a preset time threshold and whether the MCU chip temperature reaches a preset second temperature threshold. If it does, the MCU chip will power down the SOC chip and record the fault code generated by the power-down SOC chip, without triggering the vehicle instrument panel fault light display. If it does not reach the threshold, the SOC chip will continue to operate normally.

[0017] The system continuously monitors gear changes and MCU chip temperature. When it detects that the gear has switched back from P or N to D or R, or when the MCU chip temperature is lower than the preset third temperature threshold, the MCU chip will restart the SOC chip.

[0018] Furthermore, if the current vehicle driving scenario is a vehicle driving scenario, the methods for controlling the SOC chip temperature include:

[0019] Real-time monitoring of SOC chip temperature to determine if it has reached the preset over-temperature threshold;

[0020] If the SOC chip temperature reaches the over-temperature threshold, the MCU chip will power down the SOC chip, and at the same time, a cooling prompt message will pop up on the vehicle instrument panel or central control screen, and the intelligent driving assistance function will be downgraded, and the fault code generated by the SOC chip due to power-down will be recorded.

[0021] After the SOC chip is powered down, the power-down duration and MCU chip temperature are continuously monitored. If the power-down duration exceeds the preset power-down time threshold, or the MCU chip temperature is less than or equal to the preset fourth temperature threshold, the MCU chip will restart the SOC chip.

[0022] Furthermore, the first temperature threshold is 70°C, and the first temperature threshold can be flexibly adjusted according to the climate conditions of the area where the vehicle is used and the actual test temperature.

[0023] Furthermore, the preset time threshold is 5 minutes, the second temperature threshold is the temperature value of the MCU chip corresponding to the hot state of the SOC chip, and the third temperature threshold is 80°C.

[0024] Furthermore, the over-temperature threshold is 123°C, the preset power-off time threshold is 20 minutes, and the fourth temperature threshold is 90°C.

[0025] Furthermore, the intelligent driving assistance function downgrade processing includes downgrading the adaptive cruise function to the cruise control function, or temporarily disabling functions that rely heavily on real-time environmental perception information, such as automatic emergency braking.

[0026] Secondly, this invention also discloses a SOC chip temperature protection system in the field of intelligent driving, comprising: a driving scenario determination unit and an SOC chip temperature control unit; wherein:

[0027] A driving scenario determination unit is used to obtain the current vehicle driving scenario, which includes a vehicle preparation driving scenario, a driving scenario, and a driving scenario;

[0028] The SOC chip temperature control unit is used to control the SOC chip temperature according to different preset rules based on the current vehicle driving scenario.

[0029] Thirdly, the present invention also discloses an electronic device, comprising:

[0030] One or more processors;

[0031] Memory, used to store one or more programs;

[0032] When the one or more programs are executed by the one or more processors, the one or more processors implement the temperature protection method.

[0033] This invention provides a temperature protection method and system for intelligent driving, solving the technical problems of existing intelligent driving SOC chips' single over-temperature protection strategy, lack of consideration for driving scenarios leading to frequent chip over-temperature, shortened lifespan, and impact on driving experience. The method includes acquiring the current vehicle driving scenario, including a vehicle preparation driving scenario, a driving scenario, and a driving scenario; and controlling the SOC chip temperature according to different preset rules based on the current vehicle driving scenario. This invention requires no additional hardware, reduces meaningless heat generation by the SOC chip through scenario-based power control strategies, lowers the over-temperature failure rate, extends chip lifespan, and simultaneously ensures the operational safety and driving experience of the intelligent driving system.

[0034] Compared with the prior art, the present invention has the following advantages:

[0035] 1. Scenario-based and refined control significantly reduces the incidence of over-temperature failures: This invention is the first to combine the temperature protection of SOC chips with actual vehicle driving scenarios, and formulates differentiated power control strategies for three scenarios: initial power-on, gear shifting, and continuous operation in D gear. This reduces the heat generated by the SOC chip from meaningless operation at the source, avoids heat accumulation, effectively reduces the number of times the chip reaches the over-temperature threshold, and fundamentally solves the problem of frequent chip over-temperature.

