Computing block system

The modular computing block system solves the inefficiency problem of traditional data centers when power, cooling and computing demands increase, achieving more efficient space utilization and scalability, and enhancing interoperability and redundancy.

CN122111182APending Publication Date: 2026-05-29VERTIV CORP

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
VERTIV CORP
Filing Date
2025-11-28
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

The standardized racks in traditional data centers become inefficient in terms of space utilization, interoperability, scalability, and redundancy as power, cooling, and computing demands increase.

Method used

It employs a modular computing block system, including computing blocks, frames, and interconnect infrastructure, providing power, cooling, and communication support. The computing blocks are removable and replaceable, and the frames support the computing blocks and allow for sliding and stacking configurations.

Benefits of technology

It improves data center space utilization and scalability, enhances interoperability and redundancy, and supports flexible changes in computing needs.

✦ Generated by Eureka AI based on patent content.

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Abstract

Modular computing systems can include a plurality of computing blocks, a frame to physically support the computing blocks, and an interconnection infrastructure. The interconnection infrastructure can provide power, cooling, and communications for the computing blocks. Each computing block can include a housing, a computing portion within the housing, a cooling portion within the housing to extract heat from the computing portion, a power infrastructure to power the computing portion, a communications infrastructure to facilitate communications between the computing portion and an external network, a cooling infrastructure to transfer heat from within the housing to outside the housing, and a service corridor within the housing to provide physical access to at least the computing portion.
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Description

[0001] Cross-references to related applications

[0002] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 726,246, filed November 28, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure generally relates to data centers, and more specifically to modular designs for data centers. Background Technology

[0004] Data centers come in many forms. Traditional standardization remains at the individual rack level. As power, cooling, and computing demands increase, standardized racks are often not even used. This can lead to suboptimal forms or solutions for solving specific computing tasks, which may be inefficient in terms of space utilization, interoperability, scalability, redundancy, and / or other considerations. Summary of the Invention

[0005] The applicant has created new and useful devices, systems, and methods for designing, assembling, and upgrading data centers. In at least one embodiment, the modular computing system according to this disclosure can improve the implementation and support of data centers by providing modular computing blocks that can be added and / or replaced as needed.

[0006] In at least one embodiment, the modular computing system according to this disclosure may include a plurality of computing blocks, a frame for physically supporting the plurality of computing blocks, interconnect infrastructure, or any combination thereof. In at least one embodiment, the interconnect infrastructure may provide power, cooling, communication, or any combination thereof to the computing blocks. In at least one embodiment, the interconnect infrastructure may include power infrastructure for supplying power to each computing block, communication infrastructure for facilitating communication between each computing block and / or an external network, cooling infrastructure for transferring heat from each computing block to a source such as the external environment, or any combination thereof.

[0007] In at least one embodiment, each computing block may be removably coupled to or within a frame and / or interconnect infrastructure, for example, for repair, replacement, upgrade, or any combination thereof. In at least one embodiment, a first computing block may be removed from the frame and replaced by a second computing block. In at least one embodiment, the second computing block may be identical to the first computing block, coupled to the same location in the frame, coupled to the same interconnect infrastructure, or any combination thereof. In at least one embodiment, the second computing block may be a different upgraded version of the first computing block.

[0008] In at least one embodiment, a computing block may include computing devices and / or functions similar to those of other computing blocks within the framework. In at least one embodiment, a computing block may include computing devices and / or functions different from those of other computing blocks within the framework.

[0009] In at least one embodiment, the frame can independently support each compute block. In at least one embodiment, the frame can independently support the weight of each compute block. In at least one embodiment, the frame can physically support the weight of one or more additional compute blocks in a stacked configuration. In at least one embodiment, the frame can support compute blocks aligned with each other. In at least one embodiment, each compute block can be in physical contact with other compute blocks within the frame. In at least one embodiment, each compute block can be physically and / or electrically isolated relative to other compute blocks coupled to or within the frame.

[0010] In at least one embodiment, each computational block, when coupled to or within a frame, may be accessible on opposite sides, such as front and rear sides, a first end, and a second end. In at least one embodiment, the system may include stairs integral with or otherwise coupled to the frame to provide access to at least two computational blocks (such as one computational block positioned above the others) and / or walkways integral with or otherwise coupled to the frame to provide access to at least two computational blocks (such as computational blocks positioned side-by-side). In at least one embodiment, each computational block may slide vertically and / or horizontally into and / or within the frame.

