A resin composition with high tg and low warpage, and a preparation method and application thereof

Abstract

The present application relates to a kind of high Tg low warping resin composition and its preparation method and application, belong to the field of semiconductor packaging technology.The resin composition includes filler 85-90 parts by weight, naphthalene ring type epoxy resin 4-6 parts, multifunctional epoxy resin 1.5-3 parts, curing agent 4.5-7 parts, diluent 0.2-0.6 parts, accelerator 0.1-0.4 parts and dyeing agent 0.1-0.2 parts.The resin composition is applied as wafer packaging liquid state mold sealant.The present application uses naphthalene ring type epoxy resin as main resin, and uses multifunctional epoxy resin as secondary resin, so that when the resin composition is applied as liquid state mold sealant, it can not only ensure low volume shrinkage and low expansion volume, but also adjust viscosity through low viscosity multifunctional epoxy resin.

Description

Technical Field

[0001] This invention relates to a high Tg, low warpage resin composition, its preparation method, and its application, belonging to the field of semiconductor packaging technology. Background Technology

[0002] Liquid molding compound (LMC) is a direct material used in wafer-level advanced packaging. During wafer-level packaging, warpage can occur due to chemical volume shrinkage during curing and the difference in expansion coefficients between the compound and silicon. Figure 1 As shown, excessive warpage can cause the chip to bend, severely affecting the chip yield. To ensure that LMC can fully protect the chip, reducing warpage is crucial.

[0003] The curing of epoxy resin is essentially a ring-opening polymerization of epoxy groups with a curing agent (such as amines or acid anhydrides), resulting in cross-linking of molecular chains to form a three-dimensional network. This process is accompanied by chemical volume shrinkage (typically 1% to 5%). When shrinkage is uneven, stress cannot be dispersed, causing the entire mold surface to bend and warp. Therefore, reducing the volume shrinkage rate and dispersing stress during the reaction process are crucial. A common method is to use spherical silica fillers, which can reduce volume shrinkage (typically 0.1% to 0.3%) while ensuring suitable high-temperature flowability. Simultaneously, a dispersion process is used to uniformly disperse the solid filler within the organic material, thereby reducing warpage. However, to ensure that the application viscosity remains constant, further reduction of warpage is necessary. If warping occurs, the solid filler ratio cannot be increased further, otherwise the system viscosity will also increase sharply. The only way to further reduce warping is to use resin and curing agent systems with lower shrinkage rates. In addition to reducing the volume shrinkage rate of the adhesive, the main factor affecting warping is the difference in the coefficient of thermal expansion between the adhesive and silicone. The coefficient of thermal expansion of silicone is about 3 ppm / ℃, while the low-temperature coefficient of thermal expansion of LMC is 6-9 ppm / ℃ (below Tg temperature) and the high-temperature coefficient of thermal expansion is 35-45 ppm / ℃ (above Tg temperature). The greater the difference in the expansion ratio between the two, the greater the warping. Therefore, reducing the expansion ratio of LMC can also reduce warping.

[0004] Currently, the main approach to reducing the shrinkage rate and expansion coefficient of LMC is to increase the filling rate of the inorganic filler in the system. Surface modification of the inorganic filler or the combination of powders with different particle sizes can improve the filling rate. However, the filling rate is also affected by factors such as the viscosity and compatibility of the organic matter. If the shrinkage rate and expansion coefficient of the epoxy resin and curing agent are large after the reaction, the effectiveness of using inorganic fillers to reduce the shrinkage rate and expansion coefficient will be greatly reduced. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a high Tg and low warpage resin composition, its preparation method, and its application. The composition uses naphthalene ring-type epoxy resin as the main resin and multifunctional epoxy resin as the secondary resin. When this resin composition is used as a liquid molding sealant, it can ensure low volume shrinkage and low volume expansion, and the viscosity can be adjusted by using low-viscosity multifunctional epoxy resin.

[0006] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: a resin composition with high Tg and low warpage, wherein, by weight, the resin composition comprises 85-90 parts of filler, 4-6 parts of naphthalene ring epoxy resin, 1.5-3 parts of multifunctional epoxy resin, 4.5-7 parts of curing agent, 0.2-0.6 parts of diluent, 0.1-0.4 parts of accelerator and 0.1-0.2 parts of dye.

