Novel vapor chamber structure and radiator

Abstract

The invention discloses a novel vapor chamber structure and a radiator, a vapor chamber comprises a diffusion plate 11, a heat conduction plate 12 and cooling liquid located between the diffusion plate 11 and the heat conduction plate 12, a plurality of water absorption columns 13 which are arranged in a crossed mode are further arranged between the diffusion plate 11 and the heat conduction plate 12, at least one side of each water absorption column 13 is a cambered surface, and one side of the cambered surface faces a central heat source. Water absorption columns 13 are arranged between a diffusion plate 11 and a heat conduction plate 12 to absorb water vapor and guide flow, so that the heat exchange efficiency between the diffusion plate 11 and the heat conduction plate 12 is improved, and the water absorption columns 13 are arranged in a row-by-row cross mode from a central heat source to the outside, so that the water vapor is diffused from the central heat source to the periphery, and the heat exchange efficiency is improved. The water vapor can be absorbed to the maximum extent, the channels can be kept orderly and smooth, each water absorption column 13 can play a role, and therefore the heat dissipation performance is improved to the maximum extent.

Description

Technical Field

[0001] This invention relates to the field of radiator technology, and specifically to a novel heat spreader structure and radiator. Background Technology

[0002] For high-performance graphics cards and other electronic products, the performance of the heatsink directly determines the stability of the device's operation, computing power release, and lifespan. When electronic components operate under high load, the impedance generated by the current flowing through the semiconductor will cause some electrical energy to be converted into heat energy. If the heat cannot be dissipated in time, it will trigger frequency reduction, accelerate component aging, and even lead to hardware damage.

[0003] Mainstream traditional heat dissipation methods each have their own advantages and disadvantages: air cooling is simple in structure, low in cost, and widely used, but its heat dissipation efficiency is insufficient in high-performance scenarios; liquid cooling is efficient and low in noise, suitable for high-end needs, but it has problems such as complex structure, high cost, and the need to prevent leakage; heat pipes have fast heat conduction speed, but are limited by the heat capacity limit and structural design, and the heat dissipation effect is significantly reduced under high load.

[0004] As an upgrade solution, the vapor chamber is a core heat dissipation component for high-performance equipment, far exceeding the efficiency of traditional heat pipes. It features a vacuum capillary cavity structure with an internal working fluid, rapidly conducting and dissipating heat through a closed-loop phase change process of "evaporation-condensation-reflux." It boasts advantages such as two-dimensional planar heat dissipation, high thermal conductivity, and strong adaptability. Customizable designs are available, and it is compatible with various cooling systems, effectively solving the problem of localized high temperatures at core components.

[0005] For example, Chinese patent publication number CN 215117437 U discloses a heat sink and its heat pipe cooling structure. The heat pipe cooling structure includes: a first heat dissipation fin unit, a second heat dissipation fin unit, a heat spreader, and several heat pipes. The first heat dissipation fin unit includes a first connecting groove; the second heat dissipation fin unit includes a second connecting groove; one end of each heat pipe is integrally formed with the heat spreader and disposed within the first connecting groove, while the other end of the heat pipe is inserted into the second connecting groove. This heat pipe cooling structure provides uniform heat dissipation and reduces thermal resistance during welding.

[0006] Since heat transfer within the vapor chamber occurs through the vaporization and liquefaction of the coolant, improving the flow of coolant within the vapor chamber is one of the key factors in enhancing heat dissipation performance.

[0007] In view of the above, the inventors propose the following technical solution. Summary of the Invention

[0008] The purpose of this invention is to overcome the shortcomings of the prior art and provide a novel heat spreader structure and radiator.

[0009] To solve the above-mentioned technical problems, the present invention adopts the following first technical solution:

[0010] A novel heat spreader structure includes: a diffuser plate and a heat-conducting plate, and a coolant located between the diffuser plate and the heat-conducting plate. Several water-absorbing columns arranged in a cross pattern are also provided between the diffuser plate and the heat-conducting plate. At least one side of each water-absorbing column is arc-shaped, and the arc-shaped side faces the central heat source.