[0011] In at least one embodiment, the computing block according to this disclosure may include a housing, a computing portion within the housing, a cooling portion within the housing and / or capable of extracting heat from the computing portion, a power infrastructure at least partially disposed within the housing and / or capable of supplying power to the computing portion, a communication infrastructure at least partially disposed within the housing and / or capable of facilitating communication between the computing portion and at least one external network, a cooling infrastructure at least partially disposed within the housing and / or capable of transferring heat from the housing to the outside of the housing, a service corridor within the housing and / or capable of providing physical access to the computing portion, or any combination thereof.

[0012] In at least one embodiment, the housing may be or include a frame that surrounds the computing and cooling portions in a two-dimensional (i.e., on four sides) or three-dimensional (i.e., on all six sides) manner. In at least one embodiment, the frame may completely surround the computing and cooling portions and / or surround the computing and cooling portions in three dimensions. In at least one embodiment, the housing may include one or more walls that surround the computing and cooling portions. In at least one embodiment, the housing may include a top wall, a bottom wall, a front wall, a rear wall, a right side wall, a left side wall, or any combination thereof. In at least one embodiment, the housing may include one or more doors or other entrances through any of the walls, for example, to provide access to a service corridor. In at least one embodiment, the housing may include one or more doors or other entrances that replace and / or serve as any of the walls.

[0013] In at least one embodiment, the computing block according to this disclosure may include one or more power connectors coupled to the housing for supplying power to the electrical infrastructure. In at least one embodiment, the power connectors may be coupled to and / or supply power through the walls of the housing. In at least one embodiment, the electrical infrastructure may include one or more busbars, one or more circuit breakers, one or more cables, one or more plugs and / or sockets, or any combination thereof.

[0014] In at least one embodiment, the computing block according to this disclosure may include one or more communication connectors coupled to the housing to facilitate communication between the communication infrastructure and external networks and / or other computing blocks. In at least one embodiment, the communication connectors may be coupled to a wall of the housing and / or facilitate communication through the walls of the housing. In at least one embodiment, the communication infrastructure may include one or more patch panels, one or more network devices (such as hubs, switches, and / or routers), one or more network cables, one or more other networking devices and / or components, or any combination thereof.

[0015] In at least one embodiment, the computing block according to this disclosure may include one or more cooling connectors coupled to the housing for supplying cooling fluid to the cooling infrastructure. In at least one embodiment, the cooling connectors may be coupled to and / or pass through the walls of the housing to supply cooling fluid. In at least one embodiment, the computing block according to this disclosure may include a cooling module that can supply cooling fluid to at least one cooling connector and / or transfer heat extracted from the computing portion within the housing to the external environment. In at least one embodiment, the cooling module may be coupled to the computing block inside, outside, or through the housing or a portion thereof (such as a frame or wall). In at least one embodiment, the cooling portion and / or cooling infrastructure within the housing may include one or more pipes, one or more fans, one or more heat exchangers, one or more pumps (such as for pumping cooling fluid through the heat exchangers), piping for circulating cooling fluid, or any combination thereof.

[0016] In at least one embodiment, the service corridor within the housing can provide access within the housing to the computing section, cooling section, power infrastructure, communication infrastructure, cooling infrastructure, or any combination thereof. In at least one embodiment, the service corridor within the housing can be located between the computing section and the cooling section. In at least one embodiment, the service corridor within the housing can be sized and configured to enable access to the computing section and / or the cooling section, which can be of any size and / or configuration required or desired according to embodiments of this disclosure.

[0017] In at least one embodiment, the computing section within the housing can be sized and configured to accommodate one or more computing device designs, such as a standard 19-inch computer rack or any other desired device design. In at least one embodiment, two or more such designs can be positioned side-by-side. In at least one embodiment, each design can support one or more mounted computing devices, such as standard 19-inch rack-mounted computing devices, computing devices such as CPUs or GPUs, other desired device designs, dedicated heat exchangers and / or dedicated cooling equipment, etc. In at least one embodiment, the computing block can be a standalone data center or can be used as a standalone data center and / or integrated with other computing blocks to form a larger data center.

[0018] In at least one embodiment, the housing dimensions may be those of a shipping container or other dimensions standardized at the data center level, such as those specified by the International Organization for Standardization in ISO 688 or other dimensional requirements, and / or the frame may be used to support each computing block in a manner similar to that used on container ships and / or in warehouses. In at least one embodiment, the housing may physically support the weight of one or more additional computing blocks stacked thereon.

