Low-dielectric low-loss planar antenna manufacturing method based on laser activation chemical plating and product thereof

Abstract

The invention discloses a low-dielectric low-loss planar antenna manufacturing method based on laser activation chemical plating and a product thereof, and relates to the technical field of electronic component manufacturing, and the manufacturing method comprises the following steps: firstly, selecting plastic particles with low dielectric constant and low dielectric loss, and carrying out extrusion molding to prepare a planar film or plate; then, performing laser scanning on a preset antenna circuit pattern on the surface to form an activated region; sequentially carrying out oil removal, ultrasonic cleaning, chemical coarsening, palladium activation and reduction treatment on the base material; selectively depositing a metal copper layer in the activated region through a chemical copper plating process to form a conductive antenna circuit; and finally, carrying out anti-oxidation protection treatment, cutting and testing to obtain the planar antenna. According to the manufacturing method provided by the invention, extrusion molding is adopted for manufacturing, the material cost is far lower than that of a special LDS material, the obtained panel antenna product is excellent in performance, the overall process is stable, the consistency is good, and the cost advantage is achieved while the high-performance requirement is met.

Description

Technical Field

[0001] This invention relates to the field of electronic component manufacturing technology, specifically to a method for manufacturing low-dielectric-low-loss planar antennas based on laser-activated chemical plating and the resulting product. Background Technology

[0002] With the rapid development of wireless communication technology, high-bandwidth, high-speed communication protocols such as WiFi 6 and the next-generation WiFi 7 are gradually becoming widespread. These protocols place much higher technical demands on router antennas in terms of signal transmission performance, loss control, manufacturing costs, and mass production capabilities than ever before. Flat panel antennas, due to their simple structure and ease of integration, have become the preferred solution for router built-in antennas.

[0003] Currently, approximately 95% of router flat panel antennas in the industry are manufactured using FR4 (glass fiber reinforced epoxy resin) sheets. However, FR4 material has a high dielectric constant (Dk, typically 4.2-4.8) and dielectric loss factor (Df, typically 0.015-0.02), resulting in significant signal transmission loss in mid-to-high frequency bands (such as 5GHz and 6GHz), making it difficult to fully utilize the high speed and low latency performance required by WiFi 6 and WiFi 7. Furthermore, FR4 antennas are mostly manufactured using an etching subtractive process, which suffers from low copper foil utilization (a large amount of copper is wasted during etching), the generation of large amounts of copper-containing etching waste liquid leading to significant environmental pressure, and a complex process resulting in high overall costs. While traditional laser direct forming (LDS) antennas offer better performance, the cost of dedicated LDS plastic particles is expensive, and the investment in laser equipment and plating processes is substantial, leading to excessively high unit costs and hindering widespread adoption in the cost-sensitive router market. Therefore, there is an urgent need to propose a manufacturing method and product for low dielectric and low loss planar antennas based on laser-activated chemical plating, in order to solve the problems of high dielectric loss, high cost, unstable process and unsuitability for mass production of existing planar antennas. Summary of the Invention

[0004] The purpose of this invention is to provide a method and product for manufacturing low dielectric and low loss planar antennas based on laser-activated chemical plating, in order to solve the problems of high dielectric loss, high cost, unstable process and unsuitability for mass production of existing planar antennas.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a method for manufacturing a low-dielectric-low-loss planar antenna based on laser-activated chemical plating, specifically including the following steps:

[0006] S1. Select plastic particles with dielectric constant Dk≤4.0@10GHz and dielectric loss Df≤0.008@10GHz, and extrude them into planar films or sheets.

[0007] S2. Laser scanning activation is performed on the surface of the film or sheet according to the preset antenna circuit pattern to form an activation area, thereby obtaining the laser-activated substrate;

[0008] S3. The laser-activated substrate is subjected to degreasing, ultrasonic cleaning, chemical roughening, palladium activation and reduction treatment in sequence.

[0009] S4. Selectively deposit a layer of metallic copper in the activated area using a chemical copper plating process to form a conductive antenna circuit;

[0010] S5. Anti-oxidation protection treatment for conductive antenna lines: The treatment methods are passivation, nickel plating, nickel plating passivation sealing or nickel-gold plating sealing to prevent copper layer oxidation and improve line reliability.

[0011] S6. Cutting and testing are performed to produce the flat panel antenna.