[0007] Furthermore, the weight ratio of naphthalene ring epoxy resin to multifunctional epoxy resin is (1.5-4.0):1.

[0008] Furthermore, the filler is silicon dioxide.

[0009] Furthermore, the curing agent is an acid anhydride curing agent.

[0010] Furthermore, the curing agent is at least one of methylhexahydrophthalic anhydride, H-TMAn, and methyltetrahydrophthalic anhydride.

[0011] Further, the diluent is at least one of N,N-di(glycidyl)o-toluidine and p-tert-butylphenol glycidyl ether.

[0012] Furthermore, the promoter is a latent liquid promoter.

[0013] Further, the accelerator is at least one selected from N,N-dimethylcyclohexylamine, toluyl-N,N-dimethylurea, 2-ethyl-4-methylimidazole, and 1-cyanoethyl-2-ethyl-4-methylimidazole.

[0014] This invention also discloses a method for preparing a resin composition with high Tg and low warpage, wherein the preparation method is as follows: The filler, naphthalene ring epoxy resin, multifunctional epoxy resin, curing agent, diluent, accelerator and dye are mixed and dispersed evenly according to the formula, and then subjected to degassing treatment to obtain a resin composition with high Tg and low warpage.

[0015] The present invention also discloses the application of a high Tg and low warpage resin composition as a liquid molding compound for wafer packaging.

[0016] The beneficial effects of this invention are: The high Tg and low warpage resin composition of this invention uses a naphthalene ring-type epoxy resin. Due to the steric hindrance effect of the naphthalene ring structure after the reaction, its shrinkage is smaller and its coefficient of thermal expansion is lower. In addition, a multifunctional epoxy resin with a low epoxy equivalent, such as an epoxy resin with a functionality of 3-4, is also used. This results in more reactive groups and a denser crosslinking network, leading to a higher Tg value during TMA testing. This results in a higher low-temperature (below Tg, low-temperature thermal expansion coefficient of 6-9 ppm / ℃) and high-temperature thermal expansion coefficients of the material. (Greater than Tg, high temperature expansion coefficient is 35-45ppm / ℃) The expansion coefficient will decrease slightly. Although the reduction in the material's expansion coefficient is small, the material experiences an increased low-temperature expansion coefficient range and a decreased high-temperature expansion coefficient range during high and low temperature changes. This results in a significant decrease in the material's expansion volume throughout the entire low-temperature and high-temperature range. The two are used together, with naphthalene ring epoxy resin as the main resin and multifunctional epoxy resin as the secondary resin. This ensures both low volume shrinkage and low expansion volume, while also adjusting the viscosity through the low-viscosity multifunctional epoxy resin. Attached Figure Description

[0017] Figure 1 This is a schematic diagram illustrating warping that occurs during wafer packaging. Detailed Implementation

[0018] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described in detail below. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0020] A high Tg, low warpage resin composition, by weight, comprises 85-90 parts filler, 4-6 parts naphthalene ring epoxy resin, 1.5-3 parts polyfunctional epoxy resin, 4.5-7 parts curing agent, 0.2-0.6 parts diluent, 0.1-0.4 parts accelerator, and 0.1-0.2 parts dyeing agent.

[0021] Specifically, the weight ratio of naphthalene ring epoxy resin to multifunctional epoxy resin is (1.5-4.0):1.

[0022] Specifically, the filler is silicon dioxide.

[0023] More specifically, the naphthalene ring type epoxy resin is selected from at least one of the following types: Anhui Xinyuan Technology's XY643 ( ); Japanese DIC naphthalene ring type epoxy resins HP-4710, HP-9500, HP-6000, HP6000L, EXA-9900, HP-5000, HP-4770; Japanese Chemicals naphthalene ring type epoxy resins NC-7300-L, NC-7000-L, NC-7000-H.

[0024] Multifunctional epoxy resins (functionality 3-4) are selected from at least one of the following types: Anhui Xinyuan Technology's XY530L ( ), XY570L ( (); Japanese DIC trifunctional epoxy resins HP-7241, EXA-7250; Japanese Kayaku trifunctional epoxy resins EPPN-500 series, FAE-2500; Japanese Kayaku tetrafunctional resin GTR-1800.

[0025] More specifically, the silicon dioxide used in the embodiments of the present invention has a D50 of 6-10 μm and a D99 of 20-40 μm.

