A copper foil electroplating manufacturing method and a copper foil manufacturing apparatus
By electroplating nickel and copper layers on a substrate and forming a protective layer on the surface of the copper layer, the problem of poor thermal and electrical conductivity caused by oxidation of copper surface is solved, and low-cost copper foil production is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DONGGUAN PURUIDE METALS-PLASTICS&PROD CO LTD
- Filing Date
- 2026-03-26
- Publication Date
- 2026-05-29
AI Technical Summary
In existing technologies, oxidation of the copper surface results in poor thermal and electrical conductivity, and the surface treatment process is complex and costly.
An electroplating method is used to first plate a nickel layer on the substrate, then a copper layer, and form a protective layer on the surface of the copper layer. By controlling the difference in adhesion force, the substrate and the copper layer can be separated, simplifying the process and reducing costs.
Copper foil is produced using electroplating, which reduces production costs and enables efficient production of copper foil through a simple equipment structure.
Smart Images
Figure CN122105544A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electroplating technology, and more particularly to a method for electroplating copper foil and equipment for producing copper foil. Background Technology
[0002] Copper is widely used in electronic products due to its excellent thermal and electrical conductivity. The production of copper in industrial production also uses electrolysis. However, copper is oxidized after production, resulting in relatively poor thermal and electrical conductivity. When industrial copper is used in electronic products, it needs to undergo surface treatment to remove the oxide layer and add an anti-oxidation layer. This process involves many steps and leads to relatively high costs. Summary of the Invention
[0003] The purpose of this invention is to address the shortcomings of existing technologies by providing a copper foil electroplating method that has relatively low cost.
[0004] Another objective of this invention is to provide a manufacturing apparatus for copper foil, which has a simple structure and is easy to implement.
[0005] A method for electroplating copper foil, comprising: Step 1: Provide a conductive substrate; preferably, the thickness of the substrate is less than 2 cm; Step 2: Insulating layers are bonded to the top and bottom ends of each side of the substrate to control the vertical width of the copper foil on each side of the substrate; one side of the tape is adhesive; the insulating layer can be made of tape, such as transparent tape or opaque tape. Step 3: Nickel plating. Electroplat a nickel layer on the substrate surface. The thickness of the nickel layer is less than a first predetermined value, and the adhesion between the nickel layer and the substrate is less than a second predetermined value. Step 4: Rinse with water to remove any residual solution from the surface; Step 5: Copper plating, forming a copper layer on the surface of the nickel layer, with a copper layer thickness of 1-10mm; the adhesion between the copper layer and the nickel layer is greater than the second predetermined value; Step 6: Rinse with water to remove any residual solution from the surface; Step 7: Plate a protective layer. Plate at least one protective layer on the surface of the copper layer. The protective layer can be a nickel layer, a rhodium plating layer, a rhodium-ruthenium alloy plating layer, etc.
[0006] Step 8: Wash with water and air dry.
[0007] Step 9: Peel off the nickel layer from the substrate.
[0008] Preferably, before step 3, the following steps are also included: Step 2.1: Clean the substrate surface.
[0009] Furthermore, after performing step 2.1, the following is also included: Step 2.2: Activate the substrate by etching it with an acid or alkali solution to remove the oxide film on the surface.
[0010] A copper foil manufacturing apparatus, comprising: A first feeding device for feeding the substrate; 4 sets of secondary feeding devices for feeding the insulation layer; An adhesive bonding device for bonding an insulating layer to the upper and lower ends of each side of a substrate; Nickel plating apparatus, used to electroplate nickel layers onto both sides of a substrate; A water washing device is used to clean the substrate; A copper plating apparatus for plating copper onto the surface of a substrate, forming a copper layer on the surface of a nickel layer; A protective plating apparatus for forming a protective layer on a copper surface; A separation device used to separate the copper layer from the substrate; A substrate receiving device for receiving substrates; Two copper foil collecting devices are used to collect copper foil.
[0011] Furthermore, it also includes a drying device to accelerate the evaporation of moisture from the substrate surface.
[0012] After washing with water, the substrate is preferably dried using an air-drying device to remove surface moisture.
