Industrial-grade general intelligent test hardware platform

Abstract

The invention relates to an industrial-grade general intelligent test hardware platform, which is characterized in that a traditional fixed function device is split into a plurality of independent detachable and replaceable function modules through modular design, so that the test requirements of various types of signals are flexibly met, free combination and emerging signal expansion are supported, and the problems of single function and expansibility are solved; a unified interface and a protocol adaptation layer are defined, one-button intelligent wiring is matched, the wiring process is simplified, manual errors are avoided, and the problems of interface disorder and operation complexity are solved; test parameters are automatically optimized based on an embedded intelligent control unit and an adaptive algorithm, multi-task parallel processing and real-time data analysis are supported, and efficiency and precision are greatly improved; a hierarchical open software system is constructed, a unified drive API is provided, multi-platform access, user-defined extension and cloud collaboration are supported, the limitation of closed software is broken, and the personalized and long-term development requirements of enterprises are met. The invention is suitable for the technical field of embedded product test systems.

Description

Technical Field

[0001] This invention relates to the field of embedded product testing system technology, and in particular to an industrial-grade general-purpose intelligent testing hardware platform. Background Technology

[0002] With the rapid development of electronic technology, various electronic devices are evolving towards higher integration and multi-functionality. Signal testing, as a key link in ensuring product performance and reliability, is experiencing explosive growth in demand. Currently, the types and complexity of test signals continue to rise, and the test scenarios faced by enterprises in actual production are becoming increasingly diversified. However, the signal architectures on the market generally suffer from prominent problems such as single functionality and poor adaptability. Most signal architectures are designed only for specific types of signals and lack compatibility with multiple signal types. This forces enterprises to purchase multiple test devices with different functions when facing mixed signal testing needs, increasing hardware procurement costs and occupying limited test space. More importantly, there is a lack of unified standards for existing signal external interface integrators. The interface protocols of devices from different manufacturers vary significantly. To cover multiple types of signal testing, enterprises often need to equip themselves with multiple dedicated interface converters or integrators, which not only further increases equipment purchase and maintenance costs but also significantly increases operational complexity. Testers need to frequently switch interfaces and manually configure parameters, which can easily lead to distorted test results due to wiring errors or improper parameter settings, directly affecting the product's factory quality and reliability. At the same time, as the complexity of test signals increases, the bottlenecks of traditional signal testing platforms in terms of hardware resource scheduling and data processing capabilities are becoming increasingly apparent.

[0003] The aforementioned problems collectively restrict the efficiency, accuracy, and intelligence level of signal testing. Especially in the production testing of high-end electronic equipment, the limitations of traditional signals can no longer meet the testing needs of enterprises for "high compatibility, high reliability, and high intelligence." Therefore, there is an urgent need for a multifunctional, highly compatible, easy-to-operate testing hardware platform that can overcome hardware bottlenecks, providing more reliable technical support for the quality control of electronic products. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide an industrial-grade general-purpose intelligent testing hardware platform.

[0005] The technical solution adopted in this invention is as follows: This invention includes several functional modules, a backplane bus interconnection module, and a core control module. The functional modules are physically isolated from each other and independently connected to the backplane bus interconnection module. The backplane bus interconnection module is connected to the functional modules through standardized high-speed connectors. A built-in protocol conversion chip automatically identifies the protocol type of the access device and converts it into an internally unified digital signal format, which is then transmitted to the core control module. The core control module includes an intelligent control and data processing unit and an open software architecture unit. The intelligent control and data processing unit automatically optimizes test parameters through a built-in machine learning model and adaptive algorithm, supporting multi-task parallel processing and real-time data analysis. The open software architecture unit provides a unified driver API and supports multi-platform access, custom extensions, and cloud collaboration, adapting to the personalized needs of enterprises and long-term technological evolution.

