Color film substrate, preparation method thereof and display panel

Abstract

The invention provides a color film substrate and a preparation method thereof and a display panel, the color film substrate comprises a first flat layer, a first electrode layer, a light-emitting function layer, a second electrode layer, a packaging layer and a color filter layer which are sequentially stacked, the first electrode layer comprises a plurality of sub-electrodes, and the second electrode layer comprises a plurality of sub-electrodes; a first groove is formed in the side, close to the first electrode layer, of the first flat layer, the first groove is located between the adjacent sub-electrodes, a pixel defining layer is arranged in the first groove, and the height of the pixel defining layer is smaller than or equal to that of the first electrode layer. According to the color film substrate, the preparation method thereof and the display panel provided by the invention, the structure is simple, the manufacturing is convenient, the reflection ring phenomenon can be effectively improved, and the user experience is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a color filter substrate and its preparation method, and a display panel. Background Technology

[0002] For medium-to-large-sized OLED (Organic Light-Emitting Diode) display products, EIC (Enhanced Efficiency Structure in COE) technology is currently used in the design. This improves the light extraction efficiency and contrast of the display panel, facilitates thinner and lighter designs, and reduces production costs and capacity losses. However, current EIC products exhibit color separation when the screen is off, and can cause aperture effects under point light source illumination. Therefore, there is an urgent need for a display product that can mitigate these aperture effects. Summary of the Invention

[0003] In view of this, the purpose of this application is to provide a color filter substrate, a method for preparing the same, and a display panel.

[0004] In a first aspect, a color filter substrate is provided, comprising a first planarization layer, a first electrode layer, a light-emitting functional layer, a second electrode layer, an encapsulation layer, and a color filter layer stacked sequentially. The first electrode layer includes a plurality of sub-electrodes. A first groove is provided on the side of the first planarization layer near the first electrode layer. The first groove is located between adjacent sub-electrodes. A pixel defining layer is provided in the first groove. The height of the pixel defining layer is less than or equal to the height of the first electrode layer.

[0005] In some implementations, the height of the pixel defining layer is less than the height of the first electrode layer in at least a portion of the region.

[0006] In some embodiments, a second planarization layer is provided between the first planarization layer and the first electrode layer, and a via is provided on the second planarization layer. The via is located between adjacent sub-electrodes and communicates with the first groove. The orthographic projection of the via on the encapsulation layer covers the orthographic projection of the first groove on the encapsulation layer. The pixel defining layer is located within the via and the first groove.

[0007] In some embodiments, the pixel defining layer has a second groove on the side near the light-emitting functional layer, and the second groove is spaced apart from the sub-electrode.

[0008] In some embodiments, the light-emitting functional layer includes a first common layer, a first light-emitting layer, a second common layer, a second light-emitting layer, and a third common layer stacked sequentially, with the first common layer disposed close to the first electrode layer; the encapsulation layer includes a first inorganic film layer, an organic film layer, a second inorganic film layer, and a buffer layer stacked sequentially, with the first inorganic film layer disposed close to the second electrode layer.

[0009] In some embodiments, the encapsulation layer has a touch electrode layer on the side near the color filter layer, the touch electrode layer has a cover layer on the side away from the encapsulation layer, and the color filter layer has a protective film on the side away from the encapsulation layer.

[0010] In some embodiments, the color filter layer includes a black matrix and a color resist block, wherein the black matrix is ​​disposed opposite to the cover layer and the color resist block is disposed opposite to the sub-electrode.

[0011] In some embodiments, the color filter layer includes multiple color resist layers of different colors, with at least two colors of the color resist layers overlapping each other, and the overlapping area of ​​the color resist layers being disposed opposite to the cover layer.

[0012] A second aspect of this application provides a display panel, including an array substrate and a color filter substrate as described in the first aspect above.

[0013] A third aspect of this application provides a method for fabricating a color filter substrate, comprising: forming a first groove on a first planarization layer; forming a first electrode layer on one side of the first planarization layer, the first electrode layer including a plurality of sub-electrodes located between adjacent first grooves; forming a pixel defining layer in the first groove, the height of the pixel defining layer being less than or equal to the height of the first electrode layer; and sequentially forming a light-emitting functional layer, a second electrode layer, an encapsulation layer, and a color filter layer on the side of the pixel defining layer and the first electrode layer away from the first planarization layer to obtain a color filter substrate.

