Display panel and display device

Abstract

The invention relates to a display panel and a display device. The display panel comprises an array substrate; the light-emitting device is located on one side of the array substrate; the light shielding layer and the light emitting device are located on the same side of the array substrate, and at least part of the light shielding layer is located on the periphery of the light emitting device. The composite film layer is located on the side, away from the array substrate, of the light-emitting device and the light shielding layer and comprises a filling layer and a decoration layer which are stacked in the thickness direction of the array substrate. In conclusion, according to the display panel in the embodiment, through the arrangement, the packaging of the light-emitting device can be simplified, and the packaging of the light-emitting device is more time-saving and labor-saving.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and display device. Background Technology

[0002] As display technology continues to mature, consumers are demanding higher specifications for display panels, requiring manufacturers to produce larger sizes. Related technologies typically involve splicing multiple smaller display panels together to create ultra-large, frameless video walls, thus meeting consumer demand for large display panels.

[0003] In related technologies, when manufacturing display panels for frameless video walls, a transparent film layer is typically printed on the side of the light-shielding layer facing away from the array substrate. This film covers the surface of the light-emitting devices on the side facing away from the substrate, encapsulating and protecting the devices from external moisture. However, this encapsulation method for the light-emitting devices is complex, time-consuming, and labor-intensive, affecting the manufacturing efficiency of the display panel. Summary of the Invention

[0004] Therefore, it is necessary to propose a new display panel and display device to address the problem that the current packaging method of the light-emitting devices in display panels is relatively complex and affects the manufacturing efficiency of display panels.

[0005] A display panel, comprising:

[0006] Array substrate;

[0007] A light-emitting device is located on one side of the array substrate;

[0008] A light-shielding layer is located on the same side of the array substrate as the light-emitting device, and is at least partially located on the outer periphery of the light-emitting device;

[0009] A composite film layer is located on the side of the light-emitting device and the light-shielding layer that is away from the array substrate. The composite film layer includes a filler layer and a decorative layer stacked along the thickness direction of the array substrate.

[0010] This application also proposes a display device including the aforementioned display panel.

[0011] The display panel and display device of this application, by placing a composite film layer on the side of the light-emitting device and the light-shielding layer facing away from the array substrate, can encapsulate and protect the light-emitting device, reducing the risk of external moisture erosion. Since the composite film layer is composed of a filler layer and a decorative layer stacked together, the filler layer and decorative layer can be stacked and prepared before processing the display panel to successfully create the composite film layer. Then, during the manufacturing process of the display panel, the prepared composite film layer only needs to be pressed onto the side of the light-emitting device and the light-shielding layer facing away from the array substrate to protect the light-emitting device, achieving rapid encapsulation of the light-emitting device. As described above, since the composite film layer can be pre-prepared, using the composite film layer to encapsulate the light-emitting device is simpler, more time-saving, and less labor-intensive than printing a transparent encapsulation layer on the surface of the light-emitting device, and further improves the manufacturing efficiency of the display panel.

[0012] In summary, the display panel and display device in this embodiment, through the above-described configuration, can simplify the packaging of the light-emitting devices, making the packaging of the light-emitting devices more time-saving and labor-saving. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of this application, the drawings used in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the structure of a display device according to an embodiment of this application.

[0015] Figure 2 for Figure 1 The top view of the display panel when the composite film layer of the display panel completely covers the array substrate in the display device shown.

[0016] Figure 3 for Figure 2 The diagram shows a cross-sectional view of the structure at point A when the composite film layer of the display panel includes the adhesive layer.

[0017] Figure 4 for Figure 2 The diagram shows a cross-sectional view of the structure at points B and / or C when the composite film layer of the display panel includes the adhesive layer.

[0018] Figure 5 for Figure 2 The diagram shows a cross-sectional view of the structure at point A when the composite film layer of the display panel does not include the adhesive layer.

[0019] Figure 6 for Figure 2The diagram shows a cross-sectional view of the structure at points B and / or C when the composite film layer of the display panel does not include the adhesive layer.

[0020] Figure 7 for Figure 1 The top view of the display panel when the composite film layer of the display panel overlaps at least partially with the array substrate in the display device shown.