[0012] Furthermore, the plastic particles are at least one of polyphenylene oxide (PPO), liquid crystal polymer (LCP), polyphenylene sulfide (PPS), syndiotactic polystyrene (SPS), and polycarbonate (PC), which have lower dielectric constant and dielectric loss, and can significantly reduce antenna signal transmission loss.

[0013] Furthermore, in the manufacture of the WiFi 7 router flat panel antenna, the plastic particles are at least one of polyphenylene oxide (PPO), liquid crystal polymer (LCP), polyphenylene sulfide (PPS), and syndiotactic polystyrene (SPS); in the manufacture of the WiFi 6 router flat panel antenna, the plastic particles are polycarbonate (PC) or polyphenylene sulfide (PPS).

[0014] Furthermore, the extrusion molding in S1 is a continuous extrusion molding process, used to achieve large-scale continuous production of planar antennas.

[0015] Furthermore, the chemical copper plating in S4 is an addition process, which generates no etching waste liquid and avoids copper material etching waste.

[0016] Furthermore, the anti-oxidation protection treatment in S5 is a separate process after the chemical copper plating is completed, which is used to improve the long-term reliability of the antenna circuit.

[0017] The present invention also discloses a low-dielectric-low-loss planar antenna based on laser-activated chemical plating, which is prepared by the above method.

[0018] Furthermore, the substrate of the flat panel antenna is a plastic particle with a dielectric constant Dk≤4.0@10GHz and a dielectric loss Df≤0.008@10GHz, wherein the plastic particle is at least one of PPO, LCP, PPS, SPS and PC.

[0019] Furthermore, the flat panel antenna circuitry is formed by laser activation and chemical copper plating, and undergoes anti-oxidation protection treatment.

[0020] Furthermore, the antenna has a planar structure, and its dielectric constant and dielectric loss are both lower than those of FR4 substrate PCB antennas, making it suitable for WiFi 6 and WiFi 7 router terminals.

[0021] Compared with existing technologies, the present invention provides a method for manufacturing low-dielectric- and low-loss planar antennas based on laser-activated chemical plating, and the resulting product has the following advantages:

[0022] (1) The present invention uses thermoplastic plastics with low dielectric constant and low dielectric loss such as PPO, LCP, PPS, SPS or PC to replace the high-loss FR4 material. The medium and high frequency signal transmission loss of the substrate itself is significantly reduced, which can give full play to the high speed and low latency performance advantages of WiFi 6 and WiFi 7 protocols.

[0023] (2) The substrate of the present invention is manufactured by extrusion molding, and the material cost is much lower than that of LDS special material and FR4 plate; the addition method of chemical copper plating is used, the copper utilization rate is close to 100%, there is no etching waste, and the material cost is saved; the overall process is simplified, and the equipment investment and operating costs are lower than those of traditional etching method and LDS method.

[0024] (3) The present invention adopts the addition process of laser activation and chemical copper plating, which eliminates the large amount of etching waste liquid and heavy metal pollution in the traditional etching subtractive process, with no copper waste, significantly reducing the environmental protection treatment pressure, and conforming to the trend of green manufacturing.

[0025] (4) The manufacturing method provided by the present invention can flexibly select the substrate according to the product positioning: PPO / LCP / PPS / SPS are selected for high-performance scenarios, and PC or SPS are selected for cost-sensitive scenarios, so as to achieve a precise balance between performance and cost and adapt to multi-level market demands.

[0026] (5) The flat panel antenna prepared by the present invention has a stable overall process and good consistency, and can realize the mass production of flat panel antennas, thus overcoming the bottleneck of traditional mass production. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0028] Figure 1 This is a schematic flowchart illustrating a method for manufacturing a low-dielectric, low-loss planar antenna based on laser-activated chemical plating, as provided in an embodiment of the present invention. Detailed Implementation

[0029] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0030] Example 1:

[0031] Please see Figure 1 A method for manufacturing low-dielectric- and low-loss planar antennas based on laser-activated chemical plating, applicable to the manufacture of high-performance WiFi 7 router planar antennas, specifically includes the following steps:

[0032] S1. Select plastic particles with dielectric constant Dk≤4.0@10GHz and dielectric loss Df≤0.008@10GHz, and extrude them into planar films or sheets.

