Transfer device and transfer method of light-emitting device
By setting a accommodating structure and moving parts on the transfer assembly, the problem of positional offset of Mini LEDs or Micro-LEDs during the transfer process is solved, enabling the pickup and position correction of off-center light-emitting devices, thereby improving the transfer yield and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHENGDU VISTAR OPTEOLECTRONICS CO LTD
- Filing Date
- 2024-11-13
- Publication Date
- 2026-05-15
AI Technical Summary
Mini LEDs or Micro-LEDs may experience positional shifts during the transfer process, leading to pick-up misalignment or failure to pick up, thus reducing transfer yield.
Design a light-emitting device transfer device, comprising a base and a transfer component. A receiving structure is provided at the end of the transfer component away from the base. A movable part can rotate within the receiving structure to adsorb the light-emitting device and drive it to the target position under the action of gravity. By setting the receiving structure and the movable part on the transfer component, the picking up and position correction of the off-center light-emitting device can be realized.
This improved the transfer yield of light-emitting devices, avoided bonding failures, and enhanced the stability and reliability of the transfer process.
Smart Images
Figure CN122054780A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display device manufacturing technology, and more specifically, to a transfer device and method for a light-emitting device. Background Technology
[0002] With the development of display device manufacturing technology, Mini LEDs and Micro-LEDs are widely used due to their superior advantages in brightness, resolution, contrast, energy consumption, lifespan, response speed and thermal stability.
[0003] However, during the transfer process, some Mini LEDs or Micro-LEDs may shift in position, resulting in problems such as being unable to be picked up or being picked up off-center, thus reducing the transfer yield. Summary of the Invention
[0004] To overcome the aforementioned shortcomings in the prior art, the purpose of this application is to provide a transfer device for a light-emitting device, the transfer device comprising:
[0005] Base;
[0006] A transfer assembly located on one side of the base, wherein a receiving structure is provided at the end of the transfer assembly away from the base;
[0007] The transfer assembly further includes a movable component disposed within the accommodating structure. The movable component is rotatable within a range defined by the accommodating structure. The movable component is used to adsorb the light-emitting device and drive the light-emitting device to rotate to the target position under the gravity of the light-emitting device.
[0008] In one possible implementation, the movable component is elastic;
[0009] Preferably, the material of the moving part includes polydimethylsiloxane.
[0010] In one possible implementation, the transfer component includes a protrusion located at one end of the receiving structure away from the base, the protrusion projecting toward a center position near the movable member, the protrusion being used to confine the movable member within the receiving structure.
[0011] In one possible implementation, the shape of the movable component includes a sphere;
[0012] The protrusion forms a receiving opening on the side of the receiving structure away from the base, and the diameter of the receiving opening is smaller than the diameter of the movable part.
[0013] In one possible implementation, the transfer component further includes a fixing component for fixing the movable component.
[0014] In one possible implementation, the material of the transfer component includes a rigid material;
[0015] Preferably, the material of the transfer component includes silicon dioxide or aluminum oxide.
[0016] In one possible implementation, the moving part is adhesive.
[0017] Another object of this application is to provide a method for transferring a light-emitting device, wherein the method uses the light-emitting device transfer apparatus provided in this application to transfer the light-emitting device, and the method includes:
[0018] The transfer device is controlled to move closer to the temporary substrate on which the light-emitting device is disposed, so that the transfer component comes into contact with the light-emitting device;
[0019] The transfer device is controlled to move away from the temporary substrate, so that the transfer component drives the light-emitting device to detach from the temporary substrate, and the movable part drives the light-emitting device to rotate to the target position under the gravity of the light-emitting device.
[0020] The transfer component is controlled to transfer the light-emitting device onto the target substrate.
[0021] In one possible implementation, the step of picking up the corresponding light-emitting device on the temporary substrate via the transfer component includes:
[0022] The transfer component is controlled to move closer to the temporary substrate, causing the movable part to deform so as to adsorb the light-emitting device on the temporary substrate.
