Laminated busbar local hot-pressing gradient forming method and hot-pressing device

Abstract

The invention discloses a laminated busbar local hot-pressing gradient forming method and a hot-pressing device, and relates to the technical field of hot-pressing molding.Based on the basic principle of a stamping assembly, a lower pressing plate is provided with a shaping cavity, a controllable elastic assembly is arranged outside the lower pressing plate, upper and lower pressing plates are provided with temperature control assemblies corresponding to the shaping cavity, and the controllable elastic assembly forms a pressure interaction feedback mechanism; the upper pressing plate is provided with a one-way pressure feedback mechanism corresponding to the shaping cavity, the upper pressing plate and the lower pressing plate can achieve multi-frequency reciprocating differential movement, dynamic pressure parameters between the pressing plates and upward counter-acting force of a base material are collected in real time through the two pressure feedback mechanisms, and the forming stages of softening, attaching, bonding, compacting, shrinking and shaping of the base material are judged through data analysis. Accordingly, the multi-frequency reciprocating difference movement mode of the upper pressing plate and the lower pressing plate is dynamically adjusted, and the gradient adaptation process of the hot pressing pressure and the base material forming state is achieved in cooperation with pressure adjustment of the controllable elastic assembly and heat source supply of the temperature control assembly.

Description

Technical Field

[0001] This invention relates to the field of hot pressing forming technology, specifically to a method and apparatus for local hot pressing gradient forming of laminated busbars. Background Technology

[0002] Laminated busbars are primarily used for power transmission in high-current, high-voltage scenarios. Specifically, they are made from relevant materials using a hot-pressing process. Hot-pressing of laminated busbars is a key process that determines their electrical performance, mechanical strength, and long-term reliability. Improper process control can easily lead to problems such as poor interlayer bonding, insulation failure, and dimensional deviations.

[0003] The key factors affecting the molding quality are hot pressing temperature and pressure. Temperature is the basic factor affecting adhesion strength, and pressure is the basic factor ensuring sufficient contact between materials. However, it should also be noted that while higher temperatures promote material deformation and ensure sufficient contact, the materials will also have different expansion during the heating process, which in turn affects the degree of material contact. Improper matching can easily generate internal stress. For example, the coefficients of thermal expansion of the conductive layer (copper / aluminum) and the insulating film (PET / PI) should be as close as possible to avoid warping, delamination, or cracking of the adhesive layer after cooling. It can be understood that if there is a balance deviation between hot pressing temperature and hot pressing pressure, it will directly affect the hot pressing molding quality between multiple materials. This invention proposes a solution to this problem. Summary of the Invention

[0004] The purpose of this invention is to provide a method and apparatus for local hot-pressing gradient forming of laminated busbars, because the two key parameters of temperature and pressure in the hot-pressing forming process of laminated busbars are interrelated and affect each other, and temperature / pressure differences may lead to poor bonding or local deformation.

[0005] The objective of this invention can be achieved through the following technical solution: a local hot pressing gradient hot pressing device for laminated busbars, comprising a hydraulic power component, an upper pressure plate, a lower pressure plate, and a tooling frame, wherein the lower pressure plate and the upper pressure plate are slidably connected in the tooling frame in the vertical direction through the hydraulic power component;

[0006] The lower pressure plate has a shaping cavity in the center area corresponding to the upper pressure plate, and a controllable elastic component is provided in the outer area of ​​the molding cavity corresponding to the lower pressure plate. Temperature control components are provided in the positions of the upper and lower pressure plates corresponding to the molding cavity.

[0007] The controllable elastic component forms a pressure interaction feedback mechanism with respect to the upper and lower pressure plates. The upper and lower pressure plates move in multiple frequencies under the pressure interaction feedback mechanism through hydraulic power components.

[0008] The configuration is further defined as follows: a directional limiting group and an elastic limiting group are respectively provided between the upper pressure plate and the lower pressure plate, and a unidirectional pressure feedback mechanism with a corresponding pressure interaction feedback mechanism is provided in the position of the upper pressure plate corresponding to the molding cavity.

[0009] A method for local hot-pressing gradient forming of laminated busbars involves placing the substrate to be processed into a shaping cavity, providing a heat source with a temperature control component, and using upper and lower pressure plates to complete the hot-pressing forming action on the substrate. During the hot-pressing forming action, pressure data is obtained through a pressure interaction feedback mechanism and a unidirectional pressure feedback mechanism, and is used as reference data in multi-frequency reciprocating differential movement actions.

