A display device and a method of manufacturing the same

Abstract

The application provides a display device and a preparation method. The display device comprises a backlight unit, a display panel and a driving assembly. The backlight unit comprises a lamp plate provided with a first vertical through hole, and the first vertical through hole is filled with a first conductive material to form a first conductor which is electrically connected with the lamp plate. An edge region of the display panel has an interconnection part extending at least to a surface of the lamp plate, and the interconnection part has a second vertical through hole filled with a second conductive material to form a second conductor which is electrically connected with the display panel and the first conductor respectively. The driving assembly comprises a circuit board assembly and a driving chip arranged on a side of the lamp plate away from the display panel. The circuit board assembly, the first conductor and the second conductor are connected together to form a signal transmission channel, and the driving chip is arranged on the signal transmission channel. The application solves the problem that the existing scheme for the liquid crystal display panel has poor effect on reducing the lower frame width of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display device and its manufacturing method. Background Technology

[0002] As electronic devices such as monitors and tablets continue to demand higher screen-to-body ratios, achieving ultra-narrow bezels or even borderless displays has become a key aspect of technological development.

[0003] Traditional LCD panels use a COF (chip-on-film) solution for the bottom bezel, which, compared to the conventional COG (chip-on-glass) design, reduces the width of the bottom bezel and increases the screen-to-body ratio. However, the COF solution also has many problems. For example, when bonding the chip (IC, Integrated Circuit) to the FPC (Flexible Printed Circuit), the chip is located on the lower surface of the backlight module when the entire FPC is bent. This requires an outer frame to cover the bent FPC, resulting in a less effective reduction in the bottom bezel width. Summary of the Invention

[0004] This application provides a display device and manufacturing method, which solves the problem that the existing methods for reducing the width of the bottom bezel in liquid crystal display panels are not effective in reducing the width of the bottom bezel.

[0005] This application is implemented as follows: A display device includes a backlight unit, a display panel, and a driving assembly. The backlight unit includes a lamp board with a first vertical through-hole penetrating the lamp board. The first vertical through-hole is filled with a first conductive material to form a first conductor, and the lamp board is electrically connected to the first conductor. The edge region of the display panel has an interconnection portion extending at least to the surface of the lamp board. The interconnection portion has a second vertical through-hole penetrating the lamp board. The second vertical through-hole is filled with a second conductive material to form a second conductor. One end of the second conductor is electrically connected to the display panel, and the other end of the second conductor is electrically connected to the first conductor. The driving assembly includes a circuit board assembly and a driving chip. The circuit board assembly is disposed on the side of the lamp board away from the display panel, and the driving chip is used to output a driving signal. The circuit board assembly, the first conductor, and the second conductor are connected together to form a signal transmission channel. The driving chip is disposed on the signal transmission channel, and the signal transmission channel is used to transmit the driving signal to the display panel.

[0006] In some embodiments, the backlight unit further includes a back plate having a receiving cavity, wherein the lamp plate and the display panel are both disposed within the receiving cavity; the side of the interconnection portion away from the receiving cavity is provided with a mounting groove, the driving chip is disposed within the mounting groove, and the driving chip is electrically connected to the second conductor.

[0007] In some embodiments, the lamp panel includes a first glass substrate and an LED lamp disposed on the first glass substrate, the first vertical through hole is disposed on the first glass substrate, and the interconnection portion is laser-welded to the first glass substrate.

[0008] In some embodiments, the interconnection portion is bonded to the lamp panel using UV adhesive tape.

[0009] In some embodiments, the second conductor includes a first protrusion protruding from the side surface of the interconnect portion facing away from the display panel, and the first conductor has a first recess on the side surface facing the display panel, with the first protrusion located within the first recess.

[0010] In some embodiments, the first conductor includes a second protrusion protruding from the surface of the lamp plate facing the display panel, and the second conductor has a second recess on the surface away from the display panel, with the second protrusion located in the second recess.

[0011] In some embodiments, the interconnection unit and the display panel are an integral structure;

[0012] Alternatively, the interconnection part and the lamp panel can be integrated into one structure;

[0013] Alternatively, one end of the interconnection section is connected to the display panel, and the other end of the interconnection section is connected to the lamp panel.

[0014] In some embodiments, the display panel includes an array substrate and a color filter substrate disposed on the side of the array substrate facing away from the lamp plate;

[0015] The edge region of the array substrate on the side opposite to the color filter substrate has an interconnection portion extending at least to the surface of the lamp plate, and the second vertical through hole passes through the array substrate or through the array substrate and the color filter substrate.

[0016] In some embodiments, there are multiple first conductors and multiple second conductors, and the multiple first conductors are electrically connected to the multiple second conductors in a one-to-one correspondence.

[0017] The surface of the lamp panel facing away from the display panel is provided with a plurality of third conductors, and the plurality of third conductors are electrically connected to the plurality of first conductors in a one-to-one correspondence.

[0018] The backlight unit further includes a back plate, the back plate includes a base plate, the lamp board is disposed on the base plate, the base plate is provided with a clearance hole, the circuit board assembly includes a PCB board and a connector electrically connected to each other, at least one of the third conductors is electrically connected to one of the connectors, and the connector is located in the clearance hole.

[0019] In some embodiments, the backlight unit further includes a back plate, the back plate including a base plate, and the lamp plate disposed on the base plate;

[0020] The base plate is made of glass, and the light panel includes a first glass substrate and an LED light disposed on the first glass substrate. The first glass substrate and the base plate are bonded together by laser welding or by UV adhesive tape.

[0021] In some embodiments, the circuit board assembly is embedded on the side surface of the base plate facing the lamp panel, and a third conductor is embedded on the side surface of the lamp panel facing away from the display panel. The third conductor is electrically connected to the first conductor, and the circuit board assembly is electrically connected to the third conductor.

[0022] In some embodiments, the circuit board assembly is located at the edge region of the base plate, the circuit board assembly is opposite to the third conductor, and the brightness of the LED corresponding to the edge region of the base plate is less than the brightness of the remaining LEDs.

[0023] In some embodiments, the backlight unit further includes a back plate and a first support column, the back plate including a base plate, the first support column being connected to the base plate, and the first support column being used to support the display panel;

[0024] The surface of the first support column facing away from the base plate is provided with foam adhesive.

[0025] In some embodiments, the first support column is connected to the base plate; an extension plate is connected to the side of the first support column, and the side surface of the extension plate facing away from the base plate is flush with the side surface of the first support column facing away from the base plate.

[0026] In some embodiments, the lamp panel is provided with a plurality of second support columns;

[0027] The display device further includes an optical film assembly disposed on the second support column.