[0023] In one possible implementation, the adhesion between the active component and the light-emitting device is less than the adhesion between the conductive adhesive on the target substrate and the light-emitting device.
[0024] Compared with the prior art, this application has the following beneficial effects:
[0025] This application provides a transfer device and method for light-emitting devices. By setting a receiving structure at the end of the transfer component away from the base and placing a movable part inside the receiving structure, the movable part moves the light-emitting device to the target position under the gravity of the light-emitting device. In this way, during the transfer process of the light-emitting device, not only can the misaligned light-emitting device be picked up, but the position of the misaligned light-emitting device can also be corrected, thereby improving the transfer yield and avoiding bonding failure of the light-emitting device. Attached Figure Description
[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0027] Figure 1 This is a schematic diagram of the transfer process of light-emitting devices in the prior art;
[0028] Figure 2 This is one of the structural schematic diagrams of the transfer device for the light-emitting device provided in the embodiments of this application;
[0029] Figure 3 This is one of the schematic diagrams illustrating the transfer process of the light-emitting device provided in the embodiments of this application;
[0030] Figure 4 A second schematic diagram of the structure of the transfer device for the light-emitting device provided in the embodiments of this application;
[0031] Figure 5 A second schematic diagram illustrating the transfer process of the light-emitting device provided in an embodiment of this application;
[0032] Figure 6 The third schematic diagram of the transfer process of the light-emitting device provided in the embodiments of this application;
[0033] Figure 7 This is the third schematic diagram of the structure of the transfer device for the light-emitting device provided in the embodiments of this application;
[0034] Figure 8 Fourth schematic diagram of the structure of the transfer device for the light-emitting device provided in the embodiments of this application;
[0035] Figure 9 A schematic flowchart illustrating the transfer method of the light-emitting device provided in the embodiments of this application;
[0036] Figure 10 This is the fourth schematic diagram of the transfer process of the light-emitting device provided in the embodiments of this application.
[0037] Icons: 100-Base; 200-Transfer assembly; 210-Accommodation structure; 220-Moving part; 211-Protrusion; 230-Fixing part; 300-Light-emitting device; 400-Temporary substrate; 500-Target substrate. Detailed Implementation
[0038] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0039] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0040] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0041] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0042] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.
[0043] The inventor discovered through research that... (Please refer to...) Figure 1 During the transfer of the light-emitting device 300' (such as a Mini LED or Micro-LED), the transfer component 200' can be used to pick up the light-emitting device 300' located in its normal position on the temporary substrate 400' and transfer the light-emitting device 300' to the target substrate 500'. However, for some light-emitting devices 300' with positional offset, the transfer component 200' may pick up the misaligned device or fail to pick it up successfully, causing the light-emitting device 300' to deviate from its electrical connection position during the bonding process, thus preventing the light-emitting device 300' from emitting light normally.
[0044] In view of this, this embodiment provides a solution that can solve the above problems. The solution provided in this embodiment will be described in detail below.
[0045] Please refer to Figure 2 , Figure 2 This is a possible structural schematic diagram of the light-emitting device transfer device provided in this embodiment. The light-emitting device transfer device may include a base 100 and a transfer component 200. The transfer component 200 can be used to pick up the light-emitting device 300 on the temporary substrate 400 and transfer the light-emitting device 300 to the target substrate 500.
[0046] The transfer component 200 can be located on one surface of the base 100, and there can be multiple transfer components 200 arranged at intervals. Each transfer component 200 can pick up a corresponding light-emitting device 300 on the temporary substrate 400.
[0047] It should be noted that, Figure 2 Only two transfer components 200 are shown in the figure, but in practical applications, the transfer device of the light-emitting device may include more transfer components.
[0048] Please refer to Figure 3 The orthographic projection of the transfer component 200 on the temporary substrate 400 can completely cover the orthographic projection of the light-emitting device 300 (including the light-emitting device 300 in the normal position and the light-emitting device 300 with positional deviation) on the temporary substrate 400. In this way, the transfer component 200 can not only pick up the light-emitting device 300 in the normal position, but also pick up the light-emitting device 300 with positional deviation.
