Chip pickup device

Abstract

The chip pickup apparatus includes: a pickup head having a holder; and a chip jacking device which jacks up the chip from the lower surface of the adhesive sheet and assists the holder in holding the chip. The chip jacking device comprises: a cylindrical body having an internal space; a cover having an upper surface that is in contact with the adhesive sheet, a through-hole that opens in the upper surface, and an air flow path that introduces negative pressure to the upper surface; a center pin and an angle pin which protrude from the through hole and jack up the chip; a flow path switching unit that introduces any one of negative pressure, atmospheric pressure, and positive pressure into the air flow path; and a pipe that connects the flow path switching unit and the air flow path without passing through the internal space.

Description

Technical Field

[0001] The present invention relates to a chip picking device that picks up chips supplied in an arranged manner to an adhesive sheet from the lower surface by using pins. Background Technology

[0002] The chip pickup device lifts the chips, which are supplied to the adhesive sheet in an arranged manner, from the lower surface of the adhesive sheet using pins, and picks them up (holds) using a nozzle or the like (holding member). Alternatively, chip pickup devices are known that use a vacuum to attract the adhesive sheet from its upper surface by a chip lifting device that abuts against the lower surface of the adhesive sheet, while simultaneously lifting it with pins to peel the chip off. (Examples: Patent Document 1, Patent Document 2)

[0003] Patent Document 1's chip pickup device (chip component supply device) utilizes a vacuum pump to draw in the internal space of a supply head that moves the supply pins internally, and vacuum-draws the lower surface of the adhesive sheet through an adsorption hole formed on the upper surface of the supply head. Patent Document 2's chip pickup device utilizes a vacuum pump to draw in the gap between the outer periphery of a needle holder that moves the supply pins internally and the inner periphery of a cylindrical body arranged to surround the needle holder, and vacuum-draws the lower surface of the adhesive sheet through suction vents formed on the upper surfaces of the needle holder and the cylindrical body.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2003-273195

[0007] Patent Document 2: Japanese Patent Application Publication No. 2003-234396 Summary of the Invention

[0008] However, in the prior art, including Patent Document 1 and Patent Document 2, the adsorption response time from the start of vacuum suction to the effective vacuum suction of the adhesive sheet, and the vacuum breakage response time from the end of vacuum suction to the breaking of the vacuum state, are relatively long. This presents a problem where it is difficult to shorten the pick-up time, which involves sequentially picking up chips while moving the adhesive sheet relative to the chip lifting device. In other words, in the device of Patent Document 1, the vacuum pump suction volume is large, resulting in a longer adsorption response time. Furthermore, in the device of Patent Document 2, the vacuum pump suction path is complex, leading to higher pipeline resistance, which in turn increases both the adsorption response time and the vacuum breakage response time.

[0009] Therefore, the object of the present invention is to provide a chip pickup device that can shorten the adsorption response time and the vacuum disruption response time.

[0010] The chip pickup device of the present invention comprises: a pickup head having a holding member for holding a chip supplied to an adhesive sheet; and a chip lifting device that lifts the chip from the lower surface of the adhesive sheet to assist the holding member in holding the chip. The chip lifting device includes: a cylindrical body having an internal space; a cover fitted to the upper part of the cylindrical body and having an upper surface abutting against the adhesive sheet, a through hole opening in the upper surface, and an airflow path for introducing negative pressure to the upper surface; a pin protruding from the through hole to lift the chip; a lifting body holding the pin and moving up and down within the internal space; a flow path switching unit that introduces any one of negative pressure, atmospheric pressure, and positive pressure into the airflow path; and a piping connecting the flow path switching unit to the airflow path without passing through the internal space.

[0011] According to the present invention, the adsorption response time and the vacuum disruption response time can be shortened. Attached Figure Description

[0012] Figure 1 This is a structural illustration of the main parts of a chip pickup device according to an embodiment of the present invention.

[0013] Figure 2 This is a block diagram illustrating the structure of a chip pickup device according to an embodiment of the present invention.

[0014] Figure 3 This is a perspective view showing the state in which the chip lifting device included in a chip pickup apparatus according to an embodiment of the present invention is lowered.

[0015] Figure 4 This is a perspective view showing the state in which the chip lifting device included in a chip pickup apparatus according to an embodiment of the present invention is raised.

[0016] Figure 5 This is a top view of a chip picking device included in a chip picking apparatus according to an embodiment of the present invention.

[0017] Figure 6 This is a partial cross-sectional view of a chip picking device included in a chip picking apparatus according to an embodiment of the present invention.

[0018] Figure 7 This is an exploded view of a chip picking device included in a chip picking apparatus according to an embodiment of the present invention.

[0019] Figure 8 This is a perspective view of the sealing element of the chip lifting device included in a chip pickup device according to an embodiment of the present invention.

[0020] Figure 9(a) is a partial cross-sectional view showing the state in which the pin is in the standby position in the chip pick-up device included in a chip pickup apparatus according to an embodiment of the present invention. Figure 9 (b) is a partial cross-sectional view showing the pin in its highest position.

[0021] Figure 10 This is an explanatory diagram showing the state in which the holding member and the chip lifting device in a chip pickup apparatus according to an embodiment of the present invention are moved to the position of the chip to be picked up.

[0022] Figure 11 This is an explanatory diagram showing the state in which the holding member abuts against the chip in a chip pickup device according to one embodiment of the present invention.

[0023] Figure 12 This is an explanatory diagram showing the state in which a pin lifts up the chip in a chip pickup device according to one embodiment of the present invention.

[0024] Figure 13 This is an explanatory diagram showing the state in which a holding member holds a chip in a chip pickup device according to an embodiment of the present invention.

[0025] Figure 14 This is an explanatory diagram showing the state in which the next holding member and the chip lifting device move to the position of the next chip to be picked up in a chip picking device according to an embodiment of the present invention.

