Leveling assembly, adsorption carrying table comprising leveling assembly and silicon wafer laser processing rotary carrying table

Abstract

The invention belongs to the technical field of photovoltaic cell manufacturing equipment, and particularly relates to a leveling assembly, an adsorption carrying table comprising the leveling assembly and a silicon wafer laser processing rotary carrying table. The structure of the leveling assembly comprises an elastic screw joint piece unit which is arranged on a rotary carrying table arm in a screw joint mode and used for pressing an adsorption carrying table downwards, and a leveling bolt which is arranged on the rotary carrying table arm in a screw joint mode and used for supporting the adsorption carrying table. And the fastening block unit is arranged on the lower surface of the rotary carrying platform arm and is used for clamping the leveled leveling bolt. The leveling assembly at least has the beneficial effects that in the leveling assembly, the elastic screw joint piece unit has the double functions of fully installing the adsorption carrying table and providing the leveling space, then the leveling bolt is rotated firstly, then the fastening block unit clamps the leveling bolt after leveling is completed, and the leveling effect is achieved. Finally, the adsorption carrying platform has an outstanding function of active leveling before being used.

Description

Technical Field

[0001] This application belongs to the technical field of equipment for photovoltaic cell manufacturing, and particularly relates to a leveling component, and an adsorption stage and a silicon wafer laser processing rotary stage including the component. Background Technology

[0002] Silicon wafers are sheet-like objects made of high-purity monocrystalline or polycrystalline silicon. Their main function is to manufacture integrated circuits and semiconductor devices, and they are a core material in the electronics and photovoltaic industries.

[0003] The manufacturing process from silicon wafers to photovoltaic cells may, for example, mainly include the following steps in sequence: silicon wafer inspection, surface texturing, diffusion junction formation, dephosphosilicate glass and plasma etching, antireflective coating deposition, screen printing and sintering, and rapid sintering and sorting.

[0004] On the other hand, laser processing operations on silicon wafers mainly include: laser doping, laser delamination, and edge isolation. Generally, laser doping corresponds to the diffusion junction formation step mentioned above, laser delamination corresponds to the anti-reflective coating deposition step mentioned above, and edge isolation is located between diffusion junction formation and dephosphosilicate glass deposition.

[0005] Accordingly, the aforementioned laser processing operations require a rotating stage to move the silicon wafer at high speed. Commonly used rotating stages typically consist of a motor, a large stage, a small stage, and a vacuum adsorption system. The adsorption stage refers to the small stage; the silicon wafer is fixed to the adsorption stage, which is mounted on the large stage. Finally, the motor drives the large stage to rotate, enabling the silicon wafer to move effectively and rapidly between the loading / unloading side and the processing side in a rotary, folding motion.

[0006] Therefore, the aforementioned rotating stage needs to be used in conjunction with loading / unloading swing arms and laser equipment. Moreover, as is well known and easily understood, the positional accuracy and flatness of the silicon wafer are extremely important for the laser processing effect. This requires that the rotation of the large stage be sufficiently precise, and that the small stages have sufficient flatness, for example, the flatness of a single small stage ≤10μm, and the overall flatness of all small stages ≤15μm.

[0007] For example, the utility model patent with authorization announcement number CN222602927U and authorization announcement date of 2025.03.11 discloses a dust removal mechanism and laser doping equipment. The rotating component inside it mainly includes: a motor, a rotating platform, a connecting part, a bearing arm, an adsorption structure, and an adsorption hole.

[0008] The rotating component in this utility model patent mainly functions to drive the adsorption structure to rotate, thereby switching between the laser doping station and the cleaning station.

[0009] However, in actual use, this rotating component still suffers from at least the following practical shortcomings and relatively low efficiency, specifically: The flatness provided by its adsorption structure can only be guaranteed by the material's own properties and the initial shape of the structure. Therefore, after a period of use, the flatness will inevitably increase, which will lead to a significant reduction in the quality of laser processing. In other words, it is necessary to frequently adjust the external optical path of the equipment, which is also extremely inefficient. Summary of the Invention

[0010] This application provides a leveling component, the technical problem to be solved by which the adsorption stage has an active leveling function during the laser processing of silicon wafers, so as to enable it to maintain a relatively small flatness over a long period of time.