[0036] 2. Ensure driving safety and enhance driving experience: For overheating scenarios when driving in D mode, a linkage operation between function downgrading and driver prompts is set up to avoid the loss of environmental perception information caused by sudden power failure of the SOC chip, thus ensuring basic driving safety of the vehicle; at the same time, fault codes are processed in a "record only, do not display" manner in various scenarios to prevent the fault light from frequently illuminating and interfering with the driver's judgment, thereby improving the driving experience.

[0037] 3. Low cost, easy to implement, and highly versatile: This invention requires no additional hardware equipment and can be implemented simply by optimizing the logic algorithm of the vehicle control software, which greatly saves R&D and manufacturing costs; moreover, this strategy is applicable to all models equipped with intelligent driving forward-looking cameras and can be modularly matched and operated with various sensor models, making it convenient for automakers to extend the functionality and expand the model range. Attached Figure Description

[0038] Figure 1 A schematic flowchart illustrating a temperature protection method in the field of intelligent driving provided by an embodiment of the present invention;

[0039] Figure 2 A flowchart illustrating the vehicle's temperature protection method for a driving scenario provided in an embodiment of the present invention;

[0040] Figure 3 This is a flowchart illustrating the vehicle temperature protection method for driving scenarios provided in an embodiment of the present invention.

[0041] Figure 4 This is a flowchart illustrating the vehicle driving scenario temperature protection method provided in an embodiment of the present invention.

[0042] Figure 5 A structural block diagram of a temperature protection system in the field of intelligent driving provided by an embodiment of the present invention;

[0043] Figure 6 This is a structural block diagram of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0044] To enable those skilled in the art to better understand the technical solutions of the present invention, exemplary embodiments of the present invention are described below in conjunction with the accompanying drawings, including various details of the embodiments of the present invention to aid understanding. These should be considered merely exemplary. Therefore, those skilled in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present invention. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0045] Where there is no conflict, the various embodiments of the present invention and the features thereof may be combined with each other.

[0046] As used herein, the term “and / or” includes any and all combinations of one or more related enumerated entries.

[0047] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used herein, the singular forms “a” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that when the terms “comprising” and / or “made of” are used in this specification, the presence of the stated feature, integral, step, operation, element, and / or component is specified, but the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof is not excluded. Terms such as “connected” or “linked” are not limited to physical or mechanical connections but can include electrical connections, whether direct or indirect.

[0048] Unless otherwise specified, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms such as those defined in commonly used dictionaries should be interpreted as having the meaning consistent with their meaning in the context of the relevant art and the invention, and will not be interpreted as having an idealized or overly formal meaning unless expressly so defined herein.

[0049] In the technical solution of this invention, the collection, storage, use, processing, transmission, provision, and disclosure of user personal information all comply with relevant laws and regulations and do not violate public order and good morals. The use of user data in this technical solution follows relevant national laws and regulations (e.g., the "Information Security Technology - Personal Information Security Specification"). For example: appropriate measures are taken for personal information access control; restrictions are imposed on the display of personal information; the purpose of using personal information does not exceed the scope of direct or reasonable association; and explicit identity targeting is eliminated when using personal information to avoid precisely locating a specific individual.

[0050] To address at least one of the technical problems existing in the aforementioned related technologies, the present invention provides a method and system for protecting the temperature of a SOC chip in the field of intelligent driving.

[0051] This embodiment discloses a method for temperature protection of SOC chips in the field of intelligent driving, such as Figure 1 ,include:

[0052] S100. Obtain the current vehicle driving scenario, which includes a vehicle preparation driving scenario, a driving scenario, and a driving scenario; specifically, the vehicle driving scenario is obtained through the vehicle gear signal and the power-on signal; for example, when the vehicle power-on signal is received but the vehicle gear signal is not received, it is determined that the current vehicle scenario is the vehicle preparation driving scenario; when the vehicle gear signal is received and it is always in D gear, it is determined that the vehicle is in the driving scenario; if the vehicle gear is switched from D gear or R gear to P gear or N gear, it is determined that the vehicle is in the driving completion scenario.

[0053] S200. Based on the current vehicle driving scenario, control the SOC chip temperature according to different preset rules.

