Cold and hot switching device and cooling instrument

Abstract

The invention provides a cold and hot switching device and a cooling instrument, and the device comprises a treatment liquid water tank which is internally provided with treatment liquid; the transduction assembly is provided with two opposite binding faces, one of the two binding faces is used for refrigerating or heating, the other binding face is used for heating or refrigerating, and the other binding face is attached to the treatment liquid water tank in a heat conduction mode; the cold and heat source module is attached to the other attaching face in a heat conduction mode and used for dissipating heat or heating the transduction assembly through the other attaching face. And the controller is used for controlling the heat dissipation intensity or the heating intensity of the cold and heat source module according to the temperature data of the two binding surfaces, so that the temperature difference between the two binding surfaces is within a preset range, and the two binding surfaces are controlled to exchange functions when a mode switching instruction is received. According to the method and the device, rapid switching of two-side refrigerating and heating functions of the transduction assembly is realized, the mode switching waiting time is shortened, and the temperature control response speed is increased.

Description

Technical Field

[0001] This application relates to the field of medical technology, and more specifically, to a hot and cold switching device and a cooling device. Background Technology

[0002] A thermoelectric semiconductor cooler (or simply cooler) is an electronic component that utilizes the Peltier effect to achieve a heat pump function. Its typical structure consists of semiconductor particles sandwiched between two ceramic substrates. When a direct current is applied, one side absorbs heat to form a cooling surface, while the other side dissipates heat to form a heating surface. Heat transfer is achieved through a metal conductor connection. Based on this characteristic, thermoelectric coolers are widely used in cryotherapy devices, and the cooling and heating functions can be interchanged by switching the electrode orientation.

[0003] However, in practical applications, thermoelectric coolers have inherent drawbacks when switching electrodes. Because the temperature difference between the two sides of the cooler is significant (up to tens of degrees Celsius) during operation, thermal inertia prevents the temperature field from being instantaneously reconstructed. When switching electrode polarities, the original cooling surface must become the heating surface, and vice versa, but the inherent temperature difference between the two sides slows down the temperature reversal process. Forcing a switch when the temperature difference is large not only results in a slow switching response but may also affect the component's lifespan due to thermal stress. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide a hot and cold switching device and a cooling device, which aims to overcome at least one of the above-mentioned defects.

[0005] In a first aspect, this application provides a hot / cold switching device, comprising: A treatment fluid tank, wherein the treatment fluid tank contains a treatment fluid; A transducer assembly having two mating surfaces arranged opposite each other, one of the mating surfaces being used for cooling or heating, and the other mating surface being used for heating or cooling, wherein the mating surface is thermally mated to the treatment fluid tank. The heat source module is thermally bonded to the other bonding surface, and is used to dissipate heat or heat the transducer component through the other bonding surface. The controller is used to control the heat dissipation intensity or heating intensity of the heat source module based on the temperature data of the two bonding surfaces, so that the temperature difference between the two bonding surfaces is within a preset range, so as to control the function of the two bonding surfaces to switch when a mode switching command is received.

[0006] Preferably, the treatment fluid tank comprises: The box contains a treatment solution. A first circulating pump, the inlet of which is connected to the housing, and the outlet of which is connected to a medical terminal.

[0007] Preferably, the cold / heat source module includes: A water cooling head, wherein the water cooling head is thermally bonded to the other contact surface; A heat dissipation circulating fluid tank, wherein the heat dissipation circulating fluid tank contains a heat dissipation circulating medium; The second circulation pump has its inlet connected to the heat dissipation circulating liquid tank and its outlet connected to the water cooling head.

[0008] Preferably, the transducer assembly includes: Multiple cooling elements are arranged in an array between the treatment fluid tank and the cold / heat source module. A control circuit, electrically connected to the plurality of cooling chips and the controller, is used to control the direction and magnitude of the current flowing through the plurality of cooling chips.

