Atmospheric measurement structure

Abstract

The invention provides an atmospheric measurement structure which comprises an equipment shell, a multilayer circuit board, a plurality of sensor modules, an external gas path interface and an external electrical interface, the multi-layer circuit board is arranged in the equipment shell, a socket connected with the sensor module is arranged on the multi-layer circuit board, the sensor module comprises a sensor body and an information processing board, the sensor body and the information processing board are packaged in a metal shielding shell, and the sensor body and the information processing board are respectively installed on different layers of the multi-layer circuit board through the socket. The multiple layers of circuit boards communicate with each other in a standard extension socket mode. By optimizing the mechanical structure, the hardware layout and the connection mode, the defects of existing equipment in the aspects of heat dissipation, electromagnetic compatibility and production and maintenance convenience are overcome.

Description

Technical Field

[0001] This invention relates to an atmospheric measurement structure, and more particularly to a low-cost, high-reliability atmospheric measurement structure design that is easy to mass-produce and maintain, belonging to the field of aerospace technology. Background Technology

[0002] Atmospheric measurement systems are an indispensable and important component of aircraft guidance and control systems. They ensure that aircraft can obtain real airspeed, real angle of attack, and sideslip angle in real time during flight, thereby ensuring stable control of aircraft attitude and trajectory.

[0003] Existing atmospheric measurement systems often suffer from the following structural problems:

[0004] 1. The internal layout is chaotic, with internal components and equipment densely packed in a small space, resulting in significant heat generation between them and shortening the lifespan of the components.

[0005] Second, the sensor and structure are highly integrated. Traditional pressure sensors are cylindrical and are fixed to the equipment housing by screwing or welding, resulting in high maintenance and replacement costs.

[0006] Third, the traditional atmospheric measurement system has a non-standard structural design, making it difficult to mass-produce.

[0007] These structural defects directly affect the long-term stability of the atmospheric measurement system, increase the maintenance cost throughout its entire life cycle, and significantly diminish its "low-cost" advantage. Summary of the Invention

[0008] The purpose of this invention is to overcome the shortcomings of the prior art and provide an atmospheric measurement structure that is low-cost, highly reliable, and easy to mass-produce and maintain.

[0009] The technical solution of the present invention: an atmospheric measurement structure, characterized in that it includes a device housing, a multi-layer circuit board, multiple sensor modules, an external air path interface, and an external electrical interface;

[0010] The multi-layer circuit board is housed in the device casing. The multi-layer circuit board is provided with sockets for connecting sensor modules. The sensor modules include a sensor body and an information processing board, which are encapsulated in a metal shielding shell and installed on different layers of the multi-layer circuit board through the sockets. The multi-layer circuit boards communicate with each other through a standard connector.

[0011] The beneficial effects of this invention compared to the prior art are as follows:

[0012] (1) This invention addresses the shortcomings of existing equipment in terms of heat dissipation, electromagnetic compatibility, and ease of production and maintenance by optimizing the mechanical structure, hardware layout and connection method;

[0013] (2) This invention optimizes heat dissipation and electromagnetic compatibility performance. Through the separate design of the device shell and the multi-layer circuit board, the heat accumulation of the circuit board components is effectively reduced and the life of the components is improved. The sensor module is designed with a metal shielding shell, which effectively improves the accuracy of the data.

[0014] (3) This invention reduces production and maintenance costs. Through the design of replaceable sensors and multi-layer circuit board installation, it greatly reduces the cost and time of fault repair, facilitates automated assembly, and reduces production costs.

[0015] (4) This invention enhances deployment flexibility. The simple installation method and compact structural design allow the equipment to be flexibly deployed in various confined spaces, giving users greater freedom when choosing products.