[0028] This application also provides a method for manufacturing a display device, including:

[0029] A first vertical through hole is made in the lamp panel, and the first vertical through hole penetrates the lamp panel;

[0030] A first conductive material is filled into the first vertical through hole to form a first conductor, and the first conductor is electrically connected to the lamp board.

[0031] A second vertical through-hole is formed on the interconnect portion in the edge area of ​​the display panel, and the second vertical through-hole passes through the interconnect portion;

[0032] A second conductive material is filled into the second vertical through hole to form a second conductor, which is electrically connected to the display panel.

[0033] The lamp plate with the first conductor, the optical film assembly, and the display panel electrically connected to the second conductor are stacked together to make the first conductor and the second conductor electrically connected.

[0034] A circuit board assembly is provided on the side of the lamp panel away from the display panel, and the circuit board assembly, the first conductor, and the second conductor are connected together to form a signal transmission channel;

[0035] The driver chip is disposed on the signal transmission channel, wherein the driver chip is used to output a drive signal, and the signal transmission channel is used to transmit the drive signal to the display panel.

[0036] The beneficial effects of the display device and manufacturing method provided in this application are as follows: Compared with the prior art, this application forms a first conductor penetrating the lamp board on the lamp board, and a second conductor penetrating the interconnection portion on the interconnection portion in the edge area of ​​the display panel, realizing the electrical connection between the first conductor and the second conductor. Then, the first conductor is electrically connected to a circuit board assembly disposed on the side of the lamp board facing away from the display panel. In this way, the first conductor, the second conductor, and the circuit board assembly are electrically connected together to form a signal transmission channel. This signal transmission channel extends along the thickness direction of the lamp board. The driver chip is disposed on this signal transmission channel, and subsequently, the signal is transmitted through the display panel. The display panel can be equipped with a narrow light-shielding layer on the display side to block the signal transmission channel. Compared with the existing technology that uses COF, which requires a wider light-shielding layer to block the FPC bending part and greatly increases the width of the bezel, this application effectively shortens the width of the light-shielding layer, thereby reducing the width of the bottom bezel. This is conducive to achieving an ultra-narrow bezel on all four sides of the display device, improving the user's visual experience and immersion. At the same time, eliminating the use of COF can reduce costs, reduce the COF bonding process, optimize the manufacturing process of the display device, improve the durability and vibration resistance of the product, and avoid product failure due to COF bonding connection failure. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the structure of the display device provided in the embodiments of this application;

[0038] Figure 2 This is a schematic diagram of the installation of the driver chip of the display device provided in the embodiments of this application. Figure 1 ;

[0039] Figure 3 This is a schematic diagram of the installation of the driver chip of the display device provided in the embodiments of this application. Figure 2 ;

[0040] Figure 4 This is a schematic diagram of the connection between the interconnection section and the lamp board of the display device provided in the embodiments of this application. Figure 1 ;

[0041] Figure 5 This is a schematic diagram of the connection between the interconnection section and the lamp board of the display device provided in the embodiments of this application. Figure 2 ;

[0042] Figure 6 This is a schematic diagram of the connection between the first conductor and the second conductor of the display device provided in the embodiments of this application. Figure 1 ;

[0043] Figure 7 This is a schematic diagram of the connection between the first conductor and the second conductor of the display device provided in the embodiments of this application. Figure 2 ;

[0044] Figure 8 This is a side view of the array substrate of the display device provided in the embodiments of this application;

[0045] Figure 9 This is a schematic flowchart of the manufacturing method of the display device provided in the embodiments of this application;

[0046] Figure 10 yes Figure 9 A schematic diagram of the device after step S101 is executed;

[0047] Figure 11 yes Figure 9 A schematic diagram of the device after step S102 is executed;

[0048] Figure 12 yes Figure 9 A schematic diagram of the device after step S103 is executed;

[0049] Figure 13 yes Figure 9 A schematic diagram of the device after step S104 is executed;

[0050] Figure 14 yes Figure 9 A schematic diagram of the device after step S105 is executed.

[0051] Reference numerals: 10, back plate; 100, receiving cavity; 11, bottom plate; 110, clearance hole; 12, side plate; 20, first support column; 21, foam adhesive; 22, extension plate;

[0052] 30. Lamp board; 300. First vertical through hole; 31. First conductor; 311. First recess; 312. Second protrusion; 301. Laser solder joint; 302. UV adhesive tape; 303. Groove; 32. Third conductor; 33. Second support column; 34. First glass substrate; 35. LED lamp;

[0053] 40. Array substrate; 400. Second vertical through-hole; 41. Interconnection portion; 42. Second conductor; 421. First protrusion; 422. Second recess; 50. Color filter substrate;

[0054] 61. PCB board; 62. Motherboard; 63. Connector; 70. Driver chip; 80. Optical film assembly. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0056] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0057] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0058] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0059] It should also be noted that in the embodiments of this application, the same reference numerals are used to represent the same component or part. For the same part in the embodiments of this application, the reference numerals may only be used to mark one part or component as an example. It should be understood that the reference numerals are also applicable to other identical parts or components.

[0060] This application provides a display device and manufacturing method, which solves the problem that the existing methods for reducing the width of the bottom bezel in liquid crystal display panels are not effective in reducing the width of the bottom bezel.

[0061] refer to Figure 1 The display device provided in this application includes a backlight unit, a display panel, and a driving assembly. The backlight unit includes a lamp board 30, on which a first vertical through hole 300 is provided. The first vertical through hole 300 is filled with a first conductive material to form a first conductor 31, and the lamp board 30 is electrically connected to the first conductor 31. The edge region of the display panel has an interconnection portion 41 extending at least to the surface of the lamp board 30. The interconnection portion 41 has a second vertical through hole 400, which is filled with a second conductive material to form a second conductor 42. One end of the second conductor 42 is electrically connected to the display panel, and the other end of the second conductor 42 is electrically connected to the first conductor 31. The driving assembly includes a circuit board assembly and a driving chip 70. The circuit board assembly is disposed on the side of the lamp board 30 away from the display panel, and the driving chip 70 is used to output driving signals. The circuit board assembly, the first conductor 31, and the second conductor 42 are connected together to form a signal transmission channel. The driving chip 70 is disposed on the signal transmission channel, and the signal transmission channel is used to transmit driving signals to the display panel.