[0006] 1. Furthermore, several of the functional modules are detachable and replaceable, and the functional modules are interconnected through the backplane bus interconnection module to form a flexible combination of "functional decoupling and on-demand combination". The several functional modules specifically include: A. High voltage and current input / output module, specifically designed to handle high voltages above 50V and high currents above 1A, supporting high-power signal transmission without attenuation; it has built-in overvoltage clamping circuit and overcurrent fuse protection, and is connected to the front end through a high-voltage banana head interface, and the back end is interconnected with the high voltage signal acquisition and conversion module through the backplane bus interconnect module to realize a "input-protection-conversion" closed loop; B. Low-voltage current and communication signal input / output module, handling low voltage below 50V, small current below 1A, and serial communication signals. It adopts double-shielded wires and low-noise operational amplifiers to suppress EMI to ≤10mV; it has built-in UART, I2C, SPI and other protocol driver chips, supports baud rate adjustable from 1200bps to 115200bps, and connects to the front end through DB9 (RS232), RJ11 (RS485) and mini-USB (I2C / SPI) interfaces. It interacts with the low-voltage signal test and acquisition module through the backplane bus interconnect module. C. The digital input module, serving as a "signal bridge" between the product under test and the acquisition system, employs optocoupler isolation devices and supports a wide range of digital input signals from 3V to 24V. It connects to TTL level input terminals via a dry contact interface and outputs standardized switch status signals to the digital input signal test and acquisition module. D. Communication switching module, based on industrial-grade Ethernet switching chip, provides 8 independent RJ45 ports, compatible with industrial protocols such as Modbus TCP, CANopen, and Profinet, and realizes multi-protocol data format conversion through protocol conversion chip; E. High voltage and current signal acquisition and conversion module, which safely converts high voltage and current signals to low voltage test values ​​of 0~5V. It adopts Hall effect current sensor and voltage divider resistor network + isolation operational amplifier, with conversion accuracy of ±0.5%FS, isolation voltage ≥1500Vrms, and supports automatic AC / DC signal identification and range software configuration. F. Overvoltage and overcurrent protection module: Real-time monitoring of voltage, current and loop impedance of all modules, with a monitoring frequency ≥1kHz; Adopting a graded protection strategy—an alarm is triggered for minor overvoltage, and in the event of severe overvoltage / overcurrent or short circuit, the MOSFET bridge arm solid-state relay is activated within 0.1ms to cut off the power supply path, while simultaneously illuminating a red alarm light and recording the fault timestamp; G. Low-voltage signal source module, which provides stable DC 5V, 12V, and 24V voltages to the system, and suppresses ripple to ≤50mV through π-type filter circuit and shielded housing design, and supplies power to other modules through the backplane bus interconnect module; H. Switch signal test and acquisition module, which adopts high-speed optocoupler and edge trigger circuit, can detect fast switching signals with frequency ≥1kHz. The built-in EEPROM stores the timestamps and durations of the most recent 1000 switching state changes, and transmits the data to the core control module through the backplane bus interconnect module. I. Low voltage and current signal test and acquisition module, using a 24-bit Σ-Δ ADC and a low temperature drift reference source, achieves voltage measurement accuracy of ±0.1%FS and current measurement accuracy of ±0.2%FS, supports point-to-point testing of the power supply voltage of individual components, and prevents hidden faults; J. Signal output channel allocation module, using magnetic isolation chips or relay matrix, completely isolates the electrical connections between different output channels, and dynamically configures signal paths through software interface, supporting precise routing of up to 16 independent channels.

[0007] Furthermore, the backplane bus interconnect module is based on the low-latency, high-speed LVDS bus and adopts a standardized interface design, retaining three core physical interfaces: a general-purpose signal input interface (Type-S), a high-speed digital interface (Type-H), and a power and control interface (Type-P). All interfaces comply with unified electrical specifications. The protocol conversion chip implemented by the built-in FPGA automatically identifies the protocol type of the access device and converts it into a unified digital signal format within the device. A standardized integrator library is also provided, and all integrators adopt the Type-S / Type-H / Type-P specifications that match the device interfaces.

[0008] Furthermore, the general-purpose signal input interface Type-S adopts a standardized circular connector, supporting mixed access of voltage, current, and differential signals, and automatically switches signal paths internally through a relay matrix; the high-speed digital interface Type-H is based on the SFP+ / QSFP+ optical module interface specification, supports digital signal transmission at rates of 10M~400Gbps, and has a built-in signal shaping circuit to ensure long-distance transmission quality; the control interface Type-P has a unified DC 24V power input + I²C / SPI control bus, used for connecting external sensors or integrator control signals.

[0009] Furthermore, the backplane bus interconnection module also includes a one-button intelligent wiring unit. The one-button intelligent wiring unit includes an integrated panel, a touch screen mounted on the integrated panel, and the aforementioned physical interfaces. Each physical interface is equipped with an LED status indicator. By selecting the target test signal type via the touch screen, the relay matrix is ​​automatically driven to switch to the corresponding interface path, and the LED indicator of the target interface is illuminated. The integrated panel also has a built-in electronic tag. After connecting to the functional module, the model is automatically identified through the electronic tag, and the one-button intelligent wiring unit automatically loads the matching drive parameters to achieve "plug-in-identification-configuration", with the entire process completed in ≤3 seconds.

