Processing follow-up control method and device, processing equipment and storage medium

Abstract

The embodiment of the invention belongs to the technical field of laser machining, and relates to a machining follow-up control method and device, machining equipment and a storage medium, and the method comprises the steps that a machining instruction carrying a preset machining path is received; starting a laser processing nozzle, and controlling the laser processing nozzle to perform laser processing along the preset processing path; in the laser machining process, current height data of the laser machining nozzle are collected in real time; calculating a height error according to the current height data and a preset height of the preset processing path; calculating control parameters of the laser processing nozzle according to a follow-up control algorithm and the height error; the speed of the laser machining nozzle is subjected to self-adaptive optimization treatment according to the control parameters, and the target machining speed is obtained; and controlling the laser processing nozzle to perform laser processing according to the target processing speed. The laser processing quality is effectively improved.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a processing follow-up control method, device, processing equipment and storage medium. Background Technology

[0002] Laser processing technology, as an advanced processing method, has been widely used in many fields such as aerospace, automobile manufacturing, and machining due to its advantages such as high processing precision, high speed, and small heat-affected zone. During laser processing, because the processing surface has an inclination angle, the distance between the laser nozzle and the processing surface changes continuously with the change of processing position.

[0003] Traditional laser processing methods typically use fixed processing parameters, such as a fixed cutting speed and nozzle height during laser cutting.

[0004] However, traditional fixed-parameter processing methods have significant drawbacks during cutting. When the distance between the laser nozzle and the processing surface changes, a fixed cutting speed cannot guarantee the stability of the cutting quality.

[0005] This shows that traditional laser processing methods cannot meet the high-quality requirements of laser processing. Summary of the Invention

[0006] The purpose of this application is to provide a processing follow-up control method, device, processing equipment, and storage medium to solve the problem that traditional laser processing methods cannot meet the high-quality requirements of laser processing.

[0007] To address the aforementioned technical problems, this application provides a machining follow-up control method, which employs the following technical solution: Receive processing instructions carrying a preset processing path; Start the laser processing nozzle and control the laser processing nozzle to perform laser processing along the preset processing path; During the laser processing, the current height data of the laser processing nozzle is collected in real time; The height error is calculated based on the current height data and the preset height of the preset processing path; The control parameters of the laser processing nozzle are calculated based on the servo control algorithm and the height error. The speed of the laser processing nozzle is adaptively optimized based on the control parameters to obtain the target processing speed. The laser processing nozzle is controlled to perform laser processing according to the target processing speed.

[0008] To address the aforementioned technical problems, this application also provides a machining follow-up control device, which employs the following technical solution: An instruction receiving module for receiving processing instructions carrying a preset processing path; A nozzle activation module for activating a laser processing nozzle and controlling the laser processing nozzle to perform laser processing along the preset processing path; A current height acquisition module for real-time acquisition of the current height data of the laser processing nozzle during the laser processing process; A height error calculation module for calculating the height error based on the current height data and the preset height of the preset processing path; A module for calculating control parameters of the laser processing nozzle based on a follow-up control algorithm and the height error; An adaptive optimization module is used to adaptively optimize the speed of the laser processing nozzle according to the control parameters to obtain the target processing speed. A laser processing module for controlling the laser processing nozzle to perform laser processing according to the target processing speed.

[0009] To address the aforementioned technical problems, this application also provides a processing device that employs the following technical solution: It includes a memory and a processor, wherein the memory stores computer-readable instructions, and the processor executes the computer-readable instructions to implement the steps of the machining follow-up control method as described above.

[0010] To address the aforementioned technical problems, this application also provides a computer-readable storage medium, employing the technical solution described below: The computer-readable storage medium stores computer-readable instructions, which, when executed by a processor, implement the steps of the machining follow-up control method described above.

[0011] To address the aforementioned technical problems, embodiments of this application also provide a computer program product that, when running on a terminal device, enables the terminal device to implement the steps of the processing follow-up control method described above.