[0019] In at least one embodiment, the housing may be removably coupled to or within a frame, the frame supporting multiple housings and / or computing blocks. In at least one embodiment, the frame may independently support each housing. In at least one embodiment, each housing, when coupled to or within the frame, may be accessible on opposite sides, such as front and rear sides, a first end, and a second end. In at least one embodiment, the system may include stairs and / or walkways, the stairs being integral with or otherwise coupled to the frame for providing access to at least two service corridors within the housing, such as service corridors within housings located above others, and the walkways being integral with or otherwise coupled to the frame for providing access to at least two service corridors within the housing, such as service corridors within housings positioned side-by-side. In at least one embodiment, each housing may slide vertically and / or horizontally into or within the frame. In at least one embodiment, each housing may be in physical contact with other housings within the frame. Attached Figure Description

[0020] Figure 1 This is a side view of one embodiment of a computational block according to the present disclosure.

[0021] Figure 2 This is a side view of one embodiment of the computing block and cooling module according to the present disclosure.

[0022] Figure 3 This is a side view of one embodiment of a modular computing system according to the present disclosure.

[0023] Figure 4 This is a perspective view of one embodiment of a modular computing system according to the present disclosure.

[0024] Figure 5 yes Figure 4 Other three-dimensional diagrams of the modular computing system.

[0025] Figure 6 yes Figure 4 Another three-dimensional view of the modular computing system.

[0026] Figure 7 This is a perspective view of other embodiments of the modular computing system according to the present disclosure.

[0027] Figure 8 This is a perspective view of yet another embodiment of the modular computing system according to the present disclosure.

[0028] Figure 9 This is a perspective view of one embodiment of a modular computing system according to the present disclosure, showing multiple units.

[0029] Figure 10 This is a perspective view of one embodiment of a modular computing system according to the present disclosure, showing a computing block being moved relative to a frame.

[0030] Figure 11 This is a perspective view of one embodiment of a modular computing system according to the present disclosure, showing the computing block next to the frame.

[0031] Figure 12 This is a perspective view of one embodiment of a modular computing system according to the present disclosure, showing multiple computing blocks arranged in a frame. Detailed Implementation

[0032] The accompanying drawings described above and the written description of specific structures and functions below are not intended to limit the scope of the applicant's invention or the scope of the appended claims. Rather, the drawings and written description are provided to teach any person skilled in the art to make and use the invention, which is seeking patent protection. It will be understood by those skilled in the art that not all features of a commercial implementation of the invention are described or illustrated for clarity and understanding. It will also be understood by those skilled in the art that the development of a practical commercial implementation incorporating various aspects of the invention will require numerous implementation-specific decisions to achieve the developer's ultimate goals for the commercial implementation. Such implementation-specific decisions may include, but are not limited to, compliance with system-related, business-related, governmental-related, and other constraints that may vary depending on the specific implementation, location, and time. While the developer's efforts may be complex and time-consuming in an absolute sense, such efforts will be a routine task for those skilled in the art who benefit from this disclosure. It must be understood that the invention disclosed and taught herein is susceptible to many and various modifications and alternatives.

[0033] The use of singular terms such as, but not limited to, “a” is not intended as a limitation on the number of items. Furthermore, the use of relational terms such as, but not limited to, “top,” “bottom,” “left,” “right,” “upper,” “lower,” “below,” “above,” “side,” etc., in the written description is for clarity when specifically referring to the accompanying drawings and is not intended to limit the scope of the invention or the appended claims. The terms “comprising” and “e.g.” are illustrative, not restrictive. The terms “coupled,” “coupled,” “coupled,” “coupler,” and similar terms are used extensively herein and may include any method or means for fixing, joining, bonding, fastening, attaching, engaging, inserting therein, forming thereon or therein, connecting one or more components, or otherwise associating one or more components together, for example mechanically, magnetically, electrically, chemically, operably, directly or indirectly through intermediate elements, and may also include, but is not limited to, integrally forming one functional component with other functional components. Coupling can occur in any direction, including rotationally. Furthermore, all parts and components of this disclosure that can be physically and inherently implemented include both hypothetical and real features, regardless of whether such features are explicitly described herein. These features include, but are not limited to, features such as axis, ends, inner and outer surfaces, internal space, top, bottom, sides, boundaries, dimensions (e.g., height, length, width, thickness), mass, weight, volume, and density.

[0034] The applicant has created new and useful apparatus, systems, and methods for designing, assembling, and upgrading data centers. In at least one embodiment, the modular computing system according to this disclosure can improve the implementation and support of data centers by providing modular computing blocks that can be added and / or replaced as desired or required according to a given implementation of this disclosure.

