Radiator and terminal device

Abstract

A heat sink includes at least a first heat dissipation component, a second heat dissipation component, a liquid inlet connector and a liquid outlet connector. The first heat dissipation component includes a first flow channel, a first liquid inlet hole and a first liquid outlet hole, the first flow channel is communicated with the first liquid inlet hole and the first liquid outlet hole, and the first liquid inlet hole and the first liquid outlet hole both penetrate through the first heat dissipation component. The second heat dissipation component is detachably connected with the first heat dissipation component, and includes a second flow channel, a second liquid inlet hole and a second liquid outlet hole, the second flow channel is communicated with the second liquid inlet hole and the second liquid outlet hole, the second liquid inlet hole is communicated with the first liquid inlet hole, and the second liquid outlet hole is communicated with the first liquid outlet hole. The liquid inlet connector is communicated with the first liquid inlet hole, and the liquid outlet connector is communicated with the first liquid outlet hole. The application also provides a terminal device.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more particularly to a heat sink and a terminal device. Background Technology

[0002] Terminal devices (such as servers) typically include memory modules and heat sinks. Currently, the heat sinks used to dissipate heat from memory modules have a fixed structure, meaning they can only dissipate heat from a fixed number of memory modules. In addition, the heat sinks have low heat dissipation efficiency and are difficult to meet heat dissipation requirements. Summary of the Invention

[0003] In view of this, it is necessary to provide a radiator and terminal device that are flexible in structure and have good heat dissipation performance.

[0004] A radiator includes at least one first heat dissipation component, a second heat dissipation component, a liquid inlet connector, and a liquid outlet connector. The first heat dissipation component includes a first flow channel, a first liquid inlet, and a first liquid outlet, the first flow channel connecting the first liquid inlet and the first liquid outlet, both of which penetrate the first heat dissipation component. The second heat dissipation component is detachably connected to the first heat dissipation component, and includes a second flow channel, a second liquid inlet, and a second liquid outlet, the second flow channel connecting the second liquid inlet and the second liquid outlet, the second liquid inlet connecting to the first liquid inlet, and the second liquid outlet connecting to the liquid outlet. The liquid inlet connector connects to the first liquid inlet, and the liquid outlet connector connects to the first liquid outlet.

[0005] In one possible embodiment of this application, the first heat dissipation component has a first receiving groove and a second receiving groove. The first receiving groove is connected to a first liquid inlet, and the second receiving groove is connected to a first liquid outlet. The liquid inlet connector includes a first connecting portion and a first protrusion. The first protrusion surrounds the first connecting portion, and a portion of the first connecting portion is received in the first receiving groove of one of the first heat dissipation components. The first protrusion abuts against the first heat dissipation component. The liquid outlet connector includes a second connecting portion and a second protrusion. The second protrusion surrounds the second connecting portion, and a portion of the second connecting portion is received in the second receiving groove of one of the first heat dissipation components. The second protrusion abuts against the first heat dissipation component.

[0006] In one possible embodiment of this application, the liquid inlet connector further includes at least one third protrusion, which surrounds the first connecting portion and is located on the side of the first protrusion away from the first heat dissipation component; the liquid outlet connector further includes at least one fourth protrusion, which surrounds the second connecting portion and is located on the side of the second protrusion away from the first heat dissipation component.

[0007] In one possible embodiment of this application, the first heat dissipation component includes a first protrusion and a second protrusion, a first liquid inlet hole penetrates the first protrusion, and a first liquid outlet hole penetrates the second protrusion; the second heat dissipation component includes a first groove and a second groove, the second liquid inlet hole and the first groove are connected, and the second liquid outlet hole and the second groove are connected; the first protrusion is received in the first groove, and the second protrusion is received in the second groove.

[0008] In one possible embodiment of this application, the heat sink further includes a first seal and a second seal, the first seal being located in a first groove and the second seal being located in a second groove, the first seal and the second seal being used to fill the gap between the first heat sink assembly and the second heat sink assembly.

[0009] In one possible embodiment of this application, the first heat dissipation component further includes a first body portion and a first mounting portion, the first mounting portion being located on the side of the first body portion away from the second heat dissipation component; the second heat dissipation component further includes a second body portion and a second mounting portion, the second mounting portion being located between the first body portion and the second body portion, and an installation space being formed between the first body portion and the second body portion.