[0010] 2. Furthermore, the intelligent control and data processing unit, through an embedded intelligent control unit and adaptive algorithm, achieves automatic optimization of test parameters, parallel processing of multiple tasks, and real-time analysis of test data. Specific functions are as follows: a. Intelligent test parameter configuration: It has a built-in machine learning model trained based on historical test data, which can automatically identify the type of signal being tested and match the optimal test strategy without manual intervention. b. Multi-task parallel testing supports multi-threaded task scheduling based on RTOS real-time operating system, and can execute multiple types of tasks such as voltage monitoring, communication protocol parsing, and transient signal capture at the same time. The real-time performance between tasks is guaranteed by hardware interrupt mechanism to ensure the integrity of testing in complex scenarios. c. Real-time data processing and visualization: After the test data is transmitted to the core processing unit through the backplane bus interconnect module, it is preprocessed by the built-in DSP coprocessor, and then the host computer software developed based on the Qt framework is run by the main processor to display waveforms, spectrum, and statistical charts in real time. Users can directly mark abnormal points through the touch screen. The system automatically records timestamps and generates fault logs. Data can be exported to CSV / PDF format for easy subsequent analysis and traceability.

[0011] Finally, the specific architecture of the open software architecture unit is as follows: 1) The underlying driver and interface layer provides a unified device driver API, compatible with Windows / Linux / embedded RTOS systems, and supports the interaction of test data with external systems through REST API or OPC UA protocol, so as to achieve seamless integration of test data and production management; 2) Middleware and application layer: Built-in test script engine, users can quickly generate personalized test processes by dragging and dropping components through a graphical programming interface. It integrates machine learning toolkits such as TensorFlow Lite, allowing enterprises to upload historical failure data to train exclusive models. The device can call the model in real time to analyze the current test data, provide early warning of potential failure risks, and improve the level of intelligence in testing. 3) Cloud-based collaboration and data management system: Supports automatic uploading of test data to cloud servers. Enterprises can view test reports of multiple devices and compare historical trends through the web platform, and use big data analysis to optimize production processes, thereby realizing the value mining of test data and continuous improvement of the production process.

[0012] Compared with existing technologies, the beneficial effects of this invention are as follows: This invention, through modular design, breaks down traditional fixed-function devices into several independent, detachable, and replaceable functional modules, flexibly adapting to various signal testing needs and supporting free combination and expansion of emerging signals, thus solving the problems of single function and scalability; it defines a unified interface and protocol adaptation layer, coupled with one-click intelligent wiring, simplifying the wiring process, eliminating human error, and suppressing interference, overcoming the difficulties of cluttered interfaces and complex operation; based on an embedded intelligent control unit and adaptive algorithms, it automatically optimizes test parameters, supports multi-task parallel processing and real-time data analysis, significantly improving efficiency and accuracy compared to traditional manual settings and single-task modes; it constructs a layered open software system, providing a unified driver API and supporting multi-platform access, custom expansion, and cloud collaboration, breaking the limitations of closed software and meeting the personalized and long-term development needs of enterprises; through the hierarchical protection strategy of the overvoltage and overcurrent protection modules and the independent replaceable design of the modules, it ensures stable system operation and reduces maintenance costs, significantly enhancing reliability and safety. Attached Figure Description

[0013] Figure 1 This is the overall architecture diagram (hardware part) of the present invention; Figure 2 This is the overall architecture diagram (software part) of the present invention. Detailed Implementation

[0014] like Figure 1 and Figure 2As shown, this invention adopts a four-layer architecture of "core control layer - functional module layer - interface adaptation layer - software ecosystem layer". Each layer works together to achieve efficient testing, flexible expansion and intelligent analysis of multiple types of signals, and systematically solves the defects of existing technologies in terms of single function, chaotic interface, hardware bottleneck and software compatibility.

[0015] This invention comprises several functional modules, a backplane bus interconnection module, and a core control module. The functional modules are physically isolated from each other and independently connected to the backplane bus interconnection module. The backplane bus interconnection module connects to the functional modules via standardized high-speed connectors. A built-in protocol conversion chip automatically identifies the access device's protocol type and converts it into an internally unified digital signal format before transmitting it to the core control module. The core control module includes an intelligent control and data processing unit and an open software architecture unit. The intelligent control and data processing unit automatically optimizes test parameters through a built-in machine learning model and adaptive algorithm, supporting multi-task parallel processing and real-time data analysis. The open software architecture unit provides a unified driver API and supports multi-platform access, custom extensions, and cloud collaboration, adapting to enterprise-specific needs and long-term technological evolution.

