Liquid-cooled heat sink with fluidic flushing and electronic device

Abstract

The present application relates to the technical field of computer, especially server, and more particularly to a kind of liquid cooling radiator of jet scouring and electronic equipment.The liquid cooling radiator of jet scouring includes jet module and heat dissipation module;Jet module has jet pipe, and heat dissipation module has heat dissipation groove, jet pipe is inserted into heat dissipation groove, jet pipe is used to inject cooling liquid into heat dissipation groove, and cooling liquid in heat dissipation groove can be discharged to heat dissipation groove outside.Electronic equipment includes the above-mentioned liquid cooling radiator of jet scouring.The liquid cooling radiator of jet scouring and electronic equipment provided by the present application can reduce volume while ensuring cooling capacity, and the overall energy consumption of system is low, and noise is small.

Description

Technical Field

[0001] This invention relates to the field of computer technology, particularly server technology, and more specifically, to a jet-fluid-type liquid cooling radiator and electronic device. Background Technology

[0002] High-power chips are characterized by high instantaneous power and long continuous heat generation time. Currently, air-cooled heat sinks and cold plate heat sinks are mainly used to dissipate heat from high-power chips.

[0003] Air-cooled heat sinks use fans and heat sink fins to transfer heat from high-power chips to the air. To ensure efficient heat dissipation for high-power chips, the heat sink fins are typically large in area and the fan speed is high, resulting in excessive device size, fan power, and noise. Cold plate heat sinks use liquid circulation to transfer heat from the chip to a cold plate, which is then cooled by a fan. Again, to ensure efficient heat dissipation for high-power chips, the cold plate is typically large in area and the fan speed is high, resulting in excessive device size, fan power, and noise. Summary of the Invention

[0004] The purpose of this invention is to provide a jet-fluid-type liquid cooling heat sink and electronic device to improve the technical problems of excessive size and noise in heat sinks used for cooling high-power chips in the prior art.

[0005] The jet-flushing liquid-cooled heat sink provided by the present invention includes a jet module and a heat dissipation module.

[0006] The jet module has a jet pipe, the heat dissipation module has a heat dissipation groove, the jet pipe is inserted into the heat dissipation groove, the jet pipe is used to inject coolant into the heat dissipation groove, and the coolant in the heat dissipation groove can be discharged to the outside of the heat dissipation groove.

[0007] Preferably, as one possible implementation, there are multiple heat dissipation slots and multiple jet pipes, the jet module is arranged opposite to the heat dissipation module, and the multiple heat dissipation slots are arranged in a honeycomb pattern on the side of the heat dissipation module facing the jet module; And / or, the inner side of the heat dissipation groove wall is provided with heat dissipation fins.

[0008] Preferably, as one possible implementation, the jet module has a liquid inlet chamber, the liquid inlet chamber has a liquid inlet for injecting coolant into the liquid inlet chamber, and the plurality of jet pipes are all connected to the liquid inlet chamber.

[0009] Preferably, as one possible implementation, the spacing between the plurality of jet tubes is in the range of 6~8mm; And / or, the inner diameter of the jet tube is in the range of 1.5~3mm.

[0010] Preferably, as one possible implementation, the outlet of the jet pipe faces and is close to the bottom of the heat dissipation tank, a first gap exists between the outlet of the jet pipe and the bottom of the tank, and a second gap exists between the outer wall of the jet pipe and the wall of the heat dissipation tank; the coolant in the heat dissipation tank can flow from the bottom of the tank to the opening and be discharged from the opening.

[0011] Preferably, as one possible implementation, the jet pipe is conical with the liquid outlet located at the small end, the axial direction of the jet pipe is consistent with the depth direction of the heat dissipation groove, and the angle between the pipe wall and the axial direction of the jet pipe is in the range of 3~5°. And / or, the width of the first gap is in the range of 2~5mm; and / or, the width of the second gap is in the range of 2~5mm.

[0012] Preferably, as one possible implementation, the heat dissipation module has a heat dissipation body, and the heat dissipation groove is formed in the heat dissipation body; the jet module has a jet body, and the jet pipe protrudes from the side of the jet body facing the heat dissipation body; there is a third gap between the heat dissipation body and the jet body, and the periphery of the third gap is open, so that the coolant in the heat dissipation groove can be discharged from the groove opening to the third gap.