[0012] This application provides a machining follow-up control method, comprising: receiving a machining instruction carrying a preset machining path; activating a laser machining nozzle and controlling the laser machining nozzle to perform laser machining along the preset machining path; during the laser machining process, acquiring the current height data of the laser machining nozzle in real time; calculating a height error based on the current height data and the preset height of the preset machining path; calculating control parameters of the laser machining nozzle based on a follow-up control algorithm and the height error; adaptively optimizing the speed of the laser machining nozzle based on the control parameters to obtain a target machining speed; and controlling the laser machining nozzle to perform laser machining based on the target machining speed. Compared with the prior art, this application, by acquiring the height data of the laser machining nozzle in real time and dynamically adjusting the cutting speed based on the height data, can ensure that the distance between the laser machining nozzle and the machining surface is always within the optimal range, thereby improving the quality of laser machining. Attached Figure Description

[0013] To more clearly illustrate the solutions in this application, the accompanying drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is an exemplary system architecture diagram to which this application can be applied; Figure 2 This is a flowchart illustrating the implementation of the machining follow-up control method provided in the embodiments of this application; Figure 3 This is a schematic diagram of the machining follow-up control device provided in the embodiments of this application; Figure 4 This is a schematic diagram of one embodiment of the processing equipment according to this application. Detailed Implementation

[0015] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0016] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0017] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0018] like Figure 1 As shown, system architecture 100 may include terminal device 101, network 102, and server 103. Terminal device 101 may be a laptop 1011, tablet 1012, or mobile phone 1013. Network 102 is used as a medium to provide a communication link between terminal device 101 and server 103. Network 102 may include various connection types, such as wired, wireless communication links, or fiber optic cables, etc.

[0019] Users can use terminal device 101 to interact with server 103 via network 102 to receive or send messages, etc. Various communication client applications can be installed on terminal device 101, such as web browser applications, shopping applications, search applications, instant messaging tools, email clients, social media platform software, etc.

[0020] Terminal device 101 can be various electronic devices with a display screen and support web browsing. In addition to laptops 1011, tablets 1012 or mobile phones 1013, terminal device 101 can also be e-book readers, MP3 players (Moving Picture Experts Group Audio Layer III), MP4 players (Moving Picture Experts Group Audio Layer IV), laptops and desktop computers, etc.

[0021] Server 103 can be a server that provides various services, such as a backend server that provides support for the pages displayed on terminal device 101.

[0022] It should be noted that the machining follow-up control method provided in the embodiments of this application is generally executed by a server / terminal device, and correspondingly, the machining follow-up control device is generally set in the server / terminal device.

[0023] It should be understood that Figure 1 The number of terminal devices, networks, and servers shown is merely illustrative. Depending on implementation needs, any number of terminal devices, networks, and servers can be included.

[0024] Continue to refer to Figure 2 The diagram shows a flowchart of one embodiment of the machining follow-up control method according to this application. The machining follow-up control method includes steps S201, S202, S203, S204, S205, S206, and S207.

[0025] In step S201, a processing instruction carrying a preset processing path is received.

[0026] In the embodiments of this application, the processing can specifically be laser processing operations such as cutting and welding, and the processing object can be a flat plate, a tilting plate, etc. The following description will take cutting processing as an example.

[0027] In this embodiment of the application, the preset processing path refers to the trajectory information of the laser processing nozzle that the system has set in advance for processing, which provides guidance for subsequent cutting operations. The preset processing path includes the preset coordinate position information and preset height position information of the laser processing nozzle.

[0028] In the embodiments of this application, a user inputs an instruction through their terminal device, which is received by the system. The user terminal may be a mobile terminal such as a mobile phone, smartphone, laptop, digital broadcast receiver, PDA (personal digital assistant), PAD (tablet computer), PMP (portable multimedia player), navigation device, etc., or a fixed terminal such as a digital TV, desktop computer, etc. It should be understood that the examples of user terminals given herein are for convenience of understanding only and are not intended to limit this application.