[0016] In this embodiment, the platform constructs a highly flexible, highly reliable, and multi-functional signal testing system with full-scenario coverage through the refined division of labor and standardized interconnection of 10 independent functional modules (which users can add, remove, or replace as needed), combined with an anti-static housing and an intelligent collaborative mechanism. The anti-static housing is made of anti-static ABS + carbon fiber composite material (surface resistivity ≤10). 5 The signal is connected to the ground via a grounding wire (impedance ≤ 1Ω) to effectively shield the test signal from interference from external electrostatic fields (such as ±15kV of human body static electricity), ensuring the measurement accuracy of weak signals (such as μV-level sensor signals). The intelligent collaborative mechanism is that each functional module is interconnected through a backplane bus module (such as a bus protocol based on I²C / SPI) to achieve data interaction and power sharing. The core control unit (integrated in the inter-module communication logic) schedules the tasks of each module through a unified protocol (such as "Module 1 outputs high voltage → Module 5 converts to low voltage → Module 9 collects data" and "Module 3 collects switch status → Module 8 records status changes"), while monitoring the module status in real time (such as overvoltage protection triggering and power supply voltage abnormality) to ensure the overall reliability of the system and the continuity of the test process.

[0017] The 10 independent functional modules mentioned above are as follows: A. High-voltage and current input / output module, specifically designed to handle high voltages above 50V (up to 1000V) and high currents above 1A. It adopts thick copper foil PCB (copper thickness ≥3oz) and high-voltage ceramic insulation material. The internal circuit withstands voltage up to 1000V (DC), supporting high-power signal transmission without attenuation. It has built-in overvoltage clamping circuit (response time ≤1μs) and overcurrent fuse protection (operation threshold settable, typical value 1.2 times rated current). It connects to the front end through a high-voltage banana plug interface (withstand voltage ≥1000V), and the back end is interconnected with the high-voltage signal acquisition and conversion module through the backplane bus to realize the "input-protection-conversion" closed loop. B. Low-voltage, current, and communication signal input / output module: Handles low voltages below 50V (e.g., 3.3V / 5V / 12V), low currents below 1A, and serial communication signals (e.g., RS232 / RS485 / I2C / SPI). It employs double-shielded cables (inner shield grounded, outer anti-EMI coating) and low-noise operational amplifiers to suppress EMI to ≤10mV (typical value). It integrates UART, I2C, and SPI protocol driver chips, supporting adjustable baud rates from 1200bps to 115200bps. It connects to the front end via DB9 (RS232), RJ11 (RS485), and mini-USB (I2C / SPI) interfaces, and interacts with the low-voltage signal test and acquisition module via the backplane bus. C. The digital input module, serving as a "signal bridge" between the product under test and the acquisition system, uses optocoupler isolation devices (isolation voltage ≥2500Vrms) to support a wide range of digital input signals (such as TTL / CMOS levels) from 3V to 24V. It connects to TTL level input terminals via a dry contact interface (normally open / normally closed selectable) and outputs standardized switch status signals to the digital input signal test and acquisition module. D. Communication switching module: Constructs an information bridge between devices in the test system. Based on an industrial-grade Ethernet switching chip (supporting 10 / 100 / 1000Mbps auto-sensing), it provides 8 independent RJ45 ports (full-duplex communication, packet forwarding delay ≤10μs), and is compatible with industrial protocols such as Modbus TCP, CANopen, and Profinet. It achieves multi-protocol data format conversion through a protocol conversion chip. E. High-voltage current signal acquisition and conversion module, which safely down-converts high-voltage current signals to 0~5V low-voltage test values. It adopts Hall effect current sensor (range 0~50A) and voltage divider resistor network + isolation operational amplifier, with conversion accuracy of ±0.5%FS (full range), isolation voltage ≥1500Vrms, and supports automatic AC / DC signal identification and range software configuration. F. Overvoltage and overcurrent protection module: Real-time monitoring of voltage (resolution ±10mV), current (resolution ±1mA), and loop impedance (detection accuracy ±5%) of all modules, with a monitoring frequency ≥1kHz; Employing a graded protection strategy—an alarm is triggered for minor overvoltage (e.g., 110% of rated voltage); in case of severe overvoltage / overcurrent (e.g., 150% of rated value) or short circuit, the MOSFET bridge arm solid-state relay is activated within 0.1ms to cut off the power supply path, simultaneously illuminating a red alarm light and recording the fault timestamp, preventing equipment burnout and operator safety accidents, and ensuring long-term stable operation of the test system; G. Low-voltage signal source module provides stable DC 5V, 12V, and 24V voltages to the system (maximum output current ≥2A per channel, accuracy ±5% / ±3% / ±3%), and suppresses ripple to ≤50mV (peak-to-peak value) through π-type filter circuit (capacitor + inductor combination) and shielded housing design, and supplies power to other modules through backplane bus; H. Switch signal test and acquisition module, which adopts high-speed optocoupler (response time ≤0.1ms) and edge triggering circuit, can detect fast switching signals with frequency ≥1kHz. The built-in EEPROM stores the timestamps and durations of the most recent 1000 switching state changes (accuracy ±1ms), and transmits the data to the core control unit through the backplane bus. I. Low voltage and current signal test acquisition module, using a 24-bit Σ-Δ ADC (resolution ≥ 16 bits) and a low temperature drift reference source (temperature drift ≤ 5 ppm / ℃), achieves voltage measurement accuracy of ±0.1%FS (full scale) and current measurement accuracy of ±0.2%FS, supports point-to-point testing of the power supply voltage of individual components, and prevents hidden faults; J. Signal output channel allocation module, using magnetic isolation chip (isolation voltage ≥5000Vrms) or relay matrix (mechanical relay for high current signal, solid-state relay for low signal) to completely isolate the electrical connection between different output channels (crosstalk ≤1mV), and dynamically configure signal paths through software interface, supporting precise routing of up to 16 independent channels.

