Constant-temperature control equipment for pressure-sensitive sintering of copper-based electrode chip

Abstract

The invention relates to the technical field of semiconductor and electronic component manufacturing, and particularly discloses copper-based electrode chip pressure-sensitive sintering constant-temperature control equipment which comprises a rack, a constant-temperature heating module and a pressure applying unit. A liftable cylindrical cover structure is adopted, a closed process chamber with extremely small volume can be formed after the cover body descends, and high-efficiency and low-consumption atmosphere protection and operation safety are realized in cooperation with a vacuumizing and inert gas system. An equipment heating area is divided into a plurality of independent temperature control subareas, a pressing rod assembly with independent driving and tail end pressure sensing is correspondingly arranged, the local pressure of the corresponding area can be independently and dynamically adjusted in real time through a control unit according to the temperature of each subarea, and self-adaptive matching and compensation of a thermal field and a force field are achieved. Therefore, the density uniformity of chip sintering is obviously improved, and buckling deformation is effectively inhibited. And a multi-stage cooling and buffering protection mechanism is also integrated, so that long-term stable operation and process consistency of equipment at high temperature and high pressure are guaranteed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor and electronic component manufacturing technology, specifically to a constant temperature control device for sintering copper-based electrode chips with varistor. Background Technology

[0002] In the manufacturing process of semiconductors and electronic components, the co-firing of chips and electrodes is a core process that determines the final performance and reliability of the product. Its quality directly affects the electrical performance and reliability of the components, and it is usually processed using a hot pressing sintering furnace.

[0003] Currently, Chinese patent application number CN202310111998.1 discloses a sintering method for ceramic chips for capacitors. The tools used are two zirconia plates and multiple ceramic sheets for support during sintering. The sintering method includes the following steps: Step 1: Place the ceramic chip capacitor to be sintered between two zirconia plates; Step 2: Place thicker ceramic sheets at the four corners of the zirconia plates; Step 3: Place the zirconia plates, the sandwiched ceramic chip capacitor, and the support ceramic sheets into a sintering furnace. The sintering process is as follows: 1) Low-speed heating stage: Heating to 700℃ at a heating rate of 0.4-0.8℃ / min; 2) Rapid heating stage: Heating to 1100℃ at a heating rate of 0.9-1.3℃ / min; 3) Constant temperature stage: Maintaining the temperature at the highest temperature for 240 minutes; 4) Cooling stage: Allowing the temperature to cool naturally from the highest temperature to room temperature; Step 4: Remove the product from the sintering furnace for testing.

[0004] However, most existing technologies rely on optimizing temperature parameters and physical gaskets, lacking active and precise control over sintering pressure. This makes it difficult to achieve dynamic adjustment and compensation of pressure, and to cope with the stress and deformation caused by uneven shrinkage of materials at high temperatures. Secondly, the entire sintering process is usually carried out in an open furnace, resulting in weak atmosphere control and making it difficult to effectively prevent easily oxidized materials such as copper-based electrodes from deteriorating at high temperatures. Furthermore, the operation is relatively cumbersome, with low levels of automation and intelligence, and poor process repeatability and safety. Summary of the Invention

[0005] The purpose of this invention is to provide a constant temperature control device for the sintering of copper-based electrode chips with varistor, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a constant temperature control device for copper-based electrode chip pressure-sensitive sintering, comprising a frame, feet, a constant temperature heating module, a pressure application unit, and a lower support platform. Feet are fixed at the four corners of the bottom of the frame. A constant temperature heating module is fixed through the middle of the inside of the frame. A pressure application unit is provided on the frame. A lower support platform for supporting the copper-based electrode chip is connected to the top side of the constant temperature heating module. The pressure application unit includes a base whose bottom is fixed to the frame. A lead screw is rotatably driven through the left side of the base. The bottom of the lead screw is connected to the top output end of the drive motor, and the drive motor is locked and fixed to the bottom side of the frame. The lead screw is installed inside the left side of the cylindrical cover. An internal threaded sleeve is provided inside the lower left side of the cylindrical cover, and the internal threaded sleeve is threadedly connected to the lead screw. A first guide rod and a second guide rod slide through the rear and right sides of the cylindrical cover, respectively. The bottoms of the first guide rod and the second guide rod are both fixed to the base. A pressure application structure is fixedly installed inside the upper middle side of the cylindrical cover, and the pressure application structure is located directly above the lower support. An inert gas pipe for connecting to an external inert gas is installed through the left rear side of the cylindrical cover. A vacuum pipe for connecting to an external vacuum device is installed through the right rear side of the cylindrical cover to efficiently manage the atmosphere inside the cylindrical cover.