[0033] The specific implementation method is as follows: polyphenylene oxide (PPO) plastic particles are selected, dried at 120°C for 4 hours, and then continuously melt-extruded through a single-screw extruder. The extruder barrel temperature is set to 240-280°C, and the die temperature is set to 260°C. The molten material is extruded through a T-die, cooled and shaped by a three-roll calender, and rolled into a continuous PPO film with a thickness of 0.2 mm and a width of 600 mm. The dielectric constant Dk of the PPO is 2.8@5GHz, the dielectric loss Df is 0.003@5GHz, and the flatness error is ±0.01 mm.

[0034] S2. Laser scanning activation is performed on the surface of the film or sheet according to the preset antenna circuit pattern to form an activation area, thereby obtaining the laser-activated substrate;

[0035] The specific implementation method is as follows: A laser is used to selectively scan according to the WiFi 7 antenna circuit diagram. The laser power is set to 8W, the scanning speed is 2000mm / s, and the frequency is 100kHz. The laser beam selectively scans the surface of the PPO film according to the circuit pattern. The laser energy causes the PPO polymer chains in the scanning area to break and form micropits and polar groups. After scanning, 1-3μm micropores are formed on the substrate surface, providing physical anchoring points and chemical adsorption sites for subsequent chemical plating.

[0036] S3. The laser-activated substrate is subjected to degreasing, ultrasonic cleaning, chemical roughening, palladium activation and reduction treatment in sequence.

[0037] The specific implementation method is as follows: Degreasing: The laser-activated substrate is steadily immersed in a special alkaline degreasing solution with a temperature strictly controlled at 40℃–50℃ and soaked for 5 minutes to completely peel off and remove the oil, fingerprints and organic pollutants attached to the surface of the substrate during processing and transportation. After soaking, the substrate is thoroughly rinsed and washed with clean deionized water to ensure that there is no degreasing agent residue on the surface.

[0038] Ultrasonic cleaning: The substrate film, after being degreased and rinsed with deionized water, is completely immersed in the cleaning tank. The ultrasonic equipment is turned on and cleaned continuously for 3 minutes. The cavitation effect generated by high-frequency ultrasound is used to powerfully remove tiny dust, debris and weakly attached impurities from the surface of the substrate, ensuring that the activated area is clean and undisturbed.

[0039] Chemical roughening: The substrate that has been ultrasonically cleaned and drained is immersed in an acidic roughening working solution with potassium permanganate as the main active ingredient and uniformly treated at 45°C for 5 minutes. Through chemical etching, a uniform and dense micro-uneven structure is constructed in the laser-activated area, which significantly improves the surface roughness and the adhesion of active sites.

[0040] Palladium activation: At room temperature, the chemically roughened and cleaned substrate film is steadily immersed in a colloidal palladium activation solution prepared by palladium chloride and stannous chloride, and fully immersed for 3 minutes. This allows the activated area on the surface of the non-metallic substrate to stably adsorb a layer of palladium / tin composite colloidal particles with high catalytic activity, providing a reliable catalytic basis for subsequent electroless copper plating.

[0041] Reduction: The substrate film after palladium activation treatment is taken out and rinsed quickly, and then immersed in sodium hypophosphite reducing solution with temperature controlled at 40°C for 2 minutes. Through the reduction reaction, palladium ions in palladium / tin colloid are fully reduced into highly active metallic palladium nanoparticles, which are uniformly distributed on the substrate surface and form continuous and stable catalytic active centers.

[0042] S4. Selectively deposit a layer of metallic copper in the activated area using a chemical copper plating process to form a conductive antenna circuit;

[0043] The specific implementation method is as follows: the PPO film after degreasing, ultrasonic cleaning, chemical roughening, palladium activation and reduction treatment is immersed in chemical copper plating solution, and the copper layer is selectively deposited only in the laser-activated circuit area to form an antenna circuit with good conductivity and adhesion.

[0044] Plating solution composition: copper sulfate 10g / L, formaldehyde 8g / L, disodium EDTA 15g / L, sodium hydroxide 12g / L, stabilizer (2,2'-bipyridine) 10mg / L, pH value 12.5, temperature 45℃; plating time 20 minutes, copper layer thickness 3-5μm.

[0045] S5. Anti-oxidation protection treatment for conductive antenna lines: the treatment methods are passivation, nickel plating, nickel plating passivation sealing or nickel-gold plating sealing.