[0018] This invention breaks down the traditional integrated testing hardware platform into 10 independent, detachable, and replaceable functional modules, covering high-voltage and current input / output, low-voltage and current and communication signal input / output, switch input / output, communication switching, high-voltage and current signal acquisition and conversion, overvoltage and overcurrent protection, low-voltage signal source provision, switch signal test acquisition, low-voltage and current signal test acquisition, and signal output channel allocation. Each functional module focuses on a single type of signal or function. For example, the high-voltage and current input / output module handles high voltage signals above 50V and high current signals above 1A, while the low-voltage, current, and communication signal input / output module handles low voltage signals below 50V, low current signals below 1A, and serial communication signals. The modules are physically isolated and interconnected through the backplane bus interconnection module, each independently completing a specific task. Users can freely combine modules according to actual testing needs without replacing the entire device.

[0019] The backplane bus interconnect module adopts a low-latency, high-speed backplane bus based on LVDS (bidirectional transmission rate ≥10Gbps). All functional modules are connected to the backplane via standardized 20-pin high-speed connectors, achieving integrated transmission of multiple independent power supplies (12V / 5V / 3.3V), high-speed data communication (bidirectional 10Gbps), and global clock synchronization (deviation ≤1ns). The backplane integrates an electromagnetic shielding layer with a thickness of ≥0.2mm copper foil and absorbing material, effectively suppressing electromagnetic interference (EMI) during multi-module integration and ensuring the testing accuracy of high-frequency signals (such as GHz-level digital signals); PCIe is reserved. The system features a high-speed serial bus (Gen4×4) and universal expansion slots, supporting rapid access for future additions of millimeter-wave RF modules (e.g., 28GHz~60GHz band), optical signal modules, and other emerging signal types, ensuring the architecture's forward-looking nature. It adopts a standardized interface design, retaining three core physical interfaces: a general-purpose signal input interface (Type-S), a high-speed digital interface (Type-H), and a power and control interface (Type-P). All interfaces adhere to unified electrical specifications (e.g., impedance matching 50Ω / 100Ω, signal level LVCMOS / LVTTL). A built-in FPGA-implemented protocol conversion chip automatically identifies the protocol type of the access device (e.g., USB 2.0 / 3.0, I2C / SPI, RS485) and converts it to a unified digital signal format within the device. A standardized integrator library (including voltage probes, RF antennas, communication module adapters, etc.) is provided, with all integrators using Type-S / Type-H / Type-P specifications compatible with the device interfaces, eliminating the need for users to adapt to non-standard interfaces from different manufacturers.

[0020] In this invention, the general signal input interface Type-S adopts a standardized circular connector (such as an 8-pin waterproof Type-S interface), supporting mixed access of voltage (0-100V), current (0-5A), and differential signals (±5V differential range), and automatically switches the signal path internally through a relay matrix; the high-speed digital interface Type-H is based on the SFP+ / QSFP+ optical module interface specification (compatible with RJ45 electrical port), supports the transmission of digital signals (such as Ethernet, Fibre Channel) at rates of 10M~400Gbps, and has a built-in signal shaping circuit (equalizer + pre-emphasis) to ensure the quality of long-distance transmission; the control interface Type-P has a unified DC 24V power input (power ≥50W) + I²C / SPI control bus, used for connecting external sensors (such as temperature probes) or integrator control signals.