[0021] Figure 8 for Figure 7 The diagram shows a cross-sectional view of the structure at point D when the composite film layer of the display panel includes the adhesive layer.

[0022] Figure 9 for Figure 7 The diagram shows a cross-sectional view of the structure at points E and / or F when the composite film layer of the display panel includes the adhesive layer.

[0023] Figure 10 for Figure 7 The diagram shows a cross-sectional view of the structure at point D when the composite film layer of the display panel does not include the adhesive layer.

[0024] Figure 11 for Figure 7 The diagram shows a cross-sectional view of the structure at points E and / or F when the composite film layer of the display panel does not include the adhesive layer.

[0025] Figure label:

[0026] Display device 1;

[0027] Display panel 10;

[0028] Array substrate 100;

[0029] Light-emitting device 200;

[0030] 300mm light-shielding layer;

[0031] Composite film layer 400, filler layer 410, decorative layer 420, adhesive layer 430;

[0032] Package structure 500, package fill layer 510, trace package layer 520, trace protection layer 530;

[0033] Side light-shielding layer 600;

[0034] Connection wiring 700;

[0035] Membrane layer 800. Detailed Implementation

[0036] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0037] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0038] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0042] Please see Figures 1 to 11 , Figure 1 A schematic diagram of the structure of a display device 1 according to an embodiment of this application is shown. An embodiment of this application provides a display panel 100. The display panel 100 includes an array substrate 100, a light-emitting device 200, a light-shielding layer 300, and a composite film layer 400. The light-emitting device 200 is located on one side of the array substrate 100. The light-shielding layer 300 is located on the same side of the array substrate 100 as the light-emitting device 200, and is at least partially located on the outer periphery of the light-emitting device 200. The composite film layer 400 is located on the side of the light-emitting device 200 and the light-shielding layer 300 away from the array substrate 100, and the composite film layer 400 includes a filling layer 410 and a decorative layer 420 stacked along the thickness direction of the array substrate 100.

[0043] In this embodiment, the display panel 100, by placing the composite film layer 400 on the side of the light-emitting device 200 and the light-shielding layer 300 away from the array substrate 100, can encapsulate and protect the light-emitting device 200, reducing the risk of external moisture eroding the light-emitting device 200. Since the composite film layer 400 is formed by stacking a filler layer 410 and a decorative layer 420, the filler layer 410 and the decorative layer 420 can be stacked and set before processing the display panel 100 to successfully prepare the composite film layer 400; then, during the manufacturing process of the display panel 100, the prepared composite film layer 400 only needs to be pressed onto the side of the light-emitting device 200 and the light-shielding layer 300 away from the array substrate 100 to protect the light-emitting device 200, achieving rapid encapsulation of the light-emitting device 200. As described above, since the composite film layer 400 can be pre-prepared, encapsulating the light-emitting device 200 with the composite film layer 400 is simpler, more time-saving, and more labor-saving than printing a transparent encapsulation layer on the surface of the light-emitting device 200, and is more conducive to improving the manufacturing efficiency of the display panel 100.

[0044] In summary, the display panel 100 in this embodiment, through the above-mentioned settings, can simplify the packaging of the light-emitting device 200, making the packaging of the light-emitting device 200 more time-saving and labor-saving.

[0045] Please see Figures 2 to 11 In some embodiments, the filling layer 410 is located on the side of the light-shielding layer 300 away from the array substrate 100, and on the side of the light-emitting device 200 away from the array substrate 100; the decorative layer 420 is located on the side of the filling layer 410 along the thickness direction of the array substrate 100.

[0046] In this embodiment, the display panel 100, by placing the filling layer 410 on the side of the light-shielding layer 300 away from the array substrate 100 and the side of the light-emitting device 200 away from the array substrate 100, can encapsulate and protect the light-emitting device 200, reducing the risk of external moisture eroding the light-emitting device 200.

[0047] Please see Figures 2 to 11 In some embodiments, the filler layer 410 has a groove (not shown) on the side facing the decorative layer 420, within which the decorative layer 420 is located. Optionally, it includes multiple grooves, with at least two partially adjacent grooves communicating with each other.