[0009] Preferably, the control circuit includes: An H-bridge circuit, electrically connected to the plurality of cooling chips, is used to switch the direction of current flowing through the plurality of cooling chips in response to instructions from the controller. A protection circuit, electrically connected to the enable terminal of the H-bridge circuit, is used to disconnect the output of the H-bridge circuit when the temperature of the plurality of cooling chips exceeds a threshold. A current acquisition circuit is connected in series between the H-bridge circuit and the plurality of cooling chips to acquire current data flowing through the cooling chips and feed it back to the controller.

[0010] Preferably, it further includes: Temperature sensors are disposed on the two bonding surfaces to collect temperature data from the two bonding surfaces and feed it back to the controller.

[0011] Preferably, the cold / heat source module further includes: The heat sink is attached to the water cooling head.

[0012] Secondly, this application provides a cooling device, comprising: case; The hot / cold switching device as described in the first aspect is disposed inside the housing; A medical terminal is connected to the treatment fluid tank of the hot and cold switching device for heat exchange with the user.

[0013] Preferably, it further includes: A heat dissipation system is installed inside the housing to dissipate heat from the cooling and heating switching device.

[0014] Preferably, it further includes: An interactive interface, electrically connected to the controller of the hot and cold switching device, is used to receive user commands and display the device's operating status.

[0015] This application provides a cooling / heating switching device and a cooling instrument, comprising: a treatment fluid tank containing treatment fluid; a transducer having two opposing contact surfaces, one of which is used for cooling or heating, and the other for heating or cooling, with one contact surface thermally bonded to the treatment fluid tank; a heat source module thermally bonded to the other contact surface for dissipating heat or heating the transducer through the other contact surface; and a controller for controlling the heat dissipation or heating intensity of the heat source module based on the temperature data of the two contact surfaces, ensuring the temperature difference between the two contact surfaces is within a preset range, and controlling the function switching of the two contact surfaces upon receiving a mode switching command. This application achieves rapid switching between cooling and heating functions on both sides of the transducer, shortening the mode switching waiting time and improving temperature control response speed.

[0016] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is one of the structural schematic diagrams of a cooling and heating switching device provided in the embodiments of this application; Figure 2 This is a second schematic diagram of the structure of a cooling and heating switching device provided in an embodiment of this application; Figure 3 This is a schematic diagram of the control circuit provided in an embodiment of this application. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. Based on the embodiments of this application, every other embodiment obtained by those skilled in the art without inventive effort falls within the scope of protection of this application.

[0020] First, the applicable scenarios for this application will be introduced. This application can be applied to the field of medical technology.

[0021] Research has shown that pediatric physical cooling devices are medical devices that help lower the body temperature of children with fever through physical means. Their working principle typically utilizes a circulating, low-temperature liquid that exchanges heat with the child's body through a medical terminal (such as a forehead patch, abdominal binder, or blanket pad) in contact with the child's skin, thus achieving a safe and gentle cooling effect. Compared to medication for fever reduction, physical cooling methods have no drug side effects and are especially suitable for children who are sensitive to medication or require continuous monitoring.

[0022] The core temperature control element of such devices often uses thermoelectric semiconductor cooling chips. A thermoelectric cooling chip is an electronic component that utilizes the Peltier effect to achieve a heat pump function. Its typical structure consists of semiconductor particles sandwiched between two ceramic substrates. When direct current is applied, one side absorbs heat to form a cooling surface, while the other side dissipates heat to form a heating surface. When the polarity of the connected electrodes is switched, the cooling and heating surfaces of the cooling chip interchange; the original cooling surface becomes the heating surface, and vice versa. This characteristic allows the cooling chip to switch between cooling and heating modes within the same device, meeting the needs of different treatment stages.

