Display panel, preparation method thereof and display device

Abstract

The invention discloses a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, an isolation structure, a light emitting device, a first packaging layer and a redundancy unit. The isolation structure is located on one side of the substrate, and a plurality of isolation openings are defined by the isolation structure; at least part of the light-emitting device is located in the corresponding isolation opening; the first packaging layer comprises a plurality of packaging parts, the packaging parts are arranged on the sides, deviating from the substrate, of the corresponding light emitting devices and extend to the sides, deviating from the substrate, of the isolation structures, and gaps are formed between the packaging parts and the sides, deviating from the substrate, of the isolation structures; the redundant unit is arranged in the gap, and the orthographic projection of the redundant unit on the substrate is located in the orthographic projection of the periphery of the gap on the substrate. The reliability and the use performance of the display panel are improved.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the reliability of current OLED display products needs to be improved. Summary of the Invention

[0004] This application provides a display panel, a method for manufacturing the same, and a display device, aiming to improve the reliability of OLED display products.

[0005] A first aspect of this application provides a display panel including a substrate, an isolation structure, a plurality of light-emitting devices, a first encapsulation layer, and a redundant unit. The isolation structure is located on one side of the substrate and encloses a plurality of isolation openings. At least a portion of the light-emitting devices is located in the corresponding isolation opening. The first encapsulation layer includes a plurality of encapsulation portions, which are disposed on the side of the corresponding light-emitting device away from the substrate and extend to the side of the isolation structure away from the substrate. A gap is formed between the encapsulation portions and the side of the isolation structure away from the substrate. The redundant unit is disposed within the gap, and the orthographic projection of the redundant unit onto the substrate is located at the periphery of the gap within the orthographic projection of the substrate.

[0006] According to an embodiment of the first aspect of this application, the packaging portion includes a first segment and a second segment. The first segment is located on the side of the corresponding light-emitting device away from the substrate. The second segment is connected to the first segment and extends to the side of the isolation structure away from the substrate. A gap is formed between the second segment and the side of the isolation structure away from the substrate.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the second segment has a first orthographic projection on the isolation structure, and the redundant unit has a second orthographic projection on the isolation structure, wherein the area of ​​the second orthographic projection is smaller than the area of ​​the first orthographic projection.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the isolation opening corresponding to the second segment has a third orthographic projection on the substrate. The first orthographic projection includes a first portion that coincides with the second orthographic projection and a second portion located outside the second orthographic projection. The second portion is located on the side of the first portion away from the third orthographic projection.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the first orthographic projection includes a first boundary that is far from the third orthographic projection, and the second orthographic projection includes a second boundary that is far from the third orthographic projection, wherein the first boundary is located on the side of the second boundary that is far from the third orthographic projection.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the distance between the first boundary and the second boundary is a, where 0 < a ≤ 1 μm.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the third orthographic projection is located within the area enclosed by the first boundary; and / or, the third orthographic projection is located within the area enclosed by the second boundary.

[0012] According to any of the foregoing embodiments of the first aspect of this application, at least two adjacent package portions are spaced apart in the orthographic projection of the substrate; and / or, the orthographic projections of at least two adjacent package portions in the substrate at least partially overlap.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the second segments of at least two adjacent encapsulation portions are spaced apart from each other in the orthographic projection of the isolation structure; and / or, the second segments of at least two adjacent encapsulation portions at least partially overlap in the orthographic projection of the isolation structure.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the materials of the redundant units between the second segments of at least two adjacent encapsulation portions and the isolation structure are different.

[0015] According to any of the foregoing embodiments of the first aspect of this application, at least two adjacent encapsulation portions are arranged at intervals in the orthographic projection of the isolation structure, and the redundant units corresponding to the two spaced-apart second portions are arranged at intervals.

[0016] According to any of the foregoing embodiments of the first aspect of this application, there is a first shortest distance between the second segments of two adjacent encapsulation portions, and there is a second shortest distance between two corresponding adjacent redundant units, wherein the first shortest distance is less than the second shortest distance.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the second segments of two adjacent encapsulation portions at least partially overlap in the orthographic projection of the isolation structure. In the two adjacent second segments, one includes a first main body, a first connecting portion, and a first overlapping portion, and the other includes a second main body. The first connecting portion connects the first main body and the first overlapping portion. The first main body and the second main body are spaced apart. The orthographic projection of the first overlapping portion in the isolation structure and the orthographic projection of the second main body in the isolation structure at least partially overlap. At least partially redundant units are provided between the first overlapping portion and the second main body.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the redundant unit includes a first redundant part, a second redundant part, and a third redundant part. The second redundant part is connected between the first redundant part and the third redundant part. The first redundant part is at least partially located between the first main body and the isolation structure. The second redundant part is at least partially located between the first connecting part and the isolation structure. The third redundant part is at least partially located between the first overlapping part and the second main body.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the third redundant portion in the isolation structure is located within the orthographic projection of the first overlapping portion in the isolation structure.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the material of the redundant unit located in the gap is at least partially the same as the material of the light-emitting device located on the side of the packaging portion near the substrate corresponding to the gap.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the light-emitting device includes a light-emitting functional layer and a first electrode stacked sequentially away from the substrate, the encapsulation portion is located on the side of the first electrode away from the substrate, at least a portion of the material of the redundant unit is the same as the material of the light-emitting functional layer, and / or, at least a portion of the material of the redundant unit is the same as the material of the first electrode.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the material of the isolation structure includes a conductive material, and the first electrode is electrically connected to the isolation structure.

[0023] According to any of the foregoing embodiments of the first aspect of this application, the redundant unit includes a first redundant sublayer and a second redundant sublayer sequentially stacked in a direction away from the substrate, wherein the material of the first redundant sublayer is the same as the material of the light-emitting functional layer, and / or the material of the second redundant sublayer is the same as the material of the first electrode.

[0024] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate, wherein the second isolation portion protrudes out of the first isolation portion toward the isolation opening.

[0025] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure further includes a third isolation portion located on the side of the first isolation portion facing the substrate, and the third isolation portion protrudes from the first isolation portion toward the isolation opening.

[0026] According to any of the foregoing embodiments of the first aspect of this application, the first isolation portion includes a conductive material, and / or, the third isolation portion includes a conductive material.

[0027] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a pixel definition layer, which is located on one side of the substrate and encloses a plurality of pixel openings. The pixel openings are connected to corresponding isolation openings. The light-emitting device includes a second electrode and a light-emitting functional layer that are sequentially stacked away from the substrate. The second electrode is located on the side of the pixel definition layer closer to the substrate. At least a portion of the second electrode is exposed in the pixel openings, and at least a portion of the light-emitting functional layer is located within the pixel openings.

[0028] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure is located on the side of the pixel definition layer away from the substrate, or a clearance opening is provided on the pixel definition layer, and the isolation structure is located within the clearance opening.

[0029] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a second encapsulation layer disposed on the side of the first encapsulation layer away from the substrate.

[0030] According to any of the foregoing embodiments of the first aspect of this application, the material of the first encapsulation layer includes inorganic materials, and / or the material of the second encapsulation layer includes organic materials.

[0031] A second aspect of this application also provides a method for manufacturing a display panel, the method comprising:

[0032] An isolation material layer is prepared on a substrate, and the isolation material layer is patterned to form multiple isolation openings, including a first isolation opening;

[0033] A first device material layer and a first encapsulation material layer are sequentially fabricated on the entire surface of a substrate;

[0034] The first encapsulation material layer is patterned to form a first encapsulation portion corresponding to the first isolation opening;

[0035] The first device material layer is patterned to form a first light-emitting device and a first redundant unit corresponding to the first isolation opening;

[0036] The first package includes a first segment located within a first isolation opening and a second segment extending from the first segment to the side of the isolation material layer away from the substrate. A first gap is formed between the second segment and the side of the isolation material layer away from the substrate. A first redundant unit is located in the first gap, and the orthographic projection of the first redundant unit on the isolation material layer is located within the orthographic projection of the second segment on the isolation material layer.

[0037] According to an embodiment of the second aspect of this application, a first isolation opening and a portion of an isolation material layer surrounding the first isolation opening constitute a first isolation region, and the step of patterning the first device material layer includes:

[0038] The first etching material is used to etch away part of the first device material layer outside the first isolation area along the thickness direction of the display panel.

[0039] The second etching material is used to etch away the remaining portion of the first device material layer outside the first isolation region along a direction intersecting the thickness direction.

[0040] According to any of the foregoing embodiments of the second aspect of this application, the first etching material includes oxygen, and / or the second etching material includes oxygen.

[0041] According to any of the foregoing embodiments of the second aspect of this application, the first etching material is the same as the second etching material.

[0042] According to any of the foregoing embodiments of the second aspect of this application, a dry etching process is used to pattern the first device material layer.

[0043] According to any of the foregoing embodiments of the second aspect of this application, the step of etching away a portion of the first device material layer outside the first isolation region using a first etching material along the thickness direction of the display panel includes:

[0044] Remove the first device material layer located on the side of the isolation material layer that faces away from the substrate and is not covered by the first package portion;

[0045] Remove a portion of the first device material layer located at the first isolation opening.