[0048] In this embodiment, the display panel 100, by providing the filling layer 410 on the side facing the decorative layer 420, allows the decorative layer 420 to be better held between the filling layer 410 and the film layer located on the side of the filling layer 410 facing the decorative layer 420.

[0049] Please see Figures 2 to 11 In some embodiments, the distance D1 between the side of the light-emitting device 200 facing away from the array substrate 100 and the array substrate 100 is greater than the distance D2 between the side of the light-shielding layer 300 facing away from the array substrate 100 and the array substrate 100. The filling layer 410 is located on the outer periphery of the side of the light-emitting device 200 facing away from the array substrate 100, and the light-shielding layer 300 is at least partially located on the outer periphery of the side of the light-emitting device 200 close to the array substrate 100.

[0050] In this embodiment, the display panel 100 has a distance D1 between the side of the light-emitting device 200 facing away from the array substrate 100 and the array substrate 100, which is greater than the distance D2 between the side of the light-shielding layer 300 facing away from the array substrate 100 and the array substrate 100. This allows the side of the light-emitting device 200 facing away from the array substrate 100 to extend beyond the light-shielding layer 300. By providing a filling layer 410 located both on the side of the light-emitting device 200 facing away from the array substrate 100 and on the outer periphery of the side of the light-emitting device 200 facing away from the array substrate 100, the filling layer 410 completely encapsulates the light-emitting device 200 extending beyond the light-shielding layer 300, thereby better encapsulating the light-emitting device 200 and reducing the risk of external moisture eroding the light-emitting device 200 extending beyond the light-shielding layer 300.

[0051] Please see Figures 2 to 11 In some embodiments, the filler layer 410 is bonded to the light-emitting device 200.

[0052] In this embodiment, the display panel 100 can prevent the filling layer 410 from falling off by bonding the filling layer 410 to the light-emitting device 200, thereby allowing the filling layer 410 to better encapsulate the light-emitting device 200.

[0053] Please see Figures 2 to 4 ,as well as Figures 7 to 9 In some embodiments, the decorative layer 420 is located on the side of the fill layer 410 facing away from the array substrate 100.

[0054] In this embodiment, the display panel 100 has a decorative layer 420 disposed on the side of the filling layer 410 away from the array substrate 100, so that the filling layer 410 supports the decorative layer 420. In this way, the decorative layer 420 can be sandwiched between the filling layer 410 and the film layer located on the side of the filling layer 410 away from the array substrate 100.

[0055] Please see Figures 2 to 4 ,as well as Figures 7 to 9In some embodiments, the composite film layer 400 further includes an adhesive layer 430, a portion of which is located on the side of the filler layer 410 away from the array substrate 100 and is bonded to the filler layer 410; another portion of which is located on the side of the decorative layer 420 away from the array substrate 100 and is bonded to the decorative layer 420.

[0056] In this embodiment, the display panel 100 has a portion of adhesive layer 430 bonded to the side of filler layer 410 facing away from array substrate 100, and another portion bonded to the side of decorative layer 420 facing away from array substrate 100. This allows the adhesive layer 430 to seal the decorative layer 420 inside, thereby better encapsulating the decorative layer 420 and reducing the risk of external moisture eroding the decorative layer 420. Furthermore, when a film layer 800 is provided on the side of adhesive layer 430 facing away from filler layer 410, the adhesive layer 430 can also bond both filler layer 410 and decorative layer 420 to the film layer 800.

[0057] Please see Figures 2 to 4 ,as well as Figures 7 to 9 In some embodiments, the thickness of the adhesive layer 430 is less than or equal to 75 μm. Optionally, the thickness of the filler layer 410 is less than or equal to 75 μm.

[0058] In this embodiment, by making the thickness of the adhesive layer 430 less than or equal to 75 μm, the thickness of the composite film layer 400 can be reduced, thereby making the composite film layer 400 thinner. Similarly, by making the thickness of the filler layer 410 less than or equal to 75 μm, it is also beneficial to make the composite film layer 400 thinner.

