Lens assembly and electronic device including same

Abstract

According to an embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a lens assembly. The lens assembly may include: a lens group including a first lens, a second lens, a third lens, and a fourth lens sequentially arranged along an optical axis (O-I) in a direction from an object side to an image side; an aperture; and an image sensor comprising an imaging surface (img) on which an image (I) is formed. The first lens may have a positive refractive power, the second lens may have a negative refractive power, the third lens may protrude toward the image side, and the fourth lens may have a negative refractive power. Various other embodiments are also possible.

Description

Technical Field

[0001] The examples disclosed herein relate to a lens assembly and an electronic device including the lens assembly. Background Technology

[0002] Optical devices (such as cameras capable of capturing images or videos) are now widely used. Traditionally, film-based optics were predominantly used, but in recent years, digital or video cameras with solid-state image sensors, such as charge-coupled devices (CCDs) or complementary metal-oxide-semiconductor (CMOS), have become widely available. Optical devices employing solid-state image sensors (CCDs or CMOS) are gradually replacing film-based optics because storing, copying, and moving images is easier compared to film-based optics.

[0003] To obtain high-quality images and / or video, optical devices can include lens assemblies (or optical systems) comprising multiple lenses and an image sensor with a high pixel count. Lens assemblies can achieve high-quality (high-resolution) images and / or video by having, for example, a low F-number (Fno) and fewer aberrations. To obtain a low F-number (Fno) and few aberrations, in other words, to obtain a bright and high-resolution image, multiple lenses need to be combined. As the number of pixels included in an image sensor increases, the pixel count of the image sensor becomes higher, and image sensors with higher pixel counts can obtain high-definition (high-resolution) images and / or video. To realize a high-pixel image sensor within the limited installation space of an electronic device, multiple very small pixels, such as micrometer-level pixels, can be arranged. Recently, image sensors containing tens of millions to hundreds of millions of micrometer-level pixels have also been installed in portable electronic devices such as smartphones and tablet PCs. Such high-performance optical devices can have an enticing effect on users to purchase electronic devices.

[0004] To aid in understanding the purposes of this disclosure, the above information may be provided as relevant technology. No representation or determination is made as to whether any of the foregoing content can be applied to prior art relating to this disclosure. Summary of the Invention

[0005] [Technical Solution] Embodiments of this disclosure may provide an electronic device. The electronic device may include a lens assembly. The lens assembly may include: a lens group comprising a first lens, a second lens, a third lens, and a fourth lens arranged sequentially along the optical axis OI in a direction from the object side to the image side; an aperture; and an image sensor including an imaging surface (img) on ​​which an image (I) is formed. The first lens may have positive refractive power, the second lens may have negative refractive power, the third lens may have a convex shape facing the image side, and the fourth lens may have negative refractive power, and the lens assembly may satisfy the following [Formula 1] to [Formula 4], [Formula 1] IH≥2.8mm [Formula 2] TTL-ASL≤0.01mm [Formula 3] L2MED / L1S1ED≤1.05 [Formula 4] f / EPD≤2.5 (Wherein, in [Formula 1], IH is half the diagonal length of the image sensor; in [Formula 2], TTL is the distance from the object surface S3 of the first lens to the imaging surface of the image sensor; ASL is the distance from the aperture to the imaging surface of the image sensor; in [Formula 3], L1S1ED is the effective diameter of the object surface S3 of the first lens; L2MED is the larger of the effective diameter of the object surface S5 of the second lens and the effective diameter of the surface of the image surface S6 of the second lens; in [Formula 4], f is the combined focal length of the lens assembly; and EPD is the entrance pupil).

[0006] Embodiments of this disclosure may provide a lens assembly. The lens assembly may include: a lens group comprising a first lens, a second lens, a third lens, and a fourth lens arranged sequentially along the optical axis OI in a direction from the object side to the image side; an aperture Sto; and an image sensor IS, including an imaging surface img, on which an image I is formed. The first lens has positive refractive power, and the object-side surface S3 of the first lens has a convex shape facing the object; the second lens has negative refractive power; the third lens has a convex shape facing the image side; and the fourth lens has negative refractive power. The lens assembly may satisfy the following [Equations 1] to [Equations 4]. [Formula 1] IH≥2.8mm [Formula 2] TTL-ASL≤0.01mm [Formula 3] L2MED / L1S1ED≤1.05 [Formula 4] f / EPD≤2.5 (Wherein, in [Formula 1], IH is half the diagonal length of the image sensor; in [Formula 2], TTL is the distance from the object surface S3 of the first lens to the imaging surface of the image sensor; ASL is the distance from the aperture to the imaging surface of the image sensor; in [Formula 3], L1S1ED is the effective diameter of the object surface S3 of the first lens; L2MED is the larger of the effective diameter of the object surface S5 of the second lens and the effective diameter of the surface of the image surface S6 of the second lens; in [Formula 4], f is the combined focal length of the lens assembly; and EPD is the entrance pupil). Attached Figure Description

[0007] Figure 1 This is a block diagram of an electronic device in a network environment according to embodiments disclosed herein.

[0008] Figure 2 This is a block diagram illustrating a camera module according to an embodiment disclosed herein.

[0009] Figure 3 This is a front perspective view showing an electronic device according to an embodiment disclosed herein.

[0010] Figure 4 This is a rear perspective view showing an electronic device according to an embodiment disclosed herein.

[0011] Figure 5 This is a cross-sectional view showing a portion of a display and lens assembly according to an embodiment disclosed herein.

[0012] Figure 6a This is a view showing the configuration of a lens according to an embodiment disclosed herein.

[0013] Figure 6b This illustrates embodiments according to the disclosure herein. Figure 6a A curve showing the spherical aberration of the lens assembly.

[0014] Figure 6c This illustrates embodiments according to the disclosure herein. Figure 6a The image scatter curve of the lens assembly.

[0015] Figure 6d This illustrates embodiments according to the disclosure herein. Figure 6a A graph showing the distortion and aberration of the lens components.

[0016] Figure 7a This is a view showing the configuration of a lens assembly according to an embodiment disclosed herein.

[0017] Figure 7b This illustrates embodiments according to the disclosure herein. Figure 7aA curve showing the spherical aberration of the lens assembly.

[0018] Figure 7c This illustrates embodiments according to the disclosure herein. Figure 7a The image scatter curve of the lens assembly.

[0019] Figure 7d This illustrates embodiments according to the disclosure herein. Figure 7a A graph showing the distortion and aberration of the lens components.

[0020] Figure 8a This is a view showing the configuration of a lens assembly according to an embodiment disclosed herein.

[0021] Figure 8b This illustrates embodiments according to the disclosure herein. Figure 8a A curve showing the spherical aberration of the lens assembly.

[0022] Figure 8c This illustrates embodiments according to the disclosure herein. Figure 8a The image scatter curve of the lens assembly.

[0023] Figure 8d This illustrates embodiments according to the disclosure herein. Figure 8a A graph showing the distortion and aberration of the lens components.

[0024] Figure 9a This is a view illustrating the configuration of a lens assembly according to an embodiment disclosed herein.

[0025] Figure 9b This illustrates embodiments according to the disclosure herein. Figure 9a A curve showing the spherical aberration of the lens assembly.

[0026] Figure 9c This illustrates embodiments according to the disclosure herein. Figure 9a The image scatter curve of the lens assembly.

[0027] Figure 9d This illustrates embodiments according to the disclosure herein. Figure 9a A graph showing the distortion and aberration of the lens components.

[0028] Figure 10a This is a view illustrating the configuration of a lens assembly according to an embodiment disclosed herein.

[0029] Figure 10b This illustrates embodiments according to the disclosure herein. Figure 10a A curve showing the spherical aberration of the lens assembly.

[0030] Figure 10c This illustrates embodiments according to the disclosure herein. Figure 10aThe image scatter curve of the lens assembly.

[0031] Figure 10d This illustrates embodiments according to the disclosure herein. Figure 10a A graph showing the distortion and aberration of the lens components.

[0032] Throughout the accompanying drawings, the same reference numerals may be assigned to the same components, configurations, and / or structures. Detailed Implementation

[0033] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment of the present disclosure. (Refer to...) Figure 1 In network environment 100, electronic device 101 can communicate with at least one of electronic devices 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In an embodiment, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In an embodiment, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (e.g., display module 160).

[0034] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121 or be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0035] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0036] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0037] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0038] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0039] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0040] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0041] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0042] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0043] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0044] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0045] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0046] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0047] The power management module 188 manages the power supply to the electronic device 101. According to one embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0048] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0049] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). A corresponding one of these communication modules can communicate via a first network 198 (e.g., a short-range communication network, such as Bluetooth). TM The wireless communication module 192 can communicate with external electronic devices via a Wi-Fi Direct or Infrared Data Association (IrDA) network or a second network 199 (e.g., a long-range communication network, such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can use user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196 to identify and verify the electronic device 101 in the communication network (such as a first network 198 or a second network 199).

[0050] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0051] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0052] According to an embodiment, antenna module 197 can form a millimeter-wave antenna module. According to an embodiment, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0053] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via inter-peripheral communication schemes (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0054] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that will run on electronic device 101 can be run on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service or should perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0055] Figure 2 This illustrates a camera module 290 according to an embodiment of the present disclosure (e.g., Figure 1 The block diagram 200 (180) is shown in Figure 180. (Refer to...) Figure 2Camera module 290 may include lens assembly 280, flash 220, image sensor 230, image stabilizer 240, memory 250 (e.g., buffer memory), or image signal processor 260. In one embodiment, lens assembly 280 may include image sensor 230. Lens assembly 280 may capture light emitted from an object to be imaged. Lens assembly 280 may include one or more lenses. According to an embodiment, camera module 290 may include multiple lens assemblies 280. In this case, camera module 290 may form, for example, a dual-camera system, a 360-degree camera, or a spherical camera. Some of the multiple lens assemblies 280 may have the same lens characteristics (e.g., field of view, focal length, F-number, or optical zoom), or at least one of the lens assemblies may have one or more lens properties that differ from the lens properties of the other lens assemblies. Lens assembly 280 may include, for example, a wide-angle lens or a telephoto lens.