[0014] As can be seen from the above description, this application provides a color filter substrate, its fabrication method, and a display panel. The color filter substrate includes a first planarization layer, a first electrode layer, a light-emitting functional layer, a second electrode layer, an encapsulation layer, and a color filter layer stacked sequentially. The first electrode layer includes multiple sub-electrodes. A first groove is provided on the side of the first planarization layer near the first electrode layer, and the first groove is located between adjacent sub-electrodes. A pixel defining layer is provided within the first groove, and the height of the pixel defining layer is less than or equal to the height of the first electrode layer. By providing a first groove in the first planarization layer, and the first groove being located between the sub-electrodes, and by forming a pixel defining layer within the first groove with a height less than or equal to the height of the first electrode layer, a sloping structure is not formed above the first electrode layer, thereby avoiding the formation of a reflection aperture when exposed to external light, ensuring the performance. This color filter substrate, its fabrication method, and the display panel have a simple structure, are easy to manufacture, and can effectively improve the reflection aperture phenomenon and enhance the user experience. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of a color filter substrate in related technologies.

[0017] Figure 2 This is a schematic diagram of the structure of the first color filter substrate in the embodiments of this application.

[0018] Figure 3 This is a schematic diagram of the structure of the second type of color filter substrate in the embodiments of this application.

[0019] Figure 4 This is a schematic diagram of the structure of the third type of color filter substrate in the embodiments of this application.

[0020] Figure 5 This is a schematic diagram of the structure of the fourth type of color filter substrate in the embodiments of this application.

[0021] Figure 6 This is a schematic diagram of the structure of the light-emitting functional layer in the embodiments of this application.

[0022] Reference numerals: 1. First planarization layer; 1-1. First groove; 2. Sub-electrode; 3. Light-emitting functional layer; 3-1. First common layer; 3-2. First light-emitting layer; 3-3. Second common layer; 3-4. Second light-emitting layer; 3-5. Third common layer; 4. Second electrode layer; 5. Encapsulation layer; 5-1. First inorganic film layer; 5-2. Organic film layer; 5-3. Second inorganic film layer; 5-4. Buffer layer; 6. Color filter layer; 6-1. Black matrix; 6-2. Color resist block; 6-3. Color resist layer; 7. Pixel defining layer; 7-1. Second groove; 8. Second planarization layer; 8-1. Via; 9. Touch electrode layer; 10. Cover layer; 11. Protective film. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0024] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0025] For medium-to-large-sized OLED (Organic Light-Emitting Diode) display products, EIC (Enhanced Efficiency Structure in COE) technology is currently used in the design. EIC technology employs a structure including a driving backplane, pixel boundary layer, multiple pixel electrodes, light-emitting units, common electrode, touch electrode layer, capping layer, filter layer, and light-shielding layer. The filter units in the filter layer cover the light-emitting units on the driving backplane. Through the combination of the high refractive index of the filter units and the low refractive index of the capping layer, total internal reflection and deflection of light are achieved, reducing the need for a contrast layer and thinning the panel structure. This improves the light extraction efficiency and contrast of the display panel, facilitates thinner designs, and reduces production costs and capacity losses.

[0026] However, current EIC products exhibit color separation when the screen is off, and under point light source illumination, they can cause aperture effects, such as... Figure 1 The image shows a color filter substrate using EIC technology, comprising a first planarization layer 1, a first electrode layer, a pixel defining layer 7, a light-emitting functional layer 3, a second electrode layer 4, an encapsulation layer 5, and a color filter layer 6 stacked sequentially. The pixel defining layer 7 is located above the first electrode layer and forms a slope. When external light passes through the color filter layer 6 and shines on the slope surface, it is reflected. The light then exits from the color filter layer 6, creating an aperture that affects the user experience.

[0027] One approach is to increase the slope angle of the ramp, which would reduce the amount of light reflected from the color filter layer 6. However, this would significantly increase the manufacturing complexity, and a small amount of light would still be reflected from the color filter layer 6. During the implementation of this application, it was discovered that changing the position of the pixel defining layer 7 to prevent it from forming a ramp on the first electrode layer could completely avoid the problem of the reflected aperture.