[0007] Preferably, the heating area of ​​the constant temperature heating module is divided into four equally divided independent temperature-controlled heating zones. The device also includes a control unit, which is configured to independently adjust the applied pressure of the pressure-applying structure in the corresponding zone according to the temperature feedback of the independent temperature-controlled heating zone, so as to realize local coupling and compensation of the thermo-mechanical field.

[0008] Preferably, liquid cooling channels are provided inside the cylindrical cover wall and inside the lower support platform; a flexible graphite ring is provided on the bottom side of the inner wall of the cylindrical cover, and when the cylindrical cover descends to the bottom, the bottom of the flexible graphite ring is sealed with the platform to form an independent sealed process chamber.

[0009] Preferably, the pressure-applying structure includes a chamber seat fastened to the upper side of the inside of the cylindrical cover. The inner wall of the chamber seat is provided with a water-cooled flow channel, and an actuation component is installed in the middle of the inside of the chamber seat. Pressure rod components are fixed through the bottom four sides of the actuation component. The top of the pressure rod components is connected to the water-cooled flow channel through a stainless steel soft water pipe. The bottom of the four pressure rod components is fastened to a semi-rigid pressure equalizing plate.

[0010] Preferably, the four pressure bar assemblies have the same structure and size and are located at the same horizontal height.

[0011] Preferably, the execution component includes a bracket embedded and fixed inside the middle side of the housing. A first servo motor is locked and fixed inside the rear side of the bracket. A drive gear is connected to the right output end of the first servo motor. A driven gear is meshed with the front side of the drive gear. A shaft is coaxially arranged in the middle left side of the driven gear. A fixed gear is fixed in the middle of the outer surface of the shaft. The front side of the fixed gear meshes with a toothed column. The toothed column slides through the interior of the positioning seat. The positioning seat is fixedly connected to the upper side inside the bracket. A protective sleeve is embedded and fixed in the bottom side of the bracket. A column is integrally formed at the bottom end of the toothed column and slides through the protective sleeve. A carrier plate is connected to the bottom end of the column.

[0012] Preferably, the carrier plate has openings on all four sides, and pressure rod assemblies are fixed through each of the four openings; an elastic compensation element consisting of a force sensor and a disc spring assembly is provided between the column and the carrier plate to monitor the total pressure and absorb the impact.

[0013] Preferably, the pressure rod assembly includes a cover connected to a stainless steel soft water pipe at the top, a second servo motor locked and fixed inside the bottom side of the cover, and a cylinder seat fixedly connected to the bottom of the cover. The upper part of the cylinder seat is fastened to the carrier plate. A rotating rod is connected to the bottom output end of the second servo motor. Two protruding posts extend laterally on both sides of the bottom end of the rotating rod. Both protruding posts are inserted into the spiral groove inside the inner spiral column and slide. A limit post is provided on one side of the outer surface of the inner spiral column and slides through the lower middle side inside the cylinder seat. A hemispherical rod is fixedly connected to the bottom end of the inner spiral column and slides inside the middle side of the limit frame. The bottom of the limit frame is locked to the pressure plate by three bolts. The bottom of the pressure plate is fastened to the semi-rigid pressure equalizing plate.