[0029] In this embodiment, the machining instructions refer to the core instruction set used in CNC programming to achieve precise machining of inclined surfaces. These machining instructions include coordinate system rotation instructions, tool length compensation instructions, layered cutting cycle instructions, etc. Specifically, the coordinate system rotation instruction mainly rotates the machining coordinate system to align the tool path with the normal direction of the inclined surface, transforming the three-dimensional inclined surface machining into two-dimensional planar machining. The tool length compensation instruction is mainly used to compensate the tool length in the vertical direction of the inclined surface to ensure accurate cutting depth. The layered cutting cycle instruction mainly achieves layered machining of the inclined surface by decreasing the radius value (R) or adjusting the endpoint coordinates (X / Z).

[0030] In step S202, the laser processing nozzle is activated and controlled to perform laser processing along a preset processing path.

[0031] In this embodiment, the laser processing nozzle begins to cut the processing material according to the initially set parameters. These initially set parameters refer to the coordinate system rotation command, tool length compensation command, layered cutting cycle command, etc. For example, the coordinate system rotation command parameters can be: IP_: coordinates of the rotation center point (default is the current point if not specified); R: rotation angle (clockwise is positive, counterclockwise is negative); I / J / K: rotation axis (X / Y / Z), such as the Y-axis (J1) commonly used on lathes.

[0032] In the embodiments of this application, laser processing can specifically be planar processing or wire processing.

[0033] In step S203, during the laser processing, the current height data of the laser processing nozzle is collected in real time.

[0034] In this embodiment, by installing a height sensor, such as a laser displacement sensor or a capacitive displacement sensor, on the laser processing nozzle, the distance between the nozzle and the processing surface can be accurately measured, and this distance information can be fed back to the control system in real time as the current height data.

[0035] In step S204, the height error is calculated based on the current height data and the preset height of the preset processing path.

[0036] In this embodiment, the height error refers to the difference between the current height of the laser processing nozzle and the preset height.

[0037] In step S205, the control parameters of the laser processing nozzle are calculated based on the follow-up control algorithm and the height error.

[0038] In this embodiment, the servo control algorithm is an algorithm that can adjust the output signal (control parameters) in real time according to the input signal (current height data). This servo control algorithm can process on the processing material at a speed of 60m / min, and ensure the stability and flexibility of the following. The servo control algorithm is built on the basic framework of the PID (Proportion Integral Differential) algorithm. Specifically, the servo control algorithm is expressed as follows:

[0039] in, , , These represent the gain parameters of the servo control algorithm. Indicates error , , This indicates the preset height of the preset processing path. This indicates the current altitude data. This indicates that the error is integrated. This indicates that the rate of change of the error is calculated by differentiating the error.

[0040] In some optional implementations of the embodiments of this application, in order to ensure the stability of the servo control algorithm, this application assigns a gain parameter to the servo control algorithm. Adding a filter, specifically, using a second-order Butterworth low-pass filter to process high-frequency noise and reduce noise interference with the signal, wherein: The response function of a second-order Butterworth low-pass filter is expressed as:

[0041] in, Indicates the cutoff frequency; Transfer function of a second-order Butterworth low-pass filter Represented as:

[0042] For transfer function After frequency scaling, it is represented as:

[0043] in, Indicates the input signal, and , Indicates the real part ， Indicates the imaginary part.

[0044] In this embodiment, the control parameter refers to the gain parameter in the aforementioned servo control algorithm. , , The parameter information is obtained by adjusting the current altitude data in real time.

[0045] In step S206, the speed of the laser processing nozzle is adaptively optimized according to the control parameters to obtain the target processing speed.

[0046] In this embodiment, the control parameters reflect the degree of influence of the current height data on the cutting speed. By applying the control parameters to the initial cutting speed, a target processing speed suitable for the current height can be calculated.

[0047] In step S207, the laser processing nozzle is controlled to perform laser processing according to the target processing speed.

[0048] In this embodiment, the control system sends the target processing speed to the drive system of the laser processing equipment, and the drive system adjusts the movement speed of the laser processing nozzle so that it continues to cut along the preset processing path according to the target processing speed.

[0049] In this embodiment of the application, during the entire cutting process, the height sensor continuously collects the height data of the nozzle, and the control system repeats the above calculation of control parameters and optimizes the cutting speed based on the new height data, so as to realize the real-time dynamic adjustment of the cutting speed and ensure that the cutting quality is always maintained at a high level.