[0046] According to any of the foregoing embodiments of the second aspect of this application, the plurality of isolation openings further includes a second isolation opening, and the step of using a second etching material to etch away a portion of the first device material layer remaining outside the first isolation region in a direction intersecting the thickness direction includes:

[0047] Remove the first device material layer remaining on the sidewall of the second isolation opening; and / or remove part of the first device material layer remaining in the first gap to form a first redundant unit.

[0048] According to any of the foregoing embodiments of the second aspect of this application, prior to the step of patterning the first encapsulation material layer, the preparation method further includes:

[0049] A first protective layer is prepared on a first encapsulation material layer, and the first protective layer is patterned to form a first protective portion that covers the first isolation opening and surrounds the first isolation opening with a portion of the isolation material layer.

[0050] According to any of the foregoing embodiments of the second aspect of this application, after the step of patterning the first device material layer, the preparation method further includes: removing the first protective portion.

[0051] According to any of the foregoing embodiments of the second aspect of this application, the material of the first protective part includes photoresist.

[0052] According to any of the foregoing embodiments of the second aspect of this application, the step of patterning the first encapsulation material layer includes:

[0053] The third etching material is used to etch away part of the first encapsulation material layer outside the first protective part along the thickness direction of the display panel, and the fourth etching material is used to etch away the remaining first encapsulation material layer outside the first protective part along the direction intersecting with the thickness direction.

[0054] According to any of the foregoing embodiments of the second aspect of this application, the third etching material includes a fluoride etching gas, and / or, the fourth etching material includes a fluoride etching gas.

[0055] According to any of the foregoing embodiments of the second aspect of this application, the fluoride etching gas includes at least one of carbon tetrafluoride, nitrogen trifluoride, and sulfur hexafluoride.

[0056] According to any of the foregoing embodiments of the second aspect of this application, the plurality of isolation openings further includes a second isolation opening, and the step of using a third etching material to etch and remove a portion of the first encapsulation material layer outside the first protective portion along the thickness direction of the display panel includes:

[0057] Remove the first encapsulation material layer that is not covered by the first protective layer;

[0058] The step of removing the remaining portion of the first encapsulation material layer by etching with a fourth etching material in a direction intersecting the thickness direction includes:

[0059] Remove the first encapsulation material layer that remains on the sidewall of the second isolation opening.

[0060] According to any of the foregoing embodiments of the second aspect of this application, the plurality of isolation openings further includes a second isolation opening, and after the step of patterning the first device material layer, the preparation method further includes:

[0061] A second device material layer and a second encapsulation material layer are sequentially fabricated on the entire surface of the substrate.

[0062] The second encapsulation material layer is patterned to form a second encapsulation portion corresponding to the second isolation opening.

[0063] The second device material layer is patterned to form a second light-emitting device corresponding to the second isolation opening.

[0064] The second package includes a first segment located within the second isolation opening and a second segment extending from the first segment to the side of the isolation material layer away from the substrate. A second gap is formed between the second segment and the side of the isolation material layer away from the substrate. A second device material layer is partially filled in the second gap to form a second redundant unit. The orthographic projection of the second redundant unit onto the isolation material layer is located within the orthographic projection of the second segment onto the isolation material layer.

[0065] According to any of the foregoing embodiments of the second aspect of this application, the second redundant unit and the first redundant unit are arranged at intervals.

[0066] According to any of the foregoing embodiments of the second aspect of this application, the orthographic projection of the second redundant unit on the substrate overlaps with the orthographic projection of the first redundant unit on the substrate.

[0067] According to any of the foregoing embodiments of the second aspect of this application, the preparation method further includes:

[0068] A third isolation opening is made in the isolation material layer;

[0069] The step of creating the third isolation opening on the isolation material layer is performed before the step of sequentially preparing the first device material layer and the first packaging material layer on the substrate; or, the step of creating the third isolation opening on the isolation material layer is performed after the step of patterning the second device material layer.

[0070] According to any of the foregoing embodiments of the second aspect of this application, the first isolation opening, the second isolation opening, and the third isolation opening are formed in the same process.

[0071] According to any of the foregoing embodiments of the second aspect of this application, after the step of forming the third isolation opening on the isolation material layer and after the step of patterning the second device material layer, the preparation method further includes:

[0072] A third device material layer and a third encapsulation material layer are sequentially fabricated on the entire surface of the substrate;

[0073] The third encapsulation material layer is patterned to form a third encapsulation portion corresponding to the third isolation opening.

[0074] The third device material layer is patterned to form a third light-emitting device corresponding to the third isolation opening.

[0075] The third package includes a first segment located within a third isolation opening and a second segment extending from the first segment to the side of the isolation material layer away from the substrate. A third gap is formed between the second segment and the side of the isolation material layer away from the substrate. A third device material layer is partially filled in the third gap to form a third redundant unit. The orthographic projection of the third redundant unit onto the isolation material layer is located within the orthographic projection of the second segment onto the isolation material layer.

[0076] According to any of the foregoing embodiments of the second aspect of this application, the third redundant unit is spaced apart from the second redundant unit, and / or the third redundant unit is spaced apart from the first redundant unit.

[0077] According to any of the foregoing embodiments of the second aspect of this application, the orthographic projection of the third redundant unit on the substrate overlaps with the orthographic projection of the first redundant unit on the substrate.

[0078] According to any of the foregoing embodiments of the second aspect of this application, the orthographic projection of the third redundant unit on the substrate overlaps with the orthographic projection of the second redundant unit on the substrate.

[0079] An embodiment of the third aspect of this application provides a display device, which includes a display panel provided in any of the first aspect embodiments described above or a display panel prepared according to any of the second aspect embodiments described above.

[0080] According to embodiments of this application, the display panel includes a substrate, an isolation structure, a light-emitting device, a first encapsulation layer, and redundant units. On one hand, the redundant units can prevent etching liquid or etching gas from penetrating between the encapsulation portion and the side of the isolation structure through gaps, reducing etching damage to the side of the isolation structure or the interior of the encapsulation portion, thereby improving the encapsulation effect and reducing the generation of dark spots in the display panel. On the other hand, the redundant units can also provide support for the encapsulation portion located on the side of the isolation structure facing away from the substrate, reducing the probability of failure of the encapsulation portion in subsequent processes and improving the reliability of the encapsulation. This application improves the reliability and performance of the display panel. Attached Figure Description

[0081] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.

[0082] Figure 1 This is a partial top view of the isolation structure and encapsulation part in a display panel provided in an embodiment of this application;

[0083] Figure 2 This is one of the cross-sectional structural schematic diagrams of a display panel provided in the embodiments of this application;

[0084] Figure 3 This is one of the enlarged cross-sectional views of a display panel provided in an embodiment of this application;

[0085] Figure 4 This is a frontal projection view of various structures in a display panel on a substrate, provided in an embodiment of this application;

[0086] Figure 5 This is a second schematic cross-sectional view of a display panel provided in an embodiment of this application;

[0087] Figure 6 This is a second enlarged cross-sectional view of a display panel provided in an embodiment of this application;

[0088] Figure 7 This is the third cross-sectional structural schematic diagram of a display panel provided in the embodiments of this application;

[0089] Figure 8 This is the fourth cross-sectional structural schematic diagram of a display panel provided in the embodiments of this application;

[0090] Figure 9 This is one of the flowcharts illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0091] Figure 10 This is a second schematic flowchart of a method for manufacturing a display panel provided in an embodiment of this application;

[0092] Figure 11 This is a schematic diagram of the structural process of a method for manufacturing a display panel provided in an embodiment of this application.

[0093] Explanation of reference numerals in the attached figures:

[0094] 1. Substrate; 101. First orthographic projection; 102. Second orthographic projection; 103. Third orthographic projection; 1011. First boundary; 1021. Second boundary;

[0095] 2. Pixel definition layer; 21. Pixel aperture;

[0096] 3. Isolation structure; 30. Isolation opening; 301. First isolation opening; 302. Second isolation opening; 303. Third isolation opening; 31. First isolation section; 32. Second isolation section; 33. Third isolation section;

[0097] 40. Light-emitting device; 41. Light-emitting functional layer; 42. First electrode; 43. Second electrode; 401. First light-emitting device; 402. Second light-emitting device; 403. Third light-emitting device;

[0098] 5. First encapsulation layer; 50. Encapsulation part; 51. First encapsulation part; 52. Second encapsulation part; 53. Third encapsulation part; 501. First segment; 502. Second segment; 5021. First main body part; 5022. First connecting part; 5023. First overlapping part; 5024. Second main body part; 5020. First shortest distance;

[0099] 6. Redundant unit; 60. Second shortest distance; 61. First redundant unit; 62. Second redundant unit; 601. First redundant sublayer; 602. Second redundant sublayer; 63. Third redundant unit; 621. First redundant part; 622. Second redundant part; 623. Third redundant part;

[0100] 7. Second encapsulation layer; 8. Third encapsulation layer. Detailed Implementation

[0101] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details.