[0026] Figure 15 This is an explanatory diagram showing the state in which a holding member abuts against a chip in a chip pickup device according to one embodiment of the present invention.

[0027] Figure 16 This is a partial cross-sectional view illustrating the state of interference between the protrusion of the chip lifting device and the chip expansion ring in a chip pickup apparatus according to one embodiment of the present invention.

[0028] Figure 17 This is a top view illustrating the state of interference between the protrusion of the chip lifting device and the chip expansion ring in a chip pickup apparatus according to one embodiment of the present invention.

[0029] Figure 18 This is an explanatory diagram of a chip pickup method of a chip pickup device according to an embodiment of the present invention.

[0030] Figure 19 This is an explanatory diagram of a chip pickup method of a chip pickup device according to an embodiment of the present invention.

[0031] Figure 20 (a) is a partial cross-sectional view showing the state in which the pin is in a standby position in a second embodiment of the chip pick-up device included in a chip pickup apparatus according to an embodiment of the present invention. Figure 20 (b) is a partial cross-sectional view showing the pin in its highest position.

[0032] Figure 21 This is a partial cross-sectional view of a third embodiment of the chip picking device included in a chip picking apparatus according to an embodiment of the present invention.

[0033] Figure 22 This is an exploded view of a third embodiment of the chip picking device included in a chip picking apparatus according to an embodiment of the present invention. Detailed Implementation

[0034] The following detailed description uses the accompanying drawings to illustrate one embodiment of the present invention. The structures, shapes, etc., described below are illustrative examples and can be appropriately modified according to the specifications of the chip pickup device, pickup head, and chip lifting device. Hereinafter, corresponding elements will be labeled with the same reference numerals throughout the drawings, and repeated descriptions will be omitted.

[0035] First, refer to Figures 1 to 3 , Figure 10 , Figure 16 The structure of the main parts of the chip pickup device 1 will be described. Figure 1 , Figure 2 In this chip pickup device 1, a Y-stage 3 is disposed on the base 2, which moves the X-stage 4 along the Y-axis. The X-stage 4 moves the chip lifting device 20 (described later) along the X-axis. The Y-stage 4 and the X-stage 3 are controlled by the control unit 5 of the chip pickup device 1.

[0036] exist Figure 1 , Figure 16 In this configuration, a cylindrical wafer expansion ring 6 is positioned above the X-stage 4 and fixed relative to the base 2. The wafer expansion ring 6 has an opening at its upper part and an annular edge end 6a is formed at its upper part. The chip lifting device 20 moves along the X-axis and Y-axis directions inside the wafer expansion ring 6. A ring frame carrier holding part 7 is positioned above the wafer expansion ring 6. The ring frame carrier holding part 7 functions to hold the ring frame carrier 8.

[0037] The ring frame carrier 8 has an annular ring frame 9 and a stretchable adhesive sheet 10 laid on the ring frame 9. Multiple chips 11 formed by cutting the wafer into individual pieces are held on the upper surface (adhesive surface) of the adhesive sheet 10.

[0038] exist Figure 1 , Figure 2 , Figure 10In this assembly, a pickup head 12 is positioned above the ring frame holder 7. The pickup head 12 includes multiple (four in this case) shafts 14, each having a holder 13 at its lower end for holding the chip 11; and a shaft lifting mechanism (not shown) for raising and lowering the shafts 14. Additionally, the chip pickup device 1 includes a pickup head moving mechanism 15 for moving the pickup head 12 in the horizontal direction (X-axis direction, Y-axis direction).

[0039] The shaft lifting mechanism and the pickup head moving mechanism 15 are controlled by the control unit 5. The control unit 5 controls the shaft lifting mechanism and the pickup head moving mechanism 15 to move the pickup head 12 in the horizontal direction, causing the shaft 14 to descend so that the holding member 13 abuts against the chip 11 held on the adhesive sheet 10, so that the holding member 13 holds the chip 11, and the shaft 14 rises to pick up the chip 11 from the adhesive sheet 10. In addition, the control unit 5 controls the shaft lifting mechanism and the pickup head moving mechanism 15 to mount (transfer) the chip 11 held by the holding member 13 onto a tray, substrate, repeater, etc. (not shown).

[0040] exist Figure 2 , Figure 16 In this process, the chip 11 on the adhesive sheet 10 is picked up while the adhesive sheet 10 is expanded using the sheet expansion ring 6 in the ring frame carrier holding part 7. Here, the sheet expansion process of the adhesive sheet 10 based on the ring frame carrier holding part 7 will be described. The ring frame carrier holding part 7 includes a ring frame pressing member 17 that is raised and lowered by a ring frame pressing member lifting mechanism 16 controlled by the control unit 5.

[0041] exist Figure 16 In the sheet expansion process of the adhesive sheet 10, firstly, the ring frame carrier 8 is placed on the sheet expansion ring 6 such that it abuts against the edge end 6a of the sheet expansion ring 6. In this state, viewed from above, the adhesive sheet 10 between the plurality of chips 11 on the adhesive sheet 10 and the ring frame 9 is located at the edge end 6a of the sheet expansion ring 6. Next, the control unit 5 controls the ring frame pressing member lifting mechanism 16 to lower the ring frame pressing member 17.

[0042] During the descent of the ring frame pressing member 17, the ring frame pressing member 17 abuts against the ring frame 9 from above. As the ring frame pressing member 17 descends further, the ring frame carrier 8 and the ring frame pressing member 17 become one and descend together, and the ring frame 9 descends to a position lower than the height of the edge end 6a of the sheet expansion ring 6. Figure 16 (In this state). In this state, the adhesive sheet 10 is pulled outwards and expands.