[0014] Preferably, a thin-film pressure sensor is provided between the contact surface of the pressure plate and the semi-rigid pressure equalizing plate to measure the output force at the end of each pressure bar in real time and independently.

[0015] Compared with the prior art, the beneficial effects of the present invention are: This invention features an optimized, liftable cylindrical cover structure, enabling rapid and reliable switching between an open operating platform and a sealed sintering chamber. The extremely small-volume sealed process chamber formed after the cylindrical cover descends, combined with an integrated high-efficiency vacuum and inert gas introduction system, can establish and maintain an ultra-high purity protective atmosphere in a very short time with extremely low gas consumption, effectively preventing the oxidation of copper-based electrodes at high temperatures. At the same time, the high-temperature, high-pressure sintering process is completely enclosed within a robust cover, achieving physical isolation for operators and greatly improving the inherent safety level of the equipment operation.

[0016] This invention divides the heating area into multiple independent temperature control zones, and each zone is equipped with a pressure bar assembly with independent drive and end pressure sensing capabilities. During the isothermal sintering process, the control unit can sense the temperature distribution of different areas of the chip in real time, and dynamically and independently adjust the applied pressure of the corresponding pressure bar through a closed-loop algorithm. This allows the equipment to actively compensate for differences in local densification rates caused by uneven heating or the material's own characteristics, enabling the pressure field to adaptively match the real-time thermal field. This significantly improves the overall density uniformity of the sintered chip, effectively suppresses product warping and deformation, and obtains high-quality products with consistent performance.

[0017] This invention integrates a multi-level cooling system and buffer protection mechanism. The liquid cooling channels inside the cylindrical cover and the lower support platform enable rapid and controllable cooling after the process is completed. The water cooling and elastic compensation elements inside the pressure application mechanism protect the precision drive components and smooth out pressure shocks. By combining real-time sensing feedback of the total pressure and the end pressure of each zone, a complete pressure closed-loop control system from the whole to the part is constructed, which ensures the stable operation of the equipment under long-term high temperature and high pressure conditions and the service life of the core components. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the pressure application unit of the present invention; Figure 3 This is a schematic diagram of the internal structure of the cylindrical cover of the present invention; Figure 4 This is a schematic diagram of the pressure-applying structure of the present invention; Figure 5 This is a schematic diagram of the structure of the execution component of the present invention; Figure 6 For the present invention Figure 5 A top view of the central support structure; Figure 7 This is a schematic diagram of the structure of the pressure bar assembly of the present invention; Figure 8 For the present invention Figure 7 A schematic diagram of the internal structure of the middle cylinder seat.

[0019] In the diagram: Frame-1, Foot pad-2, Constant temperature heating module-3, Pressure application unit-4, Lower support platform-5, Base-41, Lead screw-42, Drive motor-43, Cylindrical cover-44, Internal threaded sleeve-45, First guide rod-46, Second guide rod-47, Pressure application structure-48, Inert gas connection pipe-49, Vacuum connection pipe-410, Chamber base-481, Water cooling channel-482, Actuation assembly-483, Pressure rod assembly-484, Stainless steel soft water pipe-485, Semi-rigid pressure equalizing plate-486, Support-48 31. First servo motor - 4832, driving gear - 4833, driven gear - 4834, shaft - 4835, fixed gear - 4836, toothed column - 4837, positioning seat - 4838, protective sleeve - 4839, carrier plate - 48310, cover - 4841, second servo motor - 4842, cylinder seat - 4843, rotating rod - 4844, inner spiral column - 4845, hemispherical rod - 4846, limit frame - 4847, bolt - 4848, pressure plate - 4849, limit post - 48451. Detailed Implementation

[0020] To further explain the technical solution of the present invention, a detailed description is provided below through specific embodiments.