[0026] Specifically, the curing agent is an acid anhydride curing agent.

[0027] Specifically, the curing agent is MH (New Japan Rikka, methylhexahydrophthalic anhydride) and H-TMAn (Mitsubishi Gas Chemical, Japan). At least one of MH700 (New Japan Rika, methyltetrahydrophthalic anhydride).

[0028] Specifically, the diluent is at least one of N,N-di(glycidyl)o-toluidine and p-tert-butylphenol glycidyl ether.

[0029] Specifically, the promoter is a latent liquid promoter.

[0030] Specifically, the accelerator is at least one selected from N,N-dimethylcyclohexylamine, toluyl-N,N-dimethylurea, 2-ethyl-4-methylimidazole, and 1-cyanoethyl-2-ethyl-4-methylimidazole.

[0031] More specifically, the dye used in the embodiments of the present invention is carbon black.

[0032] The sources of each substance in the formula and their roles in the composition are as follows: Filler: Purchase directly. It is an inorganic filler that can reduce the coefficient of thermal expansion and increase the strength of the material.

[0033] Naphthalene ring epoxy resin: Purchase directly as a material matrix. Compared with other bisphenol A or bisphenol F epoxy resins, naphthalene ring epoxy resin has less shrinkage and a lower coefficient of expansion.

[0034] Multifunctional epoxy resins (functionality 3-4): Purchase directly as a material matrix. Multifunctional epoxy resins have more reactive groups, higher crosslinking density, and lower viscosity.

[0035] Curing agent: Purchased directly. Under certain temperature and with the help of accelerators, it reacts with epoxy resin, and the system changes from a fluid state to a solid state. Compared with curing agents such as amines, acid anhydride curing agents have lower viscosity and higher crosslinking reaction density.

[0036] Diluent: Purchase directly; it reduces viscosity.

[0037] Accelerators: Purchased directly. They act as catalysts. Accelerators do not function at room temperature, but can promote the reaction at a certain temperature.

[0038] Dyeing agent: Purchase directly; it serves to dye the product.

[0039] A method for preparing a resin composition with high Tg and low warpage, wherein the preparation method comprises: The filler, naphthalene ring epoxy resin, multifunctional epoxy resin, curing agent, diluent, accelerator and dye are mixed and dispersed evenly according to the formula, and then subjected to degassing treatment to obtain a resin composition with high Tg and low warpage.

[0040] More specifically, the preparation method is as follows: S1. Add each component raw material to the mixing cup according to a certain ratio; S2. Use a centrifugal mixer to stir for an appropriate time until the system is initially mixed evenly; S3. The preliminarily uniformly mixed composition is added to a three-roller drum for dispersion treatment to obtain a uniformly dispersed composition. S4. Vacuum degassing is performed on the uniformly dispersed composition using a centrifugal mixer to obtain the final product.

[0041] In step S2 above, the stirring time is 60~100 s each time, the rotation is 1500 r / min, the revolution is 1200 r / min, and it is repeated four times. After each heating, the temperature is cooled to below 30℃ before stirring. In step S3, the feed gap of the three rollers is 60~100 μm and the discharge gap is 30~60 μm; In step S4, the vacuum degassing time of the centrifuge mixer is 60~80 s each time, the rotation is 1500 r / min, the revolution is 1200 r / min, and this is repeated three times. After each heating, the mixture is cooled to below 30℃ at room temperature before stirring.

[0042] Application of a high Tg, low warpage resin composition, wherein the resin composition is used as a liquid molding compound for wafer packaging.

[0043] Example 1 Preparation of a high Tg, low warpage resin composition, wherein the raw material formulation is shown in Table 1 below.

[0044] Table 1. Raw material composition of Example 1 The preparation method is as follows: S1. Add each component raw material to the mixing cup according to the formula ratio; S2. Use a centrifugal mixer to stir for an appropriate time until the system is initially mixed evenly; S3. The preliminarily uniformly mixed composition is added to a three-roller drum for dispersion treatment to obtain a uniformly dispersed composition. S4. Vacuum degassing is performed on the uniformly dispersed composition using a centrifugal mixer to obtain the final product.

[0045] In step S2, the stirring time is 80 s each time, the rotation is 1500 r / min, and the revolution is 1200 r / min. This is repeated four times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring. In step S3, the feed gap of the three rollers is 60 μm and the discharge gap is 60 μm. In step S4, the vacuum degassing time of the centrifuge mixer is 80 s each time, with a rotation speed of 1500 r / min and a revolution speed of 1200 r / min. This process is repeated three times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring.