[0054] In the initial power-on scenario of a vehicle, most electric vehicles on the market can remotely control the vehicle's air conditioning. To reduce the heat generated by the SOC (System-on-a-Chip) during the driver's wait for the air conditioning to cool down, especially when the vehicle is exposed to direct sunlight with closed windows and no intelligent driving assistance functions are in use, based on local August temperature statistics, the controller temperature after being exposed to direct sunlight for about 10 am on a sunny day is below 80℃. Therefore, a strategy was developed to prevent the SOC from starting up and generating heat when the MCU temperature is below 70℃. This temperature can be adjusted based on the test temperature. To solve the above problems, this invention has developed a set of overall operating strategies for the SOC chip in the initial power-on scenario of a vehicle. The specific strategy is as follows: 1. Temperature threshold setting: After extensive experimental testing and data analysis, it was determined that when the MCU temperature is below 70℃, the SOC chip will not start up, preventing it from operating and thus avoiding heat generation. It should be noted that this 70℃ temperature threshold is not fixed but can be flexibly adjusted according to different regional climate conditions, vehicle usage environment, and actual test temperature. For example, in cooler climates or when vehicles are parked in the shade, the temperature threshold can be appropriately lowered; while in hot climates or after prolonged exposure to sunlight, the threshold may need to be appropriately increased to ensure the rationality and effectiveness of the strategy. 2. Fault Code Recording and Handling: When the MCU fails to activate the SOC chip, the system may generate corresponding fault codes due to the SOC chip not being operational. To avoid unnecessary interference and panic for the driver, this invention records these fault codes generated by the MCU failing to activate the SOC, but does not illuminate the instrument panel display for such fault codes. This ensures that the system can accurately record relevant status information for subsequent fault diagnosis and analysis, without affecting the driver's normal driving and judgment of the vehicle's status.

[0055] In this embodiment, as Figure 2 If the current vehicle driving scenario is a vehicle preparing to drive scenario, the methods for controlling the SOC chip temperature include:

[0056] After the vehicle is powered on, the MCU chip monitors its own temperature in real time to obtain the MCU chip temperature.

[0057] The system determines whether the MCU chip temperature is lower than a preset first temperature threshold. If the MCU chip temperature is lower than the preset first temperature threshold, the MCU chip will not activate the SOC chip, and a fault code generated due to the failure to activate the SOC chip will be recorded, and the fault light on the vehicle's instrument panel will not be triggered. If the MCU chip temperature is not lower than the preset first temperature threshold, the MCU chip will normally activate the SOC chip, enabling the SOC chip to operate and achieve intelligent driving environment perception. The first temperature threshold is 70°C, and the first temperature threshold can be flexibly adjusted according to the climate conditions of the region where the vehicle is used and the actual test temperature.

[0058] Continuously monitor the temperature change of the MCU chip. When the temperature of the MCU chip rises from below the first temperature threshold to above or equal to the first temperature threshold, determine whether to activate the SOC chip based on the usage requirements of the intelligent driving function.

[0059] This embodiment describes the SOC chip temperature protection control during the initial power-on scenario of a vehicle. The vehicle is parked in a high-temperature, direct sunlight environment, and the driver remotely turns on the vehicle's air conditioning. There is no need to use intelligent driving functions. The specific implementation steps are as follows:

[0060] The driver remotely controls the vehicle to power on via a mobile app. The vehicle enters the initialization phase, and the body control module triggers the MCU chip to perform a self-test. The MCU chip detects its own temperature as 65°C through the temperature detection module.

[0061] The body control module determines that the MCU chip temperature is 65℃, which is lower than the first temperature threshold of 70℃. It instructs the MCU chip not to pull up the SOC chip to avoid the SOC chip generating heat during operation. At the same time, the vehicle fault code recording module records the "SOC chip not pulled up" fault code, and the body control module does not trigger the instrument fault light display.

[0062] After the vehicle's air conditioning has been running for 30 minutes, the temperature of the MCU chip rises to 72°C. The body control module continues to monitor that the driver still has no need to use the intelligent driving function, and continues to keep the SOC chip powered down. Until the driver unlocks the vehicle and activates the intelligent driving function, the body control module instructs the MCU chip to immediately power up the SOC chip, and the chip enters normal operation.