[0021] Please see Figure 1 This invention provides a constant temperature control device for copper-based electrode chip varistor sintering, including a frame 1, feet 2, a constant temperature heating module 3, a pressure application unit 4, and a lower support 5. Feet 2 are fixed at each of the four corners of the bottom of the frame 1. The constant temperature heating module 3 is fixed through the middle of the interior of the frame 1. The constant temperature heating module 3 is a ceramic heating plate using a silicon carbide heating element, which can efficiently and stably provide the heat source required for sintering. The pressure application unit 4 is installed on the frame 1, and the lower support 5 is connected to the top of the constant temperature heating module 3. The lower support 5 is made of heat-resistant alloy and is used to directly support the copper-based electrode chip stack to be sintered, ensuring the structural strength and dimensional stability of the support at high temperatures and providing a flat and stable support substrate for the chip.

[0022] Please see Figure 1 , Figure 2 and Figure 3 This invention provides a constant temperature control device for copper-based electrode chip pressure-sensitive sintering. The pressure application unit 4 includes a base 41 whose bottom is fastened to the frame 1. A lead screw 42 is rotatably inserted through the left side of the base 41. The bottom of the lead screw 42 is connected to the top output end of the drive motor 43, and the drive motor 43 is locked and fixed to the bottom side of the frame 1. The lead screw 42 is inserted through the inside of the left side of the cylindrical cover 44. An internal threaded sleeve 45 is provided inside the lower left side of the cylindrical cover 44, and the inside of the internal threaded sleeve 45 is threadedly connected to the lead screw 42 so as to drive the lead screw 42 to rotate through the drive motor 43, thereby providing power for the lifting and lowering of the cylindrical cover 44. A first guide rod 46 and a second guide rod 47 slide through the rear and right sides of the cylindrical cover 44, respectively. The bottoms of the first guide rod 46 and the second guide rod 47 are both fastened to the base 41. The double guide rods ensure that the cylindrical cover 44 will not rotate or jam during the lifting process. A pressure applying structure 48 is fastened to the upper middle side inside the cylindrical cover 44, and the pressure applying structure 48 is located directly above the lower support 5, so that the pressure applying structure 48 and the lower support 5 are precisely aligned, ensuring that the pressure is applied vertically to the chip. An inert gas pipe 49 for connecting to an external inert gas is provided through the left rear side inside the cylindrical cover 44, and a vacuum pipe 410 for connecting to an external vacuuming device is provided through the right rear side inside the cylindrical cover 44, so as to efficiently manage the atmosphere inside the cylindrical cover 44, facilitate the process of first evacuating the sealed chamber and then filling it with inert gas, and can quickly replace and maintain a high-purity protective atmosphere, effectively preventing the oxidation of copper-based electrodes.

[0023] The heating area of ​​the constant temperature heating module 3 is divided into four equally divided independent temperature-controlled heating zones. The device also includes a control unit, which is configured to independently adjust the pressure applied by the pressure structure 48 in the corresponding area according to the temperature feedback of the independent temperature-controlled heating zone, so as to realize the local coupling and compensation of the thermal-mechanical field. This allows the device to sense and respond to the local temperature non-uniformity that may occur in the chip during the sintering process. By dynamically adjusting the local pressure in the corresponding area, it compensates for the difference in thermal stress and densification rate caused by temperature difference, thereby significantly improving the overall density uniformity of the sintered chip and suppressing warping deformation.

[0024] Liquid cooling channels are provided inside the cylindrical cover 44 and the lower support 5. The liquid cooling channels inside the cylindrical cover 44 are used to quickly reduce the temperature of the cover after the process is completed, shorten the production cycle, and protect the seals. The liquid cooling channels inside the lower support 5 can achieve controllable and rapid cooling of the bottom of the chip and optimize the microstructure. A flexible graphite ring is provided on the bottom side of the inner wall of the cylindrical cover 44. When the cylindrical cover 44 is lowered to the bottom, the bottom of the flexible graphite ring is sealed with the platform 41 to form an independent closed process chamber.