[0049] Each transfer component 200 is provided with a receiving structure 210 at the end away from the base 100. The transfer component 200 may also include a movable part 220 disposed within the receiving structure 210. The movable part 220 can rotate within the range defined by the receiving structure 210, and the movable part 220 can be used to adsorb the light-emitting device 300, and drive the light-emitting device 300 to rotate to the target position under the action of gravity.
[0050] In this embodiment, the movable component 220 can be placed within the accommodating structure 210 to pick up the light-emitting device 300. The light-emitting device 300 picked up by the movable component 220 can be either a light-emitting device 300 with a positional offset or a light-emitting device 300 without a positional offset. When the light-emitting device 300 picked up by the movable component 220 has a positional offset, the movable component 220 can rotate the light-emitting device 300 to the target position under the action of gravity, thereby correcting the position of the light-emitting device 300.
[0051] Please refer to Figure 4The movable part 220 can drive the light-emitting device 300 to rotate to the straight line where the central axis of the transfer component is located under the action of gravity (as shown by the dotted line in the figure).
[0052] The accommodating structure 210 can be obtained through an etching process.
[0053] Specifically, when transferring the light-emitting device 300 through the transfer component 200, multiple light-emitting devices of different colors can be transferred simultaneously. The colors of the light-emitting devices include, but are not limited to, red, green, and blue.
[0054] Based on the above design, by setting a receiving structure 210 at the end of the transfer component 200 away from the base 100 and placing the movable part 220 inside the receiving structure 210, the movable part 220 can move the light-emitting device 300 to the target position under the gravity of the light-emitting device 300. In this way, during the transfer of the light-emitting device 300, not only can the misaligned light-emitting device 300 be picked up, but the position of the misaligned light-emitting device 300 can also be corrected, thereby improving the transfer yield and avoiding bonding failure of the light-emitting device 300.
[0055] In one possible implementation, the movable part 220 is elastic.
[0056] In this embodiment, please refer to Figure 5 When the transfer component 200 picks up the light-emitting device 300, it can be controlled to move closer to the light-emitting device 300. After the movable part 220 contacts the light-emitting device 300, since the movable part 220 is elastic, it can be pressed down further to deform the movable part 220, thereby better wrapping or adhering to the surface of the light-emitting device 300 and sticking to the light-emitting device 300. In this way, the transfer component 200 can pick up the light-emitting device 300 with positional displacement. In addition, by setting the material of the movable part 220 to be an elastic material, it can also adapt to light-emitting devices 300 of different shapes and sizes, and control the pressing intensity during the pressing process to avoid damaging the light-emitting device 300.
[0057] Specifically, during the pressing process of the movable part 220, the movable part 220 deforms, which can increase the contact area with the light-emitting device 300, thereby enhancing the adsorption force on the light-emitting device 300 and preventing damage to the light-emitting device 300.
[0058] After picking up the light-emitting device 300, the transfer component 200 can be controlled to move away from the light-emitting device 300, so that the movable part 220 can restore its deformation. In this way, the movable part 220 can drive the light-emitting device 300 to rotate under the action of gravity.
[0059] The material of the movable part 220 can be an adhesive, and preferably, the material of the movable part 220 can include polydimethylsiloxane (PDMS).
[0060] Polydimethylsiloxane has good hydrophobicity, and the inner wall of the accommodating structure 210 can also be made into a hydrophobic structure. In this way, the adhesion between the moving part 220 and the accommodating structure 210 can be effectively reduced, ensuring that the moving part 220 can rotate in the accommodating structure 210.
[0061] In one possible implementation, please refer again. Figure 1 The transfer assembly 200 may include a protrusion 211 located at one end of the receiving structure 210 away from the base 100. The protrusion 211 may protrude toward the center of the movable member 220 and contact the movable member 220. The protrusion 211 may be used to confine the movable member 220 within the receiving structure 210.