[0050] This application provides a processing follow-up control method, including: receiving a processing instruction carrying a preset processing path; activating a laser processing nozzle and controlling the laser processing nozzle to perform laser processing along the preset processing path; during laser processing, acquiring the current height data of the laser processing nozzle in real time; calculating a height error based on the current height data and the preset height of the preset processing path; calculating control parameters of the laser processing nozzle based on a follow-up control algorithm and the height error; adaptively optimizing the speed of the laser processing nozzle based on the control parameters to obtain a target processing speed; and controlling the laser processing nozzle to perform laser processing according to the target processing speed. Compared with the prior art, this application, by acquiring the height data of the laser processing nozzle in real time and dynamically adjusting the cutting speed based on the height data, can ensure that the distance between the laser processing nozzle and the processing surface is always within the optimal range, thereby avoiding problems such as incomplete cutting or material overheating and deformation caused by distance changes, and improving the quality of laser processing.

[0051] In some optional implementations of the embodiments of this application, after calculating the control parameters of the laser processing nozzle based on the servo control algorithm and the height error, the method further includes: Calculate feedforward data based on the slope calculation function and the current height data; The sum of the feedforward data and the control parameters is calculated to obtain the integrated control parameters, where the integrated control parameters are... Represented as:

[0052] in, Indicates control parameters, Represents feedforward data; The speed of the laser processing nozzle is adaptively optimized based on the control parameters to obtain the target processing speed, specifically including: The speed of the laser processing nozzle is adaptively optimized based on the comprehensive control parameters to obtain the target processing speed.

[0053] In this embodiment, the feedforward data is mainly used to accelerate the convergence of the above-mentioned servo control algorithm, wherein the feedforward data is expressed as:

[0054]

[0055] in, Represents feedforward data. Indicates the feedforward gain parameter This indicates the feedback height error for the current cycle. This indicates the current height of the laser processing nozzle. This indicates the height of the laser processing nozzle in the previous cycle. This indicates the feedback height of the laser processing nozzle in the current cycle. This indicates the feedback height of the laser processing nozzle in the previous cycle. This represents the feedforward gain parameter.

[0056] In this embodiment, the original servo control algorithm, after incorporating feedforward data, yields the final integrated control parameters. Represented as: .

[0057] Compared with existing technologies, this application solves the problems of slow convergence speed and poor robustness of traditional methods by real-time calculation of slope-related feedforward data to guide the servo control algorithm to quickly adjust parameters to the optimal value.

[0058] In some optional implementations of the embodiments of this application, the above-mentioned calculation of control parameters based on the servo control algorithm and the current altitude data specifically includes: A theoretical speed curve is generated based on the preset processing path; Obtain the current processing speed of the laser processing nozzle, and calculate the current speed deviation based on the theoretical speed curve and the current processing speed; Confirm the current transition state of the laser processing nozzle based on the current speed deviation; The gain parameters of the servo control algorithm are dynamically adjusted according to the current transition state to obtain the optimized servo control algorithm. The control parameters are calculated based on the optimized servo control algorithm and the current altitude data.

[0059] In this embodiment, the theoretical speed curve is generated by generating the theoretical speed curve based on a preset processing path. The jerk J is limited using an S-curve programming algorithm, and the formula is:

[0060] in, Indicates the duration of the acceleration phase. This indicates the initial velocity.

[0061] In this embodiment, the current transition state refers to a qualitative description of the current speed condition of the laser processing nozzle. It reflects the degree and direction of deviation between the actual speed and the theoretical speed. This current transition state is based on the current speed deviation. and its rate of change The current transition state is determined to include three types: over-start, over-deceleration, and over-reverse. Specifically, over-start refers to the laser processing equipment's starting phase, where the actual starting speed, acceleration, and other motion parameters of the laser processing nozzle exceed the preset reasonable range. Over-deceleration refers to the laser processing nozzle needing to decelerate and stop or reduce speed for the next operation, where the actual speed change during deceleration exceeds the preset reasonable range. Over-reverse refers to the laser processing nozzle needing to change its direction of movement, where the actual reverse movement speed, acceleration, or reverse position exceeds the preset reasonable range. The classification rules for this current transition state are as follows: Initiating the transition: and (continued ); Deceleration transition: and ; Reverse transition: and .