[0046] The specific implementation method is as follows: in order to prevent the copper circuit from oxidizing, a chemical nickel plating process is used to protect the conductive antenna circuit, and the conductive antenna circuit is immersed in a chemical nickel plating solution.

[0047] The plating solution consists of 25 g / L nickel sulfate, 30 g / L sodium hypophosphite, 15 g / L sodium citrate, pH 4.8, and a temperature of 85°C. The plating time is 10 minutes, and the thickness of the deposited nickel layer is approximately 1-2 μm. The solution is then rinsed with deionized water and dried. The nickel layer acts as a barrier layer, effectively preventing copper diffusion and oxidation.

[0048] S6. Cutting and testing are performed to produce the flat panel antenna.

[0049] The specific implementation method is as follows: the conductive antenna circuit is cut into individual antenna elements using a laser cutter or mold; the standing wave ratio (VSWR) of the antenna in the 2.4GHz, 5GHz and 6GHz frequency bands is tested using a network analyzer, and is required to be less than 2.0; the continuity of the circuit is tested using a multimeter; the coating adhesion is verified by the 100-cross cross-cut test (ASTM D3359); the reliability is verified by the constant temperature and humidity test at 85℃ / 85%RH for 240 hours; after all tests are passed, the flat panel antenna is produced, packaged and stored.

[0050] Example 2:

[0051] Please see Figure 1 This embodiment provides a technical solution based on Embodiment 1: a method for manufacturing low-dielectric-low-loss planar antennas based on laser-activated chemical plating, applicable to the manufacturing of cost-sensitive WiFi 6 router planar antennas, specifically including the following steps:

[0052] S1. Select plastic particles with dielectric constant Dk≤4.0@10GHz and dielectric loss Df≤0.008@10GHz, and extrude them into planar films or sheets.

[0053] The specific implementation method is as follows: Polycarbonate (PC) plastic particles are selected, dried at 110°C for 3 hours, and then continuously melt-extruded through a single-screw extruder. The extruder barrel temperature is set to 260-300°C, and the die temperature is set to 280°C. The molten material is extruded through a T-die, cooled and shaped by a three-roll calender, and rolled into a continuous PC film with a thickness of 0.3 mm and a width of 600 mm. The dielectric constant Dk of PC is 3.0@5GHz, the dielectric loss Df is 0.008@5GHz, and the flatness error is ±0.015 mm.

[0054] S2. Laser scanning activation is performed on the surface of the film or sheet according to the preset antenna circuit pattern to form an activation area, thereby obtaining the laser-activated substrate;

[0055] The specific implementation method is as follows: a laser is used to selectively scan according to the WiFi 6 antenna circuit diagram. The laser power is set to 10W, the scanning speed is 1800mm / s, and the frequency is 80kHz. The laser beam selectively scans the PC film surface according to the circuit diagram. The laser energy causes the PC polymer chains in the scanning area to break and form micropits and polar groups. After scanning, 1-2μm micropores are formed on the substrate surface, providing physical anchoring points and chemical adsorption sites for subsequent chemical plating.

[0056] S3. The laser-activated substrate is subjected to degreasing, ultrasonic cleaning, chemical roughening, palladium activation and reduction treatment in sequence.

[0057] The specific implementation method is to steadily immerse the laser-activated substrate in a special alkaline degreasing solution with a temperature strictly controlled at 45-55℃ for 4 minutes to thoroughly peel off and remove oil stains, fingerprints and organic pollutants that adhered to the surface of the substrate during processing and transportation. After immersion, the substrate is thoroughly rinsed and washed with clean deionized water to ensure that there is no degreasing agent residue on the surface.

[0058] Ultrasonic cleaning: The substrate film, after being degreased and rinsed with deionized water, is completely immersed in the cleaning tank. The ultrasonic equipment is turned on and cleaned continuously for 2 minutes. The cavitation effect generated by high-frequency ultrasound is used to powerfully remove tiny dust, debris and weakly attached impurities from the surface of the substrate, ensuring that the activated area is clean and undisturbed.

[0059] Chemical roughening: The substrate film, which has been ultrasonically cleaned and drained, is immersed in an acidic roughening working solution with potassium permanganate as the main active ingredient. It is uniformly treated at 50°C for 4 minutes. Through chemical etching, a uniform and dense micro-uneven structure is constructed in the laser-activated area, which significantly improves the surface roughness and the adhesion of active sites.