[0062] Among them, reference Figure 1 The backlight unit also includes a back plate 10 with a receiving cavity 100. The back plate 10 includes a bottom plate 11, a side plate 12 surrounding the periphery of the bottom plate 11, and a first support column 20. The first support column 20 is disposed on the bottom plate 11 and is disposed close to the side plate 12. The lamp plate 30 is disposed on the bottom plate 11. The lamp plate 30 includes a first glass substrate 34 and an LED lamp 35 disposed on the first glass substrate 34. A first circuit is disposed in the first glass substrate 34. A first conductor 31 disposed on the lamp plate 30 that penetrates the lamp plate 30 is equivalent to being disposed through the first glass substrate 34, and the first conductor 31 is electrically connected to the first circuit disposed in the first glass substrate 34.

[0063] Further reference Figure 1An optical film assembly 80 can be further installed on the lamp panel 30. In order to install the optical film assembly 80 more stably, multiple second support columns 33 can be set on the surface of the first glass substrate 34, and the optical film assembly 80 can be set on the second support columns 33. This can ensure that there is a certain distance between the optical film assembly 80 and the LED lamp 35, which is beneficial for the optical film assembly 80 to perform optical response to the light emitted by the LED lamp 35.

[0064] refer to Figure 1 This application provides a display panel above the optical film assembly 80, specifically on the first support post 20. The display panel includes an array substrate 40 and a color filter substrate 50 mounted opposite each other. There is a certain distance between the display panel and the circuit board assembly. To facilitate electrical connection between the display panel and the circuit board assembly, the second circuitry included in the array substrate 40 is electrically connected to the circuit board assembly. An interconnection portion 41 extending at least to the surface of the lamp board 30 is provided in the edge region of the display panel. Specifically, an interconnection portion 41 extending at least to the surface of the lamp board 30 is provided in the edge region of the array substrate 40 on the side facing away from the color filter substrate 50. A second conductor 42 penetrating the interconnection portion 41 is provided within the interconnection portion 41, and the second conductor 42 is connected to the second circuitry. Electrical connection: When the height of the interconnect part 41 in the thickness direction of the array substrate 40 is set such that the interconnect part 41 can contact the first glass substrate 34 when the array substrate 40 is mounted on the first support post 20, and the first conductor 31 and the second conductor 42 are aligned, it can be ensured that the second conductor 42 and the first conductor 31 are in contact with each other to achieve electrical connection. In this way, the second line of the array substrate 40 can be connected to the first line of the lamp board 30 by connecting the first conductor 31 and the second conductor 42. Only the first conductor 31 needs to be electrically connected to the circuit board assembly to achieve electrical connection between the second line and the circuit board assembly and between the first line and the circuit board assembly, which greatly reduces the number of lines that need to be connected and simplifies the line connection steps.

[0065] Furthermore, the fact that the interconnect portion 41 extends to the surface of the lamp panel 30 indicates that the interconnect portion 41 is in contact with the first glass substrate 34. This means that the interconnect portion 41 and the first support column 20 together support the array substrate 40. In this way, the first support column 20 does not need to be set on the side of the array substrate 40 where the interconnect portion 41 is located, which can reduce costs.

[0066] It should be noted that a first conductor 31 penetrating the lamp board 30 is provided on the lamp board 30, and a second conductor 42 penetrating the interconnection part 41 is provided in the interconnection part 41, realizing the electrical connection between the first conductor 31 and the second conductor 42. The first conductor 31 is then electrically connected to a circuit board assembly disposed on the side of the lamp board 30 facing away from the display panel. In this way, the first conductor 31, the second conductor 42, and the circuit board assembly are electrically connected together to form a signal transmission channel. This signal transmission channel extends along the thickness direction of the lamp board 30. The driver chip 70 is disposed on this signal transmission channel, and subsequently, the signal is transmitted through the display panel. By using a narrower light-shielding layer to block the signal transmission channel, compared to the existing COF solution which requires a wider light-shielding layer to cover the bent part of the FPC and greatly increases the bezel width, this application effectively shortens the width of the light-shielding layer, thereby reducing the width of the bottom bezel. This facilitates the achievement of ultra-narrow bezels on all four sides of the display device, improving the user's visual experience and immersion. At the same time, eliminating the use of COF reduces costs, streamlines the COF bonding process, optimizes the manufacturing process of the display device, improves the product's durability and vibration resistance, and avoids product failures caused by COF bonding connection failures.

[0067] Optional, see reference Figure 1 The circuit board assembly of this application can be disposed on the side surface of the base plate 11 facing away from the accommodating cavity 100. The circuit board assembly includes a PCB board 61 and a main board 62 / power board. The first conductor 31 is electrically connected to the circuit board assembly, which is actually the first conductor 31 is electrically connected to the PCB board 61. The PCB board 61 is electrically connected to the main board 62 / power board. In this way, the internal circuit connection of the display device can be realized without increasing the bezel width, and it is also more convenient for the installation and maintenance of the main board 62 / power board and the PCB board 61.

[0068] Compared to the existing technology that uses a COF (Copy-on-Flight) solution to reduce the bottom bezel width by connecting the driver chip 70 to the FPC and then bonding it to the PCB board 61, this method increases the bonding process for the driver chip 70 and is prone to connection failure, causing display malfunctions. This application allows the driver chip 70 to be positioned on the signal transmission channel formed by connecting the first conductor 31, the second conductor 42, and the circuit board assembly. The specific placement location can be multiple.

[0069] In some embodiments, the driver chip 70 is integrated onto the PCB board 61. For example, the driver chip 70 can be directly integrated onto the PCB board 61 during PCB board fabrication. This allows the installation and circuit connection of the driver chip 70 to be completed simultaneously during PCB board manufacturing, reducing the need for independent positioning, soldering, and testing processes in subsequent display device assembly stages, thereby simplifying the production process and reducing assembly time and the risk of poor connections.

[0070] In other embodiments, the driver chip 70 can be additionally connected to the PCB board 61 after the PCB board 61 has been manufactured, during the assembly of the display device.

[0071] In some embodiments, reference Figure 2 and Figure 3 The interconnection part 41 has a mounting groove on the side away from the accommodating cavity 100. The bottom of the mounting groove has an opening, and the second conductor 42 is exposed from the opening. The driving chip 70 is disposed in the mounting groove and is electrically connected to the second conductor 42.

[0072] It should be noted that when the driver chip 70 is electrically connected to the second conductor 42, and the second conductor 42, the first conductor 31, and the PCB board 61 are electrically connected together, the driver chip 70 is also connected to the PCB board 61. This connection method allows the signal emitted by the driver chip 70 to be directly transmitted to the array substrate 40 and the lamp board 30. Compared to integrating the driver chip 70 on the PCB board 61, where the driver chip 70 needs to be connected to the lines on the PCB board 61 and the signal needs to be transmitted on the lines on the PCB board 61 before it can be transmitted to the array substrate 40 and the lamp board 30, this application effectively optimizes the signal transmission path and also reduces the number of lines that need to be connected when the driver chip 70 is connected to the signal transmission line, thus reducing workload and cost.