[0010] Further configured as follows: the upper and lower pressure plates in the multi-frequency reciprocating differential movement include four movement modes: same-direction same-speed movement, same-direction differential movement, reverse differential movement, and reverse constant-speed movement; the pressure interaction feedback mechanism is used to obtain the dynamic pressure parameters of the upper and lower pressure plates; and the unidirectional pressure feedback mechanism is used to feedback the upward reaction force generated during the hot pressing of the substrate.

[0011] The molding method is further configured to include the following steps:

[0012] S1: Based on the initial pressure data analysis of the two feedback mechanisms, it is determined that the substrate has not undergone significant deformation. The upper and lower pressure plates are controlled to move in the same direction at a constant speed. The pressure data change trend is continuously analyzed. If the data fluctuates, the moving speed is adjusted.

[0013] S2: When analyzing pressure data to determine that the substrate begins to soften and the interlayer shows an initial bonding trend, control the upper and lower pressure plates to move in the same direction at different speeds. Fine-tune the movement speed of the pressure plates according to the pressure parameter distribution. If the substrate reaction force rises too quickly, reduce the overall movement speed of the pressure plates.

[0014] S3: When analyzing pressure data to determine that the substrate is completely softened and the interlayer has entered the bonding and compaction stage, control the upper and lower pressure plates to move in opposite directions at different speeds. Determine the internal stress state based on the reaction force change of the unidirectional pressure feedback mechanism and adjust the pressure plate movement parameters.

[0015] S4: When the pressure data is analyzed and it is determined that the air between the substrate layers has been basically discharged and the reaction force remains stable, the upper and lower pressure plates are controlled to move in opposite directions at a constant speed. The uniformity of the reaction force in each area of ​​the substrate is analyzed, and the reciprocating amplitude and frequency of the pressure plates are finely adjusted.

[0016] S5: After analyzing the pressure data to determine that the substrate is uniformly compacted throughout, maintain the molding pressure and control the pressure plate to make very small-amplitude reverse constant-speed reciprocating fine adjustments. Determine the substrate shrinkage state based on the reaction force change of the unidirectional pressure feedback mechanism.

[0017] Further configuration: During the substrate shaping process in step S5, the temperature control component, in conjunction with pressure feedback, adjusts the temperature and eliminates residual stress inside the substrate through small reciprocating adjustments of the pressure plate.

[0018] The present invention has the following beneficial effects:

[0019] 1. By establishing a dual pressure detection system with a pressure interaction feedback mechanism and a one-way pressure feedback mechanism, and combining real-time analysis of pressure data, the state of each stage of hot pressing of the substrate is accurately determined. This allows for dynamic control of the multi-frequency reciprocating differential movement form and parameters of the upper and lower pressure plates, ensuring that the hot pressing pressure is precisely matched with the actual forming state of the substrate, such as softening, bonding, compaction, and shrinkage. This avoids excessive reliance on fixed pressure methods based on traditional process experience parameters, effectively solving problems such as poor interlayer bonding and local deformation caused by temperature and pressure imbalance, and significantly improving the forming accuracy and interlayer bonding effect of the laminated busbar.

[0020] 2. With the synergistic effect of controllable elastic components and dual pressure feedback mechanism, it can compensate and buffer local pressure in real time during the hot pressing process. At the same time, the multi-frequency reciprocating differential movement of the pressure plate can fully expel residual air between substrate layers. Combined with the small reciprocating fine adjustment during the pressure holding stage, it can effectively release and eliminate the internal stress generated during the hot pressing process, avoid defects such as warping, delamination, and adhesive layer cracking after the laminated busbar cools down, and significantly improve the mechanical strength of the laminated busbar. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of a local hot-pressing gradient forming method and hot-pressing device for laminated busbars proposed in this invention;

[0023] Figure 2 For the present invention Figure 1 Front view of the upper and lower pressure plates;

[0024] Figure 3 For the present invention Figure 1 Detailed diagram of the upper and lower pressure plates;

[0025] Figure 4 This is a schematic diagram illustrating the operation of a local hot-pressing gradient forming method for laminated busbars proposed in this invention.