[0060] Palladium activation: At room temperature, the chemically roughened and cleaned substrate film is steadily immersed in a colloidal palladium activation solution prepared from palladium chloride and stannous chloride for 2.5 minutes. This allows the activated area on the surface of the non-metallic substrate to stably adsorb a layer of palladium / tin composite colloidal particles with high catalytic activity, providing a reliable catalytic basis for subsequent electroless copper plating.

[0061] Reduction: The substrate film after palladium activation treatment is taken out and rinsed quickly, and then immersed in sodium hypophosphite reducing solution at a temperature controlled at 45°C for 1.5 minutes. Through the reduction reaction, palladium ions in palladium / tin colloid are fully reduced to highly active metallic palladium nanoparticles, which are uniformly distributed on the substrate surface and form continuous and stable catalytic active centers.

[0062] S4. Selectively deposit a layer of metallic copper in the activated area using a chemical copper plating process to form a conductive antenna circuit;

[0063] The specific implementation method is to immerse the PC film, which has undergone degreasing, ultrasonic cleaning, chemical roughening, palladium activation and reduction treatment, into a chemical copper plating solution. The copper layer is selectively deposited only in the laser-activated circuit area to form an antenna circuit with good conductivity and adhesion.

[0064] Plating solution composition: copper sulfate 12g / L, formaldehyde 7g / L, disodium EDTA 12g / L, sodium hydroxide 10g / L, stabilizer (2,2'-bipyridine) 8mg / L, pH 12.0, temperature 42℃; plating time 15 minutes, copper layer thickness 2-3μm.

[0065] S5. Anti-oxidation protection treatment for conductive antenna lines: the treatment methods are passivation, nickel plating, nickel plating passivation sealing or nickel-gold plating sealing.

[0066] The specific implementation method is as follows: In order to prevent copper circuit oxidation while controlling costs, a passivation process is used to protect the conductive antenna circuit. The conductive antenna circuit is immersed in a benzotriazole (BTA) passivation solution with a concentration of 0.5wt%, a temperature of 60°C, and a treatment time of 2 minutes to form a nanoscale organic protective film on the copper layer surface. After that, it is cleaned with deionized water and dried. The organic protective film effectively isolates air and moisture, meeting the anti-oxidation requirements of the router's internal working environment.

[0067] S6. Cutting and testing are performed to produce the flat panel antenna.

[0068] The specific implementation method is as follows: the conductive antenna circuit is cut into individual antenna elements using a laser cutter or mold; the standing wave ratio (VSWR) of the antenna in the 2.4GHz and 5GHz frequency bands is tested using a network analyzer, and is required to be less than 2.0; the continuity of the circuit is tested using a multimeter; the coating adhesion is verified by the 100-cross cross-cut test (ASTM D3359); the reliability is verified by the constant temperature and humidity test at 85℃ / 85%RH for 96 hours; after all tests are passed, the flat panel antenna is produced, packaged and stored.

[0069] Example 3:

[0070] Please see Figure 1 This embodiment provides a technical solution based on Embodiment 1: a method for manufacturing low-dielectric-low-loss planar antennas based on laser-activated chemical plating, applicable to the manufacturing of general-purpose WiFi 6 / 7 planar antennas, specifically including the following steps:

[0071] S1. Select plastic particles with dielectric constant Dk≤4.0@10GHz and dielectric loss Df≤0.008@10GHz, and extrude them into planar films or sheets.

[0072] The specific implementation method is as follows: syndiotactic polystyrene (SPS) plastic particles are selected, dried at 110℃ for 3-4 hours, and then continuously melt-extruded through a single-screw extruder. The extruder barrel temperature is set to 270-300℃, and the die temperature is set to 290℃. The molten material is extruded through a T-die, cooled and shaped by a three-roll calender, and rolled into a continuous film with a thickness of 0.15-0.25mm and a width of 600mm, or cut into sheets of A4-A3 size. The dielectric constant Dk of SPS is 2.5-2.7@5GHz, the dielectric loss Df is 0.002-0.003@5GHz, and the flatness error is ±0.01mm.