[0025] Please see Figures 3-8 This invention provides a constant temperature control device for the sintering of copper-based electrode chips with pressure sensitivity. The pressure application structure 48 includes a chamber 481 fastened to the upper side inside the cylindrical cover 44. The inner wall of the chamber 481 is provided with a water-cooling channel 482 for cooling the inside of the pressure application structure 48, preventing high temperature from being transferred to components such as the precision servo motor above, and ensuring its long-term stable operation. An execution component 483 is installed in the middle side inside the chamber 481. Four pressure rod components 484 of the same structure and size are fixed through the four sides of the bottom of the execution component 483, and the four pressure rod components 484 are located at the same horizontal height to ensure the uniformity of the initial pressure application. The top of the pressure rod components 484 is connected to the water-cooling channel 482 through a stainless steel soft water pipe 485 to ensure that the cooling water path is continuously unobstructed. The bottom of each of the four pressure bar assemblies 484 is fastened to a semi-rigid pressure equalizing plate 486. The semi-rigid pressure equalizing plate 486 can integrate and equalize the pressure from the four independent pressure bars and then transmit it to the chip. At the same time, its moderate rigidity allows for slight elastic deformation when the pressure at the four fulcrums is uneven, so as to achieve differential adjustment of the zone pressure.

[0026] The execution component 483 includes a bracket 4831 embedded and fixed inside the middle side of the housing 481. A first servo motor 4832 is locked and fixed inside the rear side of the bracket 4831. The output end of the first servo motor 4832 is connected to a drive gear 4833. The front side of the drive gear 4833 meshes with a driven gear 4834 to realize the change of power direction and the matching of speed. A shaft 4835 is coaxially arranged in the middle of the left side of the driven gear 4834. A fixed gear 4836 is fixed in the middle of the outer surface of the shaft 4835. The front side of the fixed gear 4836 meshes with a toothed column 4837, forming a gear-rack pair that converts the rotational motion back into linear motion. The toothed column 4837 slides through the inside of the positioning seat 4838, which is fixedly connected to the upper middle side of the bracket 4831. A protective sleeve 4839 is embedded and fixed inside the bottom side of the bracket 4831. A column is integrally formed at the bottom end of the toothed column 4837, and the column slides through the inside of the protective sleeve 4839. The protective sleeve 4839 provides secondary guidance and protection for the column, further improving motion stability and preventing dust intrusion. A carrier plate 48310 is connected to the bottom end of the column. The carrier plate 48310 serves as a transition platform connecting the actuator 483 and all the pressure rod assemblies 484, distributing the main driving force evenly to each pressure rod.

[0027] The carrier plate 48310 has openings on all four sides, and pressure rod assemblies 484 are fixedly installed through each of the four openings, which realizes a firm connection between the pressure rod assemblies 484 and the carrier plate 48310 and ensures effective power transmission. An elastic compensation element consisting of a force sensor and a disc spring assembly is set between the column and the carrier plate 48310. The force sensor monitors the total pressure generated by the four pressure rods in real time and provides feedback for the overall pressure closed-loop control. The disc spring assembly, as an elastic buffer element, can effectively absorb the instantaneous impact force caused by sudden densification of the chip or transmission gap, protect the sensor and chip, and make pressure changes smoother, thus improving control quality.