[0013] Preferably, as one possible implementation, the jet module has a drain channel, one end of which leads to the third gap, and the other end of which passes through the side of the jet body opposite to the heat dissipation body.

[0014] Preferably, as one possible implementation, the drain channel extends along the depth direction of the heat dissipation groove; And / or, there are multiple drainage channels, and the multiple drainage channels are distributed in a dispersed manner.

[0015] The electronic device provided by the present invention includes a chip and a jet-fluid-type liquid cooler as described in any of the above claims, wherein the heat dissipation module is disposed opposite to the chip.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: During operation, the heat dissipation module absorbs heat from the heat-generating device, and the jet pipe injects low-temperature coolant into the heat dissipation tank of the heat dissipation module. The coolant in the heat dissipation tank absorbs the heat in the heat dissipation module and heats up. The heated coolant can then be discharged outside the heat dissipation tank, carrying away the heat. Thus, the heat dissipation module can be cooled and dissipated, thereby cooling and dissipating the heat-generating device.

[0017] It should be noted that the presence of the heat sink increases the contact area between the coolant and the heat dissipation module, improving cooling efficiency and reducing volume while maintaining cooling capacity. Simultaneously, inserting the jet pipe into the heat sink allows the low-temperature coolant to be directly delivered to the interior of the heat dissipation module (heat sink), reducing coolant splashing loss and maximizing the utilization of the low-temperature coolant. This minimizes unnecessary cooling losses and further improves cooling efficiency, thereby reducing overall system energy consumption while achieving high-intensity flushing heat dissipation. Furthermore, eliminating the need for a cooling fan allows for quiet operation, reducing noise and further lowering power consumption and size. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a jet-fluid-type liquid-cooled radiator provided in an embodiment of the present invention; Figure 2 This is a partial cross-sectional view of the jet-fluid-type liquid-cooled heat sink provided in an embodiment of the present invention; Figure 3 A cross-sectional view and a partial enlarged view of the jet-fluid-type liquid-cooled heat sink provided in an embodiment of the present invention; Figure 4 This is a partial cross-sectional view and a magnified view of the heat dissipation module provided in an embodiment of the present invention.

[0020] Explanation of reference numerals in the attached figures: 100 - Jet module; 110 - Jet tube; 120 - Liquid inlet chamber; 121 - Liquid inlet; 130 - Drainage channel; 200 - Heat dissipation module; 210 - Heat dissipation slot; 220 - Heat dissipation fins. Detailed Implementation

[0021] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings.

[0023] See Figures 1-4 An embodiment of the present invention provides a jet-fluid-type liquid-cooled radiator, which includes a jet module 100 and a heat dissipation module 200; the jet module 100 has a jet pipe 110, and the heat dissipation module 200 has a heat dissipation groove 210. The jet pipe 110 is inserted into the heat dissipation groove 210, and the jet pipe 110 is used to inject coolant into the heat dissipation groove 210, and the coolant in the heat dissipation groove 210 can be discharged to the outside of the heat dissipation groove 210.

[0024] During operation, the heat dissipation module 200 can absorb heat from the heat-generating device. The jet pipe 110 can inject low-temperature coolant into the heat dissipation tank 210 of the heat dissipation module 200. The coolant entering the heat dissipation tank 210 absorbs the heat in the heat dissipation module 200 and then heats up. The heated coolant can be discharged to the outside of the heat dissipation tank 210, carrying away the heat. Thus, the heat dissipation module 200 can be cooled and dissipated, thereby cooling and dissipating the heat-generating device.

[0025] It should be noted that the presence of the heat sink 210 increases the contact area between the coolant and the heat dissipation module 200, improving cooling efficiency and reducing volume while ensuring cooling capacity. Simultaneously, inserting the jet pipe 110 into the heat sink 210 allows the low-temperature coolant to be directly delivered to the interior of the heat dissipation module 200 (heat sink 210), reducing coolant splashing loss and maximizing the utilization of the low-temperature coolant. This minimizes unnecessary cooling losses and further improves cooling efficiency, thereby reducing overall system energy consumption while achieving high-intensity flushing heat dissipation. Furthermore, the elimination of the cooling fan allows for quiet operation, reducing noise and further lowering power consumption and size.