[0035] Figure 1 This is a side view of one embodiment of a computational block according to the present disclosure. Figure 2 This is a side view of one embodiment of the computing block and cooling module according to the present disclosure. Figure 3 This is a side view of one embodiment of a modular computing system according to the present disclosure. Figure 4 This is a perspective view of one embodiment of a modular computing system according to the present disclosure. Figure 5 yes Figure 4 Other three-dimensional diagrams of the modular computing system. Figure 6 yes Figure 4 Another three-dimensional view of the modular computing system. Figure 7This is a perspective view of other embodiments of the modular computing system according to the present disclosure. Figure 8 This is a perspective view of yet another embodiment of the modular computing system according to the present disclosure. Figure 9 This is a perspective view of one embodiment of a modular computing system according to the present disclosure, showing multiple units. Figure 10 This is a perspective view of one embodiment of a modular computing system according to the present disclosure, showing a computing block being moved relative to a frame. Figure 11 This is a perspective view of one embodiment of a modular computing system according to the present disclosure, showing the computing block next to the frame. Figure 12 This is a perspective view of one embodiment of a modular computing system according to the present disclosure, showing multiple computing blocks arranged in a frame. Figures 1 to 12 They are described in combination.

[0036] In at least one embodiment, the modular computing system 100 according to this disclosure may include a plurality of computing blocks 200, a frame 110 for physically supporting the plurality of computing blocks 200, an interconnect infrastructure 120, or any combination thereof. In at least one embodiment, the interconnect infrastructure 120 may provide power, cooling, communication, or any combination thereof to the computing blocks. In at least one embodiment, the interconnect infrastructure 120 may include power infrastructure 122 for supplying power to each computing block 200, communication infrastructure 124 for facilitating communication between each computing block 200 and / or an external network, cooling infrastructure 126 for transferring heat from each computing block 200 to, for example, the external environment, or any combination thereof.

[0037] In at least one embodiment, each computing block 200 may be removably coupled to or within the frame 110 and / or interconnect infrastructure 120, for example, for repair, replacement, upgrade, or any combination thereof. In at least one embodiment, a first computing block in computing block 200 may be removed from the frame 110 and replaced by a second computing block in computing block 200. In at least one embodiment, the second computing block in computing block 200 may be identical to the first computing block in computing block 200, may be coupled to the same location in the frame 110 as the first computing block in computing block 200, may be coupled to the same interconnect infrastructure 120 as the first computing block in computing block 200, or any combination thereof. For example, in at least one embodiment, two or more computing blocks 200 may be identical or interchangeable in form and interface with the frame 110 and interconnect infrastructure, but identical or different in internal configuration and / or functionality. In at least one embodiment, the second computation block in computation block 200 may be different from the first computation block in computation block 200, for example, as an upgraded version of the first computation block in computation block 200.

[0038] In at least one embodiment, a computing block 200 may include similar (which may include the same) computing devices 222 and / or functions relative to other computing blocks 200 within the frame 110. In at least one embodiment, a computing block 200 may include different computing devices 222 and / or functions relative to other computing blocks 200 within the frame 110.

[0039] In at least one embodiment, the frame 110 can independently support each computing block 200. In at least one embodiment, the frame 110 can independently support the weight of each computing block 200. In at least one embodiment, each computing block 200 and / or the frame 110 can physically support the weight of one or more additional computing blocks 200 stacked thereon. In at least one embodiment, the frame 110 can support computing blocks 200 aligned with each other. In at least one embodiment, each computing block 200 can be in physical contact with other computing blocks 200 within the frame 110. In at least one embodiment, each computing block 200 can be physically and / or electrically isolated relative to other computing blocks 200 coupled to or within the frame 110.

[0040] In at least one embodiment, each computation block 200, when coupled to or within the frame 110, may be accessible on opposite sides, such as front and rear sides, a first end, and a second end. In at least one embodiment, the system 100 may include: a staircase integrally or otherwise coupled to the frame 110 to provide access to at least two computation blocks (e.g., computation blocks positioned one above the others) among the computation blocks 200; and / or a walkway integrally or otherwise coupled to the frame 110 to provide access to at least two computation blocks (side-by-side computation blocks) among the computation blocks 200. In at least one embodiment, each computation block 200 may slide vertically and / or horizontally into and / or within the frame 110.