[0011] In addition, this application also provides an adsorption stage including the above-mentioned leveling components and a silicon wafer laser processing rotary stage including the above-mentioned leveling components.

[0012] The technical solution adopted by this application to solve the above problems is: a leveling component, the structure of which includes an elastic threaded member unit screwed on the rotating platform arm and used to press down the adsorption platform, a leveling bolt screwed on the rotating platform arm and used to support the adsorption platform, and a fastening block unit disposed on the lower surface of the rotating platform arm and used to clamp the leveling bolt after leveling is completed.

[0013] A further preferred technical solution is that the elastic screw unit includes a mounting bolt screwed onto the rotating platform arm and passing through the adsorption platform, and a compression spring sleeved on the mounting bolt and used to press down the adsorption platform.

[0014] A further preferred technical solution is that the fastening block unit includes a fixing block disposed on the lower surface of the rotating platform arm, a circular opening disposed on the fixing block for passing through the leveling bolt, and a through cut disposed between the circular opening and the side of the fixing block for clamping the leveling bolt after leveling by means of narrowing deformation.

[0015] A further preferred technical solution is that the fastening block unit further includes a locking hole for closing the opening, which is disposed on the fixing block, passes through the through-cut, and is used to perform a compression operation on the through-cut.

[0016] A further preferred technical solution includes a dual-effect lifting block unit that is disposed at the upper end of the leveling bolt, embedded in the adsorption platform, and used to separate the adsorption platform and the leveling bolt.

[0017] A further preferred technical solution is that the dual-effect lifting block unit includes a dividing block embedded on the lower surface of the adsorption stage, and a circular groove disposed on the lower surface of the dividing block, into which the leveling bolt is inserted, and which is used to engage and block the deformation tendency when the adsorption stage is heated and deformed.

[0018] A further preferred technical solution is that the elastic screw unit further includes a vertical through hole disposed on the mounting bolt and used for heat dissipation operation of the lower area of ​​the silicon wafer.

[0019] An adsorption stage including the leveling component comprises a silicon wafer support frame having an adsorption channel and an adsorption hole, a connecting plate disposed on the silicon wafer support frame and used to increase the rigidity of the silicon wafer support frame, a countersunk hole disposed on the connecting plate and used to install the elastic screw unit, and a limiting groove disposed on the lower surface of the connecting plate and used to install the separating block.

[0020] A further preferred technical solution includes: a thickened plate disposed on the upper surface of the connecting plate and connected to the silicon wafer support frame, which is used to increase the difficulty of thermal expansion deformation of the silicon wafer support frame, and heat dissipation holes disposed on the connecting plate; wherein the countersunk hole and the limiting groove are disposed on the connecting plate and the thickened plate.

[0021] A silicon wafer laser processing rotary stage including the leveling component, the structure includes the rotary stage arm, and also includes a heat dissipation port disposed on the rotary stage arm for heat dissipation operation of the adsorption stage.

[0022] The beneficial effects of this application include at least the following five points.

[0023] First, in this leveling assembly, the elastic screw unit serves the dual purpose of fully installing the adsorption platform and providing leveling space. Then, the leveling bolt is rotated first, and then the fastening block unit clamps the leveling bolt after leveling, ultimately giving the adsorption platform an outstanding function of active leveling before use.