[0013] Furthermore, the bonding device includes: a front bonding mechanism and a rear bonding mechanism; The front bonding mechanism includes a front roller assembly for abutting the substrate, a front positioning rod is provided on the left side of the front roller assembly, and the substrate passes through the gap between the front roller assembly and the front positioning rod; two adhesive tapes are respectively introduced between the front positioning rod and the substrate, and the two adhesive tapes are respectively bonded to the upper and lower ends of the left side of the substrate; The post-bonding mechanism includes a rear roller assembly for abutting the substrate, a rear positioning rod is provided on the right side of the rear roller assembly, and the substrate passes through the gap between the rear roller assembly and the rear positioning rod; two adhesive tapes are respectively introduced between the front positioning rod and the substrate, and the two adhesive tapes are respectively bonded to the upper and lower ends of the right side of the substrate.
[0014] One side of the tape is self-adhesive. The direction of movement is changed by the front or rear positioning rod, and it adheres to the substrate to form an adhesive bond. As the substrate and the tape move continuously, the substrate and the tape are bonded between the front roller assembly and the front positioning rod, and between the rear roller assembly and the rear positioning rod.
[0015] The rear roller assembly can adopt the same structure as the front roller assembly.
[0016] The front roller assembly and the rear roller assembly are combined into a single roller assembly.
[0017] The roller assembly includes a fixed shaft and a roller sleeved on the fixed shaft. The roller can rotate relative to the fixed shaft. Preferably, the fixed shaft is sleeved with a bearing and connected to the roller through the bearing. The base abuts against the roller and moves forward.
[0018] Furthermore, the separation device includes: three spaced-apart separation wheel assemblies, each separation wheel assembly including a separation wheel and a connecting shaft, with the separation wheel sleeved on the connecting shaft.
[0019] The beneficial effects of the present invention are as follows: The present invention produces copper foil by electroplating and electroplating protective layers on both sides of the copper foil, which makes the production cost relatively low. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the structure of the first feeding device, the second feeding device, and the bonding device in the copper foil manufacturing equipment of this embodiment.
[0021] Figure 2 This is a schematic diagram of the separation device.
[0022] Figure label: 1—Second feeding device; 2—First feeding device; 3—Rear positioning rod; 4—Front positioning rod; 5—Roller assembly; 6—Connecting shaft; 7—Separating wheel; 8—Base; 9—Copper foil; 10—Insulating layer. Detailed Implementation
[0023] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.
[0024] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.
[0025] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0027] The present invention will now be described in detail with reference to the accompanying drawings. Figures 1 to 2 As shown.
[0028] Example 1: A method for electroplating copper foil, comprising: Step 1: Provide a conductive substrate 8; preferably, the thickness of the substrate 8 is less than 2 cm; Step 2: An insulating layer 10 is bonded to the top and bottom ends of each side of the substrate 8 to control the top and bottom width of the copper foil 9 on each side of the substrate 8; one side of the tape is adhesive; the insulating layer 10 can be tape, such as transparent tape or opaque tape. Step 3: Nickel plating. Electroplat a nickel layer on the surface of the substrate 8. The thickness of the nickel layer is less than a first predetermined value, and the adhesion between the nickel layer and the substrate 8 is less than a second predetermined value. Step 4: Rinse with water to remove any residual solution from the surface; Step 5: Copper plating, forming a copper layer on the surface of the nickel layer, with a copper layer thickness of 1-10mm; the adhesion between the copper layer and the nickel layer is greater than the second predetermined value; Step 6: Rinse with water to remove any residual solution from the surface; Step 7: Plate a protective layer. Plate at least one protective layer on the surface of the copper layer. The protective layer can be a nickel layer, a rhodium plating layer, a rhodium-ruthenium alloy plating layer, etc.
[0029] Step 8: Wash with water and air dry.
[0030] Step 9: Peel off the nickel layer from the substrate 8 to form copper foil 9.
[0031] This technical solution produces copper through electroplating. First, a nickel layer is electroplated onto both sides of the substrate 8. Then, copper is electroplated onto the nickel layer to form a copper layer. The thickness of both the nickel and copper layers is controlled within a predetermined range. This thickness control is related to the electroplating time, which can be controlled empirically or adjusted through multiple experiments. The initial predetermined value can be 1mm, 2mm, etc.; this is existing technology and will not be elaborated further. Then, a protective layer is electroplated onto the copper layer surface. This protective layer can be an anti-oxidation layer, an anti-corrosion layer, etc.