[0041] In at least one embodiment, the computing block 200 according to this disclosure may include: a housing 210, such as a container or shell; a computing portion 220 within the housing 210; a cooling portion 230 within the housing 210 and / or from which heat can be extracted from the computing portion 220; an electrical infrastructure 240 at least partially disposed within the housing 210 and / or capable of supplying power to the computing portion 220 and / or the cooling portion 230; a communication infrastructure 250 at least partially disposed within the housing 210 and / or capable of facilitating communication between the computing portion 230 and at least one external network and / or other computing blocks 200; a cooling infrastructure 260 at least partially disposed within the housing 210 and / or capable of transferring heat from within the housing 210 to the outside of the housing 210; a service corridor (or space) 270 within the housing 210 and / or capable of providing physical access to the computing portion 220, the cooling portion 230 and / or any or all of the infrastructures 240, 250, 260; or any combination thereof.

[0042] In at least one embodiment, housing 210 may be or include a frame 212 that surrounds computing section 220 and cooling section 230, such as in two dimensions (i.e., on four sides) or three dimensions (i.e., on all six sides). In at least one embodiment, frame 212 may completely surround computing section 220 and cooling section 230 and / or surround computing section 220 and cooling section 230 in three dimensions. In at least one embodiment, housing 210 may include one or more walls 214 surrounding computing section 220 and cooling section 230. In at least one embodiment, housing 210 may include a top wall, bottom wall, front wall, rear wall, right side wall, left side wall, or any combination thereof. In at least one embodiment, housing 210 may include one or more doors or other entrances through any wall 214, for example, to provide access to service corridor 270. In at least one embodiment, housing 210 may include one or more doors or other entrances that replace or serve as any of the walls 214.

[0043] In at least one embodiment, the computing block 200 according to this disclosure may include one or more power connectors 290 coupled to housing 210 for supplying power to power infrastructure 240. In at least one embodiment, the power connectors may be coupled to and / or supply power through walls 214 of housing 210. In at least one embodiment, power infrastructure 240 may include one or more busbars, one or more circuit breakers, one or more cables, one or more plugs and / or sockets, or any combination thereof.

[0044] In at least one embodiment, the computing block 200 according to this disclosure may include one or more communication connectors 292 coupled to the housing 210 for facilitating communication between the communication infrastructure 250 and external networks and / or other computing blocks 200. In at least one embodiment, the communication connectors may be coupled to and / or pass through the wall 214 of the housing 210 to facilitate communication. In at least one embodiment, the communication infrastructure 250 may include one or more patch panels, one or more network devices (e.g., hubs and / or routers), one or more network cables, one or more other networking devices and / or components, or any combination thereof.

[0045] In at least one embodiment, the computing block 200 according to this disclosure may include one or more cooling connectors 294 coupled to a housing for supplying cooling fluid to a cooling infrastructure 260. In at least one embodiment, the cooling connectors may be coupled to and / or supply cooling fluid through a wall 214 of the housing 210. In at least one embodiment, the computing block 200 according to this disclosure may include a cooling module 280, which may be connected to the cooling infrastructure 260, for example, via a cooling connector, and / or transfer heat extracted from the computing portion 220 within the housing 210 to the environment outside the housing 210. In at least one embodiment, the cooling module 280 may be coupled to the computing block 200 inside, outside, or through the housing 210 or a portion thereof (e.g., frame 212 or wall 214). In at least one embodiment, the cooling module 280 may work in conjunction with, replace or accommodate, the cooling section 230, the power infrastructure 240, the communication infrastructure 250, the cooling infrastructure 260, or any combination and / or portion thereof. In at least one embodiment, the cooling section 230, the cooling infrastructure 260, the cooling module 280, or any combination thereof may include one or more pipes 232, one or more fans 234, one or more heat exchangers 236, one or more prime movers 238 (e.g., pumps and / or compressors) for moving cooling fluid through the heat exchangers, conduits 262 (e.g., fluid conduits, connectors, fittings, valves, and other piping components) for circulating, delivering, and / or controlling the flow of cooling fluid, or any combination thereof.

[0046] In at least one embodiment, a service corridor 270 within the housing 210 may provide access within the housing 210 to the computing unit 220, cooling unit 230, power infrastructure 240, communication infrastructure 250, cooling infrastructure 260, or any combination thereof, for purposes such as maintenance, repair, upgrades, or any combination thereof. In at least one embodiment, the service corridor 270 within the housing 210 may be located between the computing unit 220 and the cooling unit 230. In at least one embodiment, the service corridor 270 within the housing 210 may be sized and configured as needed or desired for access to the computing unit 220 and / or the cooling unit 230, for example, for maintenance, repair, or other purposes.

