Chip high-temperature test system structure

Abstract

The invention relates to the technical field of chip testing, in particular to a chip high-temperature testing system structure which comprises a constant-temperature controller, a plurality of chip high-temperature testing sockets, a double-end spring needle and a chip function testing circuit board. A socket needle die is fixedly arranged on the upper surface of the chip high-temperature test socket, and the double-end spring needle is embedded in the socket needle die in the vertical direction. According to the invention, the heating pressing plate is directly installed at the bottom of the upper cover of the chip high-temperature test socket, a high-temperature test environment is directly constructed for a single chip in combination with the temperature adjustment effects of the thermocouple, the constant-temperature controller radiator and the cooling fan, and meanwhile, the LED panel is fixedly arranged on the outer side wall of the chip high-temperature test socket, so that the chip high-temperature test efficiency is improved. The LED panel is electrically connected with the chip function test circuit board through the constant temperature controller, the qualified or bad state of the tested chip can be visually displayed, and an operator can directly position and sort qualified and unqualified chips.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, specifically to a chip high-temperature testing system structure. Background Technology

[0002] Electrical performance testing under high temperature conditions is a critical step before chip mass production. Currently, the mainstream high temperature testing solution for chips in the industry uses a high temperature environment chamber as a temperature control carrier. The test socket is built into the environment chamber, and the test socket is connected to the external test function board through a long-distance test cable passing through the insulation wall of the environment chamber. After the chip under test is positioned and clamped on the test socket, the chip pins need to form an electrical circuit with the external equipment through the test cable to complete the electrical parameter test.

[0003] As semiconductor chip technology develops towards higher speeds and radio frequency capabilities, existing testing solutions suffer severe attenuation of high-speed and radio frequency signals during long-distance cable transmission, leading to distorted test data and failing to meet testing requirements. Furthermore, traditional testing solutions separate temperature control components from test sockets, resulting in delayed temperature feedback. Moreover, test results rely on external devices to read data, requiring operators to open the environmental chamber to locate defective chips based on external data, increasing the complexity and time consumption of chip sorting.

[0004] Therefore, a chip high-temperature testing system structure is proposed to solve the problems mentioned above. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a high-temperature chip testing system structure. By directly installing a heating plate inside the high-temperature chip testing socket, and combining the temperature regulation functions of thermocouples, a constant temperature controller, a heat sink, and a cooling fan, a high-temperature testing environment is directly constructed for a single chip. Simultaneously, an LED panel is fixedly mounted on the outer wall of the high-temperature chip testing socket. The LED panel is connected to the constant temperature controller via a temperature control cable. The chip functional testing circuit board transmits the "pass" or "fail" information of the chip test to the constant temperature controller via an RS232 or 485 communication cable. The constant temperature controller controls the LED's on / off state via the temperature control cable, which can intuitively display the pass or fail status of the tested chip. Operators can directly locate and find defective chips, significantly simplifying the chip sorting process and effectively shortening sorting time, thus solving the problems mentioned in the background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solution: including a constant temperature controller, multiple chip high-temperature test sockets, double-ended spring pins, and a chip function test circuit board. The multiple chip high-temperature test sockets are detachably electrically connected to the constant temperature controller via temperature control cables. A socket pin mold is fixedly provided in the socket base of the chip high-temperature test socket. The double-ended spring pins are vertically embedded in the socket pin molds, and the lower ends of the double-ended spring pins form a pressing electrical contact with the circuit contacts of the chip function test circuit board. A heating plate is horizontally fixed on the top cover of the chip high-temperature test socket near the side of the chip functional test circuit board. The lower surface of the heating plate corresponds to the upper surface of the chip under test. A thermocouple is embedded in the interior of the heating plate in the horizontal direction.

[0007] Preferably, the signal output terminal of the thermocouple is electrically connected to the signal input terminal of the thermostat via a temperature control cable, and the power input terminal of the heating plate is electrically connected to the power output terminal of the thermostat via the temperature control cable.

[0008] Preferably, the chip high temperature test socket is provided with a heat sink and a cooling fan at the top. The bottom side of the heat sink is fixedly mounted to the upper side of the heating plate by bolts, and the upper fins of the heat sink are placed at the top of the chip high temperature test socket.

[0009] Preferably, the heating plate is floatingly connected to the upper part of the socket cover by elastic bolts, the cooling fan is installed on the upper surface of the radiator, and the power input terminal of the cooling fan is electrically connected to the power output terminal of the constant temperature controller through a temperature control cable.