[0046] Example 2 Preparation of a high Tg, low warpage resin composition, wherein the raw material formulation is shown in Table 2 below.

[0047] Table 2. Raw material composition of Example 2 The preparation method is as follows: S1. Add each component raw material to the mixing cup according to the formula ratio; S2. Use a centrifugal mixer to stir for an appropriate time until the system is initially mixed evenly; S3. The preliminarily uniformly mixed composition is added to a three-roller drum for dispersion treatment to obtain a uniformly dispersed composition. S4. Vacuum degassing is performed on the uniformly dispersed composition using a centrifugal mixer to obtain the final product.

[0048] In step S2, the stirring time is 60 s each time, the rotation is 1500 r / min, the revolution is 1200 r / min, and this is repeated four times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring. In step S3, the feed gap of the three rollers is 100 μm and the discharge gap is 30 μm. In step S4, the vacuum degassing time of the centrifuge mixer is 60 s each time, with a rotation speed of 1500 r / min and a revolution speed of 1200 r / min. This process is repeated three times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring.

[0049] Example 3 Preparation of a high Tg, low warpage resin composition, wherein the raw material formulation is shown in Table 3 below.

[0050] Table 3. Raw material composition of Example 3 The preparation method is as follows: S1. Add each component raw material to the mixing cup according to the formula ratio; S2. Use a centrifugal mixer to stir for an appropriate time until the system is initially mixed evenly; S3. The preliminarily uniformly mixed composition is added to a three-roller drum for dispersion treatment to obtain a uniformly dispersed composition. S4. Vacuum degassing is performed on the uniformly dispersed composition using a centrifugal mixer to obtain the final product.

[0051] In step S2, the stirring time is 100 s each time, the rotation is 1500 r / min, and the revolution is 1200 r / min. This is repeated four times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring. In step S3, the feed gap of the three rollers is 60 μm and the discharge gap is 60 μm. In step S4, the vacuum degassing time of the centrifuge mixer is 60 s each time, with a rotation speed of 1500 r / min and a revolution speed of 1200 r / min. This process is repeated three times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring.

[0052] Example 4 Preparation of a resin composition with high Tg and low warpage, wherein the raw material formulation is shown in Table 4 below.

[0053] Table 4. Raw material formulation composition of Example 4 The preparation method is as follows: S1. Add each component raw material to the mixing cup according to the formula ratio; S2. Use a centrifugal mixer to stir for an appropriate time until the system is initially mixed evenly; S3. The preliminarily uniformly mixed composition is added to a three-roller drum for dispersion treatment to obtain a uniformly dispersed composition. S4. Vacuum degassing is performed on the uniformly dispersed composition using a centrifugal mixer to obtain the final product.

[0054] In step S2, the stirring time is 100 s each time, the rotation is 1500 r / min, and the revolution is 1200 r / min. This is repeated four times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring. In step S3, the feed gap of the three rollers is 60 μm and the discharge gap is 60 μm. In step S4, the vacuum degassing time of the centrifuge mixer is 80 s each time, with a rotation speed of 1500 r / min and a revolution speed of 1200 r / min. This process is repeated three times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring.

[0055] Example 5 Preparation of a high Tg, low warpage resin composition, wherein the raw material formulation is shown in Table 5 below.

[0056] Table 5. Raw material formulation composition of Example 5 The preparation method is as follows: S1. Add each component raw material to the mixing cup according to the formula ratio; S2. Use a centrifugal mixer to stir for an appropriate time until the system is initially mixed evenly; S3. The preliminarily uniformly mixed composition is added to a three-roller drum for dispersion treatment to obtain a uniformly dispersed composition. S4. Vacuum degassing is performed on the uniformly dispersed composition using a centrifugal mixer to obtain the final product.

[0057] In step S2, the stirring time is 100 s each time, the rotation is 1500 r / min, and the revolution is 1200 r / min. This is repeated four times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring. In step S3, the feed gap of the three rollers is 60 μm and the discharge gap is 60 μm. In step S4, the vacuum degassing time of the centrifuge mixer is 80 s each time, with a rotation speed of 1500 r / min and a revolution speed of 1200 r / min. This process is repeated three times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring.