[0043] Next, refer to Figures 2 to 9The structure of the chip lifting device 20 will be described. The chip lifting device 20 has the function of lifting chips 11, which are supplied to the adhesive sheet 10 in a plurality of arrangements from the lower surface of the adhesive sheet 10, and the auxiliary holding member 13 holding the chips 11 (see reference). Figure 12 ). Figure 6 yes Figure 5 A portion of section AA in the diagram.

[0044] exist Figure 3 , Figure 6 , Figure 7 In this embodiment, the chip lifting device 20 includes: a cylindrical body 21 having an internal space 21a; and a cover 22 fitted onto the upper part 21b of the cylindrical body 21. The cover 22 has an upper surface 22a that abuts against the adhesive sheet 10 and a plurality of (in this case, five) through holes 22b opening on the upper surface 22a. On the upper part 21b of the cylindrical body 21, a plurality of through holes 21c are formed at positions corresponding to the through holes 22b of the cover 22 when the cover 22 is fitted onto the cylindrical body 21.

[0045] exist Figures 6 to 8 In this design, a recess, namely a sealing member assembly portion 21e, is formed on the upper surface 21d of the cylindrical body 21, where a disc-shaped sealing member 23 is disposed. The sealing member 23 is formed of a material with a low coefficient of friction, such as fluororesin, and when assembled in the sealing member assembly portion 21e of the cylindrical body 21, a plurality of through holes 23a are formed at positions corresponding to the through holes 21c.

[0046] After assembling the seal 23 into the seal assembly portion 21e of the cylindrical body 21, the cover 22 is assembled from above into the upper portion 21b of the cylindrical body 21. Thus, the seal 23 is positioned between the cylindrical body 21 and the cover 22. With the seal 23 positioned between the cylindrical body 21 and the cover 22, the through hole 21c of the cylindrical body 21, the through hole 23a of the seal 23, and the through hole 22b of the cover 22 are aligned.

[0047] exist Figure 5 , Figure 6 In this case, the cover 22 is configured to include: a contact portion 24 having an upper surface 22a that abuts against the adhesive sheet 10; and a protrusion 25 that protrudes horizontally from the contact portion 24. The contact portion 24 is cylindrical and has an upper surface 22a at its upper part, and a through hole 22b of the cover 22 is formed in the contact portion 24. In addition, a sealing member 23 is disposed below the contact portion 24. A plurality of concentric annular grooves 22c and a plurality of connecting grooves 22d that are radially transversely cut through the plurality of annular grooves 22c are formed on the upper surface 22a of the cover 22 (contact portion 24).

[0048] An airflow path 22e is formed inside the cover 22, extending from the protrusion 25 to the through-feed portion 24 and radially transversely cutting below the plurality of annular grooves 22c. In the abutment portion 24, longitudinal holes 22f are formed at multiple locations where the plurality of annular grooves 22c intersect with the airflow path 22e, connecting the annular grooves 22c to the airflow path 22e. The airflow path 22e extends downward from the protrusion 25 and opens at a flow path opening 22g on the lower surface 25a of the protrusion 25. One end of the piping 26 is connected upward to the flow path opening 22g. Negative pressure, atmospheric pressure, and positive pressure are supplied to the piping 26 as described later.

[0049] exist Figure 5 , Figure 6 When negative pressure is supplied from piping 26 to airflow path 22e while the adhesive sheet 10 is abutting against the upper surface 22a of cover 22, airflow path 22e, longitudinal hole 22f, a portion of annular groove 22c, connecting groove 22d, and other annular grooves 22c are connected, and adhesive sheet 10 is adsorbed onto the upper surface 22a of cover 22. Furthermore, when atmospheric pressure or positive pressure is supplied to piping 26 while adhesive sheet 10 is adsorbed onto the upper surface 22a of cover 22, the vacuum is broken, and adhesive sheet 10 separates from the upper surface 22a of cover 22.

[0050] Thus, the cover 22 has: an upper surface 22a, which is fitted to the upper part 21b of the cylindrical body 21 and abuts against the adhesive sheet 10; a through hole 22b, which opens on the upper surface 22a; and an air flow path 22e, which introduces negative pressure to the upper surface 22a. Furthermore, the cover 22 has a protrusion 25 formed by a portion of it protruding horizontally, and the air flow path 22e connects from the flow path opening 22g on the lower surface 25a of the protrusion 25 to longitudinal holes 22f formed at multiple locations on the upper surface 22a. One end of the pipe 26 is connected upwards to the flow path opening 22g.

[0051] exist Figure 6 In this chip lifting device 20, a central pin 27 is provided, which sequentially passes through the through hole 21c of the cylindrical body 21, the through hole 23a of the sealing member 23, and the through hole 22b of the cover 22, and protrudes from the through hole 22b of the cover 22 upwards to lift the chip 11 on the adhesive sheet 10, as well as multiple (in this case, four) corner pins 28. It should be noted that the chip lifting device 20 does not necessarily need to have multiple pins, including the central pin 27 and the corner pins 28; it can also have a structure with only one central pin 27. That is, the chip lifting device 20 only needs to have at least one pin (central pin 27) protruding from the through hole 22b to lift the chip 11.

[0052] A center pin 27 is fitted to the upper part of a center pin holder 29 disposed in the internal space 21a of the cylindrical body 21. When the center pin holder 29 rises, the center pin 27 protrudes upward from the through hole 22b formed in the center of the abutment portion 24 toward the top of the cover 22. Four corner pins 28 are fitted to the upper part of a corner pin holder 30 disposed in the internal space 21a. When the corner pin holder 30 rises, the four corner pins 28 protrude upward from the four through holes 22b formed around the center of the abutment portion 24 toward the top of the cover 22.