[0026] In the diagram: 1. Hydraulic power component; 2. Upper pressure plate; 3. Lower pressure plate; 4. Tooling frame; 5. Orientation limit assembly; 6. Elastic limit assembly; 7. Controllable elastic component; 8. Shaping cavity. Detailed Implementation

[0027] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] Example 1: Since the two key parameters of temperature and pressure in the hot pressing process of laminated busbars are interrelated and affect each other, the difference in temperature / pressure may lead to poor bonding or local deformation. In this regard, the hot pressing process of laminated busbars can be simply explained as follows: In essence, multiple substrates are combined together using stamping technology and placed into matching forming cavities. Then, the upper pressure plate 2 is used as a "punch" structure to impact the multiple substrates. Under the dual action of temperature and pressure, hot pressing is completed. This part is the basic principle of the hot pressing process, so it will not be explained in detail. Since the specifications of the substrates are not uniform, the present invention does not impose specific restrictions on the structure of the forming cavity 8, and therefore the "punch" structure in the upper pressure plate 2 that matches the forming cavity 8 will not be explained.

[0029] In conventional hot pressing processes, temperature, hot pressing pressure, and action time are mostly empirical parameters. This invention mainly focuses on hot pressing pressure. Conventional pressure application methods are mostly staged pressure variation methods. Specifically, the first stage is when the upper pressure plate 2 moves from its initial position to a position close to the substrate. This stage does not affect the overall hot pressing process, so the lower pressure and action time can be set normally. The key is that when applying pressure to the substrate, the lower pressure needs to be gradually increased to ensure full contact between multiple substrates. Then, the position of the lower pressure plate 3 is maintained to enter the pressure holding stage. After the pressure holding is completed, the upper pressure plate 2 is reset and the hot-pressed substrate is removed.

[0030] Combine the above content Figure 1It should be noted that: the upper pressure plate 2 is the moving part, while the lower pressure plate 3 is fixed and only provides a "support platform" during the hot pressing process. However, in reality, excessive pressure may be applied to the substrate during the hot pressing process, resulting in "residual" stress inside. As a result, after the hot pressing is completed, the substrate will deform and reset due to the temperature returning to room temperature, causing local deformation of the stacked busbar. Therefore, this invention is based on the basic process of hot pressing and mainly optimizes the movement of the upper pressure plate 2 and the lower pressure plate 3 relative to the substrate. In addition, a one-way pressure feedback mechanism is added to the substrate in the forming cavity 8 during their operation. The essence of the one-way pressure feedback mechanism and the pressure interaction feedback mechanism is based on a cylinder / rod structure. Based on the principle of the cylinder, the pressure is sensed by the hydraulic pressure change of the hydraulic oil during the operation of the upper pressure plate 2 and the lower pressure plate 3. Taking the pressure interaction feedback mechanism as an example, the oil rod is installed on the upper pressure plate 2, and the oil sleeve is installed in the lower pressure plate 3. The oil rod and the oil sleeve keep sliding, and the oil sleeve is filled with hydraulic oil. When the two keep sliding, the hydraulic oil pressure fluctuation can be monitored in real time.

[0031] It should also be noted that the pressure interaction feedback mechanism is used to feed back the dynamic pressure parameters of the upper pressure plate 2 and the lower pressure plate 3, thereby indirectly feeding back the molding pressure applied by the upper pressure plate 2 and the lower pressure plate 3 to the substrate. However, the unidirectional pressure feedback mechanism is different: it is only used to obtain the upward reaction force that the substrate may generate during the molding process. Ultimately, the unidirectional pressure feedback mechanism and the pressure interaction feedback mechanism directly control the movement direction, movement speed and the frequency of the up-and-down reciprocating movement of the upper pressure plate 2 and the lower pressure plate 3 in the multi-frequency reciprocating differential movement.

[0032] Example 2: This example is based on the technical content of Example 1, and supplements the explanation of the multi-frequency reciprocating differential movement process. The core analysis is based on the dynamic pressure parameters between the upper and lower pressure plates collected by the pressure interaction feedback mechanism and the upward reaction force of the substrate during hot pressing collected by the unidirectional pressure feedback mechanism. By analyzing the two types of pressure data in real time, the stage state of hot pressing of the substrate is judged, and then the action command is issued to the hydraulic power component to dynamically adjust the multi-frequency reciprocating differential movement of the upper pressure plate (2) and the lower pressure plate (3) to achieve gradient adaptation of hot pressing pressure and temperature, and solve problems such as poor interlayer adhesion, local deformation and internal stress accumulation in the hot pressing of the laminated busbar. The entire process is combined with the heat source supply of the temperature control component to complete the precise hot pressing gradient forming of the laminated busbar. The specific linkage process of pressure data analysis - action command generation - execution is as follows:

[0033] S1: After the substrate to be processed is placed into the shaping cavity 8 and the temperature control component is activated to supply heat, the structure of the temperature control component is not specifically described in this invention because it is a basic structure of the hot pressing process. The pressure interaction feedback mechanism and the one-way pressure feedback mechanism are activated simultaneously to complete the initial data acquisition and calibration of the two types of feedback mechanisms. The baseline data state under no pressure is analyzed and determined to ensure the accuracy of subsequent pressure data acquisition. At this time, the hydraulic power component 1 drives the upper pressure plate 2 to make an initial approaching action towards the substrate. During the process, the dynamic pressure parameters between the pressure plates are continuously collected and the critical contact state between the pressure plate and the substrate is analyzed and determined. When the pressure interaction feedback mechanism detects the first slight increase in pressure parameters and the one-way pressure feedback mechanism collects the weak reaction force generated by the substrate, it is determined that the upper pressure plate 2 and the substrate have completed the initial contact and immediately enter the formal control stage of multi-frequency reciprocating differential movement.

[0034] S2: After the pressure plate and substrate have made initial contact, the control system analyzes the initial pressure data based on the two types of feedback mechanisms. If it determines that the substrate has not yet undergone significant deformation and interlayer contact has not started, it outputs a constant-speed motion control command in the same direction. The upper pressure plate 2 continues to move at a constant speed towards the substrate, and the lower pressure plate 3 moves at the same speed towards the substrate (i.e., the lower pressure plate 3 moves upward along the direction close to the upper pressure plate 2, connected to the substrate). During this process, the changing trends of the two types of pressure data are continuously analyzed. If the dynamic pressure parameters of the pressure interaction feedback mechanism show a steady upward trend, and the reaction force of the unidirectional pressure feedback mechanism increases steadily, it is determined that the substrate is in the initial stage of stable pressure, and the constant-speed motion command in the same direction is maintained. If the analysis finds that the pressure data fluctuates irregularly, it is determined that there is a gap or misalignment in the substrate clamping, and the moving speed is immediately adjusted until the pressure data returns to a stable change, ensuring the uniformity of the initial pressure on the substrate.

[0035] S3: When the control system analyzes the pressure data and determines that the substrate begins to soften under the combined effect of temperature and initial pressure, and that the interlayer shows a preliminary bonding trend, and the reaction force of the unidirectional pressure feedback mechanism increases in stages, it immediately outputs a motion control command for unidirectional differential movement, adjusting the moving speed of the upper pressure plate 2 and the lower pressure plate 3 so that they move towards each other while forming a speed difference. During this process, the dynamic pressure parameter distribution of the pressure interaction feedback mechanism is analyzed. Combined with the pressure adjustment function of the controllable elastic component 7, if the analysis finds that the local pressure parameter is too low, it is determined that the interlayer contact in the corresponding area of ​​the substrate is insufficient. By adjusting the controllable elastic component 7 to compensate for the pressure, the moving speed of the corresponding position of the pressure plate is finely adjusted so that the pressure is applied evenly to the softened substrate. If the analysis finds that the reaction force of the unidirectional pressure feedback mechanism rises too quickly, it is determined that the substrate is not softened enough. The overall moving speed of the pressure plate is appropriately reduced to allow time for the interlayer of the substrate to soften and bond sufficiently, avoiding damage to the substrate caused by hard pressure.

[0036] S4: When the analysis of two types of pressure data determines that the substrate has completely softened, the interlayer has entered the critical bonding and compaction stage, and the reaction force of the unidirectional pressure feedback mechanism reaches the critical pressure correlation value for substrate molding, the control system immediately outputs a reverse differential movement motion control command to adjust the movement direction of the upper pressure plate 2 and the lower pressure plate 3. The upper pressure plate 2 maintains a pressing motion towards the substrate, while the lower pressure plate 3 makes a small reverse movement, forming a reverse differential pressure pattern. The focus of analysis at this stage is the change in the reaction force of the unidirectional pressure feedback mechanism, which is used to determine the degree of compaction and internal stress between the substrate layers. Force generation state: If the reaction force remains stable, the interlayer compaction process is considered to be progressing smoothly, and the frequency and speed of the reverse differential movement are maintained. If the reaction force suddenly increases, it is determined that internal stress has begun to be generated inside the substrate. The pressing speed of the upper pressure plate 2 is immediately reduced, while the reverse movement amplitude of the lower pressure plate 3 is increased. The internal stress is relieved through pressure gradient release. In addition, combined with the analysis of the pressure interaction feedback mechanism, if a sudden change in dynamic pressure parameters between the pressure plates is detected, it is determined that the local pressure is too high. The controllable elastic component 7 is used for immediate buffering to prevent problems such as insulation film rupture and conductive layer deformation. Furthermore, the pressure gradient formed by the reverse differential movement enables the gradual discharge of residual air between the substrate layers. The stability of the pressure data can be analyzed to determine the air discharge state. The air discharge status is determined until the pressure data shows no fluctuation, indicating that the interlayer air has been basically discharged.