[0056] Flash 220 emits light to enhance light emitted or reflected from an object. According to embodiments, flash 220 may include one or more light-emitting diodes (e.g., red-green-blue (RGB) LEDs, white LEDs, infrared (IR) LEDs, or ultraviolet (UV) LEDs) or xenon lamps. Image sensor 230 acquires an image corresponding to an object by converting light emitted or reflected from the object and transmitted through lens assembly 280 into an electrical signal. According to embodiments, image sensor 230 may include one image sensor selected from a plurality of image sensors with different characteristics (e.g., an RGB sensor, a black-and-white (BW) sensor, an IR sensor, or a UV sensor), a plurality of image sensors having the same characteristics, or a plurality of image sensors with different characteristics. Each image sensor included in image sensor 230 may be implemented using, for example, a charge-coupled device (CCD) sensor or a complementary metal-oxide-semiconductor (CMOS) sensor.

[0057] Image stabilizer 240 may move image sensor 230 or at least one lens included in lens assembly 280 in a specific direction, or may control the operating characteristics of image sensor 230 (e.g., adjust readout timing) in response to movement of camera module 290 or electronics 201 including camera module 290. This compensates for at least a portion of the negative effects on the captured image caused by the aforementioned movement (e.g., image blur). According to embodiments, image stabilizer 240 may use a gyroscope sensor (not shown) or accelerometer sensor (not shown) disposed within or outside camera module 290 to sense camera module 290 or electronics (e.g., Figure 1The movement of the electronic device 101 in the image sensor 230. According to an embodiment, the image stabilizer 240 may be implemented as, for example, an optical image stabilizer. The memory 250 may at least temporarily store at least a portion of the images acquired via the image sensor 230 for subsequent image processing tasks. For example, if multiple images are captured based on shutter lag, the acquired raw images (e.g., Bayer pattern images, high-resolution images) may be stored in the memory 250 and can be used... Figure 1 The display module 160 is used to preview its corresponding copy image (e.g., a low-resolution image). Then, when predetermined conditions are met (e.g., user input or system command), at least some of the original images stored in the memory 250 can be acquired and processed by, for example, an image signal processor 260. According to an embodiment, the memory 250 can be configured as a memory (e.g., ... Figure 1 At least a portion of the memory 130, or the memory 250 may be configured as a separate memory that operates independently of the memory 130.

[0058] Image signal processor 260 can perform one or more image processing operations on images acquired by image sensor 230 or stored in memory 250. The one or more image processing operations may include, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image compositing, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or optionally, image signal processor 260 can perform control (e.g., exposure time control or readout timing control) on at least one component included in camera module 290 (e.g., image sensor 230). Images processed by image signal processor 260 can be stored back in memory 250 for further processing, or the image can be provided to components outside camera module 290 (e.g., ...). Figure 1 (The memory 130, display module 160, electronic device 102, electronic device 104, or server 108). According to an embodiment, the image signal processor 260 may be configured as a processor (e.g., Figure 1 The image signal processor 260 may be configured as a separate processor operating independently of the processor 120, or at least a portion thereof. When the image signal processor 260 is configured as a separate processor from the processor 120, the processor 120 may cause at least one image processed by the image signal processor 260 to be displayed via the display module 160 as is, or to be displayed after further image processing.

[0059] According to an embodiment, electronic devices (e.g., Figure 1The electronic device 101 may include a plurality of camera modules 290 with different attributes or functions. In this case, for example, at least one of the plurality of camera modules 290 may be a wide-angle camera, and at least another may be a telephoto camera. Similarly, at least one of the plurality of camera modules 290 may be a front-facing camera, and at least another may be a rear-facing camera.

[0060] Figure 3 This is a front perspective view showing an electronic device according to an embodiment disclosed herein. Figure 4 This is a rear perspective view showing an electronic device according to an embodiment disclosed herein.

[0061] Figure 3 and Figure 4 The configuration of the electronic device 101 can be with Figure 1 The configuration of the electronic device 101 is completely or partially the same.

[0062] Reference Figure 3 and Figure 4 According to an embodiment, the electronic device 101 may include a housing 210, including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding the space between the first surface 210A and the second surface 210B. In an embodiment (not shown), the housing 210 may refer to a structure formed by... Figure 2 First surface 210A and Figure 3 The structure includes some of the second surface 210B and side surfaces 210C. According to an embodiment, at least a portion of the first surface 210A may be formed of a substantially transparent front surface panel 202 (e.g., a glass or polymer panel including various coatings). The second surface 210B may be formed of a substantially opaque rear surface panel 211. The rear surface panel 211 may be made of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of two or more of these materials. The side surface 210C may be defined by a side surface structure (or “side surface frame structure”) 218 ​​coupled to the front surface panel 202 and the rear surface panel 211 and comprising metal and / or polymer. In an embodiment, the rear surface panel 211 and the side surface structure 218 may be integrated with each other and may comprise the same material (e.g., a metallic material such as aluminum).

[0063] Although not shown, the front surface panel 202 may include one or more curved regions that extend seamlessly from at least a portion of its edge toward the rear surface panel 211. In an embodiment, at one side edge of the first surface 210A, the front surface panel 202 (or the rear surface panel 211) may include only one of the regions that curve and extend toward the rear surface panel 211 (or the front surface panel 202). According to an embodiment, the front surface panel 202 or the rear surface panel 211 may have a substantially flat plate shape, and in this case, the curved and extended regions may not be included. When curved and extended regions are included, the thickness of the electronic device 101 in the portion including the curved and extended regions may be less than the thickness of the other portions.

[0064] According to an embodiment, the electronic device 101 may include a display 201, an audio module (not shown) including one or more sound holes 203, 207, and 214 (e.g., Figure 1 The audio module 170), sensor module (e.g., Figure 1 Sensor module 176), camera modules 205, 212 and 213 (e.g., Figure 1 The camera module 180 and key input device 217 (e.g., in the camera module 180) are included. Figure 1 Input module 150) and connector holes 208 and 209 (e.g., Figure 1 At least one of the above components (e.g., key input device 217 or light-emitting element 206) in the electronic device 101. In an embodiment, at least one of the above components (e.g., key input device 217 or light-emitting element 206) may be omitted in the electronic device 101, or other components may be included.

[0065] According to an embodiment, the display 201 may be visually exposed through, for example, a large portion of the front surface panel 202. In an embodiment, at least a portion of the display 201 may be visually exposed through the front surface panel 202 forming the first surface 210A or through a portion of the side surface 210C. In an embodiment, the edge of the display 201 may be formed to have a substantially similar shape to the periphery of its adjacent front surface panel 202. In an embodiment (not shown), the distance between the periphery of the display 201 and the periphery of the front surface panel 202 may be substantially constant to increase the visually exposed area of ​​the display 201.

[0066] In one embodiment (not shown), a recess or opening may be provided in a portion of the screen display area of ​​the display 201, and may include one or more of a sound hole 214, a sensor module 204, a camera module 205, and a light-emitting element 206 aligned with the recess or opening. In another embodiment (not shown), the rear surface of the screen display area of ​​the display 201 may include at least one of a sound hole 214, a sensor module 204, a camera module 205, a fingerprint sensor (not shown), and a light-emitting element 206. In another embodiment (not shown), the display 201 may be coupled to a touch-sensitive circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer configured to detect an electromagnetic field type stylus, or a proximity setting of a touch-sensitive circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer configured to detect an electromagnetic field type stylus. In another embodiment, at least some of the sensor modules 204 and / or at least some of the key input devices 217 may be disposed on the side surface 210C.

[0067] According to an embodiment, the audio module (not shown) may include a microphone hole 203 and sound holes 207 and 214. A microphone configured to acquire external sound may be placed inside the microphone hole 203, and in an embodiment, multiple microphones may be placed to detect the direction of sound. According to an embodiment, sound holes 207 and 214 may include an external sound hole 207 and a communication receiver hole 214. In an embodiment, sound holes 207 and 214 and microphone hole 203 may be implemented as a hall, or a speaker (e.g., a piezoelectric speaker) may be included in the audio module without sound holes 207 and 214.

[0068] According to an embodiment, sensor module 204 can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of electronic device 101. Sensor module 204 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface 210A of housing 210. According to an embodiment, additional sensor modules may be disposed on a second surface 210B of housing 210. The fingerprint sensor (not shown) may be disposed not only on the first surface 210A of housing 210 (e.g., display 201), but also on the second surface 210B or side surface 210C of housing 210. Electronic device 101 may also include at least one of, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0069] According to an embodiment, camera modules 205, 212, and 213 may include a first camera module 205 facing a first surface 210A of electronic device 101 and a second camera module 212 facing a second surface 210B, and / or a flash 213. For example, the first camera module 205 and / or the second camera module 212 may include one or more lenses, image sensors, and / or image signal processors. According to an embodiment, some of the camera modules 205 and / or some sensor modules (e.g., sensor module 204) may be configured to be exposed to the outside through at least a portion of the display 201. According to an embodiment, the first camera module 205 may include a punch-hole camera disposed within a hole or recess disposed in the rear surface of the display 201. For example, the first camera module 205 may receive at least a portion of the light incident on the first surface (or front surface) 210A of electronic device 101 through the display 201 inside electronic device 101. According to an embodiment, the first camera module 205 and / or sensor module 204 can be disposed from the internal space of the electronic device 101 to the front panel 202 of the display 201 to contact the external environment through a transparent area. Alternatively, some sensor modules 204 can be disposed within the internal space of the electronic device to perform their functions without being visually exposed through the front panel 202.