[0053] exist Figure 2 , Figure 6 In the middle, the center pin retainer 29 and the corner pin retainer 30 are raised and lowered by means of the pin drive mechanism 31 controlled by the control unit 5. That is, the center pin retainer 29 and the corner pin retainer 30 hold the pins (center pin 27, corner pin 28) at the upper part, forming a lifting body 32 in the internal space 21a that is raised and lowered by means of the pin drive mechanism 31.

[0054] exist Figure 9 In addition to raising and lowering the center pin retainer 29 and the corner pin retainer 30 as a whole to make the pin tip 27a of the center pin 27 and the pin tip 28a of the corner pin 28 the same height, the pin drive mechanism 31 can also raise and lower the center pin retainer 29 and the corner pin retainer 30 independently to change the height of the pin tip 27a of the center pin 27 and the pin tip 28a of the corner pin 28. For example, when raising the pins (center pin 27, corner pin 28), the center pin 27 can also be raised or lowered to a position higher than the corner pin 28.

[0055] Next, refer to Figure 9 The relationship between the shapes of the center pin 27 and the corner pin 28 and the cylindrical body 21, the cover 22, and the seal 23 is explained. Figure 9 (a) shows the state in which the lifting body 32 is lowered by means of the pin drive mechanism 31, and the pin tip 27a of the center pin 27 and the pin tip 28a of the corner pin 28 are in a standby position Hw that is lower than the upper surface 22a of the cover 22. That is, in the standby position Hw, the center pin 27 and the corner pin 28 do not protrude upward from the upper surface 22a of the cover 22.

[0056] Figure 9 (b) shows the state where the lifting body 32 is raised by the pin drive mechanism 31, with the pin tip 27a of the center pin 27 and the pin tip 28a of the corner pin 28 at the highest reached position Hh. In this state, the center pin 27 and the corner pin 28 protrude upward from the upper surface 22a of the cover 22. The pin tips 27a and 28a (the front ends 27c and 28c) of the center pin 27 and the corner pin 28 (pins) rise from the standby position Hw, which is lower than the upper surface 22a of the cover 22, and lift the chip 11 (see reference). Figure 12 ).

[0057] exist Figure 9 of (a) Figure 9 In (b), the center pin 27 has a shaft portion 27b extending in the vertical direction with a constant thickness and a front end portion 27c that tapers towards the front end. Similarly, the corner pin 28 has a shaft portion 28b extending in the vertical direction with a constant thickness and a front end portion 28c that tapers towards the front end.

[0058] The inner diameters of the through hole 21c of the cylindrical body 21 and the through hole 22b of the cover 22 are set to be larger than the outer diameters of the shaft portion 27b of the center pin 27 and the shaft portion 28b of the corner pin 28, without interfering with the lifting and lowering movements of the center pin 27 and the corner pin 28. On the other hand, the inner diameter of the through hole 23a of the seal 23 is set such that the seal 23 is in surface contact with the shaft portion 27b of the center pin 27 and the shaft portion 28b of the corner pin 28.

[0059] exist Figure 9 In (a), the height dimension L1 of the through hole 22b of the cover 22 is larger than the height dimension L2 of the front end portion 27c of the center pin 27 and the front end portion 28c of the corner pin 28 (L1 > L2). Furthermore, when the center pin 27 and the corner pin 28 (pins) are in the standby position Hw, the front ends 27c and 28c are entirely contained within the through hole 22b of the cover 22. That is, even when the center pin 27 and the corner pin 28 are lowered and in the standby position Hw, the seal 23 is in contact with the surfaces of the shaft portions 27b and 28b of the center pin 27 and the corner pin 28.

[0060] Thus, during the movement of the center pin 27 and the corner pin 28 between the standby position Hw and the highest reached position Hh, the seal 23 contacts the surfaces of the shaft portions 27b and 28b of the center pin 27 and the corner pin 28. Therefore, when a negative pressure is supplied to the airflow path 22e and the adhesive sheet 10 is adhered to the upper surface 22a of the cover 22, airtightness is ensured so that air does not flow in or out from the through hole 22b of the cover 22 (see reference). Figure 11 , Figure 12 That is, the seal 23 prevents the flow of air through the through hole 22b of the cover 22 by contacting the surface of the pins (center pin 27, corner pin 28).

[0061] exist Figure 3In this configuration, a pin drive mechanism 31, which allows the lifting body 32 (containing pins 27 and 28 at the top) to move up and down within the internal space 21a of the cylindrical body 21, is disposed inside the pin drive unit 33. The cylindrical body 21 is disposed at the upper part of the pin drive unit 33. An L-shaped base 34 is fixed to the upper surface of the X-stage 4. A lifting guide 35 extending in the vertical direction (Z-axis direction) is disposed on the vertically extending surface of the base 34. A sliding member 36 that moves along the lifting guide 35 is disposed on the side of the pin drive unit 33. Thus, the pin drive unit 33 can move up and down along the lifting guide 35.

[0062] A lifting mechanism 37 for raising and lowering the pin drive unit 33 is disposed on a horizontally extending surface of the base 34. The lifting mechanism 37 is controlled by a control unit 5. By controlling the lifting mechanism 37 by the control unit 5, the pin drive unit 33 moves up and down along the lifting guide 35. A flow path switching unit 38 is disposed on the side of the pin drive unit 33. The flow path switching unit 38 has a negative pressure connection port 40 connected to a vacuum source 39 supplying negative pressure and a positive pressure connection port 42 connected to a compressed air source 41 supplying positive pressure. In addition, atmospheric pressure is introduced from the silencer 43 provided in the flow path switching unit 38.