[0047] In at least one embodiment, the computing section 220 within housing 210 may be sized and configured to accommodate one or more computing device designs (e.g., a standard 19-inch computer rack or any other desired or desired device design according to an implementation of this disclosure) or otherwise cooperate with them. In at least one embodiment, two or more such designs may be positioned side-by-side. In at least one embodiment, each design may support one or more mounted computing devices, such as standard 19-inch rack-mount computing devices, computing devices such as central processing units (CPUs) or graphics processing units (GPUs), dedicated heat exchangers and / or dedicated cooling systems and / or other desired or desired device designs. In at least one embodiment, two or more of such devices may be positioned one above the others. In at least one embodiment, computing block 200 may be a standalone data center or serve as a standalone data center and / or may be integrated with one or more other computing blocks 200 to form one or more larger data centers.

[0048] In at least one embodiment, the housing 210 may be or include a shipping container, such as a freight container or other sized container standardized at the data center level (whether now known or to be developed in the future), such as a container specified by the International Organization for Standardization in ISO 688 or other size requirements, and / or the frame 110 may be arranged to support each computing block 200 in a manner similar to that used on container ships and / or in warehouses. In at least one embodiment, the housing 210 and / or the frame 110 may physically support the weight of one or more additional computing blocks 200, for example, by stacking on the housing 210, on top of the housing 210, or otherwise supported by the housing 210 and / or in layers of the frame 110.

[0049] In at least one embodiment, housing 210 may be removably coupled to or within frame 110, and frame 110 may support a plurality of housings 210 and / or computing blocks 200. In at least one embodiment, frame 110 may independently support each housing 210. In at least one embodiment, each housing 210 may be accessible on opposite sides (e.g., front and rear sides, first and second ends, or one or more other sides) when coupled to or within frame 110. In at least one embodiment, system 100 may include staircases 140 integral with or otherwise coupled to frame 110 for providing access to at least two service corridors (e.g., one service corridor 270 positioned above the others within housing 210) within housing 210, and / or walkways integral with or otherwise coupled to frame 110 for providing access to at least two service corridors (e.g., service corridors 270 positioned side-by-side within housing 210) within housing 210. In at least one embodiment, each housing 210 may slide vertically and / or horizontally into or within frame 110. In at least one embodiment, each housing 210 may be in physical contact with or isolated from other housings 210 within frame 110.

[0050] In at least one embodiment, the modular computing system according to this disclosure may include a plurality of computing blocks, a frame for physically supporting the plurality of computing blocks, interconnect infrastructure, or any combination thereof. In at least one embodiment, the interconnect infrastructure may provide power, cooling, communication, or any combination thereof to the computing blocks. In at least one embodiment, the interconnect infrastructure may include power infrastructure for supplying power to each computing block, communication infrastructure for facilitating communication between each computing block and / or with an external network, cooling infrastructure for transferring heat from each computing block to, for example, the external environment, or any combination thereof.

[0051] In at least one embodiment, each computing block may be removably coupled to or within a frame and / or interconnect infrastructure, for example, for repair, replacement, upgrade, or any combination thereof. In at least one embodiment, a first computing block may be removed from the frame and replaced with a second computing block. In at least one embodiment, the second computing block may be identical to the first computing block, coupled to the same location in the frame, coupled to the same interconnect infrastructure, or any combination thereof. In at least one embodiment, the second computing block may differ from the first computing block, for example, as an upgraded version of the first computing block.

[0052] In at least one embodiment, a computing block may include similar computing devices and / or functions relative to other computing blocks within the frame. In at least one embodiment, a computing block may include different computing devices and / or functions relative to other computing blocks within the frame.

[0053] In at least one embodiment, the frame can independently support each computing block. In at least one embodiment, the frame can independently support the weight of each computing block. In at least one embodiment, each computing block can physically support the weight of one or more additional computing blocks stacked on it. In at least one embodiment, the frame can support computing blocks aligned with each other. In at least one embodiment, each computing block can be in physical contact with other computing blocks within the frame. In at least one embodiment, each computing block can be physically and / or electrically isolated relative to other computing blocks coupled to or within the frame.

[0054] In at least one embodiment, each computational block may be accessible on opposite sides (e.g., front and rear sides, first and second ends, etc.) when coupled to or within a frame. In at least one embodiment, the system may include stairs integral with or otherwise coupled to the frame to provide access to at least two computational blocks (e.g., one positioned above the others) and / or walkways integral with or otherwise coupled to the frame to provide access to at least two computational blocks (e.g., side-by-side computational blocks). In at least one embodiment, each computational block may slide vertically and / or horizontally into and / or within the frame.