[0016] (5) The present invention achieves efficient system assembly and electromagnetic compatibility, facilitates production, maintenance and long-term stable operation, and significantly reduces the system manufacturing cost, assembly complexity and maintenance cost at the hardware level. Attached Figure Description

[0017] Figure 1 This is an isometric view of an embodiment of the present invention;

[0018] Figure 2 This is a cross-sectional view of the device casing according to an embodiment of the present invention;

[0019] Figure 3 This is a side view of the connection between the sensor module and the multilayer circuit board in an embodiment of the present invention;

[0020] Figure 4 This is a cross-sectional view of the connection between the sensor module and the external air circuit in an embodiment of the present invention. Detailed Implementation

[0021] The present invention is as follows Figure 1 As shown, an atmospheric measurement structure is provided, including a device housing, a multi-layer circuit board, multiple sensor modules, an external air path interface, and an external electrical interface. The multi-layer circuit board is disposed in the device housing, and sockets for connecting the sensor modules are provided on the multi-layer circuit board. The sensor modules include a sensor body and an information processing board, which are encapsulated in a metal shielding shell and are respectively mounted on different layers of the multi-layer circuit board through the sockets. The multi-layer circuit boards communicate with each other through a standard connector.

[0022] The device of this invention has a split and modular structure. The device shell adopts an upper and lower split structure with an anti-slip hollow design, including an upper shell, a lower shell, an upper cover plate and a lower cover plate. A test cover plate for debugging is provided on the upper cover plate.

[0023] Furthermore, the test cover is positioned at the center of the upper cover, allowing for debugging of the internal circuitry without disassembling the system itself.

[0024] Furthermore, both the upper and lower housings are designed with supports for mounting multi-layer circuit boards. During assembly, the multi-layer circuit boards are connected to the upper and lower housings respectively, and then the two are mated together. More preferably, the equipment casing is made of metal, such as aluminum alloy.

[0025] Furthermore, the equipment casing adopts an integrated installation and anti-slip design. The bottom of the lower casing has an integrally machined mounting lug that can be connected to the installation environment via screws. The equipment casing has a hollowed-out anti-slip protrusion structure to reduce the possibility of accidental slippage during installation.

[0026] The multilayer circuit board of this invention adopts a modular internal structure of layered stacking. The multilayer circuit boards are fixed on the upper and lower shells respectively. The circuit boards integrate microprocessors, communication chips, field programmable gate arrays and power modules.

[0027] Furthermore, the multilayer circuit boards communicate with each other through standard connectors. This layered approach reduces heat buildup on the circuit board components, improving the stability of the equipment.

[0028] Furthermore, the sensor module connects to the socket of the multilayer circuit board via a board-to-board connector and is secured with studs. The socket is a standardized socket, and the sensor module and the multilayer circuit board are connected using a standardized socket with a 2.54mm pitch.

[0029] Furthermore, the sensor module is a board-type module with a metal housing that can shield against external electromagnetic interference. The bottom is connected to the information processing board of the sensor module. After completing signal acquisition and preliminary processing, the information processing board transmits the raw electrical signal to the multi-layer circuit board through a standardized socket.

[0030] Furthermore, the external air and electrical interfaces are fixedly installed on the equipment housing and connected to the multi-layer circuit board via a connector.

[0031] Furthermore, the external air interface uses a standard air nozzle. The external interface of the standard air nozzle is a 74° conical connector conforming to HB 4-4-2002 "Flanged Straight-Through Pipe Fittings", and the internal interface is a pagoda-shaped air nozzle, which is connected to the sensor body through a flexible hose. More preferably, the flexible hose is a silicone rubber hose.

[0032] Furthermore, the external electrical interface is a standard electrical interface designed to prevent errors.

[0033] This invention adopts standardized hardware interfaces and connection methods. The standardized internal hardware interface ensures the maintainability between components, while the standardized external hardware interface ensures adaptability in different usage environments.

[0034] The present invention will now be described in detail with reference to specific examples and accompanying drawings.

[0035] like Figure 1 As shown, a low-cost atmospheric measurement structure design mainly consists of an equipment housing 1, a multi-layer circuit board 2, multiple sensor modules 3, an external air path interface 4, and an external electrical interface 5.