[0026] The jet-fluid liquid cooling radiator provided in this embodiment is particularly useful for dissipating heat from the core heat sources of electronic devices. For example, the heat dissipation module 200 can be positioned opposite to a medium- to high-power chip in the electronic device to provide localized, high-intensity cooling and suppress localized hot spots.

[0027] Specifically, multiple heat sinks 210 and jet pipes 110 can be provided to achieve liquid cooling heat dissipation in different areas of the heat dissipation module 200.

[0028] Preferably, multiple heat dissipation slots 210 are arranged in a one-to-one correspondence with multiple jet pipes 110 to achieve the best heat dissipation effect.

[0029] The jet module 100 and the heat dissipation module 200 are positioned opposite each other, and multiple heat dissipation slots 210 are arranged in a honeycomb pattern on the side of the heat dissipation module 200 facing the jet module 100 (e.g., Figure 4As shown, by simply moving the jet module 100 to a position where each jet tube 110 is directly opposite the corresponding heat sink 210, and then moving the jet module 100 toward the heat sink 200, each jet tube 110 can be inserted into the corresponding heat sink 210, thus achieving the cooperation between the jet module 100 and the heat sink 200, which is very convenient.

[0030] It should be noted that due to the right-angle structure, quadrilaterals have fixed right-angle gaps when densely laid out, resulting in a maximum space utilization rate of approximately 78%–85%. The arc-shaped gaps formed by tangent dense laying of circular fins are even larger, with a maximum space utilization rate of only 60%–70%. This embodiment uses a honeycomb-shaped heat dissipation channel 210 (similar to honeycomb fins) with a regular hexagonal cross-section. The regular hexagonal shape provides seamless dense laying, allowing the heat dissipation channel 210 to fill the entire heat dissipation area without gaps. Compared to quadrilateral and circular heat dissipation channels, the effective contact area between the honeycomb heat dissipation channel and the coolant is increased by 18%–22%, corresponding to a 15%–20% improvement in heat dissipation coefficient compared to quadrilateral channels and a 25%–30% improvement compared to circular channels. This achieves optimal heat dissipation area allocation and results in excellent convective heat transfer efficiency. In addition, the flow channels formed by the honeycomb-shaped heat dissipation grooves 210 can reduce the turbulence intensity of the coolant by 30% to 40% and control the flow velocity fluctuation within ±5%, thereby ensuring the controllability of the coolant flow and maintaining the stability of the flow state.

[0031] Preferably, see Figure 3 and Figure 4 Heat dissipation fins 220 can be provided on the inner side of the heat dissipation slot 210. The heat dissipation fins 220 can further increase the heat dissipation area of ​​the heat dissipation module 200, thereby further improving the heat exchange efficiency.

[0032] Furthermore, the heat dissipation fins 220 can be set to be parallel to the depth direction of the heat dissipation groove 210. In this way, the heat dissipation fins 220 can guide the coolant at the bottom of the groove to the groove opening, which can reduce the occurrence of turbulence.

[0033] Specifically, two heat dissipation fins 220 can be provided on each wall of the heat dissipation slot 210, which can improve the turbulence suppression rate by about 30% compared to providing one heat dissipation fin 220 on each wall of the heat dissipation slot 210.

[0034] See Figure 2 and Figure 3In the specific structure of the jet module 100, an inlet chamber 120 can be provided, and an inlet port 121 is opened on the inlet chamber 120 to inject coolant into the inlet chamber 120 through the inlet port 121; multiple jet pipes 110 are all connected to the inlet chamber 120 so that the coolant in the inlet chamber 120 can enter each jet pipe 110 respectively. It should be noted that the inlet chamber 120 can realize the diversion of coolant, saving pipes and simplifying the structure.

[0035] Specifically, the distribution spacing of the jet pipes 110 can be set to 6~8mm. Within this range, a reasonable distribution of coolant flow can be achieved.

[0036] The inner diameter of the jet pipe 110 can also be set to a range of 1.5~3mm, within which a reasonable distribution of coolant flow can be achieved.

