Shielded connector

Abstract

The present invention provides a shielded connector that suppresses the leakage of electromagnetic noise in an outer conductor. The shielded connector (A) includes: an L-shaped inner conductor (21) connected to a circuit board (P); and an outer conductor (30) having a receiving space (43) for receiving the inner conductor (21). The outer conductor (30) is constructed by assembling a first housing (31) and a second housing (36). A partition wall (50) is formed on the first mating surface (45) of one of a pair of mating surfaces (45, 46) of the first housing (31) and the second housing (36) that are close to each other and opposite to each other. The partition wall (50) protrudes in such a way as to separate the receiving space (43) from the outer surface of the outer conductor (30). A groove (51) is formed on the second mating surface (46) of the other pair of mating surfaces (45, 46) for inserting the partition wall (50).

Description

Technical Field

[0001] This disclosure relates to shielded connectors. Background Technology

[0002] Patent Document 1 discloses a shielding terminal comprising a conductive inner conductor, an insulating dielectric, and a conductive outer conductor surrounding the dielectric. When viewed from the side, the shielding terminal is formed in an L-shaped bend. The outer conductor is constructed from a single metal plate. By performing bending and other processes while assembling the dielectric on the metal plate, the L-shaped dielectric and the outer conductor are assembled, and the outer conductor is shaped into an L-shape. Existing technical documents Patent documents

[0003] Patent Document 1: Japanese Patent Application Publication No. 2023-077157 Summary of the Invention The problem that the invention aims to solve

[0004] In circuits using shielded terminals to transmit high-frequency signals, the shielding effect against electromagnetic noise is low in outer conductors made of thin-walled metal sheets that can be bent. Therefore, the outer conductor must be a thick-walled component formed by forging or similar processes. To surround the L-shaped dielectric with the outer conductor, it is necessary to assemble the outer conductor into multiple parts. However, in an outer conductor assembled from multiple parts, gaps that could become leakage paths for electromagnetic noise between the opposing surfaces of the assembled parts are unavoidable.

[0005] The shielded connector disclosed herein is made based on the above-mentioned situation, and its purpose is to suppress the leakage of electromagnetic noise in the outer conductor. Solution for solving the problem

[0006] The shielded connector disclosed herein has the following features: The L-shaped inner conductor is connected to the circuit board; and The outer conductor has a storage space for accommodating the inner conductor. The outer conductor is constructed by assembling a first housing and a second housing. A partition wall is formed on one of the mating surfaces of the first housing and the second housing, which are close to and opposite each other. The partition wall protrudes in a manner that separates the receiving space from the outer surface of the outer conductor. The other of the pair of mating surfaces has a groove formed on it for the partition wall to be embedded. Invention Effects

[0007] According to this disclosure, leakage of electromagnetic noise in the outer conductor can be suppressed. Attached Figure Description

[0008] Figure 1 This is a perspective view showing the shielded connector of Embodiment 1 separated into shielding terminals and a housing. Figure 2 This is an exploded 3D view of the shielding terminal. Figure 3 It is a three-dimensional diagram of the first shell that constitutes the outer conductor. Figure 4 This is a three-dimensional diagram of the second shell that constitutes the outer conductor. Figure 5 This is a side sectional view of the shielded connector. Figure 6 This is a rear sectional view of the shielded connector. Detailed Implementation

[0009] [Description of embodiments of this disclosure] First, embodiments of this disclosure are described. Solutions obtained by arbitrarily combining the following embodiments without causing contradictions are also included in the solutions for carrying out the invention.

[0010] The shielded connector disclosed herein, (1) The device comprises: an L-shaped inner conductor connected to a circuit board; and an outer conductor having a receiving space for receiving the inner conductor. The outer conductor is constructed by assembling a first housing and a second housing. A partition wall is formed on one of a pair of mating surfaces of the first housing and the second housing that are close to each other and opposite each other, the partition wall protruding in a manner that separates the receiving space from the outer surface of the outer conductor. A groove is formed on the other mating surface of the pair of mating surfaces to embed the partition wall. According to the structure of this disclosure, radiated noise generated from the inner conductor within the receiving space leaks to the outside of the outer conductor through the gap (possible leakage path) between the mating surfaces of the first housing and the second housing. Since the possible leakage path of radiated noise from the receiving space to the outer surface of the outer conductor increases by an amount corresponding to the bending path formed by the partition wall and the groove, it is possible to suppress the leakage of radiated noise through the outer conductor.