[0059] Please see Figures 2 to 4 ,as well as Figures 7 to 9 In some embodiments, the refractive index n1 of the adhesive layer 430 is less than the refractive index n2 of the filler layer 410.

[0060] In this embodiment, the display panel 100 improves its light emission performance by setting the refractive index n1 of the adhesive layer 430 to be less than the refractive index n2 of the filler layer 410. Preferably, the difference between the refractive index n2 of the filler layer 410 and the refractive index n1 of the adhesive layer 430 is between 0.3 and 0.4. More preferably, the refractive index n2 of the filler layer 410 is between 1.6 and 1.7. More preferably, the refractive index n1 of the adhesive layer 430 can be 1, which can further increase the difference between the refractive index n2 of the filler layer 410 and the refractive index n1 of the adhesive layer 430.

[0061] Please see Figure 2 , Figure 5 and Figure 6 ,as well as Figure 7 , Figure 10 and Figure 11In some embodiments, the decorative layer 420 is located between at least one of the light-emitting device 200 and the light-shielding layer 300 and the filling layer 410.

[0062] Optionally, the filling layer 410 is located on the side of the light-emitting device 200 away from the array substrate 100, and at least one layer is provided on the side closer to the light-emitting device 200.

[0063] Optionally, the filling layer 410 is located on the side of the light-shielding layer 300 away from the array substrate 100, and at least one is provided on the side close to the light-shielding layer 300.

[0064] In this embodiment, the display panel 100 has a decorative layer 420 located between the light-emitting device 200 and the filling layer 410. This allows the decorative layer 420 to decorate the surface of the light-emitting device 200 near the filling layer 410 when the light-emitting device 200 stops emitting light. Specifically, when the display panel 100 is off, the decorative layer 420 located between the light-emitting device 200 and the filling layer 410 will display a pattern effect.

[0065] Similarly, by setting the decorative layer 420 between the light-shielding layer 300 and the filling layer 410, the decorative layer 420 can decorate the surface of the light-shielding layer 300 near the filling layer 410 when the light-emitting device 200 stops emitting light. Specifically, when the display panel 100 is off, the decorative layer 420 between the light-shielding layer 300 and the filling layer 410 will present a pattern effect.

[0066] Please see Figure 2 , Figure 5 and Figure 6 ,as well as Figure 7 , Figure 10 and Figure 11 In some embodiments, at least a portion of the decorative layer 420 is located on the outer periphery of the light-emitting device 200 on the side opposite to the array substrate 100. Optionally, at least a portion of the decorative layer 420 surrounds the outer periphery of the light-emitting device 200 on the side opposite to the array substrate 100.

[0067] Optionally, the decorative layer 420 is located on the outer periphery of the light-emitting device 200 on the side opposite to the array substrate 100, and at least one is provided on the side close to the outer periphery of the light-emitting device 200.

[0068] In this embodiment, the display panel 100 has a decorative layer 420 located on the outer periphery of the side of the light-emitting device 200 facing away from the array substrate 100. This allows the decorative layer 420 to decorate the outer periphery of the side of the light-emitting device 200 facing away from the array substrate 100 when the light-emitting device 200 stops emitting light. Specifically, when the display panel 100 is off, the decorative layer 420 located on the outer periphery of the side of the light-emitting device 200 facing away from the array substrate 100 will display a pattern effect.

[0069] Please see Figures 3 to 6 ,as well as Figures 8 to 11 In some embodiments, the refractive index n2 of the filling layer 410 is less than the refractive index n3 of the light-shielding layer 300.

[0070] In this embodiment, the display panel 100 improves its light emission effect by setting the refractive index n2 of the filling layer 410 to be less than the refractive index n3 of the light-shielding layer 300. Optionally, the difference between the refractive index n3 of the light-shielding layer 300 and the refractive index n2 of the filling layer 410 is between 0.1 and 0.4.

[0071] Please see Figures 3 to 6 ,as well as Figures 8 to 11 In some embodiments, when the light-emitting device 200 emits light, the decorative layer 420 is invisible; when the light-emitting device 200 stops emitting light, the decorative layer 420 is visible and presents a patterned effect.