[0058] Example 6 Preparation of a high Tg, low warpage resin composition, wherein the raw material formulation is shown in Table 6 below.

[0059] Table 6. Raw material formulation composition of Example 6 The preparation method is as follows: S1. Add each component raw material to the mixing cup according to the formula ratio; S2. Use a centrifugal mixer to stir for an appropriate time until the system is initially mixed evenly; S3. The preliminarily uniformly mixed composition is added to a three-roller drum for dispersion treatment to obtain a uniformly dispersed composition. S4. Vacuum degassing is performed on the uniformly dispersed composition using a centrifugal mixer to obtain the final product.

[0060] In step S2, the stirring time is 100 s each time, the rotation is 1500 r / min, and the revolution is 1200 r / min. This is repeated four times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring. In step S3, the feed gap of the three rollers is 60 μm and the discharge gap is 60 μm. In step S4, the vacuum degassing time of the centrifuge mixer is 80 s each time, with a rotation speed of 1500 r / min and a revolution speed of 1200 r / min. This process is repeated three times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring.

[0061] Example 7 Preparation of a high Tg, low warpage resin composition, wherein the raw material formulation is shown in Table 7 below.

[0062] Table 7 Raw material formulation composition of Example 7 The preparation method is as follows: S1. First, add HP-4710, HP-7241, and XY643 to the mixing cup according to the formula ratio, and heat at 100℃ for 30 minutes to melt the solid HP-4710 and HP-7241 into XY643. Cool to room temperature for later use. Then add other component raw materials to the mixing cup according to the formula ratio. S2. Use a centrifugal mixer to stir for an appropriate time until the system is initially mixed evenly; S3. The preliminarily uniformly mixed composition is added to a three-roller drum for dispersion treatment to obtain a uniformly dispersed composition. S4. Vacuum degassing is performed on the uniformly dispersed composition using a centrifugal mixer to obtain the final product.

[0063] In step S2, the stirring time is 80 s each time, the rotation is 1500 r / min, and the revolution is 1200 r / min. This is repeated four times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring. In step S3, the feed gap of the three rollers is 60 μm and the discharge gap is 60 μm. In step S4, the vacuum degassing time of the centrifuge mixer is 80 s each time, with a rotation speed of 1500 r / min and a revolution speed of 1200 r / min. This process is repeated three times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring.

[0064] Example 8 Preparation of a high Tg, low warpage resin composition, wherein the raw material formulation is shown in Table 8 below.

[0065] Table 8. Raw material formulation composition of Example 8 The preparation method is as follows: S1. First, add NC-7300-L, FAE-2500, and XY643 to the mixing cup according to the formula ratio, and heat at 100℃ for 30 minutes to melt the solid NC-7300-L and FAE-2500 into XY643. Cool to room temperature for later use. Then, add the other components to the mixing cup according to the formula ratio. S2. Use a centrifugal mixer to stir for an appropriate time until the system is initially mixed evenly; S3. The preliminarily uniformly mixed composition is added to a three-roller drum for dispersion treatment to obtain a uniformly dispersed composition. S4. Vacuum degassing is performed on the uniformly dispersed composition using a centrifugal mixer to obtain the final product.

[0066] In step S2, the stirring time is 80 s each time, the rotation is 1500 r / min, and the revolution is 1200 r / min. This is repeated four times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring. In step S3, the feed gap of the three rollers is 60 μm and the discharge gap is 60 μm. In step S4, the vacuum degassing time of the centrifuge mixer is 80 s each time, with a rotation speed of 1500 r / min and a revolution speed of 1200 r / min. This process is repeated three times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring.

[0067] Example 9 Preparation of a high Tg, low warpage resin composition, wherein the raw material formulation is shown in Table 9 below.

[0068] Table 9. Raw material formulation composition of Example 9 The preparation method is as follows: S1. First, add EXA-9900, GTR-1800, and XY643 to the mixing cup according to the formula ratio. Heat at 100℃ for 30 minutes to melt the solid EXA-9900 and GTR-1800 into XY643. Cool to room temperature for later use. Then, add the other components to the mixing cup according to the formula ratio. S2. Use a centrifugal mixer to stir for an appropriate time until the system is initially mixed evenly; S3. The preliminarily uniformly mixed composition is added to a three-roller drum for dispersion treatment to obtain a uniformly dispersed composition. S4. Vacuum degassing is performed on the uniformly dispersed composition using a centrifugal mixer to obtain the final product.