[0036] The equipment housing 1 consists of an upper housing 11, a lower housing 12, an upper cover plate 13, and a lower cover plate 14. The external installation interface is a mounting lug 15, the external air circuit interface 4 is a standard air nozzle, and the external electrical interface 5 is a fault-proof standard interface.

[0037] like Figure 1 , 2 As shown, in this embodiment of the invention, the upper cover plate 13, the upper housing 11, the lower housing 12 and the lower cover plate 14 are all connected by screws, and a support for mounting the multilayer circuit board 2 is provided inside the upper and lower housings.

[0038] like Figure 3 As shown, in this embodiment of the invention, there are multiple independent sensor modules 3, which adopt a distributed layout. The sensor body 31 is connected to the multi-layer circuit board 2 through a standardized socket 32, and the multi-layer circuit boards 2 communicate with each other through a standard connector 21.

[0039] like Figure 4 As shown, the external air interface 4 adopts a standardized conical interface, which passes through the upper shell and communicates with the internal interface pagoda head air nozzle. In this embodiment of the invention, a silicone rubber hose 42 is used to connect the pagoda head air nozzle 41 and the sensor body 31 to realize the sensor's sensing of external pressure.

[0040] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

[0041] The parts of this invention not described in detail are techniques known to those skilled in the art.

Claims

1. An atmospheric measurement structure, characterized in that: This includes the equipment housing, multi-layer circuit boards, multiple sensor modules, external air interface, and external electrical interface; The multi-layer circuit board is housed in the device casing. The multi-layer circuit board is provided with sockets for connecting sensor modules. The sensor modules include a sensor body and an information processing board, which are encapsulated in a metal shielding shell and installed on different layers of the multi-layer circuit board through the sockets. The multi-layer circuit boards communicate with each other through a standard connector.

2. The atmospheric measurement structure according to claim 1, characterized in that: The device housing has a split and modular structure. The housing is a split structure consisting of an upper shell, a lower shell, an upper cover plate, and a lower cover plate. A test cover plate for debugging is provided on the upper cover plate.

3. An atmospheric measurement structure according to claim 2, characterized in that: Both the upper and lower housings are designed with supports for mounting multi-layer circuit boards. During assembly, the multi-layer circuit boards are connected to the upper and lower housings respectively, and then the two are mated together.

4. An atmospheric measurement structure according to claim 3, characterized in that: The equipment housing adopts an integrated installation and anti-slip design. The bottom of the lower housing is provided with an integrally machined mounting lug, which is connected to the installation environment by screws. The anti-slip protrusion structure is hollowed out in the equipment housing.

5. An atmospheric measurement structure according to claim 4, characterized in that: The multi-layer circuit board adopts a modular internal structure with layered stacking. The multi-layer circuit boards are fixed on the upper and lower housings respectively. The circuit boards integrate microprocessors, communication chips, field-programmable gate arrays and power modules.

6. An atmospheric measurement structure according to claim 5, characterized in that: The sensor module is a board type, with its sensor housing made of metal. The bottom is connected to the information processing board of the sensor module. After completing signal acquisition and preliminary processing, the information processing board transmits the raw electrical signal to the multi-layer circuit board through a standardized socket.

7. An atmospheric measurement structure according to claim 6, characterized in that: The external air interface and external electrical interface are fixedly installed on the equipment housing and connected to the multi-layer circuit board through a connector.

8. An atmospheric measurement structure according to claim 6, characterized in that: The external air circuit interface uses a standard air nozzle. The external interface of the standard air nozzle is a conical connector, and the internal interface is a pagoda-shaped air nozzle. It is connected to the sensor body through a flexible hose.

9. An atmospheric measurement structure according to claim 8, characterized in that: The flexible hose is made of silicone rubber, and the external electrical interface is a standard electrical interface designed to prevent errors.

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