[0063] In scenarios where the vehicle has completed its journey—that is, shifting from D (Drive) or R (Reverse) to P (Park) or N (Neutral)—drivers frequently encounter situations where they need to briefly stop while driving in D or R (Drive or Reverse). Examples include refueling at a gas station, waiting at a traffic light, or searching for a parking space. In these scenarios, although the vehicle is in D or R, its actual speed is low or it is stationary, and intelligent driving assistance functions are typically not required.

[0064] However, when the vehicle is in Drive (D) or Reverse (R) gear, the MCU activates the System-on-Chips (SOC) chip, keeping it running to maintain the intelligent driving system's standby status. This causes the SOC chip to continuously generate heat even during short periods of vehicle parking, with the chip temperature gradually increasing over time. If the driver continues to maintain Park (P) or Neutral (N) gear for an extended period after a short parking period, the heat generated by the SOC chip will accumulate, increasing the likelihood of the chip reaching its over-temperature threshold, thus affecting the chip's performance and lifespan.

[0065] In this embodiment, as Figure 3 If the current vehicle driving scenario is a scenario where the vehicle has completed its journey, the methods for controlling the SOC chip temperature include:

[0066] Monitor vehicle gear shifting signals. When the vehicle gear is detected to shift from D or R to P or N, start a timer and monitor the MCU chip temperature in real time.

[0067] The system determines whether the duration of the P or N gear setting exceeds a preset time threshold and whether the MCU chip temperature reaches a preset second temperature threshold. If the threshold is reached, the MCU chip powers down the SOC chip, records the fault code generated by the SOC chip during the power-down, and does not trigger the fault light display on the vehicle's instrument panel. If the threshold is not reached, the SOC chip continues to operate normally. The preset time threshold is 5 minutes, the second temperature threshold is the MCU chip temperature value corresponding to the relatively hot state of the SOC chip, and the third temperature threshold is 80°C.

[0068] The system continuously monitors gear changes and MCU chip temperature. When it detects that the gear has switched back from P or N to D or R, or when the MCU chip temperature is lower than the preset third temperature threshold, the MCU chip will restart the SOC chip.

[0069] This embodiment describes the SOC chip temperature protection control for a vehicle switching from D to P gear. The driver is refueling at a gas station, and the vehicle is briefly parked. The specific implementation steps are as follows:

[0070] The vehicle was originally in D gear and driving normally, and the SOC chip was operating normally. After the driver entered the gas station, he switched the gear from D gear to P gear. The gear detection module transmitted the switching signal to the body control module, the body control module started the timer, and at the same time detected that the temperature of the MCU chip was 85℃.

[0071] The driver spent 8 minutes refueling. The vehicle control module determined that the P gear was maintained for 8 minutes, which exceeded the time threshold of 5 minutes. The MCU chip temperature reached 85℃, which is the second temperature threshold (the value corresponding to the hot state of the SOC chip). The module instructed the MCU chip to perform a power-down operation on the SOC chip. At the same time, the "SOC chip actively power-down" fault code was recorded, and the instrument fault light was not triggered.

[0072] After the driver finishes refueling, they shift the gear from P to D. The gear detection module transmits a signal to the body control module, which instructs the MCU chip to immediately restart the SOC chip, restoring normal operation and enabling environmental perception.

[0073] In vehicle driving scenarios, specifically when the vehicle is in Drive (D) mode, the intelligent driving assistance system is highly active when the vehicle is in D mode for an extended period. The System-on-Chips (SoC) chip needs to continuously process data from various sensors to perceive and control the vehicle's surroundings. During this process, the SoC chip operates at high speed continuously, generating a significant amount of heat. As the operating time increases, the SoC chip's temperature gradually rises. If over-temperature thresholds are not addressed promptly, it will severely impact the chip's performance and lifespan, potentially even causing chip damage and affecting the normal operation of the entire intelligent driving system.

[0074] In this embodiment, as Figure 4 If the current vehicle driving scenario is a vehicle driving scenario, the methods for controlling the SOC chip temperature include:

[0075] Real-time monitoring of SOC chip temperature to determine if it has reached the preset over-temperature threshold;

[0076] If the SOC chip temperature reaches the over-temperature threshold, the MCU chip will power down the SOC chip and simultaneously display a cooling prompt message on the vehicle's instrument panel or central control screen. The intelligent driving assistance function will be downgraded, and the fault code generated by the SOC chip due to power-down will be recorded. The intelligent driving assistance function downgrade includes downgrading the adaptive cruise function to the cruise control function, or temporarily disabling functions that rely heavily on real-time environmental perception information, such as automatic emergency braking.