[0024] Secondly, although the aforementioned active leveling function cannot be performed during the operation of the adsorption stage, the adsorption stage reduces its own uneven thermal deformation through at least the following four methods, thereby also reducing the flatness of the adsorption stage and enhancing the leveling function: 1. The connecting plate combined with the thickened plate can actively absorb heat, thereby alleviating the original "hot on top, cold on bottom" phenomenon of the adsorption stage, reducing the temperature difference, and ultimately increasing the difficulty and reducing the magnitude of thermal expansion deformation; 2. The leveling bolts are inserted into the double-effect lifting block unit, which in turn engages with the connecting plate, thereby allowing the leveling bolts to block and limit the aforementioned thermal deformation; 3. The vertical through holes can dissipate heat to the area below the silicon wafer, thereby alleviating the thermal deformation problem of the adsorption stage from the source; 4. The heat dissipation holes combined with the heat dissipation vents can further improve the aforementioned heat dissipation effect, ultimately indirectly allowing the adsorption stage to maintain a relatively small flatness during long-term use.

[0025] Third, in this leveling component, the "dual-effect" designation of the dual-effect lifting block unit refers to its main functions including at least: 1. separating the adsorption platform and the leveling bolt, preventing the latter from directly wearing down the former. Consequently, the replacement cost of the separating block is much lower than that of the adsorption platform; 2. ensuring that the separating block fully engages with the adsorption platform and the circular groove fully engages with the leveling bolt, thereby allowing the leveling bolt to appropriately limit the degree of thermal deformation on the adsorption platform.

[0026] Fourth, the silicon wafer support frame itself is a frame structure, including side strips and middle strips, so it has the necessary and relatively high basic heat dissipation function. Compared with a whole plate, it is less likely to accumulate heat or bend and deform.

[0027] Fifth, the overall structure composed of the connecting plate and the thickened plate, in addition to increasing the difficulty of thermal expansion and deformation of the adsorption platform as mentioned above, also has at least the following functions: 1. It provides sufficient lateral installation space for the countersunk hole and the limiting groove, thereby allowing for a larger size of the heat dissipation vent and improving heat dissipation intensity; 2. It provides sufficient vertical depth for the countersunk hole and the limiting groove, otherwise these parts are prone to cracking. Attached Figure Description

[0028] Figure 1 This is a schematic diagram illustrating the installation method of the leveling component in this application.

[0029] Figure 2 This is a schematic diagram showing the installation position of the flexible screw connector unit in this application.

[0030] Figure 3 This is a schematic diagram of the fastening block unit in this application.

[0031] Figure 4 This is a schematic diagram showing the installation location of the dual-effect lifting block unit in this application.

[0032] Figure 5 This is a schematic diagram showing the location and shape of the vertical through hole in this application.

[0033] Figure 6 This is a schematic diagram of the adsorption stage in this application.

[0034] Figure 7 This is a schematic diagram showing the location and shape of the heat dissipation vent in this application.

[0035] Figure 8 This is a schematic diagram showing the position of the silicon wafer in this application from a side view.

[0036] The meanings of the markings in the diagram are as follows.

[0037] silicon wafer a; Elastic screw connector unit 1, leveling bolt 2, fastening block unit 3, double-effect lifting block unit 4; Mounting bolt 101, compression spring 102, vertical through hole 103; Fixing block 301, circular opening 302, through cut 303, locking hole for closing 304; Separating block 401, circular groove 402; 5. Silicon wafer support frame; 6. Connecting plate; 7. Countersunk hole; 8. Limiting groove; 9. Thickened plate; 10. Heat dissipation hole; Rotating stage arm 11, heat dissipation vent 12, rotating stage center area 13, motor 14, pneumatic slip ring 15. Detailed Implementation

[0038] The following description is merely a preferred embodiment of this application and is not intended to limit the scope of this application.

[0039] As attached Figure 1 -Appendix Figure 8 As shown, a leveling assembly includes an elastic threaded member unit 1 screwed onto a rotating platform arm 11 for pressing down on the adsorption platform, a leveling bolt 2 screwed onto the rotating platform arm 11 for supporting the adsorption platform, and a fastening block unit 3 disposed on the lower surface of the rotating platform arm 11 for clamping the leveling bolt 2 after leveling is completed.

[0040] In this embodiment, the main material of the leveling component is, for example, various types of high-strength stainless steel, and its specific structural composition includes, for example, 4 elastic screw connection units 1, 4 leveling bolts 2, and 4 fastening block units 3.