[0011] Furthermore, in the above technical solution, the water-absorbing column is an arc-shaped prism, with one side of the arc facing the central heat source, and the water-absorbing columns are staggered in the front and rear rows.

[0012] Furthermore, in the above technical solution, the water-absorbing column is a prism with a teardrop-shaped cross-section, wherein the side with the longer arc faces the central heat source, and the water-absorbing columns are staggered in front and behind.

[0013] Furthermore, in the above technical solution, the water-absorbing column has a bowl-shaped protrusion suspended on the diffuser plate or heat-conducting plate, and the bottom of the water-absorbing column extends to contact the heat-conducting plate or diffuser plate.

[0014] Furthermore, in the above technical solution, the water-absorbing column is suspended on the diffuser plate with a bowl-shaped protrusion, and the bottom of the bowl-shaped protrusion extends to the heat-conducting plate in a columnar or teardrop shape, and the bowl-shaped protrusion and the columnar or teardrop-shaped bottom are smoothly interlocked.

[0015] Furthermore, in the above technical solution, the water-absorbing column is a vertical wall arranged in alternating rows around the central heat source, and the vertical wall is provided with multiple horizontally penetrating ventilation holes.

[0016] Furthermore, the above technical solution also includes a vent that penetrates the diffuser plate and the heat-conducting plate, and the vent leads to one side of the chip.

[0017] Furthermore, in the above technical solution, the air guide hole is conical, and the hole diameter gradually decreases from large to small from the diffuser plate to the heat conduction plate.

[0018] Furthermore, in the above technical solution, a supporting copper pillar is also provided between the diffusion plate and the heat-conducting plate to resist the chip pressure at the central heat source, and water-absorbing pillars are arranged in a cross pattern around the supporting copper pillar.

[0019] Furthermore, in the above technical solution, the water-absorbing column is a sponge-like water-absorbing column.

[0020] To solve the above-mentioned technical problems, the present invention adopts the following first technical solution: a heat sink, which includes a heat dissipation plate, a heat conduction pipe that contacts the heat dissipation plate to conduct heat, a fin group through which the heat conduction pipe passes, and a fan group disposed on the fin group, wherein the diffuser plate and the heat conduction plate of the heat dissipation plate are in contact with the heat conduction pipe and the chip, respectively.

[0021] Furthermore, in the above technical solution, the fin assembly is provided with ventilation holes that correspond to the air guide holes of the heat dissipation plate so that the heat dissipation air can pass through.

[0022] By adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art:

[0023] 1. In this invention, water-absorbing columns are set between the diffuser plate and the heat-conducting plate to absorb water vapor and guide its flow, thereby improving the heat exchange efficiency between the diffuser plate and the heat-conducting plate. Furthermore, the water-absorbing columns are arranged in a cross-row layout from the central heat source outwards, so that as the water vapor diffuses from the central heat source to the surrounding areas, it can not only absorb water vapor to the maximum extent, but also keep the channels orderly and unobstructed, allowing each water-absorbing column to play its role, thereby maximizing the heat dissipation performance.

[0024] 2. In this invention, air ducts leading to one side of the chip are provided on the heat spreader, allowing the airflow generated by the fan assembly to flow directly to the chip and carry away the heat generated by the chip from the side, thereby improving heat dissipation performance. Furthermore, designing the air ducts in a conical shape helps to concentrate and guide airflow, increasing the airflow speed to the chip and enabling rapid heat removal. Attached Figure Description

[0025] Figure 1 This is a structural diagram of the heat sink in this invention.

[0026] Figure 2 This is an exploded view of the heat sink in this invention.

[0027] Figure 3 This is a structural diagram of the heat spreader in Embodiment 1 of the present invention.

[0028] Figure 4 This is an internal distribution diagram of the heat spreader in Embodiment 1 of the present invention.

