Data reading and writing device based on radio frequency identification and gene sequencer

Abstract

The application provides a data reading and writing device based on radio frequency identification and a gene sequencer, the data reading and writing device comprises a radio frequency modulation transceiving processing module, a voltage standing wave ratio adjusting module, a power matching amplification module and a transceiving antenna module. The radio frequency modulation transceiving processing module is configured to send and receive uplink and downlink radio frequency signals carrying data information, and the radio frequency signals are high-frequency analog wave signals. The voltage standing wave ratio adjusting module is connected with the radio frequency modulation transceiving processing module and is configured to adjust the voltage standing wave ratio of the uplink and downlink radio frequency signals. The power matching amplification module is connected with the voltage standing wave ratio adjusting module and is configured to perform power matching and amplification processing on the uplink and downlink radio frequency signals. The transceiving antenna module is connected with the power matching amplification module and is configured to send the uplink radio frequency signals after power matching and amplification and receive the downlink radio frequency signals sent by a target object. The signal transceiving power and the signal anti-interference capability can be improved.

Description

Technical Field

[0001] This application relates to the field of gene sequencing technology, and more specifically, to a data reading and writing device based on radio frequency identification and a gene sequencer. Background Technology

[0002] Gene sequencing systems are widely used in genomics, genetics, and disease research, helping to deepen our understanding of the genetic characteristics and evolutionary milestones of organisms. They also aid in the discovery of disease-related genetic variations, assisting in disease detection and treatment. First-generation sequencing (NGS) technology was introduced in the 1970s. With the increasing demand for low-cost, high-throughput sequencing, high-throughput sequencing methods were developed. High-throughput sequencing (HTS), also known as next-generation sequencing (NGS), is represented by polymerase chain reaction (PLR) sequencing (Solexa), pyrosequencing (Mostafa Ronaghi), and ligase chain reaction (Drmanac R-Sparks AB). Although third-generation sequencing technology has been introduced in recent years, its accuracy is still lower than that of NGS due to its immaturity. Therefore, NGS remains the most widely used technology.

[0003] In gene sequencing systems employing next-generation sequencing technology, before sequencing, a radio frequency identification (RFID) reader module is used to read information from various consumables loaded into the sequencing instrument. This information is then displayed to the user to confirm the consumables are correct. The consumables transmit information via radio waves through a specially coded coil antenna to the RFID reader module for data processing and information retrieval. However, because information is transmitted via radio waves, long transmission distances lead to significant signal attenuation, affecting information transmission quality. Furthermore, significant external interference during operation can also degrade information transmission quality. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide a data reading and writing device based on radio frequency identification, so as to at least partially solve the above-mentioned technical problems.

[0005] This application provides a data reading and writing device based on radio frequency identification (RFID) for identifying and processing data information of a target object. The data reading and writing device includes:

[0006] The radio frequency modulation transceiver processing module is configured to transmit and receive uplink and downlink radio frequency signals carrying data information, wherein the radio frequency signals are high-frequency analog wave signals. A voltage standing wave ratio (VSWR) adjustment module is connected to the radio frequency modulation and transceiver processing module and is configured to adjust the VSWR of uplink and downlink radio frequency signals. A power matching amplifier module is connected to the voltage standing wave ratio adjustment module and is configured to perform power matching and amplification processing on uplink and downlink radio frequency signals. The transceiver antenna module is connected to the power matching amplifier module and is configured to transmit uplink radio frequency signals after power matching and amplification, and to receive downlink radio frequency signals transmitted by the target object.

[0007] In one possible implementation, the radio frequency modulation transceiver processing module is provided with a signal transmission interface, an amplitude modulation receiving interface, and / or a phase modulation receiving interface; the voltage standing wave ratio (VSWR) adjustment module includes: a VSWR phase adjustment unit and / or a VSWR amplitude adjustment unit; The standing wave phase adjustment unit is connected to the signal transmitting interface and the phase modulation receiving interface, respectively, and is configured to adjust the reflection phase coefficient of the uplink and downlink radio frequency signals in order to adjust the voltage standing wave ratio of the uplink and downlink radio frequency signals. The standing wave amplitude adjustment unit is connected to the standing wave phase adjustment unit and the amplitude modulation receiving interface, respectively, and is configured to adjust the reflection attenuation amplitude of the uplink and downlink radio frequency signals in order to adjust the voltage standing wave ratio of the uplink and downlink radio frequency signals.

[0008] In one possible implementation, the voltage standing wave ratio (VSWR) adjustment module further includes: A resonant frequency adjustment unit is connected between the signal transmission interface and the standing wave phase adjustment unit, and is configured to tune the resonant frequency of the uplink and downlink radio frequency signals to match the transmission and reception signal frequency of the radio frequency modulation and transceiver processing module.