[0032] Secondly, when selecting materials for the substrate 8, it is generally made of metal. After electroplating with nickel, the adhesion between the substrate and the nickel layer is less than the adhesion between the copper layer and the nickel layer. The substrate 8 is generally made of stainless steel, etc. This technical solution uses electroplating to produce copper, and through the difference in adhesion, tears the copper layer, forming a nickel layer and a protective layer on both sides of the copper layer. This method has a relatively low production cost, and it is produced in one step through electroplating. The second predetermined value is only a reference value, referring to the adhesion between the copper layer and the nickel layer. The second predetermined value can be 4 / 5, 2 / 3, 9 / 10, etc., of the adhesion between the copper layer and the nickel layer. Secondly, the electroplated nickel layer serves two purposes. First, the nickel layer acts as an intermediate layer, providing adhesion to both the substrate 8 and the copper layer, ensuring that electroplating can proceed normally. Second, due to differences in adhesion, it can be peeled off from the substrate 8. Third, the nickel layer acts as a protective layer to protect the copper layer (copper foil). The nickel layer also has oxidation resistance.
[0033] Preferably, before step 3, the following steps are also included: Step 2.1: Clean the surface of substrate 8.
[0034] Cleaning treatment mainly includes: surface degreasing and rust removal; during operation, the substrate 8 is passed through degreasing and rust removal tanks; weak alkalis, weak acids, or other agents are used in the degreasing and rust removal tanks; such as alkaline degreasing agents, which are chemical preparations with detergent builders and surfactants as the main components, achieving the degreasing function by reducing the adhesion between oil stains and the substrate. Rust removal is mainly carried out by electro-desorption, which is existing technology and will not be described in detail.
[0035] Furthermore, after performing step 2.1, the following is also included: Step 2.2: Activate substrate 8 by etching it with acid or alkali solution to remove the oxide film on the surface.
[0036] It is understandable that after treatment with acid, alkali, or electroplating solutions, substrate 8 will be rinsed with water to clean the surface and remove residual acid or alkali. Therefore, a water rinse is required between steps 2.1 and 2.2. To enable nickel plating on substrate 8, surface activation treatment is necessary. Substrate 8 is generally made of metal; its surface may be oxidized. To prevent oxides from hindering or affecting nickel plating, this embodiment performs activation treatment on the surface of substrate 8. Activation treatment is optional. Depending on the degree of oxidation on the surface of substrate 8, if the oxidation degree is low, such as below 1%, activation treatment is not required.
[0037] Secondly, it should be noted that during nickel plating in step 3, the thickness of the nickel layer is preferably less than 1 mm. The thickness of the nickel layer can be determined based on the subsequent use of the copper foil 9 (copper layer). If used in a harsher environment, the thickness of the nickel layer can be appropriately increased. When selecting the substrate 8, it can be chosen based on the adhesion between the copper layer and the nickel layer in step 5, ensuring that the adhesion between the substrate 8 and the nickel layer is relatively small, much smaller than the adhesion between the copper layer and the nickel layer, to facilitate peeling in step 9. During peeling in step 9, the insulating layer 10 can be torn between itself and the copper layer. Since the insulating layer 10 is adhesive and non-conductive, and its surface has no plating, there is a clear boundary between the insulating layer 10 and the plating. Tear off a small portion of the insulating layer 10 from the end, and then use a scraper or other tool to peel off the plating adjacent to the torn portion of the insulating layer 10. After peeling off a small section, the nickel layer and the substrate 8 can be gradually peeled off, thus obtaining a copper layer with protection on both sides.
[0038] Example 2: A copper foil manufacturing device, comprising: First feeding device 2 for feeding material onto substrate 8; 4 sets of second feeding devices 1 for feeding the insulation layer 10; An adhesive device for bonding the insulating layer 10 to the upper and lower ends of each side of the substrate 8; A nickel plating apparatus for electroplating nickel layers on both sides of the substrate 8; A water washing device is used to clean the substrate 8; A copper plating apparatus is used to plate copper on the surface of substrate 8, forming a copper layer on the surface of the nickel layer; A protective plating apparatus for forming a protective layer on a copper surface; A separation device for separating the copper layer from the substrate 8; A substrate receiving device is used to receive substrate 8; Two copper foil collecting devices are used to collect copper foil.
[0039] This technical solution is mainly applied to industrial production. The substrate 8 is copper-plated on both sides to form copper foil (copper layer). To control the width of the copper plating on both sides and to prevent the copper foil from fusing together at the edges, this embodiment attaches an insulating layer 10 to the upper and lower ends of both sides of the substrate 8. The insulating layer 10 can be adhesive tape, such as transparent or opaque tape. The substrate 8 can be a stainless steel roll. After the stainless steel and adhesive tape are unwound, the adhesive tape is sequentially bonded to the stainless steel at the bonding device; then they are conveyed forward together.
