Display substrate and display device

Abstract

The invention discloses a display substrate and a display device, the display substrate is provided with a plurality of pixel areas, and each pixel area comprises a shared sub-pixel area and a peep-proof sub-pixel area; the display substrate includes: a substrate; the shared sub-pixel area and the peep-proof sub-pixel area are both provided with the light-emitting devices; the shading layer is positioned on one side, far away from the substrate, of the plurality of light emitting devices and is provided with a plurality of light transmitting openings; a first functional layer between the plurality of light emitting devices and the light shielding layer; the shared sub-pixel area comprises a middle light-emitting area and edge light-emitting areas, and the edge light-emitting areas are at least located on the two opposite sides of the middle light-emitting area in the first direction; the first functional layer comprises a first functional part at least located in the peep-proof sub-pixel area and a hollow part at least located in the edge light emitting area; or the first functional layer comprises a first functional part at least located in the peep-proof sub-pixel area and a second functional part at least located in the edge light-emitting area, and the maximum thickness of the second functional part is smaller than that of the first functional part.

Description

Display substrate and display device TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, in particular to a display substrate and a display device. BACKGROUND

[0002] With the increasing application of display technology, people will like to share information with others, but in special cases, they also hope to have privacy. For example, some display products have a privacy mode and a sharing mode. In the privacy mode, only the user in a small visual angle position can see the display screen; in the sharing mode, users in a large visual angle range can see the display screen.

[0003] SUMMARY

[0004] The present disclosure provides a display substrate and a display device.

[0005] In a first aspect, the present disclosure provides a display substrate having a plurality of pixel regions, the pixel regions comprising a shared sub-pixel region and a privacy sub-pixel region; the display substrate comprising:

[0006] a substrate;

[0007] a plurality of light emitting devices disposed on the substrate, wherein the shared sub-pixel region and the privacy sub-pixel region are both provided with the light emitting devices;

[0008] a light shielding layer located on a side of the plurality of light emitting devices away from the substrate, and having a plurality of light transmission openings, wherein a projection of each of the light emitting devices on the substrate overlaps with a projection of the light transmission opening on the substrate;

[0009] a first functional layer located between the plurality of light emitting devices and the light shielding layer;

[0010] wherein the shared sub-pixel region comprises a middle light emitting region and an edge light emitting region, and the edge light emitting region is located at least on opposite sides of the middle light emitting region along a first direction;

[0011] the first functional layer comprises a first functional part located at least in the privacy sub-pixel region, and a hollow part located at least in the edge light emitting region; or the first functional layer comprises a first functional part located at least in the privacy sub-pixel region, and a second functional part located at least in the edge light emitting region, wherein a maximum thickness of the second functional part is less than a maximum thickness of the first functional part.

[0012] In some embodiments, the first functional layer comprises a first functional part and a second functional part, the second functional part comprises a plurality of lens parts, and at least part of the plurality of lens parts is located in the edge light emitting region; a surface of the lens part away from the substrate is a convex surface.

[0013] The display substrate further comprises a second functional layer between the first functional layer and the light shielding layer, the second functional layer is in contact with the convex surface, and a refractive index of the second functional layer is less than a refractive index of the lens portion.

[0014] In some embodiments, the plurality of lens portions are located in the edge light-emitting area, the first functional layer further comprises a flat portion located in the middle light-emitting area, a maximum thickness of the flat portion is not greater than a maximum thickness of the first functional portion,

[0015] The maximum thickness of the lens portion is less than the maximum thickness of the flat portion.

[0016] In some embodiments, the plurality of lens portions are arranged in sequence along the first direction, and a part of the plurality of lens portions are located in the edge light-emitting area, and another part are located in the middle light-emitting area.

[0017] In some embodiments, a ratio of a width of the lens portion in the first direction to a width of the shared sub-pixel area in the first direction is 1 / 10-1 / 5.

[0018] In some embodiments, the first functional layer comprises: a first functional portion located at least in the anti-peep sub-pixel area, a hollow portion located in the edge light-emitting area, and a flat portion located in the middle light-emitting area, a maximum thickness of the flat portion is not greater than a maximum thickness of the first functional portion.

[0019] In some embodiments, the first functional layer comprises: a first functional portion and a hollow portion, a part of the hollow portion is located in the middle light-emitting area, and another part is located in the edge light-emitting area.

[0020] In some embodiments, a ratio of a width of the hollow portion in the second direction to a width of the shared sub-pixel area in the second direction is greater than or equal to 70%.

[0021] In some embodiments, the first functional layer comprises: a first functional portion and a second functional portion, a part of the second functional portion is located in the edge light-emitting area, and another part is located in the middle light-emitting area; the second functional portion is a flat surface both towards the surface of the substrate and away from the surface of the substrate.

[0022] In some embodiments, the first functional layer is an organic encapsulation layer, and the display substrate further comprises: a first inorganic encapsulation layer and a second inorganic encapsulation layer, the first inorganic encapsulation layer, the organic encapsulation layer and the second inorganic encapsulation layer are sequentially arranged in a direction away from the substrate, forming an encapsulation structure for encapsulating the plurality of light-emitting devices.

[0023] In some embodiments, the first functional layer comprises a hollow part, and a portion of the second inorganic encapsulation layer is located in the hollow part and in contact with the first inorganic encapsulation layer.

[0024] Alternatively, the first functional layer is a continuous film layer, and the second inorganic encapsulation layer is conformal to the first functional layer away from the surface of the substrate.

[0025] In some embodiments, the ratio of the maximum thickness of the second functional part to the maximum thickness of the first functional part is 7 / 10-9 / 10.

[0026] In some embodiments, the first functional layer further comprises a third functional part, the third functional part surrounds the middle light-out area, and the third functional part away from the surface of the substrate is in contact with the first functional part away from the surface of the substrate.

[0027] In the direction close to the middle light-out area, the distance from the third functional part away from the surface of the substrate to the substrate gradually decreases.

[0028] In some embodiments, the plurality of light-transmitting openings comprises a plurality of first light-transmitting openings and a plurality of second light-transmitting openings, the anti-peep sub-pixel area comprises at least one anti-peep pixel part, and each of the anti-peep pixel parts is provided with the light-emitting device; the light-emitting device comprises a light-emitting layer.

[0029] The anti-peep pixel part corresponds to the first light-transmitting opening in one-to-one correspondence, and the shared sub-pixel area corresponds to the second light-transmitting opening in one-to-one correspondence.

[0030] The orthographic projection of the first light-transmitting opening on the substrate is located within the orthographic projection range of the light-emitting layer in the anti-peep pixel part on the substrate, and the orthographic projection of the light-emitting layer in the shared sub-pixel area on the substrate is located within the orthographic projection range of the second light-transmitting opening on the substrate.

[0031] In a second aspect, the present disclosure provides a display device comprising the display substrate as described above. BRIEF DESCRIPTION OF DRAWINGS

[0032] The accompanying drawings are included to provide a further understanding of the present disclosure and constitute a part of the specification, and are used together with the specific embodiments described below to explain the present disclosure, but do not constitute a limitation on the present disclosure. In the drawings:

[0033] FIG. 1 is a schematic diagram of the area division of a display substrate provided in some embodiments.

[0034] FIG. 2 is a plan view of a light-blocking layer and a pixel area provided in some embodiments.

[0035] FIG. 3 is a cross-sectional view of the display substrate along lines A-A' and B-B' in FIG. 2 according to some embodiments.

[0036] FIG. 4A is a cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0037] FIG. 4B is another cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0038] FIG. 5 is a schematic view of the connection between a light emitting device and a driving circuit layer according to some embodiments of the present disclosure.

[0039] FIGS. 6A to 6D are schematic views of the preparation process of the organic encapsulation layer in FIG. 4A.

[0040] FIG. 7 is a further cross-sectional view of a display substrate according to some embodiments of the present disclosure.

[0041] FIG. 8 is a cross-sectional view of a display substrate according to a second embodiment of the present disclosure.

[0042] FIG. 9 is a schematic view of the display substrate in FIG. 8 after removing the cover layer, the light shielding layer, the color filter portion, the spacer layer, and the second inorganic encapsulation layer.

[0043] FIG. 10 is a cross-sectional view of a display substrate according to a third embodiment of the present disclosure.

[0044] FIG. 11 is a cross-sectional view of a display substrate according to a fourth embodiment of the present disclosure.

[0045] FIG. 12 is a schematic view of the display substrate in FIG. 11 after removing the cover layer, the light shielding layer, the color filter portion, the spacer layer, and the second inorganic encapsulation layer.

[0046] FIG. 13 is a cross-sectional view of a display substrate according to a fifth embodiment of the present disclosure. DETAILED DESCRIPTION

[0047] The specific embodiments of the present disclosure will be described below in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely intended to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.

[0048] To make the objects, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described below in a clear and complete manner with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are only some of the embodiments of the present disclosure, rather than all the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative effort belong to the scope of the present disclosure.

[0049] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the meanings as commonly understood by one of ordinary skill in the art to which this present disclosure belongs. The terms "first", "second", and similar terms are used herein to distinguish one element from another, and are not necessarily used in a sequence. Also, the terms "include", "comprise", and the like are used herein not to limit the components listed after these terms but to encompass the components listed after these terms and equivalents thereof. The terms "connected", "coupled", and similar terms are used herein to include physical or mechanical connections, electrical connections, or logical connections, and combinations thereof. The terms "upper", "lower", "left", "right", and the like are used herein merely to reflect relative positional relationships, and can change when the absolute positions of the described objects are changed.