[0069] In step S2, the stirring time is 80 s each time, the rotation is 1500 r / min, and the revolution is 1200 r / min. This is repeated four times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring. In step S3, the feed gap of the three rollers is 60 μm and the discharge gap is 60 μm. In step S4, the vacuum degassing time of the centrifuge mixer is 80 s each time, with a rotation speed of 1500 r / min and a revolution speed of 1200 r / min. This process is repeated three times. After each heating, the mixture is cooled to below 30°C at room temperature before stirring.

[0070] Comparative Example 1 Comparative Example 1 uses bisphenol A type epoxy resin to prepare a resin composition, and the specific formulation is shown in Table 10 below.

[0071] Table 10. Raw material composition of Comparative Example 1 The preparation method is the same as in Example 1.

[0072] Comparative Example 2 Comparative Example 2 uses bisphenol F type epoxy resin to prepare the resin composition, and the specific formulation is shown in Table 11 below.

[0073] Table 11 Raw material composition of Comparative Example 2 The preparation method is the same as in Example 1.

[0074] Comparative Example 3 In this comparative example 3, only naphthalene ring type epoxy resin was used to prepare the resin composition, and the specific formulation composition is shown in Table 12 below.

[0075] Table 12 Raw material composition of Comparative Example 3 The preparation method is the same as in Example 1.

[0076] Comparative Example 4 In this Comparative Example 4, only a trifunctional epoxy resin was used to prepare the resin composition, and the specific formulation is shown in Table 13 below.

[0077] Table 13 Raw material composition of Comparative Example 4 The preparation method is the same as in Example 1.

[0078] Comparative Example 5 In this Comparative Example 5, only a 4-functionality epoxy resin was used to prepare the resin composition, and the specific formulation is shown in Table 14 below.

[0079] Table 14 Raw material composition of Comparative Example 4 The preparation method is the same as in Example 1.

[0080] Comparative Example 6 In Comparative Example 6, the proportion of naphthalene ring epoxy resin was increased when preparing the resin composition. The specific formulation is shown in Table 15 below.

[0081] Table 15 Raw material composition of Comparative Example 6 The preparation method is the same as in Example 1.

[0082] Comparative Example 7 In Comparative Example 7, the proportion of naphthalene ring epoxy resin was reduced when preparing the resin composition. The specific formulation is shown in Table 16 below.

[0083] Table 16 Raw material composition of Comparative Example 7 The preparation method is the same as in Example 1.

[0084] Comparative Example 8 In Comparative Example 8, the proportion of trifunctional epoxy resin was increased when preparing the resin composition. The specific formulation is shown in Table 17 below.

[0085] Table 17 Raw material composition of Comparative Example 8 The preparation method is the same as in Example 1.

[0086] Comparative Example 9 In Comparative Example 9, the proportion of trifunctional epoxy resin was reduced when preparing the resin composition. The specific formulation is shown in Table 18 below.

[0087] Table 18 Raw material composition of Comparative Example 9 The preparation method is the same as in Example 1.

[0088] The epoxy resins prepared in the above examples and comparative examples were subjected to performance tests, and the specific test results are shown in Table 19 below. The test methods involved are as follows: Viscosity testing method: Borelfeld viscometer, 25℃, No. 14 rotor, 5 rpm; Thermal expansion coefficient and Tg test method: TMA (Static Thermomechanical Analyzer); Warpage testing method: Using a Towa advanced packaging molding machine from Japan, a 12-inch, 775µm thick wafer was used to mold an LMC thickness of 1000µm. After molding at 125℃ for 10 minutes, it was further cured at 150℃ for 60 minutes. Figure 1 Test the warpage value.

[0089] The calculation method for the thermal expansion ratio from 0 to 200℃ is: CTE1*(Tg-0)+CTE2*(200-Tg), where CTE1 is the thermal expansion coefficient from 0℃ to Tg temperature, and CTE2 is the thermal expansion coefficient from Tg temperature to 200℃.