[0023] However, in practical applications, thermoelectric coolers have inherent defects when switching electrodes. Because the temperature difference between the two sides of the cooler is large (up to tens of degrees Celsius) during operation, thermal inertia prevents the temperature field from being instantaneously reconstructed. When switching electrode polarity, the original cooling surface must become the heating surface, and vice versa, but the inherent temperature difference between the two sides delays the temperature reversal process. Forcing a switch when the temperature difference is large not only results in a slow switching response but may also affect the component's lifespan due to thermal stress. Therefore, in existing technologies, when switching operating modes, thermoelectric coolers often need to wait for the temperature difference between the two sides to naturally decrease to a certain extent before switching electrodes. This waiting process significantly reduces the device's response speed, wastes valuable treatment time, and becomes a key technical bottleneck restricting the performance improvement of alternating hot and cold therapy devices.

[0024] Based on this, the present application provides a cooling and heating switching device and a cooling instrument, which aims to realize the rapid switching of cooling and heating functions on both sides of the transducer component, so as to shorten the mode switching waiting time and improve the temperature control response speed.

[0025] Please see Figure 1 , Figure 1 This is one of the structural schematic diagrams of a cooling and heating switching device provided in an embodiment of this application. Figure 1 As shown in the figure, the hot and cold switching device 100 provided in this application embodiment includes: a treatment fluid tank 2, a transducer 3, a hot and cold source module 4, and a controller 1.

[0026] The treatment fluid tank 2 contains a treatment fluid that is circulated and transported to the medical terminal for heat exchange with the user, thereby cooling or heating the target area. The treatment fluid tank 2 is preferably made of a material with good thermal conductivity, such as copper, to improve heat transfer efficiency.

[0027] The transducer assembly 3 has two opposing contact surfaces, namely a first contact surface and a second contact surface. The first contact surface is used for cooling or heating the treatment fluid tank 2, while the second contact surface is used for heating or cooling; that is, the two contact surfaces have opposite and interchangeable functions. The first contact surface is thermally bonded to the treatment fluid tank 2, and thermally conductive silicone grease is applied between them to ensure efficient heat conduction.

[0028] The heat source module 4 is thermally bonded to the second bonding surface, also tightly bonded by thermally conductive silicone grease. This module is used to dissipate heat or heat the transducer component 3 through the second bonding surface, that is, to actively adjust the temperature of the second bonding surface according to the requirements of the working mode.

[0029] Controller 1 is electrically connected to temperature sensors located on the first and second bonding surfaces. Controller 1 controls the heat dissipation or heating intensity of the heat source module 4 based on real-time temperature data from the first and second bonding surfaces, thereby dynamically maintaining the temperature difference between the two bonding surfaces within a preset range. When controller 1 receives a mode switching command (such as switching from cooling to heating), since the temperature difference between the two bonding surfaces has already been controlled within a small range, controller 1 can directly control the two bonding surfaces to switch functions without waiting for the temperature difference to naturally decrease, thus achieving rapid switching of the transducer component 3's operating mode.

[0030] In this embodiment of the application, in order to achieve precise control and multiple protections, various acquisition units are also provided and electrically connected to the controller 1 for real-time monitoring of the equipment's operating status.

[0031] Specifically, the data acquisition unit includes: a pressure acquisition module, installed on the treatment fluid pipeline, used to collect pressure data of the treatment water circuit, so that the controller 1 can trigger protection or adjustment commands when the water circuit is abnormal; a water temperature acquisition module, installed in the treatment fluid tank 2 or pipeline, used to collect the temperature of the treatment fluid, providing a basis for precise temperature control; a water level acquisition module, installed in the treatment fluid tank 2, used to monitor whether the water level is sufficient, triggering water replenishment or an alarm when it is too low; a hot end temperature sensor, attached to the second bonding surface, used to collect the temperature of this surface to assist in heat dissipation control; and a cold end temperature sensor, attached to the first bonding surface, used to collect the temperature of this surface to assist in power adjustment. In addition, a body temperature acquisition module is used to collect the user's body temperature, enabling the controller 1 to dynamically adjust the cooling strategy according to the degree of fever. The controller 1 receives all the above-mentioned acquired data, analyzes and processes it, and then sends control commands to each execution unit to realize automated functions such as temperature regulation, water circuit circulation control, and fault protection.