[0041] The usage of this component mainly includes the following steps: First, fully and completely tighten all four elastic screw units 1 so that they press the main structure of the adsorption platform onto the upper surface of the rotating platform arm 11. At this time, the elastic structure is not completely compressed, allowing the main structure to be lifted slightly away from the rotating platform arm 11 as needed, thereby leveling the main structure. For example, the leveling target is that the flatness of a single main structure is ≤10μm and the overall flatness of all the main structures on the rotating platform is ≤15μm. Second, in conjunction with the existing flatness monitoring instrument, adjust the four leveling bolts 2 as needed, that is, rotate and lift or lower the leveling bolts 2 until the flatness data is qualified. Third, tighten all four fastening block units 3 respectively to clamp and fix the four leveling bolts 2, preventing the leveling bolts 2 from rotating spontaneously. In addition, when the fastening block unit 3 is tightened, it can also perform additional, common, and relatively simple fixing operations on the leveling bolts 2 to prevent the tightening action itself from accidentally rotating the leveling bolts 2.

[0042] Thus, the leveling component can achieve a relatively small flatness that is beneficial for silicon wafer laser processing through active leveling.

[0043] The elastic screw unit 1 is screwed to the rotating platform arm 11 and inserted into the main structure of the adsorption platform; the leveling bolt 2 is screwed to the rotating platform arm 11 and at least abuts against the main structure; the main body of the fastening block unit 3 is screwed to or integrally formed with the rotating platform arm 11, and its remaining clamping part can be appropriately bent and deformed, so as to fix the leveling bolt 2 after the rotation adjustment is completed as needed.

[0044] The elastic screw unit 1 includes a mounting bolt 101 screwed onto the rotating platform arm 11 and passing through the adsorption platform, and a compression spring 102 sleeved on the mounting bolt 101 and used to press down the adsorption platform.

[0045] In this embodiment, the mounting bolt 101 is screwed to the rotating platform arm 11 and inserted into the main structure of the adsorption platform, and the insertion gap between the bolt and the latter is relatively small to avoid significant lateral displacement of the main structure.

[0046] In addition, the lower end of the compression spring 102 abuts against the main structure and the upper end abuts against the head of the mounting bolt 101, so that the main structure can fully fit the upper surface of the rotating platform arm 11 and has a small lifting and shifting function, so that the subsequent leveling function can be effectively performed.

[0047] The fastening block unit 3 includes a fixing block 301 disposed on the lower surface of the rotating platform arm 11, a circular opening 302 disposed on the fixing block 301 and used to pass through the leveling bolt 2, and a through cut 303 disposed between the circular opening 302 and the side of the fixing block 301 and used to clamp the leveling bolt 2 after leveling by means of narrowing deformation.

[0048] In this embodiment, the fixing block 301 is rectangular in shape, with one end along its length serving as the fixed installation end, and the other end having the through cut 303. Appropriate deformation at this point allows for clamping the leveling bolt 2 after leveling. See attached diagram for details. Figure 2 .

[0049] The circular opening 302 is connected to the through cut 303. The latter can be appropriately narrowed and deformed so that the annular surface of the former can clamp the leveling bolt 2, thus preventing the already effective and appropriate leveling range from changing again.

[0050] The fastening block unit 3 further includes a closing locking hole 304 disposed on the fixing block 301, passing through the through cut 303, and used for squeezing and compressing the through cut 303.

[0051] In this embodiment, one way to achieve the narrowing deformation of the through cut 303 is to screw a common bolt into the locking hole 304 for closing, so that the cut width of the through cut 303 becomes smaller and the area undergoes appropriate bending deformation.

[0052] The locking hole 304 for closing the opening is divided into two sections by the through cut 303, one section being a threaded section and the other a smooth section, thereby enabling the above-mentioned bending deformation function to be effectively performed.

[0053] The structure of the leveling assembly also includes a double-lifting block unit 4, which is disposed at the upper end of the leveling bolt 2, embedded in the adsorption platform, and used to separate the adsorption platform and the leveling bolt 2.