[0028] The following describes specific embodiments in conjunction with... Figures 2 to 6 The technical solution of this application will be described in detail below.

[0029] Some embodiments of this application provide a color filter substrate, such as Figures 2 to 5 As shown, the structure includes a first planarization layer 1, a first electrode layer, a light-emitting functional layer 3 (EL), a second electrode layer 4, an encapsulation layer 5, and a color filter layer 6, which are stacked sequentially. The first electrode layer includes a plurality of sub-electrodes 2. The first planarization layer 1 has a first groove 1-1 on the side near the first electrode layer. The first groove 1-1 is located between adjacent sub-electrodes 2. A pixel defining layer 7 (Black PDL) is provided in the first groove 1-1. The height of the pixel defining layer 7 is less than or equal to the height of the first electrode layer.

[0030] like Figure 2 As shown, the color filter substrate includes a first planarization layer 1, a first electrode layer, a light-emitting functional layer 3, a second electrode layer 4, an encapsulation layer 5, and a color filter layer 6, which are stacked sequentially. The first planarization layer 1 is used for film planarization. The first electrode layer is, for example, an anode layer, and the second electrode layer 4 is, for example, a cathode layer; the specific type is not limited. The light-emitting functional layer 3 is used for emitting light. The encapsulation layer 5 is used to isolate moisture. The color filter layer 6 is used for filtering light and improving light saturation.

[0031] like Figure 2 As shown, a first groove 1-1 is provided on the first planarization layer 1, for example, fabricated using a Halftone process. Sub-electrodes 2 of the first electrode layer are disposed on protrusions formed between adjacent first grooves 1-1. A pixel defining layer 7 is formed within the first groove 1-1, such as... Figure 2As shown, the height of the pixel defining layer 7 is equal to the height of the first electrode layer (this height can be defined as the distance between the side of the corresponding film layer away from the first planarization layer 1 and the side of the first planarization layer 1 away from the light-emitting functional layer 3), as... Figure 3 As shown, the height of the pixel defining layer 7 is less than the height of the first electrode layer, such as... Figure 4 As shown, the height of the pixel defining layer 7 in some areas is less than the height of the first electrode layer, while the height of the pixel defining layer 7 in other areas is equal to the height of the first electrode layer. By setting the height of the pixel defining layer 7 to be less than or equal to the height of the first electrode layer, a sloping structure is not formed above the first electrode layer compared to the setting method in related technologies, thereby avoiding the formation of a reflected aperture when exposed to external light and ensuring the best performance.

[0032] This color filter substrate has a simple structure and is easy to manufacture. It can effectively improve the reflection aperture phenomenon and enhance the user experience.

[0033] In some embodiments, such as Figure 3 and Figure 4 As shown, the height of the pixel defining layer 7 in at least a portion of the region is less than the height of the first electrode layer.

[0034] like Figure 3 As shown, the height of the pixel defining layer 7 is less than the height of the first electrode layer, such as... Figure 4 As shown, the height of the pixel defining layer 7 in some areas is less than the height of the first electrode layer. By setting the height of the pixel defining layer 7 in at least some areas to be less than the height of the first electrode layer, a groove-like structure can be formed when the light-emitting functional layer 3 is made, thereby extending the leakage path between the sub-pixels of the light-emitting functional layer 3, reducing the color crossing problem caused by leakage between pixels, and improving the display effect.

[0035] In some embodiments, such as Figure 5 As shown, a second flattening layer 8 is provided between the first flattening layer 1 and the first electrode layer. A via 8-1 is provided on the second flattening layer 8. The via 8-1 is located between adjacent sub-electrodes 2 and communicates with the first groove 1-1. The orthographic projection of the via 8-1 on the encapsulation layer 5 covers the orthographic projection of the first groove 1-1 on the encapsulation layer 5. The pixel defining layer 7 is located within the via 8-1 and the first groove 1-1.