[0032] In this embodiment, the treatment fluid tank 2 includes a tank body 201 and a first circulation pump.

[0033] The chamber contains a treatment fluid; the inlet of the first circulation pump is connected to the chamber, and the outlet of the first circulation pump is connected to the medical terminal. The controller 1 controls the first circulation pump to drive the treatment fluid to circulate between the chamber and the medical terminal for continuous heat exchange.

[0034] In this embodiment, the heat source module 4 includes a water cooling head 401, a heat dissipation circulating liquid tank 402, and a second circulation pump.

[0035] The water-cooling head 401 is thermally bonded to the second contact surface of the transducer assembly 3; the heat dissipation circulation tank 402 contains a heat dissipation circulation medium, which is used to absorb or provide heat; the inlet of the second circulation pump is connected to the heat dissipation circulation tank 402, and the outlet of the second circulation pump is connected to the water-cooling head 401. The controller 1 controls the second circulation pump to drive the heat dissipation circulation medium to circulate between the heat dissipation circulation tank 402 and the water-cooling head 401, so as to achieve continuous heat dissipation or heating of the second contact surface.

[0036] Please see Figure 2 , Figure 2This is a second schematic diagram of a cooling and heating switching device provided in an embodiment of this application. The cooling and heating source device is the cooling and heating source module 4 in this application, which is a cooling and heating module composed of multiple semiconductor cooling chips and is equipped with a control interface that can switch the electrodes of the semiconductor cooling chips. It is uniformly controlled by the controller 1. The water cooling head 401 and the heat dissipation circulating fluid tank 402 are connected by a flexible hose to achieve a flexible pipeline layout. The number of semiconductor cooling chips N≥1 can be freely combined and evenly distributed according to the size of the water cooling head 401. They are tightly attached between the treatment fluid tank 2 and the water cooling head 401 using thermally conductive silicone grease. The number of semiconductor cooling chips here can be cascaded, that is, the number of cooling chips can be increased or decreased according to the power requirements to achieve the purpose of efficient cooling or heating.

[0037] In addition, the heat source module 4 may also include a radiator connected to the heat dissipation circulating liquid tank 402 for forced heat dissipation of the circulating heat dissipation medium, for example, by using a condenser structure with a fan to further improve heat dissipation efficiency.

[0038] In this embodiment, the transducer assembly 3 includes multiple cooling elements and a control circuit. The multiple cooling elements are arranged in an array between the treatment fluid tank 2 and the heat source module 4, achieving greater cooling or heating power through cascading to meet different treatment needs. The control circuit is electrically connected to the multiple cooling elements and the controller 1, and is used to respond to commands from the controller 1 to control the direction and magnitude of the current flowing through the multiple cooling elements, thereby precisely adjusting the operating state of the transducer assembly 3.

[0039] Please see Figure 3 , Figure 3 This is a schematic diagram of the control circuit provided in an embodiment of this application. The control circuit specifically includes three parts: an H-bridge circuit, a protection circuit, and a current acquisition circuit. Through dual hardware and software protection, it achieves precise control and safety protection of the cooling chip.

[0040] The H-bridge circuit is electrically connected to multiple thermoelectric coolers and is used to switch the direction of current flowing through the coolers in response to commands from controller 1. This circuit outputs two PWM signals, PWM1A and PWM1B, from a microcontroller to control an IR2184 half-bridge driver chip, which in turn drives the H-bridge composed of two dual NMOS transistors. The principle of PWM (Pulse Width Modulation) control is to determine the output voltage by using the ratio of the high-level duration of the PWM signal to the entire cycle (i.e., the duty cycle). By adjusting the duty cycle, not only can the polarity of the thermoelectric coolers be controlled (forward or reverse rotation), but the output voltage and power can also be precisely controlled, achieving continuous adjustment of cooling or heating intensity, avoiding energy waste, and reducing system energy consumption.