[0073] Optionally, a second vertical through-hole 400 can be first opened on the interconnect part 41, as shown in the reference. Figure 2 A mounting groove communicating with the second vertical through-hole 400 is formed on the side of the interconnect part 41. A driver chip 70 is placed in the mounting groove, and the driver chip 70 will extend into the second vertical through-hole 400 or fill the entire mounting groove. Then, a second conductive material is filled into the second vertical through-hole 400 to form a second conductor 42. At this time, the second conductor 42 contacts and connects with the driver chip 70. (Reference) Figure 3 After a mounting groove is provided on the side of the interconnection part 41, a connection hole is opened at the bottom of the mounting groove to connect the mounting groove and the second vertical through hole 400. The driver chip 70 is placed in the mounting groove. When the second conductive material is filled in the second vertical through hole 400, the second conductive material will fill the second vertical through hole 400 and the connection hole, thereby making the second conductor 42 formed in the second vertical through hole 400 electrically connected to the driver chip 70.

[0074] After the array substrate 40 of this application is installed, the interconnection part 41 contacts the lamp board 30, and the second conductor 42 contacts the first conductor 31. In order to make the array substrate 40 more stable and not move, thereby ensuring that the first conductor 31 and the second conductor 42 are electrically connected, a connection structure can be further provided between the interconnection part 41 and the lamp board 30 to make the connection between the two more secure.

[0075] It should be noted that the base material of the lamp board 30 can be the same as the base material of the printed circuit board, that is, the insulating medium, such as glass fiber reinforced epoxy resin. Of course, the base material of the lamp board 30 can also be glass, that is, the lamp board 30 includes a glass substrate and LED lamps 35. Alternatively, the base material of the lamp board 30 can be partly glass and partly other insulating materials. This application embodiment does not make specific limitations, and the specific choice can be made according to the actual situation.

[0076] In some embodiments, when the base material of the lamp panel 30 is glass, the lamp panel 30 includes a first glass substrate 34 and LED lights 35 disposed on the first glass substrate 34, and a first vertical through hole 300 is disposed on the first glass substrate 34. Figure 4 The connection between the interconnection part 41 and the lamp board 30 can be achieved by laser welding between the interconnection part 41 and the first glass substrate 34. After the array substrate 40 is installed and the first conductor 31 and the second conductor 42 are electrically connected, the interconnection part 41 and the first glass substrate 34 are laser welded together. This ensures that the interconnection part 41 and the lamp board 30 are firmly connected together. This not only prevents the array substrate 40 from moving and affecting the display effect, but also ensures that the electrical connection between the first conductor 31 and the second conductor 42 does not fail, thereby ensuring that the signal transmission line can transmit signals normally and reducing the probability of display device failure.

[0077] Optionally, there can be multiple laser solder points 301 between the interconnection part 41 and the first glass substrate 34. For example, multiple laser solder points 301 can be distributed around the first conductor 31. This allows for a comprehensive connection between the interconnection part 41 and the lamp board 30, making the connection between the interconnection part 41 and the lamp board 30 more robust. The first conductor 31 and the second conductor 42 will not easily experience connection failure.

[0078] Optionally, in order to enable the interconnection part 41 and the lamp board 30 to be laser welded together, the material of the interconnection part 41 can be set to be the same as that of the lamp board 30, that is, the same as the material of the first glass substrate 34 of the lamp board 30. This is equivalent to setting the material of the interconnection part 41 to glass. The interconnection part 41 can be integrally manufactured when manufacturing the array substrate 40. This not only saves manufacturing costs but also improves manufacturing efficiency, making the connection between the interconnection part 41 and the array substrate 40 more secure and less likely to fall off. Of course, the interconnection part 41 can also be added to the already manufactured array substrate 40. This allows the already manufactured array substrate 40 to be modified, making the manufacturing of narrow bezel display devices more convenient and faster.

[0079] Optional, see reference Figure 5When the base material of the light panel 30 is any of the above-described materials, the connection between the interconnection part 41 and the light panel 30 can be achieved by bonding the interconnection part 41 and the light panel 30 together with UV adhesive tape 302.

[0080] Among them, UV adhesive tape 302 is a high-end functional tape that controls the strength of adhesion through ultraviolet light. It is equivalent to a "smart double-sided tape". Before being irradiated by ultraviolet light, it has strong adhesion and can firmly fix the workpiece. After being irradiated by ultraviolet light, the adhesion will become extremely low instantly, and it can be easily and cleanly peeled off without leaving any trace. It can not only stick firmly and peel off easily, but also withstand the high temperature (such as reflow soldering) and chemical corrosion (such as electroplating solution) in subsequent processes.

[0081] It should be noted that by using UV adhesive tape 302 to bond the interconnect part 41 and the lamp board 30, the interconnect part 41 and the lamp board 30 can be firmly connected together during the assembly of the display device, ensuring that the electrical connection between the first conductor 31 and the second conductor 42 will not fail. When it is necessary to repair or replace the internal components of the display device, the properties of UV adhesive tape 302 can be utilized to irradiate the UV adhesive tape 302 with ultraviolet light, thereby making the array substrate 40 easier to disassemble, facilitating the maintenance of the internal components of the display device, and improving the overall practicality and durability of the display device.

[0082] In some embodiments, reference Figure 6 The second conductor 42 includes a first protrusion 421 protruding from the side surface of the interconnection portion 41 facing away from the display panel. The side surface of the first conductor 31 facing the display panel is provided with a first recess 311, and the first protrusion 421 is located in the first recess 311.

[0083] It should be noted that after the array substrate 40 is installed, the interconnect portion 41 contacts the lamp panel 30, causing the first conductor 31 and the second conductor 42 to contact and achieve electrical connection. To further improve the stability of the electrical connection between the first conductor 31 and the second conductor 42, the contact area between the first conductor 31 and the second conductor 42 can be increased. In this application, when the first conductor 31 is installed, a first recess 311 is provided on the surface of the first conductor 31 facing the display panel. When the second conductor 42 is installed, the side of the second conductor 42 away from the array substrate 40 is set to protrude from the interconnect portion 41. The protruding part, that is, the first protruding part 421, can be set to be connected to the first... The recess 311 is appropriately sized and shaped so that when the interconnect part 41 contacts the lamp board 30, the first protrusion 421 will be located in the first recess 311. The contact area between the first conductor 31 and the second conductor 42 is the same as the contact area between the first protrusion 421 and the first recess 311, which is significantly increased. Moreover, when installing the array substrate 40, it is not necessary to spend a lot of time aligning the first conductor 31 and the second conductor 42. Simply placing the first protrusion 421 in the first recess 311 is sufficient to accurately position the array substrate 40, which greatly improves the installation efficiency of the array substrate 40 and thus improves the assembly efficiency of the display device.