[0010] Preferably, an LED panel is fixedly installed on the outer wall of the chip high temperature test socket, and the power input terminal of the LED panel is electrically connected to the power output terminal of the constant temperature controller through a temperature control cable.

[0011] Preferably, the thermostat has multiple temperature control interfaces on its back, and each temperature control interface is electrically connected to a high-temperature test socket of the chip via an independent temperature control cable.

[0012] Preferably, the temperature control interface is provided with multiple connection contact points, which are heating block +, cooling fan +, heating block -, cooling fan -, LED (GD,NG) +, LED (GD) -, thermocouple -, thermocouple +, and LED (NG) -.

[0013] Preferably, the high-temperature chip test socket includes a socket base and a socket cover.

[0014] Preferably, the socket base is fixedly installed on the upper surface of the chip functional test circuit board, and the socket pin mold is positioned and engaged with the inner wall of the socket base by a positioning pin.

[0015] Compared with the prior art, the present invention provides a chip high-temperature testing system structure, which has the following beneficial effects: 1. By directly installing the heating plate on the bottom of the socket cover of the chip high-temperature test socket, combined with the temperature regulation functions of thermocouples, constant temperature controllers, heat sinks, and cooling fans, a high-temperature constant temperature test environment is directly constructed for a single chip. At the same time, the LED panel fixed on the outer wall of the chip high-temperature test socket can intuitively display the qualified or defective status of the tested chip. Operators can directly locate and find defective chips, which greatly simplifies the chip sorting process, effectively shortens the sorting time, and solves the problems of indirect result feedback and complex and inefficient sorting operations in traditional testing, further improving the overall efficiency of chip high-temperature testing.

[0016] 2. By embedding double-headed spring pins vertically into the socket pin mold and forming a pressing electrical contact with the pins of the chip under test and the circuit contacts of the chip function test circuit board, a short electrical loop without long-distance cables is directly constructed between the chip and the test circuit board. This avoids the serious attenuation problem of high-speed signals and radio frequency signals when transmitted through long cables in traditional solutions, and solves the problem that traditional tests cannot adapt to new chips due to signal distortion. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 A front view of the structure of a high-temperature chip testing system according to the present invention is provided. Figure 2 A schematic diagram of the back structure of a chip high-temperature testing system according to the present invention; Figure 3 A magnified structural diagram of point A provided for the high-temperature chip testing system structure of the present invention; Figure 4 A schematic diagram of the isometric side structure provided by the present invention for a chip high-temperature testing system; Figure 5 This invention provides an exploded view of the socket bottom and the test circuit board structure of a high-temperature chip testing system. Figure 6 A magnified structural diagram of point B provided for a high-temperature chip testing system structure according to the present invention; Figure 7This is an enlarged structural diagram of point C, which is provided for the high-temperature chip testing system structure of the present invention.

[0018] In the diagram: 1. Temperature controller; 101. RS232 communication port; 102. RS485 communication port; 2. Chip high-temperature test socket; 3. Double-ended spring pin; 4. Chip function test circuit board; 5. Temperature control cable; 6. Socket pin mold; 7. Heating pressure plate; 8. Thermocouple; 9. Heat sink; 10. Cooling fan; 11. LED panel; 12. Temperature control interface; 13. Connecting contact point; 201. Socket base; 202. Socket top cover. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Example: Please see Figure 1 - Figure 7 This embodiment of a chip high-temperature testing system structure includes a constant temperature controller 1, multiple chip high-temperature test sockets 2, double-ended spring pins 3, and a chip function test circuit board 4. The multiple chip high-temperature test sockets 2 are detachably electrically connected to the constant temperature controller 1 via temperature control cables 5. The number of chip high-temperature test sockets 2 can be flexibly increased or decreased according to the testing batch requirements. A socket pin mold 6 is fixedly provided in the socket base 201 of the chip high-temperature test socket 2. The double-ended spring pins 3 are vertically embedded in the socket pin mold 6, and the lower end of the double-ended spring pins 3 forms a pressing electrical contact with the circuit contacts of the chip function test circuit board 4. The pin hole position inside the socket pin mold 6 is precisely matched with the chip pin arrangement, ensuring the vertical positioning of the double-ended spring pins 3. The assembly pressure of the socket as a whole ensures that the lower end of the double-ended spring pins 3 is always tightly attached to the circuit contacts of the chip function test circuit board 4. The socket base 201 can be directly fixed to the chip function test circuit board 4 using screws.