[0029] Figure 5 This is a structural diagram of the heat spreader in Embodiment 2 of the present invention.

[0030] Figure 6 This is an internal distribution diagram of the heat spreader in Embodiment 3 of the present invention.

[0031] Figure 7 This is a structural diagram of the heat spreader in Embodiment 3 of the present invention.

[0032] Figure 8 This is an internal distribution diagram of the heat spreader in Embodiment 2 of the present invention.

[0033] Figure 9 This is a schematic diagram of the structure of the heat spreader in Embodiment 4 of the present invention. Figure 1 .

[0034] Figure 10This is a schematic diagram of the structure of the heat spreader in Embodiment 4 of the present invention. Figure 2 .

[0035] Figure 11 This is a schematic diagram of the structure of the heat spreader in Embodiment 4 of the present invention. Figure 3 . Detailed Implementation

[0036] The present invention will be further described below with reference to specific embodiments and accompanying drawings.

[0037] See Figures 1 to 11 As shown, a graphics card heatsink includes a motherboard 5, a heat spreader 1 that contacts a chip 51 in the motherboard 5, a heat pipe 2 that contacts the heat spreader 1 to conduct heat, a fin assembly 3 through which the heat pipe 2 passes, and a fan assembly 4 disposed on the fin assembly 3. The diffuser plate 11 and the heat-conducting plate 12 of the heat spreader 1 are in contact with the heat pipe 2 and the chip 51, respectively.

[0038] The heat spreader 1 comprises a diffuser plate 11, a heat-conducting plate 12, and a coolant located between the diffuser plate 11 and the heat-conducting plate 12. Several cross-arranged water-absorbing columns 13 are also arranged between the diffuser plate 11 and the heat-conducting plate 12. Each water-absorbing column 13 has at least one curved side, with the curved side facing the central heat source. By using water-absorbing columns 13 between the diffuser plate 11 and the heat-conducting plate 12 to absorb and guide water vapor, the heat exchange efficiency between the diffuser plate 11 and the heat-conducting plate 12 is improved. Furthermore, the cross-arrangement of the water-absorbing columns 13, starting from the central heat source and extending outwards, maximizes the absorption of water vapor as it diffuses from the central heat source outwards, while also maintaining orderly and unobstructed channels, ensuring that each water-absorbing column 13 functions effectively and thus maximizing heat dissipation performance. The water-absorbing columns 13 are sponge-like water-absorbing columns.

[0039] See Figure 3 and Figure 4 As shown in Embodiment 1, the water-absorbing column 13 is a prismatic shape with an arc-shaped apex, wherein one side of the arc-shaped apex faces the central heat source, and the water-absorbing columns 13 are arranged in alternating rows. By setting the water-absorbing column 13 to a prismatic shape with an arc-shaped apex and utilizing the alternating arrangement of the front and rear rows, not only can water vapor be ensured to flow smoothly from the front row of water-absorbing columns 13 to the rear row of water-absorbing columns 13, but also, by utilizing the fact that one side of the arc-shaped apex of the water-absorbing column 13 faces the central heat source, water vapor can quickly flow from both sides to the rear row when passing through the water-absorbing column 13, thereby ensuring the orderly and smooth flow of water vapor.

[0040] See Figure 5 and Figure 6As shown, in Embodiment 2, the water-absorbing column 13 is a prism with a teardrop-shaped cross-section, wherein the side with the longer arc faces the central heat source, and the water-absorbing columns 13 are arranged in staggered rows. In this embodiment, the staggered arrangement of the water-absorbing columns 13 ensures the excellent heat dissipation effect of Embodiment 1. By adopting a teardrop shape, water vapor can pass around the water-absorbing column 13, ensuring that the outer periphery of the water-absorbing column 13 can have a large-scale contact with the water vapor. Moreover, the teardrop shape of the water-absorbing column is more in line with fluid kinematics, which can reduce resistance, make the water vapor flow faster, accelerate heat conduction, and improve heat dissipation performance.