[0084] In addition to the above-described structure connecting the first conductor 31 and the second conductor 42, reference can also be made to Figure 7 A second recess 422 is provided on the surface of the second conductor 42 away from the display panel. The first conductor 31 includes a second protrusion 312 protruding from the surface of the lamp plate 30 facing the display panel, and the second protrusion 312 is located in the second recess 422. This structure can also quickly and accurately position the array substrate 40, and can increase the contact area between the first conductor 31 and the second conductor 42, making the electrical connection between the first conductor 31 and the second conductor 42 less prone to failure.

[0085] In this embodiment, the interconnection part 41 is located between the display panel and the lamp board 30. The second conductor 42 disposed between the interconnection parts 41 is electrically connected to the first conductor 31 disposed in the lamp board 30, thereby making the electrical connection between the display panel and the lamp board 30 conductive. There can be various connection relationships between the interconnection part 41 and the display panel and the lamp board 30.

[0086] Optionally, the interconnection section 41 is an integral structure with the display panel. The display panel of this application includes an array substrate 40 and a color filter substrate 50 disposed opposite to each other. The interconnection section 41 is an integral structure with the display panel, that is, the interconnection section 41 and the array substrate 40 are an integral structure. The interconnection section 41 can be made of glass material, so that the interconnection section 41 can be manufactured at the same time as the array substrate 40. In this way, after the array substrate 40 is installed, it is only necessary to connect the interconnection section 41 and the lamp board 30 together to achieve a stable and firm position of the interconnection section 41 between the display panel and the lamp board 30.

[0087] Optionally, the interconnecting part 41 and the lamp board 30 are an integral structure. The lamp board 30 can be configured to include a first glass substrate 34, and the interconnecting part 41 can be made of glass. Making the interconnecting part 41 and the lamp board 30 an integral structure is equivalent to making the interconnecting part 41 and the first glass substrate 34 an integral structure. The first glass substrate 34 and the interconnecting part 41 can be integrally molded. After the display panel is installed, only the connection between the display panel and the interconnecting part 41 is needed to ensure that the interconnecting part 41 is stably and securely located between the display panel and the lamp board 30. Specifically, the connection method between the display panel and the interconnecting part 41 can be laser welding or UV adhesive tape bonding.

[0088] Optionally, one end of the interconnection section 41 is connected to the display panel, and the other end of the interconnection section 41 is connected to the lamp board 30. The interconnection section 41 can be used as an independent component. When installing the display device, the interconnection section 41 is first connected to the lamp board 30, and then the display panel is placed on the interconnection section 41, thus connecting the display panel and the interconnection section 41 together.

[0089] In some embodiments, reference Figure 1 The display panel includes an array substrate 40 and a color filter substrate 50 disposed on the side of the array substrate 40 away from the lamp plate 30; the edge region of the side of the array substrate 40 away from the color filter substrate 50 has an interconnection portion 41 extending at least to the surface of the lamp plate 30, and a second vertical through hole 400 passes through the array substrate 40.

[0090] It should be noted that the interconnect part 41 is provided with a second vertical through hole 400. Filling the second vertical through hole 400 with a second conductive material will form a second conductor 42. The second conductor 42 is electrically connected to the display panel, that is, electrically connected to the circuits in the display panel. When the display panel includes an array substrate 40 and a color filter substrate 50, the circuits of the display panel are located in the array substrate 40 and the color filter substrate 50. When the circuits of the display panel are located in the array substrate 40, the second conductor 42 can pass through the array substrate 40 to be electrically connected to the circuits in the array substrate 40. At this time, the second vertical through hole 400 needs to pass through the array substrate 40. In this way, the second conductor 42 formed after filling the second vertical through hole 400 with the second conductive material will pass through the array substrate 40.

[0091] Optionally, the second vertical via 400 can also pass through the array substrate 40 and the color filter substrate 50. In this way, when the circuitry of the display panel is disposed within the color filter substrate 50, the second conductor 42 formed after the second vertical via 400 is filled with the second conductive material will pass through the array substrate 40 and the color filter substrate 50 to electrically connect with the circuitry within the color filter substrate 50.

[0092] In some embodiments, reference Figure 1 and Figure 8 There are multiple first conductors 31 and multiple second conductors 42, and the multiple first conductors 31 are electrically connected to the multiple second conductors 42 in a one-to-one correspondence; multiple third conductors 32 are embedded on the side surface of the lamp board 30 facing away from the display panel, and the multiple third conductors 32 are electrically connected to the multiple first conductors 31 in a one-to-one correspondence; the backlight unit also includes a back plate 10, the back plate 10 includes a base plate 11, and the lamp board 30 is disposed on the base plate 11; the base plate 11 is provided with a clearance hole 110, and the circuit board assembly includes a PCB board 61 and a connector 63 that are electrically connected to each other, and at least one third conductor 32 is electrically connected to a connector 63, and the connector 63 is located in the clearance hole 110.

[0093] refer to Figure 8There are multiple second conductors 42, which are arranged at intervals along the length of the edge of the display panel. Multiple first conductors 31 are connected to the multiple second conductors 42 in a one-to-one correspondence. It should be noted that in this embodiment, the electrical connection between the first conductor 31 and the circuit board assembly means that each first conductor 31 is electrically connected to the circuit board assembly. In order to reduce the number of connection lines and the workload, multiple connectors 63 can be provided for the multiple first conductors 31. That is, the multiple first conductors 31 are divided into multiple groups, and each group has at least one first conductor 31. Each group of first conductors 31 is connected to the same connector 63. Finally, the multiple connectors 63 are electrically connected to the circuit board assembly.

[0094] Further reference Figure 1 Since the cross-sectional area of ​​the first conductor 31 is small, it cannot be effectively connected to the connector 63. Therefore, in this embodiment, a plurality of third conductors 32 are also embedded on the side surface of the lamp plate 30 facing away from the display panel. The plurality of third conductors 32 are electrically connected to the plurality of first conductors 31 in a one-to-one correspondence. Connecting the connector 63 to at least one third conductor 32 can ensure that the connector 63 is effectively connected to the first conductor 31. In addition, the fact that the third conductors 32 are embedded on the side surface of the lamp plate 30 facing the base plate 11 can prevent the overall thickness of the lamp plate 30 from increasing, and thus prevent the thickness of the display device from increasing.