[0028] The pressure rod assembly 484 includes a cover 4841 connected to the top of a stainless steel soft water pipe 485. A second servo motor 4842 is locked and fixed inside the bottom of the cover 4841, and a cylinder seat 4843 is fixedly connected to the bottom of the cover 4841. The upper part of the cylinder seat 4843 is fastened to the carrier plate 48310. A rotating rod 4844 is connected to the bottom output end of the second servo motor 4842. Two protrusions extend laterally on both sides of the bottom end of the rotating rod 4844. Both protrusions are inserted into the spiral groove inside the inner spiral column 4845 and slide. The second servo motor 4842 is used as a power source to convert the rotational motion of the rotating rod 4844 into the linear motion of the inner spiral column 4845. A limiting post 48451 is provided on one side of the outer surface of the inner helical column 4845, and it slides through the lower middle side of the inner cylinder seat 4843. The limiting post 48451 cooperates with the sliding groove on the cylinder seat 4843 to prevent the inner helical column 4845 from rotating with the rotating rod 4844, forcing it to only perform linear motion. A hemispherical rod 4846 is fixedly connected to the bottom end of the inner helical column 4845. The hemispherical rod 4846 is slidably connected to the middle side of the inner limit frame 4847. The bottom of the limit frame 4847 is connected by three screws. Bolt 4848 is locked to pressure plate 4849. The bottom of pressure plate 4849 is fastened to semi-rigid pressure equalizing plate 486. Hemispherical rod 4846 and limit frame 4847 form a spherical pair connection, which allows pressure plate 4849 to produce small-angle adaptive swing when subjected to eccentric load or slight tilt of semi-rigid pressure equalizing plate 486. This ensures good contact between the bottom of pressure plate 4849 and semi-rigid pressure equalizing plate 486, avoids edge stress concentration, and directly transmits the final force of the pressure rod to semi-rigid pressure equalizing plate 486. A thin-film pressure sensor is installed between the contact surface of the pressure plate 4849 and the semi-rigid pressure equalizing plate 486. This sensor can accurately measure the local force transmitted to the support point on the semi-rigid pressure equalizing plate 486. The signal is directly fed back to the control unit, which then precisely adjusts the corresponding second servo motor 4842. This enables independent setting and stable maintenance of the pressure in each zone, improving the accuracy of pressure control and dynamic response capability, thereby forming local coupling and compensation of the thermo-mechanical field.

[0029] The working principle of the copper-based electrode chip varistor sintering constant temperature control device of the present invention is as follows: First, at the start of operation, the control unit drives the cylindrical cover 44 to rise to the open position, raising the internal pressure structure 48 and fully exposing the lower support 5. The operator then places the copper-based electrode chip stack to be sintered in the center of the lower support 5.

[0030] Second, the control unit starts the drive motor 43, which drives the lead screw 42 to rotate. Through the threaded sleeve 45 connected to it, the cylindrical cover 44 is driven to descend smoothly along the first guide rod 46 and the second guide rod 47. When the cylindrical cover 44 descends to the bottom, the flexible graphite ring at its bottom is pressed and sealed with the platform 41, forming an independent sealed process chamber surrounding the lower support 5. Immediately afterwards, the control unit starts the external equipment connected to the vacuum pipe 410 and the inert gas pipe 49 in sequence. First, the chamber is evacuated, and then high-purity inert gas is filled in, thereby quickly and efficiently replacing the air in the chamber with a protective atmosphere, effectively preventing the oxidation of the copper-based electrode during the subsequent high-temperature process. At the same time, the constant temperature heating module 3 is started, and the silicon carbide heating element starts to work, heating the lower support 5 and the chip it supports. The temperature rises according to the preset program.

[0031] Third, once the heating temperature reaches the preset sintering value and enters a constant temperature state, the pressure structure 48 begins to work. The control unit first instructs the first servo motor 4832 in the execution component 483 to move. Through the transmission of the driving gear 4833, driven gear 4834, shaft 4835, and fixed gear 4836, the toothed column 4837 and its connected column and carrier plate 48310 are driven to move downward as a whole. This pushes the four pressure rod components 484 and the semi-rigid pressure equalizing plate 486 to contact and press against the chip, applying a reference total pressure. During this process, the total force sensor between the column and the carrier plate 48310 monitors the total pressure value in real time, forming a closed-loop control of the total pressure. The disc spring assembly absorbs possible instantaneous impacts, making the pressure application smooth. At the same time, the four independent temperature control zones of the constant temperature heating module 3 continuously monitor the temperature of different areas of the chip. The control unit receives these temperature signals in real time and the signals set between each pressure plate 4849 and the semi-rigid pressure equalizing plate 486. The thin-film pressure sensor signal is transmitted between the two regions. If the temperature feedback of a certain heating zone shows that the temperature in that area is too low (which may lead to slower densification), the control unit sends a command to the second servo motor 4842 of the pressure rod assembly 484 in the corresponding area. The motor drives the rotating rod 4844 to rotate. Through the cooperation of the protrusion at its end with the inner spiral groove of the inner spiral column 4845, and under the restriction of the limiting column 48451, the rotational motion is converted into precise linear fine adjustment of the inner spiral column 4845. Then, through the spherical pair composed of the hemispherical rod 4846 and the limiting frame 4847, the pressure plate 4849 is driven to fine adjust the force of the pressure point on the semi-rigid pressure equalizing plate 486. The semi-rigid pressure equalizing plate 486 undergoes slight elastic deformation during this process, coordinating the pressure difference between the four support points. Finally, the optimized pressure distribution is transmitted to the chip, realizing real-time local coupling and dynamic compensation of the thermal field and the force field. This ensures the high uniformity of heating and stress on the chip during the isothermal sintering process and suppresses warping deformation.