[0050] As used herein, "parallel", "perpendicular" include the recited condition and conditions that are approximately the recited condition, the range of which is within an acceptable deviation range, as determined by one of ordinary skill in the art taking into account the measurement being discussed and the error associated with a particular measurement (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the acceptable deviation range for approximately parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximately perpendicular, where the acceptable deviation range for approximately perpendicular can also be, for example, within 5°.

[0051] It is to be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers can also be present.

[0052] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are idealized examples. In the interest of clarity, not all of the layer and regions are shown in the drawings with the same dimensions. For example, the thickness of layers and regions can be exaggerated in some drawings for clarity. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated in the drawings, which are schematic, but include shapes that result from, for example, manufacturing. The regions illustrated in the drawings are schematic and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the exemplary embodiments in terms of scope. In the drawings:

[0053] FIG. 1 is a schematic diagram of the regional division of a display substrate provided in some embodiments, FIG. 2 is a plan view of a light-shielding layer and a pixel region provided in some embodiments, and FIG. 3 is a cross-sectional view of the display substrate along line A-A' and line B-B' in FIG. 2. As shown in FIGS. 1 to 3, the display substrate has a display area AA and a peripheral area NA surrounding the display area AA. The display area AA includes a plurality of pixel regions P0, and each pixel region P0 is used to emit light of one color, for example, red light, green light, or blue light; the plurality of pixel regions P0 in the display area AA can form a plurality of pixel units, and each pixel unit can include: a pixel region P0 for emitting red light, a pixel region P0 for emitting green light, and a pixel region P0 for emitting blue light. The plurality of pixel regions P0 in the display area AA can be arranged in an array. For example, the plurality of pixel units are arranged in an array, and the plurality of pixel regions P0 in each pixel unit are arranged in the row direction; or for another example, the plurality of pixel units are arranged in an array, and the plurality of pixel regions P0 in each pixel unit are arranged in a "pin" shape, that is, each pixel unit includes three pixel regions P0, and these three pixel regions P0 are arranged in two rows, with one pixel region P0 arranged in one row and two pixel regions P0 arranged in the other row.

[0054] Among them, the pixel region P0 includes a shared sub-pixel region S-D and a privacy sub-pixel region P-D. The light-emitting colors of the shared sub-pixel S-D and the privacy sub-pixel P-D in the same pixel region P0 are the same. In one example, the shared sub-pixel region S-D and the privacy sub-pixel region P-D in the same pixel region are arranged in the second direction. The privacy sub-pixel region P-D can include a plurality of privacy pixel portions P-D1, and the plurality of privacy sub-pixel regions P-D can be arranged in the second direction, or in the first direction, or arranged in an array. The first direction intersects with the second direction. For example, the first direction is perpendicular to the second direction. The shape of the orthographic projection of the privacy pixel portion P-D1 on the substrate SUB can be rectangular, square, diamond-shaped, circular, oval, or other shapes. The plurality of privacy sub-pixel regions P-D and the plurality of shared sub-pixel regions S-D in the display area AA form privacy regions PA and shared regions SA that are alternately arranged in the second direction. The privacy region PA includes a plurality of privacy sub-pixel regions P-D, and the shared region SA includes a plurality of shared sub-pixel regions S-D.

[0055] The display substrate comprises a substrate SUB and a driving circuit layer, a plurality of light emitting devices 50 and a pixel definition layer PDL disposed on the substrate SUB. The driving circuit layer comprises a pixel driving circuit comprising a plurality of transistors. The shared sub-pixel region S-D and the privacy sub-pixel region P-D are both provided with the light emitting device 50. The pixel definition layer PDL has a plurality of pixel openings, each of which corresponds to a light emitting device 50. The light emitting device 50 is disposed in each privacy pixel part P-D1. When one privacy sub-pixel region P-D comprises a plurality of privacy pixel parts P-D1, the plurality of light emitting devices 50 in the same privacy sub-pixel region P-D can be controlled to emit light by the same pixel driving circuit, so that the first electrodes 51 of the plurality of light emitting devices 50 of the plurality of privacy pixel parts P-D1 in the same privacy sub-pixel region P-D can be connected as an integral structure; in addition, the light emitting layers 53 of the plurality of light emitting devices 50 of the plurality of privacy pixel parts P-D1 in the same privacy sub-pixel region P-D are also connected as an integral structure, so that the precision requirements of the first electrodes 51 and the light emitting layers 53 in the manufacturing process can be reduced. The first electrodes 51 of the light emitting devices 50 in the privacy sub-pixel region P-D and the first electrodes 51 of the light emitting devices 50 in the shared sub-pixel region S-D are spaced apart from each other.

[0056] It should be noted that for other embodiments, the first electrodes 51 of the plurality of light emitting devices 50 of the plurality of privacy pixel parts P-D1 in the same privacy sub-pixel region P-D can also be independent of each other, and the light emitting layers 53 of the plurality of light emitting devices 50 of the plurality of privacy pixel parts P-D1 can also be independent.

[0057] The display substrate further comprises an encapsulation structure and a light blocking layer BM, the encapsulation structure is located on the side of the plurality of light emitting devices 50 away from the substrate SUB, and is used for encapsulating the plurality of light emitting devices 50 to prevent water vapor and / or oxygen in the external environment from corroding the light emitting devices 50. For example, the encapsulation structure comprises a first inorganic encapsulation layer CVD1, an organic encapsulation layer IJP and a second inorganic encapsulation layer CVD2 arranged in sequence away from the substrate SUB. The first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 can be made of inorganic materials with high density such as silicon oxynitride (SiON), silicon oxide (SiOx) and silicon nitride (SiNx). The organic encapsulation layer IJP can be made of a high polymer material containing a desiccant, or a high polymer material capable of blocking water vapor. For example, a high polymer resin is used, so that the stress of the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 can be relieved, and a hygroscopic material such as a desiccant can also be included to absorb water, oxygen and other substances invading the inside. The organic encapsulation layer IJP is formed after the organic material is solidified, and the organic material has a certain flowability in the manufacturing process, so that the surface of the finally formed organic encapsulation layer IJP away from the substrate SUB is a substantially flat surface.

[0058] The light shielding layer BM is located on the side of the encapsulation structure away from the substrate SUB, and has a plurality of light transmission openings V, and the orthographic projection of each light emitting device 50 on the substrate SUB overlaps with the orthographic projection of the light transmission opening V on the substrate SUB. For example, the light emitting devices 50 in different shared sub-pixel regions S-D can correspond to different light transmission openings V, and the light emitting devices 50 in different privacy pixel regions P-D1 also correspond to different light transmission openings V. Among them, the orthographic projection area of the shared sub-pixel region S-D on the substrate SUB is greater than the orthographic projection area of the privacy sub-pixel region P-D on the substrate SUB, and the area of the light transmission opening V corresponding to the shared sub-pixel region S-D is greater than the area of the light transmission opening V corresponding to the privacy sub-pixel region P-D.

[0059] When the display substrate is in the shared mode, the light emitting devices 50 in the shared sub-pixel region S-D and the privacy sub-pixel region P-D all emit light, or only the light emitting devices 50 in the shared sub-pixel region S-D emit light, and since the area of the light transmission opening corresponding to the shared sub-pixel region S-D is larger, at least part of the large-angle light emitted by the light emitting device 50 can be emitted from the light transmission opening; when the display substrate is in the privacy mode, the light emitting devices 50 in the shared sub-pixel region S-D do not emit light, and the light emitting devices 50 in the privacy sub-pixel region P-D emit light, and the large-angle light emitted by the light emitting device 50 is shielded by the light shielding layer BM.

[0060] It should be noted that FIG. 3 is an example of one layer of the light shielding layer BM, and in other embodiments, the display substrate can include two layers of light shielding layers BM, the first layer of light shielding layers BM is located away from the substrate SUB on the side of the packaging structure, each of the anti-peep pixel portions P-D1 corresponds to a light transmission port of the first layer of light shielding layers BM, different anti-peep pixel portions P-D1 correspond to different light transmission ports, and the orthogonal projection of each anti-peep pixel portion P-D1 on the substrate SUB overlaps with the orthogonal projection of the corresponding light transmission port of the first layer of light shielding layers BM on the substrate SUB. The interval region between the two adjacent shared sub-pixels S-D arranged along the first direction does not overlap with the orthogonal projection of the first layer of light shielding layers BM on the substrate SUB. The second layer of light shielding layers BM is located away from the substrate SUB on the side of the first layer of light shielding layers BM. A spacing layer is arranged between the two layers of light shielding layers BM. The size relationship between the area of the light transmission port corresponding to the anti-peep pixel portion P-D1 and the area of the light transmission port corresponding to the shared sub-pixel region S-D can not be limited. In this case, when the display substrate is in the sharing mode, the light emitting devices 50 in the shared sub-pixel region S-D and the anti-peep sub-pixel region P-D all emit light, or only the light emitting devices 50 in the shared sub-pixel region S-D emit light, and the wide-angle light emitted to the left and right sides by the light emitting devices 50 in the shared sub-pixel region S-D will not be blocked by the first layer of light shielding layers BM1. When the display substrate is in the anti-peep display mode, the light emitting devices 50 in the anti-peep sub-pixel region P-D emit light, and the two layers of light shielding layers BM block the wide-angle light of the light emitting devices 50, thereby improving the anti-peep effect.