[0062] In this embodiment, a protrusion 211 is provided on the side of the accommodating structure 210 away from the substrate. The protrusion 211 can contact the movable member 220, and the shape of the protrusion 211 can be the same as the shape of the movable member 220. The size of the protrusion 211 can be equal to or slightly smaller than the size of the movable member 220. In this way, it can be ensured that the movable member 220 can be located in the accommodating structure 210 and will not detach during the transfer of the light-emitting device 300.
[0063] For example, when the movable part 220 is spherical, the accommodating opening formed by the protrusion 211 on the side away from the base 100 is circular, and the diameter of the circle may be equal to or slightly smaller than the diameter of the movable part 220.
[0064] In addition, the shape of the accommodating structure 210 can be the same as that of the movable part 220, and the size of the accommodating structure 210 can be larger than that of the movable part 220. In this way, the inner wall of the accommodating structure 210 can not contact the movable part 220, thereby reducing the adhesion between the movable part 220 and the accommodating structure 210, which is beneficial for the movable part 220 to rotate within the accommodating structure 210.
[0065] In one possible implementation, the shape of the active part 220 may include a sphere.
[0066] The protrusion 211 can form a receiving opening on the side of the receiving structure 210 away from the base 100, and the diameter of the receiving opening can be smaller than the diameter of the movable part 220.
[0067] In this embodiment, when the movable part 220 is spherical, the accommodating structure 210 can be hemispherical, and the diameter of the movable part 220 can be smaller than the diameter of the accommodating structure 210. The accommodating opening can be circular, and the diameter of the circle can be smaller than the diameter of the movable part 220.
[0068] Please refer to Figure 6 When a light-emitting device 300 without positional misalignment is adsorbed onto the surface of the movable component 220, the movable component 220 can remain stationary under the weight of the light-emitting device 300, maintaining its original position. When a light-emitting device 300 with positional misalignment is adsorbed onto the surface of the movable component 220, the movable component 220 can rotate under the weight of the light-emitting device 300, thereby moving the light-emitting device 300 to its lowest position and correcting its position. This significantly improves the transfer success rate and yield of the light-emitting device 300, and reduces the scrap rate caused by positional misalignment.
[0069] It should be noted that when the movable part 220 becomes stuck due to friction or error, and cannot rotate normally under the gravity of the light-emitting device 300, the movable part 220 can be vibrated to allow it to rotate again.
[0070] In one possible implementation, the transfer component 200 may further include a fixing component 230, which can be used to fix the movable component 220.
[0071] In this embodiment, when the movable component 220 moves the light-emitting device 300 to the target position, the movable component 220 can be fixed by the fixed component 230 to prevent the movable component 220 from shaking. In this way, the position of the light-emitting device 300 can be stabilized, reducing the risk of offset or misalignment, avoiding bonding failure, and improving the bonding success rate.
[0072] For example, in one instance, please refer to Figure 7 The fixed component 230 can be located within the accommodating structure 210. When the movable component 220 needs to move the light-emitting device 300 to the target position, the fixed component 230 located above the movable component 220 does not operate, and the fixed component 230 may not contact the movable component 220. After the movable component 220 picks up the light-emitting device 300 and performs position correction on the light-emitting device 300, the fixed component 230 located above the movable component 220 can extend downward, contact and abut against the movable component 220, restricting the rotation of the movable component 220, thereby fixing the movable component 220.
[0073] For example, in another example, please refer to Figure 8The fixed components 230 can be located on both sides of the movable component 220. When the movable component 220 needs to move the light-emitting device 300 to the target position, the fixed components 230 located on both sides of the movable component 220 can clamp the movable component 220 from both sides to prevent the movable component 220 from falling off, but the movable component 220 can move within the accommodating structure 210 formed by the fixed components 230. After the movable component 220 picks up the light-emitting device 300 and corrects its position, the fixed components 230 located on both sides of the movable component 220 can simultaneously move towards the movable component 220 to reduce the space of the accommodating structure 210, further abut against the movable component 220, restrict the rotation of the movable component 220, and thus fix the movable component 220.
[0074] In one possible implementation, the material of the transfer component 200 may include a rigid material.