[0054] In this embodiment, the term "dual-effect" refers to the role of the dual-effect lifting block unit 4 in the leveling assembly, which includes at least the following two: First, it separates the leveling bolt 2 from the main structure of the adsorption platform, avoiding wear and tear on the latter due to the rotation of the former. Correspondingly, the replacement cost of the dual-effect lifting block unit 4 is naturally much lower than that of the main structure. Secondly, the dual-effect lifting block unit 4 engages with the main structure and is then sleeved at the upper end of the leveling bolt 2, thereby preventing and limiting the inevitable thermal expansion phenomenon on the main structure and ensuring that the flatness of the adsorption platform does not increase significantly during use.

[0055] In addition, the following two points need to be specifically noted.

[0056] First, when the silicon wafer is subjected to laser processing, the temperature of its upper surface is significantly higher than that of its lower surface. Even though the material of the adsorption stage itself has the advantage of low thermal expansion, the above-mentioned uneven heat distribution problem cannot be ignored. The heat is eventually transferred downward to the main structure, causing the middle part to bend and deform upward, and the surrounding parts to bend and deform downward. After being magnified and exaggerated, the deformation can be regarded as an inverted "bowl". This is one of the main reasons why the dual-effect lifting block unit 4 needs to engage and limit the main structure.

[0057] Secondly, when adjusting the flatness of the adsorption stage before use, it is difficult to take into account the subsequent thermal deformation. Otherwise, the leveling operation would be too complicated. Therefore, the only way to block and limit the relatively convex deformation in the middle of the main structure is through the relatively passive method described above.

[0058] The dual-effect lifting block unit 4 includes a dividing block 401 embedded on the lower surface of the adsorption platform, and a circular groove 402 disposed on the lower surface of the dividing block 401, into which the leveling bolt 2 is inserted, and which is used to engage and block the deformation tendency when the adsorption platform is heated and deformed.

[0059] In this embodiment, the dividing block 401 is rectangular in shape, and the upper end of the leveling bolt 2 is a smooth section without threads, so that it can fully fit and be inserted into the circular groove 402, and can rotate stably within the circular groove 402.

[0060] Correspondingly, the dividing block 401 also needs to be embedded and installed in a relatively close manner so that it is relatively fixed to the main structure.

[0061] The elastic screw unit 1 also includes a vertical through hole 103 disposed on the mounting bolt 101 and used for heat dissipation operation of the lower area of ​​the silicon wafer a.

[0062] In this embodiment, the mounting bolt 101 is both the main structure that directly contacts the adsorption stage and the upper end that can directly face the silicon wafer. Therefore, the solution of drilling holes in it for heat dissipation and thus reducing the thermal expansion of the main structure is highly practical.

[0063] Conversely, it is not suitable to provide heat dissipation holes on the leveling bolt 2, which does not have the positional advantages of the installation bolt 101 as described above.

[0064] Of course, the diameter of the vertically penetrating hole 103 is relatively small and does not affect the basic tightening function of the installation bolt 101.

[0065] An adsorption stage including the leveling component has a structure including a silicon wafer support body 5 provided with an adsorption channel and adsorption holes, a connecting plate 6 provided on the silicon wafer support body 5 and used to increase the rigidity of the silicon wafer support body 5, a counterbore 7 provided on the connecting plate 6 and used to install the elastic screw connection unit 1, and a limiting groove 8 provided on the lower surface of the connecting plate 6 and used to install the separating block 401.

[0066] In this embodiment, the above main structure of the adsorption stage mainly refers to the silicon wafer support body 5. Specifically, its shape is, for example, a "field shape", and its structural composition includes 4 frame plates and 2 intermediate plates integrally formed and provided with adsorption channels and adsorption holes thereon. For details, please refer to the appendix Figure 6 .

[0067] Among them, the silicon wafer support body 5 and the connecting plate 6 are also integrally formed, and their lower surfaces are flush. The number of the latter is 4, and they respectively fill the original 4 internal rectangular openings of the former.