[0032] Fourth, after the isothermal sintering stage is completed, the control unit shuts down the main heater and immediately starts the cooling program. The liquid cooling channels inside the cylindrical cover 44 and the lower support 5 begin to circulate the cooling medium to rapidly, uniformly and controllably cool the chamber environment and the bottom of the chip, thereby optimizing the microstructure of the chip. During the cooling process, the pressure application structure 48 can maintain or gradually adjust the pressure according to the preset cooling curve to adapt to the phase change and shrinkage of the material during the cooling process. When the temperature drops to a safe range, the control unit controls the execution component 483 to drive the pressure rod component 484 to rise as a whole to release the pressure, and then drives the cylindrical cover 44 to rise to the open position, completely exposing the lower support 5 and the sintered chip, so that the operator can safely take out the finished product.

[0033] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A constant temperature control device for copper-based electrode chip varistor sintering, comprising a frame (1), wherein pads (2) are fixed at the four corners of the bottom of the frame (1), and a constant temperature heating module (3) is fixed through the middle of the interior of the frame (1), characterized in that: A pressure application unit (4) is provided on the frame (1). The top side of the constant temperature heating module (3) is connected to a lower support (5) for supporting copper-based electrode chips. The pressure application unit (4) includes a base (41) whose bottom is fastened to the frame (1). A lead screw (42) is rotatably inserted through the left side of the base (41). The bottom of the lead screw (42) is connected to the top output end of the drive motor (43), and the drive motor (43) is locked and fixed to the bottom side of the frame (1). The lead screw (42) is inserted through the inside of the left side of the cylindrical cover (44). An internal thread sleeve (45) is provided inside the lower left side of the cylindrical cover (44), and the internal thread sleeve (45) 45) The internal screw is threaded to the lead screw (42). The first guide rod (46) and the second guide rod (47) slide through the rear and right sides of the cylindrical cover (44) respectively. The bottom of the first guide rod (46) and the second guide rod (47) are fastened to the base (41). The upper middle side of the inside of the cylindrical cover (44) is fastened with a pressure structure (48), and the pressure structure (48) is located directly above the lower support (5). The left rear side of the inside of the cylindrical cover (44) is provided with an inert gas pipe (49) for connecting to an external inert gas. The right rear side of the inside of the cylindrical cover (44) is provided with a vacuum pipe (410) for connecting to an external vacuum device.

2. The constant temperature control device for copper-based electrode chip varistor sintering according to claim 1, characterized in that: It also includes a control unit, which is configured to independently adjust the applied pressure of the pressure structure (48) in the corresponding area according to the temperature feedback of the independent temperature-controlled heating zone; the heating area of ​​the constant temperature heating module (3) is divided into four equally divided independent temperature-controlled heating zones.

3. The constant temperature control device for copper-based electrode chip varistor sintering according to claim 1, characterized in that: Liquid cooling channels are provided inside the cylindrical cover (44) and inside the lower support platform (5), and a flexible graphite ring is provided on the bottom side of the inner wall of the cylindrical cover (44).