[0037] S5: When the pressure data analysis determines that the air between the substrate layers has been largely expelled and the reaction force remains stable without sudden increases or decreases, and the initial bonding between the substrate layers is completed, the control system outputs a reverse constant-speed movement control command to control the upper pressure plate 2 and the lower pressure plate 3 to move back and forth in opposite directions at the same speed. During this process, the uniformity of the reaction force in each area of ​​the substrate collected by the unidirectional pressure feedback mechanism is analyzed. If the analysis reveals deviations in the reaction force in different areas, it is determined that the substrate is under uneven pressure. The amplitude and frequency of the reciprocating motion of the pressure plates are immediately fine-tuned, and targeted small-amplitude pressure is applied to areas with low reaction force to achieve uniform compaction across the entire substrate layer. Simultaneously, the overall pressure parameters of the pressure interaction feedback mechanism are continuously analyzed to ensure overall pressure stability between the pressure plates, avoiding sudden pressure fluctuations caused by reciprocating movement, further eliminating problems such as localized incomplete compaction and weak bonding, and laying the foundation for subsequent pressure holding and shaping.

[0038] S6: After analyzing the two types of pressure data and determining that the substrate has achieved uniform compaction and the interlayer bonding has met the preset molding requirements, the control system does not directly lock the pressure plate position. Instead, based on real-time analysis of the pressure data, it outputs a pressure-holding + small-amplitude reciprocating fine-tuning action control command to maintain the molding pressure of the pressure plate on the substrate. At the same time, it controls the upper pressure plate 2 and the lower pressure plate 3 to move back and forth in opposite directions at a constant speed with a very small amplitude. At this stage, the focus is on analyzing the reaction force changes of the unidirectional pressure feedback mechanism to determine the shrinkage state of the substrate during temperature changes: if the reaction force decreases slightly, it is determined that the substrate has a shrinkage gap due to cooling. Immediately, the local pressure amplitude is increased through small-amplitude reciprocating fine-tuning to compensate for the shrinkage gap and avoid micro-cracks between layers; if the reaction force remains stable, it is determined that the substrate shrinkage is compatible with the pressure, and the frequency of small-amplitude reciprocating fine-tuning is maintained. Through pressure analysis and reciprocating fine-tuning during the pressure-holding process, residual stress inside the substrate is completely eliminated, avoiding problems such as warping, delamination, and deformation after cooling.

[0039] In addition to the above, it should be noted that in this embodiment, the switching of each motion mode and the adjustment of motion parameters for the multi-frequency reciprocating differential movement are based on pressure data from the pressure interaction feedback mechanism and the unidirectional pressure feedback mechanism. Through comprehensive analysis of the trend, magnitude, and uniformity of pressure data changes, the various states of the substrate during the hot pressing process, such as softening, bonding, adhesion, compaction, shrinkage, and shaping, are accurately determined. Based on the analysis results, corresponding action control commands are output to achieve dynamic control of the motion states of the upper pressure plate 2 and the lower pressure plate 3. Compared to the traditional hot pressing method with fixed pressure and empirical parameter control, this embodiment, through real-time linkage between pressure analysis and action control, ensures that the hot pressing pressure always matches the actual forming state of the substrate.

[0040] The above description is merely an example and illustration of the structure of the present invention. Those skilled in the art can make various modifications or additions to the specific embodiments described, or use similar methods to replace them, as long as they do not deviate from the structure of the invention or exceed the scope defined in the claims, all of which should fall within the protection scope of the present invention.