[0068] In addition, the "small hole" of the counterbore 7 is used to sleeve and limit the installation bolt 101, and its inner bottom surface is used to support the compression spring 102. The position, shape and number of the limiting groove 8 correspond to the separating block 401, serving as the "anchoring point" when the silicon wafer support body 5 bulges upward in the middle, so that the degree of deformation can be appropriately reduced.

[0069] Correspondingly, precisely because the structural feature of the silicon wafer support body 5 is hollow, the problems of uneven heat transfer of the silicon wafer in the above "upper hot and lower cold" situation and the middle bulging deformation are relatively more obvious and cannot be ignored.

[0070] The structure of the adsorption stage further includes a thickening plate 9 provided on the upper surface of the connecting plate 6, connecting the silicon wafer support body 5 and used to increase the difficulty of thermal expansion deformation of the silicon wafer support body 5, and a heat dissipation hole 10 provided on the connecting plate 6; among them, the counterbore 7 and the limiting groove 8 are both provided on the connecting plate 6 and the thickening plate 9.

[0071] In this embodiment, the thickened plate 9 is also integrally formed with the silicon wafer support frame 5 and the connecting plate 6. There are four of them, and they are rectangular in shape. They are only connected to the middle plate of the silicon wafer support frame 5, and not to the side frame plates, thus leaving installation space for the heat dissipation hole 10. The term "thickened" in the thickened plate 9 refers to a portion of its area on the upper surface of the connecting plate 6, where the overall thickness of this area is greater than the thickness of the connecting plate 6 itself.

[0072] Accordingly, the main functions of the thickened plate 9 include: First, the connecting plate 6 and the thickened plate 9 together can actively absorb heat, thereby alleviating the "hot on top and cold on bottom" phenomenon on the silicon wafer support frame 5, reducing the temperature difference, and ultimately increasing the difficulty and reducing the magnitude of thermal expansion deformation. Secondly, sufficient vertical space is provided for the countersunk hole 7 and the limiting groove 8, so that the former can fully engage the installation bolt 101 and the latter can fully engage the separating block 401. If the thickened plate 9 is not provided, and the countersunk hole 7 and the limiting groove 8 are only opened on the connecting plate 6, the structure of the hole and groove itself will be unstable and relatively easy to crack.

[0073] Furthermore, the heat dissipation holes 10 are circular or rectangular in shape, and there are four of them, each disposed on one of the four connecting plates 6, and they do not contact the thickened plate 9. The main function of the heat dissipation holes 10 is to dissipate and conduct heat generated on the silicon wafer due to laser processing, thereby alleviating the deformation of the silicon wafer support frame 5 at its source.

[0074] A silicon wafer laser processing rotary stage including the leveling component, the structure includes the rotary stage arm 11, and also includes a heat dissipation port 12 disposed on the rotary stage arm 11 for heat dissipation operation of the adsorption stage.

[0075] In this embodiment, the main body of the rotating stage is made of ultra-hard aluminum alloy, such as 7075-T6 or 6061-T6.

[0076] The specific structural components of the rotating platform include, for example: a central area 13 of the rotating platform, four rotating platform arms 11, four heat dissipation vents 12, a motor 14, and a pneumatic slip ring 15.

[0077] The general usage and precautions for this rotary stage include, for example, the following two points: First, the central area 13 of the rotating platform and the four rotating platform arms 11 together form an "I" shaped platform. The motor 14 rotates 180° each time. One side of the rotating platform is the loading / unloading station, and the other side is the alignment / processing station. Secondly, the rotating stage feeds two silicon wafers at a time, so it can be regarded as a dual-station operation. The above-mentioned alignment operation can be carried out by "dynamic compensation of the driving laser galvanometer" instead of physically adjusting the adsorption stage. Accordingly, the ultimate purpose of the above-mentioned leveling component is to reduce the triggering frequency of the above-mentioned "dynamic compensation" operation.