[0063] exist Figure 2 , Figure 3 In this design, the flow path switching unit 38 includes a first valve 45 and a second valve 46 that switchably outputs negative pressure supplied from the negative pressure connection port 40, positive pressure supplied from the positive pressure connection port 42, and atmospheric pressure supplied from the silencer 43 to the output port 44. The first valve 45 and the second valve 46 are controlled by the control unit 5. The first valve 45 and the second valve 46 are both dual-input single-output valves and are connected in series. The control unit 5 outputs any one of negative pressure, atmospheric pressure, or positive pressure from the output port 44 by changing the combination of the on / off states of the first valve 45 and the second valve 46. It should be noted that, in addition to having a dual-input single-output structure with the first valve 45 and the second valve 46, the flow path switching unit 38 can also be composed of a three-input single-output valve.

[0064] The other end of the pipe 26 is connected to the output port 44 of the flow path switching unit 38. One end of the pipe 26 is connected to the flow path opening 22g on the lower surface 25a of the protrusion 25 of the cover 22 mounted on the upper part 21b of the cylindrical body 21. In this way, the pipe 26 connects the flow path switching unit 38 and the air flow path 22e without passing through the internal space 21a of the cylindrical body 21. That is, the pipe 26 is separate from the cylindrical body 21. Furthermore, any one of negative pressure, atmospheric pressure, or positive pressure is introduced from the flow path switching unit 38 to the air flow path 22e of the cover 22 via the pipe 26.

[0065] For the piping 26, the piping resistance can be reduced compared to the case where it passes through the internal space 21a of the cylindrical body 21. Furthermore, since the distance between the flow path switching section 38 and the air flow path 22e of the cover 22 is shorter, the piping 26 is shorter, improving responsiveness compared to the case where it passes through the internal space 21a of the cylindrical body 21. This shortens the adsorption response time required from the supply of negative pressure from the flow path switching section 38 until the adhesive sheet 10 against the upper surface 22a of the cover 22 is adsorbed. Additionally, it also shortens the vacuum breaking response time required from the supply of atmospheric pressure or positive pressure from the flow path switching section 38 until the vacuum between the upper surface 22a of the cover 22 and the adhesive sheet 10 is broken.

[0066] exist Figure 3 , Figure 4 In the chip lifting device 20, the pin drive unit 33, the cylindrical body 21 arranged on the upper part of the pin drive unit 33, the seal 23, the cover 22 assembled on the upper part 21b of the cylindrical body 21, the pin (center pin 27, corner pin 28), the lifting body 32, the flow path switching unit 38, and the piping 26 are integrated and lifted by means of the lifting mechanism 37. Figure 3 This shows the state in which the chip lifting device 20 has been lowered by means of the lifting mechanism 37. Figure 4 This shows the state in which the chip lifting device 20 has been raised by means of the lifting mechanism 37.

[0067] When the lifting mechanism 37 raises the chip lifting device 20, the upper surface 22a of the cover 22 abuts against the adhesive sheet 10 (see, for example, reference). Figure 10 When the lifting mechanism 37 lowers the chip lifting device 20, the upper surface 22a of the cover 22 separates from the adhesive sheet 10. Thus, the chip pickup device 1 has a lifting mechanism 37 that raises and lowers the chip lifting device 20 to separate or abut the upper surface 22a of the cover 22 from the adhesive sheet 10, and the flow path switching unit 38 is configured to rise and fall together with the chip lifting device 20 by means of the lifting mechanism 37.

[0068] Next, refer to Figures 10 to 15 The chip pickup method (pickup process) based on the chip pickup device 11 will be described. The chip pickup process of the chip 11 is performed after the wafer expansion process in which the adhesive sheet 10 is brought into contact with the edge end 6a of the wafer expansion ring 6 and expanded (see reference). Figure 16 ).

[0069] exist Figure 10 In the picking process, the control unit 5 controls the Y stage 3 and the X stage 4 to move the chip lifting device 20 (arrow a1) so that the position of the center pin 27 of the chip lifting device 20 is below the chip 11 (hereinafter referred to as "first chip 11A") to be picked up on the expanded adhesive sheet 10.

[0070] Next, the control unit 5 controls the lifting mechanism 37 to raise the chip lifting device 20 so that the upper surface 22a of the cover 22 abuts against the adhesive sheet 10, and further rises to a predetermined height (arrow a2) (cover position moving process). Thus, the adhesive sheet 10 is lifted upwards from a horizontal position by the cover 22. At this time, atmospheric pressure is supplied from the flow path switching unit 38 to the air flow path 22e (atmosphere opening process). That is, the upper surface 22a of the cover 22 is not adhered to the adhesive sheet 10. It should be noted that in the cover position moving process, it is also possible that, with the chip lifting device 20 raised to the predetermined height, the chip lifting device 20 is moved horizontally to move the position of the center pin 27 below the first chip 11A.

[0071] exist Figure 10 Next, the control unit 5 controls the pickup head moving mechanism 15 to move the pickup head 12 so that the position of the holding member 13 (hereinafter referred to as "first holding member 13A") of the first chip 11A is above the first chip 11A (arrow b1) (pickup head moving process). In the pickup head moving process, the control unit 5 controls the pickup head moving mechanism 15 based on the position of the first chip 11A identified by the image recognition device equipped with a camera (not shown).

[0072] exist Figure 11 Next, the control unit 5 controls the first valve 45 and the second valve 46 to supply negative pressure from the flow path switching unit 38 to the air flow path 22e (arrow c1) (sheet adsorption process). As a result, the upper surface 22a of the cover 22 adsorbs the adhesive sheet 10. Then, the control unit 5 controls the pickup head 12 to lower the first holding member 13A to abut against the first chip 11A (arrow d1) (holding member lowering process). Next, the control unit 5 controls the pickup head 12 to hold (adsorb) the first chip 11A with the first holding member 13A (chip holding process).