[0021] In this invention, the backplane bus interconnect module further includes a one-button intelligent wiring unit. This unit comprises an integrated panel, a touchscreen mounted on the integrated panel, and several physical interfaces. Each physical interface is equipped with an LED status indicator (green = normal connection, red = incorrect wiring) and a touch button. The user selects the target test signal type (e.g., "RF signal test") via the touchscreen. The system automatically drives the relay matrix to switch to the corresponding interface path and illuminates the LED indicator of the target interface. Simultaneously, after the integrator is inserted, the model is automatically identified via an electronic tag (e.g., an NFC chip), and the device automatically loads matching drive parameters (e.g., impedance, sampling rate), achieving "plug-in-identification-configuration," with the entire process completed in ≤3 seconds.

[0022] The intelligent control and data processing unit, through an embedded intelligent control unit and adaptive algorithms, achieves automatic optimization of test parameters, parallel processing of multiple tasks, and real-time analysis of test data. Its specific functions are as follows: a. Intelligent test parameter configuration: The built-in machine learning model (decision tree algorithm) trained based on historical test data can automatically identify the type of the signal under test (such as extracting voltage / frequency / duty cycle parameters through signal waveform features) and match the optimal test strategy (such as sampling rate = highest signal frequency × 10, threshold = mean ± 3σ). For example, when an unknown communication signal is connected, the device analyzes the spectrum characteristics through FFT and automatically determines that it is a USB 3.0 protocol (5Gbps rate), and sets the sampling rate ≥ 50GSa / s and the trigger condition to synchronization head detection. No manual experience is required to set parameters (such as traditional devices that rely on engineers to manually adjust the sampling rate), reducing test preparation time by more than 50% and improving the scientificity and accuracy of parameter settings. b. Multi-task parallel testing: The core control unit supports multi-threaded task scheduling based on an RTOS real-time operating system, enabling simultaneous execution of multiple tasks such as voltage monitoring (continuous sampling), communication protocol parsing (e.g., TCP / IP packet analysis), and transient signal capture (trigger-based recording). For example, when testing the electronic control system of a new energy vehicle, the device simultaneously acquires battery voltage (analog signal), CAN bus communication (digital signal), and IGBT module switching transients (pulse signal). Real-time performance (response delay ≤10μs) is ensured between tasks through a hardware interrupt mechanism, avoiding the bottleneck of traditional single-task processing and meeting the high-efficiency testing requirements of complex systems. c. Real-time data processing and visualization: After the test data is transmitted to the core processing unit via the backplane bus interconnect module, it is preprocessed by the DSP coprocessor (e.g., filtering, noise reduction), and then the main processor runs host computer software developed based on the Qt framework to display waveforms, spectra, and statistical charts (e.g., mean / variance / maximum value) in real time. Users can directly mark abnormal points (e.g., voltage surges) via the touch screen. The system automatically records timestamps and generates fault logs, supporting data export in CSV / PDF format for easy subsequent analysis and traceability.

[0023] In this invention, the open software architecture unit constructs a layered and open software system that supports multi-platform access, custom extensions, and cloud collaboration, breaking the limitations of traditional closed software. The specific architecture is as follows: 1) The underlying driver and interface layer: The underlying driver provides a unified API based on the POSIX standard, which is compatible with Windows / Linux / embedded RTOS systems. It supports the interaction of test data with external systems such as MES (Production Management System) and QMS through REST API or OPC UA protocol, so as to achieve seamless integration of test data and production management. 2) Middleware and application layer: Built-in Python / Lua script engine and graphical programming interface (similar to LabVIEW), allowing users to write personalized test processes (such as complex signal timing verification); integrates machine learning toolkits such as TensorFlow Lite, supports enterprises to upload historical fault data to train dedicated models, and the device can call the model in real time to analyze the current data, provide early warning of potential failure risks, and improve the level of intelligence in testing; 3) Cloud-based collaboration and data management: Test data is automatically uploaded to the cloud server (via 4G / 5G / Wi-Fi). Enterprises can view test reports of multiple devices (such as voltage pass rate statistics for batch products), compare historical trends (such as current drift analysis of a batch of products) through the web platform, and use big data analysis to optimize production processes (such as adjusting welding parameters to reduce contact resistance), thereby realizing the value mining of test data and continuous improvement of the production process.

[0024] This invention, through a modular, intelligent, and standardized multi-functional signal testing hardware platform design, combines a modular hardware architecture, unified interface standards, intelligent control technology, and an open software ecosystem. Compared to existing technologies, it provides manufacturing enterprises with a highly efficient, accurate, safe, and intelligent overall signal testing solution. Specific benefits include: reduced costs by decreasing the number of dedicated testing equipment required (e.g., a single device can now cover multiple signals compared to the previous method), lowering hardware procurement and maintenance costs; extended equipment lifespan due to modular design (single module damage can be replaced individually), further conserving resources; improved efficiency by simplifying wiring processes (one-click intelligent wiring), shortening test preparation time (intelligent parameter automatic configuration), and supporting multi-task parallel testing, resulting in an overall testing efficiency improvement of over 50%; controllable quality by ensuring product quality consistency and reducing defect rates through high-precision measurement capabilities and intelligent fault diagnosis (e.g., switch status recording and component-level voltage diagnosis); cloud-based data analysis supporting production process optimization and improving product reliability; and enhanced adaptability by meeting diverse testing needs of enterprises (e.g., traditional electronics manufacturing and emerging automotive-grade chip testing) through its full-type signal compatibility and open software architecture, helping enterprises maintain a competitive edge in technological iteration.