[0072] In this embodiment, the display panel 100 is configured such that when the light-emitting device 200 stops emitting light, the decorative layer 420 is visible and displays a pattern effect, so that the display panel 100 can display a certain pattern effect when the screen is off.

[0073] Optionally, the decorative layer 420 may be made of colored ink or black ink.

[0074] Please see Figures 3 to 6 ,as well as Figures 8 to 11 In some embodiments, the light-shielding layer 300 includes at least one of a white light-shielding layer 300, a gray light-shielding layer 300, and a black light-shielding layer 300.

[0075] In this embodiment, the display panel 100 is provided with a light-shielding layer 300, which includes at least one of a white light-shielding layer 300, a gray light-shielding layer 300, and a black light-shielding layer 300. This allows the light-shielding layer 300 to better block the light emitted from the light-emitting surface of the display panel 100 onto the array substrate 100, preventing external light from hitting the array substrate 100 and being reflected by the metal wires in the array substrate 100. This reduces the reflection of external light by the display panel 100 and improves the display effect of the display panel 100.

[0076] Please see Figures 2 to 11In some embodiments, the composite film layer 400 covers the array substrate 100 along the thickness direction of the display panel 10. The display panel 10 includes an encapsulation structure 500, which surrounds the array substrate 100 and the light-shielding layer 300. The encapsulation structure 500 is bonded to a portion of the surface of the composite film layer 400 facing the array substrate 100. Specifically, a portion of the surface of the composite film layer 400 facing the array substrate 100 is bonded to the light-emitting device 200 and the light-shielding layer 300, and another portion is bonded to the encapsulation structure 500.

[0077] In this embodiment, the display panel 100, by surrounding the array substrate 100 and the light-shielding layer 300 with the encapsulation structure 500, can prevent external moisture from eroding the light-shielding layer 300 and the array substrate 100 from their outer periphery. By providing a composite film layer 400 to cover the array substrate 100, and bonding the encapsulation structure 500 to a portion of the composite film layer 400 facing the array substrate 100, the encapsulation structure 500 can support the portion of the composite film layer 400 extending beyond the array substrate 100, thereby reducing air bubbles generated when the composite film layer 400 is pressed against the light-emitting device 200 and the light-shielding layer 300.

[0078] It should be further explained that the above-mentioned "composite film layer 400 covers array substrate 100" means that the composite film layer 400 and the array substrate 100 at least partially overlap, or the composite film layer 400 completely covers the array substrate 100.

[0079] Optionally, the encapsulation structure 500 includes an encapsulation filler layer 510, which surrounds the outer periphery of the array substrate 100 and the light-shielding layer 300. The encapsulation filler layer 510 is bonded to the surface of a portion of the composite film layer 400 facing the array substrate 100. It should be noted that the encapsulation filler layer 510 can be fabricated using a single filling or multiple filling methods during the filling process.

[0080] Please see Figures 3 to 6 ,as well as Figures 8 to 11 In some embodiments, the composite film layer 400 covers the encapsulation structure 500 along the thickness direction of the display panel 10. Specifically, the composite film layer 400 covers the encapsulation fill layer 510 of the encapsulation structure 500 along the thickness direction of the display panel 10.

[0081] In this embodiment, the display panel 100 can be made flush with the outer periphery of the encapsulation structure 500 by setting a composite film layer 400 to cover the encapsulation structure 500. This reduces the difficulty of setting a side light-shielding layer 600 on the outer periphery of the encapsulation structure 500 and the outer periphery of the composite film layer 400.

[0082] Optionally, at least one side of the outer periphery of the packaging structure 500 along the first direction V1 is perpendicular to one side of the array substrate 100 along its own thickness direction.

[0083] Optionally, at least one side of the outer periphery of the packaging structure 500 along the second direction V2 is perpendicular to one side of the array substrate 100 along its own thickness direction. The second direction V2 is perpendicular to the first direction V1, and the second direction V2 is perpendicular to the thickness direction of the array substrate 100.