[0009] In one possible implementation, the voltage standing wave ratio (VSWR) adjustment module further includes: The subharmonic suppression unit is configured to filter out the harmonic components of the radio frequency signal.

[0010] In one possible implementation, the power matching amplifier module includes an impedance matching unit, an uplink / downlink RF follower unit, an uplink / downlink detection and control unit, and a signal amplification and processing unit; One end of the impedance matching unit is connected to the voltage standing wave ratio adjustment module, and the other end of the impedance matching unit is connected to the uplink and downlink RF follower unit. The impedance matching unit is configured to match the input and output impedances of the uplink and downlink RF signals. The uplink and downlink RF follower units are configured to improve the driving capability of the input RF signal; The uplink and downlink detection control unit is connected to the uplink and downlink radio frequency follower unit and is configured to control the transmission link of the other of the uplink and downlink radio frequency signals to be shut down when one of the uplink radio frequency signal and the downlink radio frequency signal is detected. One end of the signal amplification and processing unit is connected to the uplink and downlink RF follower unit, and the other end is connected to the transceiver antenna module. It is configured to amplify the power and perform frequency selection processing on the uplink and downlink RF signals.

[0011] In one possible implementation, the uplink and downlink radio frequency follower unit includes an uplink radio frequency follower unit and a downlink radio frequency follower unit; the uplink and downlink detection control unit includes an uplink detection control input unit and a downlink detection control output unit; The input terminal of the uplink RF follower unit is connected to the impedance matching unit, and the output terminal of the uplink RF follower unit is connected to the signal amplification and processing unit; the input terminal of the downlink RF follower unit is connected to the signal amplification and processing unit, and the output terminal of the downlink RF follower unit is connected to the impedance matching unit. The detection terminal of the uplink detection control input unit is connected to the input terminal of the uplink RF follower unit, and the control terminal of the uplink detection control input unit is connected to the output terminal of the downlink RF follower unit; the uplink detection control input unit is configured to control the output terminal of the downlink RF follower unit to turn off when it detects that the input terminal of the uplink RF follower unit receives the uplink RF signal. The detection terminal of the downlink detection control output unit is connected to the input terminal of the downlink radio frequency follower unit, and the control terminal of the downlink detection control output unit is connected to the output terminal of the uplink radio frequency follower unit. The downlink detection control output unit is configured to control the output terminal of the uplink radio frequency follower unit to turn off when it detects that the input terminal of the downlink radio frequency follower unit receives the downlink radio frequency signal.

[0012] In one possible implementation, the signal amplification processing unit includes: A DC component removal unit is connected to the uplink and downlink RF follower unit and is configured to remove the DC component of the uplink and downlink RF signals; The signal amplification unit is connected between the DC component removal unit and the transceiver antenna module, and is configured to amplify the power and perform frequency selection processing on the uplink and downlink radio frequency signals.

[0013] In one possible implementation, the signal amplification unit includes: The LC frequency selection unit, connected to the DC component removal unit, is configured to increase the energy of the target frequency band of the uplink and downlink radio frequency signals and filter out frequency signals in the uplink and downlink radio frequency signals that do not belong to the target frequency band. The target frequency band refers to the transmission or reception frequency band of the radio frequency modulation transceiver processing module.

[0014] In one possible implementation, the signal amplification unit further includes: The signal power input / output gain unit is connected to the LC frequency selection unit and is configured to perform power gain amplification processing on the received radio frequency signal to improve the transmission and reception power of the radio frequency signal.

[0015] In one possible implementation, the signal amplification unit further includes: The uplink and downlink frequency selective amplification unit is connected to the signal power input and output gain unit and is configured to perform target frequency band filtering on the uplink and downlink radio frequency signals in order to reduce the noise frequency of the uplink and downlink radio frequency signals.

[0016] This application embodiment also provides a gene sequencer, including the radio frequency identification-based data reading and writing device, sequencing consumables, processor and display described in any of the above possible embodiments, wherein the sequencing consumables are provided with radio frequency tags, and the radio frequency tags carry basic information about the sequencing consumables; The data reading and writing device is configured to read basic information about the sequencing consumables from the RFID tag and upload it to the processor after the sequencing consumables are loaded onto the gene sequencer. The processor is configured to display basic information about the sequencing consumables on the display.