[0021] A heating plate 7 is horizontally fixed on the top cover 202 of the chip high temperature test socket 2 near the chip function test circuit board 4. The heating plate 7 is heated by electric heating. The lower surface of the heating plate 7 corresponds to the upper surface of the chip under test. The lower surface of the heating plate 7 is made of a high thermal conductivity metal and is tightly attached to the upper surface of the chip under test. A thermocouple 8 is embedded in the heating plate 7 in the horizontal direction. The signal output terminal of the thermocouple 8 is electrically connected to the signal input terminal of the constant temperature controller 1 through a temperature control cable 5. The power input terminal of the heating plate 7 is electrically connected to the power output terminal of the constant temperature controller 1 through a temperature control cable 5. The thermocouple 8 is a K-type thermocouple, which can collect the temperature data of the heating plate 7 in real time and convert it into an electrical signal and transmit it to the constant temperature controller 1. After receiving the signal, the constant temperature controller 1 can automatically adjust the power supply to the heating plate 7 according to the set temperature to achieve precise temperature control during the heating process.

[0022] The high-temperature chip test socket 2 includes a socket base 201 and a socket cover 202. The socket base 201 is fixedly installed on the upper surface of the chip functional test circuit board 4. The socket pin mold 6 is positioned and engaged with the inner wall of the socket base 201 by a positioning pin. The socket base 201 is made of high-temperature resistant engineering plastic and is fixed to the upper surface of the chip functional test circuit board 4 by four countersunk screws. The double-headed spring pin 3 includes a needle tube, a spring disposed in the needle tube, and an upper needle head and a lower needle head that slide through both ends of the needle tube respectively. The upper end of the upper needle head corresponds to the pin of the chip under test, and the lower end of the lower needle head corresponds to the circuit contact of the chip functional test circuit board 4. The specific internal structure of the double-headed spring pin 3 is existing technology and will not be described in detail here.

[0023] The back of the constant temperature controller 1 is provided with multiple temperature control interfaces 12. Each temperature control interface 12 is electrically connected to a chip high temperature test socket 2 through an independent temperature control cable 5. The temperature control interface 12 is provided with multiple connection points 13. The multiple connection points 13 are heating block +, cooling fan +, heating block -, cooling fan -, LED (GD,NG) +, LED (GD) -, thermocouple -, thermocouple +, and LED (NG) -. Among them, heating block + / - corresponds to the heating plate, cooling fan + / - corresponds to the cooling fan, LED (GD,NG) +, LED (GD) -, and LED (NG) - correspond to the power supply and signal circuit of the LED panel 11, and thermocouple - / + is used to transmit the temperature signal of thermocouple 8.

[0024] The chip high temperature test socket 2 is equipped with a heat sink 9 and a cooling fan 10 on its top. The heat sink 9 is fixedly mounted to the top of the chip high temperature test socket 2 with bolts. The lower end of the heat sink 9 extends to the upper surface of the heating plate 7. The cooling fan 10 is installed on the upper surface of the heat sink 9. The power input terminal of the cooling fan 10 is electrically connected to the power output terminal of the constant temperature controller 1 through the temperature control cable 5. The heating plate 7 is floatingly connected to the top of the socket cover 202 by four elastic bolts. The heat sink 9 has a finned structure, and its lower side is fixedly mounted on the upper surface of the heating plate 7 and fits tightly to absorb the excess heat of the heating plate 7. The cooling fan 10 is a DC brushless fan. When the constant temperature controller 1 detects that the temperature of the heating plate 7 exceeds the set value, it will automatically start the fan to accelerate the airflow between the fins of the heat sink 9 and dissipate the heat quickly.

[0025] An LED panel 11 is fixedly installed on the outer wall of the chip high temperature test socket 2. The power input terminal of the LED panel 11 is electrically connected to the power output terminal of the constant temperature controller 1 through the temperature control cable 5. The LED panel 11 is equipped with green GD and red NG indicator lights. When the chip function test circuit board 4 detects that the chip parameters are qualified, it will send a qualified chip signal in the socket to the constant temperature controller 1 through RS232 / 485 communication. The constant temperature controller 1 transmits the qualified signal to the LED panel 11 of the test socket through the temperature control cable, and the green light is lit. If the parameters are not qualified, the red light is lit. The operator can quickly judge the chip status by the panel lights without checking the external equipment.