[0070] According to an embodiment, the second camera module 212 may be disposed inside the housing 210, such that the lens is exposed on the second surface (or rear surface) 210B of the electronic device 101. For example, the camera module 212 may be electrically connected to a printed circuit board (e.g., Figure 4 The printed circuit board 240a in the device 101. For example, the flash 213 may include a light-emitting diode or a xenon lamp. In an embodiment, one or more lenses (e.g., infrared camera lenses, wide-angle lenses, and telephoto lenses) and an image sensor may be disposed on a surface of the electronic device 101. In an embodiment, the flash 213 may emit infrared light. For example, infrared light emitted from the flash 213 and reflected by an object can be received by a sensor module (not shown) disposed on a second surface 210B of the housing 210. The electronic device 101 or processor (e.g., Figure 1 The processor 180 in the sensor module can detect the depth information of an object based on the time point at which infrared light is received from the sensor module.

[0071] Camera modules 205, 212 and 213 are not limited to the above-described structure, and can be modified in various ways depending on the structure of electronic device 101, for example by installing only some camera modules or by adding new camera modules.

[0072] According to embodiments, electronic device 101 may include multiple camera modules (e.g., dual-camera or triple-camera) that each have different attributes (e.g., field of view) or functions. For example, multiple camera modules 205 and 212 may be provided, each including lenses with different fields of view, and electronic device 101 may control and change the field of view of the camera modules 205 and 212 operating therein based on user selection. For example, at least one of the multiple camera modules 205 and 212 may be a wide-angle camera, and at least one of the other camera modules may be a telephoto camera. Similarly, at least one of the multiple camera modules 205 and 212 may be a front-facing camera, and at least one of the other camera modules may be a rear-facing camera. Additionally, the multiple camera modules 205 and 212 may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (e.g., a time-of-flight (TOF) camera or a structured light camera). According to embodiments, an IR camera may operate as at least part of a sensor module. For example, a TOF camera may operate as at least part of a sensor module (not shown) for detecting the distance to an object.

[0073] According to an embodiment, the key input device 217 may be disposed on the side surface 210C of the housing 210. In an embodiment, the electronic device 101 may not include some or all of the aforementioned key input devices 217, and the un-included key input devices 217 may be implemented on the display 201 in another form, such as soft keys. In an embodiment, the key input device may include a sensor module disposed on the second surface 210B of the housing 210.

[0074] According to an embodiment, the light-emitting element 206 may be disposed on, for example, a first surface 210A of the housing 210. The light-emitting element 206 may provide, for example, status information of the electronic device 101 in an optical form. In an embodiment, the light-emitting element 206 may provide a light source operatively linked to, for example, a camera module 205. The light-emitting element 206 may include, for example, an LED, an IR LED, and a xenon lamp.

[0075] According to an embodiment, connector holes 208 and 209 may include: a first connector hole 208 capable of accommodating a connector (e.g., a USB connector) configured to send power and / or data to / receive power and / or data from an external electronic device; and a second connector hole (e.g., a headphone jack) 209 capable of accommodating a connector configured to send audio signals to / receive audio signals from an external electronic device.

[0076] Figure 5 This is a cross-sectional view showing a portion of a display and lens assembly according to an embodiment disclosed herein.

[0077] Reference Figure 5In an embodiment, electronic device 101 (e.g., Figure 1 Electronic device 101 and / or Figure 3 and Figure 4 The electronic device 101 in the middle may include a display 301 (e.g., Figure 1 The display module 160 and Figure 3 and Figure 4 The display 201 and lens assembly 380 (e.g., Figure 2 (Lens assembly 280 in the middle).

[0078] According to an embodiment, the display 301 may include a cover glass (or front panel) 310 (e.g., Figure 3 and Figure 4 The front panel 202), display panel 320, and / or support panel 330 are included. As will be described later, according to an embodiment, the display 301 may include a through-hole 341 to receive at least a portion of the lens assembly 380.

[0079] According to an embodiment, the cover glass 310 may be laminated or disposed on the front surface (e.g., the +Z direction surface) of the display panel 320. For example, the cover glass 310 may be formed to be substantially transparent in at least a partial area and may provide protection for the display panel 320. According to an embodiment, the support panel 330 may be laminated or disposed on the rear surface (e.g., the -Z direction surface) of the display panel 320. For example, the support panel 330 may comprise a single layer or multiple layers and may be formed to support the display panel 320.

[0080] In an embodiment, electronic device 101 may include a front-facing camera (e.g., Figure 2 The camera module 280 and / or Figure 3 The first camera module 205 in the device. According to an embodiment, the lens assembly 380 may include the front-facing camera of the electronic device 101 (e.g., the first camera module 205 in the device). Figure 3 In the first camera module 205). According to an embodiment, a front-facing camera (e.g., a lens assembly 380) is included. Figure 3 The first camera module 205 in the display 301 can be a camera (e.g., an under-display camera (UDC)) located below (or behind) the display 301.

[0081] According to an embodiment, the lens assembly 380 can be configured to receive light through a camera exposure area of ​​the display 301. Here, the camera exposure area can be a through-hole 341 (e.g., a punch or perforation) formed in a portion of the display 310.

[0082] In an embodiment, the through-hole 341 of the display 301 can be disposed in the effective area (or screen area) of the display 301 where an image is displayed, or in a non-effective area of ​​the display 301 surrounding the effective area where no image is displayed. According to an embodiment, the through-hole 341 can be formed in the effective area of ​​the display 301, and in this case, the through-hole 341 can extend from the support panel 330 to the display panel 320 in the thickness direction (e.g., the Z-axis direction) of the electronic device 101. (See also...) Figure 5 For example, the thickness of the through hole 341 (e.g., the thickness in the Z-axis direction) can be compared with... Figure 5 The thickness t1 corresponds to the thickness t1, which can be about 1 mm to about 1.5 mm. However, the extent in which the through hole 341 is formed on the display 301 is not limited, and according to an embodiment, the through hole 341 can be formed only in the support panel 330, or it can be formed as part of the thickness (e.g., the thickness in the Z-axis direction) of the display panel 320 penetrating from the support panel 330.

[0083] According to an embodiment, the lens assembly 380 may include a lens group containing multiple lenses (e.g., at least four lenses) and a lens barrel B disposed around the lens group.

[0084] According to an embodiment, the lens assembly 380 or lens group may include a first lens L1, a second lens L2, a third lens L3, and a fourth lens (e.g., Figure 6a The fourth lens L4 in the image). According to an embodiment, the lens assembly 380 may be provided with multiple lenses passing through the object (or external object) side to the image side (e.g., the fourth lens L4 in the image). Figure 5 Lenses L1, L2, L3 and / or Figure 6a The fourth lens L4 is located on the optical axis OI at its center. According to an embodiment, the first lens L1 may be disposed or positioned within the through-hole 341 of the display 301. According to an embodiment, all or part of the second lens L2 may be disposed or positioned within the through-hole 341 of the display 301. According to an embodiment, the diameter (or effective diameter) of the first lens L1 (e.g., Figure 5 In this context, d1) can be larger than the diameter (or effective diameter) of the second lens L2 (e.g., Figure 5 (d2 in the middle).

[0085] According to an embodiment, the lens barrel B can be disposed within the electronic device 101 and can be formed as a support lens (e.g., Figure 5 Lenses L1, L2, and L3 and / or Figure 6a (The fourth lens L4 in the lens barrel). For example, the portion of the lens barrel B containing the first lens L1 and the second lens L2 can be formed in a cylindrical shape, but is not limited to this. See reference. Figure 5 The diameter of the portion of the lens barrel B disposed in the through hole 341 (e.g., Figure 5l1 in the figure can be smaller than the diameter of the through hole 341 (e.g., Figure 5 (l2 in the middle).

[0086] [Example 1] Figure 6a This is a view illustrating the configuration of a lens assembly according to an embodiment disclosed herein. Figure 6b This illustrates embodiments according to the disclosure herein. Figure 6a A curve showing the spherical aberration of the lens assembly. Figure 6c This illustrates embodiments according to the disclosure herein. Figure 6a The image scatter curve of the lens assembly. Figure 6d This illustrates embodiments according to the disclosure herein. Figure 6a A graph showing the distortion and aberration of the lens components.

[0087] Figure 6a The configuration of the lens assembly 400 can be matched with Figure 5 The configuration of the lens assembly 380 is completely or partially the same or similar.

[0088] Reference Figures 6a to 6d In embodiments, electronic devices (e.g., Figure 1 , Figure 3 and Figure 4 The electronic device 101 may include a lens assembly 400 (e.g., Figure 2 Lens assembly 280 and / or Figure 5 The lens assembly 380 (or optical system). According to embodiments of this disclosure, the lens assembly (e.g., Figure 6a Lens assembly 400 in Figure 7a Lens assembly 500, Figure 8a Lens assembly 600 in Figure 9a Lens assembly 700 and / or Figure 10a The lens assembly 800 can be configured with the camera module of the electronic device 101 (e.g., Figure 1 Camera module 180, Figure 2 Camera module 290, Figure 3 Camera module 205 and / or Figure 4 At least a portion of the camera module 212. According to embodiments of the present disclosure, the lens assembly 400 can be designed to achieve a bright wide-angle (e.g., a field of view (FOV) of about 80 degrees) optical system with high pixel count while being miniaturized and / or thinned to be suitable for application in a punch-hole display. For example, the lens assembly 400 can, but not exclusively, be configured in an optical system in which the path of incident light to the image sensor IS is formed as a straight line (e.g., a direct optical system), and can be configured in a curved optical system in which the incident light is reflected / refracted at least once and reaches the image sensor IS when including a reflecting member (e.g., a prism or a mirror).

[0089] According to an embodiment, the lens assembly 400 may be arranged on an optical axis OI passing through the center of a plurality of lenses L1, L2, L3, and L4 from the object (or external object) side to the image side. In the following description of the configuration of each of the lenses L1, L2, L3, and L4, for example, the object side may indicate the side where the object O is located, and the image side may indicate the side where the imaging surface img is located, on which the image I is formed.

[0090] According to an embodiment, the lens assembly 400 includes: a lens group including a plurality of lenses (e.g., at least four elements) L1, L2, L3, and L4; an aperture sto; and / or an image sensor IS. According to an embodiment, the plurality of lenses L1, L2, L3, and L4, the aperture sto, and / or the image sensor IS of the lens group can be substantially aligned on the optical axis OI.