[0075] Preferably, the material of the transfer component 200 may include silicon dioxide (SiO2) or aluminum oxide (Al2O3).
[0076] Compared to existing technologies that use polydimethylsiloxane (PDMS) as the material for the transfer component 200, this embodiment uses a rigid material for the transfer component 200. This reduces the shrinkage deformation of the transfer component 200, minimizing offset caused by bending or twisting of the material itself during pickup and transfer, and improving the pickup stability of the light-emitting device 300. Simultaneously, it also makes the transfer component 200 less prone to deformation or damage during long-term use, thus ensuring the long-term stability and reliability of the device.
[0077] In one possible implementation, the active part 220 is adhesive.
[0078] In this embodiment, the material of the movable part 220 can be an adhesive material, so that the light-emitting device 300 can be directly bonded to the movable part 220 during the process of picking up the light-emitting device 300, and the pressure and damage to the surface of the light-emitting device 300 can be reduced.
[0079] This embodiment also provides a method for transferring a light-emitting device. The method can use the light-emitting device transfer apparatus provided in this application to transfer the light-emitting device 300. Please refer to... Figure 9 The method for transferring the light-emitting device may include the following steps.
[0080] Step S110: Control the transfer device to move closer to the temporary substrate 400 on which the light-emitting device 300 is disposed, so that the transfer component 200 comes into contact with the light-emitting device 300.
[0081] In this embodiment, the transfer component 200 can be controlled to move toward the temporary substrate 400, so that the moving part 220 of the transfer component 200 contacts the light-emitting device 300 and picks up the light-emitting device 300 on the temporary substrate 400, including the light-emitting device 300 that has been misaligned on the temporary substrate 400.
[0082] Step S120: Control the transfer device to move away from the temporary substrate 400, so that the transfer component 200 drives the light-emitting device 300 to detach from the temporary substrate 400, and the movable component 220 drives the light-emitting device 300 to rotate to the target position under the gravity of the light-emitting device 300.
[0083] In this embodiment, when the movable component 220 picks up the light-emitting device 300, the transfer component 200 can be controlled to move away from the temporary substrate 400, so that the light-emitting device 300 is separated from the temporary substrate 400.
[0084] If the light-emitting device 300 picked up by the movable part 220 is a misaligned light-emitting device 300, the movable part 220 can rotate under the gravity of the light-emitting device 300 and move the light-emitting device 300 to the target position. In this way, the position of the misaligned light-emitting device 300 can be corrected by the rotation of the movable part 220, so that the light-emitting device 300 can be transferred to a suitable position on the target substrate 500.
[0085] Step S130: Control the transfer component 200 to transfer the light-emitting device 300 onto the target substrate 500.
[0086] In this embodiment, please refer to Figure 10 After the light-emitting device 300 is moved to the target position, the transfer component 200 can be moved above the target substrate 500, and then the transfer component 200 is moved toward the target substrate 500 until the light-emitting device 300 contacts the conductive adhesive on the target substrate 500. At this time, the bonding of the light-emitting device 300 begins. After the bonding of the light-emitting device 300 is completed, the transfer component 200 is removed.
[0087] In the above design, during the process of transferring the light-emitting device 300 to the target substrate 500, the light-emitting device 300 on the temporary substrate 400 is picked up by the transfer component 200, and the position of the light-emitting device 300 is corrected by the moving part 220, which can improve the transfer yield and avoid bonding failure of the light-emitting device 300.
[0088] In one possible implementation, in step S110, when the transfer component 200 picks up the corresponding light-emitting device 300 on the temporary substrate 400, the transfer component 200 can be controlled to move towards the temporary substrate 400, so that the movable component 220 deforms to adsorb the light-emitting device 300 on the temporary substrate 400.
[0089] In this embodiment, please refer again. Figure 5 Because the movable component 220 is elastic, it can deform when picking up the light-emitting device 300 on the temporary substrate 400, increasing its contact area with the light-emitting device 300, thereby increasing adhesion or adsorption force and enabling the movable component 220 to be tightly bonded to the light-emitting device 300 on the temporary substrate 400. Even for light-emitting devices 300 that are misaligned, the deformation of the movable component 220 can allow it to adhere to the surface of the movable component 220.