[0084] Optionally, the display panel 10 includes a connection trace 700, which is at least partially located between the peripheral wall of the array substrate 100 and the encapsulation filling layer 510. The connection trace 700 is used to electrically connect the light-emitting device 200 and a circuit board (not shown) located on the side of the array substrate 100 opposite to the light-emitting device 200 layer.

[0085] Optionally, the connection trace 700 is located on the side of the array substrate 100 near the light-emitting device 200, on the peripheral wall of the array substrate 100, and on the side of the array substrate 100 away from the light-emitting device 200. The connection trace 700 on the side of the array substrate 100 near the light-emitting device 200 is located between the array substrate 100 and the light-shielding layer 300.

[0086] Optionally, the packaging structure 500 includes a wiring packaging layer 520, which is located on the side of the array substrate 100 away from the light-emitting device 200, and a connection trace 700 on the side of the array substrate 100 away from the light-emitting device 200 is located between the wiring packaging layer 520 and the array substrate 100.

[0087] Optionally, the connecting trace 700 is located on one side surface of the peripheral wall of the array substrate 100 along the first direction V1, and the first direction V1 intersects the arrangement direction of the array substrate 100 and the light-emitting device 200.

[0088] Optionally, the package structure 500 includes a trace protection layer 530, which is located between the package filling layer 510 and the connection traces 700 on the peripheral wall of the array substrate 100, and covers the connection traces 700 on the peripheral wall of the array substrate 100.

[0089] Please see Figures 3 to 6 ,as well as Figures 8 to 11 In some embodiments, the display panel 10 includes a side light-shielding layer 600, which surrounds the outer periphery of the encapsulation structure 500 and the composite film layer 400.

[0090] In this embodiment, the display panel 100 has a side light-shielding layer 600 around the outer periphery of the encapsulation structure 500 and the composite film layer 400. This can block the light emitted by the light-emitting device 200 from leaking from the outer periphery of the encapsulation structure 500 and the composite film layer 400 to the outside of the display panel 100, thereby reducing light leakage around the outer periphery of the encapsulation structure 500 and the composite film layer 400 and reducing the visibility of the edges of the display panel 100.

[0091] Optionally, the side light-shielding layer 600 is bonded to the outer periphery of the encapsulation structure 500 and the composite film layer 400. Specifically, the side light-shielding layer 600 is bonded to the outer periphery of the encapsulation filler layer 510 of the encapsulation structure 500 and the outer periphery of the composite film layer 400.

[0092] Optionally, the side light-shielding layer 600 is located on the side of the encapsulation structure 500 opposite to the composite film layer 400.

[0093] Optionally, the side light-shielding layer 600 is bonded to the side of the encapsulation structure 500 opposite to the composite film layer 400. Specifically, the side light-shielding layer 600 is bonded to the side of the encapsulation filler layer 510 of the encapsulation structure 500 opposite to the composite film layer 400.

[0094] Optionally, the display panel 100 includes a film layer 800 located on the side of the filler layer 410 facing away from the array substrate 100, and the film layer 800 is bonded to the array substrate 100. Optionally, the film layer 800 is configured as a cover plate.

[0095] Optionally, the side light-shielding layer 600 is located on the side of the film layer 800 facing away from the array substrate 100.

[0096] Optionally, the side light-shielding layer 600 is bonded to the side of the film layer 800 facing away from the array substrate 100.

[0097] Optionally, the side shading layer 600 includes a black side shading layer.

[0098] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of a display device 1 according to an embodiment of this application. An embodiment of this application provides a display device 1, which includes a display panel 10.

[0099] In this embodiment, the display device 1, by placing the composite film layer 400 on the side of the light-emitting device 200 and the light-shielding layer 300 away from the array substrate 100, can encapsulate and protect the light-emitting device 200, reducing the risk of external moisture eroding the light-emitting device 200. Since the composite film layer 400 is formed by stacking a filler layer 410 and a decorative layer 420, the filler layer 410 and the decorative layer 420 can be stacked before processing the display panel 100 to successfully prepare the composite film layer 400; then, during the manufacturing process of the display panel 100, the prepared composite film layer 400 only needs to be pressed onto the side of the light-emitting device 200 and the light-shielding layer 300 away from the array substrate 100 to protect the light-emitting device 200, achieving rapid encapsulation of the light-emitting device 200. As described above, since the composite film layer 400 can be pre-prepared, encapsulating the light-emitting device 200 with the composite film layer 400 is simpler, more time-saving, and more labor-saving than printing a transparent encapsulation layer on the surface of the light-emitting device 200, and is more conducive to improving the manufacturing efficiency of the display panel 100.