[0037] Preferably, see continue to see Figure 2 and Figure 3 The outlet of the jet pipe 110 can be set to face and be close to the bottom of the heat dissipation tank 210. A first gap is set between the outlet of the jet pipe 110 and the bottom of the heat dissipation tank 210, and a second gap is set between the outer wall of the jet pipe 110 and the wall of the heat dissipation tank 210. This allows the coolant in the heat dissipation tank 210 to flow from the bottom to the opening and be discharged from the opening. As a result, the coolant entering the heat dissipation tank 210 can fully contact the bottom and wall of the heat dissipation tank 210, thereby improving the heat exchange efficiency.

[0038] Preferably, see Figure 3 The inner wall of the jet pipe 110 is made into a conical shape, and its outlet is located at the small end. The angle α between the pipe wall of the jet pipe 110 and the axial direction (hereinafter referred to as the outlet angle) is set to a range of 3~5°. In this way, oblique outflow can be achieved, which helps to reduce turbulence around the outlet of the jet pipe 110 and improve the problem of coolant splashing and loss.

[0039] In fact, the inner diameter, outlet angle α, and distribution spacing of the jet tube 110 are interconnected and optimized. The inlet flow rate of the jet module 100 can be determined first based on the rated power of the heat-generating device and the peak temperature during normal operation. Under this flow rate, the inner diameter and distribution spacing of the jet tube 110 are designed to reasonably disperse the flow rate. The outlet angle of the jet tube 110 is also designed to reduce turbulence around the outlet of the jet tube 110. This minimizes turbulence inside the heat sink 210, allowing the coolant to be accurately delivered to the corresponding area of ​​the heat sink 200 in a directional and uniform flow pattern, ensuring the heat dissipation effect.

[0040] Specifically, the width of the first gap can be set to 2~5mm, and the width of the second gap can also be set to 2~5mm. In this way, the coolant in the heat dissipation tank 210 can obtain a moderate flow rate, which can form an effective flow channel without easily forming turbulence. The heat exchange time is moderate, and the coolant splash loss rate can be controlled within 5%, thereby ensuring heat dissipation efficiency.

[0041] Preferably, the outer wall of the jet pipe 110 can be made into a conical shape, and the outer diameter of the jet pipe 110 can be made to gradually increase from the outlet end to the other end. At the same time, the wall of the heat dissipation groove 210 can be made to gradually slope towards the center from the outside to the inside. In this way, a conical flow channel can be formed between the wall of the heat dissipation groove 210 and the outer wall of the jet pipe 110, and the small end of the conical flow channel is located at the bottom of the heat dissipation groove 210. This can further reduce turbulence, so that the coolant can be accurately delivered to the corresponding area of ​​the heat dissipation module 200 in a directional and uniform flow state, and the splash loss rate of coolant can be reduced, thus ensuring the heat dissipation effect.

[0042] In this embodiment, the heat dissipation module 200 has a heat dissipation body, and a heat dissipation groove 210 is formed in the heat dissipation body; the jet module 100 has a jet body, and a jet pipe 110 protrudes from the side of the jet body facing the heat dissipation body. Furthermore, a third gap is formed between the heat dissipation body and the jet body, with an open periphery to allow coolant in the heat dissipation groove 210 to drain from the groove opening into the third gap and flow along the third gap to its periphery, overflowing from the open periphery. In reality, the heat dissipation module 200 and the jet module 100 are two independent structures, fixed only locally (e.g., at corner positions) by connecting posts.

[0043] See Figure 2 and Figure 3 Furthermore, a drain channel 130 can be provided on the jet module 100, with one end of the drain channel 130 leading to the third gap and the other end penetrating the side of the jet body opposite to the heat dissipation body. In this way, the coolant in the heat dissipation tank 210 can flow into the drain channel 130 through the third gap after being discharged from the tank opening, and then be discharged to the side of the jet body opposite to the heat dissipation body through the drain channel 130.

[0044] In other words, the coolant discharged from the heat sink 210 can be discharged in two separate streams, which increases the discharge speed of the coolant after heat absorption and helps to improve the heat dissipation effect.

[0045] Preferably, the drain channel 130 can be extended along the depth direction of the heat sink 210, which can reduce the flow resistance of the coolant discharged through the drain channel 130 and ensure the discharge speed of the coolant.