[0062] in, , , .

[0063] In this embodiment of the application, after confirming the current transition state, the PID parameters of the servo control algorithm are adjusted according to the transition state, wherein the adjustment strategy is shown in Table 1 below:

[0064] Table 1 Compared with existing technologies, this application achieves smooth control during the transition phase through dynamic speed planning and adaptive adjustment of gain parameters, thereby improving processing accuracy and efficiency.

[0065] In some optional implementations of the embodiments of this application, after adaptively optimizing the speed of the laser processing nozzle according to the control parameters to obtain the target processing speed, the method further includes: The target processing speed is optimized by using a follow-up speed planning algorithm to obtain the optimized target processing speed. The follow-up speed planning algorithm is either a quadratic programming algorithm or a nonlinear programming algorithm. The quadratic programming algorithm is expressed as:

[0066] in, Weight of acceleration Indicates acceleration. Weights representing speed, Indicates the current speed. Indicates the preset reference speed; The nonlinear programming algorithm is expressed as:

[0067] in, This indicates the lateral displacement error. This indicates the longitudinal displacement error. Indicates acceleration. The weights representing the lateral displacement error. The weight representing the longitudinal displacement error. The weights representing acceleration.

[0068] In this application embodiment, speed optimization refers to a method of optimizing the target processing speed based on the dynamic characteristics of the equipment, the complexity of the processing path, and multiple constraints, so as to improve the overall performance of the processing process.

[0069] In this embodiment, the main function of the quadratic programming algorithm is to smooth and optimize the coarse curve generated by dynamic programming, generating a velocity curve that satisfies acceleration and acceleration constraints. Specifically, the velocity programming is transformed into an optimization problem on a displacement-time graph (ST graph), which is solved by designing objective functions (such as minimizing position deviation, acceleration, and acceleration) and constraints (such as speed limits and kinematic restrictions).

[0070] In this embodiment, the main function of the nonlinear programming algorithm is to solve the problem of inaccurate curvature constraints in quadratic programming, making it suitable for scenarios with extremely high accuracy requirements (such as semiconductor manufacturing). Specifically, considering the influence of path curvature on speed, the curvature constraint is transformed into a nonlinear function.

[0071] The embodiments of this application can acquire and process relevant data based on artificial intelligence technology. Artificial intelligence (AI) refers to the theories, methods, technologies, and application systems that use digital computers or machines controlled by digital computers to simulate, extend, and expand human intelligence, perceive the environment, acquire knowledge, and use that knowledge to obtain optimal results.

[0072] Foundational technologies for artificial intelligence generally include sensors, dedicated AI chips, cloud computing, distributed storage, big data processing, operating / interactive systems, and mechatronics. AI software technologies mainly encompass computer vision, robotics, biometrics, speech processing, natural language processing, and machine learning / deep learning.

[0073] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by instructing related hardware through computer-readable instructions. These computer-readable instructions can be stored in a computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above methods. The aforementioned storage medium can be a non-volatile storage medium such as a magnetic disk, optical disk, or read-only memory (ROM), or random access memory (RAM).

[0074] It should be understood that although the steps in the flowcharts of the accompanying figures are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the accompanying figures may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.

[0075] Further reference Figure 3 As a response to the above Figure 2 To implement the method shown, this application provides an embodiment of a machining follow-up control device, which is similar to... Figure 2 Corresponding to the method embodiments shown, this device can be specifically applied to various electronic devices.

[0076] like Figure 3 As shown, the machining follow-up control device 200 of this application embodiment includes: Instruction receiving module 210 for receiving processing instructions carrying preset processing paths; Nozzle starting module 220 for starting the laser processing nozzle and controlling the laser processing nozzle to perform laser processing along the preset processing path; Current height acquisition module 230 is used to acquire the current height data of the laser processing nozzle in real time during the laser processing process; Height error calculation module 240 for calculating height error based on the current height data and the preset height of the preset processing path; Calculation module 250 for calculating control parameters of the laser processing nozzle based on the follow-up control algorithm and the height error; An adaptive optimization module 260 is used to adaptively optimize the speed of the laser processing nozzle according to the control parameters to obtain the target processing speed. A laser processing module 270 for controlling the laser processing nozzle to perform laser processing according to the target processing speed.