[0036] like Figure 5As shown, a second flattening layer 8 is provided on the first flattening layer 1. The second flattening layer 8 has a via 8-1 communicating with the first groove 1-1. It can also be fabricated using the Halftone process. The size of the via 8-1 is larger than the size of the first groove 1-1. This creates a stepped structure at the connection between the via 8-1 and the first groove 1-1, thereby reducing the step difference of the sub-electrode 2 and avoiding the risk of peeling off the first electrode layer. Furthermore, because of the stepped structure, the material of the pixel electrode layer will form a depression on its surface after curing, allowing the light-emitting functional layer 3 to also form a similar groove structure. This extends the leakage path between the sub-pixels of the light-emitting functional layer 3, reduces color crosstalk caused by inter-pixel leakage, and improves the display effect.

[0037] In some embodiments, such as Figure 4 and Figure 5 As shown, the pixel defining layer 7 has a second groove 7-1 on the side near the light-emitting functional layer 3, and the second groove 7-1 is spaced apart from the sub-electrode 2.

[0038] like Figure 4 As shown, a second groove 7-1 can be formed on the already solidified and flattened pixel defining layer 7 by means of etching or other methods. Figure 5 As shown, a stepped structure can also be formed using two flat layers, creating a second groove 7-1 in the uncured pixel defining layer 7. Forming the second groove 7-1 allows the light-emitting functional layer 3 to form a groove-like structure, thereby extending the leakage path between sub-pixels of the light-emitting functional layer 3, reducing color crosstalk caused by inter-pixel leakage, and improving the display effect. By setting the second groove 7-1 at an interval from the sub-electrode 2, a stepped structure can be formed around the second groove 7-1 and the top surface of the pixel defining layer 7, further increasing the leakage path and improving the display effect.

[0039] In some embodiments, such as Figure 2 As shown, the encapsulation layer 5 has a touch electrode layer 9 (TMB) on the side close to the color filter layer 6, the touch electrode layer 9 has a cover layer 10 (EOC) on the side away from the encapsulation layer 5, and the color filter layer 6 has a protective film 11 (COC) on the side away from the encapsulation layer 5.

[0040] The refractive index of the cover layer 10 is lower than that of the light-emitting region in the color filter layer 6, which allows for total internal reflection and deflection of light at the interface, thereby improving the light emission effect.

[0041] In some embodiments, such as Figure 2 As shown, the color filter layer 6 includes a black matrix 6-1 (BM) and a color resist block 6-2. The black matrix 6-1 is disposed opposite to the cover layer 10, and the color resist block 6-2 is disposed opposite to the sub-electrode 2.

[0042] Color resist blocks 6-2, for example, are blue, red, or green color resist blocks set on the same layer, such as... Figure 2 As shown, color block 6-2 is opposite to sub-electrode 2 and is used for filtering light to improve light saturation.

[0043] In some embodiments, such as Figure 3 and Figure 5 As shown, the color filter layer 6 includes multiple color resist layers 6-3 of different colors, with at least two colors of the color resist layers 6-3 overlapping each other, and the overlapping area of ​​the color resist layers 6-3 is disposed opposite to the cover layer 10.

[0044] Color resist layer 6-3 is, for example, a blue color resist layer, a red color resist layer, or a green color resist layer, etc. Figure 3 As shown, two colors of color resist layers 6-3 can be overlapped, such as blue and red color resist layers, red and green color resist layers, or blue and green color resist layers overlapping. The overlapping area is set opposite to the cover layer 10, which can form a barrier between the light emission paths of the sub-pixels, forming a similar function to the black matrix 6-1, but saving the manufacturing process of the black matrix 6-1. Figure 5 As shown, three colors of color resist layers 6-3 can also be set in an overlapping configuration to further improve the light-blocking effect.

[0045] In some embodiments, the first electrode layer may be formed of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium oxide (In2O3), or of a metal such as lithium (Li), calcium (Ca), lithium fluoride / calcium (LiF / Ca), lithium fluoride / aluminum (LiF / Al), aluminum (Al), silver (Ag), magnesium (Mg), or gold (Au). The second electrode layer 4 may be formed of a transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium oxide (In2O3), or of a reflective metal such as lithium (Li), calcium (Ca), lithium fluoride / calcium (LiF / Ca), lithium fluoride / aluminum (LiF / Al), aluminum (Al), silver (Ag), magnesium (Mg), or gold (Au). The material of the touch electrode layer 9 can be metallic silver (Ag), magnesium (Mg), aluminum (Al) and their alloys (such as magnesium-silver alloy), or metal oxides such as indium tin oxide (ITO), zinc oxide (ZnO), indium zinc oxide (IZO), and indium oxide (In2O3).