[0091] Reference Figure 6a In an embodiment, the lens assembly (or lens group) 400 may include a first lens L1 arranged and / or aligned sequentially along the optical axis OI in the direction from the object O toward the image sensor IS (e.g., Figure 5 The first lens L1 and the second lens L2 (e.g., Figure 5 The second lens L2 and the third lens L3 (for example, Figure 5 The first lens L3 and / or the fourth lens L4 are included. According to embodiments, each of lenses L1, L2, L3, and L4 may include an "object-side surface" and an "image-side surface," wherein the object-side surface is the surface facing the object O, and the image-side surface is the surface facing the image I (or image sensor IS). For example, the first lens L1 may include an object-side surface S3 and an image-side surface S4. For example, the second lens L2 may include an object-side surface S5 and an image-side surface S6. For example, the third lens L3 may include an object-side surface S7 and an image-side surface S8. For example, the fourth lens L4 may include an object-side surface S9 and an image-side surface S10. According to embodiments, lenses L1, L2, L3, and L4 may be made of synthetic resin (e.g., plastic). However, the number and materials of the lenses in the lens group of this disclosure are not limited. For example, additional lenses may be included, or at least one lens may be made of glass.

[0092] According to an embodiment, at least some of the lenses L1, L2, L3, and L4 may have at least one of an object-side surface or an image-side surface formed aspherical. For example, by forming the surfaces of lenses L1, L2, L3, and L4 aspherical, spherical aberration that may occur in the lenses can be suppressed, coma at the periphery of the image sensor IS can be reduced, astigmatism can be easily controlled, and field curvature from the center to the periphery of the imaging surface img of the image sensor IS can be reduced.

[0093] In the detailed description below, the shapes of the object-side surfaces of lenses L1, L2, L3, and L4, which are the surfaces facing object O and / or the image-side surfaces facing image sensor IS or imaging surface img, can be described using the terms "concave" or "convex." References to the shape of a lens surface can refer to the shape of the intersection with the optical axis OI or to the "paraxial region" surrounding the intersection with the optical axis OI. Describing an "object-side surface with a concave shape" can mean that the center of the radius of curvature of the object-side surface is located on the object side. Describing an "object-side surface with a convex shape" can mean that the center of the radius of curvature of the object-side surface is located on the image sensor IS side. Therefore, even when one surface of the lens (the paraxial region of that surface) is described as having a convex shape, the edge region surrounding the paraxial region of the lens can be concave. Similarly, even when one surface of the lens (the paraxial region of that surface) is described as having a concave shape, the edge region surrounding the paraxial region of the lens can be convex.

[0094] In an embodiment, the first lens L1 is the lens closest to the object (or the first lens from the object side) and may have positive refractive power. According to an embodiment, the object-side surface S3 of the first lens L1 may have a convex shape facing the object. For example, the convex shape of the object-side surface S3 can suppress the increase in spherical aberration caused by the large diameters of lenses L1, L2, L3, and L4. According to an embodiment, at least one of the object-side surface S3 and the image-side surface S4 of the first lens L1 may be formed aspherical. According to an embodiment, the refractive index of the first lens L1 may be relatively small compared to the refractive index of the second lens L2, and may be, for example, about 1.6 or less.

[0095] According to the embodiment, the diameter (or effective diameter) of the first lens L1 (e.g., Figure 6a In this context, d1) can be larger than the diameter (or effective diameter) of the second lens L2 (e.g., Figure 6a (d2 in the original text). For example, the diameter d1 of the first lens L1 can be the effective diameter of the object surface S3 of the first lens L1. For example, the diameter d2 of the second lens L2 can be the larger of the effective diameter of the object surface S5 and the effective diameter of the image surface S6 of the second lens L2.

[0096] In an embodiment, the second lens L2 is the second lens from the object side and may have negative refractive power. According to an embodiment, the image-side surface S6 of the second lens L2 may have a concave shape facing the image side. For example, the shape of the concave image-side surface S6 can help reduce or thin the overall length of the lens assembly 400 and improve aberrations.

[0097] According to an embodiment, the effective diameter of the second lens L2 can be smaller than the effective diameter of the first lens L1. According to an embodiment, the effective diameter of the object-side surface S5 or the effective diameter of the image-side surface S6 of the second lens L2 is larger than the effective diameter of the object-side surface S3 of the first lens L1. According to an embodiment, the refractive index of the second lens L2 can be greater than the refractive indices of the first lens L1, the third lens L3, and / or the fourth lens L4. For example, by making the refractive index of the second lens L2 greater than that of the first lens L1, the lens assembly 400 can be made thinner, and chromatic aberration caused by the first lens L1 can be corrected.

[0098] In an embodiment, the third lens L3 is the third lens from the object side and may have positive refractive power. According to an embodiment, the third lens L3 may have a meniscus shape convex towards the image side, and this shape of the third lens L3 can facilitate the correction of peripheral aberrations. For example, the object-side surface S7 and the image-side surface S8 of the third lens L3 may have convex shapes towards the image side.

[0099] In an embodiment, the fourth lens L4 is the fourth lens from the object side and may have negative refractive power. According to an embodiment, the object-side surface S9 and / or the image-side surface S10 of the fourth lens L4 may be formed as an aspherical surface including at least one inflection point. In this disclosure, an inflection point may refer to a point where the curvature sign (or radius of curvature) changes at a lens edge region surrounding the paraxial region of the lens. For example, the inflection point may be located at the boundary between a region on a lens surface whose radius of curvature is centered on the object O side and a region whose radius of curvature is centered on the image sensor IS side. For example, using at least one inflection point of the object-side surface S9 of the fourth lens L4 as a boundary, the paraxial region may have a center of radius of curvature located on the image sensor IS side, and the edge region surrounding the paraxial region may have a center of radius of curvature located on the object O side. According to an embodiment, the image-side surface S10 of the fourth lens L4 may include at least one inflection point. For example, since the image-side surface S10 includes at least one inflection point, the field curvature from the paraxial region around the point where the image-side surface S10 intersects the optical axis OI to the peripheral region (or edge region) surrounding the paraxial region can be reduced or minimized. According to an embodiment, the fourth lens L4 may have a meniscus shape convex toward the object in the paraxial region, and a convex inflection point shape inclined toward the object around the peripheral region of the paraxial region. This shape of the fourth lens L4 can facilitate a reduction in the effective diameter of the fourth lens L4, which is the lens closest to the image sensor IS, and make the lens assembly 400 thinner. According to an embodiment, the refractive index of the fourth lens L4 may be relatively smaller than that of the second lens L2, and may be, for example, about 1.6 or less.

[0100] According to an embodiment, the second lens L2 is configured to have a high refractive index, and the first lens L1, the third lens L3, and / or the fourth lens L4 are configured to have a low refractive index. This can facilitate the realization of a mass-market lens assembly at a relatively lower manufacturing cost compared to implementing multiple lenses as high-refractive-index lenses.

[0101] In an embodiment, at least one of lenses L1, L2, L3, and L4 and / or the image sensor IS can be configured to reciprocate along the optical axis OI. According to an embodiment, electronic devices (e.g., Figure 1 Electronic device 101 and / or Figure 3 and Figure 4 Electronic device 101) or processor (e.g., Figure 1 The processor 120 can be configured to focus or adjust the focal length by causing the lenses L1, L2, L3 and L4 and / or the image sensor IS to reciprocate along the optical axis OI.

[0102] According to an embodiment, the aperture sto can be disposed between the object O and the first lens L1, and can be implemented, for example, on a surface of the first lens L1 (e.g., the object-side surface S3). For example, placing the aperture sto in front of the object-side surface S3 of the first lens L1 can help reduce the field of view of the optical system and minimize the diameter of the optical system.

[0103] According to an embodiment, the aperture sto is positioned on the object side relative to lenses L1, L2, L3, and L4, and can define the light to be substantially incident on the lens assembly (e.g., Figure 6a Lens assembly 400 in Figure 7a Lens assembly 500, Figure 8a Lens assembly 600 in Figure 9a Lens assembly 700 and / or Figure 10a The area on the lens assembly 800. According to an embodiment, the aperture sto can be disposed between the object O and the first lens L1, and can be implemented, for example, on a surface of the first lens L1 (e.g., object-side surface S3). For example, lenses L1, L2, L3, and L4 are substantially disposed between the aperture sto and the image sensor IS, and can focus light incident through the aperture sto and cause the light to be incident on the image sensor IS. For example, placing the aperture sto in front of the object-side surface S3 of the first lens L1 can help reduce the field of view of the optical system and minimize the diameter of the optical system. For example, by placing the aperture sto in front of the object-side surface S3 of the first lens L1, good wide-angle performance can be provided while reducing the diameter of the lens assembly 400, 500, 600, 700, or 800.

[0104] Reference Figure 6aAccording to an embodiment, the aperture sto can be arranged to align with the vertex of the first lens L1. Here, the vertex of the first lens L1 can refer to the central portion of the object surface S3 of the first lens L1, that is, the portion closest to the object or the highest portion. For example, the vertex of the object surface S3 of the first lens L1 can be located at the intersection of the optical axis OI and the object surface S3. For example, as another expression, the aperture sto can be placed on a virtual plane that contacts the vertex of the object surface S3.

[0105] According to an embodiment, the image sensor IS may include an imaging surface img, at which at least some of the light focused by the aperture sto and / or lenses L1, L2, L3, and L4 is received and an image is formed. According to an embodiment, the image sensor IS may be a sensor mounted on a circuit board or the like to be aligned with an optical axis and capable of responding to light. The image sensor IS may include, for example, sensors such as complementary metal-oxide-semiconductor (CMOS) or charge-coupled devices (CCDs). Not limited to these, the image sensor IS may include various elements configured to convert, for example, an image of an object into an electrical image signal. The image sensor IS can acquire an image of an object by detecting contrast information, grayscale information, color information, etc., about the object from light that has passed through multiple lenses.