[0010] In one possible embodiment of this application, the radiator further includes a fixing member that fixes the first heat dissipation component and the second heat dissipation component; a clearance groove is provided on the first mounting part, the fixing member passes through the first heat dissipation component and connects to the second heat dissipation component, and a portion of the fixing member is located in the clearance groove.

[0011] In one possible embodiment of this application, the first heat dissipation assembly further includes a first heat dissipation plate and a first cover plate, the first heat dissipation plate and the first cover plate forming a first flow channel, a first liquid inlet penetrating the first heat dissipation plate and the first cover plate, and a first liquid outlet penetrating the first heat dissipation plate and the first cover plate; the second heat dissipation assembly further includes a second heat dissipation plate and a second cover plate, the second heat dissipation plate and the second cover plate forming a second flow channel, the second liquid inlet penetrating the second heat dissipation plate and communicating with the first liquid inlet, and the second liquid outlet penetrating the second heat dissipation plate and communicating with the first liquid outlet.

[0012] In one possible embodiment of this application, the heat sink further includes a plurality of heat-conducting plates located on the surfaces of the first heat dissipation component and the second heat dissipation component.

[0013] A terminal device includes a radiator, an inlet pipe, an outlet pipe, a working element, and a working fluid. The inlet pipe is connected to an inlet connector; the outlet pipe is connected to an outlet connector; the working element is located between a first heat dissipation assembly and a second heat dissipation assembly, or between two adjacent first heat dissipation assemblies; the working fluid is used to enter from the inlet pipe, pass through the radiator, and exit from the outlet pipe.

[0014] The heat sink provided in this application embodiment can adjust the number of the first heat dissipation components according to the number of working components that need to be dissipated. That is, the structure of the heat sink is flexible and can meet the needs of different usage scenarios, and can improve the space utilization of the heat sink. The interior of the heat sink is a hollow structure, which can absorb the heat generated by the working components through the flow of working fluid, thereby playing a role in rapid heat dissipation and improving the heat dissipation efficiency of the heat sink. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the terminal device provided in the embodiments of this application.

[0016] Figure 2 for Figure 1 A schematic diagram of the heat sink structure.

[0017] Figure 3 for Figure 2 The diagram shows a cross-sectional view of the heat sink along the AA direction.

[0018] Figure 4 for Figure 2 The diagram shows a cross-sectional view of the heat sink along the BB direction.

[0019] Figure 5 For working fluid in Figure 2 A schematic diagram of the flow in the radiator shown.

[0020] Figure 6 for Figure 2 The exploded view of the heat sink with the heat-conducting fins omitted is shown.

[0021] Figure 7 for Figure 2 The exploded view of the heat sink with the heat-conducting fins omitted is shown.

[0022] Explanation of main component symbols Terminal device: 200; Inlet pipe: 210; Outlet pipe: 220; Working element: 230; Working fluid: 240; Radiator: 100; First heat dissipation assembly: 10; First body part: 11; First mounting part: 12; Clearance groove: 121; First flow channel: 13; First inlet hole: 14; First outlet hole: 15; First heat dissipation plate: 16; First receiving groove: 161; Second receiving groove: 162; First cover plate: 17; First protrusion: 171; Second protrusion: 172; Second heat dissipation assembly: 20; Second Body: 21; Second mounting part: 22; Second flow channel: 23; Second liquid inlet: 24; Second liquid outlet: 25; Second heat dissipation plate: 26; First groove: 261; Second groove: 262; Second cover plate: 27; Installation space: 30; Liquid inlet connector: 40; First connecting part: 41; First protrusion: 42; Third protrusion: 43; Liquid outlet connector: 50; Second connecting part: 51; Second protrusion: 52; Fourth protrusion: 53; Heat-conducting plate: 60; First sealing element: 71; Second sealing element: 72; Fixing element: 80. Detailed Implementation

[0023] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this application; the described embodiments are merely some, not all, of the embodiments described in this application.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.

[0025] In the various embodiments of this application, for ease of description and not limitation, the term "connection" used in the patent application specification and claims is not limited to physical or mechanical connections, whether direct or indirect. Terms such as "upper," "lower," "above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.