[0061] As shown in FIG. 3, the display substrate further includes a color filter layer, and the color filter layer includes a plurality of color filter portions CF, and the color filter portions CF are located in the light transmission ports. The orthogonal projection of the light emitting device 50 on the substrate SUB overlaps with the orthogonal projection of the color filter portion CF on the substrate SUB. The light emitting color of the plurality of light emitting devices 50 of the display substrate can include multiple colors, for example, red, green, and blue. The color of the color filter portion CF is the same as the light emitting color of the corresponding light emitting device 50. By arranging the color filter portion CF, the color gamut of the display substrate can be improved, and the reflection of external ambient light can be reduced.

[0062] At present, for display products (such as vehicle-mounted display screens) having an anti-peep mode and a sharing mode, the brightness of the horizontal direction 45° view angle is required to be high in the sharing mode. In the related art, the brightness of the horizontal direction 45° view angle is improved by increasing the brightness of the light emitting device 50, but this method can cause the problem of reduced service life of the light emitting device 50.

[0063] FIG. 4A is a cross-sectional view of a display substrate provided in some embodiments of the present disclosure, in one example, the plan view of the shared sub-pixel region S-D, the privacy sub-pixel region P-D, and the light shielding layer BM of the display substrate is the same as that of FIG. 2, and the cross-section shown in FIG. 4A corresponds to the A-A' and B-B' section lines in FIG. 2. As shown in FIGS. 2 and 4A, the display substrate has a plurality of pixel regions, each of which includes a shared sub-pixel region S-D and a privacy sub-pixel region P-D. In one example, the plurality of pixel regions are arranged in an array, and the shared sub-pixel region S-D and the privacy sub-pixel region P-D in the same pixel region are arranged along a second direction. For example, the second direction is the column direction.

[0064] The display substrate includes a substrate SUB, and a plurality of light emitting devices 50, a light shielding layer BM, and a first functional layer 61 disposed on the substrate SUB. The shared sub-pixel region S-D and the privacy sub-pixel region P-D are each provided with a light emitting device 50. The light shielding layer BM is located on a side of the plurality of light emitting devices 50 away from the substrate SUB, and has a plurality of light transmission ports V, and the orthographic projection of each light emitting device 50 on the substrate SUB overlaps with the orthographic projection of the light transmission port V on the substrate SUB. The first functional layer 61 is located between the plurality of light emitting devices 50 and the light shielding layer BM.

[0065] The first functional layer 61 can be a film layer with a high transmittance to visible light, for example, a transmittance to visible light of 80% or more.

[0066] The shared sub-pixel region S-D includes a middle light emitting region S-D2 and an edge light emitting region S-D1, and the edge light emitting region S-D1 is located on at least opposite sides of the middle light emitting region S-D2 along a first direction. For example, the first direction is perpendicular to the second direction. In one example, the edge light emitting region S-D1 is a region located near the edge of the shared sub-pixel region S-D, and the width of the edge light emitting region S-D1 in the first direction is 1 / 20 to 1 / 5 of the width of the shared sub-pixel region S-D in the first direction; the sum of the widths of the middle light emitting region S-D2 and the edge light emitting region S-D1 on both sides thereof in the first direction is equal to the width of the shared sub-pixel region S-D in the first direction. In one example, the edge light emitting region S-D1 is located on opposite sides of the middle light emitting region S-D2 along the first direction; in another example, the edge light emitting region S-D1 is located around the middle light emitting region S-D2.

[0067] The first functional layer 61 comprises: the first functional part IJP1 located at least in the privacy sub-pixel area P-D, and the hollow part located at least in the edge light-out area S-D1; that is, at least part of the first functional part IJP1 is located in the privacy sub-pixel area P-D, and at least part of the hollow part is located in the edge light-out area S-D1. Alternatively, the first functional layer 61 comprises: the first functional part IJP1 located at least in the privacy sub-pixel area P-D, and the second functional part IJP2 located at least in the edge light-out area S-D1; that is, at least part of the first functional part IJP1 is located in the privacy sub-pixel area P-D, and at least part of the second functional part IJP2 is located in the edge light-out area S-D1; wherein the maximum thickness of the second functional part IJP2 is smaller than the maximum thickness of the first functional part IJP1.

[0068] In the embodiments of the present disclosure, at least in the position of the edge light-out area S-D1, the first functional layer 61 is hollowed out; or the maximum thickness of the first functional layer 61 in the edge light-out area S-D1 is smaller than the maximum thickness of the first functional layer 61 in the privacy sub-pixel area P-D. Therefore, when the large-angle light emitted by the light-emitting device 50 irradiates the first functional layer 61 in the edge light-out area S-D1, the path of the light in the first functional layer 61 with smaller thickness is smaller, thereby reducing light loss, and further improving the light-out luminance of the display substrate in the large-angle position in the sharing mode, thereby facilitating the requirement that the luminance at 45° viewing angle is greater than 500 nit.

[0069] It should be noted that in the embodiments of the present disclosure, the first functional layer 61 has various setting modes, for example, only the first functional layer 61 in the edge light-out area S-D1 can be hollowed out; or the first functional layer 61 in the edge light-out area S-D1 and the middle light-out area S-D2 can be hollowed out; or the thickness of the first functional layer 61 in the edge light-out area S-D1 can be thinned, so that the maximum thickness of the first functional layer 61 in the edge light-out area S-D1 is smaller than the maximum thickness of the first functional layer 61 in the privacy sub-pixel area P-D; or the thickness of the first functional layer 61 in the sharing sub-pixel area S-D and the privacy sub-pixel area P-D can be thinned, for example, the maximum thickness of the first functional layer 61 in the sharing sub-pixel area S-D and the maximum thickness of the first functional layer 61 in the privacy sub-pixel area P-D are both smaller than the maximum thickness of the first functional layer 61 in the interval area between the adjacent two pixel areas P0.

[0070] FIG. 5 is a schematic diagram of the connection between the light-emitting device and the driving circuit layer provided in some embodiments of the present disclosure, and the embodiments of the present disclosure will be specifically introduced below in combination with FIG. 4A and FIG. 5.

[0071] In some embodiments, as shown in FIG. 5, the substrate SUB is a flexible substrate, which can be made of a flexible organic material. For example, the organic material is a resin material such as polyimide, polycarbonate, polyacrylate, polyetherimide, polyethersulfone, polyethylene terephthalate, and polyethylene naphthalate.

[0072] In some embodiments, the light emitting device 50 can be an organic light emitting diode (OLED) that emits, for example, red light, green light, blue light, or white light. The pixel circuit is electrically connected to the light emitting device 50 for providing a driving signal to the light emitting device 50. The pixel electrode can include a plurality of transistors and at least one capacitor. Only one of the transistors and one of the capacitors are shown in FIG. 5.

[0073] In some embodiments, a semiconductor layer is provided on the substrate SUB. The material of the semiconductor layer can include, for example, an inorganic semiconductor material (e.g., polysilicon, amorphous silicon, etc.), an organic semiconductor material, an oxide semiconductor material. The semiconductor layer includes an active layer 31 of each transistor 30, which includes a channel portion and source and drain connecting portions located on both sides of the channel portion, the source connecting portion being connected to the source 33 of the transistor 30, and the drain connecting portion being connected to the drain 34 of the transistor 30. Both the source and drain connecting portions can be doped with impurities (e.g., N-type impurities or P-type impurities) having a higher impurity concentration than the channel portion. The channel portion is directly opposite to the gate 32 of the transistor 30, and when the voltage signal applied to the gate 32 reaches a certain value, a carrier channel is formed in the channel portion, which causes the source 33 and the drain 34 of the transistor 30 to be turned on.

[0074] In one example, in order to prevent or reduce the diffusion of metal atoms and / or impurities from the substrate SUB into the active layer of the transistor, a buffer layer BFL can be provided between the semiconductor layer and the substrate SUB.

[0075] In some embodiments, a first gate insulating layer GI1 is provided on the semiconductor layer, and the material of the first gate insulating layer GI1 can include a silicon compound. For example, the material of the first gate insulating layer GI1 includes silicon oxynitride (SiON), silicon oxide (SiOx), silicon nitride (SiNx), silicon oxycarbide (SiOxCy), silicon oxycarbonitride (SiCxNy), etc. In addition, the first gate insulating layer GI1 can be a single layer or multiple layers.

[0076] In some embodiments, a first gate electrode layer is disposed on the first gate insulating layer GI1. The first gate electrode layer can include the gate 32 of each transistor 30, the first electrode plate 41 of the capacitor 40. The material of the first gate electrode layer can include, for example, metal, metal alloy, metal nitride, conductive metal oxide, transparent conductive material, etc. For example, the first gate electrode layer can include gold (Au), alloy of gold, silver (Ag), alloy of silver, aluminum (Al), alloy of aluminum, aluminum nitride (AlNx), tungsten (W), tungsten nitride (WNx), copper (Cu), alloy of copper, nickel (Ni), chromium (Cr), chromium nitride (CrNx), molybdenum (Mo), alloy of molybdenum, titanium (Ti), titanium nitride (TiNx), platinum (Pt), tantalum (Ta), tantalum nitride (TaNx), neodymium (Nd), scandium (Sc), strontium ruthenium oxide (SRO), zinc oxide (ZnOx), tin oxide (SnOx), indium oxide (InOx), gallium oxide (GaOx), indium tin oxide (ITO), indium zinc oxide (IZO), etc. The first gate electrode layer can have a single layer or multiple layers.

[0077] In some embodiments, as shown in FIG. 5, a second gate insulating layer GI2 is disposed on the first gate electrode layer G1. The material of the second gate insulating layer GI2 can be selected from the materials of the first gate insulating layer GI1 listed above. The second gate insulating layer GI2 can be formed as a single layer or multiple layers.