[0041] See Figure 7 and Figure 8 As shown in Embodiment 3, the water-absorbing columns 13 are vertical walls arranged in a staggered pattern around the central heat source, with multiple transversely penetrating vents 131 on the vertical walls, and the cross-section of the vertical walls is trapezoidal or L-shaped. At least three layers of vertical walls are arranged in a front-to-back arrangement. The inner layer of vertical walls is located in the four directions of the central heat source, and the sides of the vertical walls are designed with inclined sections to facilitate water vapor flow. The middle layer of vertical walls is located at the four corners of the inner layer of vertical walls and has an L-shaped structure. The outer layer of vertical walls is located between the middle layer of vertical walls and directly behind the inner layer of vertical walls.

[0042] See Figure 9 As shown in Embodiment 4, the water-absorbing column 13 has a bowl-shaped protrusion 16 suspended on the diffuser plate 11 or the heat-conducting plate 12, and the bottom of the water-absorbing column 13 extends to contact the heat-conducting plate 12 or the diffuser plate 11. In this embodiment, the water-absorbing column 13 adopts a bowl-shaped structure, which allows water vapor to pass through the water-absorbing column 13 in a circular manner, ensuring that the outer periphery of the water-absorbing column 13 can contact the water vapor over a large area. Moreover, the teardrop-shaped water-absorbing column is more in line with fluid kinematics, which can reduce resistance, allow water vapor to flow more quickly, accelerate heat conduction, and improve heat dissipation performance.

[0043] See Figure 10 As shown, in another embodiment, the water-absorbing column 13 is suspended from the diffuser plate 11 by a bowl-shaped protrusion 16. The bottom of the bowl-shaped protrusion 16 extends to the heat-conducting plate 12 in a columnar or teardrop shape, and the bowl-shaped protrusion 16 and the columnar or teardrop-shaped bottom are smoothly interlocked. By setting the bottom of the bowl-shaped protrusion 16 to extend to the heat-conducting plate 12 in the shape described in the previous embodiment, and utilizing the different shapes at both ends of the water-absorbing column 13, the water-absorbing column 13 has different water vapor absorption and flow efficiencies on both sides in contact with the diffuser plate 11 and the heat-conducting plate 12, ensuring efficient heat conversion of the coolant.

[0044] The heat spreader 1 also includes an air guide hole 14 penetrating the diffuser plate 11 and the heat conduction plate 12, which leads to one side of the chip 51. The air guide hole 14 is conical, and its diameter gradually decreases from the diffuser plate 11 to the heat conduction plate 12. By providing the air guide hole 14 on the heat spreader 1 leading to one side of the chip 51, the airflow generated by the fan assembly 4 can flow directly to the chip 51, carrying away the heat generated by the chip 51 from the side, thereby improving heat dissipation performance. The conical shape of the air guide hole 14 can concentrate and guide the airflow, increasing the airflow speed to the chip 51 and achieving rapid heat removal.

[0045] The fin assembly 3 is provided with ventilation holes 31 corresponding to the air guide holes 14 of the heat spreader 1 to allow heat dissipation air to pass through. By providing ventilation holes 31 corresponding to the air guide holes 14 on the fin assembly 3, the airflow generated by the air distribution assembly 4 can smoothly reach the chip 51, and the ventilation holes 31 can increase the length of the air duct, making the air gathering performance of the conical air guide holes 14 stronger.

[0046] A supporting copper pillar 15 is also provided between the diffuser plate 11 and the heat-conducting plate 12, located at the central heat source to resist the pressure of the chip 51. Water-absorbing pillars 13 are arranged in a cross pattern around the supporting copper pillar 15. One end of the supporting copper pillar 15 forms a cone portion 151 that extends onto the heat-conducting plate 14.