[0102] In some display panels, due to the presence of isolation structures, a precision mask can be eliminated during the fabrication of the light-emitting functional layers. The light-emitting material is separated into multiple light-emitting functional layers by these isolation structures. When fabricating light-emitting functional layers of different colors, the first color light-emitting material is first deposited across the entire surface, allowing it to fall into multiple isolation openings and be encapsulated. Then, part of the encapsulation material and the first color light-emitting material are etched away, leaving the first color light-emitting material in some of the isolation openings and the encapsulation material covering those openings, forming a light-emitting functional layer of the first color. This process is then repeated to form light-emitting functional layers of the second and third colors. However, in the subsequent fabrication processes of the second and third color light-emitting functional layers, wet etching solutions or dry etching gases may enter the interior along the gaps formed between the encapsulation portion and the isolation structure on the previous light-emitting functional layer, causing etching damage to the isolation structure or encapsulation portion. This affects the encapsulation of the previous light-emitting functional layer, leading to problems such as dark spots, impacting the performance and reducing the reliability of the display panel.

[0103] To address the aforementioned issues, this application provides a display panel, a method for manufacturing the same, and a display device. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, its manufacturing method, and the display device.

[0104] Please refer to the following: Figures 1 to 3 The first aspect of this application provides a display panel, which includes a substrate 1, an isolation structure 3, a plurality of light-emitting devices 40, a first encapsulation layer 5, and a redundant unit 6. The isolation structure 3 is located on one side of the substrate 1 and forms a plurality of isolation openings 30. At least a portion of the light-emitting devices 40 is located in the corresponding isolation opening 30. The first encapsulation layer 5 includes a plurality of encapsulation portions 50, which are disposed on the side of the corresponding light-emitting device 40 away from the substrate 1 and extend to the side of the isolation structure 3 away from the substrate 1. A gap is formed between the encapsulation portions 50 and the side of the isolation structure 3 away from the substrate 1. The redundant unit 6 is disposed in the gap, and the orthographic projection of the redundant unit 6 on the substrate 1 is located at the periphery of the gap within the orthographic projection of the substrate 1.

[0105] Optional, refer to Figure 1 The isolation structure 3 can be in the form of a grid to facilitate the division of sub-pixels in the display panel. The area shown by the cross-sectional lines in the grid-shaped isolation structure 3 can be the isolation opening 30 and its corresponding light-emitting device 40. Figure 1 The locations of each package 50 are indicated by dashed lines. The dashed lines do not constitute a limitation on the structure of this application. The dashed lines can be used to define the location and distribution range of the package 50.

[0106] Optionally, multiple isolation openings 30 are spaced apart along the row and column directions, and the direction from one isolation opening 30 to the next is the row or column direction. For example... Figure 1 As shown, the row direction can be the first direction X, and the column direction can be the second direction Y.

[0107] The encapsulation portion 50 is used to encapsulate the light-emitting device 40, and the isolation opening 30 can be used to accommodate the light-emitting device 40 and the encapsulation portion 50. Optionally, each light-emitting device 40 can be correspondingly arranged with each isolation opening 30, and each encapsulation portion 50 can be correspondingly arranged with each light-emitting device 40. The orthographic projection of the light-emitting device 40 on the substrate 1 and the orthographic projection of the isolation opening 30 on the substrate 1 at least partially overlap.

[0108] In this application, the orthographic projection of "opening" and "gap" on substrate 1 can be understood as: the area enclosed by the structure forming the opening on substrate 11 corresponding to the orthographic projection of the structure forming the gap on substrate 11 corresponding to the orthographic projection of the structure forming the gap.

[0109] Optionally, the light-emitting device 40 includes a light-emitting functional layer 41.

[0110] Optionally, the above structure can be referenced in the orthographic projection direction of substrate 1. Figure 2 The Z-axis direction can also be the thickness direction of the display panel.

[0111] The encapsulation portion 50 covers the sidewall of the isolation structure 3 facing the isolation opening 30 and extends to the side of the isolation structure 3 away from the substrate 1. That is, the encapsulation portion 50 not only covers the isolation opening 30, but also covers part of the isolation structure 3 surrounding the isolation opening 30, which can expand the distribution area of ​​the encapsulation portion 50 and improve the encapsulation effect of the encapsulation portion 50.

[0112] In a display panel provided in this application embodiment, the display panel includes a substrate 1, an isolation structure 3, a light-emitting device 40, a first encapsulation layer 5, and a redundancy unit 6. On one hand, the redundancy unit 6 can prevent etching liquid or etching gas from intruding between the encapsulation portion 50 and the side of the isolation structure 3 through gaps, reducing the etching damage caused to the side of the isolation structure 3 or the interior of the encapsulation portion 50, thereby improving the encapsulation effect of the encapsulation portion 50 and reducing the generation of dark spots in the display panel. On the other hand, the redundancy unit 6 can also provide support for the encapsulation portion 50 located on the side of the isolation structure 3 facing away from the substrate 1, reducing the probability of failure of the encapsulation portion 50 in subsequent processes and improving the reliability of the encapsulation. In summary, this application improves the reliability and performance of the display panel.

[0113] An isolation structure 3 is disposed on one side of the substrate 1 and encloses multiple isolation openings 30 to isolate the light-emitting material, forming disconnected light-emitting functional layers 41. This reduces crosstalk between charge carriers in adjacent light-emitting functional layers 41, improves the display effect of the display panel, and eliminates the need for precision photomasks in fabricating the light-emitting functional layers 41, thus reducing the development and use of precision photomasks and lowering manufacturing costs. The first encapsulation layer 5 includes an encapsulation portion 50 for encapsulating each light-emitting functional layer 41. The encapsulation portion 50 provides encapsulation protection to the light-emitting functional layers 41, achieving independent encapsulation and improving the yield of the light-emitting functional layers 41 from the impact of water and oxygen intrusion.

[0114] The composition and preparation of the isolation structure 3 (or partition structure or isolation column) are detailed in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099. Further descriptions are provided in CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A for reference.

[0115] Optionally, the encapsulation portion 50 includes a first segment 501 located within the isolation opening 30, and a second segment 502 extending from the first segment 501 to the side of the isolation structure 3 facing away from the substrate 1, with a gap formed between the second segment 502 and the side of the isolation structure 3 facing away from the substrate 1. The first segment 501 covers the isolation opening 30 and its sidewalls, and the second segment 502 covers a portion of the isolation structure 3 surrounding the isolation opening 30, thereby increasing the distribution area of ​​the encapsulation portion 50 and improving its encapsulation effect.

[0116] Optionally, the redundant unit 6 is projected onto the substrate 1 within the projection of the second segment 502 onto the substrate 1. The redundant unit 6 can provide support for the second segment 502, reducing the probability of the second segment 502 failing in subsequent processes and improving the reliability of the package.

[0117] Optionally, one or more etching processes for both the encapsulation material and the luminescent material can be performed using a dry etching process. This reduces the etching damage to the luminescent material covered by the second segment 502 of each encapsulation portion 50 caused by the wet etching process, thereby effectively preserving this portion of the luminescent material. Optionally, the redundant unit 6 includes this portion of the luminescent material.

[0118] Optional, refer to Figure 4 The second segment 502 has a first orthographic projection 101 on the isolation structure 3, and the redundant unit 6 has a second orthographic projection 102 on the isolation structure. The area of ​​the second orthographic projection 102 is smaller than the area of ​​the first orthographic projection 101.

[0119] The first orthographic projection 101 can also be understood as the orthographic projection of the part of the second segment 502 and the isolation structure 3 overlapping in the thickness direction Z onto the substrate 1. The second orthographic projection 102 can also be understood as the orthographic projection of the part of the redundant unit and the isolation structure 3 overlapping in the thickness direction Z onto the substrate 1.

[0120] In these embodiments, the redundant unit 6 is recessed relative to the second segment 502. During fabrication, after etching away excess encapsulation material, a portion of the isolation opening 30 and the redundant material are exposed. The remaining encapsulation material forms another portion of the encapsulation portion 50 of the isolation opening 30. Then, the redundant material is etched. First, the redundant material is longitudinally etched along the thickness direction Z to remove the portion of redundant material not covered and protected by the encapsulation portion 50. Then, the redundant material is transversely etched along a direction intersecting the thickness direction Z to remove the redundant material remaining on the sidewalls of the exposed isolation opening 30, improving the adhesion and encapsulation effect of the subsequently fabricated encapsulation portion 50 to the isolation opening 30. During transverse etching, a portion of the redundant material located between the second segment 502 of the encapsulation portion 50 and the isolation structure 3 is also etched away, causing the redundant unit 6 to be recessed relative to the second segment 502, and the area of ​​the second orthographic projection 102 to be smaller than the area of ​​the first orthographic projection 101.

[0121] Optionally, the redundant material may include at least one of the luminescent material and the electrode material between the luminescent material and the encapsulation material.