[0017] In this embodiment, the data read / write device includes a radio frequency modulation transceiver processing module, a voltage standing wave ratio (VSWR) adjustment module, a power matching amplifier module, and a transceiver antenna module. The radio frequency modulation transceiver processing module modulates the data information into an analog radio frequency signal and sends it to the VSWR adjustment module. This adjusts the phase or impedance amplitude of the reflected wave to change the VSWR, thereby enabling the signal to be transmitted in the optimal power mode. The power matching amplifier module amplifies the processed radio frequency signal power, enhancing the transmission and reception distance and anti-interference capability. This not only enables the identification and processing of reagent and consumable information, but also improves the signal transmission and reception power, as well as the anti-interference capability in strong interference environments. This enhances the distance, reliability, and stability of information reading and transmission, thereby reducing the impact of poor wireless transmission and radio frequency information processing quality caused by transmission distance and strong interference environments.

[0018] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1-a A schematic block diagram of a gene sequencer provided in some embodiments of this application is shown.

[0021] Figure 1-b A schematic diagram of a sequencing chip provided in some embodiments of this application is shown.

[0022] Figure 1-c A structural framework diagram of the electronic control system in a gene sequencer provided in some embodiments of this application is shown.

[0023] Figure 2 A schematic block diagram of a data read / write device based on radio frequency identification provided in some embodiments of this application is shown.

[0024] Figure 3 A block diagram illustrating the principle of a voltage standing wave ratio (VSWR) adjustment module provided in some embodiments of this application is shown.

[0025] Figure 4 A block diagram illustrating the principle of a voltage standing wave ratio (VSWR) adjustment module provided in other embodiments of this application is shown.

[0026] Figure 5 A schematic block diagram of a power matching module provided in some embodiments of this application is shown.

[0027] Figure 6 A schematic block diagram of a power matching module provided in some other embodiments of this application is shown.

[0028] Figure 7 The circuit diagram of the voltage standing wave ratio (VSWR) adjustment module provided in some embodiments of this application is shown.

[0029] Figure 8 The diagram shows the circuit schematics of the impedance matching unit, uplink RF follower unit, and uplink detection input control unit provided in some embodiments of this application.

[0030] Figure 9The circuit schematics of the uplink DC component removal unit and the uplink LC frequency selection unit provided in some embodiments of this application are shown.

[0031] Figure 10 The circuit schematics of the signal power output gain unit and the uplink frequency selective amplifier unit provided in some embodiments of this application are shown.

[0032] Figure 11 The circuit schematics of transceiver antenna modules provided in some embodiments of this application are shown.

[0033] Figure 12 A schematic block diagram of a gene sequencer provided in some embodiments of this application is shown. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0035] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0036] In this document, the term "and / or" merely describes a relationship, indicating that three relationships can exist. For example, A and / or B can represent three cases: A alone, A and B simultaneously, and B alone. Furthermore, the term "at least one" in this document means any combination of at least two of any one or more elements. For example, including at least one of A, B, and C can mean including any one or more elements selected from the set consisting of A, B, and C.

[0037] See Figure 1-a As shown in Figure 1-a, it is a schematic diagram of the structure of a gene sequencer provided in an embodiment of this application. The sequencer includes: a sequencing chip 10, a chip platform 20, a reagent storage container 30, a liquid path system 40 (or a flow guiding system), an optical detection system 50, a computer system 60, a waste liquid storage container 70, and an electronic control system 80.

[0038] The sequencing chip 10 provides reaction regions for amplification and sequencing reactions. The chip platform 20 secures and supports the sequencing chip 10. The reagent storage container 30 stores a sample library of one or more mixed samples, and one or more reagents (including universal sequencing reagents and buffers). The reagent storage container 30 may include, for example, universal reagent kits and buffer cartridges. The liquid path system 40 controllably delivers one or more mixed sample libraries and one or more reagents from the reagent storage container 30 to the sequencing chip 10 for amplification and sequencing reactions, and controllably delivers waste liquid from the sequencing chip 10 to the waste liquid storage container 70. The optical detection system 50 excites and acquires fluorescence signals during the sequencing reaction, and generates fluorescence images based on the fluorescence signals. The computer system 60 acquires fluorescence images from the optical detection system 50 and identifies the base sequences of the sample library based on the fluorescence images. The waste liquid storage container 70 is configured to store waste liquid generated after the reaction. The electronic control system 80 is used to control the operation and function of the chip platform 20, the liquid circuit system 40 and the optical detection system 50 according to the instructions of the computer system 60.

[0039] Among them, such as Figure 1-b As shown, the sequencing chip 10 serves as a carrier for amplification and sequencing reactions, providing reaction regions, which are called channels. Typically, a sequencing chip 10 may contain one or more channels (e.g., 2, 4, 6, or 8 channels), and these channels are isolated from each other. Taking a 4-channel chip as an example, each channel 11 has a small hole 12 at each end for the flow of fluids (e.g., sample libraries, reagents) in and out.