[0040] First, the substrate 8 passes through a nickel plating device (which can be an existing technology, such as a nickel plating bath) to continuously form a nickel layer on both sides of the substrate 8. Then, it passes through a water washing device to rinse the surface of the substrate 8 with pure water to remove residual electrolyte. The water washing device can also be an existing technology, such as a rain shower tank where spray water onto the surface of the substrate 8. Next, the substrate 8 passes through a copper plating device to form a copper layer on the surface of the nickel layer. The copper plating device can also be an existing technology, such as a copper plating bath. As the substrate 8 continuously passes through the copper plating bath, a copper layer continuously forms on the surface of the nickel layer, thus forming a copper foil. After the copper layer is formed, the substrate 8 is washed again and then passes through a protective layer electroplating device to form a protective layer on the surface of the copper layer. This protective layer can be a nickel layer, a rhodium layer, or a rhodium-ruthenium alloy layer. The material selection for the protective layer depends on the subsequent usage environment of the copper foil. The protective electroplating device can be an existing technology, such as an electroplating bath. After each electroplating process, the substrate 8 needs to pass through a water washing device to clean the surface and remove any remaining electrolyte.
[0041] After electroplating, the substrate 8 is separated from the copper layers on both sides by a separation device. The separation device can be three different conveying lines. When the substrate 8 passes through the separation device, initially, it can be manually peeled off to separate the substrate 8 from the copper layers on both sides. Then, the separation device conveys the copper layers on both sides and the substrate 8 in the middle to three directions respectively. During the conveying process, the copper layers on both sides are continuously separated from the substrate 8.
[0042] Finally, the substrate 8 and the stripped copper layer are collected by the substrate 8 collecting device and the copper foil collecting device; the collecting device is generally a winding device, which can be based on existing technology.
[0043] Furthermore, it also includes a drying device to accelerate the evaporation of moisture from the surface of the substrate 8.
[0044] After washing with water, the substrate 8 is preferably dried using an air-drying device to remove surface moisture. The air-drying device can also be an existing technology.
[0045] Furthermore, the bonding device includes: a front bonding mechanism and a rear bonding mechanism; The front bonding mechanism includes a front roller assembly for abutting against the substrate 8. A front positioning rod 4 is provided on the left side of the front roller assembly. The substrate 8 passes through the gap between the front roller assembly and the front positioning rod 4. Two adhesive tapes are introduced between the front positioning rod 4 and the substrate 8, and the two adhesive tapes are bonded to the upper and lower ends of the left side of the substrate 8, respectively. The post-bonding mechanism includes a rear roller assembly for abutting the substrate 8. A rear positioning rod 3 is provided on the right side of the rear roller assembly. The substrate 8 passes through the gap between the rear roller assembly and the rear positioning rod 3. Two adhesive tapes are introduced between the front positioning rod 4 and the substrate 8, and the two adhesive tapes are bonded to the upper and lower ends of the right side of the substrate 8, respectively.
[0046] One side of the tape is self-adhesive. The direction of movement is changed by the front positioning rod 4 or the rear positioning rod 3, and it adheres to the base 8 to form an adhesive bond. As the base 8 and the tape move continuously, the base 8 and the tape are bonded between the front roller assembly and the front positioning rod 4, and between the rear roller assembly and the rear positioning rod 3.
[0047] The rear roller assembly can adopt the same structure as the front roller assembly.
[0048] See Figure 1 The front roller assembly and the rear roller assembly are combined into roller assembly 5.
[0049] The roller assembly includes a fixed shaft and a roller sleeved on the fixed shaft. The roller can rotate relative to the fixed shaft. Preferably, the fixed shaft is sleeved with a bearing and connected to the roller through the bearing. The base 8 abuts against the front roller and moves forward.
[0050] In this embodiment, to simplify the structure, the front roller assembly and the rear roller assembly are combined, that is, the front bonding mechanism and the rear bonding mechanism are integrated, and one set of roller assembly 5 is omitted; the front bonding mechanism and the rear bonding mechanism share one front roller assembly or rear roller assembly, and one rear roller assembly or front roller assembly is omitted accordingly.
[0051] See Figure 2 The separation device includes three spaced-apart separation wheel 7 assemblies, each of which includes a separation wheel 7 and a connecting shaft 6, with the separation wheel 7 sleeved on the connecting shaft 6.
[0052] The spacing between the three separation rollers 7 can be slightly larger. After the base 8 and the copper layers on both sides are initially peeled off, they are guided to the separation rollers 7 and come into contact with them. After the copper layers are peeled off, copper foil 9 is formed.