[0046] Furthermore, multiple drainage channels 130 can be configured and distributed to allow the coolant discharged from the heat sinks 210 in different areas of the heat dissipation module 200 to be discharged through adjacent drainage channels 130.

[0047] In fact, the jet-fluid type liquid cooler provided in this embodiment is immersed in coolant during use.

[0048] An embodiment of the present invention also provides an electronic device, which includes a chip and a jet-fluid-type liquid cooling heat sink, wherein a heat dissipation module 200 is disposed opposite to the chip.

[0049] The electronic device provided in this embodiment includes the jet-fluid-type liquid cooling heat sink in the above embodiments, and therefore has all the technical effects of the above embodiments, with excellent heat dissipation effect of the chip.

[0050] The aforementioned chip is preferably a medium-to-high power chip, such as a chip with a rated power of 300W and a normal operating temperature peak of 65℃.

[0051] The electronic device in this embodiment can be a server or other type of computer.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A jet-flushing liquid-cooled radiator, characterized in that, Includes jetting module and heat dissipation module; The jet module has a jet pipe, the heat dissipation module has a heat dissipation groove, the jet pipe is inserted into the heat dissipation groove, the jet pipe is used to inject coolant into the heat dissipation groove, and the coolant in the heat dissipation groove can be discharged to the outside of the heat dissipation groove.

2. The jet-fluid-type liquid-cooled radiator according to claim 1, characterized in that, There are multiple heat dissipation slots and multiple jet tubes. The jet module is arranged opposite to the heat dissipation module, and the multiple heat dissipation slots are arranged in a honeycomb pattern on the side of the heat dissipation module facing the jet module. And / or, the inner side of the heat dissipation groove wall is provided with heat dissipation fins.

3. The jet-flushing liquid-cooled radiator according to claim 1, characterized in that, The jet module has a liquid inlet chamber with an inlet for injecting coolant into it. Multiple jet tubes are connected to the liquid inlet chamber.

4. The jet-flushing liquid-cooled radiator according to claim 1, characterized in that, The spacing between the plurality of jet tubes ranges from 6 to 8 mm; And / or, the inner diameter of the jet tube is in the range of 1.5~3mm.

5. The jet-flushing liquid-cooled radiator according to any one of claims 1-4, characterized in that, The outlet of the jet pipe faces and is close to the bottom of the heat dissipation tank. There is a first gap between the outlet of the jet pipe and the bottom of the tank, and a second gap between the outer wall of the jet pipe and the wall of the heat dissipation tank. The coolant in the heat dissipation tank can flow from the bottom of the tank to the opening and be discharged from the opening.

6. The jet-fluid-type liquid-cooled radiator according to claim 5, characterized in that, The jet tube is conical with the liquid outlet located at the small end. The axial direction of the jet tube is consistent with the depth direction of the heat dissipation groove. The angle between the tube wall and the axial direction of the jet tube is 3~5°. And / or, the width of the first gap is in the range of 2~5mm; and / or, the width of the second gap is in the range of 2~5mm.

7. The jet-fluid-type liquid-cooled radiator according to claim 5, characterized in that, The heat dissipation module has a heat dissipation body, and the heat dissipation groove is formed in the heat dissipation body; the jet module has a jet body, and the jet pipe protrudes from the side of the jet body facing the heat dissipation body; there is a third gap between the heat dissipation body and the jet body, and the periphery of the third gap is open, so that the coolant in the heat dissipation groove can be discharged from the groove opening to the third gap.

8. The jet-flushing liquid-cooled radiator according to claim 7, characterized in that, The jet module has a drainage channel, one end of which leads to the third gap, and the other end of which passes through the side of the jet body opposite to the heat dissipation body.

9. The jet-flushing liquid-cooled radiator according to claim 8, characterized in that, The drain channel extends along the depth direction of the heat dissipation groove; And / or, there are multiple drainage channels, and the multiple drainage channels are distributed in a dispersed manner.

10. An electronic device, characterized in that, It includes a chip and a jet-fluid-type liquid-cooled heat sink as described in any one of claims 1-9, wherein the heat dissipation module is disposed opposite to the chip.

Images