[0040] Specifically, the sequencing chip 10 may have a sample library containing one or more mixed samples attached to it. In some possible embodiments, the sample may be derived from, for example, biological blood, cell tissue, etc. Deoxyribonucleotide (DNA) single strands or ribonucleotide (RNA) single strands can be extracted and isolated from the sample.

[0041] In other possible embodiments, the sample library may be obtained by cutting a single-stranded DNA / RNA or a single-stranded DNA / RNA into multiple fragments, and then chemically modifying the DNA or RNA fragments and adding adapters. That is, the sample library may be a gene library obtained through a library preparation process. For example, it may be a whole single-stranded DNA or a whole single-stranded RNA, wherein the double-stranded RNA may be obtained by transcription of double-stranded DNA.

[0042] The reagent storage container 30 is configured to store one or more reagents that will chemically react with the sample library. The reagents include at least reagents for sequencing reactions, and in some implementations, may also include reagents for amplification reactions. In other implementations, the reagents may also include buffer solutions for sequencing and amplification reactions.

[0043] The chip platform 20 is configured to fix and support the sequencing chip 10. Specifically, the chip platform 20 can be an XY motion platform capable of moving along the X and Y directions respectively, thereby enabling the optical detection system 50 to perform optical detection on different regions of the sequencing chip 10.

[0044] According to functional division, the electronic control system 80 may specifically include a central control module (or central control board), a control module that realizes multiple control functions, and multiple sensors that can collect information reflecting various operating states of the instrument.

[0045] The central control module acts as the hub connecting the host computer (e.g., computer system 60) and each control module. It receives control commands from the host computer via a communication interface (e.g., RS232 interface), parses, verifies, and re-encodes the commands before issuing them to the corresponding control modules. This enables unified and orderly control of all control modules, allowing them to cooperate smoothly and efficiently to achieve the goal of gene sequencing. The electrical control system structure is as follows: Figure 1-c As shown, the electronic control system may include, but is not limited to: a temperature control module, a chip platform motion control module, an optical detection system motion control module, a storage container motion control module, a liquid circuit system control module, a light source control module, and a consumable information reading control module.

[0046] The temperature control module can control the heating and cooling devices to provide suitable reaction temperatures and conditions for the amplification and sequencing reactions occurring within the sequencing chip 10. For example, the heating device could be a TEC (thermal energy storage) module, and the cooling device could be a fan. Furthermore, to achieve better temperature control, the temperature control module can also implement closed-loop control based on the temperature collected by the temperature sensor.

[0047] The chip platform motion control module and the optical detection system motion control module work together to achieve relative movement between chip 10 and optical detection system 50, completing the acquisition of fluorescence images of various reaction regions in chip 10. Taking the movement of chip platform 20 in a two-dimensional plane as an example, the chip platform motion control module can control the driver to drive the X-axis motor and Y-axis motor respectively, thereby moving chip platform 20 in the X and Y directions (the X and Y directions are perpendicular to each other on the horizontal plane), so that optical detection system 50 can perform optical detection on different regions of sequencing chip 10. In addition, during the image acquisition process, in order to acquire the best quality fluorescence image, it is also necessary to focus the imaging component in optical detection system 50. The optical detection system motion control module can control the driver to drive the motor to move the objective lens in the imaging component in the Z direction (the Z direction is perpendicular to the horizontal plane formed by the X and Y directions), so that the objective lens reaches the optimal focal plane and finally obtains the best fluorescence image.

[0048] Typically, the reagent storage container 30 (e.g., including universal reagent kits and buffer solutions) has a sealing film on its surface to facilitate the preservation and transportation of the internal universal reagents and buffer solutions. After the reagent storage container 30 is loaded into the gene sequencer, the sealing film needs to be pierced using a sharp pipette needle to draw reagents from the container. The storage container motion control module can control a driver to drive a motor to move the reagent storage container 30 in the Z-axis and bring it closer to the pipette needle, so that the pipette needle can pierce the sealing film and draw the reagents.

[0049] The fluid system control module includes an injection pump control submodule and a distribution valve control submodule. The injection pump control submodule and the distribution valve control submodule can control the operation of the injection pump and the distribution valve in the fluid system respectively, and cooperate with other components or parts in the fluid system to realize the automated control of the fluid system.

[0050] The light source control module includes an LED control submodule and an LD control submodule. The LED control submodule controls the LED light source to operate at a stable optical power level so that the LED emits excitation light to excite phosphors and generate fluorescence signals. The LD control submodule controls the LD to operate at a stable optical power level so that the LD emits laser light to assist the imaging component in focusing.