[0073] exist Figure 12 Next, the control unit 5 controls the pin drive mechanism 31 and the pickup head 12, so that the action of raising the lifting body 32 to lift the pins (center pin 27, corner pin 28) located in the standby position Hw from the upper surface 22a of the cover 22 (arrow e1) and the action of raising the first holding member 13A holding the first chip 11A (arrow f1) are performed simultaneously (chip peeling process). As a result, the first chip 11A is peeled off from the adhesive sheet 10.

[0074] The chip removal process needs to begin when the adhesive sheet 10 can be adsorbed with a specified force from the upper surface 22a of the cover 22. In this embodiment, the chip pickup device 1 connects the flow path switching unit 38 to the air flow path 22e of the cover 22 via piping 26 in a manner that does not pass through the internal space 21a of the cylindrical body 21, thus resulting in a shorter adsorption response time. Therefore, the waiting time from the start of the chip adsorption process to the start of the chip removal process can be shortened, thereby improving productivity.

[0075] It should be noted that, in Figure 12 In the example, the pins (center pin 27, corner pin 28) break through the adhesive sheet 10 to lift the first chip 11A, but the pins do not necessarily need to break through the adhesive sheet 10. For example, the shapes of the pin tip 27a of the center pin 27 and the pin tip 28a of the corner pin 28 can be set to flat, rounded, blunt shapes to lift the first chip 11A without breaking through the adhesive sheet 10. By ensuring that the pins do not break through the adhesive sheet 10, damage to the first chip 11A caused by the pins can be reduced.

[0076] exist Figure 13 Next, the control unit 5 controls the pickup head 12 to raise the first holding member 13A holding the first chip 11A to its original height (arrow f2) (holding member raising process). In addition, the control unit 5 controls the pin drive mechanism 31 to lower the lifting body 32 and lower the pins (center pin 27, corner pin 28) to the standby position Hw (arrow g1) (pin lowering process).

[0077] Next, the control unit 5 controls the first valve 45 and the second valve 46 to supply positive pressure (arrow h1) from the flow path switching unit 38 to the air flow path 22e (vacuum breaking process). As a result, the vacuum between the upper surface 22a of the cover 22 and the adhesive sheet 10 is broken, and the adhesion of the upper surface 22a of the cover 22 to the adhesive sheet 10 ends. Next, the control unit 5 controls the first valve 45 and the second valve 46 to supply atmospheric pressure from the flow path switching unit 38 to the air flow path 22e (atmosphere opening process). Thus, the pickup process of picking up the first chip 11A from the cover position moving process to the atmosphere opening process is completed.

[0078] exist Figure 14 Next, the next pickup process begins, in which the second retainer 13B picks up the second chip 11B. First, a cover position movement process is performed, in which the chip lifting device 20 moves so that the position of the center pin 27 is below the second chip 11B on the expanded adhesive sheet 10 (arrow i1). Then (or simultaneously), a pickup head movement process is performed, in which the pickup head 12 moves so that the position of the second retainer 13B is above the second chip 11B (arrow j1).

[0079] The subsequent cover position movement process requires the pin tips 27a and 28a of the pins (center pin 27 and corner pin 28) to descend to a position lower than the upper surface 22a of the cover 22, and the vacuum between the upper surface 22a of the cover 22 and the adhesive sheet 10 to be broken. In this embodiment, the chip pickup device 1 uses piping 26 to connect the flow path switching unit 38 to the air flow path 22e of the cover 22 without passing through the internal space 21a of the cylindrical body 21, thus resulting in a shorter vacuum break response time. Therefore, the waiting time from the start of the vacuum break process to the start of the subsequent cover position movement process can be shortened, thereby increasing productivity.

[0080] exist Figure 15 Next, a chip adsorption process is performed, where negative pressure (arrow k1) is supplied from the flow path switching unit 38 to the air flow path 22e, and the adhesive sheet 10 is adsorbed onto the upper surface 22a of the cover 22. Next, a retainer descent process is performed, where the second retainer 13B descends and abuts against the second chip 11B (arrow l1). Thereafter, similar to the previous pick-up process, a chip holding process, a chip peeling process, a retainer rising process, a pin descent process, a vacuum breaking process, and an atmospheric opening process are performed.

[0081] The chip pickup device 1 of this embodiment has a short adsorption response time and a short vacuum destruction response time, which can shorten the waiting time from the chip adsorption process to the chip peeling process and from the vacuum destruction process to the cap position movement process, thus achieving a high productivity.

[0082] When the pick-up head 12 holds the chip 11 with all of its holding members 13, the control unit 5 controls the pick-up head moving mechanism 15 and the pick-up head 12 to move the pick-up head 12 to a target position outside the figure to perform a prescribed operation (prescribed operation procedure). The prescribed operations based on the pick-up head 12 include mounting or bonding the chip 11 to a substrate, mounting (transferring) the chip 11 to a tray, repeater, etc., and transferring it to other operation heads.

[0083] Next, refer to Figures 16 to 19 This describes a method for addressing the problem caused by the protrusion 25 of the cover 22 provided by the chip lifting device 20 in the chip picking method (picking process) of the chip 11 based on the chip picking device 1.

[0084] exist Figure 16 , Figure 17 In this process, the chip pickup device 1 moves the chip lifting device 20 along the direction in which the chips 11 are arranged on the adhesive sheet 10 while the holding member 13 of the pickup head 12 picks up (holds) the chips 11. At this time, there is a problem in picking up the chips 11 located on the outer periphery among the multiple chips 11 arranged on the adhesive sheet 10.

[0085] That is, for the chip 11 located on the outer periphery of the protrusion 25, which is formed by a portion of the cover 22 protruding horizontally, Figure 16 Chip 11 on the left end of the middle Figure 17 The chip 11 at the upper end of the chip can be picked up because the protrusion 25 does not interfere with the chip expansion ring 6. On the other hand, for the chip 11 located on the outer periphery of the protrusion 25 ( Figure 16 Chip 11 on the right end of the middle Figure 17 The lower chip 11 in the adhesive sheet 10 cannot be picked up because the protrusion 25 interferes with the sheet expansion ring 6. That is, the outer periphery of the protrusion 25 side of the plurality of chips 11 arranged on the adhesive sheet 10 has a dead zone Dz that the cover 22 cannot access and therefore cannot pick up. Figure 17 (The part marked with diagonal grid lines is the shaded area).