[0025] Finally, it should be emphasized that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An industrial-grade general-purpose intelligent testing hardware platform, characterized in that: The system comprises several functional modules, a backplane bus interconnect module, and a core control module. The functional modules are physically isolated from each other and independently connected to the backplane bus interconnect module. The backplane bus interconnect module connects to the functional modules via standardized high-speed connectors. A built-in protocol conversion chip automatically identifies the access device's protocol type and converts it into an internally unified digital signal format before transmitting it to the core control module. The core control module includes an intelligent control and data processing unit and an open software architecture unit. The intelligent control and data processing unit automatically optimizes test parameters through a built-in machine learning model and adaptive algorithms, supporting multi-task parallel processing and real-time data analysis. The open software architecture unit provides a unified driver API and supports multi-platform access, custom extensions, and cloud collaboration, adapting to individual enterprise needs and long-term technological evolution.

2. The industrial-grade general-purpose intelligent testing hardware platform according to claim 1, characterized in that: Several functional modules are detachable and replaceable, and are interconnected via the backplane bus interconnection module to form a flexible combination of "functional decoupling and on-demand combination". The several functional modules specifically include... A. High voltage and current input / output module, specifically designed to handle high voltages above 50V and high currents above 1A, supporting high-power signal transmission without attenuation; it has a built-in overvoltage clamping circuit and overcurrent fuse protection, and is connected to the front end through a high-voltage banana head interface. The back end is interconnected with the high voltage signal acquisition and conversion module through the backplane bus interconnection module to realize a "input-protection-conversion" closed loop. B. Low-voltage current and communication signal input / output module, handling low voltage below 50V, small current below 1A, and serial communication signals. It adopts double-shielded wires and low-noise operational amplifiers to suppress EMI to ≤10mV; it has built-in UART, I2C, SPI and other protocol driver chips, supports baud rate adjustable from 1200bps to 115200bps, and connects to the front end through DB9 (RS232), RJ11 (RS485) and mini-USB (I2C / SPI) interfaces. It interacts with the low-voltage signal test and acquisition module through the backplane bus interconnect module. C. The digital input module, serving as a "signal bridge" between the product under test and the acquisition system, uses optocoupler isolation devices and supports a wide range of digital input signals from 3V to 24V. It connects to TTL level input terminals through a dry contact interface and outputs standardized switch status signals to the digital signal test and acquisition module. D. Communication switching module, based on industrial-grade Ethernet switching chip, provides 8 independent RJ45 ports, compatible with industrial protocols such as ModbusTCP, CANopen, and Profinet, and realizes multi-protocol data format conversion through protocol conversion chip; E. High voltage and current signal acquisition and conversion module, which safely converts high voltage and current signals to 0~5V low voltage test values. It adopts Hall effect current sensor and voltage divider resistor network + isolation operational amplifier, with conversion accuracy of ±0.5%FS, isolation voltage ≥1500Vrms, and supports automatic AC / DC signal identification and range software configuration. F. Overvoltage and overcurrent protection module: Real-time monitoring of voltage, current and circuit impedance of all modules, with a monitoring frequency ≥1kHz; Adopting a graded protection strategy—an alarm is triggered for minor overvoltage, and in the event of severe overvoltage / overcurrent or short circuit, the MOSFET bridge arm solid-state relay is activated within 0.1ms to cut off the power supply path, while simultaneously illuminating a red alarm light and recording the fault timestamp; G. Low-voltage signal source module provides stable DC 5V, 12V, and 24V voltages to the system, and suppresses ripple to ≤50mV through π-type filter circuit and shielded housing design. It also supplies power to other modules through the backplane bus interconnect module. H. Switch signal test and acquisition module, which adopts high-speed optocoupler and edge trigger circuit, can detect fast switching signals with frequency ≥1kHz. The built-in EEPROM stores the timestamps and durations of the most recent 1000 switching state changes, and transmits the data to the core control module through the backplane bus interconnect module. I. Low voltage and current signal test and acquisition module, using a 24-bit Σ-Δ ADC and a low temperature drift reference source, achieves voltage measurement accuracy of ±0.1%FS and current measurement accuracy of ±0.2%FS, supports point-to-point testing of the power supply voltage of individual components, and prevents hidden faults; J. Signal output channel allocation module, using magnetic isolation chips or relay matrix, completely isolates the electrical connections between different output channels, and dynamically configures signal paths through software interface, supporting precise routing of up to 16 independent channels.