[0026] Please see Figure 1 , Figure 1This is a schematic diagram of the structure of the terminal device 200 provided in the embodiments of this application. The terminal device 200 may include a heat sink 100, an inlet pipe 210, an outlet pipe 220, and a working element 230. The working element 230 is connected to the heat sink 100, and both the inlet pipe 210 and the outlet pipe 220 are connected to the heat sink 100.

[0027] During operation, the working element 230 generates heat. Working fluid 240 is injected into the radiator 100 through the inlet pipe 210. The working fluid 240 enters the radiator 100 from the inlet pipe 210, passes through the radiator 100, and exits through the outlet pipe 220. During its flow, the working fluid 240 rapidly dissipates the heat generated by the working element 230, maintaining the working environment of the working element 230 within a suitable temperature range.

[0028] The working element 230 can be a memory module, chip, etc.; the working fluid 240 can be water.

[0029] Please see Figure 2 , Figure 2 for Figure 1 A schematic diagram of the structure of the radiator 100 is shown below. The radiator 100 may include at least one first heat dissipation component 10, a second heat dissipation component 20, a liquid inlet connector 40, and a liquid outlet connector 50. The number of first heat dissipation components 10 may be one or more, and the number of first heat dissipation components 10 may be increased or decreased as needed. In this embodiment, there are four first heat dissipation components 10, which are stacked with the second heat dissipation component 20. The liquid inlet connector 40 and the liquid outlet connector 50 are both connected to the outermost first heat dissipation component 10. The liquid inlet connector 40 is used to connect to the liquid inlet pipe 210, and the liquid outlet connector 50 is used to connect to the liquid outlet pipe 220.

[0030] Each first heat dissipation assembly 10 includes a first body portion 11 and a first mounting portion 12, which are fixedly connected. The first mounting portion 12 is located on the side of the first body portion 11 facing away from the second heat dissipation assembly 20. The second heat dissipation assembly 20 includes a second body portion 21 and a second mounting portion 22, which is located between the first body portion 11 and the second body portion 21, forming a mounting space 30 between them. When there are multiple first heat dissipation assemblies 10, two adjacent first body portions 11 also form a mounting space 30. A working element 230 is located in the mounting space 30 and is connected to the first body portion 11 and / or the second body portion 21 to transfer heat to the first heat dissipation assembly 10 and / or the second heat dissipation assembly 20.

[0031] In some embodiments, the heat sink 100 may further include a plurality of heat-conducting plates 60, which are located in the mounting space 30 and on the surfaces of the first heat dissipation assembly 10 and the second heat dissipation assembly 20, i.e., the heat-conducting plates 60 are located on opposite surfaces of the working element 230. The heat-conducting plates 60 are used to connect the first heat dissipation assembly 10 and the working element 230 or to connect the second heat dissipation assembly 20 and the working element 230. The heat-conducting plates 60 are used to quickly transfer the heat generated by the working element 230 to the first heat dissipation assembly 10 and the second heat dissipation assembly 20, thereby enabling the heat sink 100 to quickly dissipate the heat.

[0032] Please see Figure 3 and Figure 4 , Figure 3 for Figure 2 The diagram shows a cross-sectional view of the radiator 100 along the AA direction. Figure 4 for Figure 2 The diagram shows a cross-sectional view of the radiator 100 along the BB direction. Each first heat dissipation component 10 may include a first flow channel 13, a first liquid inlet 14, and a first liquid outlet 15. The first flow channel 13 connects the first liquid inlet 14 and the first liquid outlet 15. Both the first liquid inlet 14 and the first liquid outlet 15 penetrate the first heat dissipation component 10.

[0033] The first heat dissipation assembly 10 further includes a first heat dissipation plate 16 and a first cover plate 17, which are fixedly connected and form a first flow channel 13. A first liquid inlet 14 penetrates the first heat dissipation plate 16 and the first cover plate 17, and a first liquid outlet 15 also penetrates the first heat dissipation plate 16 and the first cover plate 17. The first flow channel 13 connects the first liquid inlet 14 and the first liquid outlet 15. The first body portion 11 includes the first heat dissipation plate 16 and the first cover plate 17 for enclosing the area forming the first flow channel 13. A heat-conducting sheet 60 is disposed on the surface of the first heat dissipation plate 16 and the first cover plate 17.