[0046] In some embodiments, the planarization layer may be made of an organic insulating material, such as polyimide, epoxy resin, acrylic, polyester, photoresist, polyacrylate, polyamide, siloxane, and other resin-based materials. As another example, the organic insulating material may include elastic materials, such as urethane, thermoplastic polyurethane (TPU), etc.

[0047] In some embodiments, such as Figure 2 As shown, the encapsulation layer 5 includes a first inorganic film layer 5-1 (CVD1), an organic film layer 5-2 (IJP), a second inorganic film layer 5-3 (CVD2), and a buffer layer 5-4 (Barrier) stacked sequentially, with the first inorganic film layer 5-1 disposed close to the second electrode layer 4.

[0048] The inorganic film layers can all be made of highly dense inorganic materials such as silicon oxynitride (SiON), silicon oxide (SiOx), and silicon nitride (SiNx). The organic film layer 5-2 can be made of a polymer material containing a desiccant or a polymer material that can block water vapor. For example, a polymer resin can be used to relieve stress in the inorganic film layer, and it can also include water-absorbing materials such as a desiccant to absorb water, oxygen, and other substances that penetrate the interior. The buffer layer 5-4 can include inorganic materials such as silicon oxide (SiOx), silicon nitride (SiNx), and / or silicon oxynitride (SiON), and can be formed as a multilayer or a single layer.

[0049] In some embodiments, such as Figure 6 As shown, the light-emitting functional layer 3 includes a first common layer 3-1, a first light-emitting layer 3-2, a second common layer 3-3, a second light-emitting layer 3-4 and a third common layer 3-5 stacked in sequence, with the first common layer 3-1 disposed close to the first electrode layer.

[0050] The first light-emitting layer 3-2 and the second light-emitting layer 3-4 are used for emitting light, and the first common layer 3-1, the second common layer 3-3 and the third common layer 3-5 are used to connect the light-emitting layer and the electrode layer.

[0051] The luminescent layer may include a stacked luminescent sublayer and an exciton blocking layer. The luminescent sublayer, used for luminescence, may include a host material and a guest material doped into the host material, with the guest material having a doping ratio of 1% to 20%. Within this doping ratio range, on the one hand, the host material can effectively transfer exciton energy to the guest material to excite it to emit light; on the other hand, the host material "dilutes" the guest material, effectively improving fluorescence quenching caused by intermolecular collisions and energy-based collisions, thus increasing luminescence efficiency and device lifetime. The doping ratio refers to the ratio of the mass of the guest material to the mass of the luminescent sublayer, i.e., mass percentage. In an exemplary embodiment, the host material and the guest material can be deposited together using a multi-source evaporation process, so that the host material and the guest material are uniformly dispersed in the luminescent layer. The doping ratio can be controlled by adjusting the evaporation rate of the guest material or by controlling the ratio of the evaporation rates of the host material and the guest material during the evaporation process. The thickness of the luminescent layer can be approximately 10 nm to 50 nm. The exciton blocking layer (EBL) mainly functions to prevent excitons generated in the luminescent layer from diffusing away from the luminescent layer, and also serves as a transfer point for holes or electrons.

[0052] The first common layer 3-1 may include a first hole transport layer and a first hole injection layer stacked together. The first hole injection layer (HIL) mainly functions to lower the hole injection barrier and improve the hole injection efficiency. It can be prepared as a monolayer film using materials such as HATCN and CuPc; it can also be prepared by p-type doping of the hole transport material, such as NPB:F4TCNQ and TAPC:MnO3, with a typical thickness of 5nm to 20nm. The first hole transport layer (HTL) can be prepared by vapor deposition using carbazole-based materials with high hole mobility.