[0041] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0042] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to specific implementations. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A local hot-pressing gradient hot-pressing device for laminated busbars, comprising a hydraulic power component (1), an upper pressure plate (2), a lower pressure plate (3), and a tooling frame (4), characterized in that, The lower pressure plate (3) and the upper pressure plate (2) are slidably connected in the vertical direction in the tooling frame (4) by a hydraulic power component (1); The lower pressure plate (3) has a shaping cavity (8) in the center area corresponding to the upper pressure plate (2), and the lower pressure plate (3) has a controllable elastic component (7) in the outer area of ​​the molding cavity (8). The upper pressure plate (2) and the lower pressure plate (3) have temperature control components in the positions corresponding to the molding cavity (8). The controllable elastic component (7) forms a pressure interaction feedback mechanism with respect to the upper pressure plate (2) and the lower pressure plate (3). The upper pressure plate (2) and the lower pressure plate (3) move in multiple frequencies under the pressure interaction feedback mechanism through the hydraulic power component (1).

2. The local hot-pressing gradient hot-pressing device for laminated busbars according to claim 1, characterized in that, The upper pressure plate (2) and the lower pressure plate (3) are respectively provided with a directional limiting group (5) and an elastic limiting group (6). The upper pressure plate (2) is provided with a one-way pressure feedback mechanism corresponding to the pressure interaction feedback mechanism in the position of the molding cavity (8).

3. A method for local hot-pressing gradient forming of laminated busbars, using the local hot-pressing gradient hot-pressing device for laminated busbars as described in claim 2, characterized in that, The substrate to be processed is placed into the shaping cavity (8), and the heat source is provided by the temperature control component. The upper pressure plate (2) and the lower pressure plate (3) complete the hot pressing action of the substrate. In the hot pressing action, the pressure data is obtained by the pressure interaction feedback mechanism and the one-way pressure feedback mechanism, and is used as the reference data in the multi-frequency reciprocating differential movement action.

4. The method for local hot-pressing gradient forming of a laminated busbar according to claim 3, characterized in that, The upper pressure plate (2) and lower pressure plate (3) in the multi-frequency reciprocating differential movement include four movement modes: same-direction same-speed movement, same-direction differential speed movement, reverse differential speed movement, and reverse constant speed movement. The pressure interaction feedback mechanism is used to obtain the dynamic pressure parameters of the upper pressure plate (2) and lower pressure plate (3). The unidirectional pressure feedback mechanism is used to feed back the upward reaction force generated during the hot pressing of the substrate.

5. The method for local hot-pressing gradient forming of a laminated busbar according to claim 4, characterized in that, The molding method includes the following steps: S1: Based on the initial pressure data analysis of the two feedback mechanisms, it is determined that the substrate has not undergone significant deformation. The upper pressure plate (2) and the lower pressure plate (3) are controlled to move in the same direction at a constant speed. The pressure data change trend is continuously analyzed. If the data fluctuates, the moving speed is adjusted. S2: When the pressure data is analyzed and it is determined that the substrate begins to soften and the interlayer shows a preliminary bonding trend, the upper pressure plate (2) and the lower pressure plate (3) are controlled to move in the same direction at a different speed. The moving speed of the pressure plate is finely adjusted according to the pressure parameter distribution. If the reaction force of the substrate rises too fast, the overall moving speed of the pressure plate is reduced. S3: When the pressure data is analyzed and the substrate is completely softened and the interlayer enters the bonding and compaction stage, the upper pressure plate (2) and the lower pressure plate (3) are controlled to move in opposite directions at different speeds. The internal stress state is determined according to the reaction force change of the unidirectional pressure feedback mechanism and the pressure plate movement parameters are adjusted. S4: When the pressure data is analyzed and it is determined that the air between the substrate layers is basically discharged and the reaction force remains stable, the upper pressure plate (2) and the lower pressure plate (3) are controlled to move in opposite directions at a constant speed. The uniformity of the reaction force in each area of ​​the substrate is analyzed, and the reciprocating amplitude and frequency of the pressure plate are finely adjusted. S5: After analyzing the pressure data to determine that the substrate is uniformly compacted throughout, maintain the molding pressure and control the pressure plate to make very small-amplitude reverse constant-speed reciprocating fine adjustments. Determine the substrate shrinkage state based on the reaction force change of the unidirectional pressure feedback mechanism.

6. The method for local hot-pressing gradient forming of a laminated busbar according to claim 5, characterized in that, In step S5, during the substrate shaping process, the temperature control component works in conjunction with pressure feedback to regulate the temperature, and the residual stress inside the substrate is eliminated by the small reciprocating adjustment of the pressure plate.

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