[0106] According to an embodiment, the lens assembly 400 may further include an infrared cut-off filter F. According to an embodiment, the infrared cut-off filter F may be disposed between the image sensor IS and the fourth lens L4 of the lens group. According to an embodiment, the infrared cut-off filter F may include an object-side surface S11 facing the object O and an image-side surface S12 facing the image sensor IS. For example, the infrared cut-off filter F may block light (e.g., infrared radiation) in a wavelength band that is indistinguishable to the naked eye of the user but detected by the film or image sensor IS. For example, in a lens assembly or electronic device 101 for detecting infrared radiation, the infrared cut-off filter F may be replaced by a filter that transmits infrared radiation and blocks visible light. For example, the infrared cut-off filter F may be aligned along the optical axis OI with the plurality of lenses L1, L2, L3 and L4 of the lens group, the aperture S10, and / or the image sensor IS.

[0107] Unless otherwise specified, the radius, effective focal length (f), total optical length (TTL), surface distance (SD) or thickness, and image height (IH) of the image sensor IS for each of the lenses L1, L2, L3, and L4 disclosed herein may all be in mm. Furthermore, the radius, effective focal length, TTL, SD, thickness, or IH of the image sensor IS for each of the lenses L1, L2, L3, and L4 may be a distance measured about the optical axis OI.

[0108] In the following description, according to an embodiment, [Formulas 1 to 11] are used to realize the lens assembly 400 as a bright wide-angle optical system with high pixel count while being miniaturized and / or thinned to be suitable for application in a hole-punch display (HID).

[0109] According to the embodiment, reference will be made later. Figures 6a to 10d Description Figure 6a Lens assembly 400, Figure 7a Lens assembly 500, Figure 8a Lens assembly 600, Figure 9a Lens assembly 700 and Figure 10a The lens assembly 800 can also satisfy the following [Formula 1 to Formula 11].

[0110] According to the embodiments, lens assemblies 400, 500, 600, 700 and 800 can satisfy the following [Formula 1].

[0111] [Formula 1]: IH≥2.8mm Here, the image height (IH) can be half the diagonal length of the image sensor IS.

[0112] In [Formula 1], IH can represent the size of the image sensor IS. In embodiments of this disclosure, when applying a high-pixel image sensor IS with an IH of about 2.8 mm or greater and satisfying [Formula 1], it may be relatively difficult to achieve a bright (e.g., small F-number or Fno) optical system with a short (small) total length and control aberrations compared to cases where the IH is less than about 2.8 mm. For example, when the IH in [Formula 1] is less than about 2.8 mm, it may be relatively advantageous to achieve a thin and bright optical system compared to cases where the IH is about 2.8 mm or greater.

[0113] According to the embodiments, lens assemblies 400, 500, 600, 700 and 800 can satisfy the following [Formula 2].

[0114] [Formula 2]: TTL-ASL≤0.01mm Here, the total optical length (TTL) is the distance from the object surface S3 of the first lens L1 to the imaging surface img of the image sensor IS, and the aperture stop length (ASL) can be the distance from the aperture sto to the imaging surface img of the image sensor IS.

[0115] In [Formula 2], TTL-ASL can define the position of aperture sto within the lens assembly. According to an embodiment, when ASL in [Formula 2] is greater than TTL (or when TTL-ASL is approximately 0.01 or less), it can help reduce the size of electronic components (e.g., Figure 1 , Figure 3 and Figure 4 The display of the electronic device 101 in the middle (e.g., Figure 5 The through-hole of the display 301 in the middle (e.g., Figure 1 The size of the through hole 351 in [Formula 2] may be limited when ASL is less than TTL (or when TTL-ASL is greater than about 0.01), and the appearance design of the electronic device 101 may be compromised.

[0116] According to the embodiments, lens assemblies 400, 500, 600, 700 and 800 can satisfy the following [Formula 3].

[0117] [Formula 3]: L2MED / L1S1ED≤1.05 In [Formula 3], L1S1ED can be the effective diameter of the object surface S3 of the first lens L1, and L2MED can be the larger of the effective diameter of the object surface S5 of the second lens L2 and the effective diameter of the image surface S6 of the second lens L2.

[0118] The L2MED / L1S1ED in [Formula 3] defines the relative size of the second lens L2 with respect to the first lens L1. According to an embodiment, when L2MED / L1S1ED in [Formula 3] is about 1.05 or less, the lens assembly can be miniaturized and / or thinned to suit its provision as a high-intensity display (HID) camera. For example, when L2MED / L1S1ED in [Formula 3] is greater than about 1.05, due to the larger effective diameter of the second lens L2, it may be difficult to place at least a portion of the first lens L1 and the second lens L2 of the lens assembly in a display (e.g., ...). Figure 5 The through-hole of the display 301 in the middle (e.g., Figure 5 In the through hole 341).

[0119] In other words, when the diameter of the second lens L2 is larger than that of the display (e.g., Figure 5 The through-hole of the display 301 in the middle (e.g., Figure 5 When the diameter of the through-hole 341 is larger than the diameter of the second lens L2, it may be difficult to place the first lens L1 and the second lens L2 of the lens assembly within the through-hole 341. Alternatively, when the diameter of the through-hole 341 is enlarged beyond the diameter of the second lens L2, the size of the through-hole visible on the display 301 may increase, which could damage the electronic device (e.g., Figure 3 and Figure 4 The aesthetics or design of the electronic device 101.

[0120] According to the embodiments, lens assemblies 400, 500, 600, 700 and 800 can satisfy the following [Formula 4].

[0121] [Formula 4]: f / EPD≤2.5 Here, the focal length (f) can be a combination of focal lengths of the lens assembly, such as 400, 500, 600, 700, or 800, and the EPD can be the diameter of the entrance pupil.

[0122] According to an embodiment, when f / EPD in [Formula 4] is greater than about 2.5, the limiting resolution may be reduced, thereby the overall performance of the optical system may be degraded compared to the case where f / EPD is about 2.5 or less, and the optical system may become a relatively dark optical system (e.g., with an increased F number or Fno).

[0123] According to the embodiments, lens assemblies 400, 500, 600, 700 and 800 can satisfy the following [Formula 5].

[0124] [Formula 5]: 17 <V2<25 Here, V2 can be the Abbe number of the second lens L2 at a wavelength of 587.6 nm.

[0125] V2 in [Formula 5] defines the Abbe number condition for achieving an optical system with improved chromatic aberration control performance. According to an embodiment, when V2 in [Formula 5] is about 25 or greater, or about 17 or less, it may be difficult to ensure the image quality of the optical system due to the increase in chromatic aberration, especially longitudinal chromatic aberration.

[0126] According to the embodiments, lens assemblies 400, 500, 600, 700 and 800 can satisfy the following [Formula 6].

[0127] [Formula 6]: N2≥1.66 Here, N2 can be the refractive index of the second lens L2 at a wavelength of 587.6 nm.

[0128] [Equation 6] can define the refractive index conditions for achieving a miniaturized optical system with improved chromatic aberration. According to an embodiment, when N2 in [Equation 6] is less than about 1.66, the field of view of the optical system may decrease, but controlling the aberrations of lenses L1, L2, L3, and L4 and optimizing the lens performance (e.g., modulation transfer function (MTF)) may become difficult, and the overall length of the lens assembly may become longer, which may defeat the requirement for miniaturization of the optical system.

[0129] According to the embodiments, lens assemblies 400, 500, 600, 700 and 800 can satisfy the following [Formula 7].

[0130] [Formula 7]: N1≤1.6 Here, N1 can be the refractive index of the first lens L1 at a wavelength of 587.6 nm.

[0131] According to an embodiment, the refractive index condition defined by [Equation 7] can define the conditions for achieving a lens assembly with improved aberrations. For example, when N1 in [Equation 7] exceeds approximately 1.6, it may be detrimental to improving the aberrations of the optical system.

[0132] According to the embodiments, lens assemblies 400, 500, 600, 700 and 800 can satisfy the following [Formula 8].

[0133] [Formula 8]: N4≤1.6 Here, N4 can be the refractive index of the fourth lens L4 at a wavelength of 587.6 nm.

[0134] According to an embodiment, the refractive index condition defined by [Equation 8] can define the conditions for achieving a lens assembly with improved aberrations. For example, when N4 in [Equation 9] exceeds approximately 1.6, it may be detrimental to improving the aberrations of the optical system.

[0135] According to the embodiments, lens assemblies 400, 500, 600, 700 and 800 can satisfy the following [Formula 9].

[0136] [Formula 9]: CT2 ≥ 0.15 mm Here, CT2 can be the center thickness of the second lens L2. For example, CT2 can be measured about the optical axis OI.

[0137] According to the embodiment, CT2 in [Formula 9] can define the thinness condition of the optical system. For example, when CT2 in [Formula 9] is less than about 0.15 mm, it may be difficult to ensure the thinness characteristics of the optical system.

[0138] According to the embodiments, lens assemblies 400, 500, 600, 700 and 800 can satisfy the following [Formula 10].

[0139] [Formula 10]: SD / TTL≤0.9 Here, the surface distance (SD) is the distance from the object surface S3 of the first lens L1 to the image surface S10 of the fourth lens L4, and the total optical length (TTL) can be the distance from the object surface S3 of the first lens L1 to the imaging surface img of the image sensor IS.

[0140] [Formula 10] can define the conditions for achieving a thin optical system with a reduced overall length. According to an embodiment, when the SD / TTL in [Formula 10] is greater than about 0.9, the value of SD may not be suitable for mass production of the lens assembly, and for example, the manufacture of the lens assembly may be impossible.

[0141] According to the embodiments, lens assemblies 400, 500, 600, 700 and 800 can satisfy the following [Formula 11].

[0142] [Formula 11]: 1.0≤TTL / f Here, TTL can be the distance from the object surface S3 of the first lens L1 to the imaging surface img of the image sensor IS, and f is the combined focal length of the lens assembly 400, 500, 600, 700 or 800.