[0078] In some embodiments, as shown in FIG. 5, a second gate electrode layer is disposed on the second gate insulating layer GI2. The second gate electrode layer can include the second electrode plate 42 of the capacitor 40. The material of the second gate electrode layer is selected from the materials of the first gate electrode layer listed above. The second gate electrode layer can have a single layer or multiple layers.

[0079] In some embodiments, as shown in FIG. 5, an interlayer insulating layer ILD is disposed on the second gate electrode layer. The material of the interlayer insulating layer ILD can include, for example, silicon compound, metal oxide, etc. The silicon compound and metal oxide listed above can be selected, which are not described herein again.

[0080] In some embodiments, as shown in FIG. 5, a source-drain conductive layer is disposed on the interlayer insulating layer ILD. The source-drain conductive layer can include the source 33 and the drain 34 of each transistor in the display area DA, the source 33 being electrically connected with the source connection portion, and the drain 34 being electrically connected with the drain connection portion. The source-drain conductive layer can include metal, alloy, metal nitride, conductive metal oxide, transparent conductive material, etc. For example, the source-drain conductive layer can be a single layer or multiple layers of metal, such as Mo / Al / Mo or Ti / Al / Ti. The transistor 30 shown in FIG. 5 includes the gate 32, the source 33, the drain 34, and the active layer 31.

[0081] In some embodiments, as shown in FIG. 5, a passivation layer PVX is disposed on the first source-drain conductive layer, and the material of the passivation layer PVX can include a compound of silicon, for example, silicon oxide, silicon nitride, or silicon oxynitride.

[0082] In some embodiments, as shown in FIG. 5, a planarization layer PLN is disposed on the side of the passivation layer PVX away from the substrate SUB, and the surface of the planarization layer PLN away from the substrate SUB is substantially planar. The planarization layer PLN is made of an organic insulating material, for example, the organic insulating material includes a resin material such as polyimide, epoxy, acrylic, polyester, photoresist, polyacrylate, polyamide, silicone, etc. For another example, the organic insulating material includes an elastic material, for example, urethane, thermoplastic polyurethane (TPU), etc.

[0083] In some embodiments, as shown in FIG. 5, a first electrode 51 of the light-emitting device 50 is disposed on the side of the planarization layer PLN away from the substrate SUB. The first electrode 51 can be an anode of the light-emitting device 50. As shown in FIG. 5, the light-emitting element includes the first electrode 51, a light-emitting layer 53, and a second electrode 52, and the first electrode 51 is disposed on the planarization layer PLN. The first electrode 51 is electrically connected to the drain 34 of the transistor 30 through a via hole penetrating the planarization layer PLN. The first electrode 51 can be made of a material such as metal, metal alloy, metal nitride, conductive metal oxide, transparent conductive material, etc. The first electrode 51 can be a single layer or a multi-layer structure.

[0084] In some embodiments, as shown in FIG. 5, a pixel definition layer PDL is disposed on the planarization layer PLN. The pixel definition layer PDL includes a pixel opening corresponding to the light-emitting device 50 one by one, and the pixel opening exposes a portion of the corresponding first electrode 51. The light-emitting layer 53 is disposed in the pixel opening one by one, and the light-emitting layer 53 can include small-molecule organic material or polymer-molecule organic material, can be fluorescent light-emitting material or phosphorescent light-emitting material, can emit red light, green light, blue light, or can emit white light. The material of the pixel definition layer PDL can include an organic insulating material such as polyimide, polyphthalimide, polyphthalamide, acrylic resin, benzocyclobutene, or phenolic resin, etc.

[0085] In some embodiments, as shown in FIG. 5, the second electrode 52 is located on the side of the light-emitting layer 53 away from the substrate SUB, and the second electrode 52 can be made of metal, metal alloy, metal nitride, conductive metal oxide, transparent conductive material, etc. In the embodiments of the present disclosure, the light-emitting device 50 can adopt a top emission structure or a bottom emission structure. When the top emission structure is adopted, the first electrode 51 includes a conductive material having light reflection performance or includes a light reflection film, and the second electrode 52 includes a transparent or semi-transparent conductive material. When the bottom emission structure is adopted, the second electrode 52 is made of a conductive material having light reflection performance or includes a light reflection film, and the first electrode 51 includes a transparent or semi-transparent conductive material. The second electrodes 52 of the light-emitting devices 50 can be connected as a whole to form a second electrode layer.

[0086] It should be noted that the light-emitting device 50 can further include other film layers, for example, can further include a hole injection layer and a hole transport layer located between the first electrode 51 and the light-emitting layer 53, and an electron transport layer and an electron injection layer located between the light-emitting layer 53 and the second electrode 52.

[0087] In some embodiments, as shown in FIG. 4A, a packaging structure is arranged on the side of the plurality of light-emitting devices 50 away from the substrate SUB, and the packaging structure covers the pixel definition layer PDL and the light-emitting devices 50, for packaging the light-emitting devices 50 to prevent water vapor and / or oxygen in the external environment from corroding the light-emitting devices 50. In some embodiments, the packaging structure includes a first inorganic packaging layer CVD1, a second inorganic packaging layer CVD2 located on the side of the first inorganic packaging layer CVD1 away from the substrate SUB, and an organic packaging layer IJP located between the first inorganic packaging layer CVD1 and the second inorganic packaging layer CVD2. The first inorganic packaging layer CVD1 and the second inorganic packaging layer CVD2 can be made of inorganic materials with high compactness, such as silicon oxynitride (SiON), silicon oxide (SiOx), silicon nitride (SiNx), etc. The organic packaging layer IJP can be made of a high polymer material containing a desiccant, or made of a high polymer material capable of blocking water vapor. For example, a high polymer resin is used, so that the stress of the first inorganic packaging layer CVD1 and the second inorganic packaging layer CVD2 can be relieved, and a desiccant or other hygroscopic material such as a desiccant can be included to absorb water, oxygen and other substances invading the inside.

[0088] In some embodiments, the organic encapsulation layer IJP is used as the first functional layer 61, and the first functional layer 61, the first inorganic encapsulation layer CVD1 and the second inorganic encapsulation layer CVD2 form an encapsulation structure for encapsulating the plurality of light emitting devices 50. Compared with other film layers, the maximum thickness of the organic encapsulation layer IJP is larger, and the influence on the brightness of light is greater. For example, the maximum thickness of the organic encapsulation layer IJP can reach 10 microns. Therefore, the local thinning or hollowing processing of the organic encapsulation layer IJP as the first functional layer 61 can effectively improve the light brightness of the display substrate in the sharing mode at a large viewing angle position. The following embodiments are described by taking the organic encapsulation layer IJP as the first functional layer 61 as an example.

[0089] In some embodiments, as shown in FIG. 4A, the organic encapsulation layer IJP includes a first functional part IJP1 and a second functional part IJP2. At least part of the first functional part IJP1 is located in the privacy sub-pixel area P-D, and at least part of the second functional part IJP2 is located in the edge light-out area S-D1. The maximum thickness d2 of the second functional part IJP2 is smaller than the maximum thickness d1 of the first functional part IJP1. In one example, the ratio of d2 to d1 is 7 / 10-9 / 10, so as to improve the brightness of the display substrate in the sharing mode at a large viewing angle while ensuring the encapsulation effect. For example, d2 is 7 / 10, or 8 / 10, or 9 / 10 of d1. For example, d2 is 8 microns, and d1 is 10 microns.

[0090] In some embodiments, as shown in FIG. 4A, the second functional part IJP2 includes a plurality of lens parts IJP22, and at least part of the plurality of lens parts IJP22 is located in the edge light-out area S-D1. The surface of the lens part IJP22 away from the substrate SUB is a convex surface. The second functional layer 62 is in contact with the convex surface, for example, each position of the convex surface is in contact with the second functional layer 62. In addition, the refractive index of the second functional layer 62 is smaller than the refractive index of the lens part IJP22, so that the lens part IJP22 plays a role of light condensation. When the organic encapsulation layer IJP is used as the first functional layer 61, the second inorganic encapsulation layer CVD2 is used as the second functional layer 62.

[0091] In some embodiments, as shown in FIG. 4A, the second functional part IJP2 includes a plurality of lens parts IJP22, and at least part of the plurality of lens parts IJP22 is located in the edge light-out area S-D1. The surface of the lens part IJP22 away from the substrate SUB is a convex surface. The second functional layer 62 is in contact with the convex surface, for example, each position of the convex surface is in contact with the second functional layer 62. In addition, the refractive index of the second functional layer 62 is smaller than the refractive index of the lens part IJP22, so that the lens part IJP22 plays a role of light condensation. When the organic encapsulation layer IJP is used as the first functional layer 61, the second inorganic encapsulation layer CVD2 is used as the second functional layer 62.

[0092] In some embodiments, as shown in FIG. 4A, the plurality of lens portions IJP22 are located in the edge light-emitting region S-D1, and the organic encapsulation layer IJP further includes a flat portion IJP4 located in the middle light-emitting region S-D2, the maximum thickness d3 of the flat portion IJP4 is not greater than the maximum thickness d1 of the first functional portion IJP1, and the maximum thickness of the lens portion IJP22 is less than the maximum thickness d3 of the flat portion IJP4. By providing the flat portion IJP4, the encapsulation effect of the organic encapsulation layer IJP can be ensured. In one example, the thickness d3 of the flat portion IJP4 is the same as or substantially the same as the thickness d1 of the first functional portion IJP1.