[0055] In at least one embodiment, the computing block according to this disclosure may include: a housing; a computing portion within the housing; a cooling portion within the housing and / or from which heat can be extracted from the computing portion; a power infrastructure at least partially disposed within the housing and / or capable of supplying power to the computing portion; a communication infrastructure at least partially disposed within the housing and / or capable of facilitating communication between the computing portion and at least one external network; a cooling infrastructure at least partially disposed within the housing and / or capable of transferring heat from within the housing to the outside of the housing; a service corridor within the housing and / or capable of providing physical access to the computing portion, or any combination thereof.

[0056] In at least one embodiment, the housing may be or include a frame that surrounds the computing and cooling portions in a two-dimensional (i.e., on four sides) or three-dimensional (i.e., on all six sides) manner. In at least one embodiment, the frame may completely surround the computing and cooling portions and / or surround the computing and cooling portions in three dimensions. In at least one embodiment, the housing may include one or more walls surrounding the computing and cooling portions. In at least one embodiment, the housing may include a top wall, a bottom wall, a front wall, a rear wall, a right side wall, a left side wall, or any combination thereof. In at least one embodiment, the housing may include one or more doors or other entrances through any of the walls, for example, to provide access to a service corridor. In at least one embodiment, the housing may include one or more doors or other entrances that replace and / or serve as any of the one or more walls.

[0057] In at least one embodiment, the computing block according to this disclosure may include one or more power connectors coupled to the housing for supplying power to the power infrastructure. In at least one embodiment, the power connectors may be coupled to and / or supply power through the walls of the housing. In at least one embodiment, the power infrastructure may include one or more busbars, one or more circuit breakers, one or more cables, one or more plugs and / or sockets, or any combination thereof.

[0058] In at least one embodiment, the computing block according to this disclosure may include one or more communication connectors coupled to the housing to facilitate communication between the communication infrastructure and external networks and / or other computing blocks. In at least one embodiment, the communication connectors may be coupled to and / or pass through the walls of the housing to facilitate communication. In at least one embodiment, the communication infrastructure may include one or more patch panels, one or more network devices (e.g., hubs and / or routers), one or more network cables, one or more other networking devices and / or components, or any combination thereof.

[0059] In at least one embodiment, the computing block according to this disclosure may include one or more cooling connectors coupled to a housing for supplying cooling fluid to the cooling infrastructure. In at least one embodiment, the cooling connectors may be coupled to and / or supply cooling fluid through the walls of the housing. In at least one embodiment, the computing block according to this disclosure may include a cooling module that can supply cooling fluid to at least one cooling connector and / or transfer heat extracted from the computing portion within the housing to the external environment. In at least one embodiment, the cooling module may be coupled to the computing block inside, outside, or through the housing or a portion thereof (such as a frame or wall). In at least one embodiment, the cooling portion and / or cooling infrastructure within the housing may include one or more pipes, one or more fans, one or more heat exchangers, one or more pumps (e.g., for pumping cooling fluid through the heat exchangers), piping that allows cooling fluid to circulate, or any combination thereof.

[0060] In at least one embodiment, the service corridor within the housing can provide access within the housing to computing units, cooling units, power infrastructure, communication infrastructure, or any combination thereof. In at least one embodiment, the service corridor within the housing can be located between the computing units and the cooling units. In at least one embodiment, the service corridor within the housing can be sized and configured to allow for service corridors of the required size, for example, to access the computing units and / or cooling units.

[0061] In at least one embodiment, the computing section within the enclosure may be sized and configured to accommodate one or more standard 19-inch rack-mount computing devices, computing units such as CPUs or GPUs, dedicated heat exchangers and / or dedicated cooling units, and / or other desired or desired device designs, such as those positioned side-by-side. In at least one embodiment, each rack may support, for example, one or more rack-mount computing devices positioned above the others. In at least one embodiment, the computing block may be a standalone data center or may be used as a standalone data center and / or integrated with other computing blocks to form a larger data center.

[0062] In at least one embodiment, the housing may be a shipping container, such as the shipping container specified by the International Organization for Standardization in ISO 688, and / or the frame may be used to support each computing block in a manner similar to that used on container ships and / or in warehouses. In at least one embodiment, the housing may physically support the weight of one or more computing blocks in a stacked configuration. In at least one embodiment, the housing may be or comprise a container of any size and / or shape, such as a container standardized for data center purposes or other purposes.