[0143] The TTL / f in [Equation 11] can define the conditions used to realize a wide-angle camera (or optical system). For example, when the TTL / f in [Equation 11] is about 1.0 or less, the field of view becomes smaller and is suitable for telephoto cameras, but may not be suitable for realizing a wide-angle camera.

[0144] The following [Table 1] indicates the information based on what will be referred to later. Figures 7a to 10d The lens assemblies 400, 500, 600, 700, and 800 described in [Example 1] and [Examples 2 to 5] have the values ​​of IH in [Formula 1], TTL-ASL in [Formula 2], L2MED / L1S1ED in [Formula 3], f / EPD in [Formula 4], V2 in [Formula 5], N2 in [Formula 6], and N1 in [Formula 7]. Referring to [Table 1], it can be seen that the lens assemblies 400, 500, 600, 700, and 800 according to [Examples 1 to 5] satisfy the above [Formulas 1 to 7].

[0145] [Table 1]

[0146] In an embodiment, the lens assembly 400 may be manufactured to satisfy the shapes of the lenses L1, L2, L3, and L4 (e.g., lens surfaces) and the conditions presented in [Formulas 1 to 11], and have the specifications illustrated in [Table 2]. In [Table 2], the lens surface 1 may represent the distance between the first lens L1 and the object O, and the measurement of its thickness may be the distance of the distance or the air gap.

[0147] The lens assembly 400, implemented with the specifications in [Table 2] below, can be a wide optical system with a focal length (f) of about 3.41 mm, an f number (Fno) of about 2.25, and a field of view (FOV) of about 80 degrees.

[0148] [Table 2]

[0149] Tables 3 and 4 below represent the aspherical coefficients of lenses L1, L2, L3 and L4, and the aspherical coefficients can be calculated using Equation 1 below.

[0150] [Equation 1]

[0151] Here, "x" can refer to the distance from the vertex of each of lenses L1, L2, L3, and L4 along the optical axis OI, "y" can refer to the distance in the direction perpendicular to the optical axis OI, "R" can refer to the radius of curvature at the vertex of each of lenses L1, L2, L3, and L4, and "K" can refer to the quadratic coefficient. "Can refer to aspheric coefficients. In this disclosure, aspheric coefficients "A4", "A6", "A8", "A" are used." 10 “A” 12 “A” 14 “A” 16 “A” 18 “A” 20 “A” 22 “A” 24 “A” 26 “A” 28 "and "A 30 The numbers can be represented sequentially as "A", "B", "C", "D", "E", "F", "G", "H", "J", "K", "L", "M", "N", and "O". For example, E+01 can represent 10. 1 And E-02 can represent 10 -2 The radius of curvature (R) can represent, for example, a value indicating the degree of curvature at each point on a surface or curve.

[0152] [Table 3]

[0153] [Table 4]

[0154] Figure 6b This is a graph showing the spherical aberration of the lens assembly 400 according to an embodiment of the present disclosure, and illustrating the variation of longitudinal spherical aberration with respect to the wavelength of light, where the horizontal axis represents the longitudinal spherical aberration coefficient and the vertical axis represents the normalized distance from the optical axis OI. The longitudinal spherical aberration is represented for light beams having wavelengths of, for example, 656.3000 (nm), 587.6000 (nm), 546.1000 (nm), 486.1000 (nm), and 435.8000 (nm). Figure 6c This is a graph showing the astigmatism curve of the lens assembly 400 according to an embodiment of the present disclosure for light with a wavelength of 546.1000 (NM), where "S" represents the sagittal plane and "T" represents the tangential plane or meridional plane. Figure 6d This is a graph showing the distortion of the lens assembly 400 according to an embodiment of the present disclosure for light with a wavelength of 546.1000 (NM).

[0155] [Example 2] Figure 7a This is a view illustrating the configuration of a lens assembly according to an embodiment disclosed herein. Figure 7b This illustrates embodiments according to the disclosure herein. Figure 7a A curve showing the spherical aberration of the lens assembly. Figure 7c This illustrates embodiments according to the disclosure herein. Figure 7a The image scatter curve of the lens assembly. Figure 7d This illustrates embodiments according to the disclosure herein. Figure 7a A graph showing the distortion and aberration of the lens components.

[0156] In this disclosure, according to Figures 7a to 7d The configuration of the lens assembly 500 in the embodiment can at least partially correspond to that according to Figures 6a to 6d The lens assembly 400 in the embodiments is configured the same as or similarly. Figures 6a to 6d The description of the first lens L1, second lens L2, third lens L3 and / or fourth lens L4, aperture sto and / or image sensor IS of the lens assembly 400 in the embodiment can also be applied to the following: Figures 7a to 7d The lens assembly 400 of the embodiment includes a first lens L1, a second lens L2, a third lens L3 and / or a fourth lens L4, an aperture Sto and / or an image sensor IS.

[0157] according to Figures 7a to 7d The lens assembly 500 of the embodiment can satisfy the above requirements. Figures 6a to 6d Formulas 1 to 11 are described in the embodiments.

[0158] In an embodiment, the lens assembly 500 may be manufactured according to the specifications illustrated in [Table 5] below, and may have the aspherical coefficients shown in [Table 6] and [Table 7]. In [Table 5], the lens surface 1 may illustrate the spacing between the first lens L1 and the object O, and the measured value of its thickness may be the distance of the spacing or the air gap.

[0159] The lens assembly 500, implemented with the specifications in [Table 5] below, can be a wide optical system with a focal length (f) of about 3.24 mm, an f number (Fno) of about 2.25, and a field of view (FOV) of about 80 degrees.

[0160] [Table 5]

[0161] The following Tables 6 and 7 describe the aspherical coefficients of lenses L1, L2, L3 and L4 of lens assembly 500, and the aspherical coefficients can be calculated by Equation 1 described above with reference to Tables 3 and 4.

[0162] [Table 6]

[0163] [Table 7]

[0164] Figure 7b This is a graph showing the spherical aberration of the lens assembly 500 according to an embodiment of the present disclosure, and illustrating the variation of longitudinal spherical aberration with respect to the wavelength of light, where the horizontal axis represents the longitudinal spherical aberration coefficient and the vertical axis represents the normalized distance from the optical axis OI. The longitudinal spherical aberration is represented for light beams having wavelengths of, for example, 656.3000 (nm), 587.6000 (nm), 546.1000 (nm), 486.1000 (nm), and 435.8000 (nm). Figure 7c This is a graph showing the astigmatism curve of the lens assembly 500 according to an embodiment of the present disclosure for light with a wavelength of 546.1000 (NM), where "S" represents the sagittal plane and "T" represents the tangential plane or meridional plane. Figure 7d This is a graph showing the distortion of the lens assembly 500 according to an embodiment of the present disclosure for light with a wavelength of 546.1000 (NM).

[0165] [Example 3] Figure 8a This is a view showing the configuration of a lens according to an embodiment disclosed herein. Figure 8bThis illustrates embodiments according to the disclosure herein. Figure 8a A curve showing the spherical aberration of the lens assembly. Figure 8c This illustrates embodiments according to the disclosure herein. Figure 8a The image scatter curve of the lens assembly. Figure 8d This illustrates embodiments according to the disclosure herein. Figure 8a A graph showing the distortion and aberration of the lens components.

[0166] In this disclosure, according to Figures 8a to 8d The configuration of the lens assembly 600 in the embodiment can at least partially correspond to that according to Figures 6a to 6d The lens assembly 400 in the embodiments is configured the same as or similarly. Figures 6a to 6d The description of the first lens L1, second lens L2, third lens L3 and / or fourth lens L4, aperture sto and / or image sensor IS of the lens assembly 400 in the embodiment can also be applied to the following: Figures 8a to 8d The lens assembly 600 of the embodiment includes a first lens L1, a second lens L2, a third lens L3 and / or a fourth lens L4, an aperture Sto and / or an image sensor IS.

[0167] according to Figures 8a to 8d The lens assembly 600 of the embodiment can satisfy the above requirements. Figures 6a to 6d Formulas 1 to 11 are described in the embodiments.

[0168] In an embodiment, the lens assembly 600 may be manufactured with the specifications illustrated in Table 8 below, and may have the aspherical coefficients shown in Tables 9 and 10. In Table 8, the lens surface 1 may represent the spacing between the first lens L1 and the object O, and the measured value of its thickness may be the distance of the spacing or the air gap.

[0169] The lens assembly 600, implemented with the specifications in [Table 8] below, can be a wide optical system with a focal length (f) of about 3.23 mm, an f number (Fno) of about 2.25, and a field of view (FOV) of about 81 degrees.

[0170] [Table 8]

[0171] The following Tables 9 and 10 describe the aspherical coefficients of lenses L1, L2, L3 and L4 of the lens assembly 600, and the aspherical coefficients can be calculated by Equation 1 described above with reference to Tables 3 and 4.

[0172] [Table 9]

[0173] [Table 10]

[0174] Figure 8b This is a graph showing the spherical aberration of the lens assembly 600 according to an embodiment of the present disclosure, and illustrating the variation of longitudinal spherical aberration with respect to the wavelength of light, where the horizontal axis represents the longitudinal spherical aberration coefficient and the vertical axis represents the normalized distance from the optical axis OI. The longitudinal spherical aberration is represented for light beams having wavelengths of, for example, 656.3000 (nm), 587.6000 (nm), 546.1000 (nm), 486.1000 (nm), and 435.8000 (nm). Figure 8c This is a graph showing the astigmatism curve of the lens assembly 600 according to an embodiment of the present disclosure for light with a wavelength of 546.1000 (NM), where "S" represents the sagittal plane and "T" represents the tangential plane or meridional plane. Figure 8d This is a graph showing the distortion of the lens assembly 600 according to an embodiment of the present disclosure for light with a wavelength of 546.1000 (NM).