[0011] (2) Based on (1), preferably, the inner conductor is housed within a dielectric having: a first housing portion extending away from the circuit board; and a second housing portion extending from the end of the first housing portion located on the side opposite to the circuit board, with a gap between it and the circuit board. The partition wall and the groove are disposed between the circuit board and the second housing portion. According to this structure, since the partition wall and the groove are disposed in the dead space between the circuit board and the second housing portion, the large size of the shielded connector caused by the formation of the partition wall and the groove can be avoided.

[0012] (3) Building upon (2), preferably, the first housing has a bottom wall portion arranged close to and opposite the mounting surface of the circuit board. The side of the bottom wall portion opposite to the opposing surface of the circuit board includes a first mating surface, which serves as the mating surface of the first housing side. The second housing has a front wall portion, on which a second mating surface is formed opposite to the first mating surface. According to this structure, the gap between the first and second mating surfaces on the outer surface of the outer conductor does not directly open relative to the circuit board. Therefore, it is possible to suppress electromagnetic noise leaking along the first and second mating surfaces from affecting the mounting components on the circuit board.

[0013] (4) Based on (3), preferably, the front wall portion is the part that separates the storage space from the outside of the outer conductor. The front surface of the front wall portion is located further back than the front end of the bottom wall portion. When the front surface of the front wall portion is located at the same position as the front end of the bottom wall portion, the thickness dimension of the front wall portion in the front-rear direction becomes larger, resulting in a heavier outer conductor. In view of this point, since the front surface of the front wall portion is located further back than the front end of the bottom wall portion, the front wall portion can be made thinner, thereby achieving a lighter outer conductor.

[0014] (5) Based on (4), preferably, the partition wall is formed on the first mating surface and the groove is formed on the second mating surface. When the partition wall is formed on the second mating surface, the bottom wall needs to be thickened by an amount corresponding to the groove, thus resulting in a heavier outer conductor. In contrast, by forming the partition wall on the first mating surface, the bottom wall can be made thinner, thus achieving a lighter outer conductor.

[0015] (6) Based on (3) to (5), preferably, the second housing has a pair of sidewalls covering the front wall and the bottom wall from both sides in the width direction, and the partition wall is formed covering the entire width direction of the first mating surface. According to this structure, since the partition wall is formed covering the entire width of the first mating surface, electromagnetic noise along the first mating surface will definitely pass through the partition wall. Therefore, the electromagnetic noise leakage suppression effect based on the partition wall is excellent.

[0016] (7) Based on (1) to (5), preferably, the first housing and the second housing are assembled in such a way that their mating surfaces are kept opposite each other, and the partition wall protrudes in a direction parallel to the assembly direction of the first housing and the second housing. According to this structure, during the assembly of the first housing and the second housing, the partition wall engages with the groove, thereby guiding the first housing and the second housing.

[0017] [Details of the embodiments of this disclosure] [Example 1] Reference Figures 1-6 The shielded connector A of Embodiment 1, which embodies this disclosure, will be described below. The invention is not limited to these examples, but is defined by the claims and includes all modifications within the meaning and scope of the claims. In Embodiment 1, regarding the front-to-back direction, Figures 1-5 In this context, the F direction is defined as forward. Regarding the up and down directions, [the following is a separate section:] Figures 1-6 The H direction is defined as upward. Regarding the left and right directions, [the following is a list of directions]. Figures 1-4 In section 6, the R direction is defined as the right. The left and right directions are used with the same meaning as the width direction.

[0018] In this embodiment 1, the shielded connector A is mounted on the circuit board P (refer to...). Figure 5 , 6 The shielded connector A is mounted in the state of mounting surface M and engages with the opposite connector (not shown) mounted on the end of the wire harness (not shown). The shielded connector A is constructed by assembling the housing 10 and the shielded terminal 20. A terminal storage chamber 11 for housing the shielded terminal 20 is formed inside the housing 10. The terminal storage chamber 11 is open at the rear and bottom of the housing 10.