[0034] Please see Figure 5 , Figure 5 This diagram illustrates the flow of the working fluid 240 within the radiator 100. The working fluid 240, entering through the inlet pipe 210, sequentially passes through the first inlet hole 14, the first flow channel 13, and the first outlet hole 15, finally exiting through the outlet pipe 220. When the working fluid 240 passes through the first flow channel 13, it absorbs heat transferred from the heat-conducting fins 60 to the first heat sink 16 and the first cover plate 17, thereby achieving heat dissipation.

[0035] The second heat dissipation component 20 may include a second flow channel 23, a second liquid inlet 24, and a second liquid outlet 25. The second flow channel 23 is connected to the second liquid inlet 24 and the second liquid outlet 25. The second liquid inlet 24 is connected to the first liquid inlet 14, and the second liquid outlet 25 is connected to the liquid outlet.

[0036] The second heat dissipation assembly 20 may further include a second heat dissipation plate 26 and a second cover plate 27. The second heat dissipation plate 26 and the second cover plate 27 form a second flow channel 23. A second liquid inlet 24 penetrates the second heat dissipation plate 26 and communicates with a first liquid inlet 14. A second liquid outlet 25 penetrates the second heat dissipation plate 26 and communicates with a first liquid outlet 15. The second body portion 21 includes the second heat dissipation plate 26 and the second cover plate 27 for enclosing the area forming the second flow channel 23. A heat-conducting sheet 60 is disposed on the surface of the second heat dissipation plate 26.

[0037] The working fluid 240 entering through the inlet pipe 210 passes sequentially through the first inlet hole 14, the second inlet hole 24, the second flow channel 23, the second outlet hole 25, and the first outlet hole 15, and finally exits through the outlet pipe 220. When the working fluid 240 passes through the second flow channel 23, it can absorb the heat transferred from the heat-conducting fin 60 to the second heat sink 26, thereby achieving the function of heat dissipation.

[0038] Please see Figure 6 and Figure 7 , Figure 6 for Figure 2 The exploded view of the radiator 100 shown. Figure 7 for Figure 2 The exploded view of the heat sink 100 shown is provided to more clearly illustrate the structure of other components. Figure 6 and Figure 7 The heat-conducting plate 60 is omitted in all cases. Each first heat sink 16 has a first receiving groove 161 and a second receiving groove 162. The first receiving groove 161 is connected to the first liquid inlet 14, and the second receiving groove 162 is connected to the first liquid outlet 15. The liquid inlet connector 40 includes a first connecting portion 41 and a first protrusion 42. The first protrusion 42 surrounds the first connecting portion 41, and a portion of the first connecting portion 41 is received in the first receiving groove 161 of one of the first heat sink components 10. The first protrusion 42 abuts against the first heat sink component 10. The liquid outlet connector 50 includes a second connecting portion 51 and a second protrusion 52. The second protrusion 52 surrounds the second connecting portion 51, and a portion of the second connecting portion 51 is received in the second receiving groove 162 of one of the first heat sink components 10. The second protrusion 52 abuts against the first heat sink component 10. The liquid inlet connector 40 and the liquid outlet connector 50 are connected to the same first heat sink component 10.

[0039] The liquid inlet connector 40 also includes at least one third protrusion 43, which surrounds the first connecting portion 41 and is located on the side of the first protrusion 42 opposite to the first heat dissipation assembly 10. In this embodiment, there are two third protrusions 43. The liquid inlet pipe 210 is sleeved on the side of the first connecting portion 41 opposite to the first heat dissipation assembly 10, and the third protrusion 43 is used to increase the diameter of the liquid inlet pipe 210 so that the liquid inlet pipe 210 and the liquid inlet connector 40 can be tightly connected.

[0040] The liquid outlet connector 50 also includes at least one fourth protrusion 53, which surrounds the second connecting portion 51 and is located on the side of the second protrusion 52 opposite to the first heat dissipation assembly 10. In this embodiment, there are two fourth protrusions 53. The liquid outlet pipe 220 is sleeved on the side of the second connecting portion 51 opposite to the first heat dissipation assembly 10, and the fourth protrusion 53 is used to increase the diameter of the liquid outlet pipe 220 so that the liquid outlet pipe 220 and the liquid outlet connector 50 can be tightly connected.