[0175] [Example 4] Figure 9a This is a view illustrating the configuration of a lens assembly according to an embodiment disclosed herein. Figure 9b This illustrates embodiments according to the disclosure herein. Figure 9a A curve showing the spherical aberration of the lens assembly. Figure 9c This illustrates embodiments according to the disclosure herein. Figure 9a The image scatter curve of the lens assembly. Figure 9d This illustrates embodiments according to the disclosure herein. Figure 9a A graph showing the distortion and aberration of the lens components.

[0176] In this disclosure, according to Figures 9a to 9d The lens assembly 700 of the embodiment can be configured at least partially with that according to Figures 6a to 6d The lens assembly 400 in the embodiments is configured the same as or similarly. Figures 6a to 6d The description of the first lens L1, second lens L2, third lens L3 and / or fourth lens L4, aperture sto and / or image sensor IS of the lens assembly 400 in the embodiment can also be applied to the following: Figures 9a to 9d The lens assembly 700 of the embodiment includes a first lens L1, a second lens L2, a third lens L3 and / or a fourth lens L4, an aperture Sto and / or an image sensor IS.

[0177] according to Figures 9a to 9d The lens assembly 700 of the embodiment can satisfy the above requirements. Figures 6a to 6d Formulas 1 to 11 are described in the embodiments.

[0178] In an embodiment, the lens assembly 700 may be manufactured to the specifications illustrated in [Table 11] and may have the aspheric coefficients of [Table 12] and [Table 13]. In [Table 11], the lens surface 1 may illustrate the spacing between the first lens L1 and the object O, and the measured value of its thickness may be the distance of the spacing or the air gap.

[0179] The lens assembly 700, implemented with the specifications in [Table 11] below, can be a wide optical system with a focal length (f) of about 3.32 mm, an f number (Fno) of about 2.25, and a field of view (FOV) of about 80 degrees.

[0180] [Table 11]

[0181] The following Tables 12 and 13 describe the aspherical coefficients of lenses L1, L2, L3 and L4 of lens assembly 700, and the aspherical coefficients can be calculated by Equation 1 described above with reference to Tables 3 and 4.

[0182] [Table 12]

[0183] [Table 13]

[0184] Figure 9b This is a graph illustrating the spherical aberration of the lens assembly 700 according to an embodiment of the present disclosure, and showing the variation of longitudinal spherical aberration with respect to the wavelength of light, where the horizontal axis represents the longitudinal spherical aberration coefficient and the vertical axis represents the normalized distance from the optical axis OI. The longitudinal spherical aberration is represented for light beams having wavelengths of, for example, 656.3000 (nm), 587.6000 (nm), 546.1000 (nm), 486.1000 (nm), and 435.8000 (nm). Figure 9c This is a graph showing the astigmatism curve of the lens assembly 700 according to an embodiment of the present disclosure for light with a wavelength of 546.1000 (NM), where "S" represents the sagittal plane and "T" represents the tangential plane or meridional plane. Figure 9d This is a graph showing the distortion of the lens assembly 700 according to an embodiment of the present disclosure for light with a wavelength of 546.1000 (NM).

[0185] [Example 5] Figure 10a This is a view illustrating the configuration of a lens assembly according to an embodiment disclosed herein. Figure 10b This illustrates embodiments according to the disclosure herein. Figure 10a A curve showing the spherical aberration of the lens assembly. Figure 10cThis illustrates embodiments according to the disclosure herein. Figure 10a The image scatter curve of the lens assembly. Figure 10d This illustrates embodiments according to the disclosure herein. Figure 10a A graph showing the distortion and aberration of the lens components.

[0186] In this disclosure, according to Figures 10a to 10d The lens assembly 800 of the embodiment can be configured at least partially with that according to Figures 6a to 6d The lens assembly 400 in the embodiments is configured the same as or similarly. Figures 6a to 6d The description of the first lens L1, second lens L2, third lens L3 and / or fourth lens L4, aperture sto and / or image sensor IS of the lens assembly 400 in the embodiment can also be applied to the following: Figures 10a to 10d The lens assembly 800 of the embodiment includes a first lens L1, a second lens L2, a third lens L3 and / or a fourth lens L4, an aperture Sto and / or an image sensor IS.

[0187] according to Figures 10a to 10d The lens assembly 800 of the embodiment can satisfy the above requirements. Figures 6a to 6d Formulas 1 to 11 are described in the embodiments.

[0188] In an embodiment, the lens assembly 800 may be manufactured with the specifications illustrated in Table 14 below, and may have the aspherical coefficients shown in Tables 15 and 16. In Table 14, the lens surface 1 may represent the spacing between the first lens L1 and the object O, and the measurement of its thickness may be the distance of the spacing or the air gap.

[0189] The lens assembly 800, implemented with the specifications in [Table 14] below, can be a wide optical system with a focal length (f) of about 3.37 mm, an f number (Fno) of about 2.25, and a field of view (FOV) of about 80 degrees.

[0190] [Table 14]

[0191] The following Tables 15 and 16 describe the aspherical coefficients of lenses L1, L2, L3 and L4 of the lens assembly 800, and the aspherical coefficients can be calculated by Equation 1 described above with reference to Tables 3 and 4.

[0192] [Table 15]

[0193] [Table 16]

[0194] Figure 10b This is a graph showing the spherical aberration of the lens assembly 800 according to an embodiment of the present disclosure, and illustrating the variation of longitudinal spherical aberration with respect to the wavelength of light, where the horizontal axis represents the longitudinal spherical aberration coefficient and the vertical axis represents the normalized distance from the optical axis OI. The longitudinal spherical aberration is represented for light beams having wavelengths of, for example, 656.3000 (nm), 587.6000 (nm), 546.1000 (nm), 486.1000 (nm), and 435.8000 (nm). Figure 10c This is a graph showing the astigmatism curve of the lens assembly 800 according to an embodiment of the present disclosure for light with a wavelength of 546.1000 (NM), where "S" represents the sagittal plane and "T" represents the tangential plane or meridional plane. Figure 10d This is a graph showing the distortion of a lens assembly 800 according to an embodiment of the present disclosure for light with a wavelength of 546.1000 nm. Optical systems including multiple lenses can be applied to camera modules of various electronic devices (e.g., smartphones, tablet PCs, smartwatches, drones). Typically, aberrations occur in optical systems due to the shape of the lenses, and it is necessary to minimize these aberrations to provide good optical performance. Generally, to reduce aberrations in an optical system, methods such as using a relatively small sensor, using a dark lens while using a large sensor, or increasing the overall length of the lenses can be employed.

[0195] The embodiments disclosed herein are intended to at least address the aforementioned problems and / or disadvantages and provide at least the advantages described later, and may provide a lens assembly (or optical system) optimized for high-pixel image sensors with reduced overall length and improved optical performance (aberration control performance and brightness), as well as an electronic device including the lens assembly.

[0196] Some embodiments disclosed herein can provide a lens assembly for achieving a bright, wide-angle camera with high resolution while being miniaturized and / or thinned to be suitable for application in a punch-hole display.

[0197] According to the embodiments disclosed herein, the lens assembly can be easily mounted on miniaturized and / or lightweight electronic devices such as smartphones, and can help expand optical functionality or improve optical performance in electronic devices.

[0198] The technical problems to be solved by this disclosure are not limited to those mentioned above, and other technical problems not described above can be clearly understood by those skilled in the art from the description of this disclosure.

[0199] The effects that can be obtained through this disclosure are not limited to those described above, and other effects not described above can be clearly understood by those skilled in the art to which this disclosure pertains from the description of this disclosure.

[0200] Some embodiments of this disclosure can provide an electronic device. The electronic device may include a lens assembly 400, 500, 600, 700, or 800. The lens assembly may include: a lens group comprising a first lens L1, a second lens L2, a third lens L3, and a fourth lens L4 arranged sequentially along the optical axis OI in a direction from the object O to the image I; an aperture Sto; and an image sensor IS, including an imaging surface img on which an image I is formed. The first lens may have positive refractive power, the second lens may have negative refractive power, the third lens may have a convex shape facing the image, and the fourth lens may have negative refractive power, and the lens assembly may satisfy the following [Formula 1] to [Formula 4]. [Formula 1]: IH≥2.8mm [Formula 2]: TTL-ASL≤0.01mm [Formula 3]: L2MED / L1S1ED≤1.05 [Formula 4]: f / EPD≤2.5 (Wherein, in [Formula 1], IH is half the diagonal length of the image sensor; in [Formula 2], TTL is the distance from the object surface S3 of the first lens to the imaging surface of the image sensor; ASL is the distance from the aperture to the imaging surface of the image sensor; in [Formula 3], L1S1ED is the effective diameter of the object surface S3 of the first lens; L2MED is the larger of the effective diameter of the object surface S5 of the second lens and the effective diameter of the image surface S6 of the second lens; in [Formula 4], f is the combined focal length of the lens assembly; and EPD is the entrance pupil).

[0201] According to an embodiment, the lens assembly can satisfy the following [Formula 5], [Formula 5]: 17 <V2<25 (Where, V2 in [Formula 5] is the Abbe number of the second lens at a wavelength of 587.6 nm).

[0202] According to an embodiment, the object-side surface S3 of the first lens may have a convex shape facing the object side.

[0203] According to an embodiment, the lens assembly can satisfy the following [Formula 6], [Formula 6]: N2≥1.66 (Where, N2 in [Formula 6] is the refractive index of the second lens at a wavelength of 587.6 nm).

[0204] According to an embodiment, the lens assembly can satisfy the following [Formula 7], [Formula 7]: N1≤1.6 (Where, N1 in [Formula 7] is the refractive index of the first lens at a wavelength of 587.6 nm).

[0205] According to the embodiment, the lens assembly can satisfy the following [Formula 8], [Formula 8]: N4≤1.6 (Where, N4 in [Formula 8] is the refractive index at a wavelength of 587.6 nm for the fourth lens).

[0206] According to an embodiment, the second lens may have negative refractive power and satisfy the following [Formula 9], [Formula 9]: CT2 ≥ 0.15 mm (Where, CT2 in [Formula 9] is the center thickness of the second lens).