[0026] The working principle of the above embodiment is as follows: The constant temperature controller 1 provides power to the heating plate 7, cooling fan 10, and LED panel 11 of each chip high temperature test socket 2 through the temperature control interface 12 on the back and the independent temperature control cable 5, and through the connection contact point 13 in the interface. It also receives the temperature signal transmitted by the thermocouple 8 and the test signal transmitted by the chip function test circuit board 4. The double-headed spring needle 3 achieves a pressing electrical contact between the upper needle tip and the pin of the chip under test, and between the lower needle tip and the circuit contact of the chip function test circuit board 4 through the spring in the needle tube. When the heating plate 7 is working, the thermocouple 8 provides real-time feedback temperature data. The constant temperature controller 1 adjusts the power supply of the heating plate 7 according to the data. If the temperature is too high, the cooling fan 10 is started, and the heat sink 9 accelerates heat dissipation to maintain the set test temperature. After the chip function test circuit board 4 collects the chip electrical performance data, it transmits the pass / fail signal to the constant temperature controller 1 through RS232 / 485 communication. The constant temperature controller 1 controls the LED panel 11 through the temperature control cable to realize the real-time display of the results.

[0027] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical connection methods. As long as they can achieve their beneficial effects, they can be implemented. Therefore, this embodiment will not elaborate on their specific structural composition and working principle.

[0028] If certain terms are used in the specification and claims to refer to specific components, those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. This specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" as used throughout the specification and claims is an open-ended term and should be interpreted as "comprising but not limited to".

[0029] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip high-temperature testing system structure, characterized in that: The device includes a constant temperature controller (1), multiple chip high temperature test sockets (2), double-headed spring pins (3), and a chip function test circuit board (4). The multiple chip high temperature test sockets (2) are detachably electrically connected to the constant temperature controller (1) via temperature control cables (5). A socket pin mold (6) is fixedly provided on the upper surface of the chip high temperature test socket (2). The double-headed spring pins (3) are embedded in the socket pin molds (6) in the vertical direction, and the lower end of the double-headed spring pins (3) forms a pressing electrical contact with the circuit contacts of the chip function test circuit board (4). A heating plate (7) is horizontally fixed on the socket cover (201) of the chip high temperature test socket (2) on the side close to the chip function test circuit board (4). The lower surface of the heating plate (7) is correspondingly set to the upper surface of the chip under test. A thermocouple (8) is embedded in the interior of the heating plate (7) along the horizontal direction.

2. The structure of a high-temperature chip testing system according to claim 1, characterized in that: Furthermore, the signal output terminal of the thermocouple (8) is electrically connected to the signal input terminal of the thermostat (1) via the temperature control cable (5), and the power input terminal of the heating plate (7) is electrically connected to the power output terminal of the thermostat (1) via the temperature control cable (5).

3. The structure of a chip high-temperature testing system according to claim 1, characterized in that: The chip high temperature test socket (2) is provided with a heat sink (9) and a cooling fan (10) on the top. The heat sink (9) is fixedly assembled to the top of the chip high temperature test socket (2) by bolts.

4. The structure of a chip high-temperature testing system according to claim 3, characterized in that: The lower end of the radiator (9) extends to the upper surface of the heating plate (7), and the cooling fan (10) is installed on the upper surface of the radiator (9). The power input terminal of the cooling fan (10) is electrically connected to the power output terminal of the constant temperature controller (1) through the temperature control cable (5).

5. The structure of a high-temperature chip testing system according to claim 1, characterized in that: LED panels (11) are fixed on the outer wall of the chip high temperature test socket (2). The signal input terminal of the LED panel (11) is electrically connected to the signal output terminal of the chip function test circuit board (4) through the temperature control cable (5), and the power input terminal of the LED panel (11) is electrically connected to the power output terminal of the constant temperature controller (1) through the temperature control cable (5).

6. The structure of a high-temperature chip testing system according to claim 1, characterized in that: The thermostat (1) has multiple temperature control interfaces (12) on its back. Each temperature control interface (12) is electrically connected to a chip high temperature test socket (2) via an independent temperature control cable (5).

7. The structure of a high-temperature chip testing system according to claim 6, characterized in that: The temperature control interface (12) is provided with multiple connection points (13), which are heating block +, cooling fan +, heating block -, cooling fan -, LED (GD,NG) +, LED (GD) -, thermocouple -, thermocouple +, and LED (NG) -.

8. The structure of a high-temperature chip testing system according to claim 1, characterized in that: The chip high temperature test socket (2) includes a socket base (201) and a socket cover (202).

9. The structure of a chip high-temperature testing system according to claim 8, characterized in that: The socket base (201) is fixedly installed on the upper surface of the chip function test circuit board (4), and the socket pin mold (6) is positioned and engaged with the inner wall of the socket base (201) by a positioning pin.

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