[0041] The first heat dissipation component 10 further includes a first protrusion 171 and a second protrusion 172, with a first liquid inlet 14 penetrating the first protrusion 171 and a first liquid outlet 15 penetrating the second protrusion 172; the second heat dissipation component 20 further includes a first groove 261 and a second groove 262, with a second liquid inlet 24 communicating with the first groove 261 and a second liquid outlet 25 communicating with the second groove 262; the first protrusion 171 is received in the first groove 261 and the second protrusion 172 is received in the second groove 262, which facilitates the assembly of the liquid inlet connector 40 and the first heat dissipation component 10 and the liquid outlet connector 50 and the first heat dissipation component 10, and further facilitates the welding of the first heat dissipation component 10 and the liquid inlet connector 40 and the liquid outlet connector 50, and the welding method may include friction welding, diffusion welding, etc.

[0042] In this embodiment, the first protrusion 171 and the second protrusion 172 are both part of the first cover plate 17, and the first groove 261 and the second groove 262 are both formed on the surface of the second heat sink 26 facing the first heat sink assembly 10 and on the second mounting portion 22. When assembling the first heat sink assembly 10 and the second heat sink assembly 20, the first protrusion 171 is placed in the first groove 261 and the second protrusion 172 is placed in the second groove 262, which facilitates the assembly of the first heat sink assembly 10 and the second heat sink assembly 20; in addition, the first protrusion 171 is received in the first groove 261 and the second protrusion 172 is received in the second groove 262, which facilitates the alignment of the first liquid inlet hole 14 and the second liquid inlet hole 24, and the alignment of the first liquid outlet hole 15 and the second liquid outlet hole 25.

[0043] The first receiving groove 161 and the second receiving groove 162 are both formed on the surface of the first heat sink 16 and on the first mounting portion 12. The first liquid inlet 14 communicates with the first receiving groove 161, and the first liquid outlet 15 communicates with the second receiving groove 162. When multiple first heat sink components 10 are assembled together, the first protrusion 171 is received in the first receiving groove 161, and the second protrusion 172 is received in the second receiving groove 162, which facilitates the assembly of two adjacent first heat sink components 10.

[0044] The radiator 100 may further include a first seal 71 and a second seal 72. The first seal 71 is located in a first groove 261, and the second seal 72 is located in a second groove 262. The first seal 71 and the second seal 72 are used to fill the gap between the first cover plate 17 of the first heat dissipation assembly 10 and the second heat dissipation plate 26 of the second heat dissipation assembly 20 to prevent liquid or air leakage. The first seal 71 and the second seal 72 can be made of EPDM, nitrile rubber, etc., and have good heat resistance, wear resistance, oil resistance, and adhesion. It is understood that a seal can also be provided between two adjacent first heat dissipation assemblies 10.

[0045] The radiator 100 also includes a plurality of fasteners 80, which are used to fix adjacent first heat dissipation components 10 and second heat dissipation components 20, so as to realize the detachable connection of the first heat dissipation components 10 and the second heat dissipation components 20; the fasteners 80 are also used to fix two adjacent first heat dissipation components 10, so as to realize the detachable connection of the adjacent first heat dissipation components 10, so as to adjust the number of first heat dissipation components 10.

[0046] The first mounting section 12 is provided with a clearance groove 121 (see reference). Figure 3 When the fixing member 80 fixes adjacent first heat dissipation components 10 and second heat dissipation components 20, the fixing member 80 passes through the first heat dissipation component 10 and connects to the second heat dissipation component 20, and a portion of the fixing member 80 is located in the clearance groove 121. When the fixing member 80 fixes two adjacent first heat dissipation components 10, the fixing member 80 passes through one of the first heat dissipation components 10 and connects to the other first heat dissipation component 10, and a portion of the fixing member 80 is located in the clearance groove 121. The clearance groove 121 can reduce the installation thickness of the heat sink 100.

[0047] The heat sink 100 provided in this application embodiment can adjust the number of the first heat dissipation components 10 according to the number of working elements 230 that need to be dissipated. That is, the structure of the heat sink 100 is flexible, which can meet the needs of different usage scenarios and improve the space utilization of the heat sink 100. The interior of the heat sink 100 is a hollow structure, which can absorb the heat generated by the working elements 230 through the flow of the working fluid 240, thereby playing a role in rapid heat dissipation and improving the heat dissipation efficiency of the heat sink 100.