[0041] Specifically, the H-bridge circuit consists of two half-bridge driver chips and four N-channel MOSFETs. C73 and C84 are filter capacitors used to smooth the voltage; D24 and D23 are reverse-connection protection diodes to prevent reverse current from burning out the control section; E2 and E4 are bootstrap capacitors used to drive the upper bridge arm MOSFETs; R87, R88, R89, and R90 are series damping resistors used to reduce gate-source oscillations; D25, D26, D27, and D28 are acceleration diodes used to accelerate the turn-off speed of the MOSFETs. The half-bridge driver chip uses the IR2184, enabled with high activity; the N-channel MOSFETs use Infineon IRFB7534PBF, which features low on-resistance and high switching speed.

[0042] The operating logic of the H-bridge circuit is as follows: When the enable signal SD1 is high, the control circuit outputs an effective signal. If PWM1A is high and PWM1B is low, then the HO output of chip U6 is high and the LO output is low, while the HO output of chip U7 is low and the LO output is high. This causes Q38 and Q41 to conduct, and Q40 and Q39 to be cut off. Current flows from the left A+ to the right A- through the cooling chip, corresponding to the cooling mode. If PWM1A is low and PWM1B is high, then Q38 and Q41 are cut off, and Q40 and Q39 are conducted. Current flows from the left A- to the right A+ through the cooling chip, corresponding to the heating mode. When the enable signal SD1 is low, the control circuit does not output, and all MOSFETs are turned off.

[0043] The protection circuit is electrically connected to the enable terminal of the H-bridge circuit, used to forcibly disconnect the H-bridge output when the temperature of transducer 3 exceeds a threshold. This embodiment uses two KSD9700 temperature control switches, respectively installed on the water cooling head 401 and / or the treatment fluid tank 2, making thermal contact with the two contact surfaces. The temperature control switches are normally closed, remaining closed (high level) below 60℃. When the temperature of either contact surface exceeds 70℃, the corresponding temperature control switch opens (low level). The two temperature control switches are connected to ports P6 and P7 respectively, and then connected to the AND gate chip SN74LVC2G08DCUR via series resistors R95 and R100. C93 is a filter capacitor used to eliminate signal jitter. The output pin 7 of the AND gate chip is connected to the enable pin SD1 of the IR2184 half-bridge driver chip. According to the truth table of the AND gate, if either of the two temperature protection switches opens when the temperature exceeds 70℃, it will be at a low level. At this time, SD1 will be at a low level, forcibly disabling the H-bridge output and achieving hardware-level fast protection.

[0044] The current acquisition circuit is connected in series with multiple thermoelectric coolers to collect the current data flowing through the coolers and feed it back to controller 1. In this embodiment, a sampling resistor R101 with a resistance of 0.05Ω is connected in series in the power supply circuit of the thermoelectric coolers. When current flows through R101, a small voltage drop U1=I×R is generated across it. This voltage signal is amplified by an amplification circuit consisting of an operational amplifier LM358 and external resistors R93, R94, R91, and R92. The amplification factor is calculated as β=(5.1 / 3.3+1)×(7.5 / 3.3+1)=8.22. C95 and C94 are filter capacitors used to filter out high-frequency noise. The amplified voltage U=β×U1 is input to the ADC pin of controller 1. For example, when the current flowing through R101 is I=5A, U1=5×0.05=0.25V, and after amplification, U=8.22×0.25=2.055V. Controller 1 can deduce the current actual current by reading the voltage value. Controller 1 has a preset current limit value. When the collected voltage value exceeds the corresponding threshold, controller 1 immediately performs protection actions, such as pulling down the PWM signal or enable signal, or cutting off the H-bridge output.