[0122] Optionally, the isolation opening 30 corresponding to the second segment 502 has a third orthographic projection 103 on the substrate 1. The first orthographic projection 101 includes a first portion that coincides with the second orthographic projection 102 and a second portion located outside the second orthographic projection. The second portion is located on the side of the first portion away from the third orthographic projection. That is, the second portion is disposed relatively away from the isolation opening 30. During lateral etching, the redundant material below the edge of the package portion 50 is etched first.

[0123] Optionally, the first orthographic projection 101 includes a first boundary 1011 that is away from the third orthographic projection 103, and the second orthographic projection 102 includes a second boundary 1021 that is away from the third orthographic projection 103. The first boundary 1011 is located on the side of the second boundary 1021 that is away from the third orthographic projection 103. The first boundary 1011 is the boundary of the second part that is away from the first part.

[0124] Optionally, the distance between the first boundary 1011 and the second boundary 1021 is a, where 0 < a ≤ 1 μm.

[0125] The isolation opening 30 corresponding to the second segment 502 is the isolation opening 30 of the package 50 where the second segment 502 is located. The distance between the first boundary 1011 and the second boundary 1021 can be understood as the distance by which the redundant unit 6 is recessed relative to the second segment 502.

[0126] In these embodiments, the distance between the redundant unit 6 and the inward indentation of the second segment 502 is less than or equal to 1 μm. Correspondingly, the lateral etching can effectively remove redundant material attached to the sidewalls of other isolation openings 30, while retaining more redundant units 6. This results in better protection and support of the redundant units 6, thereby improving the reliability and performance of the display panel. For example, along the direction from the isolation opening 30 to the adjacent isolation opening 30, the length of a single second segment 502 on the isolation structure 3 is 2 μm to 8 μm, such as 2 μm, 4 μm, 6 μm, or 8 μm. By setting 0 < a ≤ 1 μm, the risk of significantly reducing the protection capability of the redundant units 6 and the support effect on the second segment 502 due to etching more redundant material is reduced.

[0127] Optionally, the third orthographic projection 103 is located within the area enclosed by the first boundary 1011. The area enclosed by the first boundary 1011 is larger than the area of ​​the third orthographic projection 103, resulting in a larger coverage area for the second segment 502, which can extend the intrusion path of the etching solution or etching gas. Optionally, the third orthographic projection 103 is located within the area enclosed by the second boundary 1021. The area enclosed by the second boundary 1021 is larger than the area of ​​the third orthographic projection 103, and the redundant unit 6 can effectively prevent the etching solution or etching gas from intruding into the isolation opening 30 from the outside in.

[0128] In some alternative embodiments, at least two adjacent package portions 50 are spaced apart in the orthographic projection of the substrate 1, such as... Figure 3 As shown; and / or, the orthographic projections of at least two adjacent package portions 50 on the substrate 1 at least partially overlap, as shown. Figure 6 As shown.

[0129] Optionally, the second segments 502 of at least two adjacent package portions 50 are spaced apart from each other in the orthographic projection of the isolation structure 3 or the substrate 1. Optionally, the second segments 502 of at least two adjacent package portions 50 at least partially overlap in the orthographic projection of the isolation structure 3 or the substrate 1.

[0130] In these embodiments, some adjacent package portions 50 may be spaced apart in their orthographic projections onto the isolation structure 3 or substrate 1, while some adjacent package portions 50 may be overlapped in their orthographic projections onto the isolation structure 3 or substrate 1. Whether spaced apart or overlapped, the redundant unit 6 below the package portion 50 can protect against the intrusion of etching liquid or etching gas through the gaps and provide support for the upper second segment 502.

[0131] At least two adjacent light-emitting devices 40 have their corresponding encapsulation portions 50 extending towards each other above the isolation structure 3. This allows the orthographic projections of the encapsulation portions 50 corresponding to two adjacent light-emitting functional layers 41 on the substrate 1 to at least partially overlap. In other words, the orthographic projections of at least two adjacent encapsulation portions 50 on the substrate 1 at least partially overlap, resulting in a larger distribution area of ​​the encapsulation portions 50. The overlap of at least partially adjacent encapsulation portions 50 expands the distribution area of ​​the encapsulation portions 50 and improves the encapsulation effect. Furthermore, by having at least one encapsulation portion 50 covered by other encapsulation portions 50, the relative position between the covered encapsulation portion 50 and the isolation structure 3 becomes more stable, making the covered encapsulation portion 50 less prone to damage and preventing encapsulation failure. This further improves the reliability and performance of the display panel.

[0132] Alternatively, the orthographic projections of the encapsulation portion 50 of the display panel onto the isolation structure 3 or the substrate 1 can be spaced apart or overlapped.

[0133] Reference Figure 5 In some alternative embodiments, the material of the redundant unit 6 between the second segment 502 of at least two adjacent encapsulation portions 50 and the isolation structure 3 is different.

[0134] In these embodiments, at least two adjacent package portions 50 correspond to different light-emitting devices 40. The material used to form the first light-emitting device 401 is different from the material used to form the second light-emitting device 402, resulting in different materials for the redundant units 6 under the second segment 502 of the package portion 50. For example, the color of the light-emitting device 40 formed by the first light-emitting material is different from the color of the light-emitting device 40 formed by the second light-emitting material, thereby resulting in different materials for the redundant units 6 formed using different materials.

[0135] In some alternative embodiments, refer to Figure 2 At least two adjacent package portions 50 have second segments 502 spaced apart from each other in the orthographic projection of the isolation structure 3 or the substrate 1, and the redundant units 6 corresponding to the spaced-apart second segments 502 are also spaced apart from each other. Each redundant unit 6 is recessed below the corresponding second segment 502, thereby ensuring that the redundant units 6 corresponding to the spaced-apart second segments 502 are spaced apart from each other, and that the second shortest distance 60 between two adjacent redundant units 6 is greater than the first shortest distance 5020 between the second segments 502 of two adjacent package portions 50. Optionally, there is a first shortest distance 5020 between the second segments 502 of two adjacent package portions 50, and a second shortest distance 60 between the corresponding two adjacent redundant units 6, wherein the first shortest distance 5020 is less than the second shortest distance 60.

[0136] In some alternative embodiments, refer to Figure 5 and Figure 6The second segments 502 of two adjacent encapsulation portions 50 at least partially overlap in the orthographic projection of the isolation structure 3 or the substrate 1. One of the two adjacent second segments 502 includes a first main body portion 5021, a first connecting portion 5022 and a first overlapping portion 5023, and the other includes a second main body portion 5024. The first connecting portion 5022 connects the first main body portion 5021 and the first overlapping portion 5023. The first main body portion 5021 and the second main body portion 5024 are spaced apart. The orthographic projection of the first overlapping portion 5023 in the isolation structure 3 or the substrate 1 and the orthographic projection of the second main body portion 5024 in the isolation structure 3 or the substrate 1 at least partially overlap. At least partially redundant units 6 are provided between the first overlapping portion 5023 and the second main body portion 5024.

[0137] In these embodiments, the first overlapping portion 5023 is located on the side of the second main body portion 5024 away from the substrate 1. The orthographic projection of the first overlapping portion 5023 on the substrate 1 and the orthographic projection of the second main body portion 5024 on the substrate 1 at least partially overlap, so that the first overlapping portion 5023 can cover part of the second main body portion 5024. On the one hand, it can expand the distribution area of ​​the encapsulation portion 50 with the overlapping portion and improve the encapsulation effect; on the other hand, the partial encapsulation portion 50 being covered by the adjacent encapsulation portion 50 can improve the stability of the relative position of the encapsulation portion 50 and the isolation structure 3, and improve the problem of encapsulation failure caused by damage to the second segment 502.

[0138] The redundant unit 6 located between the first overlapping portion 5023 and the second main body portion 5024 can prevent the etching liquid or etching gas from invading into the space between the second main body portion 5024 and the isolation structure 3, and also prevent the etching liquid or etching gas from invading into the space between the first main body portion 5021 and the isolation structure 3. This allows the redundant unit 6 to be positioned relatively ahead of the intrusion path in the gap for protection, thereby improving the protection effect.

[0139] Optionally, the redundancy unit 6 includes a first redundancy part 621, a second redundancy part 622, and a third redundancy part 623. The second redundancy part 622 is connected between the first redundancy part 621 and the third redundancy part 623. The first redundancy part 621 is at least partially located between the first main body part 5021 and the isolation structure 3. The second redundancy part 622 is at least partially located between the first connecting part 5022 and the isolation structure 3. The third redundancy part 623 is at least partially located between the first overlapping part 5023 and the second main body part 5024.

[0140] In these embodiments, the redundant unit 6 is located below the second segment 502 with overlapping portions, and the first redundant portion 621, the second redundant portion 622 and the third redundant portion 623 are arranged continuously. The overall integrity of the redundant unit 6 is better, the protection and support length of the redundant unit 6 is increased, and the protection and support effect is improved.