[0019] The shielding terminal 20 is constructed by assembling an inner conductor 21, a dielectric 24, and an outer conductor 30. In a side view of the shielding terminal 20, the inner conductor 21 is a single component formed in an L-shaped bend. The inner conductor 21 has a substrate connection portion 22 that is elongated in the vertical direction and a terminal connection portion 23 that extends forward from the upper end of the substrate connection portion 22. The lower end of the substrate connection portion 22 can be connected to the circuit board P. The terminal connection portion 23 can be connected to the terminal parts (not shown) of the opposite connector.

[0020] The dielectric 24, like the inner conductor 21, is formed in an L-shaped bend. The dielectric 24 is a single component comprising a first housing portion 25 housing a substrate connection portion 22 and a second housing portion 26 housing a terminal connection portion 23. The first housing portion 25 is formed as an elongated prism in the vertical direction. The second housing portion 26 is a cylindrical portion protruding forward from the upper end of the first housing portion 25. A press-fit hole 27 for housing the inner conductor 21 is formed inside the dielectric 24. The press-fit hole 27 opens on the rear and lower surfaces of the first housing portion 25 and the front end face of the second housing portion 26. The inner conductor 21 is housed within the dielectric 24 by press-fitting, becoming integrated with the dielectric 24.

[0021] The outer conductor 30 is constructed by assembling a first metal housing 31 and a second metal housing 36. The first housing 31 and the second housing 36 are components formed by casting, forging, machining, etc. Figure 3 As shown, the first housing 31 is a single component having a bottom wall portion 32 and a rear wall portion 33 protruding upward from the rear end of the bottom wall portion 32. A pair of protrusions 34 are formed on the rear end side region of the left and right outer surfaces of the bottom wall portion 32. The protrusions 34 protrude in the width direction from the outer side surface of the rear wall portion 33. A positioning hole 35 is formed in the bottom wall portion 32, penetrating the bottom wall portion 32 in the front-rear direction. The protrusions 34 and the positioning hole 35 are formed in the same area in the front-rear direction. The positioning hole 35 is square in shape when viewed from above. The rear surface of the inner circumferential surface of the positioning hole 35 is coplanar and continuous with the front surface of the rear wall portion 33.

[0022] like Figure 4As shown, the second housing 36 is a single component having a box-shaped portion 37 and a cylindrical portion 42. The box-shaped portion 37 has a front wall portion 38, an upper wall portion 39, and a pair of left and right side wall portions 40. The upper wall portion 39 extends rearward from the upper edge of the front wall portion 38. The pair of side wall portions 40 are connected at right angles to the left and right side edges of the front wall portion 38 and the left and right side edges of the upper wall portion 39. The wall thickness of the front wall portion 38 is greater than that of the upper wall portion 39 and the side wall portions 40. The side wall portions 40 have portions extending downward beyond the lower end of the front wall portion 38. A pair of recesses 41 are formed at the lower end of the side wall portions 40, creating a recess on the left and right inner surfaces of the side wall portions 40. The cylindrical portion 42 protrudes forward from the front wall portion 38 with its axis pointing in the front-rear direction. The internal space of the box-shaped portion 37 is in communication with the internal space of the cylindrical portion 42. The interior space of the box section 37 is open at the rear and bottom.

[0023] The outer conductor 30 is constructed by assembling the first housing 31 from below to the second housing 36. The first housing 31 and the second housing 36 are integrated by pressing. The pressing locations include, for example, the left and right outer sides of the rear wall 33 and the left and right inner sides of the side wall 40, the left and right outer sides of the bottom wall 32 and the left and right inner sides of the side wall 40, and the protrusion 34 and the recess 41. With the first housing 31 and the second housing 36 assembled, the bottom wall 32 closes the lower opening of the housing 37, the rear wall 33 closes the rear opening of the housing 37, and the protrusion 34 fits into the recess 41. An L-shaped storage space 43 for storing the dielectric 24 is formed inside the outer conductor 30. When the dielectric 24 is not stored, the front end of the storage space 43 opens at the front end face of the cylindrical portion 42. The lower end of the storage space 43 opens in the positioning hole 35 on the lower surface of the bottom wall 32.