[0063] In at least one embodiment, the housing may be removably coupled to or within a frame, the frame supporting multiple housings and / or computing blocks. In at least one embodiment, the frame may independently support each housing. In at least one embodiment, each housing may be accessible on opposite sides (e.g., front and rear, first and second ends, etc.) when coupled to or within the frame. In at least one embodiment, the system may include stairs integral with or otherwise coupled to the frame for providing access to at least two service corridors (e.g., one service corridor positioned above the others within the housing) within the service corridors, and / or walkways integral with or otherwise coupled to the frame for providing access to at least two service corridors (e.g., side-by-side service corridors within the housing) within the service corridors. In at least one embodiment, each housing may slide vertically and / or horizontally into or within the frame. In at least one embodiment, each housing may be in physical contact with other housings within the frame.

[0064] Without departing from the spirit of the applicant's disclosure, other and additional embodiments utilizing one or more aspects of this disclosure are conceivable. For example, apparatuses, systems, and methods can be implemented for many different types and sizes across many different industries. Furthermore, various methods and embodiments of apparatuses, systems, and methods can be combined with each other to produce variations of the disclosed methods and embodiments. Discussion of singular elements can include plural elements, and vice versa. Unless otherwise specifically limited, the order of steps can occur in various sequences. The various steps described herein can be combined with other steps, interspersed with stated steps, and / or broken down into multiple steps. Similarly, elements have been functionally described, and elements can be implemented as individual components or can be combined into components having multiple functions.

[0065] The invention has been described in the context of preferred and other embodiments, and not every embodiment of the invention has been described. Obvious modifications and variations of the described embodiments will be useful to those skilled in the art who will benefit from this disclosure. The disclosed and undisclosed embodiments are not intended to limit or restrict the scope or applicability of the invention as envisioned by the applicant, but rather, in accordance with patent law, the applicant intends to fully protect all such modifications and improvements that fall within the scope or range of equivalents of the appended claims.

Claims

1. A modular computing system, comprising: Multiple computation blocks, wherein each computation block includes: case; The calculation section within the housing; The cooling section within the housing; and A service corridor, which is located within the housing and configured to provide access to the computing portion within the housing; A framework, configured to physically support the plurality of computational blocks; and Interconnected infrastructure, including: The power infrastructure is configured to supply power to each computing block; The communication infrastructure is configured to facilitate communication between each computing block; and Cooling infrastructure is configured to transfer heat from each computing block to the external environment.

2. The system according to claim 1, wherein, Each compute block is removably coupled to the framework and the interconnect infrastructure.

3. The system according to claim 1, wherein, The first computation block in the computation block is configured to be removed from the frame and replaced by the second computation block in the computation block.

4. The system according to claim 1, wherein, Each housing includes a frame surrounding the computing section and the cooling section.

5. The system according to claim 1, wherein, Each housing includes a frame and multiple walls surrounding the computing section and the cooling section.

6. The system according to claim 1, wherein, Each housing is configured to physically support the weight of at least one additional computing block thereon, and wherein the frame is configured to support the computing blocks that are aligned with each other.

7. The system according to claim 1, wherein, Each enclosure has standardized dimensions at the data center level.

8. The system according to claim 1, wherein, The service corridors within each housing are sized and configured to allow ordinary people to stand within them.

9. The system according to claim 1, wherein, The service corridor within each housing is at least partially located between the computing section and the cooling section.

10. The system according to claim 1, wherein, The service corridor within each housing is configured to provide access to the computing section and the cooling section within the housing.

11. The system according to claim 1, wherein, The computing portion within each housing is sized and configured to accommodate a variety of computing devices.

12. The system according to claim 1, wherein, The cooling components within each housing include at least one duct and at least one fan.

13. The system according to claim 1, wherein, The cooling section within each housing includes at least one heat exchanger and at least one pump, the at least one pump being configured to pump cooling fluid through the at least one heat exchanger and the computing section.

14. The system according to claim 1, wherein, The cooling infrastructure within each housing includes piping configured to circulate cooling fluid therein.

15. The system according to claim 1, wherein, Each housing is configured to slide vertically within the frame.

16. The system according to claim 1, wherein, Each housing is configured to slide horizontally within the frame.

17. The system according to claim 1, wherein, Each housing is configured to physically contact other housings within the frame.

18. The system according to claim 1, wherein, The frame is configured to independently support each housing.

19. The system according to claim 1, wherein, Each housing is configured to be accessible from the side when coupled within the frame.

20. The system of claim 1, further comprising a staircase coupled to the frame and configured to provide access to the service corridor within the housing.