[0077] In this embodiment of the application, a processing follow-up control device 200 is provided, comprising: an instruction receiving module 210 for receiving a processing instruction carrying a preset processing path; a nozzle starting module 220 for starting a laser processing nozzle and controlling the laser processing nozzle to perform laser processing along the preset processing path; a current height acquisition module 230 for acquiring the current height data of the laser processing nozzle in real time during the laser processing; a height error calculation module 240 for calculating the height error based on the current height data and the preset height of the preset processing path; a control parameter calculation module 250 for calculating the control parameter of the laser processing nozzle based on a follow-up control algorithm and the height error; an adaptive optimization module 260 for adaptively optimizing the speed of the laser processing nozzle based on the control parameters to obtain a target processing speed; and a laser processing module 270 for controlling the laser processing nozzle to perform laser processing according to the target processing speed. Compared with existing technologies, this application can ensure that the distance between the laser processing nozzle and the processing surface is always within the optimal range by collecting the height data of the laser processing nozzle in real time and dynamically adjusting the cutting speed according to the height data. This avoids problems such as incomplete cutting or material overheating and deformation caused by changes in distance, and improves the quality of laser processing.

[0078] In some optional implementations of the embodiments of this application, the above-mentioned machining follow-up control device 200 further includes: A feedforward data calculation module for calculating feedforward data based on the slope calculation function and the current height data; A feedforward adjustment module is used to calculate the sum of the feedforward data and the control parameters to obtain the comprehensive control parameters, wherein the comprehensive control parameters... Represented as:

[0079] in, This refers to the control parameters. This refers to the feedforward data; A control parameter calculation submodule is used to adaptively optimize the speed of the laser processing nozzle based on the comprehensive control parameters to obtain the target processing speed.

[0080] In some optional implementations of the embodiments of this application, the control parameter calculation module 240 includes: Theoretical speed curve generation submodule is used to generate theoretical speed curves based on preset processing paths; A speed deviation calculation submodule is used to obtain the current processing speed of the laser processing nozzle and calculate the current speed deviation based on the theoretical speed curve and the current processing speed. A transition state confirmation submodule for confirming the current transition state of the laser processing nozzle based on the current speed deviation; This module is used to dynamically adjust the gain parameters of the servo control algorithm based on the current transition state, resulting in an optimized servo control algorithm parameter adjustment submodule. The control parameter calculation submodule is used to calculate control parameters based on the optimized servo control algorithm and the current altitude data.

[0081] In some optional implementations of the embodiments of this application, the above-mentioned machining follow-up control device 200 further includes: A speed optimization module is used to optimize the target processing speed according to the follow-up speed planning algorithm to obtain the optimized target processing speed. The follow-up speed planning algorithm is a quadratic programming algorithm or a nonlinear programming algorithm. The quadratic programming algorithm is expressed as:

[0082] in, Weight of acceleration Indicates acceleration. Weights representing speed, Indicates the current speed. Indicates the preset reference speed; The nonlinear programming algorithm is expressed as:

[0083] in, This indicates the lateral displacement error. This indicates the longitudinal displacement error. Indicates acceleration. The weights representing the lateral displacement error. The weight representing the longitudinal displacement error. The weights representing acceleration.

[0084] To address the aforementioned technical problems, embodiments of this application also provide processing equipment. Please refer to [link / reference needed] for details. Figure 4, Figure 4 This is a basic structural block diagram of the processing equipment in an embodiment of this application.

[0085] The processing equipment 300 includes a memory 310, a processor 320, and a network interface 330 that are interconnected via a system bus. It should be noted that only processing equipment 300 with components 310-330 is shown in the figure; however, it should be understood that it is not required to implement all the shown components, and more or fewer components can be implemented alternatively. Those skilled in the art will understand that the processing equipment described here is a device capable of automatically performing numerical calculations and / or information processing according to pre-set or stored instructions, and its hardware includes, but is not limited to, microprocessors, application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc.