[0093] In some embodiments, the flat portion IJP4 and the lens portion IJP22 can be in contact without a gap, that is, the flat portion IJP4 and the lens portion IJP22 form an integrated structure. In other embodiments, a certain gap can be left between the flat portion IJP4 and the lens portion IJP22.

[0094] In some embodiments, in the direction close to the substrate SUB, the cross section (here, the cross section refers to the section parallel to the substrate SUB) of the flat portion IJP4 gradually increases, thereby preventing the subsequent formation of the second inorganic encapsulation layer CVD2 from being broken, and further improving the encapsulation effect. The flat portion IJP4 has a bottom surface facing the substrate SUB, a top surface facing away from the substrate SUB, and a side surface connected between the bottom surface and the top surface and facing the lens portion IJP22. The side surface can be an inclined surface, or a convex surface or a concave surface.

[0095] In some embodiments, as shown in FIG. 4A, the ratio of the width w of the lens portion IJP22 in the first direction to the width of the shared sub-pixel region S-D in the first direction is 1 / 10-1 / 5, thereby ensuring that the lens portion IJP22 has a certain width, and the light rays of large angles can be emitted from the lens portion IJP22 as much as possible, improving the light brightness of the display substrate at a large viewing angle position, while not affecting the encapsulation effect of the encapsulation structure.

[0096] In one example, the width of the shared sub-pixel region S-D in the first direction is 10 microns, and the width of the lens portion IJP22 in the first direction is 1-2 microns.

[0097] In one example, the maximum height of the lens portion IJP22 is the maximum height of the second functional portion IJP2.

[0098] In one example, as shown in FIG. 4A, one lens portion IJP22 is arranged on each of the opposite sides of the flat portion IJP4 along the first direction; in other examples, a plurality of lens portions IJP22 can be arranged on each of the opposite sides of the flat portion IJP4 along the first direction.

[0099] In some embodiments, as shown in FIG4A, the organic encapsulation layer IJP further includes a third functional portion IJP3, which surrounds the central light-emitting region S-D2. The third functional portion IJP3 and the first functional portion IJP1 are integrally formed, and the surface of the third functional portion IJP3 away from the substrate SUB is connected to the surface of the first functional portion IJP1 away from the substrate SUB. In one example, the third functional portion IJP3 is in contact with the lens portion IJP22; in another example, a certain gap is left between the third functional portion IJP3 and the lens portion IJP22.

[0100] Along the direction near the central light-emitting region S-D2, the distance from the surface of the third functional part IJP3 away from the substrate SUB (i.e., the top surface of the third functional part IJP3) to the substrate SUB gradually decreases. In Figure 4A, the third functional part IJP3 is the transition portion between the first functional part IJP1 and the lens part IJP22 in the organic encapsulation layer IJP. Setting the top surface of the third functional part IJP3 to gradually approach the substrate SUB facilitates the fabrication process and is beneficial for the subsequent formation of the second inorganic encapsulation layer CVD2 into a continuous film layer, thereby improving the encapsulation effect.

[0101] In one example, the surface of the third functional unit IJP3 away from the substrate SUB is a slope, a convex surface, a concave surface, or a stepped surface.

[0102] In some embodiments, as shown in FIG4A, the display substrate further includes a spacer layer OC0 and a light-shielding layer BM. The light-shielding layer BM is located on the side of the second inorganic encapsulation layer CVD2 away from the substrate SUB. The pattern of the light-shielding layer BM can be seen in FIG2. The light-shielding layer BM has multiple light-transmitting holes V; the orthographic projection of each light-emitting device 50 on the substrate SUB overlaps with the orthographic projection of the light-transmitting hole V on the substrate SUB. The spacer layer OC0 is located between the second inorganic encapsulation layer CVD2 and the light-shielding layer BM. By setting the spacer layer OC0, the light-shielding layer BM can be located on a generally flat surface.

[0103] Among them, the transmittance of visible light by the spacer layer OC0 is greater than that of the organic encapsulation layer IJP, and the maximum thickness of the spacer layer OC0 is less than that of the organic encapsulation layer IJP. For example, the transmittance of visible light by the organic encapsulation layer IJP is 90%, the transmittance of visible light by the spacer layer OC0 is 95%, the maximum thickness of the organic encapsulation layer IJP is 10 micrometers, and the maximum thickness of the spacer layer OC0 is 2 micrometers. That is, the influence of the spacer layer OC0 on the brightness of light is less than that of the organic encapsulation layer IJP.

[0104] In some embodiments, the plurality of light-transmitting openings V includes a plurality of first light-transmitting openings V1 and a plurality of second light-transmitting openings V2, the privacy sub-pixel region P-D includes at least one privacy pixel portion P-D1, and each privacy pixel portion P-D1 is provided with a light-emitting device 50; the privacy pixel portion P-D1 corresponds to the first light-transmitting opening V1 in one-to-one correspondence; and the shared sub-pixel region S-D corresponds to the second light-transmitting opening V2 in one-to-one correspondence.

[0105] In some examples, the orthographic projection of the shared sub-pixel region S-D on the substrate SUB coincides with the orthographic projection of the corresponding second light-transmitting hole V2 on the substrate SUB; and the orthographic projection of the privacy pixel portion P-D1 on the substrate SUB coincides with the orthographic projection of the corresponding first light-transmitting hole V1 on the substrate SUB.

[0106] In some examples, the orthographic projection of the first light-transmitting opening V1 on the substrate SUB is located within the range of the orthographic projection of the light-emitting layer 53 in the privacy pixel portion P-D1 on the substrate SUB, and the orthographic projection of the light-emitting layer 53 in the shared sub-pixel region S-D on the substrate SUB is located within the range of the orthographic projection of the second light-transmitting opening V2 on the substrate SUB. For example, the orthographic projection of the light-emitting layer 53 of the privacy pixel portion P-D1 on the substrate SUB covers and exceeds the orthographic projection of the first light-transmitting opening V1 on the substrate SUB; and the orthographic projection of the second light-transmitting opening V2 on the substrate SUB covers and exceeds the orthographic projection of the light-emitting layer 53 of the shared sub-pixel region S-D on the substrate SUB. By setting a smaller first light-transmitting opening V1 and a larger second light-transmitting opening V2, the light-emitting angle of the privacy sub-pixel region P-D can be reduced, and the light-emitting angle of the shared sub-pixel region S-D can be increased.

[0107] It should be noted that in other examples, the orthographic projection of the light-emitting layer 53 in the shared sub-pixel region S-D on the substrate SUB can be located within the range of the orthographic projection of the second light-transmitting opening V2 on the substrate SUB, and the orthographic projection of the light-emitting layer 53 in the privacy pixel portion P-D1 on the substrate SUB can be located within the range of the orthographic projection of the first light-transmitting opening V1 on the substrate SUB. In this case, a new light-blocking layer can be added between the light-blocking layer BM and the packaging structure of FIG. 4A, and the new light-blocking layer has a light-transmitting opening corresponding to each privacy pixel portion P-D1, so that the large-angle light emitted by the privacy pixel portion P-D1 can be blocked, achieving a privacy effect. As described above, when the display substrate includes two light-blocking layers BM, the size relationship between the light-transmitting opening corresponding to the privacy pixel portion P-D1 and the light-transmitting opening corresponding to the shared sub-pixel region S-D is not limited.

[0108] In some examples, the orthographic projection of the second light-transmitting opening V2 on the substrate SUB is a right-angled rectangle or a circular-angled rectangle, the length direction of the second light-transmitting opening V2 is the first direction, and the width direction is the second direction, so that the light of the shared sub-pixel region S-D can be more easily seen at the large-viewing-angle positions on both sides of the first direction.

[0109] In some examples, the sizes of the second light-transmitting ports V2 corresponding to the shared sub-pixel regions S-D of different colors are different. For example, in FIG. 2, the light-emitting colors of the shared sub-pixel regions S-D are identified, R represents red, G represents green, and B represents blue. For example, the shared sub-pixel regions S-D of red and the shared sub-pixel regions S-D of green are arranged along the first direction, and the shared sub-pixel regions S-D of blue are arranged along the second direction. As shown in FIG. 2, the second light-transmitting port V2 corresponding to the shared sub-pixel region S-D of red is smaller than the second light-transmitting port V2 corresponding to the shared sub-pixel region S-D of blue, and is larger than the second light-transmitting port V2 corresponding to the shared sub-pixel region S-D of green.

[0110] In some embodiments, as shown in FIG. 4A, the display substrate can further include a color filter layer located on the side of the spacing layer OC0 away from the substrate SUB, and the color filter layer can include a plurality of color filter portions CF located in the light-transmitting ports. The orthographic projection of the light-emitting device 50 on the substrate SUB overlaps with the orthographic projection of the color filter portion CF on the substrate SUB. Each light-emitting device 50 can correspond to a color filter portion CF, and different color filter portions CF are independent of each other. Of course, the color filter portions CF corresponding to a plurality of light-emitting devices 50 in the same privacy sub-pixel region P-D can be connected as a whole, thereby reducing the requirement for the manufacturing precision of the color filter portion CF.

[0111] The light-emitting colors of the plurality of light-emitting devices 50 of the display substrate can include multiple colors, for example, red, green, and blue. The color of the color filter portion CF is the same as the light-emitting color of the corresponding light-emitting device 50. By providing the color filter portion CF, the color gamut of the display substrate can be improved.