[0051] The electronic control system 80 also needs to collect information reflecting the instrument's operating status in real time through various sensors, and report it to the host computer through the central control module. The host computer can then detect the instrument's operating status to ensure stable operation.

[0052] Various sensors may include, but are not limited to: temperature sensors for collecting the temperature of key components inside the sequencer; sensors for detecting the chip loading status; sensors for detecting the chip fixture status; sensors for detecting the loading and positioning status of reagent storage containers; sensors for detecting the loading and positioning status of waste liquid storage containers; sensors for detecting the positioning status of door panels on the sequencer (e.g., reagent storage container door, waste liquid storage container door); sensors for detecting the waste liquid level in the waste liquid storage container; and sensors for detecting the volume and number of air bubbles, fluid flow rate, and pipeline pressure status in the liquid system.

[0053] Temperature sensors can collect data such as the temperature of the imaging components, the temperature of the host computer, the temperature of the air inlet / outlet, and the temperature of the sequencer's internal and external environments. The central control module can further control the fans located at the air inlet / outlet based on the air inlet / outlet temperature, forming a closed-loop control.

[0054] After the central control module reports the information collected by the sensor to the host computer, the host computer detects the working status of the instrument and issues instructions to indicate the working status based on the detection results. The central control module controls the indicator lights to indicate the working status of the instrument according to the instructions. For example, RGB three-color indicator lights are used to indicate the working status of the instrument.

[0055] The central control module can also receive input power, convert the input power into the working power required by each control module as needed, and then output it.

[0056] In addition to the various control modules mentioned above, a consumable information reading and writing module is also included. This module can read consumable information (e.g., sequencing chips, universal reagent kits, buffer cartridges) from within the gene sequencer according to instructions and report the read consumable information to the host computer via the central control module. For example, consumable information can be read using radio frequency identification (RFID) technology. An RFID tag is attached to the consumable, carrying consumable information, and the consumable information reading and writing module reads the consumable information from the RFID tag.

[0057] Specifically, the consumables transmit information via radio waves to the read / write module through a specially coded coil antenna to process the data and retrieve the consumables' information. However, since information is transmitted via radio waves, long transmission distances lead to significant signal attenuation, affecting information transmission quality. Furthermore, significant external interference during use can also degrade information transmission quality.

[0058] Based on the above research, this application provides a data read / write device based on radio frequency identification (RFID). This device includes an RF modulation and transceiver processing module, a voltage standing wave ratio (VSWR) adjustment module, a power matching amplifier module, and a transceiver antenna module. When each reagent consumable with a specific code approaches the data read / write device for information identification, the RF modulation and transceiver processing module modulates the data information into an analog RF signal and sends it to the VSWR adjustment module. This adjusts the phase or impedance amplitude of the reflected wave to change the VSWR, thereby enabling the signal to be transmitted in the optimal power mode. The power matching amplifier module amplifies the processed RF signal power, enhancing the transmission and reception distance and anti-interference capability. Finally, the signal propagates wirelessly through the transceiver antenna module. When the RF signal reaches the specific coded coil antenna at the reagent consumable, the specific coded coil antenna sends the reagent consumable number information to the transceiver antenna module of the data read / write device, thus completing the reading of the consumable information. In this way, not only can the identification and processing of reagent and consumable information be realized, but the power matching amplification module can also improve the power of signal transmission and reception, as well as the anti-interference capability in strong interference environments. This enhances the distance, reliability, and stability of information reading and transmission, thereby reducing the impact of poor wireless transmission and radio frequency information processing quality caused by transmission distance and strong interference environments.

[0059] The data reading and writing device based on radio frequency identification provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0060] See Figure 2 The diagram shown is a schematic block diagram of a data read / write device based on radio frequency identification (RFID) according to some embodiments of this application. The RFID-based data read / write device 100 includes an RF modulation transceiver processing module 10, a voltage standing wave ratio (VSWR) adjustment module 20, a power matching amplification module 30, and a transceiver antenna module 40. The RF modulation transceiver processing module 10 can transmit and receive uplink and downlink RF signals carrying data information; these RF signals are high-frequency analog wave signals. The VSWR adjustment module 20 is connected to the RF modulation transceiver processing module 10 and can adjust the VSWR of the uplink and downlink RF signals. The power matching amplification module 30 is connected to the VSWR adjustment module 20 and can perform power matching and amplification processing on the uplink and downlink RF signals. The transceiver antenna module 40 is connected to the power matching amplification module 30 and can transmit the power-matched and amplified uplink RF signal and receive the downlink RF signal transmitted by the target object.