[0024] When assembling shielded connector A, firstly, the inner conductor 21 is pressed into the press-in hole 27 from behind the dielectric 24. The dielectric 24 with the inner conductor 21 pressed in is then housed inside the second housing 36 from behind. Next, the positioning hole 35 is engaged with the lower end of the first housing portion 25, and the first housing 31 is assembled onto the second housing 36. When the first housing 31 and the second housing 36 are assembled, the dielectric 24 is housed within the housing space 43 of the outer conductor 30, forming the outer conductor 30. Based on the above, the assembly of the shielded terminal 20 is completed. By housing the assembled shielded terminal 20 inside the housing 10, the assembly of shielded connector A is thus completed.

[0025] The second housing 36 has multiple (two pairs in this embodiment 1) grounding connection portions 44 for connecting to the grounding circuit (not shown) of the circuit board P. The grounding connection portions 44 protrude downward from the front and rear ends of the lower surface of the left and right side wall portions 40. The first housing 31 and the second housing 36 are electrically connected in the aforementioned press-in portion. Electromagnetic noise generated from the inner conductor 21 within the storage space 43 is absorbed by the outer conductor 30 and transmitted to the grounding circuit of the circuit board P through the grounding connection portions 44.

[0026] Electromagnetic noise absorbed by the first housing 31 is transmitted to the grounding circuit of the circuit board P via the grounding connection portion 44. Although the second housing 36 differs from the first housing 31 and does not have a portion connected to the grounding circuit, it is electrically connected to the first housing 31 and the second housing 36 on the surface parallel to the assembly direction of the two housings 31 and 36 (the surface facing each other in the direction intersecting the assembly direction) by pressing in. Therefore, electromagnetic noise absorbed by the second housing 36 is transmitted to the grounding circuit via the grounding connection portion 44 through the first housing 31 and the pressing portion.

[0027] On the other hand, a press-fit connection structure is not implemented on the mating surfaces 45 and 46 (surfaces intersecting the assembly direction) of the first housing 31 and the second housing 36, which are opposite each other in the same direction as the assembly direction of the two housings 31 and 36. Therefore, there is a concern that gaps may occur between the mating surfaces 45 and 46 of the first housing 31 and the second housing 36, allowing radiated noise generated from the inner conductor 21 to leak to the outside of the outer conductor 30. Countermeasures will be explained below.

[0028] The region on the upper surface of the bottom wall portion 32 that faces the lower surface of the front wall portion 38 is defined as the first mating surface 45. The region on the lower surface of the front wall portion 38 that faces the upper surface of the bottom wall portion 32 (the first mating surface 45) is defined as the second mating surface 46. The gap between the first mating surface 45 and the second mating surface 46 is defined as a possible leakage path 47 for radiated noise. The surface of the first housing 31 facing the possible leakage path 47 is defined as the first surface leakage path 48 from which electromagnetic noise can leak from the storage space 43 toward the front surface 38F of the front wall portion 38. The surface of the second housing 36 facing the possible leakage path 47 is defined as the second surface leakage path 49 from which electromagnetic noise can leak from the storage space 43 toward the front surface 38F of the front wall portion 38.

[0029] A partition wall 50 is formed on the bottom wall portion 32, protruding upward from the first mating surface 45. The partition wall 50 is arranged to separate the receiving space 43 from the outer surface of the outer conductor 30 (the front surface 38F of the front wall portion 38) in the front-rear direction. In the width direction, the partition wall 50 is continuously erected over the entire width of the bottom wall portion 32. A groove portion 51 is formed on the front wall portion 38, which recesses the second mating surface 46. In the width direction, the groove portion 51 is formed over the entire width of the front wall portion 38. The left and right inner surfaces of the groove portion 51 are coplanar and continuous with the inner surfaces of the side wall portion 40.

[0030] With the first housing 31 and the second housing 36 assembled, the partition wall 50 is housed within the groove 51. In a cross-section of the shielded connector A viewed from the side, the two flat areas in the possible leakage path 47 where the partition wall 50 and the groove 51 are not formed are straight lines extending in the front-back direction. In contrast, the bent area where the partition wall 50 and the groove 51 are formed is a square-shaped (inverted U-shaped) bend. Therefore, the possible leakage path 47 in this embodiment 1 is longer than the form without the bent area. As a result, it is possible to suppress the leakage of radiated noise generated from the inner conductor 21 within the housing space 43 to the outside of the outer conductor 30 through the gap between the first mating surface 45 and the second mating surface 46 (the possible leakage path 47).