3. An industrial-grade general-purpose intelligent testing hardware platform as described in claim 1, characterized in that: The backplane bus interconnect module is based on the low-latency, high-speed LVDS bus and adopts a standardized interface design, retaining three core physical interfaces: a general-purpose signal input interface (Type-S), a high-speed digital interface (Type-H), and a power and control interface (Type-P). All interfaces comply with unified electrical specifications. The protocol conversion chip implemented by the built-in FPGA automatically identifies the protocol type of the access device and converts it into a unified digital signal format within the device. A standardized integrator library is also provided, and all integrators adopt the Type-S / Type-H / Type-P specifications that match the device interfaces.

4. The industrial-grade general-purpose intelligent testing hardware platform according to claim 3, characterized in that: The general signal input interface Type-S adopts a standardized circular connector, supports mixed access of voltage, current and differential signals, and automatically switches the signal path through a relay matrix internally; the high-speed digital interface Type-H is based on the SFP+ / QSFP+ optical module interface specification, supports digital signal transmission at a rate of 10M~400Gbps, and has a built-in signal shaping circuit to ensure long-distance transmission quality. The control interface Type-P features a unified DC 24V power input and an I²C / SPI control bus, used for connecting external sensors or integrator control signals.

5. The industrial-grade general-purpose intelligent testing hardware platform according to claim 3, characterized in that: The backplane bus interconnection module also includes a one-button intelligent wiring unit. The one-button intelligent wiring unit includes an integrated panel, a touch screen mounted on the integrated panel, and several physical interfaces. Each physical interface is equipped with an LED status indicator. By selecting the target test signal type through the touch screen, the relay matrix is ​​automatically driven to switch to the corresponding interface path and illuminate the LED indicator of the target interface. The integrated panel also has a built-in electronic tag. After connecting to the functional module, the model is automatically identified through the electronic tag. The one-button intelligent wiring unit automatically loads the matching drive parameters to achieve "plug-in-identification-configuration", with the entire process completed in ≤3 seconds.

6. The industrial-grade general-purpose intelligent testing hardware platform according to claim 1, characterized in that: The intelligent control and data processing unit, through an embedded intelligent control unit and adaptive algorithms, achieves automatic optimization of test parameters, parallel processing of multiple tasks, and real-time analysis of test data. Its specific functions are as follows: a. Intelligent test parameter configuration: It has a built-in machine learning model trained based on historical test data, which can automatically identify the type of signal being tested and match the optimal test strategy without manual intervention. b. Multi-task parallel testing supports multi-threaded task scheduling based on RTOS real-time operating system, and can execute multiple types of tasks such as voltage monitoring, communication protocol parsing, and transient signal capture at the same time. The real-time performance between tasks is guaranteed by hardware interrupt mechanism to ensure the integrity of testing in complex scenarios. c. Real-time data processing and visualization: After the test data is transmitted to the core processing unit through the backplane bus interconnect module, it is preprocessed by the built-in DSP coprocessor, and then the host computer software developed based on the Qt framework is run by the main processor to display waveforms, spectrum, and statistical charts in real time. Users can directly mark abnormal points through the touch screen. The system automatically records timestamps and generates fault logs. Data can be exported to CSV / PDF format for easy subsequent analysis and traceability.

7. The industrial-grade general-purpose intelligent testing hardware platform according to claim 1, characterized in that: The specific architecture of the open software architecture unit is as follows. 1) The underlying driver and interface layer provides a unified device driver API, compatible with Windows / Linux / embedded RTOS systems, and supports the interaction of test data with external systems through REST API or OPC UA protocol, so as to achieve seamless integration of test data and production management; 2) Middleware and application layer: Built-in test script engine, users can quickly generate personalized test processes by dragging and dropping components through a graphical programming interface. It integrates machine learning toolkits such as TensorFlow Lite, allowing enterprises to upload historical failure data to train exclusive models. The device can call the model in real time to analyze the current test data, provide early warning of potential failure risks, and improve the level of intelligence in testing. 3) Cloud-based collaboration and data management system: Supports automatic uploading of test data to cloud servers. Enterprises can view test reports of multiple devices and compare historical trends through the web platform, and use big data analysis to optimize production processes, thereby realizing the value mining of test data and continuous improvement of the production process.

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