[0061] In this embodiment of the application, the radio frequency signal transmitted by the data read / write device 100 is an uplink radio frequency signal, and the radio frequency signal returned by the target object 200 is a downlink radio frequency signal.

[0062] For example, the target object 200 may include a label on the sequencing consumable, and the data information to be identified and processed may be basic information about the sequencing consumable, etc. The sequencing consumable may be at least one of a sequencing chip, a sequencing kit, or a buffer cartridge.

[0063] The basic information of a sequencing chip includes, but is not limited to: serial number, product number, product version number, product batch number, maximum read length, throughput type, first experiment time, repeat experiment time, expiration time, and usage status.

[0064] Basic information about sequencing kits includes, but is not limited to: serial number, product number, product version number, product batch number, maximum read length, throughput type, first-time experiment date, retest date, expiration date, and usage status.

[0065] Basic information about the buffer cartridge includes, but is not limited to: serial number, product number, product version number, product batch number, maximum read length, throughput type, first test date, repeat test date, expiration date, and usage status.

[0066] Understandably, in other embodiments, the target object 200 can also be other instruments or items in the gene sequencing system, depending on actual needs. In other application scenarios (such as supermarkets), the target object 200 can also be different categories of goods.

[0067] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the data read / write device 100. In other embodiments of this application, the data read / write device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0068] See Figure 3As shown, in some embodiments, the RF modulation transceiver processing module 10 is provided with a signal transmission interface 11, an amplitude modulation (AM) receiving interface 12, and a phase modulation (PM) receiving interface 13. The voltage standing wave ratio (VSWR) adjustment module 20 includes a VSWR phase adjustment unit 21 and a VSWR amplitude adjustment unit 22. The VSWR phase adjustment unit 21 is connected to both the signal transmission interface 11 and the PM receiving interface 13, and is configured to adjust the reflection phase coefficients of the uplink and downlink RF signals to adjust the VSWR. That is, the PM receiving interface 13 receives the signal from the VSWR adjustment module 20 that changes the reflected wave phase, thereby altering the system's VSWR performance. The VSWR amplitude adjustment unit 22 is connected to both the VSWR phase adjustment unit 21 and the AM receiving interface 12, and is configured to adjust the reflection attenuation amplitude of the uplink and downlink RF signals to adjust the VSWR. That is, the AM receiving interface 12 receives the signal from the VSWR adjustment module 20 that changes the reflected wave amplitude, thereby altering the VSWR performance.

[0069] In this embodiment, by adjusting the VSWR of the radio frequency signal, the radio frequency signal can be better compatible with the system, enabling the transmitted signal to be transmitted with more efficient power, thereby improving the reliability of the signal.

[0070] Understandably, in some embodiments, the voltage standing wave ratio (VSWR) adjustment module 20 may include only the standing wave phase adjustment unit 21 or the standing wave amplitude adjustment unit 22. That is, in some embodiments, the standing wave phase adjustment unit 21 or the standing wave amplitude adjustment unit 22 may be omitted.

[0071] Optionally, the voltage standing wave ratio (VSWR) adjustment module 20 may further include a subharmonic suppression unit 23. This subharmonic suppression unit 23 is used to filter out harmonic components of the radio frequency signal. Specifically, the subharmonic suppression unit 23 can suppress harmonic components in high-frequency analog waves to reduce system noise.

[0072] Understandably, in some cases, the center frequency of the encoding coil antenna of the target object 200 may be offset, making it impossible to properly match with the antenna system of the RFID reader / writer module, thus degrading the quality of transmitted information.

[0073] To address this technical problem, in some embodiments, see [reference needed]. Figure 4As shown, the voltage standing wave ratio (VSWR) adjustment module 20 further includes a resonant frequency adjustment unit 24. The resonant frequency adjustment unit 24 is connected between the signal transmission interface 11 and the VSWR phase adjustment unit 21. The resonant frequency adjustment unit 24 is used to tune the resonant frequencies of the uplink and downlink radio frequency signals to match the transmit and receive signal frequencies of the radio frequency modulation and transceiver processing module 10, and to attenuate signals in other frequency bands. Thus, by selecting the optimal resonant frequency points for transmission and reception using the resonant frequency adjustment unit 24, not only can the center frequency offset problem be solved, but the matching between the radio frequency signal source and the adjustment system can also be improved, thereby increasing the voltage standing wave ratio and further improving transmission efficiency.