[0141] Optionally, the orthographic projection of the third redundant portion 623 onto the isolation structure 3 or substrate 1 is located within the orthographic projection of the first overlapping portion 5023 onto the isolation structure 3 or substrate 1. The third redundant portion 623 is recessed relative to the first overlapping portion 5023, that is, the third redundant portion 623 is subjected to transverse etching, which can remove the redundant material remaining on the sidewall of the isolation opening 30 where the light-emitting device 40 has not yet been fabricated, improve the redundant material residue on the sidewall of the isolation opening 30, thereby improving the adhesion and encapsulation effect of the subsequently fabricated encapsulation portion 50 to the isolation opening 30.

[0142] In some optional embodiments, the display panel further includes a first electrode layer and a second electrode layer. The first electrode layer includes a first electrode 42 located between the light-emitting functional layer 41 and the encapsulation portion 50. The second electrode layer includes a second electrode 43 disposed between the substrate 1 and the light-emitting functional layer 41. One of the second electrode 43 and the first electrode 42 can serve as an anode, and the other can serve as a cathode to drive the light-emitting functional layer 41 to emit light. In this embodiment, the first electrode 42 is used as the cathode of the display panel, and the second electrode 43 is used as the anode of the display panel for illustrative purposes.

[0143] The light-emitting functional layer 41 may include one or more of the following: a hole injection layer (HIL), a hole transport layer (HTL), an electron blocking layer, an emitting layer (EML), a hole blocking layer, an electron injection layer (EIL), and an electron transport layer (ETL).

[0144] In some optional embodiments, the material of the redundant unit 6 located within the gap is at least partially the same as the material of the light-emitting device 40 located on the side of the encapsulation portion 50 near the substrate 1 corresponding to the gap. Optionally, the light-emitting device 40 includes a light-emitting functional layer 41 and a first electrode 42 sequentially stacked away from the substrate 1, the encapsulation portion 50 is located on the side of the first electrode 42 away from the substrate 1, at least partially the material of the redundant unit 6 is the same as the material of the light-emitting functional layer 41, and / or, at least partially the material of the redundant unit 6 is the same as the material of the first electrode 42. The redundant unit 6 may be at least one of the light-emitting material and electrode material that has not been etched away.

[0145] Optional, refer to Figure 3The redundancy unit 6 includes a first redundant sublayer 601 and a second redundant sublayer 602 sequentially stacked in the direction away from the substrate 1. The material of the first redundant sublayer 601 is the same as the material of the light-emitting functional layer 41. For example, the first redundant sublayer 601 of the redundancy unit 6 is made of the same material as the corresponding light-emitting functional layer 41. Optionally, the material of the second redundant sublayer 602 is the same as the material of the first electrode 42. The first electrode 42 is disposed on the side of the light-emitting functional layer 41 facing away from the substrate 1, therefore the second redundant sublayer 602 is also located on the side of the first redundant sublayer 601 facing away from the substrate 1.

[0146] Optionally, the material of the isolation structure 3 includes a conductive material, and the first electrode 42 is electrically connected to the isolation structure 3. The isolation structure 3 isolates the first electrode layer to form mutually spaced first electrodes 42, and the mutually spaced first electrodes 42 are electrically connected through the isolation structure 3 to form a full-surface electrode, ensuring the normal light emission of the light-emitting functional layer 41.

[0147] Optionally, the light-emitting device 40 may also include a second electrode 43, which is located on the side of the light-emitting functional layer 41 near the substrate 1.

[0148] Optionally, an array layer may be included between the substrate 1 and the light-emitting device 40. The array layer may include pixel circuitry, which is electrically connected to the first electrode 42. For example, the pixel circuitry disposed in the array layer includes a transistor and a storage capacitor. The transistor includes a semiconductor, a gate, a source, and a drain. The storage capacitor includes a first electrode and a second electrode.

[0149] In some optional embodiments, the isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32 located on the side of the first isolation portion 31 away from the substrate 1, the second isolation portion 32 being disposed protruding from the first isolation portion 31 toward the isolation opening 30.

[0150] Optionally, the material of the first isolation portion 31 may include a conductive material, and the first electrode 42 may be connected to the first isolation portion 31, so that the first electrodes 42 of adjacent sub-pixels can be electrically connected through the first isolation portion 31.

[0151] In these embodiments, by making the second isolation portion 32 protrude from the first isolation portion 31 toward the isolation opening 30, the second isolation portion 32 can block at least part of the material used to prepare the light-emitting layer and the first electrode layer when the light-emitting layer and the first electrode layer of the display panel are deposited, so as to isolate the light-emitting layer and the first electrode layer between adjacent sub-pixels, and facilitate the formation of multiple spaced light-emitting functional layers 41 located in the isolation opening 30 and multiple spaced first electrodes 42 located in the isolation opening 30. As a result, it is not necessary to set a high-precision mask when depositing the light-emitting layer and the first electrode layer of the display panel. For example, it is not necessary to set a high-precision metal mask (FMM) when depositing the light-emitting layer and the first electrode layer, thereby reducing the production cost of the display panel.

[0152] Reference Figure 7 In some optional embodiments, the isolation structure 3 further includes a third isolation portion 33 located on the side of the first isolation portion 31 facing the substrate 1, the third isolation portion 33 protruding from the first isolation portion 31 toward the isolation opening 30. Optionally, the material of the third isolation portion 33 may include a conductive material, and the first electrode 42 may be connected to the third isolation portion 33, so that the first electrodes 42 of adjacent sub-pixels can be electrically connected through the third isolation portion 33. By setting the third isolation portion 33 to protrude from the first isolation portion 31 toward the isolation opening 30, the third isolation portion 33 can have a larger size to facilitate connection with the first electrode 42.

[0153] Optionally, the second isolation part 32 is made of titanium (Ti) or molybdenum (Mo), the first isolation part 31 is made of aluminum (Al), silver (Ag) or copper (Cu), and the third isolation part 33 is made of titanium (Ti) or molybdenum (Mo). For example, the isolation structure 3 is a Ti / Al / Ti (titanium / aluminum / titanium) or Ti / Al / Mo (titanium / aluminum / molybdenum) three-layer metal composite material.

[0154] In some optional embodiments, the display panel further includes a pixel definition layer 2, which is located on one side of the substrate 1 and encloses a plurality of pixel openings 21. The pixel openings 21 are connected to the corresponding isolation openings 30. The light-emitting device 40 includes a second electrode 43 and a light-emitting functional layer 41 stacked sequentially away from the substrate 1. The second electrode 43 is located on the side of the pixel definition layer 2 close to the substrate 1. At least part of the second electrode 43 is exposed in the pixel openings 21, and at least part of the light-emitting functional layer 41 is located within the pixel openings 21.

[0155] Optionally, a second electrode layer is disposed between the pixel definition layer 2 and the substrate 1. The second electrode layer includes a plurality of second electrodes 43, which are located on the side of the light-emitting functional layer 41 closest to the substrate 1. At least a portion of the second electrodes 43 protrudes from the pixel opening 21 to contact the light-emitting functional layer 41, allowing the light-emitting functional layer 41 to be connected to the second electrodes 43 through the pixel opening 21, thereby enabling the second electrodes 43 to drive the light-emitting functional layer 41 to emit light. By fabricating the light-emitting functional layer 41 and the first electrode 42 within the isolation opening 30, the light-emitting functional layer 41 can be driven to emit light through the second electrodes 43 and the first electrode 42.

[0156] In these optional embodiments, the second electrode 43 and the isolation structure 3 can be insulated from each other by the pixel definition layer 2, so that the first electrode 42 is less likely to be short-circuited to the second electrode 43 through the isolation structure 3, thereby improving the working stability of the display panel.

[0157] Optionally, the isolation structure 3 can be disposed on the side of the pixel definition layer 2 facing away from the substrate 1, or the pixel definition layer 2 has a clearance opening, and the isolation structure 3 is located within the clearance opening. This embodiment illustrates the example where the isolation structure 3 is located on the pixel definition layer 2.

[0158] Reference Figure 8 In some optional embodiments, the display panel further includes a second encapsulation layer 7, which is disposed on the side of the first encapsulation layer 5 facing away from the substrate 1. Optionally, the display panel further includes a third encapsulation layer 8 disposed on the side of the second encapsulation layer 7 facing away from the substrate 1. The material of the first encapsulation layer 5 may include inorganic materials, which have good density and good barrier properties against moisture and oxygen. The material of the second encapsulation layer 7 may include organic materials to give the second encapsulation layer 7 good flowability and make the surface of the second encapsulation layer 7 facing away from the substrate 1 relatively flat. The material of the third encapsulation layer 8 may include inorganic materials to further improve the encapsulation effect of the display panel.

[0159] Optionally, the first encapsulation layer 5 can be prepared by chemical vapor deposition (CVD). Optionally, the second encapsulation layer 7 can be prepared by inkjet printing (IJP). Optionally, the third encapsulation layer 8 can be prepared by chemical vapor deposition.