[0045] Through the aforementioned triple protection mechanism—temperature sensor monitoring, hardware temperature control switch protection, and current acquisition protection—this embodiment can promptly interrupt the output when any abnormal condition is triggered, ensuring the safety of equipment operation, and is especially suitable for sensitive groups such as children. The temperature sensor monitoring circuit works simultaneously with the protection circuit and the current acquisition circuit, with multiple monitoring methods operating in parallel, further enhancing the system's safety redundancy.

[0046] The synergistic effect of the above-mentioned components will be explained below in conjunction with the working principle of the embodiments of this application: In normal operation mode, controller 1 dynamically adjusts the working intensity of the heat source module 4 based on the real-time temperature data of the first and second bonding surfaces. For example, when the first bonding surface is used for cooling, the second bonding surface generates heat as the hot end. Controller 1 adjusts the heat dissipation intensity on the second bonding surface by controlling the speed of the second circulation pump or the fan speed of the radiator, so that the temperature of the second bonding surface is maintained within a reasonable range, thereby controlling the temperature difference between the two bonding surfaces within a preset range.

[0047] When a switch in operating mode is required, such as from cooling to heating, controller 1 first confirms that the current temperature difference between the two contact surfaces is within a preset range (because continuous adjustment has met the condition), and then sends a switching command to the H-bridge circuit of the control circuit. The H-bridge circuit responds to the command, instantly switching the direction of the current flowing through multiple cooling elements, changing the first contact surface from a cooling surface to a heating surface, and the second contact surface from a heating surface to a cooling surface. After the switch is completed, controller 1 continues to adjust the operating state of the cold and heat source modules 4 according to real-time temperature data to maintain the new temperature difference balance. The entire switching process is rapid and smooth, without waiting for the temperature difference to naturally decrease, significantly improving the device's response speed and therapeutic effect.

[0048] This embodiment of the application achieves rapid switching between cooling and heating functions on both sides of the transducer 3 by actively controlling the temperature difference within a preset range and cooperating with the rapid commutation function of the H-bridge circuit, thereby shortening the mode switching waiting time and improving the temperature control response speed.

[0049] This application also provides a cooling device, including: a housing, a cooling / heating switching device 100, a medical terminal, a heat dissipation system, and an interactive interface.

[0050] The housing serves as the external support structure for the cooling device, housing and protecting the internal functional components.

[0051] The hot and cold switching device 100 is located inside the housing. This hot and cold switching device 100 is the same as the hot and cold switching device 100 described in the foregoing embodiments, and specifically includes core components such as the treatment fluid tank 2, the transducer 3, the hot and cold source module 4, and the controller 1.

[0052] The medical terminal is connected to the treatment fluid tank 2 in the hot and cold switching device 100 via pipelines, forming a treatment fluid circulation loop. The medical terminal can take the form of a flexible patch, abdominal binder, blanket pad, or forehead patch, etc., and can directly contact the user's skin. It exchanges heat with the user through the treatment fluid flowing inside, achieving physical cooling or heating. The medical terminal can be selected with appropriate specifications and shapes according to different treatment sites.

[0053] The heat dissipation system is located inside the housing and is connected to the heat source module 4 in the heat exchanger 100. The heat dissipation system is used to dissipate heat from inside the housing to ensure that the hot end temperature of the transducer 3 is maintained within a reasonable range during operation. Specifically, the heat dissipation system can adopt a finned condenser structure with a fan. The fan accelerates airflow and dissipates the heat carried by the heat dissipation circulation medium to the outside of the housing, ensuring the continuous and stable operation of the heat exchanger 100.