[0053] The second common layer 3-3 includes an exciton blocking layer, a charge generation unit, and a second hole transport layer stacked sequentially. The exciton blocking layer primarily blocks exciton diffusion and also serves to transport holes or electrons. The second hole transport layer can be prepared by vapor deposition using a carbazole-based material with high hole mobility. The charge generation unit is used to connect the two light-emitting layers in series, improving current efficiency and thus enhancing the light emission effect. The charge generation unit can be applied to the entire display panel by vapor deposition, and the specific application is not limited. The charge generation unit includes an N-type charge generation layer and a P-type charge generation layer. The N-type charge generation layer includes a metal or an organic material doped with the N-type dopant. The metal can be selected from one or more of Li, Na, K, Rb, Cs, Mg, Ca, Ba, Sm, Eu, Tb, or Yb. The organic material doped with the N-type dopant can include an N-type dopant and a matrix material. The N-type dopant can be an alkali metal, an alkali metal compound, an alkaline earth metal, or an alkaline earth metal compound. The matrix material can be one or more of tris(8-hydroxyquinoline)aluminum, hydroxyquinoline derivatives, triazine, indole derivatives, and thiophene derivatives. The P-type charge generation layer comprises a transition metal oxide or an organic material doped with the P-type dopant. The transition metal in the transition metal oxide can be one or more of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, In, Sn, Ge, Y, Mo, Ta, W, etc. The P-type doped organic material comprises a P-type dopant and a matrix material. The P-type dopant can be one or more of F4-TCNQ:m-MTDATA, MoO3:NPB, FeCl3:NPB, HATCN, etc. The matrix material can be the same as the matrix material in the N-type charge generation layer. The charge generation unit can include multiple sets of alternating N-type charge generation layers and P-type charge generation layers, without specific limitations.

[0054] The third common layer 3-5 includes an exciton blocking layer, an electron transport layer, and an electron injection layer stacked sequentially. The exciton blocking layer mainly blocks exciton diffusion and also serves to transport holes or electrons. The electron transport layer (ETL) can be prepared by vapor deposition using triazine materials with high electron mobility, and its thickness can be adjusted between 5 nm and 50 nm. The electron injection layer (EIL) can be made of alkali metals or metals, such as lithium fluoride (LiF), ytterbium (Yb), magnesium (Mg), or calcium (Ca), or compounds of these alkali metals or metals, and its thickness can be adjusted between 0.5 nm and 20 nm.

[0055] In some embodiments of this application, a display panel is provided, including an array substrate and a color filter substrate as described in any of the above embodiments.

[0056] The effect produced by this display panel is the same as that produced by the color filter substrate mentioned above, and will not be described in detail here.

[0057] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0058] In the embodiments of this application, the first electrode can be the second electrode, the second electrode can be the first electrode, or the first electrode can be the first electrode and the second electrode can be the second electrode. In cases where transistors with opposite polarities are used or the current direction changes during circuit operation, the functions of the "first electrode" and the "second electrode" are sometimes interchanged. Therefore, in this specification, the "first electrode" and the "second electrode" can be interchanged.

[0059] In the embodiments of this application, "film" and "layer" can be interchanged. For example, sometimes "conductive layer" can be replaced with "conductive film". Similarly, sometimes "insulating film" can be replaced with "insulating layer". The scale of the drawings in the embodiments of this application can be used as a reference in actual processes, but is not limited thereto. For example, the aspect ratio of the channel, the thickness and spacing of each film layer can be adjusted according to actual needs. The number of pixels in the display panel and the number of sub-pixels in each pixel are not limited to the quantities shown in the figures. The drawings described in the embodiments of this application are only structural schematic diagrams, and one method in the embodiments of this application is not limited to the shapes or values ​​shown in the drawings.

[0060] In the embodiments of this application, triangles, rectangles, trapezoids, pentagons, or hexagons are not strictly defined, but can be approximate triangles, rectangles, trapezoids, pentagons, or hexagons, etc., and may have some small deformations due to tolerances, and may have chamfers, curved edges, and other deformations.

[0061] Furthermore, given that details have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that embodiments of this application may be practiced without these details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0062] Based on the same inventive concept, this application also provides a method for preparing a color filter substrate, comprising: forming a first groove 1-1 on a first planarization layer 1; forming a first electrode layer on one side of the first planarization layer 1, the first electrode layer including a plurality of sub-electrodes 2, the sub-electrodes 2 being located between adjacent first grooves 1-1; forming a pixel defining layer 7 in the first groove 1-1, the height of the pixel defining layer 7 being less than or equal to the height of the first electrode layer; and sequentially forming a light-emitting functional layer 3, a second electrode layer 4, an encapsulation layer 5, and a color filter layer 6 on the side of the pixel defining layer 7 and the first electrode layer away from the first planarization layer 1 to obtain a color filter substrate.