[0078] The heat dissipation vent 12 is circular in shape and its size is significantly larger than that of a single heat dissipation hole 10. Its function is similar to that of the heat dissipation hole 10, both of which are to indirectly alleviate the degree of upward deformation in the middle of the silicon wafer support frame 5, and ultimately reduce the workload of the above-mentioned "dynamic compensation" operation.

[0079] Correspondingly, in the horizontal direction, the heat dissipation hole 10 needs to avoid the mounting bolt 101 and the leveling bolt 2, so that the opening of the heat dissipation hole 10 does not affect the normal installation of the latter two.

[0080] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various modifications can be made without departing from the spirit of this application. These are non-inventive modifications and are protected by patent law as long as they are within the scope of the claims of this application.

Claims

1. A leveling component, characterized in that: The structure includes an elastic threaded component unit (1) that is threaded onto the rotating platform arm (11) and used to press down the adsorption platform, a leveling bolt (2) that is threaded onto the rotating platform arm (11) and used to support the adsorption platform, and a fastening block unit (3) that is disposed on the lower surface of the rotating platform arm (11) and used to clamp the leveling bolt (2) after leveling is completed.

2. The leveling component according to claim 1, characterized in that: The elastic screw unit (1) includes a mounting bolt (101) screwed onto the rotating platform arm (11) and passing through the adsorption platform, and a compression spring (102) sleeved on the mounting bolt (101) and used to press down the adsorption platform.

3. A leveling component according to claim 1, characterized in that: The fastening block unit (3) includes a fixing block (301) disposed on the lower surface of the rotating platform arm (11), a circular opening (302) disposed on the fixing block (301) for passing through the leveling bolt (2), and a through cut (303) disposed between the circular opening (302) and the side of the fixing block (301) and used for clamping the leveling bolt (2) after leveling by means of narrowing deformation.

4. A leveling component according to claim 3, characterized in that: The fastening block unit (3) further includes a locking hole (304) for closing the opening, which is disposed on the fixing block (301), passes through the through cut (303), and is used to perform a compression operation on the through cut (303).

5. A leveling component according to claim 1, characterized in that: It also includes a double-effect lifting block unit (4) which is located at the upper end of the leveling bolt (2), embedded in the adsorption platform, and used to separate the adsorption platform and the leveling bolt (2).

6. A leveling component according to claim 5, characterized in that: The dual-effect lifting block unit (4) includes a dividing block (401) embedded on the lower surface of the adsorption stage, and a circular groove (402) disposed on the lower surface of the dividing block (401), into which the leveling bolt (2) is inserted, and which is used to engage and block the deformation tendency when the adsorption stage is heated and deformed.

7. A leveling component according to claim 2, characterized in that: The elastic screw unit (1) also includes a vertical through hole (103) disposed on the mounting bolt (101) and used for heat dissipation operation of the lower region of the silicon wafer (a).

8. An adsorption stage comprising the leveling component as described in claim 6, characterized in that: The structure includes a silicon wafer support frame (5) with adsorption channels and adsorption holes, a connecting plate (6) disposed on the silicon wafer support frame (5) and used to increase the rigidity of the silicon wafer support frame (5), a countersunk hole (7) disposed on the connecting plate (6) and used to install the elastic screw unit (1), and a limiting groove (8) disposed on the lower surface of the connecting plate (6) and used to install the separator block (401).

9. An adsorption stage including the leveling component according to claim 8, characterized in that: It also includes a thickened plate (9) disposed on the upper surface of the connecting plate (6) and connected to the silicon wafer support frame (5), and used to increase the difficulty of thermal expansion deformation of the silicon wafer support frame (5), as well as heat dissipation holes (10) disposed on the connecting plate (6); wherein the countersunk hole (7) and the limiting groove (8) are disposed on the connecting plate (6) and the thickened plate (9).

10. A silicon wafer laser processing rotary stage including the leveling component as described in any one of claims 1-6, the structure including the rotary stage arm (11), characterized in that: It also includes a heat dissipation port (12) disposed on the rotating stage arm (11) and used for heat dissipation operation of the adsorption stage.

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