[0048] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A radiator, characterized in that, include: At least one first heat dissipation component, the first heat dissipation component includes a first flow channel, a first liquid inlet and a first liquid outlet, the first flow channel connects the first liquid inlet and the first liquid outlet, and the first liquid inlet and the first liquid outlet both penetrate the first heat dissipation component; The second heat dissipation component is detachably connected to the first heat dissipation component. The second heat dissipation component includes a second flow channel, a second liquid inlet, and a second liquid outlet. The second flow channel connects the second liquid inlet and the second liquid outlet. The second liquid inlet connects to the first liquid inlet, and the second liquid outlet connects to the liquid outlet. Liquid inlet connector, connected to the first liquid inlet hole; as well as The liquid outlet connector connects to the first liquid outlet hole.

2. The radiator according to claim 1, characterized in that, The first heat dissipation component has a first receiving groove and a second receiving groove, the first receiving groove is connected to the first liquid inlet hole, and the second receiving groove is connected to the first liquid outlet hole; The liquid inlet connector includes a first connecting portion and a first protrusion, the first protrusion surrounds the first connecting portion, a portion of the first connecting portion is received in the first receiving groove of one of the first heat dissipation components, and the first protrusion abuts against the first heat dissipation component. The liquid outlet connector includes a second connecting portion and a second protrusion, the second protrusion surrounding the second connecting portion, a portion of the second connecting portion being received in the second receiving groove of one of the first heat dissipation components, and the second protrusion abutting against the first heat dissipation component.

3. The radiator according to claim 2, characterized in that, The liquid inlet connector further includes at least one third protrusion, which surrounds the first connecting portion and is located on the side of the first protrusion away from the first heat dissipation component; The liquid outlet connector further includes at least one fourth protrusion, which surrounds the second connecting portion and is located on the side of the second protrusion away from the first heat dissipation component.

4. The radiator according to any one of claims 1-3, characterized in that, The first heat dissipation component includes a first protrusion and a second protrusion, the first liquid inlet hole penetrates the first protrusion, and the first liquid outlet hole penetrates the second protrusion; The second heat dissipation component includes a first groove and a second groove, the second liquid inlet is connected to the first groove, and the second liquid outlet is connected to the second groove; The first protrusion is received in the first groove, and the second protrusion is received in the second groove.

5. The radiator according to claim 4, characterized in that, The radiator further includes a first seal and a second seal, the first seal being located in the first groove and the second seal being located in the second groove, the first seal and the second seal being used to fill the gap between the first heat dissipation component and the second heat dissipation component.

6. The radiator according to claim 1, characterized in that, The first heat dissipation component further includes a first body portion and a first mounting portion, the first mounting portion being located on the side of the first body portion away from the second heat dissipation component; the second heat dissipation component further includes a second body portion and a second mounting portion, the second mounting portion being located between the first body portion and the second body portion, and an installation space being formed between the first body portion and the second body portion.

7. The radiator according to claim 6, characterized in that, The radiator also includes a fixing member, which fixes the first heat dissipation component and the second heat dissipation component; The first mounting part has a clearance groove, the fixing member passes through the first heat dissipation component and connects to the second heat dissipation component, and part of the fixing member is located in the clearance groove.

8. The radiator according to claim 1, characterized in that, The first heat dissipation component further includes a first heat dissipation plate and a first cover plate, the first heat dissipation plate and the first cover plate forming the first flow channel, the first liquid inlet hole penetrating the first heat dissipation plate and the first cover plate, and the first liquid outlet hole penetrating the first heat dissipation plate and the first cover plate. The second heat dissipation component further includes a second heat dissipation plate and a second cover plate. The second heat dissipation plate and the second cover plate surround the second flow channel. The second liquid inlet hole penetrates the second heat dissipation plate and is connected to the first liquid inlet hole. The second liquid outlet hole penetrates the second heat dissipation plate and is connected to the first liquid outlet hole.

9. The radiator according to claim 1, characterized in that, The heat sink also includes a plurality of heat-conducting plates, which are located on the surfaces of the first heat dissipation component and the second heat dissipation component.

10. A terminal device, characterized in that, include: The heat sink according to any one of claims 1 to 9; The inlet pipe is connected to the inlet connector; The liquid outlet pipe is connected to the liquid outlet connector; The working element is located between the first heat dissipation component and the second heat dissipation component, or between two adjacent first heat dissipation components; as well as Working fluid is used to enter from the inlet pipe, pass through the radiator, and exit from the outlet pipe.

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