[0160] Optionally, the display panel also includes a touch layer, a polarizing layer, and a cover plate disposed on the third encapsulation layer 8. The touch layer is used to enable touch operation of the display panel, the polarizing layer is used to filter light to improve the display effect of the display panel, and the cover plate is used to protect the underlying film layer to improve the strength of the display panel.

[0161] Please see Figures 1 to 8 and in conjunction with reference Figure 9 , Figure 9 This is one of the schematic flowcharts of a method for manufacturing a display panel according to an embodiment of this application. The plurality of isolation openings 30 may include a first isolation opening 301, a second isolation opening 302, and a third isolation opening 303. The plurality of light-emitting devices 40 may include a first light-emitting device 401, a second light-emitting device 402, and a third light-emitting device 403. The plurality of encapsulation portions may include a first encapsulation portion 51, a second encapsulation portion 52, and a third encapsulation portion 53. The plurality of redundant units 6 may include a first redundant unit 61, a second redundant unit 62, and a third redundant unit 63.

[0162] A second aspect of this application also provides a method for manufacturing a display panel, the method comprising:

[0163] S10, an isolation material layer is prepared on the substrate, and the isolation material layer is patterned to form multiple isolation openings, including a first isolation opening.

[0164] The first isolation opening can be used to accommodate and form the light-emitting functional layer and the first electrode of the first light-emitting device, as well as to accommodate a first encapsulation portion that partially encapsulates the first light-emitting device. The plurality of isolation openings may also include a second isolation opening, which can be fabricated simultaneously with the first isolation opening.

[0165] S20, the first device material layer and the first packaging material layer are sequentially prepared on the entire surface of the substrate.

[0166] S30, the first encapsulation material layer is patterned to form a first encapsulation portion corresponding to the first isolation opening.

[0167] Patterning the first encapsulation material layer includes etching away the first encapsulation material layer located within the second isolation opening to expose the first device material layer located within the second isolation opening.

[0168] S40, the first device material layer is patterned to form a first light-emitting device and a first redundant unit corresponding to the first isolation opening.

[0169] Patterning the first device material layer includes etching away the first device material layer located within the second isolation opening to re-expose the second isolation opening.

[0170] The first package includes a first segment located within a first isolation opening and a second segment extending from the first segment to the side of the isolation material layer away from the substrate. A first gap is formed between the second segment and the side of the isolation material layer away from the substrate. A first redundant unit is located in the first gap, and the orthographic projection of the first redundant unit on the isolation material layer is located within the orthographic projection of the second segment on the isolation material layer.

[0171] In a method for fabricating a display panel provided in this application embodiment, after patterning the first encapsulation material layer and the first device material layer to form the first encapsulation portion and the first light-emitting device, a first redundant unit is still retained. The first redundant unit can prevent etching liquid or etching gas from penetrating between the encapsulation portion and the side of the isolation structure during the subsequent fabrication of other light-emitting devices, thereby reducing the etching damage caused to the side of the isolation structure or the interior of the encapsulation portion, thus improving the encapsulation effect of the encapsulation portion and reducing the generation of dark spots in the display panel. On the other hand, the first redundant unit can also provide support for the second segment of the first encapsulation portion, reducing the probability of the second segment failing in subsequent processes and improving the reliability of the encapsulation.

[0172] Please refer to the following: Figure 10 and Figure 11 , Figure 10 This is a second schematic flowchart of a method for manufacturing a display panel provided in an embodiment of this application; Figure 11 This is a schematic diagram of the structural process of a method for manufacturing a display panel provided in an embodiment of this application. Figure 11 The etching is carried out in sequence from (1) to (6), and the arrows in the figure indicate the etching direction of the etching material.

[0173] In some optional embodiments, the first isolation opening and a portion of the isolation material layer surrounding the first isolation opening constitute a first isolation region, and step S40 includes:

[0174] S401, using a first etching material to etch away part of the first device material layer outside the first isolation area along the thickness direction of the display panel.

[0175] S402, using a second etching material to etch away a portion of the first device material layer remaining outside the first isolation region along a direction intersecting the thickness direction.

[0176] In these embodiments, after etching away excess first encapsulation material, the first device material outside the first isolation region is exposed. Further etching of the first device material is then required to expose the isolation material layer and isolation openings at other locations. First, the first device material is longitudinally etched along the thickness direction Z using a first etching material. This removes the portion of the first device material not covered or protected by the first encapsulation portion and exposes other isolation openings. Then, the remaining first device material is transversely etched along a direction intersecting the thickness direction Z using a second etching material. This removes the remaining first device material on the sidewalls of the isolation openings, improving the adhesion between the subsequently fabricated encapsulation portion and the isolation opening, and thus enhancing the encapsulation effect. During transverse etching, a portion of the first device material located between the second segment of the first encapsulation portion and the isolation material layer is also etched away, causing the first redundant unit to be recessed relative to the second segment.

[0177] Optionally, the first etching material includes oxygen. Optionally, the second etching material includes oxygen. Using oxygen as an etching material can effectively etch away the first device material and reduce the impact on the first package during etching.

[0178] Optionally, the first etching material is the same as the second etching material.

[0179] Optionally, a dry etching process can be used to pattern the first device material layer. Compared with wet etching, dry etching can reduce etching damage to the first device material covered by the second segment of the first package, thereby effectively preserving this portion of the first device material to form the first redundant unit.

[0180] Optionally, step S401 includes:

[0181] Remove the first device material layer located on the side of the isolation material layer that faces away from the substrate and is not covered by the first package portion.

[0182] Remove a portion of the first device material layer located at the first isolation opening.

[0183] In these embodiments, the two etching steps can be performed simultaneously without any order of priority. The first etching material simultaneously etches the side of the isolation material layer away from the substrate and the first device material within the first isolation opening.

[0184] In some optional embodiments, the plurality of isolation openings further includes a second isolation opening, which optionally is disposed adjacent to the first isolation opening. The second isolation opening can be used to accommodate and form the light-emitting functional layer and the first electrode of the second light-emitting device, as well as to accommodate a second encapsulation portion that partially encapsulates the second light-emitting device. Optionally, the light emission color of the first light-emitting device is different from the light emission color of the second light-emitting device.

[0185] Step S402 includes: removing the first device material layer remaining on the sidewall of the second isolation opening; and / or, removing a portion of the first device material layer remaining within the first gap to form a first redundant unit. These two steps can be performed simultaneously, simplifying the fabrication process.

[0186] In some optional embodiments, after step S20 and before step S30, the preparation method further includes:

[0187] A first protective layer is prepared on a first encapsulation material layer, and the first protective layer is patterned to form a first protective portion that covers the first isolation opening and surrounds the first isolation opening with a portion of the isolation material layer.

[0188] Figure 11 The diagram shows a first protective layer 500. The area covered by the first protective layer includes the aforementioned first isolation region. Optionally, the material of the first protective layer includes photoresist. Fabricating the first protective layer on the first packaging material layer and patterning the first protective layer may include photoresist coating, exposure, and development processes.

[0189] Optionally, after step S40, the fabrication method further includes removing the first protective portion. After fabricating the first light-emitting device and the first encapsulation portion, the first protective portion is removed to facilitate the subsequent fabrication of the second light-emitting device.

[0190] In some optional embodiments, step S30 includes:

[0191] The third etching material is used to etch away part of the first encapsulation material layer outside the first protective part along the thickness direction of the display panel, and the fourth etching material is used to etch away the remaining first encapsulation material layer outside the first protective part along the direction intersecting with the thickness direction.

[0192] Similar to step S40, step S30 may also include longitudinal etching and transverse etching processes to etch away the first encapsulation material attached to the sidewalls of the isolation openings other than the first isolation opening. This facilitates the subsequent fabrication of the light-emitting device and the encapsulation part, and exposes the first device material attached to the sidewalls of the isolation openings so that it can be removed by etching in step S402.

[0193] Optionally, the third etching material includes a fluoride etching gas. Optionally, the fourth etching material includes a fluoride etching gas. Optionally, the fluoride etching gas includes at least one of carbon tetrafluoride, nitrogen trifluoride, and sulfur hexafluoride.

[0194] Optionally, the plurality of isolation openings also include a second isolation opening, and the step of using a third etching material to etch away a portion of the first encapsulation material layer outside the first protective portion along the thickness direction of the display panel includes:

[0195] Remove the first encapsulation material layer that is not covered by the first protective part.

[0196] The step of removing the remaining portion of the first encapsulation material layer by etching with a fourth etching material in a direction intersecting the thickness direction includes:

[0197] Remove the first encapsulation material layer that remains on the sidewall of the second isolation opening.

[0198] In these embodiments, due to the undercut morphology of the second isolation opening, the first encapsulation material located on the sidewall of the second isolation opening is prone to remain after longitudinal etching. By using a fourth etching material to perform transverse etching in a direction intersecting the thickness direction, the residual first encapsulation material attached to the sidewall of the second isolation opening can be effectively removed.