[0095] After setting connector 63, refer to Figure 1 An obstacle hole 110 is made on the base plate 11 at the position corresponding to the connector 63, so that the connector 63 is located in the obstacle hole 110. In this way, the thickness of the connector 63 and the thickness of the base plate 11 will overlap to a certain extent. This allows the overall thickness of the display device to not increase after the connector 63 is electrically connected to the third conductor 32. Moreover, the connecting wire used for the electrical connection between the connector 63 and the circuit board assembly can also pass through the obstacle hole 110, which is conducive to the easier connection of the connector 63 and the circuit board assembly.

[0096] In some embodiments, the backlight unit further includes a back plate 10, the back plate 10 includes a base plate 11, and a lamp plate 30 is disposed on the base plate 11; the base plate 11 is made of glass, and the lamp plate 30 includes a first glass substrate 34 and an LED lamp 35 disposed on the first glass substrate 34. The first glass substrate 34 and the base plate 11 are bonded together by laser welding or by UV adhesive tape 302.

[0097] It should be noted that the lamp board 30 of this application is mounted on the base plate 11. The lamp board 30 and the base plate 11 need to be firmly connected to avoid the lamp board 30 shifting and causing uneven display brightness of the display device. When the lamp board 30 of this application includes the first glass substrate 34, the base plate 11 can also be made of glass. In this way, the base plate 11 and the first glass substrate 34 can be connected together by laser welding, which can improve the connection between the base plate 11 and the lamp board 30.

[0098] Of course, the lamp board 30 and the base plate 11 can also be bonded together using UV adhesive tape 302. This makes the connection surface between the lamp board 30 and the base plate 11 larger and the connection between the two more secure. Moreover, the UV adhesive tape 302 bonding method is easier to operate.

[0099] In some embodiments, the circuit board assembly is embedded on the side surface of the base plate 11 facing the lamp panel 30, and a third conductor 32 is embedded on the side surface of the lamp panel 30 facing away from the display panel. The third conductor 32 is electrically connected to the first conductor 31, and the circuit board assembly is electrically connected to the third conductor 32.

[0100] It should be noted that by embedding the circuit board assembly on the side of the base plate 11 facing the lamp board 30, the height of the circuit board assembly in the thickness direction of the base plate 11 will partially overlap with the thickness of the base plate 11. This can effectively reduce the overall thickness of the display device. Moreover, the circuit board assembly and the third conductor 32 can be directly electrically connected without the need to open a clearance hole 110 on the base plate 11 for the connecting wire to pass through, which reduces the process operation steps and improves the manufacturing efficiency of the display device.

[0101] Optionally, when the circuit board assembly is embedded on the side surface of the base plate 11 facing the lamp board 30, the top surface of the circuit board assembly can be flush with the side surface of the base plate 11 facing the lamp board 30. The circuit board assembly of this application includes a PCB board 61, which is electrically connected to the third conductor 32. A pad can be provided on the top surface of the PCB board 61, so that the electrical connection can be achieved by contacting the pad with the third conductor 32, which is more convenient.

[0102] Of course, in addition to the PCB board 61 and the third conductor 32 being electrically connected, the connector 63 that is electrically connected to the third conductor 32 can also be embedded on the side surface of the base plate 11 facing the lamp board 30. In this way, the connecting wire that connects the connector 63 and the PCB board 61 can be placed inside the base plate 11. This connection method can also reduce the thickness of the display device.

[0103] In some embodiments, the circuit board assembly is located in the edge region of the base plate 11, the circuit board assembly is opposite to the third conductor 32, and the brightness of the LED 35 corresponding to the edge region of the base plate 11 is less than the brightness of the remaining LEDs 35.

[0104] It should be noted that the interconnection part 41 is connected to the edge area of ​​the display panel, and the first conductor 31 is located in the edge area of ​​the lamp board 30. In order to shorten the connection path between the circuit board assembly and the third conductor 32, the circuit board assembly can be set in the edge area of ​​the base plate 11. Furthermore, the brightness of the LED 35 corresponding to the edge area of ​​the base plate 11 can be reduced, that is, the output power of the LED 35 corresponding to the edge area of ​​the base plate 11 can be reduced. In this way, the heat generated by the LED 35 will be reduced, thereby reducing the adverse effects on the circuit board assembly set in the edge area of ​​the base plate 11, and preventing the circuit in the circuit board assembly from failing due to high temperature.

[0105] In some embodiments, reference Figure 1 The backlight unit also includes a back plate 10 and a first support column 20. The back plate 10 includes a base plate 11, and the first support column 20 is connected to the base plate 11. The first support column 20 is used to support the display panel. Foam adhesive 21 is provided on the side surface of the first support column 20 facing away from the base plate 11.

[0106] It should be noted that the display panel is mounted on the first support column 20, so foam adhesive 21 can be applied to the surface of the first support column 20 facing away from the base plate 11. This will firmly bond the display panel to the first support column 20, preventing the display panel from shifting. In addition, the foam adhesive 21 can also play a certain role in cushioning, preventing the first support column 20 from damaging the display panel.

[0107] It is understood that the first support column 20 can be a plastic frame. The first support column 20 is set close to the side plate 12 of the back plate 10. The first support column 20 is located between the lamp plate 30 and the side plate 12. Since the edge area of ​​the display panel of this application has an interconnection part 41, when the interconnection part 41 contacts the lamp plate 30, the interconnection part 41 can be regarded as the first support column 20, which can also play the role of supporting the array substrate 40. Therefore, when connecting the first support column 20 on the base plate 11, it is not necessary for the first support column 20 to completely surround the lamp plate 30. This can reduce the manufacturing cost of the first support column 20 and reduce the construction cycle of connecting the first support column 20 to the base plate 11, thereby improving the assembly efficiency of the display device.

[0108] In some embodiments, reference Figure 1 The first support column 20 is connected to the base plate 11; an extension plate 22 is connected to the side of the first support column 20, and the surface of the extension plate 22 facing away from the base plate 11 is flush with the surface of the first support column 20 facing away from the base plate 11.

[0109] With the above configuration, both the first support column 20 and the extension plate 22 can be in contact with the display panel, which can increase the support area of ​​the display panel, so that the central area of ​​the display panel will not easily deform.