[0073] S2. Laser scanning activation is performed on the surface of the film or sheet according to the preset antenna circuit pattern to form an activation area, thereby obtaining the laser-activated substrate;

[0074] The specific implementation method is as follows: a laser is used to selectively scan according to the WiFi 6 or WiFi 7 antenna circuit diagram. The laser power is set to 7-9W, the scanning speed is 1800-2200mm / s, and the frequency is 90-110kHz. The laser beam selectively scans the surface of the SPS film or board according to the circuit pattern. The laser energy causes the SPS polymer chains in the scanning area to break and form micropits and polar groups. After scanning, 0.5-2.5μm micropores are formed on the substrate surface, providing physical anchoring points and chemical adsorption sites for subsequent chemical plating.

[0075] S3. The laser-activated substrate is subjected to degreasing, ultrasonic cleaning, chemical roughening, palladium activation and reduction treatment in sequence.

[0076] The specific implementation method is as follows: degreasing: the laser-activated substrate film or board is steadily immersed in a special alkaline degreasing solution with a temperature strictly controlled at 40-50℃, and soaked for 3-5 minutes to completely peel off and remove the oil, fingerprints and organic pollutants attached to the surface of the substrate during processing and transportation. After soaking, the substrate is thoroughly rinsed and washed with clean deionized water to ensure that there is no degreasing agent residue on the surface.

[0077] Ultrasonic cleaning: The substrate film or board, after being degreased and rinsed with deionized water, is completely immersed in the cleaning tank. The ultrasonic equipment is turned on and cleaned continuously for 2-3 minutes. The cavitation effect generated by high-frequency ultrasound is used to powerfully remove tiny dust, debris and weakly attached impurities from the surface of the substrate, ensuring that the activated area is clean and undisturbed.

[0078] Chemical roughening: The substrate film or sheet that has been ultrasonically cleaned and drained is immersed in an acidic roughening working solution with potassium permanganate as the main active ingredient. It is uniformly treated for 3-5 minutes at a temperature of 45-55℃. Through chemical etching, a uniform and dense micro-uneven structure is constructed in the laser-activated area, which significantly improves the surface roughness and the adhesion of active sites.

[0079] Palladium activation: At room temperature, the chemically roughened and cleaned substrate film or plate is steadily immersed in a colloidal palladium activation solution prepared by palladium chloride and stannous chloride for 2-3 minutes. This allows the activated area on the surface of the non-metallic substrate to stably adsorb a layer of palladium / tin composite colloidal particles with high catalytic activity, providing a reliable catalytic basis for subsequent electroless copper plating.

[0080] Reduction: The substrate film after palladium activation treatment is taken out and rinsed quickly, and then immersed in sodium hypophosphite reducing solution with temperature controlled at 40-50℃ for 1-2 minutes. Through the reduction reaction, palladium ions in palladium / tin colloid are fully reduced into highly active metallic palladium nanoparticles, which are uniformly distributed on the substrate surface and form continuous and stable catalytic active centers.

[0081] S4. Selectively deposit a layer of metallic copper in the activated area using a chemical copper plating process to form a conductive antenna circuit;

[0082] The specific implementation method is to immerse the SPS substrate, which has undergone degreasing, ultrasonic cleaning, chemical roughening, palladium activation and reduction treatment, into a chemical copper plating solution. The copper layer is selectively deposited only in the laser-activated circuit area to form an antenna circuit with good conductivity and adhesion.

[0083] Plating solution composition: copper sulfate 9-11 g / L, formaldehyde 7.5-8.5 g / L, disodium EDTA 14-16 g / L, sodium hydroxide 11-13 g / L, stabilizer (2,2'-bipyridine) 9-11 mg / L, pH value 12.2-12.8, temperature 43-47℃; plating time 18-22 minutes, copper layer thickness 3-5 μm.

[0084] S5. Anti-oxidation protection treatment for conductive antenna lines: the treatment methods are passivation, nickel plating, nickel plating passivation sealing or nickel-gold plating sealing.

[0085] The specific implementation method is as follows: to prevent copper circuit oxidation, the anti-oxidation protection method is selected according to the application requirements:

[0086] The conductive antenna circuitry is protected using an electroless nickel plating process. The circuitry is immersed in an electroless nickel plating solution. The solution composition is: nickel sulfate 25-28 g / L, sodium hypophosphite 30-32 g / L, sodium citrate 15-18 g / L, pH 4.8-5.0, temperature 82-85℃. The plating time is 10-12 minutes, resulting in a nickel layer thickness of 1-3 μm. The circuitry is then rinsed with deionized water and dried. The nickel layer acts as a barrier layer, effectively preventing copper diffusion and oxidation.