[0063] In some embodiments, the preparation method further includes forming a second planarization layer 8 on the first planarization layer 1 and forming a via 8-1 on the second planarization layer 8.

[0064] The "patterning process" described in this application includes, for metallic, inorganic, or transparent conductive materials, processes such as photoresist coating, mask exposure, development, etching, and photoresist stripping; for organic materials, it includes processes such as organic material coating, mask exposure, and development. Deposition can be performed using any one or more of sputtering, evaporation, and chemical vapor deposition; coating can be performed using any one or more of spraying, spin coating, and inkjet printing; and etching can be performed using any one or more of dry and wet etching, without limitation.

[0065] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0066] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0067] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, well-known power / ground connections to other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be illustrated in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be entirely within the understanding of those skilled in the art). While specific details have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application may be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0068] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. The embodiments of this application are intended to cover all such substitutions, modifications, and variations falling within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A color filter substrate, characterized in that, The device includes a first planarization layer, a first electrode layer, a light-emitting functional layer, a second electrode layer, an encapsulation layer, and a color filter layer stacked in sequence. The first electrode layer includes multiple sub-electrodes. A first groove is provided on the side of the first planarization layer near the first electrode layer. The first groove is located between adjacent sub-electrodes. A pixel defining layer is provided in the first groove. The height of the pixel defining layer is less than or equal to the height of the first electrode layer.

2. The color filter substrate according to claim 1, characterized in that, The height of the pixel-defining layer in at least a portion of the region is less than the height of the first electrode layer.

3. The color filter substrate according to claim 1, characterized in that, A second planarization layer is provided between the first planarization layer and the first electrode layer. A via is provided on the second planarization layer. The via is located between adjacent sub-electrodes and communicates with the first groove. The orthogonal projection of the via on the encapsulation layer covers the orthogonal projection of the first groove on the encapsulation layer. The pixel defining layer is located within the via and the first groove.

4. The color filter substrate according to claim 1 or 3, characterized in that, The pixel defining layer has a second groove on the side near the light-emitting functional layer, and the second groove is spaced apart from the sub-electrode.

5. The color filter substrate according to claim 1, characterized in that, The light-emitting functional layer includes a first common layer, a first light-emitting layer, a second common layer, a second light-emitting layer and a third common layer stacked in sequence, with the first common layer disposed close to the first electrode layer; The encapsulation layer includes a first inorganic film layer, an organic film layer, a second inorganic film layer, and a buffer layer stacked sequentially, with the first inorganic film layer disposed close to the second electrode layer.

6. The color filter substrate according to claim 1, characterized in that, The encapsulation layer has a touch electrode layer on the side close to the color filter layer, the touch electrode layer has a cover layer on the side away from the encapsulation layer, and the color filter layer has a protective film on the side away from the encapsulation layer.

7. The color filter substrate according to claim 6, characterized in that, The color filter layer includes a black matrix and a color resist block, wherein the black matrix is ​​disposed opposite to the cover layer and the color resist block is disposed opposite to the sub-electrode.

8. The color filter substrate according to claim 6, characterized in that, The color filter layer includes multiple color resist layers of different colors, with at least two colors of the color resist layers overlapping each other, and the overlapping area of ​​the color resist layers is positioned opposite to the cover layer.

9. A display panel, characterized in that, It includes an array substrate and a color filter substrate as described in any one of claims 1-8.

10. A method for preparing a color filter substrate, characterized in that, include: A first groove is formed on a first planarization layer; a first electrode layer is formed on one side of the first planarization layer, the first electrode layer including a plurality of sub-electrodes, the sub-electrodes being located between adjacent first grooves; a pixel defining layer is formed in the first groove, the height of the pixel defining layer being less than or equal to the height of the first electrode layer; a light-emitting functional layer, a second electrode layer, an encapsulation layer and a color filter layer are sequentially formed on the side of the pixel defining layer and the first electrode layer away from the first planarization layer to obtain a color filter substrate.

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