[0110] Furthermore, foam adhesive 21 can also be provided on the extension plate 22, so that the extension plate 22 can be firmly connected to the display panel, thereby connecting the first support column 20 and the extension plate 22 to the display panel and better supporting the display panel.

[0111] In this embodiment, besides connecting the first support column 20 to the base plate 11 and then placing the display panel on the first support column 20 to support the display panel, alternatively, the first support column 20 can be connected to the side surface of the display panel with the interconnection portion 41. That is, the first support column 20 is connected to the display panel, so the first support column 20 and the interconnection portion 41 are located on the same side surface of the display panel. When installing the display panel, the interconnection portion 41 is brought into contact with the lamp board 30, and the first support column 20 is brought into contact with the base plate 11, thus allowing the display panel to be installed above the lamp board 30. This method of installing the display panel allows the first support column 20 and the interconnection portion 41 to be fabricated together with the array substrate 40 of the display panel, saving installation time.

[0112] Optionally, the material of the first support post 20 connected to the array substrate 40 can be set to be the same as the material of the interconnect part 41, that is, the first support post 20 is made of glass. In this way, the glass substrate of the array substrate 40, the interconnect part 41 and the first support post 20 can be integrally formed, which greatly improves the manufacturing efficiency of the array substrate 40, the interconnect part 41 and the first support post 20.

[0113] refer to Figure 9 This application provides a method for manufacturing a display device, comprising the following steps:

[0114] S101. A first vertical through hole 300 is made on the lamp panel 30, and the first vertical through hole 300 penetrates the lamp panel 30.

[0115] refer to Figure 10 , Figure 10 This is a schematic diagram of the device after step S101 is executed. The lamp board 30 in this embodiment includes a first glass substrate 34. Step S101 actually involves opening a first vertical through hole 300 on the first glass substrate 34, and the first vertical through hole 300 penetrates the first glass substrate 34.

[0116] Optionally, a laser-induced etching valve can be used to open the first vertical through hole 300. Specifically, the interior of the first glass substrate 34 is first modified with a laser, and then the modified area is selectively removed by a chemical etching solution to open the first vertical through hole 300.

[0117] S102. Fill the first vertical through hole 300 with a first conductive material to form a first conductor 31, which is electrically connected to the lamp board 30.

[0118] refer to Figure 11 , Figure 11 This is a schematic diagram of the device after step S102 is executed.

[0119] A specific implementation of step S102 above may include the following steps: preparing a metal seed layer on the first glass substrate 34, the metal seed layer covering the first glass substrate 34 and the side surface of the first vertical via 300, wherein the metal seed layers on the side surface of the first vertical via 300 are electrically connected to the metal seed layers on the first glass substrate 34; preparing a metal conductive layer on each metal seed layer; removing the metal seed layer and the metal conductive layer on the first glass substrate 34, thereby forming a first conductor 31 within the first vertical via 300. The material of the metal conductive layer here is the first conductive material.

[0120] S103. A second vertical through hole 400 is formed on the interconnection portion 41 in the edge area of ​​the display panel, and the second vertical through hole 400 passes through the interconnection portion 41.

[0121] refer to Figure 12 , Figure 12 This is a schematic diagram of the device after step S103 is executed.

[0122] Optionally, the interconnect part 41 is made of glass, and the second vertical through hole 400 can also be made by laser-induced etching. The specific manufacturing method can be referred to the manufacturing method of the first vertical through hole 300 mentioned above, and will not be repeated here.

[0123] S104. Fill the second vertical through hole 400 with a second conductive material to form a second conductor 42, which is electrically connected to the display panel.

[0124] refer to Figure 13 , Figure 13 This is a schematic diagram of the device after step S104 is executed.

[0125] S105, the lamp panel 30 with the first conductor 31, the optical film assembly 80, and the display panel electrically connected to the second conductor 42 are stacked and arranged so that the first conductor 31 and the second conductor 42 are electrically connected.

[0126] refer to Figure 14, Figure 14 This is a schematic diagram of the device after step S105 is executed.

[0127] S106. A circuit board assembly is provided on the side of the lamp board 30 away from the display panel, and the circuit board assembly, the first conductor 31 and the second conductor 42 are connected together to form a signal transmission channel.

[0128] refer to Figure 1 , Figure 1 This is a schematic diagram of the device after step S106 is executed.

[0129] Before implementing step S106, a groove 303 can be formed on the side surface of the lamp board 30 facing away from the display panel. The groove 303 communicates with the first vertical through hole 300. The groove 303 and the first vertical through hole 300 are filled with a first conductive material to form a first conductor 31 and a third conductor 32 connected together. The circuit board assembly in step S106 may include a PCB board 61 and a connector 63. When implementing step S106, the connector 63 can be electrically connected to the third conductor 32 to electrically connect the connector 63 to the PCB board 61.

[0130] S107. The driver chip 70 is placed on the signal transmission channel, wherein the driver chip 70 is used to output the drive signal, and the signal transmission channel is used to transmit the drive signal to the display panel.

[0131] In the manufacturing method of this application embodiment, when manufacturing the display device, a first conductor 31 penetrating the lamp board 30 is formed on the lamp board 30, and a second conductor 42 penetrating the interconnection portion 41 is formed on the interconnection portion 41 in the edge region of the display panel. The first conductor 31 and the second conductor 42 are electrically connected, and then the first conductor 31 is electrically connected to a circuit board assembly disposed on the side of the lamp board facing away from the display panel. In this way, the first conductor 31, the second conductor 42, and the circuit board assembly are electrically connected together to form a signal transmission channel. This signal transmission channel extends along the thickness direction of the lamp board. The driver chip 70 is disposed on this signal transmission channel. The signal transmission channel can be blocked by setting a narrower light-shielding layer on the display side of the display panel. Compared with the existing COF solution, which requires a wider light-shielding layer to block the FPC bending part and greatly increases the bezel width, this application effectively shortens the width of the light-shielding layer, thereby reducing the width of the bottom bezel. This is conducive to achieving an ultra-narrow bezel on all four sides of the display device, improving the user's visual experience and immersion. At the same time, eliminating the use of COF can reduce costs, reduce the COF bonding process, optimize the manufacturing process of the display device, improve the durability and vibration resistance of the product, and avoid product failure due to COF bonding connection failure.