[0086] Processing equipment can be computing devices such as desktop computers, laptops, handheld computers, and cloud servers. The processing equipment can interact with users via keyboards, mice, remote controls, touchpads, or voice-activated devices.

[0087] The memory 310 includes at least one type of readable storage medium, including flash memory, hard disk, multimedia card, card-type memory (e.g., SD or DX memory), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic memory, magnetic disk, optical disk, etc. In some embodiments, the memory 310 may be an internal storage unit of the processing equipment 300, such as the hard disk or memory of the processing equipment 300. In other embodiments, the memory 310 may also be an external storage device of the processing equipment 300, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the processing equipment 300. Of course, the memory 310 may include both internal storage units of the processing equipment 300 and its external storage devices. In the embodiments of this application, the memory 310 is typically used to store the operating system and various application software installed on the processing equipment 300, such as computer-readable instructions for processing follow-up control methods. In addition, the memory 310 can also be used to temporarily store various types of data that have been output or will be output.

[0088] In some embodiments, processor 320 may be a central processing unit (CPU), controller, microcontroller, microprocessor, or other data processing chip. This processor 320 is typically used to control the overall operation of the processing equipment 300. In embodiments of this application, processor 320 is used to execute computer-readable instructions stored in memory 310 or process data, such as executing computer-readable instructions for a processing follow-up control method.

[0089] The network interface 330 may include a wireless network interface or a wired network interface, which is typically used to establish a communication connection between the processing equipment 300 and other electronic devices.

[0090] The processing equipment provided in this application can ensure that the distance between the laser processing nozzle and the processing surface is always within the optimal range by collecting the height data of the laser processing nozzle in real time and dynamically adjusting the cutting speed according to the height data. This avoids problems such as incomplete cutting or material overheating and deformation caused by changes in distance, and improves the quality of laser processing.

[0091] This application also provides another embodiment, namely, providing a computer-readable storage medium storing computer-readable instructions that can be executed by at least one processor to cause the at least one processor to perform the steps of the processing follow-up control method described above.

[0092] The computer-readable storage medium provided in this application can ensure that the distance between the laser processing nozzle and the processing surface is always within the optimal range by acquiring the height data of the laser processing nozzle in real time and dynamically adjusting the cutting speed according to the height data. This avoids problems such as incomplete cutting or material overheating and deformation caused by changes in distance, and improves the quality of laser processing.

[0093] This application also provides another embodiment, namely, a computer program product that, when running on a terminal device, enables the terminal device to implement the steps of the above-described machining follow-up control method.

[0094] The computer program product provided in the application can collect the height data of the laser processing nozzle in real time and dynamically adjust the cutting speed according to the height data. This ensures that the distance between the laser processing nozzle and the processing surface is always within the optimal range, thereby avoiding problems such as incomplete cutting or material overheating and deformation caused by changes in distance, and improving the quality of laser processing.

[0095] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods of the various embodiments of this application.

[0096] Obviously, the embodiments described above are only some embodiments of this application, not all embodiments. The accompanying drawings show preferred embodiments of this application, but do not limit the patent scope of this application. This application can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this application's specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the scope of patent protection of this application.

Claims

1. A machining follow-up control method, characterized in that, include: Receive processing instructions carrying a preset processing path; Start the laser processing nozzle and control the laser processing nozzle to perform laser processing along the preset processing path; During the laser processing, the current height data of the laser processing nozzle is collected in real time; The height error is calculated based on the current height data and the preset height of the preset processing path; The control parameters of the laser processing nozzle are calculated based on the servo control algorithm and the height error. The speed of the laser processing nozzle is adaptively optimized based on the control parameters to obtain the target processing speed. The laser processing nozzle is controlled to perform laser processing according to the target processing speed.