[0199] In some optional embodiments, the plurality of isolation openings further includes a second isolation opening, and after the step of patterning the first device material layer, the fabrication method further includes:

[0200] A second device material layer and a second encapsulation material layer are sequentially fabricated on the entire surface of the substrate.

[0201] The second encapsulation material layer is patterned to form a second encapsulation portion corresponding to the second isolation opening.

[0202] The second device material layer is patterned to form a second light-emitting device corresponding to the second isolation opening.

[0203] The second package includes a first segment located within the second isolation opening and a second segment extending from the first segment to the side of the isolation material layer away from the substrate. A second gap is formed between the second segment and the side of the isolation material layer away from the substrate. A second device material layer is partially filled in the second gap to form a second redundant unit. The orthographic projection of the second redundant unit onto the isolation material layer is located within the orthographic projection of the second segment onto the isolation material layer.

[0204] The subsequent steps for fabricating the second light-emitting device, the second packaging section, and the third light-emitting device and the third packaging section, as well as their beneficial effects, can be carried out with reference to the steps for fabricating the first light-emitting device and the first packaging section, and will not be repeated here.

[0205] Optionally, the second redundant unit is spaced apart from the first redundant unit. The shape of the second redundant unit can be similar to the second segment of the second package. The second redundant unit is spaced apart from the first redundant unit, meaning that the second redundant unit is not connected to the first redundant unit. At least one of the first redundant units is recessed relative to the first segment of the first package, reducing the amount of first device material remaining on the sidewalls of the second and third isolation openings for subsequent fabrication of the light-emitting device.

[0206] Optionally, the orthographic projection of the second redundant unit on the substrate overlaps with the orthographic projection of the first redundant unit on the substrate. The etching process of the second redundant unit refers to the etching process of the first redundant unit. If the orthographic projection of the second segment of the second package on the substrate overlaps with the orthographic projection of the second segment of the first package on the substrate, the orthographic projection of the second redundant unit on the substrate will also overlap with the orthographic projection of the first redundant unit on the substrate. This extends the penetration path of the etching solution or etching gas during the subsequent fabrication of the third light-emitting device, resulting in better overall integrity of the second redundant unit, increased protection and support length of the second redundant unit, and improved protection and support effect.

[0207] In some optional embodiments, the preparation method further includes:

[0208] A third isolation opening is made in the isolation material layer;

[0209] The step of creating the third isolation opening on the isolation material layer is performed before the step of sequentially preparing the first device material layer and the first packaging material layer on the substrate; or, the step of creating the third isolation opening on the isolation material layer is performed after the step of patterning the second device material layer.

[0210] In these embodiments, the third isolation opening can be fabricated simultaneously with the first isolation opening, which simplifies the fabrication process. Alternatively, the third isolation opening can be created after the second light-emitting device is fabricated, which reduces the impact of the fabrication processes of the first and second light-emitting devices on the morphology of the third isolation opening.

[0211] Optionally, the first isolation opening, the second isolation opening, and the third isolation opening are formed in the same process.

[0212] Optionally, after the step of creating the third isolation opening on the isolation material layer and the step of patterning the second device material layer, the fabrication method further includes:

[0213] A third device material layer and a third encapsulation material layer are sequentially fabricated on the entire surface of the substrate;

[0214] The third encapsulation material layer is patterned to form a third encapsulation portion corresponding to the third isolation opening.

[0215] The third device material layer is patterned to form a third light-emitting device corresponding to the third isolation opening.

[0216] The third package includes a first segment located within a third isolation opening and a second segment extending from the first segment to the side of the isolation material layer facing away from the substrate. A third gap is formed between the second segment and the side of the isolation material layer facing away from the substrate. A third device material layer is partially filled in the third gap to form a third redundant unit. The orthographic projection of the third redundant unit onto the substrate is located within the orthographic projection of the second segment onto the substrate.

[0217] Optionally, the third redundant unit is spaced apart from the second redundant unit, and / or the third redundant unit is spaced apart from the first redundant unit. The third isolation opening can be adjacent to the second isolation opening, or simultaneously adjacent to the first isolation opening, for example, in an arrangement where the first, second, and third isolation openings are alternately arranged. Therefore, the third redundant unit can be adjacent to and spaced apart from the second redundant unit, and the third redundant unit can be adjacent to and spaced apart from the first redundant unit.

[0218] Optionally, the orthographic projection of the third redundant unit on the substrate overlaps with the orthographic projection of the first redundant unit on the substrate. If the orthographic projection of the second segment of the third package on the substrate overlaps with the orthographic projection of the second segment of the first package on the substrate, the orthographic projection of the third redundant unit on the isolation material layer can overlap with the orthographic projection of the first redundant unit on the isolation material layer.

[0219] Optionally, the orthographic projection of the third redundant unit on the substrate overlaps with the orthographic projection of the second redundant unit on the substrate. If the orthographic projection of the second segment of the third package on the substrate overlaps with the orthographic projection of the second segment of the second package on the substrate, the orthographic projection of the third redundant unit on the substrate may overlap with the orthographic projection of the second redundant unit on the substrate.

[0220] An embodiment of the third aspect of this application provides a display device, which includes a display panel provided in any of the first aspect embodiments or a display panel prepared according to any of the second aspect embodiments. Since the display device provided in the third aspect embodiment includes the display panel provided in any of the first aspect embodiments, it has the beneficial effects of the display panel in any of the first aspect embodiments, which will not be elaborated further here.

[0221] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0222] The embodiments described above are not exhaustive, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses and forms a plurality of isolation openings; Multiple light-emitting devices, at least a portion of which are located in the corresponding isolation openings; A first encapsulation layer includes a plurality of encapsulation portions, each encapsulation portion being disposed on the side of the corresponding light-emitting device away from the substrate and extending to the side of the isolation structure away from the substrate, with a gap formed between the encapsulation portion and the side of the isolation structure away from the substrate. A redundant unit is disposed within the gap, and the orthographic projection of the redundant unit onto the substrate is located at the periphery of the gap within the orthographic projection of the substrate.

2. The display panel according to claim 1, characterized in that, The packaging unit includes: The first segment is located on the side of the corresponding light-emitting device that is away from the substrate; The second segment is connected to the first segment and extends to the side of the isolation structure away from the substrate, and the gap is formed between the second segment and the side of the isolation structure away from the substrate. Preferably, the second segment has a first orthographic projection on the isolation structure, and the redundant unit has a second orthographic projection on the isolation structure, wherein the area of ​​the second orthographic projection is smaller than the area of ​​the first orthographic projection. Preferably, the isolation opening corresponding to the second segment has a third orthographic projection on the substrate. The first orthographic projection includes a first portion that coincides with the second orthographic projection and a second portion located outside the second orthographic projection. The second portion is located on the side of the first portion away from the third orthographic projection. Preferably, the first orthographic projection includes a first boundary away from the third orthographic projection, the second orthographic projection includes a second boundary away from the third orthographic projection, and the first boundary is located on the side of the second boundary away from the third orthographic projection; Preferably, the distance between the first boundary and the second boundary is a, where 0 < a ≤ 1 μm; Preferably, the third orthographic projection is located within the area enclosed by the first boundary; and / or, the third orthographic projection is located within the area enclosed by the second boundary.

3. The display panel according to claim 2, characterized in that, At least two adjacent package portions are spaced apart in the orthographic projection of the substrate; and / or, The orthographic projections of at least two adjacent package portions onto the substrate at least partially overlap; Preferably, the second segments of at least two adjacent encapsulation portions are spaced apart from each other in the orthographic projection of the isolation structure; and / or, the second segments of at least two adjacent encapsulation portions at least partially overlap in the orthographic projection of the isolation structure. Preferably, the redundant units between at least two adjacent segments of the second portion of the encapsulation and the isolation structure are made of different materials.

4. The display panel according to claim 3, characterized in that, At least two adjacent second segments of the encapsulation portion are spaced apart from each other in the orthographic projection of the isolation structure, and the redundant units corresponding to the two spaced second segments are spaced apart from each other. Preferably, there is a first shortest distance between the second segments of two adjacent encapsulation portions, and there is a second shortest distance between two corresponding adjacent redundant units, wherein the first shortest distance is less than the second shortest distance.

5. The display panel according to claim 3, characterized in that, The second segments of two adjacent encapsulation portions at least partially overlap in their orthographic projections onto the isolation structure. Of the two adjacent second segments, one includes a first main body, a first connecting portion, and a first overlapping portion, and the other includes a second main body. The first connecting portion connects the first main body and the first overlapping portion. The first main body and the second main body are spaced apart. The orthographic projections of the first overlapping portion and the second main body in the isolation structure at least partially overlap. At least a portion of the redundant units are provided between the first overlapping portion and the second main body portion.

6. The display panel according to claim 5, characterized in that, The redundancy unit includes a first redundancy part, a second redundancy part, and a third redundancy part. The second redundancy part is connected between the first redundancy part and the third redundancy part. The first redundancy part is at least partially located between the first main body part and the isolation structure. The second redundancy part is at least partially located between the first connecting part and the isolation structure. The third redundancy part is at least partially located between the first overlapping part and the second main body part. Preferably, the orthographic projection of the third redundant portion onto the isolation structure is located within the orthographic projection of the first overlapping portion onto the isolation structure.