[0132] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display device, characterized by comprising: include: The backlight unit includes a lamp board (30), the lamp board (30) is provided with a first vertical through hole (300) penetrating the lamp board (30), the first vertical through hole (300) is filled with a first conductive material to form a first conductor (31), and the lamp board (30) is electrically connected to the first conductor (31). The display panel has an edge region having an interconnection portion (41) extending at least to the surface of the lamp plate (30). The interconnection portion (41) has a through second vertical through hole (400). The second vertical through hole (400) is filled with a second conductive material to form a second conductor (42). One end of the second conductor (42) is electrically connected to the display panel, and the other end of the second conductor (42) is electrically connected to the first conductor (31). The driving component includes a circuit board assembly and a driving chip (70). The circuit board assembly is disposed on the side of the lamp board (30) away from the display panel, and the driving chip (70) is used to output driving signals. The circuit board assembly, the first conductor (31), and the second conductor (42) are connected together to form a signal transmission channel. The driving chip (70) is disposed on the signal transmission channel, and the signal transmission channel is used to transmit the driving signal to the display panel.

2. The display device according to claim 1, characterized in that, The backlight unit also includes a back plate (10) having a receiving cavity (100), the back plate (10) including a side plate (12), and the lamp plate (30) and the display panel are both disposed in the receiving cavity (100); The interconnection part (41) has a mounting groove on the side near the side plate (12). The bottom of the mounting groove has an opening, and the second conductor (42) is exposed from the opening. The driving chip (70) is disposed in the mounting groove and is electrically connected to the second conductor (42).

3. The display device according to claim 1 or 2, characterized in that, The lamp board (30) includes a first glass substrate (34) and an LED lamp (35) disposed on the first glass substrate (34). The first vertical through hole (300) is disposed on the first glass substrate (34). The interconnection part (41) is laser welded to the first glass substrate (34). Alternatively, the interconnecting part (41) and the lamp panel (30) can be bonded together by UV adhesive tape (302).

4. The display device according to claim 1 or 2, characterized in that, The second conductor (42) includes a first protrusion (421) protruding from the side surface of the interconnect (41) facing away from the display panel, and the first conductor (31) has a first recess (311) on the side surface facing the display panel, and the first protrusion (421) is located in the first recess (311). Alternatively, the first conductor (31) includes a second protrusion (312) protruding from the lamp plate (30) toward the side surface of the display panel, and the second conductor (42) has a second recess (422) on the side surface away from the display panel, with the second protrusion (312) located in the second recess (422).

5. The display device according to claim 1 or 2, characterized in that, The interconnection unit (41) and the display panel are an integral structure; Alternatively, the interconnection part (41) and the lamp panel (30) are an integral structure; Alternatively, one end of the interconnection section (41) is connected to the display panel, and the other end of the interconnection section (41) is connected to the lamp panel (30).

6. The display device according to claim 1 or 2, characterized in that, The display panel includes an array substrate (40) and a color filter substrate (50) disposed on the side of the array substrate (40) facing away from the lamp panel (30). The array substrate (40) has an interconnection portion (41) on the edge region of the side facing away from the color filter substrate (50) that extends at least to the surface of the lamp plate (30), and the second vertical through hole (400) passes through the array substrate (40) or through the array substrate (40) and the color filter substrate (50).

7. The display device according to claim 1 or 2, characterized in that, There are multiple first conductors (31) and multiple second conductors (42), and multiple first conductors (31) and multiple second conductors (42) are electrically connected in a one-to-one correspondence; The lamp panel (30) has a plurality of third conductors (32) embedded on the side surface facing away from the display panel, and the plurality of third conductors (32) are electrically connected to the plurality of first conductors (31) in a one-to-one correspondence. The backlight unit also includes a back plate (10), the back plate (10) includes a base plate (11), the lamp plate (30) is disposed on the base plate (11), the base plate (11) is provided with a clearance hole (110), the circuit board assembly includes a PCB board (61) and a connector (63) electrically connected to each other, at least one of the third conductors (32) is electrically connected to one of the connectors (63), and the connector (63) is located in the clearance hole (110).

8. The display device according to claim 1, characterized in that, The backlight unit also includes a back plate (10), the back plate (10) includes a base plate (11), and the lamp plate (30) is disposed on the base plate (11); The base plate (11) is made of glass, and the lamp plate (30) includes a first glass substrate (34) and an LED lamp (35) disposed on the first glass substrate (34). The first glass substrate (34) and the base plate (11) are bonded by laser welding or by UV adhesive tape (302).

9. The display device according to claim 8, characterized in that, The circuit board assembly is embedded on the side surface of the base plate (11) facing the lamp plate (30). A third conductor (32) is embedded on the side surface of the lamp plate (30) facing away from the display panel. The third conductor (32) is electrically connected to the first conductor (31). The circuit board assembly is electrically connected to the third conductor (32).

10. The display device according to claim 9, characterized in that, The circuit board assembly is located in the edge region of the base plate (11), and the circuit board assembly is opposite to the third conductor (32). The brightness of the LED (35) corresponding to the edge region of the base plate (11) is less than the brightness of the remaining LEDs (35).

11. The display device according to claim 1 or 2, characterized in that, The backlight unit further includes a back plate (10) and a first support column (20). The back plate (10) includes a base plate (11), and the first support column (20) is connected to the base plate (11). The first support column (20) is used to support the display panel. The first support column (20) has foam adhesive (21) on the side surface facing away from the base plate (11). And / or, the side of the first support column (20) is connected to an extension plate (22), and the side surface of the extension plate (22) facing away from the base plate (11) is flush with the side surface of the first support column (20) facing away from the base plate (11).

12. The display device according to claim 1 or 2, characterized in that, The lamp panel (30) is provided with a plurality of second support columns (33); The display device further includes an optical film assembly (80), which is disposed on the second support column (33).

13. A method for producing a display device, characterized by include: A first vertical through hole (300) is opened on the lamp plate (30), and the first vertical through hole (300) passes through the lamp plate (30). A first conductive material is filled into the first vertical through hole (300) to form a first conductor (31), and the first conductor (31) is electrically connected to the lamp plate (30); A second vertical through hole (400) is formed on the interconnect portion (41) in the edge area of ​​the display panel, and the second vertical through hole (400) passes through the interconnect portion (41). A second conductive material is filled into the second vertical through hole (400) to form a second conductor (42), which is electrically connected to the display panel; The lamp plate (30) with the first conductor (31) formed thereon, the optical film assembly (80), and the display panel electrically connected to the second conductor (42) are stacked together so that the first conductor (31) and the second conductor (42) are electrically connected. A circuit board assembly is provided on the side of the lamp board (30) away from the display panel, and the circuit board assembly, the first conductor (31) and the second conductor (42) are connected together to form a signal transmission channel; A driver chip (70) is disposed on the signal transmission channel, wherein the driver chip (70) is used to output a drive signal, and the signal transmission channel is used to transmit the drive signal to the display panel.

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