[0077] After the SOC chip is powered down, the power-down duration and MCU chip temperature are continuously monitored. If the power-down duration exceeds a preset power-down time threshold, or the MCU chip temperature is less than or equal to a preset fourth temperature threshold, the MCU chip will restart the SOC chip. The over-temperature threshold is 123°C, the preset power-down time threshold is 20 minutes, and the fourth temperature threshold is 90°C.

[0078] This embodiment describes the SOC chip temperature protection control for a vehicle continuously operating in D mode. When the vehicle is traveling at high speed in hot weather, the SOC chip operates under high load and generates heat. The specific implementation steps are as follows:

[0079] When the vehicle is in D gear and driving at high speed for 1 hour, the temperature detection module detects in real time that the SOC chip temperature has risen to 123°C, reaching the over-temperature threshold, and transmits the temperature signal to the body control module.

[0080] The vehicle control module instructs the MCU chip to power down the SOC chip, and at the same time displays a prompt message on the vehicle instrument panel: "Intelligent driving SOC chip overheating, power-down operation has been performed, please turn on the air conditioning to cool down the controller"; and downgrades the adaptive cruise function to cruise control function, disables the automatic emergency braking function, and records the "SOC chip overheating power-down" fault code.

[0081] After the SOC chip is powered down, the driver turns on the vehicle's air conditioning to cool down the controller. The body control module continuously monitors the power-down duration and the MCU chip temperature. After 15 minutes of power-down, the MCU chip temperature drops to 90°C, reaching the fourth temperature threshold. The body control module then instructs the MCU chip to restart the SOC chip, and the chip resumes operation. The intelligent driving assistance function is simultaneously restored to normal.

[0082] This embodiment provides a temperature protection method and system for intelligent driving, addressing the technical problems of existing intelligent driving SOC chips' single over-temperature protection strategy, lack of consideration for driving scenarios leading to frequent chip over-temperature, shortened lifespan, and impact on driving experience. The method includes acquiring the current vehicle driving scenario, including a vehicle preparation driving scenario, a driving scenario, and a driving scenario; based on the current vehicle driving scenario, controlling the SOC chip temperature according to different preset rules. This invention requires no additional hardware, reduces meaningless heat generation by the SOC chip through scenario-based power control strategies, lowers the over-temperature failure rate, extends chip lifespan, and simultaneously ensures the operational safety and driving experience of the intelligent driving system.

[0083] Based on the same inventive concept, embodiments of the present invention also provide a SOC chip temperature protection system in the field of intelligent driving, such as... Figure 5 It includes: a driving scenario determination unit and a SOC chip temperature control unit; wherein:

[0084] A driving scenario determination unit is used to obtain the current vehicle driving scenario, which includes a vehicle preparation driving scenario, a driving scenario, and a driving scenario;

[0085] The SOC chip temperature control unit is used to control the SOC chip temperature according to different preset rules based on the current vehicle driving scenario.

[0086] The specific working methods of the driving scenario determination unit and the SOC chip temperature control unit have been described in detail in the above-mentioned SOC chip temperature protection method, and will not be repeated here in this embodiment.

[0087] Based on the same inventive concept, embodiments of the present invention also provide an electronic device. Figure 6 This is a structural block diagram of an electronic device provided in an embodiment of the present invention. Figure 6As shown, an embodiment of the present invention provides an electronic device including: one or more processors 101, a memory 102, and one or more I / O interfaces 103. The memory 102 stores one or more programs, which, when executed by the one or more processors, cause the one or more processors to implement any of the temperature protection methods described in the above embodiments; the one or more I / O interfaces 103 are connected between the processor and the memory, configured to enable information interaction between the processor and the memory.

[0088] The processor 101 is a device with data processing capabilities, including but not limited to a central processing unit (CPU); the memory 102 is a device with data storage capabilities, including but not limited to random access memory (RAM, more specifically SDRAM, DDR, etc.), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), and flash memory (FLASH); the I / O interface (read / write interface) 103 is connected between the processor 101 and the memory 102, and can realize information interaction between the processor 101 and the memory 102, including but not limited to a data bus (Bus).