[0086] In the chip 11 picking method (picking process) of this embodiment, in order to pick up all the chips 11 arranged on the adhesive sheet 10, including the chips 11 with dead zone Dz, the picking operation is performed as follows.

[0087] First, while moving the chip lifting device 20 and the pickup head 12, the chips 11 arranged on the side opposite to the dead zone Dz are picked up sequentially. Figure 18 Next, rotate the sheet expansion ring 6 180 degrees. Figure 19 The arrow m) moves the portion that was previously a dead zone Dz to the side opposite to the protrusion 25 (chip rotation process). Then, the remaining chips 11 are picked up while the chip lifting device 20 and the pick-up head 12 are moved. Thus, all the chips 11 arranged on the adhesive sheet 10 can be picked up using the pick-up head 12.

[0088] Next, refer to Figure 20 A second embodiment of the chip ejector device (hereinafter referred to as "chip ejector device 20A") will be described. The shapes of the center pin 27A and the corner pin 28A of the chip ejector device 20A are different from those of the chip ejector device 20. Hereinafter, the same reference numerals will be used to mark the same parts as in the chip ejector device 20, and detailed descriptions will be omitted.

[0089] exist Figure 20 In (a), the height dimension L3 of the front end portion 27Ac of the center pin 27A and the front end portion 28Ac of the corner pin 28A is larger than the height dimension L1 of the through hole 22b of the cover 22 (L3 > L1). Therefore, when the center pin 27A and the corner pin 28A (pins) are in the standby position Hw, a portion of the front ends 27Ac and 28Ac are located in the through hole 23a of the seal 23. That is, the seal 23 does not contact the surfaces of the center pin 27A and the corner pin 28A, but the gap is extremely small and airtightness is ensured.

[0090] exist Figure 20 In (b), with the pin tip 27Aa of the center pin 27A and the pin tip 28Aa of the corner pin 28A raised to their highest positions Hh, the seal 23 contacts the surfaces of the shaft portions 27Ab of the center pin 27A and 28Ab of the corner pin 28A. Thus, even if the seal 23 does not contact the surfaces of the center pin 27A and the corner pin 28A, airtightness is ensured, and the standby position Hw can be set such that a portion of the front end 27Ac of the center pin 27A and a portion of the front end 28Ac of the corner pin 28A are within the through hole 23a of the seal 23.

[0091] Next, refer to Figure 21 , Figure 22 A third embodiment of the chip ejector device (hereinafter referred to as "chip ejector device 20B") will be described. The chip ejector device 20B differs from the chip ejector device 20 in that the seal 23B is mounted on the back of the cover 22B. Hereinafter, the same reference numerals will be used for the parts identical to those in the chip ejector device 20, and detailed descriptions will be omitted.

[0092] exist Figure 21 , Figure 22 In this embodiment, the cylindrical body 21B, which has an internal space 21Ba, differs from the cylindrical body 21 in that it has an opening at the top. The outer diameter of the seal 23B is smaller than the inner diameter of the opening at the top of the cylindrical body 21B. In the seal 23B, in addition to multiple through holes 23Ba, a vertically penetrating mounting hole 23Bb is also formed. Below the seal 23B, an assembly 47, made of a material such as metal, is disposed with a shape approximately the same as that of the seal 23B. In the assembly 47, multiple through holes 47a are formed at positions corresponding to the through holes 23Ba of the seal 23B, and mounting holes 47b are formed at positions corresponding to the mounting holes 23Bb.

[0093] A screw hole 22Bh is formed on the back side of the abutment portion 24B of the cover 22B, and the screw hole 22Bh has an internal thread. The seal 23B and the fitting 47 are mounted overlappingly on the back side of the abutment portion 24B of the cover 22B, and are assembled on the back side of the cover 22B by fastening a screw 48 with an external thread through the mounting hole 47b and the mounting hole 23Bb to the screw hole 22Bh.

[0094] exist Figure 21 , Figure 22In the middle, the cover 22B is assembled on the upper part of the cylindrical body 21B and has an upper surface 22Ba that abuts against the adhesive sheet 10, a through hole 22Bb opening in the upper surface 22Ba, and an air flow path 22Be for introducing negative pressure to the upper surface 22Ba. Multiple concentric annular grooves 22Bc and multiple connecting grooves 22Bd that radially transversely cut the multiple annular grooves 22Bc are formed on the upper surface 22Ba of the cover 22B (abutment portion 24B). The cover 22B has a protrusion 25B, a portion of which protrudes horizontally. The air flow path 22Be connects from the flow path opening 22Bg on the lower surface 25Ba of the protrusion 25B to longitudinal holes 22Bf formed at multiple locations on the upper surface 22Ba. One end of the pipe 26 is connected upwards to the flow path opening 22Bg.

[0095] The center pin 27 and the corner pin 28 are assembled in such a way that the through hole 47a of the fitting 47, the through hole 23Ba of the seal 23B, and the through hole 22Bb of the cover 22B are sequentially passed through from below.

[0096] It should be noted that the above description uses the example of pre-formed through holes 23a and 23Ba in seals 23 and 23B as an example, but seals 23 and 23B are not limited to this. For example, seals 23 and 23B may not have pre-formed through holes 23a and 23Ba in seals 23 and 23B, and when assembling center pin 27 and corner pin 28, seals 23 and 23B may be punctured by the pin tip 27a of center pin 27 and the pin tip 28a of corner pin 28.

