Electrolytic copper foil and roughening treatment method thereof

By forming a nanoscale nodular structure on the surface of electrolytic copper foil using an organic-inorganic composite additive system, the technical challenges of low roughness, high peel strength, and uniform density in high-end HVLP copper foil have been solved. This achieves an environmentally friendly and efficient roughening process with strong adaptability and ease of industrialization.

CN122105552APending Publication Date: 2026-05-29江西铜博科技股份有限公司 +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
江西铜博科技股份有限公司
Filing Date
2026-02-14
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Existing technologies struggle to simultaneously achieve the comprehensive performance goals of low roughness, high peel strength, and uniform density in high-end HVLP copper foils. Traditional additive systems also present environmental challenges and insufficient control precision.

Method used

An organic-inorganic composite additive system, including sodium molybdate, sodium tungstate, and hydroxyethyl cellulose, is used to form a uniform and dense nanoscale nodular structure through cathodic electrolytic roughening treatment. Combined with curing, ashing, and passivation treatments, the microscopic morphology and macroscopic properties of the copper foil surface are synergistically optimized.

Benefits of technology

While maintaining low roughness, the peel strength reaches over 0.80 N/mm, meeting the performance requirements of high-end HVLP copper foil. It is also completely free of toxic substances, meets environmental protection requirements, has strong adaptability to process conditions, and is easy to industrialize.

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Abstract

The application relates to the technical field of copper foil and discloses an electrolytic copper foil and a roughening treatment method thereof. The roughening treatment method of the electrolytic copper foil comprises the following steps: S1, adding an organic-inorganic composite additive into a prepared base roughening solution to prepare a roughening solution, wherein the organic-inorganic composite additive comprises sodium molybdate, sodium tungstate and hydroxyethyl cellulose, the concentration of the sodium molybdate is 30-50 mg / L, the concentration of the sodium tungstate is 20-40 mg / L, and the concentration of the hydroxyethyl cellulose is 6-10 mg / L; and S2, performing cathode electrolytic roughening treatment on a pretreated copper foil by using the roughening solution to obtain the electrolytic copper foil. Through the above mode, the problem that a roughening layer is difficult to synchronously realize the comprehensive performance target of 'low roughness, high peeling strength and uniform compactness' can be solved.
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