[0054] The interactive interface is located on the housing and is electrically connected to the controller 1 in the cooling / heating switching device 100. The interface receives user input commands, such as target temperature settings, operating mode selection (cooling / heating), and start / stop control, and transmits these commands to the controller 1. Simultaneously, the interface displays real-time operating status information, including but not limited to the current treatment fluid temperature, user body temperature, system pressure, water level, operating mode, and fault alarms, allowing medical personnel or users to intuitively understand the device's operation and perform necessary manual operations. The interactive interface can be implemented using a touchscreen, a keypad, or an LCD screen combined with buttons.

[0055] In the embodiments of this application, through the coordinated operation of the above-mentioned parts, the cooling device can quickly and accurately provide cooling or heating functions according to user needs, meet the temperature requirements of different treatment stages, and at the same time ensure the safety and stability of the device operation.

[0056] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0057] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the shown or discussed mutual couplings, direct couplings, or communication connections may be through some communication interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms.

[0058] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0059] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0060] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a processor-executable, non-volatile, computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0061] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The scope of protection of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the scope of the technology disclosed in this application. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A hot / cold switching device, characterized in that, include: A treatment fluid tank, wherein the treatment fluid tank contains a treatment fluid; A transducer assembly having two mating surfaces arranged opposite each other, one of the mating surfaces being used for cooling or heating, and the other mating surface being used for heating or cooling, wherein the mating surface is thermally mated to the treatment fluid tank. The heat source module is thermally bonded to the other bonding surface, and is used to dissipate heat or heat the transducer component through the other bonding surface. The controller is used to control the heat dissipation intensity or heating intensity of the heat source module based on the temperature data of the two bonding surfaces, so that the temperature difference between the two bonding surfaces is within a preset range, so as to control the function of the two bonding surfaces to switch when a mode switching command is received.

2. The apparatus according to claim 1, characterized in that, The treatment fluid tank includes: The box contains a treatment solution. A first circulating pump, the inlet of which is connected to the housing, and the outlet of which is connected to a medical terminal.

3. The apparatus according to claim 1, characterized in that, The cold / heat source module includes: A water cooling head, wherein the water cooling head is thermally bonded to the other contact surface; A heat dissipation circulating fluid tank, wherein the heat dissipation circulating fluid tank contains a heat dissipation circulating medium; The second circulation pump has its inlet connected to the heat dissipation circulating liquid tank and its outlet connected to the water cooling head.

4. The apparatus according to claim 1, characterized in that, The transducer assembly includes: Multiple cooling elements are arranged in an array between the treatment fluid tank and the cold / heat source module. A control circuit, electrically connected to the plurality of cooling chips and the controller, is used to control the direction and magnitude of the current flowing through the plurality of cooling chips.

5. The apparatus according to claim 4, characterized in that, The control circuit includes: An H-bridge circuit, electrically connected to the plurality of cooling chips, is used to switch the direction of current flowing through the plurality of cooling chips in response to instructions from the controller. A protection circuit, electrically connected to the enable terminal of the H-bridge circuit, is used to disconnect the output of the H-bridge circuit when the temperature of the plurality of cooling chips exceeds a threshold. A current acquisition circuit is connected in series between the H-bridge circuit and the plurality of cooling chips to acquire current data flowing through the cooling chips and feed it back to the controller.

6. The apparatus according to claim 1, characterized in that, Also includes: Temperature sensors are disposed on the two bonding surfaces to collect temperature data from the two bonding surfaces and feed it back to the controller.

7. The apparatus according to claim 3, characterized in that, The cold / heat source module also includes: The heat sink is attached to the water cooling head.

8. A cooling device, characterized in that, include: case; The hot and cold switching device as described in any one of claims 1-7 is disposed inside the housing; A medical terminal is connected to the treatment fluid tank of the hot and cold switching device for heat exchange with the user.

9. The cooling device according to claim 8, characterized in that, Also includes: A heat dissipation system is installed inside the housing to dissipate heat from the cooling and heating switching device.

10. The cooling device according to claim 9, characterized in that, Also includes: An interactive interface, electrically connected to the controller of the hot and cold switching device, is used to receive user commands and display the device's operating status.

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