[0053] The above description is only a preferred embodiment of the present invention. For those skilled in the art, there will be changes in the specific implementation and application scope based on the ideas of the present invention. The content of this specification should not be construed as a limitation of the present invention.
Claims
1. A method for electroplating copper foil, comprising: Step 1: Provide a conductive substrate; Its characteristic is that it also includes: Step 2: Insulating layers are bonded to the top and bottom ends of each side of the substrate to control the vertical width of the copper foil on each side of the substrate. Step 3: Nickel plating. Electroplat a nickel layer on the substrate surface. The thickness of the nickel layer is less than a first predetermined value, and the adhesion between the nickel layer and the substrate is less than a second predetermined value. Step 4: Rinse with water to remove any residual solution from the surface; Step 5: Copper plating, forming a copper layer on the surface of the nickel layer, with a copper layer thickness of 1-10mm; the adhesion between the copper layer and the nickel layer is greater than the second predetermined value; Step 6: Rinse with water to remove any residual solution from the surface; Step 7: Apply a protective layer. Apply at least one protective layer to the surface of the copper layer. Step 8: Wash with water and air dry; Step 9: Peel off the nickel layer from the substrate to obtain copper foil.
2. The method for manufacturing copper foil by electroplating according to claim 1, characterized in that: Before step 3, the following steps are also included: Step 2.1: Clean the substrate surface.
3. The method for manufacturing copper foil by electroplating according to claim 1, characterized in that: After step 2.1, the following is also included: Step 2.2: Activate the substrate by etching it with an acid or alkali solution to remove the oxide film on the surface.
4. A copper foil manufacturing device, characterized in that: include: A first feeding device for feeding the substrate; 4 sets of secondary feeding devices for feeding the insulation layer; An adhesive bonding device for bonding an insulating layer to the upper and lower ends of each side of a substrate; Nickel plating apparatus, used to electroplate nickel layers onto both sides of a substrate; A water washing device is used to clean the substrate; A copper plating apparatus for plating copper onto the surface of a substrate, forming a copper layer on the surface of a nickel layer; A protective plating apparatus for forming a protective layer on a copper surface; A separation device used to separate the copper layer from the substrate; A substrate receiving device for receiving substrates; Two copper foil collecting devices are used to collect copper foil.
5. The copper foil manufacturing equipment according to claim 4, characterized in that: It also includes a drying device to accelerate the evaporation of moisture from the substrate surface.
6. The copper foil manufacturing equipment according to claim 4, characterized in that: The bonding device includes: a front bonding mechanism and a rear bonding mechanism; The front bonding mechanism includes a front roller assembly for abutting the substrate, a front positioning rod is provided on the left side of the front roller assembly, and the substrate passes through the gap between the front roller assembly and the front positioning rod; two adhesive tapes are respectively introduced between the front positioning rod and the substrate, and the two adhesive tapes are respectively bonded to the upper and lower ends of the left side of the substrate; The post-bonding mechanism includes a rear roller assembly for abutting the substrate, a rear positioning rod is provided on the right side of the rear roller assembly, and the substrate passes through the gap between the rear roller assembly and the rear positioning rod; wherein two adhesive tapes are respectively introduced between the front positioning rod and the substrate, and the two adhesive tapes are respectively bonded to the upper end and the lower end of the right side of the substrate; One side of the tape is self-adhesive. The direction of movement is changed by the front or rear positioning rod, and it adheres to the substrate to form an adhesive bond. As the substrate and the tape move continuously, the substrate and the tape are bonded between the front roller assembly and the front positioning rod, and between the rear roller assembly and the rear positioning rod.
7. The copper foil manufacturing equipment according to claim 6, characterized in that: The front roller assembly and the rear roller assembly are combined into a single roller assembly.
8. The copper foil manufacturing equipment according to claim 7, characterized in that: The roller assembly includes a fixed shaft and a roller sleeved on the fixed shaft, the roller being rotatable relative to the front fixed shaft.
9. The copper foil manufacturing equipment according to claim 8, characterized in that: The fixed shaft is fitted with a bearing and connected to the front roller through the bearing; the base abuts against the front roller and moves forward.
10. The copper foil manufacturing equipment according to claim 4, characterized in that: The separation device includes three spaced-apart separation wheel assemblies, each consisting of a separation wheel and a connecting shaft, with the separation wheel sleeved onto the connecting shaft.