[0090] After picking up the light-emitting device 300, the transfer component 200 can be controlled to move away from the temporary substrate 400, so that the moving part 220 gradually returns to its original shape and can rotate under the gravity of the light-emitting device 300, driving the light-emitting device 300 to the target position, so as to ensure that the light-emitting device 300 will not be misaligned on the target substrate 500.
[0091] In one possible implementation, the adhesion force between the movable part 220 and the light-emitting device 300 is less than the adhesion force between the conductive adhesive on the target substrate 500 and the light-emitting device 300. This ensures that the light-emitting device 300 can detach from the movable part 220 during the bonding process, reducing the risk of damage to the light-emitting device 300.
[0092] In summary, the embodiments of this application provide a transfer device and method for light-emitting devices. By setting a receiving structure at the end of the transfer component away from the base and placing the movable part inside the receiving structure, the movable part drives the light-emitting device to the target position under the gravity of the light-emitting device. In this way, during the transfer process of the light-emitting device, not only can the misaligned light-emitting device be picked up, but the position of the misaligned light-emitting device can also be corrected, thereby improving the transfer yield and avoiding bonding failure of the light-emitting device.
[0093] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0094] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.
Claims
1. A transfer device for a light-emitting device, characterized in that, include: Base; A transfer assembly located on one side of the base, wherein a receiving structure is provided at the end of the transfer assembly away from the base; The transfer assembly further includes a movable component disposed within the accommodating structure. The movable component is rotatable within a range defined by the accommodating structure. The movable component is used to adsorb the light-emitting device and drive the light-emitting device to rotate to the target position under the gravity of the light-emitting device.
2. The transfer device for the light-emitting device according to claim 1, characterized in that, The movable component is elastic; Preferably, the material of the moving part includes polydimethylsiloxane.
3. The transfer device for the light-emitting device according to claim 1, characterized in that, The transfer assembly includes a protrusion located at one end of the receiving structure away from the base, the protrusion protruding toward the center of the movable member, the protrusion being used to confine the movable member within the receiving structure.
4. The transfer device for the light-emitting device according to claim 3, characterized in that, The shape of the movable component includes a sphere; The protrusion forms a receiving opening on the side of the receiving structure away from the base, and the diameter of the receiving opening is smaller than the diameter of the movable part.
5. The transfer device for the light-emitting device according to claim 1, characterized in that, The transfer assembly also includes a fixing component for fixing the movable component.
6. The transfer device for the light-emitting device according to claim 1, characterized in that, The transfer component is made of rigid materials; Preferably, the material of the transfer component includes silicon dioxide or aluminum oxide.
7. The transfer device for the light-emitting device according to claim 1, characterized in that, The movable part is adhesive.
8. A method for transferring light-emitting devices, characterized in that, The light-emitting device is transferred using the transfer device of any one of claims 1-7, the method comprising: The transfer device is controlled to move closer to the temporary substrate on which the light-emitting device is disposed, so that the transfer component comes into contact with the light-emitting device; The transfer device is controlled to move away from the temporary substrate, so that the transfer component drives the light-emitting device to detach from the temporary substrate, and the movable part drives the light-emitting device to rotate to the target position under the gravity of the light-emitting device. The transfer component is controlled to transfer the light-emitting device onto the target substrate.
9. The method for transferring light-emitting devices according to claim 8, characterized in that, After the step of controlling the transfer device to move closer to the temporary substrate on which the light-emitting device is disposed, so that the transfer assembly contacts the light-emitting device, the method further includes: The transfer component is controlled to move closer to the temporary substrate, causing the movable part to deform so as to adsorb the light-emitting device on the temporary substrate.
10. The method for transferring light-emitting devices according to claim 8, characterized in that, The adhesion between the moving part and the light-emitting device is less than the adhesion between the conductive adhesive on the target substrate and the light-emitting device.