[0031] Furthermore, the first surface leakage path 48 is formed by the first mating surface 45 and the partition wall 50, thus the path is longer compared to the form without the partition wall 50. Therefore, even if electromagnetic noise absorbed by the first housing 31 propagates along the first surface leakage path 48, leakage of such electromagnetic noise to the outside of the outer conductor 30 can be suppressed. The second surface leakage path 49 is formed by the second mating surface 46 and the groove 51, thus the path is longer compared to the form without the groove 51. Therefore, even if electromagnetic noise absorbed by the second housing 36 propagates along the second surface leakage path 49, leakage of such electromagnetic noise to the outside of the outer conductor 30 can be suppressed.

[0032] The shielded connector A of this embodiment 1 includes an L-shaped inner conductor 21 connected to a circuit board P and an outer conductor 30 having a receiving space 43 for receiving the inner conductor 21. The outer conductor 30 is constructed by assembling a first housing 31 and a second housing 36. A partition wall 50 is formed on the first mating surface 45 of the first housing 31 and the second housing 36, which are close to each other and opposite each other. The partition wall 50 protrudes in such a way that it separates the receiving space 43 from the outer surface of the outer conductor 30. A groove 51 is formed on the second mating surface 46 of the pair of mating surfaces 45 and 46, into which the partition wall 50 is inserted. According to this structure, the radiated noise generated from the inner conductor 21 in the receiving space 43 leaks to the outside of the outer conductor 30 through the gap between the mating surfaces 45 and 46 of the first housing 31 and the second housing 36 (possible leakage path 47). The potential leakage path 47 of radiated noise from the storage space 43 to the outer surface of the outer conductor 30 increases by an amount corresponding to the bending path formed by the partition wall 50 and the groove 51. Therefore, leakage of radiated noise through the outer conductor 30 can be suppressed.

[0033] The inner conductor 21 is housed within the dielectric 24. The dielectric 24 has a first housing portion 25 and a second housing portion 26. The first housing portion 25 is a portion extending away from the circuit board P. The second housing portion 26 is a portion extending from the end of the first housing portion 25 located on the side opposite to the circuit board P, spaced apart from the circuit board P. A partition wall 50 and a groove 51 are disposed between the circuit board P and the second housing portion 26. According to this structure, since the partition wall 50 and the groove 51 are disposed in the dead space between the circuit board P and the second housing portion 26, the large size of the shielded connector A caused by the formation of the partition wall 50 and the groove 51 can be avoided.

[0034] The first housing 31 has a bottom wall portion 32 arranged close to and opposite the mounting surface M of the circuit board P. The upper surface of the bottom wall portion 32, located on the side opposite to the opposing surface of the circuit board P, includes a first mating surface 45. The second housing 36 has a front wall portion 38 with a second mating surface 46 formed opposite to the first mating surface 45. According to this structure, the gap (potential leakage path 47) between the first mating surface 45 and the second mating surface 46 on the outer surface of the outer conductor 30 does not directly open relative to the circuit board P. Therefore, it is possible to suppress the impact of electromagnetic noise leaking along the first mating surface 45 and the second mating surface 46 on the mounting components on the circuit board P.

[0035] The front wall portion 38 separates the storage space 43 from the exterior of the outer conductor 30. When the front surface 38F of the front wall portion 38 is located at the same position as the front end of the bottom wall portion 32, the thickness of the front wall portion 38 in the longitudinal direction increases, resulting in a heavier outer conductor 30. Therefore, the front surface 38F of the front wall portion 38 is positioned rearward than the front end 32F of the bottom wall portion 32. This allows for a thinner front wall portion 38, thereby achieving a lighter outer conductor 30.

[0036] Unlike Embodiment 1, when the partition wall 50 is formed on the second mating surface 46, the bottom wall portion 32 needs to be thickened by an amount corresponding to the groove portion 51, thus increasing the weight of the outer conductor 30. Therefore, the partition wall 50 is formed on the first mating surface 45, and the groove portion 51 is formed on the second mating surface 46. This allows the bottom wall portion 32 to be thinner, thereby achieving a lighter outer conductor 30.