7. The display panel according to claim 1, characterized in that, The material of the redundant unit located within the gap is at least partially the same as the material of the light-emitting device located on the side of the packaging portion near the substrate corresponding to the gap; Preferably, the light-emitting device includes a light-emitting functional layer and a first electrode stacked sequentially along the path away from the substrate, the encapsulation portion is located on the side of the first electrode away from the substrate, at least a portion of the material of the redundant unit is the same as the material of the light-emitting functional layer, and / or, at least a portion of the material of the redundant unit is the same as the material of the first electrode; Preferably, the material of the isolation structure includes a conductive material, and the first electrode is electrically connected to the isolation structure; Preferably, the redundant unit includes a first redundant sublayer and a second redundant sublayer stacked sequentially in a direction away from the substrate, wherein the material of the first redundant sublayer is the same as the material of the light-emitting functional layer, and / or the material of the second redundant sublayer is the same as the material of the first electrode.

8. The display panel according to claim 1, characterized in that, The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the substrate, wherein the second isolation portion protrudes from the first isolation portion toward the isolation opening; Preferably, the isolation structure further includes a third isolation portion located on the side of the first isolation portion facing the substrate, the third isolation portion being disposed protruding from the first isolation portion toward the isolation opening; Preferably, the first isolation portion includes a conductive material, and / or the third isolation portion includes a conductive material.

9. The display panel according to claim 1, characterized in that, Also includes: A pixel definition layer is located on one side of the substrate and encloses a plurality of pixel openings. The pixel openings are connected to the corresponding isolation openings. The light-emitting device includes a second electrode and a light-emitting functional layer stacked sequentially away from the substrate. The second electrode is located on the side of the pixel definition layer closer to the substrate. At least a portion of the second electrode is exposed in the pixel openings. At least a portion of the light-emitting functional layer is located within the pixel openings. Preferably, the isolation structure is located on the side of the pixel definition layer opposite to the substrate, or the pixel definition layer has a clearance opening and the isolation structure is located within the clearance opening; Preferably, the display panel further includes a second encapsulation layer, which is disposed on the side of the first encapsulation layer opposite to the substrate; Preferably, the material of the first encapsulation layer includes inorganic materials, and / or the material of the second encapsulation layer includes organic materials.

10. A method for manufacturing a display panel, characterized in that, The preparation method includes: An isolation material layer is prepared on a substrate, and the isolation material layer is patterned to form a plurality of isolation openings, wherein the plurality of isolation openings include a first isolation opening; A first device material layer and a first encapsulation material layer are sequentially fabricated on the entire surface of the substrate; The first encapsulation material layer is patterned to form a first encapsulation portion corresponding to the first isolation opening; The first device material layer is patterned to form a first light-emitting device and a first redundant unit corresponding to the first isolation opening; The first encapsulation portion includes a first segment located within the first isolation opening and a second segment extending from the first segment to the side of the isolation material layer opposite to the substrate. A first gap is formed between the second segment and the side of the isolation material layer opposite to the substrate. The first redundant unit is located in the first gap, and the orthographic projection of the first redundant unit on the isolation material layer is located within the orthographic projection of the second segment on the isolation material layer.

11. The preparation method according to claim 10, characterized in that, The first isolation opening and the portion of the isolation material layer surrounding the first isolation opening constitute a first isolation region. The step of patterning the first device material layer includes: The first etching material is used to etch away a portion of the first device material layer outside the first isolation area along the thickness direction of the display panel. The remaining portion of the first device material layer outside the first isolation area is removed by etching with a second etching material along a direction intersecting the thickness direction; Preferably, the first etching material includes oxygen, and / or the second etching material includes oxygen; Preferably, the first etching material is the same as the second etching material; Preferably, the material layer of the first device is patterned using a dry etching process.

12. The preparation method according to claim 11, characterized in that, The step of using a first etching material to etch away a portion of the first device material layer outside the first isolation area along the thickness direction of the display panel includes: Remove the first device material layer located on the side of the isolation material layer facing away from the substrate and not covered by the first package portion; Remove the portion of the first device material layer located at the first isolation opening.

13. The preparation method according to claim 11, characterized in that, The plurality of isolation openings further includes a second isolation opening, and the step of using a second etching material to etch away a portion of the first device material layer remaining outside the first isolation region in a direction intersecting the thickness direction includes: Remove the first device material layer remaining on the sidewall of the second isolation opening; and / or remove a portion of the first device material layer remaining within the first gap to form the first redundant unit.

14. The preparation method according to claim 10, characterized in that, Before the step of patterning the first encapsulation material layer, the preparation method further includes: A first protective layer is prepared on the first encapsulation material layer, and the first protective layer is patterned to form a first protective portion that covers the first isolation opening and surrounds the first isolation opening with a portion of the isolation material layer. Preferably, after the step of patterning the first device material layer, the fabrication method further includes: removing the first protective portion; Preferably, the material of the first protective portion includes photoresist.

15. The preparation method according to claim 14, characterized in that, The step of patterning the first encapsulation material layer includes: The third etching material is used to etch away part of the first encapsulation material layer outside the first protective part along the thickness direction of the display panel, and the fourth etching material is used to etch away the remaining first encapsulation material layer outside the first protective part along the direction intersecting the thickness direction. Preferably, the third etching material comprises a fluoride etching gas, and / or the fourth etching material comprises a fluoride etching gas; Preferably, the fluoride etching gas includes at least one of carbon tetrafluoride, nitrogen trifluoride, and sulfur hexafluoride.

16. The preparation method according to claim 15, characterized in that, The plurality of isolation openings further include a second isolation opening, and the step of using a third etching material to etch away the portion of the first encapsulation material layer outside the first protective portion along the thickness direction of the display panel includes: Remove the first encapsulation material layer that is not covered by the first protective part; The step of removing the remaining portion of the first encapsulation material layer by etching with the fourth etching material along a direction intersecting the thickness direction includes: Remove the first encapsulation material layer that remains on the sidewall of the second isolation opening.

17. The preparation method according to claim 10, characterized in that, The plurality of isolation openings further includes a second isolation opening, and after the step of patterning the first device material layer, the fabrication method further includes: A second device material layer and a second encapsulation material layer are sequentially fabricated on the entire surface of the substrate. The second encapsulation material layer is patterned to form a second encapsulation portion corresponding to the second isolation opening. The second device material layer is patterned to form a second light-emitting device corresponding to the second isolation opening; The second encapsulation portion includes a first segment located within the second isolation opening and a second segment extending from the first segment to the side of the isolation material layer facing away from the substrate. A second gap is formed between the second segment and the side of the isolation material layer facing away from the substrate. The second device material layer is partially filled in the second gap to form a second redundant unit. The orthographic projection of the second redundant unit on the isolation material layer is located within the orthographic projection of the second segment on the isolation material layer. Preferably, the second redundant unit is spaced apart from the first redundant unit; Preferably, the orthographic projection of the second redundant unit on the substrate overlaps with the orthographic projection of the first redundant unit on the substrate.

18. The preparation method according to claim 17, characterized in that, The preparation method further includes: A third isolation opening is formed in the isolation material layer; Wherein, the step of forming the third isolation opening on the isolation material layer is before the step of sequentially preparing the first device material layer and the first encapsulation material layer on the substrate; or, the step of forming the third isolation opening on the isolation material layer is after the step of patterning the second device material layer; Preferably, the first isolation opening, the second isolation opening, and the third isolation opening are formed in the same process.

19. The preparation method according to claim 17, characterized in that, After the step of creating the third isolation opening on the isolation material layer and after the step of patterning the second device material layer, the fabrication method further includes: A third device material layer and a third encapsulation material layer are sequentially fabricated on the entire surface of the substrate; The third encapsulation material layer is patterned to form a third encapsulation portion corresponding to the third isolation opening; The third device material layer is patterned to form a third light-emitting device corresponding to the third isolation opening; The third packaging portion includes a first segment located within the third isolation opening and a second segment extending from the first segment to the side of the isolation material layer facing away from the substrate. A third gap is formed between the second segment and the side of the isolation material layer facing away from the substrate. The third device material layer is partially filled in the third gap to form a third redundant unit. The orthographic projection of the third redundant unit on the isolation material layer is located within the orthographic projection of the second segment on the isolation material layer. Preferably, the third redundant unit is spaced apart from the second redundant unit, and / or the third redundant unit is spaced apart from the first redundant unit; Preferably, the orthographic projection of the third redundant unit on the substrate overlaps with the orthographic projection of the first redundant unit on the substrate; Preferably, the orthographic projection of the third redundant unit on the substrate overlaps with the orthographic projection of the second redundant unit on the substrate.

20. A display device, characterized in that, The display panel includes the display panel as described in any one of claims 1 to 9 or the display panel as described in any one of claims 10 to 19, which is prepared by the method of preparing the display panel.

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