[0112] In a specific example, the width of the shared sub-pixel region S-D along the first direction in FIG. 4A is set to 10 microns, the width of the lens portion IJP22 along the first direction is set to 1-2 microns, and the height is set to 8 microns; the maximum thickness d1 of the first functional portion IJP1 is set to 10 microns, and the maximum thickness d3 of the flat portion IJP4 is the same as the maximum thickness d1 of the first functional portion IJP1. Tests show that, compared with the display substrate in FIG. 3 (the surface of the organic encapsulation layer IJP is a flat surface, and the maximum thickness is 10 microns), the brightness of the shared sub-pixel region S-D in FIG. 4A at a 45° viewing angle can be increased by about 8%.

[0113] In some embodiments, as shown in FIG. 4A, the cover layer OC1 is located on the side of the color filter portion CF away from the substrate SUB.

[0114] In some embodiments, the organic encapsulation layer IJP is formed by a photolithography patterning process. FIGS. 6A-6C are schematic diagrams of the preparation process of the organic encapsulation layer IJP in FIG. 4A. As shown in FIGS. 6A-6C, the process of the organic encapsulation layer IJP includes:

[0115] S1, as shown in FIG. 6A, on the side of the first inorganic encapsulation layer CVD1 away from the substrate SUB, an organic material layer IJPa for making the organic encapsulation layer is formed in sequence, and a photoresist layer PR is formed.

[0116] S2, the photoresist layer PR is exposed by using a half-tone mask, and the exposed photoresist layer PR is developed, thereby forming a first photoresist part PR1, a second photoresist part PR2, a third photoresist part PR3 and a fourth photoresist part PR4. As shown in FIG. 6B, the first photoresist part PR1 is located in the region to be formed into the first functional part IJP1, the second photoresist part PR2 is located in the region to be formed into the lens part IJP22, the third photoresist part PR3 is located in the region to be formed into the third functional part IJP3, and the fourth photoresist part PR4 is located in the region to be formed into the flat part IJP4. Among them, the thickness of the first photoresist part PR1 and the fourth photoresist part PR4 is the same as or substantially the same as the initial thickness of the photoresist layer PR; the surface of the second photoresist part PR2 away from the substrate SUB is a convex surface, and the maximum thickness of the second photoresist part PR2 is less than the thickness of the first photoresist part PR1; the thickness of the third photoresist part PR3 gradually decreases along the direction close to the second photoresist part PR2.

[0117] S3, as shown in FIG. 6C, the photoresist layer PR and the organic material layer are etched. During the etching process, the thickness of the photoresist layer PR at each position gradually decreases, and when the photoresist at a certain position is completely removed, the etching of the underlying organic material layer begins, thereby forming the first functional part IJP1, the lens part IJP22, the flat part IJP4 and the third functional part IJP3 after the etching is completed.

[0118] S4, as shown in FIG. 6D, the remaining photoresist is removed. After the etching is completed, the first photoresist part PR1 and the fourth photoresist part PR4 may still have a certain thickness, that is, there is still a certain photoresist remaining above the first functional part IJP1 and the flat part IJP4, therefore, after the etching step, the remaining photoresist is removed.

[0119] FIG. 4B is another cross-sectional view of a display substrate provided in some embodiments of the present disclosure. The structure shown in FIG. 4B is similar to that in FIG. 4A, and the only difference is that in FIG. 4B, the display substrate can further include a first optical adhesive layer OCA1 and a cover plate CG, the first optical adhesive layer OCA1 is located on the side of the cover layer OC1 away from the substrate SUB, and the cover plate CG is located on the side of the first optical adhesive layer OCA1 away from the substrate SUB.

[0120] In one example, the first optical adhesive layer OCA1 has a transmittance of visible light of 93% or above, for example 95%.

[0121] FIG. 7 is another cross-sectional view of a display substrate provided in some embodiments of the present disclosure, the structure shown in FIG. 7 is similar to that shown in FIG. 4A, the only difference is that in FIG. 7, the color filter part CF is no longer provided in the display substrate, and a portion of the cover layer OC1 is located in the light transmission port of the light blocking layer BM; in addition, the display substrate in FIG. 7 can further include a polarizer POL, a first optical adhesive layer OCA1, a second optical adhesive layer OCA2 and a cover plate CG, the first optical adhesive layer OCA1 is located on the side of the cover layer OC1 away from the substrate SUB; the polarizer POL is located on the side of the first optical adhesive layer OCA1 away from the substrate SUB, and the polarizer POL is a circular polarizer, so as to reduce the reflection of the display substrate to the external ambient light.

[0122] The second optical adhesive layer OCA2 is located on the side of the polarizer POL away from the substrate SUB, and the cover plate CG is located on the side of the second optical adhesive layer OCA2 away from the substrate SUB.

[0123] In one example, the second optical adhesive layer OCA2 has a transmittance of visible light of 93% or above, for example 95%.

[0124] FIG. 8 is a cross-sectional view of a display substrate provided in a second embodiment of the present disclosure, and FIG. 9 is a schematic view of the display substrate in FIG. 8 after removing the cover layer OC1, the light blocking layer BM, the color filter part CF, the spacer layer OC0 and the second inorganic encapsulation layer CVD2. The display substrate shown in FIG. 8 is similar to that shown in FIG. 4A, and only the differences between the two will be introduced below.

[0125] In the embodiment shown in FIGS. 8 and 9, the organic encapsulation layer IJP includes a first functional part IJP1, a hollow part IJP0 (see FIG. 9) and a flat part IJP4, at least part of the first functional part IJP1 is located in the privacy sub-pixel area P-D, the hollow part IJP0 is located in the edge light-out area S-D1, the flat part IJP4 is located in the middle light-out area S-D2, and the maximum thickness d3 of the flat part IJP4 is not greater than the maximum thickness d1 of the first functional part IJP1.

[0126] In the embodiment shown in FIGS. 8 and 9, by providing the hollow part IJP0 on the organic encapsulation layer IJP in the edge light-out area S-D1, at least part of the large-angle light is no longer blocked by the organic encapsulation layer IJP, thereby improving the light brightness at a large viewing angle position.

[0127] Exemplarily, the maximum thickness d3 of the flat portion IJP4 in FIG. 8 and FIG. 9 is the same as the maximum thickness d1 of the first functional portion IJP1, in this case, when manufacturing the organic encapsulation layer IJP with the flat portion IJP4 and the hollow portion IJP0, the organic material layer and the photoresist layer can be formed first, and then the photoresist layer is exposed and developed, the developed photoresist layer includes the first photoresist portion PR1, the third photoresist portion PR3 and the fourth photoresist portion PR4 in FIG. 6B, but does not include the second photoresist portion PR2. Then, the organic material layer is etched, thereby forming the first functional portion IJP1 corresponding to the first photoresist portion PR1, the flat portion IJP4 corresponding to the fourth photoresist portion PR4, the third functional portion IJP3 corresponding to the third photoresist portion PR3, and the hollow portion IJP0 located in the edge light-emitting area S-D1. Since the thickness of the third photoresist portion PR3 gradually decreases along the direction from the first photoresist portion PR1 to the fourth photoresist portion PR4, the third photoresist portion PR3 will also be gradually etched as the etching proceeds, so that the height of the finally formed third functional portion IJP3 away from the surface of the substrate SUB gradually decreases in the direction close to the fourth functional portion IJP4. While in the position of the middle light-emitting area S-D2, although there is the shielding of the fourth photoresist PR4, due to the limitation of the etching process, while etching the organic material layer longitudinally, a certain etching will inevitably occur in the transverse direction, so that the side surface of the fourth encapsulation layer IJP4 is formed as an inclined surface or has a certain curvature.

[0128] Exemplarily, in the display substrate shown in FIG. 8 and FIG. 9, the ratio of the width of the hollow portion IJP0 in the first direction to the width of the shared sub-pixel area S-D in the first direction is 1 / 10-1 / 5, so as to ensure that the lens portion IJP22 has a certain width, so that the light rays with large angles can be emitted from the hollow portion IJP0 as much as possible, and the light brightness of the display substrate at a large viewing angle position is improved, while the encapsulation effect of the encapsulation structure is not affected.

[0129] For example, the width of the light-emitting layer 53 of the shared sub-pixel area S-D in the first direction is 10 microns, and the width of the hollow portion IJP0 in the first direction is 1-2 microns.

[0130] For example, in the display substrate shown in Figures 8 and 9, the organic encapsulation layer IJP further includes a third functional portion IJP3. The third functional portion IJP3 surrounds the central light-emitting region S-D2, and the surface of the third functional portion IJP3 away from the substrate SUB is connected to the surface of the first functional portion IJP1 away from the substrate SUB. Along the direction close to the central light-emitting region S-D2, the distance between the surface of the third functional portion IJP3 away from the substrate SUB (i.e., the top surface of the third functional portion IJP3) and the substrate SUB gradually decreases. In Figures 8 and 9, the third functional portion IJP3 is the transition portion between the first functional portion IJP1 and the cutout portion IJP0 in the organic encapsulation layer IJP. Setting the top surface of the third functional portion IJP3 to gradually approach the substrate SUB facilitates the manufacturing process and is beneficial for the subsequent formation of the second inorganic encapsulation layer CVD2 into a continuous film layer, thereby improving the encapsulation effect.

[0131] For example, the surface of the third functional unit IJP3 away from the substrate SUB is a slope, a convex surface, a concave surface, or a stepped surface.

[0132] In Figure 8, the arrangement of other film layer structures of the display substrate (e.g., light-emitting device 50, light-shielding layer BM, color filter layer, spacer layer OC0, etc.) is the same as described in Figures 4A and 5, and will not be repeated here.