[0037] The second housing 36 has a pair of sidewalls 40 covering the front wall 38 and the bottom wall 32 from both sides in the width direction. The partition wall 50 is formed over the entire width direction of the first mating surface 45. According to this structure, electromagnetic noise along the first mating surface 45 will definitely pass through the partition wall 50, so the electromagnetic noise leakage suppression effect based on the partition wall 50 is excellent.

[0038] The first housing 31 and the second housing 36 are assembled in such a way that their mating surfaces are facing each other. The partition wall 50 protrudes in a direction parallel to the assembly direction of the first housing 31 and the second housing 36. According to this structure, during the assembly of the first housing 31 and the second housing 36, the partition wall 50 engages with the groove 51, thereby guiding the first housing 31 and the second housing 36.

[0039] [Other Embodiments] This invention is not limited to the embodiments described above and in the accompanying drawings, but is defined by the claims. In this invention, all modifications equivalent to and within the scope of the claims are included, as well as the embodiments described below. The partition walls and slots can also be configured in areas other than the dead space between the circuit board and the second storage section. The gap between the first mating surface and the second mating surface on the outer surface of the outer conductor can also be directly opened relative to the circuit board. The front surface of the front wall can also be located at the same position as the front end of the bottom wall. Alternatively, the partition wall can be formed on the second mating surface, and the groove can be formed on the first mating surface. The assembly direction of the first shell and the second shell can also be parallel to the mating surface. Explanation of reference numerals in the attached figures

[0040] A…Shielded connector M…Mounting surface P…circuit board 10…outer shell 11…Terminal storage compartment 20…Shielded Terminals 21…Inner conductor 22…Substrate connection portion 23…Terminal connection part 24…dielectric 25…First Storage Department 26…Second Storage Department 27…Press-in hole 30…outer conductor 31…First Shell 32...Bottom wall part 32F…Front end of bottom wall 33…posterior wall portion 34…convex part 35… Positioning hole 36…Second shell 37…box section 38…Anterior wall portion 38F…Front surface of the front wall 39…Upper wall 40…side wall portion 41…concave 42...cylindrical part 43… Storage space 44… Grounding connection part 45…First pair of mating surfaces 46…Second pair of mating surfaces 47…may reveal path 48…First surface leakage path 49…Second path along the surface 50… partition wall 51…groove section

Claims

1. A shielded connector comprising: The L-shaped inner conductor is connected to the circuit board; and The outer conductor has a storage space for accommodating the inner conductor. The outer conductor is constructed by assembling a first housing and a second housing. A partition wall is formed on one of the mating surfaces of the first housing and the second housing, which are close to and opposite each other. The partition wall protrudes in a manner that separates the receiving space from the outer surface of the outer conductor. The other of the pair of mating surfaces has a groove formed on it for the partition wall to be embedded.

2. The shielded connector according to claim 1, wherein, The inner conductor is housed within the dielectric. The dielectric has the following characteristics: The first storage section extends away from the circuit board. as well as The second storage section extends from the end of the first storage section located on the side opposite to the circuit board, with a gap between it and the circuit board. The partition wall and the groove are disposed between the circuit board and the second storage portion.

3. The shielded connector according to claim 2, wherein, The first housing has a bottom wall portion configured to be close to and opposite the mounting surface of the circuit board. The surface of the bottom wall portion located on the side opposite to the opposing surface opposite the circuit board includes a first mating surface that serves as the mating surface of the first housing side. The second housing has a front wall portion, on which a second mating surface is formed, which is opposite to the first mating surface.

4. The shielded connector according to claim 3, wherein, The front wall portion is the part that separates the storage space from the exterior of the outer conductor. The front surface of the front wall is located behind the front end of the bottom wall.

5. The shielded connector according to claim 4, wherein, The partition wall is formed on the first mating surface. The groove is formed on the second mating surface.

6. The shielded connector according to any one of claims 1 to 5, wherein, The second housing has a pair of sidewalls that cover the front wall and the bottom wall from both sides in the width direction. The partition wall is formed over the entire area in the width direction of the first mating surface.

7. The shielded connector according to any one of claims 1 to 5, wherein, The first housing and the second housing are assembled in such a manner that their mating surfaces remain opposite to each other. The partition wall protrudes in a direction parallel to the assembly direction of the first housing and the second housing.

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