[0089] In some embodiments, the processor 101, memory 102, and I / O interface 103 are interconnected via bus 104, and thus connected to other components of the computing device.

[0090] In some embodiments, the one or more processors 101 include a field-programmable gate array.

[0091] This invention also provides a computer-readable medium. The computer-readable medium stores a computer program, which, when executed by a processor, implements the steps of any of the temperature protection methods described in the above embodiments. The computer-readable storage medium may be volatile or non-volatile.

[0092] This invention also provides a computer program product, including computer-readable code, or a non-volatile computer-readable storage medium carrying computer-readable code. When the computer-readable code is run in the processor of an electronic device, the processor in the electronic device executes the above-described temperature protection method.

[0093] Those skilled in the art will understand that all or some of the steps, systems, and apparatuses disclosed above, and their functional modules / units, can be implemented as software, firmware, hardware, or suitable combinations thereof. In hardware implementations, the division between functional modules / units mentioned above does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may be performed collaboratively by several physical components. Some or all physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit (ASIC). Such software can be distributed on a computer-readable storage medium, which may include computer storage media (or non-transitory media) and communication media (or transient media).

[0094] As is known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information, such as computer-readable program instructions, data structures, program modules, or other data. Computer storage media includes, but is not limited to, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), static random access memory (SRAM), flash memory or other memory technologies, portable compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, it is known to those skilled in the art that communication media typically contain computer-readable program instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0095] The computer-readable program instructions described herein can be downloaded from computer-readable storage media to various computing / processing devices, or downloaded via a network, such as the Internet, local area network, wide area network, and / or wireless network, to an external computer or external storage device. The network may include copper transmission cables, fiber optic transmission, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards them to the computer-readable storage media in the respective computing / processing device.

[0096] The computer program instructions used to perform the operations of this invention may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk, C++, etc., and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The computer-readable program instructions may be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer may be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or may be connected to an external computer (e.g., via the Internet using an Internet service provider). In some embodiments, electronic circuitry, such as programmable logic circuitry, field-programmable gate arrays (FPGAs), or programmable logic arrays (PLAs), is personalized by utilizing state information from the computer-readable program instructions. This electronic circuitry can execute the computer-readable program instructions to implement various aspects of the invention.

[0097] The computer program product described herein can be implemented specifically through hardware, software, or a combination thereof. In one alternative embodiment, the computer program product is specifically embodied in a computer storage medium; in another alternative embodiment, the computer program product is specifically embodied in a software product, such as a software development kit (SDK), etc.

[0098] Various aspects of the present invention are described herein with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer-readable program instructions.

[0099] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that, when executed by the processor of the computer or other programmable data processing apparatus, they create means for implementing the functions / actions specified in one or more blocks of the flowchart and / or block diagram. These computer-readable program instructions can also be stored in a computer-readable storage medium that causes a computer, programmable data processing apparatus, and / or other device to operate in a particular manner; thus, the computer-readable medium storing the instructions comprises an article of manufacture that includes instructions for implementing aspects of the functions / actions specified in one or more blocks of the flowchart and / or block diagram.

[0100] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to perform the functions / actions specified in one or more boxes of a flowchart and / or block diagram.

[0101] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of an instruction, which contains one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions marked in the blocks may occur in a different order than those shown in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0102] Example embodiments have been disclosed herein, and while specific terminology has been used, it is for illustrative purposes only and should be construed as such, and is not intended to be limiting. In some instances, it will be apparent to those skilled in the art that features, characteristics, and / or elements described in conjunction with particular embodiments may be used alone, or in combination with features, characteristics, and / or elements described in conjunction with other embodiments, unless otherwise expressly indicated. Therefore, those skilled in the art will understand that various changes in form and detail may be made without departing from the scope of the invention as set forth in the appended claims.

Claims

1. A method for temperature protection of a SOC chip in the field of intelligent driving, characterized in that, include: Obtain the current vehicle driving scenario, which includes the vehicle preparing to drive scenario, the vehicle driving scenario, and the vehicle driving completion scenario; Based on the current vehicle driving scenario, the SOC chip temperature is controlled according to different preset rules.