[0133] It should be noted that in the embodiments shown in Figures 4A, 4B, 7 and 8, the flat portion IJP4 is illustrated as a continuous, uninterrupted structure. In other examples, the flat portion IJP4 can be set as a structure with multiple sub-flat portions, and a hollow portion can be provided between two adjacent sub-flat portions.

[0134] In a specific example, the width of the shared sub-pixel region SD in Figure 8 along the first direction is set to 10 micrometers, the width of the cutout portion IJP0 along the first direction is set to 1-2 micrometers, the maximum thickness d1 of the first functional portion IJP1 is set to 10 micrometers, and the maximum thickness d3 of the flat portion IJP4 is the same as the maximum thickness d1 of the first functional portion IJP1. Tests show that, compared to the display substrate in Figure 3 (whose organic encapsulation layer IJP surface is flat and has a maximum thickness of 10 micrometers), the brightness of the shared sub-pixel region SD in Figure 8 at a 45° viewing angle can be increased by approximately 15%.

[0135] In addition, in the embodiment shown in FIG8, the display substrate may also include structures such as a color filter CF and a cover plate CG, as described in FIG4B above; or, it may not include the color filter CF, but include structures such as a polarizer and a cover plate, as described in FIG7 above.

[0136] FIG. 10 is a sectional view of a display substrate provided in a third embodiment of the present disclosure, the display substrate shown in FIG. 10 is similar to that shown in FIG. 4A, the organic encapsulation layer IJP includes a first functional part IJP1 and a second functional part IJP2, at least part of the first functional part IJP1 is located in the privacy sub-pixel region P-D, and at least part of the second functional part IJP2 is located in the edge light-out region S-D1. The second functional part IJP2 includes a plurality of lens parts IJP22, at least part of the plurality of lens parts IJP22 is located in the edge light-out region S-D1; the surface of the lens part IJP22 away from the substrate SUB is a convex surface. The ratio of the width of the lens part IJP22 in the first direction to the width of the light-emitting layer 53 in the first direction is 1 / 10-1 / 5. Only the differences between FIG. 10 and FIG. 4A will be introduced below.

[0137] In the embodiment shown in FIG. 10, the plurality of lens parts IJP22 are arranged in sequence along the first direction, part of the plurality of lens parts IJP22 is located in the edge light-out region S-D1, and the other part is located in the middle light-out region S-D2. This arrangement can shorten the path of the light in the edge light-out region S-D1 in the organic encapsulation layer IJP, while enhancing the light-gathering ability of the organic encapsulation layer IJP in the edge light-out region S-D1 and the middle light-out region S-D1, thereby further improving the brightness of the large-view-angle light emitted by the edge light-out region S-D1, and also improving the brightness of the small-view-angle light emitted by the middle light-out region S-D2.

[0138] In one example, each adjacent two lens parts IJP22 are connected without gaps; in another example, at least two adjacent lens parts IJP22 form a hollow part.

[0139] In one example, each adjacent two lens parts IJP22 are connected without gaps; in another example, at least two adjacent lens parts IJP22 form a hollow part.

[0140] For example, the number of lens parts IJP22 in the second functional part IJP2 is between 5 and 10.

[0141] In the embodiment shown in FIG. 10, the organic encapsulation layer IJP further includes a third functional portion IJP3, the third functional portion IJP3 surrounds the middle light-exit region S-D2, and the surface of the third functional portion IJP3 away from the substrate SUB is connected to the surface of the first functional portion IJP1 away from the substrate SUB. In the direction close to the middle light-exit region S-D2, the distance between the surface of the third functional portion IJP3 away from the substrate SUB (i.e., the top surface of the third functional portion IJP3) and the substrate SUB gradually decreases. In FIG. 10, the third functional portion IJP3 is a transition portion between the first functional portion IJP1 and the lens portion IJP22 in the organic encapsulation layer IJP, and the structure that the top surface of the third functional portion IJP3 is gradually close to the substrate SUB is more convenient for process manufacturing, and is beneficial to the subsequent preparation of the second inorganic encapsulation layer CVD2 to form a continuous film layer, thereby improving the encapsulation effect.

[0142] For example, the surface of the third functional portion IJP3 away from the substrate SUB is a slope, or a convex surface, or a concave surface, or a stepped surface.

[0143] In FIG. 10, the setting manner of other film layers of the display substrate (for example, the light-emitting device 50, the light-blocking layer BM, the color filter layer, the spacing layer OC0, etc.) is described with reference to the descriptions of FIG. 4A and FIG. 5, which will not be repeated here.

[0144] In one specific example, the width of the shared sub-pixel region S-D in FIG. 10 along the first direction is set to 10 microns, the width of the lens portion IJP22 along the first direction is set to 1-2 microns, the height is set to 8 microns, and the number of the lens portion IJP22 is 5-8; the maximum thickness d1 of the first functional portion IJP1 is set to 10 microns. It has been tested that, compared with the display substrate in FIG. 3 (the surface of the organic encapsulation layer IJP is a flat surface, and the maximum thickness is 10 microns), the brightness of the shared sub-pixel region S-D in FIG. 4A at a 45° viewing angle can be increased by about 12%.

[0145] In addition, in the embodiment shown in FIG. 10, the display substrate can also include a color filter portion CF and a cover plate CG, etc., and specific reference can be made to the description of FIG. 4B above; or, the display substrate can also not include the color filter portion CF, and include a polarizer POL and a cover plate CG, etc., and specific reference can be made to the description of FIG. 7 above.

[0146] FIG. 11 is a cross-sectional view of a display substrate provided in a fourth embodiment of the present disclosure, and FIG. 12 is a schematic view of the display substrate in FIG. 11 after removing the cover layer, the light-blocking layer BM, the color filter portion, the spacing layer OC0, and the second inorganic encapsulation layer CVD2. The display substrate shown in FIG. 11 is similar to that in FIG. 4A, and only the differences between the two will be introduced below.

[0147] In the display substrate shown in FIG. 11, the organic encapsulation layer IJP includes a first functional portion IJP1 and a hollow portion IJP0, at least part of the first functional portion IJP1 is located in the privacy sub-pixel region P-D, part of the hollow portion IJP0 is located in the middle light-out region S-D2, and the other part is located in the edge light-out region S-D1. Through this arrangement, more light emitted by the light-emitting layer 53 of the shared sub-pixel region S-D no longer passes through the organic encapsulation layer IJP, thereby further improving the brightness of the light emitted by the shared sub-pixel region S-D, and further facilitating the improvement of the front light brightness and the light brightness at large viewing angles.

[0148] In one example, the hollow portion IJP0 exposes part of the first inorganic encapsulation layer CVD1, and part of the second inorganic encapsulation layer CVD2 is located in the hollow portion IJP0 and is separated from the first inorganic encapsulation layer CVD1.

[0149] In one example, the orthogonal projection of the hollow portion IJP0 on the substrate SUB covers the orthogonal projection of the middle light-out region S-D2 on the substrate SUB; in addition, the orthogonal projection of the hollow portion IJP0 on the substrate SUB can partially overlap with the orthogonal projection of the edge light-out region S-D1 on the substrate SUB, or the orthogonal projection of the hollow portion IJP0 on the substrate SUB covers the orthogonal projection of the edge light-out region S-D1 on the substrate SUB.

[0150] In one example, the ratio of the width of the hollow portion IJP0 in the first direction to the width of the shared sub-pixel region S-D in the first direction is greater than or equal to 70%, so that more light emitted by the light-emitting layer 53 of the shared sub-pixel region S-D no longer passes through the organic encapsulation layer IJP. For example, the ratio of the width of the hollow portion IJP0 in the first direction to the width of the shared sub-pixel region S-D in the first direction is 70%, or 80%, or 90%, or 100%.

[0151] In FIG. 11, the arrangement of other film layers (such as the light-emitting device 50, the light-blocking layer BM, the color film layer, the spacer layer OC0, etc.) of the display substrate is described with reference to FIG. 4A and FIG. 5, and will not be described here.

[0152] In one specific example, the width of the shared sub-pixel region S-D in the first direction in FIG. 11 is set to 10 microns, the width of the hollow portion IJP0 in the first direction is set to at least 7 microns, and the maximum thickness d1 of the first functional portion IJP1 is set to 10 microns. Tests show that, compared with the display substrate in FIG. 3 (the surface of the organic encapsulation layer IJP is a flat surface, and the maximum thickness is 10 microns), the brightness of the shared sub-pixel region S-D in FIG. 11 at a 45° viewing angle can be improved by more than 20%.

[0153] In addition, in the embodiment shown in FIG. 11, the display substrate can also include a color filter portion CF and a cover plate CG, and the like, as described above with reference to FIG. 4B, or can not include the color filter portion CF and include a polarizer POL and a cover plate CG, and the like, as described above with reference to FIG. 7.

[0154] FIG. 13 is a cross-sectional view of a display substrate provided in a fifth embodiment of the present disclosure. The display substrate shown in FIG. 13 is similar to that shown in FIG. 4A, and only the differences between the two will be described below.

[0155] In the display substrate shown in FIG. 13, the organic encapsulation layer IJP includes a first functional portion IJP1 and a second functional portion IJP2. A portion of the second functional portion IJP2 is located in the edge light-emitting region S-D1, and another portion of the second functional portion IJP2 is located in the middle light-emitting region S-D2. The surface of the second functional portion IJP2 facing the substrate SUB and the surface of the second functional portion IJP2 facing away from the substrate SUB are both flat surfaces. This arrangement can improve the brightness of the display substrate in the sharing mode at a large viewing angle, and facilitates the process of the organic encapsulation layer IJP.