[0047] In summary, this invention employs a cross-arranged arrangement of water-absorbing columns 13 within the heat spreader 1. When the chip 51 generates heat during operation, the coolant vaporizes into water vapor. This water vapor diffuses from the center of the heat spreader 1 outwards, absorbing the water vapor through the water-absorbing columns 13 and transferring it to the heat pipe 2 side for liquefaction. This cross-arranged arrangement of the water-absorbing columns 13 not only maximizes the absorption of water vapor but also ensures that the water vapor flows smoothly and orderly to each column 13, maximizing heat dissipation performance. Furthermore, designing the water-absorbing columns 13 as either arc-shaped prisms or teardrop-shaped better conforms to fluid kinematics, reduces flow resistance, and allows for faster water vapor flow, accelerating heat conduction and further enhancing heat dissipation performance. Additionally, by opening air guide holes 14 on the heat spreader 1, the cooling air generated by the air duct assembly 4 can be directly directed to the chip 51 side, directly removing heat from the vicinity of the chip 51 and further improving heat dissipation performance.

[0048] Of course, the above description is only a specific embodiment of the present invention and is not intended to limit the scope of the present invention. All equivalent changes or modifications made to the structure, features and principles described in the claims of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A novel heat spreader structure, comprising a diffuser plate (11) and a heat-conducting plate (12) and a coolant located between the diffuser plate (11) and the heat-conducting plate (12), characterized in that: Between the diffuser plate (11) and the heat-conducting plate (12), there are also several water-absorbing columns (13) arranged in a cross pattern. At least one side of the water-absorbing column (13) is arc-shaped, and the arc-shaped side faces the central heat source.

2. The novel heat spreader structure according to claim 1, characterized in that: The water-absorbing column (13) is an arc-shaped prism, with one side of the arc facing the central heat source, and the water-absorbing columns (13) are staggered in front and behind.

3. The novel heat spreader structure according to claim 1, characterized in that: The water-absorbing column (13) is a prism with a teardrop-shaped cross-section, wherein the side with the longer arc faces the central heat source, and the water-absorbing columns (13) are staggered in front and behind.

4. The novel heat spreader structure according to claim 1, characterized in that: The water-absorbing column (13) has a bowl-shaped protrusion (16) suspended on the diffuser plate (11) or the heat-conducting plate (12), and the bottom of the water-absorbing column (13) extends to contact the heat-conducting plate (12) or the diffuser plate (11).

5. A novel heat spreader structure according to claim 4, characterized in that: The water-absorbing column (13) is suspended on the diffuser plate (11) with a bowl-shaped protrusion (16). The bottom of the bowl-shaped protrusion (16) extends to the heat-conducting plate (12) in a column or teardrop shape, and the bowl-shaped protrusion (16) and the column or teardrop bottom are smoothly interlocked.

6. The novel heat spreader structure according to claim 1, characterized in that: The water-absorbing column (13) is a vertical wall that is staggered in front and behind the central heat source, and multiple horizontally penetrating ventilation holes (131) are provided on the vertical wall.

7. The novel heat spreader structure according to claim 1, characterized in that: It also includes a vent (14) that penetrates the diffuser plate (11) and the heat-conducting plate (12) and leads to one side of the chip.

8. The novel heat spreader structure according to claim 7, characterized in that: The air guide hole (14) is conical, and the diameter of the hole gradually decreases from the diffuser plate (11) to the heat conduction plate (12).

9. The novel heat spreader structure according to claim 1, characterized in that: Between the diffuser plate (11) and the heat-conducting plate (12), there is a supporting copper column (15) located at the central heat source to resist the chip pressure, and water-absorbing columns (13) are arranged in a cross pattern around the supporting copper column (15).

10. A radiator, characterized in that, It includes a heat spreader (1) according to any one of claims 1-8, a heat pipe (2) that contacts the heat spreader (1) to conduct heat, a fin assembly (3) through which the heat pipe (2) passes, and a fan assembly (4) disposed on the fin assembly (3), wherein the diffuser plate (11) and the heat pipe (12) of the heat spreader (1) are in contact with the heat pipe (2) and the chip, respectively.

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