2. The temperature protection method according to claim 1, characterized in that, If the current vehicle driving scenario is a vehicle preparing to drive scenario, the methods for controlling the SOC chip temperature include: After the vehicle is powered on, the MCU chip monitors its own temperature in real time to obtain the MCU chip temperature. The system determines whether the MCU chip temperature is lower than a preset first temperature threshold. If the MCU chip temperature is lower than the preset first temperature threshold, the MCU chip will not activate the SOC chip, and will record the fault code generated by the failure to activate the SOC chip, and will not trigger the fault light display on the vehicle instrument panel. If the MCU chip temperature is not lower than the preset first temperature threshold, the MCU chip will normally activate the SOC chip, enabling the SOC chip to operate and realize intelligent driving environment perception. Continuously monitor the temperature change of the MCU chip. When the temperature of the MCU chip rises from below the first temperature threshold to above or equal to the first temperature threshold, determine whether to activate the SOC chip based on the usage requirements of the intelligent driving function.

3. The temperature protection method according to claim 1, characterized in that, If the current vehicle driving scenario is a scenario where the vehicle has completed its journey, the methods for controlling the SOC chip temperature include: Monitor vehicle gear shifting signals. When the vehicle gear is detected to shift from D or R to P or N, start a timer and monitor the MCU chip temperature in real time. Determine whether the P or N gear holding time exceeds a preset time threshold and whether the MCU chip temperature reaches a preset second temperature threshold. If it does, the MCU chip will power down the SOC chip and record the fault code generated by the power-down SOC chip, without triggering the vehicle instrument panel fault light display. If it does not reach the threshold, the SOC chip will continue to operate normally. The system continuously monitors gear changes and MCU chip temperature. When it detects that the gear has switched back from P or N to D or R, or when the MCU chip temperature is lower than the preset third temperature threshold, the MCU chip will restart the SOC chip.

4. The temperature protection method according to claim 1, characterized in that, If the current vehicle driving scenario is a vehicle driving scenario, the methods for controlling the SOC chip temperature include: Real-time monitoring of SOC chip temperature to determine if it has reached the preset over-temperature threshold; If the SOC chip temperature reaches the over-temperature threshold, the MCU chip will power down the SOC chip, and at the same time, a cooling prompt message will pop up on the vehicle instrument panel or central control screen, and the intelligent driving assistance function will be downgraded, and the fault code generated by the SOC chip due to power-down will be recorded. After the SOC chip is powered down, the power-down duration and MCU chip temperature are continuously monitored. If the power-down duration exceeds the preset power-down time threshold, or the MCU chip temperature is less than or equal to the preset fourth temperature threshold, the MCU chip will restart the SOC chip.

5. The temperature protection method according to claim 2, characterized in that, The first temperature threshold is 70°C, and the first temperature threshold can be flexibly adjusted according to the climate conditions of the area where the vehicle is used and the actual test temperature.

6. The temperature protection method according to claim 3, characterized in that, The preset time threshold is 5 minutes, the second temperature threshold is the temperature value of the MCU chip corresponding to the hot state of the SOC chip, and the third temperature threshold is 80℃.

7. The temperature protection method according to claim 4, characterized in that, The over-temperature threshold is 123°C, the preset power-off time threshold is 20 minutes, and the fourth temperature threshold is 90°C.

8. The method according to claim 5, characterized in that, The intelligent driving assistance function downgrade processing includes downgrading the adaptive cruise function to the cruise control function, or temporarily disabling functions that rely heavily on real-time environmental perception information, such as automatic emergency braking.

9. A temperature protection system for a SOC chip in the field of intelligent driving, employing the temperature protection method described in any one of claims 1-8, characterized in that, include: Driving scenario determination unit and SOC chip temperature control unit; wherein: A driving scenario determination unit is used to obtain the current vehicle driving scenario, which includes a vehicle preparation driving scenario, a driving scenario, and a driving scenario; The SOC chip temperature control unit is used to control the SOC chip temperature according to different preset rules based on the current vehicle driving scenario.

10. An electronic device, characterized in that, include: One or more processors; Memory, used to store one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the temperature protection method as described in any one of claims 1 to 8.

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