[0087] S6. Cutting and testing are performed to produce the flat panel antenna.

[0088] The specific implementation method is as follows: For SPS film rolls, a laser cutter or rotary die cutter is used to cut them into individual antenna units; for SPS sheet materials, a laser cutter or mold is used to cut them into individual antenna units; a network analyzer is used to test the standing wave ratio (VSWR) of the antenna in the 2.4GHz, 5GHz, and 6GHz frequency bands, requiring it to be less than 2.0 (WiFi 6) or less than 1.8 (WiFi 7); a multimeter is used to test the continuity of the circuit; the coating adhesion is verified by the cross-cut adhesion test (ASTM D3359), requiring a rating of 4B-5B; the reliability is verified by a constant temperature and humidity test at 85℃ / 85% RH for 240-500 hours; after all tests are passed, the flat panel antenna is manufactured, packaged, and stored.

[0089] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A method for manufacturing a low-dielectric-loss, low-loss planar antenna based on laser-activated chemical plating, characterized in that, Specifically, the following steps are included: S1. Select plastic particles with dielectric constant Dk≤4.0@10GHz and dielectric loss Df≤0.008@10GHz, and extrude them into planar films or sheets. S2. Laser scanning activation is performed on the surface of the film or sheet according to the preset antenna circuit pattern to form an activation area, thereby obtaining the laser-activated substrate; S3. The laser-activated substrate is subjected to degreasing, ultrasonic cleaning, chemical roughening, palladium activation and reduction treatment in sequence. S4. Selectively deposit a layer of metallic copper in the activated area using a chemical copper plating process to form a conductive antenna circuit; S5. Anti-oxidation protection treatment for conductive antenna lines: the treatment methods are passivation, nickel plating, nickel plating passivation sealing or nickel-gold plating sealing. S6. Cutting and testing are performed to produce a flat panel antenna.

2. The method for manufacturing a low-dielectric-value, low-loss planar antenna based on laser-activated chemical plating according to claim 1, characterized in that, The plastic particles are at least one of PPO, LCP, PPS, SPS, and PC.

3. The method for manufacturing a low-dielectric-loss, low-loss planar antenna based on laser-activated chemical plating according to claim 2, characterized in that, For the manufacture of WiFi 7 router flat panel antennas, the plastic particles are at least one of PPO, LCP, PPS, and SPS; for the manufacture of WiFi 6 router flat panel antennas, the plastic particles are PC or SPS.

4. The method for manufacturing a low-dielectric-value, low-loss planar antenna based on laser-activated chemical plating according to claim 1, characterized in that, The extrusion molding in S1 is a continuous extrusion molding process.

5. The method for manufacturing a low-dielectric-loss, low-loss planar antenna based on laser-activated chemical plating according to claim 1, characterized in that, The electroless copper plating in S4 is an addition process.

6. The method for manufacturing a low-dielectric-loss, low-loss planar antenna based on laser-activated chemical plating according to claim 1, characterized in that, The anti-oxidation protection treatment in S5 is a separate process after the completion of chemical copper plating.

7. A low-dielectric-value, low-loss planar antenna based on laser-activated chemical plating, characterized in that, It is prepared by a method for manufacturing a low-dielectric, low-loss planar antenna based on laser-activated chemical plating as described in any one of claims 1-6.

8. A low-dielectric-value, low-loss planar antenna based on laser-activated chemical plating according to claim 7, characterized in that, The substrate of the flat panel antenna is a plastic particle with a dielectric constant Dk≤4.0@10GHz and a dielectric loss Df≤0.008@10GHz, wherein the plastic particle is at least one of PPO, LCP, PPS, SPS and PC.

9. A low-dielectric-value, low-loss planar antenna based on laser-activated chemical plating according to claim 7, characterized in that, The flat panel antenna circuitry is formed by laser activation and chemical copper plating, and is protected against oxidation.

10. A low-dielectric-value, low-loss planar antenna based on laser-activated chemical plating according to claim 7, characterized in that, The antenna has a planar structure, and its dielectric constant and dielectric loss are lower than those of FR4 substrate PCB antennas, making it suitable for WiFi 6 and WiFi 7 router terminals.

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