[0097] Alternatively, the seals 23 and 23B can have inner diameters of pre-formed through holes 23a and 23Ba smaller than the shaft portion 27b of the center pin 27 and the shaft portion 28b of the corner pin 28. During assembly of the center pin 27 and the corner pin 28, the through holes 23a and 23Ba are compressed and expanded. This improves the tightness of the seals 23 and 23B with the center pin 27 and the corner pin 28.

[0098] As described above, the chip pickup device 1 of this embodiment includes: a pickup head 12 having a holding member 13 for holding chips 11 supplied to the adhesive sheet 10 in a plurality of arranged states; and a chip lifting device 20 for lifting the chips 11 from the lower surface of the adhesive sheet 10 and assisting the holding member 13 in holding the chips 11.

[0099] Furthermore, the chip lifting device 20 includes: a cylindrical body 21 having an internal space 21a; a cover 22 fitted to the upper part 21b of the cylindrical body 21, having an upper surface 22a that abuts against the adhesive sheet 10, a through hole 22b opening in the upper surface 22a, and an air flow path 22e for introducing negative pressure to the upper surface 22a; at least one pin (center pin 27, corner pin 28) protruding from the through hole 22b to lift the chip 11; a lifting body 32 holding the pin at the upper part and moving up and down in the internal space 21a; a flow path switching part 38 introducing any one of negative pressure, atmospheric pressure, and positive pressure into the air flow path 22e; and a pipe 26 connecting the flow path switching part 38 and the air flow path 22e in a manner that does not pass through the internal space 21a.

[0100] This can shorten the adsorption response time and vacuum disruption response time.

[0101] Industrial applicability

[0102] The chip pickup device of the present invention has the effect of shortening the adsorption response time and vacuum destruction response time, and is useful in the field of removing chips from adhesive sheets and mounting them onto substrates.

[0103] Explanation of reference numerals in the attached figures

[0104] 1. Chip pickup device

[0105] 10 Adhesive Sheets

[0106] 11 chips

[0107] 11A First Chip (Chip)

[0108] 11B Second Chip (Chip)

[0109] 12 Pick up the head

[0110] 13 Retaining components

[0111] 13A First retainer (retainer)

[0112] 13B Second retainer (retainer)

[0113] 20, 20A, 20B Chip Lifting Device

[0114] 21, 21B cylindrical body

[0115] 21a, 21Ba internal space

[0116] 21e Sealing Assembly Section

[0117] 22, 22B Cover

[0118] 22a, 22Ba upper surface

[0119] 22b and 22Bb through holes

[0120] 22e, 22Be airflow path

[0121] 22f, 22Bf longitudinal holes

[0122] 22g, 22Bg flow path opening

[0123] 23 Seals

[0124] 25, 25B protrusions

[0125] 26 Piping

[0126] 27, 27A Center Sales (Sales)

[0127] Shafts 27b, 27Ab, 28b, and 28Ab

[0128] 27c, 27Ac, ​​28c, 28Ac front end

[0129] 28, 28A Angle Pins (Pin)

[0130] 32 Lifting Body

[0131] 37 Lifting Mechanism

[0132] 38 Flow path switching unit

[0133] Hw standby position

[0134] L1 Dimension in the height direction of the through hole

[0135] L2 is the dimension in the height direction of the front end.

Claims

1. A chip pickup device, comprising: A pickup head having a holding member for holding the chip supplied to the adhesive sheet; and A chip lifting device that lifts the chip from the lower surface of the adhesive sheet to assist the retaining member in holding the chip. The chip lifting device includes: A cylindrical body with an internal space; The cover is fitted to the upper part of the cylindrical body and has an upper surface that abuts against the adhesive sheet, a through hole that opens on the upper surface, and an air flow path that introduces negative pressure to the upper surface. A pin protrudes from the through hole and lifts the chip. A lifting body that holds the pin and moves up and down within the internal space; The flow path switching unit introduces any one of negative pressure, atmospheric pressure, or positive pressure into the air flow path; as well as Piping that connects the flow path switching unit to the air flow path without passing through the internal space.

2. The chip pickup device according to claim 1, wherein, The piping is separate from the cylindrical body.

3. The chip pickup device according to claim 1, wherein, The chip pickup device also includes a seal that prevents airflow through the through hole by contacting the surface of the pin.

4. The chip pickup device according to claim 3, wherein, The seal is disposed between the cylindrical body and the cover.

5. The chip pickup device according to claim 4, wherein, The cylindrical body also has a sealing assembly portion, which arranges the sealing element on the upper surface of the cylindrical body.

6. The chip pickup device according to claim 3, wherein, The seal is fitted onto the back of the cover.

7. The chip pickup device according to claim 3, wherein, The pin has a shaft portion that extends in the vertical direction with a constant thickness and a front end portion that tapers towards the front end of the pin. The seal is in contact with the surface of the shaft.

8. The chip pickup device according to claim 7, wherein, The tip of the pin rises from a standby position lower than the upper surface of the cover, thereby lifting the chip. The dimension of the through hole in the cover in the height direction is larger than the dimension of the front end in the height direction. When the front end of the pin is in the standby position, the entire front end is contained within the through hole.

9. The chip pickup device according to claim 1, wherein, The chip pickup device also includes a lifting mechanism that raises and lowers the chip lifting device to separate the cover from the adhesive sheet or to bring the cover into contact with the adhesive sheet. The flow path switching unit is configured to rise and fall together with the chip lifting device via the lifting mechanism.

10. The chip pickup device according to claim 1, wherein, The cover also has a protrusion that projects in a horizontal direction. The airflow path is connected to the airflow opening on the lower surface of the protrusion and to the plurality of longitudinal holes formed on the upper surface of the cover. One end of the piping is connected to the flow path opening.

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