[0207] According to an embodiment, the second lens may have negative refractive power, and the image-side surface S6 of the second lens has a concave shape facing the image side.

[0208] According to an embodiment, at least one of the object surface S9 or the image surface S10 of the fourth lens can be formed to have at least one inflection point.

[0209] According to the embodiment, the lens assembly can satisfy the following [Formula 10], [Formula 10]: SD / TTL≤0.9 (Where, in [Formula 10], SD is the distance from the object surface S3 of the first lens to the image surface S10 of the fourth lens, and TTL is the distance from the object surface S3 of the first lens to the imaging surface of the image sensor).

[0210] According to the embodiment, the lens assembly can satisfy the following [Formula 11], [Formula 11]: 1.0≤TTL / f (Where, TTL in [Formula 11] is the distance from the object surface S3 of the first lens to the imaging surface of the image sensor, and f is the combined focal length of the lens assembly).

[0211] According to an embodiment, the electronic device may further include a display 201 or a display 301, which includes at least one through-hole 341. At least a portion of the second lens L2 and the first lens L1 may be disposed in the through-hole.

[0212] According to an embodiment, the display may include a support panel 330, a display panel 320 disposed on a surface of the support panel facing a first direction, and a cover glass 310 disposed on a surface of the display panel facing a first direction.

[0213] According to an embodiment, the through hole can be formed from a surface of the support panel facing the opposite direction to the first direction to a surface of the display panel facing the first direction.

[0214] According to an embodiment, the aperture can be configured to face the object surface S3 of the first lens.

[0215] Some embodiments of this disclosure may provide lens assemblies 400, 500, 600, 700, or 800. The lens assembly may include: a lens group comprising a first lens L1, a second lens L2, a third lens L3, and a fourth lens L4 arranged sequentially along the optical axis OI in a direction from the object O side to the image I side; an aperture S10; and an image sensor IS, including an imaging surface img on which an image I is formed. The first lens may have positive refractive power, the object-side surface S3 of the first lens may have a convex shape facing the object, the second lens has negative refractive power, the third lens has a convex shape facing the image side, and the fourth lens has negative refractive power. The lens assembly may satisfy the following [Formula 1] to [Formula 4].

[0216] [Formula 1]: IH≥2.8mm [Formula 2]: TTL-ASL≤0.01mm [Formula 3]: L2MED / L1S1ED≤1.05 [Formula 4]: f / EPD≤2.5 (Wherein, in [Formula 1], IH is half the diagonal length of the image sensor; in [Formula 2], TTL is the distance from the object surface S3 of the first lens to the imaging surface of the image sensor; ASL is the distance from the aperture to the imaging surface of the image sensor; in [Formula 3], L1S1ED is the effective diameter of the object surface S3 of the first lens; L2MED is the larger of the effective diameter of the object surface S5 of the second lens and the effective diameter of the image surface S6 of the second lens; in [Formula 4], f is the combined focal length of the lens assembly; and EPD is the entrance pupil).

[0217] According to the embodiment, the second lens can satisfy the following [Formula 5] and [Formula 6], [Formula 5]: V2<25 [Formula 6]: N2≥1.66 (Where, V2 in [Formula 5] is the Abbe number of the second lens at a wavelength of 587.6 nm, and N2 in [Formula 6] is the refractive index of the second lens at a wavelength of 587.6 nm).

[0218] According to the embodiment, the lens assembly can satisfy the following [Formula 7] and [Formula 8], [Formula 7]: N1≤1.6 [Formula 8]: N4≤1.6 (Where, N1 in [Formula 7] is the refractive index of the first lens at a wavelength of 587.6 nm, and N4 in [Formula 8] is the refractive index of the fourth lens at a wavelength of 587.6 nm).

[0219] According to an embodiment, the second lens may have negative refractive power and may satisfy the following [Formula 9], and the image-side surface S6 of the second lens may have a concave shape facing the image side, and At least one of the object surface S9 and the image surface S10 of the fourth lens may be formed to have at least one inflection point. [Formula 9]: CT2 ≥ 0.15 mm (Where, CT2 in [Formula 9] is the center thickness of the second lens).

[0220] According to the embodiment, the lens assembly can satisfy the following [Formula 10] and [Formula 11], [Formula 10]: SD / TTL≤0.9 [Formula 11]: 1.0≤TTL / f (Wherein, in [Formula 10], SD is the distance from the object surface S3 of the first lens to the image surface S10 of the fourth lens, TTL is the distance from the object surface S3 of the first lens to the imaging surface of the image sensor, and in [Formula 11], TTL is the distance from the object surface S3 of the first lens to the imaging surface of the image sensor, and f is the combined focal length of the lens assembly).

[0221] The embodiments disclosed herein should be understood as examples and not as limitations of this disclosure. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, which includes the appended claims and their equivalents.

[0222] The electronic device according to various embodiments of this disclosure can be any electronic device of various types. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0223] It should be understood that the specific embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the corresponding embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the singular form of a noun corresponding to an item may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include all possible combinations of the items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0224] As used in conjunction with embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0225] The embodiments described herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0226] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0227] According to various embodiments, each of the above components (e.g., a module or program) may include a single entity or multiple entities. Some of the multiple entities may be separately located in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0228] While exemplary embodiments of this disclosure have been shown and described, this disclosure is not limited to the specific embodiments described above, and it will be understood that various modifications can be made by those skilled in the art to which this disclosure pertains without departing from the spirit of this disclosure as claimed in the appended claims. Furthermore, such modifications are intended to be interpreted without independence from the technical concept or vision of this disclosure.

Claims

1. An electronic device (101), comprising: Lens assembly (400; 500； 600； 700; 800), including: The lens group includes a first lens (L1), a second lens (L2), a third lens (L3) and a fourth lens (L4) arranged sequentially along the optical axis (OI) in the direction from the object (O) side to the image (I) side. Aperture (sto); and An image sensor (IS) includes an imaging surface (img) on ​​which an image (I) is formed. The first lens has positive refractive power, the second lens has negative refractive power, the third lens has a convex shape facing the image, and the fourth lens has negative refractive power. The lens assembly satisfies the following [Formula 1] to [Formula 4], [Formula 1] IH≥2.8mm [Formula 2] TTL-ASL≤0.01mm [Formula 3] L2MED / L1S1ED≤1.05 [Formula 4] f / EPD≤2.5 (Wherein, in [Formula 1], IH is half the diagonal length of the image sensor; in [Formula 2], TTL is the distance from the object surface (S3) of the first lens to the imaging surface of the image sensor; ASL is the distance from the aperture to the imaging surface of the image sensor; in [Formula 3], L1S1ED is the effective diameter of the object surface (S3) of the first lens; L2MED is the larger of the effective diameter of the object surface (S5) of the second lens and the effective diameter of the surface of the image surface (S6) of the second lens; in [Formula 4], f is the combined focal length of the lens assembly; and EPD is the entrance pupil).

2. The electronic device according to claim 1, wherein, The lens assembly satisfies the following [Formula 5], [Formula 5] 17<V2<25 (Where, V2 in [Formula 5] is the Abbe number of the second lens at a wavelength of 587.6 nm).

3. The electronic device according to claim 1 or 2, wherein, The object-side surface (S3) of the first lens has a convex shape facing the object side.

4. The electronic device according to any one of claims 1 to 3, wherein, The lens assembly satisfies the following [Formula 6], [Formula 6] N2≥1.66 (Where, N2 in [Formula 6] is the refractive index of the second lens at a wavelength of 587.6 nm).

5. The electronic device according to any one of claims 1 to 4, wherein, The lens assembly satisfies the following [Formula 7], [Formula 7] N1≤1.6 (Where, N2 in [Formula 7] is the refractive index of the second lens at a wavelength of 587.6 nm).

6. The electronic device according to any one of claims 1 to 5, wherein, The lens assembly satisfies the following [Formula 8], [Formula 8] N4≤1.6 (Where, N4 in [Formula 8] is the refractive index of the fourth lens at a wavelength of 587.6 nm).

7. The electronic device according to any one of claims 1 to 6, wherein, The second lens has negative refractive power and satisfies the following [Equation 9], [Formula 9] CT2 ≥ 0.15 mm (Where, CT2 in [Formula 9] is the center thickness of the second lens).

8. The electronic device according to any one of claims 1 to 7, wherein, The second lens has negative refractive power, and the image-side surface (S6) of the second lens has a concave shape facing the image side.

9. The electronic device according to any one of claims 1 to 8, wherein, At least one of the object surface (S9) or image surface (S10) of the fourth lens is formed to have at least one inflection point.

10. The electronic device according to any one of claims 1 to 9, wherein, The lens assembly satisfies the following [Formula 10], [Formula 10] SD / TTL≤0.9 (Where, in [Formula 10], SD is the distance from the object surface (S3) of the first lens to the image surface (S10) of the fourth lens, and TTL is the distance from the object surface (S3) of the first lens to the imaging surface of the image sensor).

11. The electronic device according to any one of claims 1 to 10, wherein, The lens assembly satisfies the following [Formula 11], [Formula 11] 1.0≤TTL / f (Where, TTL in [Formula 11] is the distance from the object surface (S3) of the first lens to the imaging surface of the image sensor, and f is the combined focal length of the lens assembly).

12. The electronic device according to any one of claims 1 to 11, further comprising: Displays (201, 301), including through-hole (341), and At least a portion of the second lens (L2) and the first lens (L1) are disposed in the through hole.

13. The electronic device according to claim 12, wherein, The display (201; 301) further includes: a support panel (330); a display panel (320) disposed on the surface of the support panel facing a first direction; and a cover glass (310) disposed on the surface of the display panel facing the first direction.

14. The electronic device according to claim 13, wherein, The through hole is formed by passing through the surface of the support panel facing a second direction opposite to the first direction to the surface of the display panel facing the first direction.

15. The electronic device according to any one of claims 1 to 14, wherein, The aperture is configured to face the object surface of the first lens (S3).

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