4. The constant temperature control device for copper-based electrode chip varistor sintering according to claim 1, characterized in that: The pressure-applying structure (48) includes a chamber seat (481) fastened to the upper side inside the cylindrical cover (44). The inner wall of the chamber seat (481) is provided with a water-cooled flow channel (482), and an actuation component (483) is installed in the middle side inside the chamber seat (481). Pressure rod components (484) are fixed through the bottom four sides of the actuation component (483). The top of the pressure rod components (484) is connected to the water-cooled flow channel (482) through a stainless steel soft water pipe (485). The bottom of the four pressure rod components (484) is fastened to a semi-rigid pressure equalizing plate (486).

5. The constant temperature control device for copper-based electrode chip varistor sintering according to claim 4, characterized in that: The four pressure bar assemblies (484) are identical in structure and size and are located at the same horizontal height.

6. The constant temperature control device for copper-based electrode chip varistor sintering according to claim 4, characterized in that: The execution component (483) includes a bracket (4831) embedded and fixed inside the middle side of the housing (481). A first servo motor (4832) is locked and fixed inside the rear side of the bracket (4831). A drive gear (4833) is connected to the right output end of the first servo motor (4832). A driven gear (4834) is meshed with the front side of the drive gear (4833). A shaft (4835) is coaxially arranged on the left middle of the driven gear (4834). A shaft (4835) is fixed on the middle of the outer surface of the shaft (4835). A fixed gear (4836) is provided, and the front side of the fixed gear (4836) meshes with a toothed column (4837). The toothed column (4837) slides through the interior of a positioning seat (4838). The positioning seat (4838) is fixedly connected to the upper side of the interior of a bracket (4831). A protective sleeve (4839) is embedded and fixed inside the bottom side of the bracket (4831). A column is integrally formed at the bottom end of the toothed column (4837), and the column slides through the interior of the protective sleeve (4839). A carrier plate (48310) is connected to the bottom end of the column.

7. The constant temperature control device for copper-based electrode chip varistor sintering according to claim 6, characterized in that: The carrier plate (48310) has openings on all four sides, and pressure rod assemblies (484) are fixed through each of the four openings.

8. The constant temperature control device for copper-based electrode chip varistor sintering according to claim 6, characterized in that: A force sensor and an elastic compensation element are provided between the column and the carrier plate (48310), and the elastic compensation element is a disc spring assembly.

9. The constant temperature control device for copper-based electrode chip varistor sintering according to claim 4, characterized in that: The pressure rod assembly (484) includes a cover (4841) connected at the top to a stainless steel soft water pipe (485). A second servo motor (4842) is locked and fixed inside the bottom of the cover (4841), and a cylinder seat (4843) is fixedly connected to the bottom of the cover (4841). The upper part of the cylinder seat (4843) is fastened to the carrier plate (48310). A rotating rod (4844) is connected to the bottom output end of the second servo motor (4842). Two protrusions extend laterally on both sides of the bottom end of the rotating rod (4844), and both protrusions are inserted into and slide within the inner spiral column. Inside the spiral groove of (4845), a limiting post (48451) is provided on one side of the outer surface of the inner spiral column (4845), and it slides through the lower middle side inside the cylinder seat (4843). A hemispherical rod (4846) is fixedly connected to the bottom end of the inner spiral column (4845). The hemispherical rod (4846) is slidably connected to the middle side inside the limiting frame (4847). The bottom of the limiting frame (4847) is locked to the pressure plate (4849) by three bolts (4848). The bottom of the pressure plate (4849) is fastened to the semi-rigid pressure equalizing plate (486).

10. The constant temperature control device for copper-based electrode chip varistor sintering according to claim 9, characterized in that: A thin-film pressure sensor is provided between the contact surface of the pressure plate (4849) and the semi-rigid pressure equalizing plate (486).

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