[0090] Table 19 Performance Test Data As can be seen from the data in the table above: Examples 1-9 are resin compositions prepared by the preparation method described in this invention. The ratio of naphthalene ring epoxy resin and multifunctional epoxy resin varies within a specified range, and its viscosity and Tg also change accordingly. The CTE1 / CTE2 changes little, and the increase in Tg contributes to the decrease in the expansion ratio.

[0091] The optimal viscosity for stable LMC operation is 300-700 Pa·s. If the viscosity is too low, it is easy to leak adhesive, and if the viscosity is too high, it is difficult to dispense the adhesive. Since most naphthalene ring-type epoxy resins and multifunctional resins are in a solid state, liquid resin should be the main resin, with a small amount of solid resin added. At the same time, the viscosity can be adjusted to the optimal range (300-700 Pa·s) by adjusting the filler ratio and diluent ratio. While adjusting the viscosity and Tg, the wafer warpage should be kept ≤15mm.

[0092] The results of Comparative Examples 1 and 2 show that both bisphenol A epoxy resin and bisphenol F epoxy resin have large coefficients of thermal expansion at low and high temperatures, and low Tg, which ultimately leads to a large expansion ratio at 0-200℃, resulting in large wafer warpage.

[0093] The results from Comparative Examples 3, 4, and 5 show that: using naphthalene-cyclic resin alone results in higher viscosity; using 3-4 functional epoxy resin alone results in lower Tg; greater expansion ratio at 0-200℃; and greater wafer warpage. Therefore, a reasonable combination of naphthalene-cyclic epoxy resin and multifunctional epoxy resin is more conducive to obtaining a liquid molding compound for wafer encapsulation with excellent overall performance.

[0094] The results from Comparative Examples 6, 7, 8, and 9 show that: when an excessive amount of naphthalene-cyclic epoxy resin is added, the viscosity increases sharply; when too little naphthalene-cyclic epoxy resin is added, the viscosity temperature (Tg) decreases; when too much multifunctional epoxy resin is added, the Tg is relatively low; and when too much multifunctional epoxy resin is added, the Tg changes less, but the viscosity remains low. Therefore, within the dosage range specified in this invention, naphthalene-cyclic epoxy resin and multifunctional epoxy resin are more conducive to obtaining liquid molding compound for wafer packaging with excellent overall performance.

[0095] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0096] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A resin composition with high Tg and low warpage, characterized in that, The resin composition comprises, by weight, 85-90 parts filler, 4-6 parts naphthalene ring epoxy resin, 1.5-3 parts polyfunctional epoxy resin, 4.5-7 parts curing agent, 0.2-0.6 parts diluent, 0.1-0.4 parts accelerator, and 0.1-0.2 parts dyeing agent.

2. The high Tg, low warpage resin composition according to claim 1, characterized in that, The weight ratio of naphthalene ring epoxy resin to multifunctional epoxy resin is (1.5-4.0):

1.

3. The high Tg, low warpage resin composition according to claim 1, characterized in that, The filler is silicon dioxide.

4. The high Tg, low warpage resin composition according to claim 1, characterized in that, The curing agent is an acid anhydride curing agent.

5. The high Tg, low warpage resin composition according to claim 4, characterized in that, The curing agent is at least one of methylhexahydrophthalic anhydride, H-TMAn, and methyltetrahydrophthalic anhydride.

6. The high Tg, low warpage resin composition according to claim 1, characterized in that, The diluent is at least one of N,N-di(glycidyl)o-toluidine and p-tert-butylphenol glycidyl ether.

7. The high Tg, low warpage resin composition according to claim 1, characterized in that, The accelerator is a latent liquid accelerator.

8. The high Tg, low warpage resin composition according to claim 7, characterized in that, The accelerator is at least one selected from N,N-dimethylcyclohexylamine, toluyl-N,N-dimethylurea, 2-ethyl-4-methylimidazole, and 1-cyanoethyl-2-ethyl-4-methylimidazole.

9. A method for preparing a high Tg, low warpage resin composition according to any one of claims 1-8, characterized in that, The preparation method is as follows: The filler, naphthalene ring epoxy resin, multifunctional epoxy resin, curing agent, diluent, accelerator and dye are mixed and dispersed evenly according to the formula, and then subjected to degassing treatment to obtain a resin composition with high Tg and low warpage.

10. The application of a high Tg, low warpage resin composition according to any one of claims 1-8, characterized in that, The resin composition is used as a liquid molding compound for wafer packaging.

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