2. The machining follow-up control method according to claim 1, characterized in that, After calculating the control parameters of the laser processing nozzle based on the servo control algorithm and the height error, the method further includes: Calculate feedforward data based on the slope calculation function and the current height data; The sum of the feedforward data and the control parameters is calculated to obtain the comprehensive control parameters. The step of adaptively optimizing the speed of the laser processing nozzle according to the control parameters to obtain the target processing speed specifically includes: The speed of the laser processing nozzle is adaptively optimized based on the comprehensive control parameters to obtain the target processing speed.

3. The machining follow-up control method according to claim 2, characterized in that, The feedforward data is represented as follows: in, This represents the feedforward gain parameter. This indicates the feedback height error for the current cycle. This indicates the nozzle height of the laser processing nozzle in the current cycle. This indicates the nozzle height of the laser processing nozzle in the previous cycle. This indicates the feedback height of the laser processing nozzle in the current cycle. This indicates the feedback height of the laser processing nozzle in the previous cycle. This represents the feedforward gain parameter.

4. The machining follow-up control method according to claim 1, characterized in that, The calculation of the control parameters of the laser processing nozzle based on the follow-up control algorithm and the height error specifically includes: A theoretical speed curve is generated based on the preset processing path; The current processing speed of the laser processing nozzle is obtained, and the current speed deviation is calculated based on the theoretical speed curve and the current processing speed. The current transition state of the laser processing nozzle is confirmed based on the current speed deviation; The gain parameters of the servo control algorithm are dynamically adjusted according to the current transition state to obtain an optimized servo control algorithm. The control parameters are calculated based on the optimized servo control algorithm and the current altitude data.

5. The machining follow-up control method according to claim 1, characterized in that, After performing adaptive optimization of the laser processing nozzle speed according to the control parameters to obtain the target processing speed, the method further includes: The target processing speed is optimized by using a follow-up speed planning algorithm to obtain the optimized target processing speed. The follow-up speed planning algorithm is a quadratic programming algorithm or a nonlinear programming algorithm.

6. The machining follow-up control method according to any one of claims 1 to 5, characterized in that, The servo control algorithm is expressed as follows: in, , , These represent the gain parameters of the servo control algorithm. This indicates the height error. This indicates that the error is integrated. This indicates that the rate of change of the error is calculated by differentiating the error. The gain parameter of the servo control algorithm High-frequency noise processing is performed based on a second-order Butterworth low-pass filter, wherein the response function of the high-frequency noise processing is expressed as: The transfer function for the high-frequency noise processing is expressed as: in, Indicates the cutoff frequency. This represents the complex frequency domain transfer function of a low-pass filter. Represents the frequency response function. Indicates the input signal, and , Indicates the real part ， Indicates the imaginary part.

7. A machining follow-up control device, characterized in that, include: An instruction receiving module for receiving processing instructions carrying a preset processing path; A nozzle activation module for activating a laser processing nozzle and controlling the laser processing nozzle to perform laser processing along the preset processing path; A current height acquisition module for real-time acquisition of the current height data of the laser processing nozzle during the laser processing process; A height error calculation module for calculating the height error based on the current height data and the preset height of the preset processing path; A module for calculating control parameters of the laser processing nozzle based on a follow-up control algorithm and the height error; An adaptive optimization module is used to adaptively optimize the speed of the laser processing nozzle according to the control parameters to obtain the target processing speed. A laser processing module for controlling the laser processing nozzle to perform laser processing according to the target processing speed.

8. The machining follow-up control device according to claim 7, characterized in that, The device further includes: A feedforward data calculation module for calculating feedforward data based on the slope calculation function and the current height data; A feedforward adjustment module is used to calculate the sum of the feedforward data and the control parameters to obtain the comprehensive control parameters; A control parameter calculation submodule is used to adaptively optimize the speed of the laser processing nozzle based on the comprehensive control parameters to obtain the target processing speed.

9. A processing apparatus, comprising a memory and a processor, characterized in that, The memory stores computer-readable instructions, and when the processor executes the computer-readable instructions, it implements the machining follow-up control method as described in any one of claims 1 to 6.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-readable instructions, which, when executed by a processor, implement the machining follow-up control method as described in any one of claims 1 to 6.

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