[0156] In one example, the maximum thickness d2 of the second functional portion IJP2 is less than the maximum thickness d1 of the first functional portion IJP1. In one example, the ratio of d2 to d1 is 7 / 10 to 9 / 10, so as to improve the brightness of the display substrate in the sharing mode at a large viewing angle while ensuring the encapsulation effect.

[0157] In the display substrate shown in FIG. 13, the organic encapsulation layer IJP further includes a third functional portion IJP3. The third functional portion IJP3 surrounds the middle light-emitting region S-D2, and the surface of the third functional portion IJP3 facing away from the substrate SUB is connected to the surface of the first functional portion IJP1 facing away from the substrate SUB. In the direction close to the middle light-emitting region S-D2, the distance between the surface of the third functional portion IJP3 facing away from the substrate SUB (i.e., the top surface of the third functional portion IJP3) and the substrate SUB gradually decreases. In FIG. 13, the third functional portion IJP3 is a transition portion between the first functional portion IJP1 and the second functional portion IJP2 in the organic encapsulation layer IJP. The structure in which the top surface of the third functional portion IJP3 is gradually close to the substrate SUB is more convenient for process, and is conducive to the second inorganic encapsulation layer CVD2 being formed as a continuous film layer in subsequent preparation, thereby improving the encapsulation effect.

[0158] For example, the surface of the third functional portion IJP3 facing away from the substrate SUB is a bevel surface, or a convex surface, or a concave surface, or a stepped surface.

[0159] In FIG. 13, the display substrate has other film layer structures (e.g., the light-emitting device 50, the light-blocking layer BM, the color film layer, the spacer layer OC0, and the like), and the arrangement of these structures is described with reference to FIG. 4A and FIG. 5, which will not be repeated here.

[0160] In one specific example, the width of the shared sub-pixel region S-D in FIG. 13 along the first direction is set to 10 microns, the width of the second functional portion IJP2 along the first direction is set to at least 7 microns, and the height is set to 8 microns; the maximum thickness d1 of the first functional portion IJP1 is set to 10 microns. It has been tested that, compared with the display substrate in FIG. 3 (the surface of the organic encapsulation layer IJP is a flat surface, and the maximum thickness is 10 microns), the brightness of the shared sub-pixel region S-D in FIG. 13 at a 45° viewing angle can be increased by about 10%.

[0161] In addition, in the embodiment shown in FIG. 13, the display substrate can also include structures such as the color filter portion CF and the cover plate CG, which are described above with reference to FIG. 4B; or, the display substrate can also not include the color filter portion CF, and include structures such as the polarizer POL and the cover plate CG, which are described above with reference to FIG. 7.

[0162] In the above various embodiments of the present disclosure, for example, for the embodiments shown in FIGS. 4A, 4B, 7, 10, 13, the organic encapsulation layer IJP is a continuous film layer, that is, no hollow portion is formed in the film layer; in this case, the surface of the second inorganic encapsulation layer CVD2 away from the substrate SUB is conformal to the surface of the organic encapsulation layer IJP away from the substrate SUB. Here, “conformal” means that the thickness of each position of the second inorganic encapsulation layer CVD2 is uniformly distributed, so that the surface of the second inorganic encapsulation layer CVD2 away from the substrate SUB is substantially the same as the surface of the organic encapsulation layer IJP away from the substrate SUB. For the embodiments shown in FIGS. 8 and 9, and the embodiments shown in FIGS. 11 and 12, the organic encapsulation layer IJP has a hollow portion IJP0; in this case, part of the second inorganic encapsulation layer CVD2 is located in the hollow portion IJP0 and is in contact with the first inorganic encapsulation layer CVD1.

[0163] It should be noted that, in the above embodiments of FIGS. 4A to 13, the edge light-emitting region S-D1 is provided on the opposite sides of the middle light-emitting region S-D2 along the first direction, and the edge light-emitting region S-D1 can also be provided on the opposite sides of the middle light-emitting region S-D2 along the second direction, or the edge light-emitting region S-D1 can be provided on the opposite sides of the middle light-emitting region S-D2 along the second direction and the opposite sides along the first direction. The morphology of the edge light-emitting region S-D1 on each side of the organic encapsulation layer IJP can be referred to the description in the above embodiments.

[0164] It is understood that the above embodiments are only exemplary for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Various modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit and essence of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display substrate having a plurality of pixel regions, the pixel regions comprising a shared sub-pixel region and a privacy sub-pixel region; the display substrate comprising: a substrate; a plurality of light emitting devices disposed on the substrate, wherein the shared sub-pixel region and the privacy sub-pixel region are both provided with the light emitting devices; a light shielding layer located on a side of the plurality of light emitting devices away from the substrate and having a plurality of light transmission openings, each of the light emitting devices has an orthogonal projection on the substrate that overlaps with an orthogonal projection of the light transmission opening on the substrate; a first functional layer located between the plurality of light emitting devices and the light shielding layer; wherein the shared sub-pixel region comprises a middle light emitting region and an edge light emitting region, the edge light emitting region is located at least on opposite sides of the middle light emitting region along a first direction; the first functional layer comprises a first functional part located at least in the privacy sub-pixel region and a hollow part located at least in the edge light emitting region; or the first functional layer comprises a first functional part located at least in the privacy sub-pixel region and a second functional part located at least in the edge light emitting region, the maximum thickness of the second functional part is less than the maximum thickness of the first functional part. The first functional layer comprises a first functional part and a second functional part, the second functional part comprises a plurality of lens parts, at least part of the plurality of lens parts is located in the edge light emitting region; the surface of the lens part away from the substrate is a convex surface; The display substrate further comprises a second functional layer located between the first functional layer and the light shielding layer, the second functional layer is in contact with the convex surface, the refractive index of the second functional layer is less than the refractive index of the lens part. The plurality of lens parts are located in the edge light emitting region, the first functional layer further comprises a flat part located in the middle light emitting region, the maximum thickness of the flat part is not greater than the maximum thickness of the first functional part, The maximum thickness of the lens part is less than the maximum thickness of the flat part. The plurality of lens parts are arranged in sequence along the first direction, part of the plurality of lens parts is located in the edge light emitting region, and the other part is located in the middle light emitting region. The ratio of the width of the lens part in the first direction to the width of the shared sub-pixel region in the first direction is 1 / 10-1 / 5. 2.The display substrate of claim 1, wherein, The first functional layer comprises a first functional part located at least in the privacy sub-pixel region, a hollow part located in the edge light emitting region, and a flat part located in the middle light emitting region, the maximum thickness of the flat part is not greater than the maximum thickness of the first functional part. The first functional layer comprises a first functional part and a hollow part, part of the hollow part is located in the middle light emitting region, and the other part is located in the edge light emitting region. 3.The display substrate of claim 2, wherein, The ratio of the width of the hollow part in the second direction to the width of the shared sub-pixel region in the second direction is greater than or equal to 70%. The first functional layer comprises a first functional part and a second functional part, part of the second functional part is located in the edge light emitting region, and the other part is located in the middle light emitting region; the surface of the second functional part facing the substrate and the surface away from the substrate are both flat surfaces. 4.The display substrate of claim 2, wherein, ​ 5.The display substrate of claim 2, wherein, ​ 6.The display substrate of claim 1, wherein, ​ 7.The display substrate of claim 1, wherein, ​ 8.The display substrate of claim 7, wherein, ​ 9.The display substrate of claim 1, wherein, ​ 10.The display substrate according to any one of claims 1 to 9, wherein The first functional layer is an organic encapsulation layer, and the display substrate further comprises a first inorganic encapsulation layer and a second inorganic encapsulation layer, the first inorganic encapsulation layer, the organic encapsulation layer and the second inorganic encapsulation layer are sequentially arranged in a direction away from the substrate, forming an encapsulation structure for encapsulating the plurality of light emitting devices. 11.The display substrate of claim 10, wherein, The first functional layer comprises a hollow part, and a part of the second inorganic encapsulation layer is located in the hollow part and in contact with the first inorganic encapsulation layer. Alternatively, the first functional layer is a continuous film layer, and a surface of the second inorganic encapsulation layer away from the substrate is conformal to a surface of the first functional layer away from the substrate. 12.The display substrate according to any one of claims 1 to 9, wherein The ratio of the maximum thickness of the second functional part to the maximum thickness of the first functional part is 7 / 10-9 / 10. 13.The display substrate according to any one of claims 1 to 9, wherein The first functional layer further comprises a third functional part, the third functional part surrounds the middle light emitting area, and a surface of the third functional part away from the substrate is in contact with a surface of the first functional part away from the substrate. In a direction close to the middle light emitting area, the distance from a surface of the third functional part away from the substrate to the substrate gradually decreases. 14.The display substrate according to any one of claims 1 to 9, wherein The plurality of light transmitting openings comprise a plurality of first light transmitting openings and a plurality of second light transmitting openings, the anti-peep sub-pixel area comprises at least one anti-peep pixel part, and the light emitting device is arranged in each anti-peep pixel part; the light emitting device comprises a light emitting layer; The anti-peep pixel part corresponds to the first light transmitting opening one by one, and the shared sub-pixel area corresponds to the second light transmitting opening one by one; The orthographic projection of the first light transmitting opening on the substrate is located in the orthographic projection range of the light emitting layer in the anti-peep pixel part on the substrate, and the orthographic projection of the light emitting layer in the shared sub-pixel area on the substrate is located in the orthographic projection range of the second light transmitting opening on the substrate.

15. A display device comprising the display substrate according to any one of claims 1-14.

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