[0100] In summary, the display device 1 in this embodiment, through the above-mentioned settings, can simplify the packaging of the light-emitting device 200, making the packaging of the light-emitting device 200 more time-saving and labor-saving.

[0101] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0102] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: Array substrate; A light-emitting device is located on one side of the array substrate; A light-shielding layer is located on the same side of the array substrate as the light-emitting device, and is at least partially located on the outer periphery of the light-emitting device; A composite film layer is located on the side of the light-emitting device and the light-shielding layer that is away from the array substrate. The composite film layer includes a filler layer and a decorative layer stacked along the thickness direction of the array substrate.

2. The display panel according to claim 1, characterized in that, The filling layer is located on the side of the light-shielding layer opposite to the array substrate, and on the side of the light-emitting device opposite to the array substrate; the decorative layer is located on the side of the filling layer along the thickness direction of the array substrate.

3. The display panel according to claim 1 or 2, characterized in that, The filling layer has a groove on the side facing the decorative layer, and the decorative layer is located in the groove.

4. The display panel according to claim 1 or 2, characterized in that, The distance between the side of the light-emitting device facing away from the array substrate and the array substrate is greater than the distance between the side of the light-shielding layer facing away from the array substrate and the array substrate. The filling layer is located on the outer periphery of the light-emitting device on the side away from the array substrate, and the light-shielding layer is at least partially located on the outer periphery of the light-emitting device on the side closer to the array substrate.

5. The display panel according to claim 1 or 2, characterized in that, The filler layer is bonded to the light-emitting device.

6. The display panel according to claim 1 or 2, characterized in that, The decorative layer is located on the side of the filler layer opposite to the array substrate.

7. The display panel according to claim 6, characterized in that, The composite film layer further includes an adhesive layer, a portion of which is located on the side of the filler layer opposite to the array substrate and is bonded to the filler layer; another portion of the adhesive layer is located on the side of the decorative layer opposite to the array substrate and is bonded to the decorative layer.

8. The display panel according to claim 7, characterized in that, The thickness of the adhesive layer is less than or equal to 75 μm.

9. The display panel according to claim 7, characterized in that, The refractive index of the adhesive layer is less than that of the filler layer.

10. The display panel according to claim 1 or 2, characterized in that, The decorative layer is located between at least one of the light-emitting device and the light-shielding layer and the filling layer.

11. The display panel according to claim 10, characterized in that, At least a portion of the decorative layer is located on the outer periphery of the light-emitting device on the side opposite to the array substrate.

12. The display panel according to claim 1 or 2, characterized in that, The refractive index of the filling layer is less than that of the light-shielding layer.

13. The display panel according to claim 1 or 2, characterized in that, When the light-emitting device emits light, the decorative layer is invisible; when the light-emitting device stops emitting light, the decorative layer becomes visible and displays a pattern effect.

14. The display panel according to claim 1 or 2, characterized in that, The light-shielding layer includes at least one of a white light-shielding layer, a gray light-shielding layer, and a black light-shielding layer.

15. The display panel according to claim 1 or 2, characterized in that, Along the thickness direction of the display panel, the composite film layer covers the array substrate; The display panel includes an encapsulation structure surrounding the outer periphery of the array substrate and the light-shielding layer, and the encapsulation structure is bonded to a portion of the composite film layer on the side facing the array substrate.

16. The display panel according to claim 15, characterized in that, The composite film layer covers the encapsulation structure along the thickness direction of the display panel.

17. The display panel according to claim 15, characterized in that, The display panel includes a side light-shielding layer, which surrounds the outer periphery of the encapsulation structure and the composite film layer.

18. A display device, characterized in that, The display device includes the display panel as described in any one of claims 1-17.

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