[0074] See Figure 5 As shown, in some embodiments, the power matching amplification module 30 includes an impedance matching unit 31, an uplink / downlink RF follower unit 32, an uplink / downlink detection control unit 33, and a signal amplification and processing unit 34. One end of the impedance matching unit 31 is connected to the voltage standing wave ratio (VSWR) adjustment module 20, and the other end of the impedance matching unit 31 is connected to the uplink / downlink RF follower unit 32. The impedance matching unit is configured to match the input impedance of the input RF signal. The uplink / downlink RF follower unit 32 is used to improve the driving capability of the input RF signal. The uplink / downlink detection control unit 33 is used to control the transmission link of the other of the uplink and downlink RF signals to be shut down when one of the uplink and downlink RF signals is detected. One end of the signal amplification and processing unit 34 is connected to the uplink / downlink RF follower unit 32, and the other end is connected to the transceiver antenna module 40. The signal amplification and processing unit 34 is configured to perform power amplification and frequency selection processing on the input RF signal.

[0075] For example, the uplink / downlink RF follower unit 32 includes an uplink RF follower unit 321 and a downlink RF follower unit 322. The uplink / downlink detection control unit 33 includes an uplink detection control input unit 331 and a downlink detection control output unit 332. The input terminal of the uplink RF follower unit 321 is connected to the impedance matching unit 31, and the output terminal Q1 of the uplink RF follower unit 321 is connected to the signal amplification and processing unit 34. The input terminal of the downlink RF follower unit 322 is connected to the signal amplification and processing unit 34, and the output terminal Q2 of the downlink RF follower unit 322 is connected to the impedance matching unit 31.

[0076] The detection terminal of the uplink detection control input unit 331 is connected to the input terminal of the uplink RF follower unit 32, and the control terminal of the uplink detection control input unit 331 is connected to the output terminal Q2 of the downlink RF follower unit. The uplink detection control input unit 331 is configured to control the output terminal Q2 of the downlink RF follower unit 322 to turn off when it detects that the input terminal of the uplink RF follower unit 321 has received the uplink RF signal.

[0077] The detection terminal of the downlink detection control output unit 332 is connected to the input terminal of the downlink RF follower unit 322, and the control terminal of the downlink detection control output unit 332 is connected to the output terminal Q1 of the uplink RF follower unit 321. The downlink detection control output unit 332 is configured to control the output terminal Q1 of the uplink RF follower unit 321 to turn off when it detects that the input terminal of the downlink RF follower unit 322 has received the downlink RF signal.

[0078] In this embodiment, the uplink / downlink detection control unit 33 can control the downlink system to shut down when an uplink radio frequency signal is detected being transmitted, thereby preventing crosstalk between the downlink radio frequency signal and the uplink radio frequency signal during information uploading. Similarly, when a downlink receiving radio frequency signal is detected to be uploading information, the uplink transmitting system can be controlled to shut down.

[0079] See Figure 6 As shown, in some embodiments, the signal amplification processing unit 34 includes a DC component removal unit 341 and a signal amplification unit (…). Figure 6 (342, 343, and 344). The DC component removal unit 341 is connected to the uplink / downlink RF follower unit 32 and is configured to remove the DC component of the input RF signal. The signal amplification unit is connected between the DC component removal unit 341 and the transceiver antenna module 40 and is configured to perform power amplification and frequency selection processing on the uplink / downlink RF signals.

[0080] In some embodiments, the signal amplification unit includes an LC frequency selection unit 342. The LC frequency selection unit 342 is connected to the DC component removal unit 341 and is configured to increase the energy of the target frequency band of the uplink and downlink radio frequency signals and filter out frequency signals in the uplink and downlink radio frequency signals that do not belong to the target frequency band. The target frequency band refers to the frequency band transmitted and received by the radio frequency modulation transceiver processing module 10.

[0081] In some embodiments, the signal amplification unit further includes a signal power input / output gain unit 343. The signal power input / output gain unit 343 is connected to the LC frequency selection unit 342 and is configured to perform power gain amplification processing on the uplink and downlink radio frequency signals to improve the transmission and reception power of the uplink and downlink radio frequency signals.

[0082] In some embodiments, the signal amplification unit further includes an uplink / downlink frequency selective amplification unit 344. The uplink / downlink frequency selective amplification unit 344 is connected to the signal power input / output gain unit 343 and is configured to perform target frequency band filtering on the uplink / downlink radio frequency signals to reduce the noise frequency of the uplink / downlink radio frequency signals.

[0083] Exemplarily, the DC component removal unit 341 includes an uplink DC component removal unit 3411 and a downlink DC component removal unit 3412. The LC frequency selection unit 342 includes an uplink LC frequency selection unit 3421 and a downlink LC frequency selection unit 3422. The signal power input / output gain unit 343 includes a signal power output gain unit 3431 and a signal power input gain unit 3432. The uplink / downlink frequency selection amplification unit 344 includes an uplink frequency selection amplification unit 3441 and a downlink frequency selection amplification unit 3442. The uplink DC component removal unit 3411, the uplink LC frequency selection unit 3421, the signal power output gain unit 3431, and the uplink frequency selection amplification unit 3441 form the transmission link for the uplink radio frequency signal. The downlink DC component removal unit 3412, the downlink LC frequency selection unit 3422, the signal power input gain unit 3432, and the downlink frequency selection amplification unit 3442 form the transmission link for the downlink radio frequency signal. Uplink radio frequency signal refers to the radio frequency signal sent by the data read / write device 100 to the target object 200. Downlink radio frequency signal refers to the radio frequency signal sent by the target object 200 to the data read / write device 100.

[0084] The following section provides a detailed description of the specific circuit diagrams for each unit.

[0085] In some embodiments, see Figure 7 As shown, the resonant frequency adjustment unit 24 includes a first variable capacitor C1, a second variable capacitor C2, and a first inductor L1. The first terminal of the first variable capacitor C1 is connected to the signal transmission interface 11, and the second terminal of the first variable capacitor C1 is connected to the standing wave phase adjustment unit 21 via the first inductor L1. One terminal of the second variable capacitor C2 is connected between the first variable capacitor C1 and the first inductor L1, and the other terminal of the second variable capacitor C2 is grounded. Therefore, by adjusting the capacitance of the first variable capacitor C1 or the second variable capacitor C2, the resonant frequency of the frequency resonant adjustment unit 24 can be tuned to match the signal frequencies transmitted and received by the RF modulation transceiver processing module 10, while attenuating signals in other frequency bands.

[0086] In some embodiments, the standing wave phase adjustment unit 21 may include a first capacitor C3, a second capacitor C4, a third capacitor C6, a second inductor L2, a third variable capacitor C7, and a fourth variable capacitor C8. The first terminal of the second inductor L2 is connected to the resonant frequency adjustment unit 24, and the second terminal of the second inductor L2 is connected to the power matching amplifier module 30. One terminal of the first capacitor C3 is connected to the first terminal of the second inductor L2, and the other terminal of the first capacitor C3 is grounded through the second capacitor C4. One terminal of the third capacitor C6 is connected to the first terminal of the second inductor L2, and the other terminal of the third capacitor C6 is grounded. The connection node between the third capacitor C6 and the second inductor L2 is closer to the second inductor L2 than the connection node between the first capacitor C3 and the second inductor L2.

[0087] Here, by adjusting the capacitance of the third variable capacitor C7 or the fourth variable capacitor C8, the standing wave phase adjustment unit 21 changes the reflection phase coefficient of the high-frequency analog wave, thereby altering the phase of the original wave and the reflected wave, and thus changing the voltage difference between them to change the standing wave ratio. Specifically, the closer the phase angle of the reflected wave is to the phase angle of the original incident wave, the higher their superposition effect, and the better the standing wave ratio. Conversely, the greater the angle difference between them, the more attenuation is canceled out, resulting in a worse standing wave ratio and poorer signal performance.

[0088] In some embodiments, the standing wave amplitude adjustment unit 22 includes a first capacitor C3, a second capacitor C4, a third capacitor C6, a second inductor L2, a fifth variable capacitor C9, and a sixth variable capacitor C10. One end of the fifth variable capacitor C9 is connected to the second end of the second inductor L2, and the other end of the fifth variable capacitor C9 is grounded. One end of the sixth variable capacitor C10 is connected to the second end of the second inductor L2, and the other end of the sixth variable capacitor C10 is grounded. The connection point between the fifth variable capacitor C9 and the second inductor L2 is closer to the second inductor L2 than the connection point between the sixth variable capacitor C10 and the second inductor L2.

[0089] Here, by adjusting the capacitance of the fifth variable capacitor C9 or the sixth variable capacitor C10, the standing wave amplitude adjustment unit 22 can change the reflection attenuation amplitude of the high-frequency analog wave, thereby altering the voltage difference between the original wave and the reflected wave and thus changing the standing wave ratio. Specifically, the smaller the amplitude of the reflected wave, the greater the difference between the reflected wave and the original wave, resulting in a better standing wave signal value and the best signal performance. Conversely, the higher the amplitude of the reflected wave, the smaller the difference, and the lower the standing wave ratio.

[0090] It should be noted that the first capacitor C3, the second capacitor C4, the third capacitor C6, and the second inductor L2 are components shared by the standing wave phase adjustment unit 21 and the standing wave amplitude adjustment unit 22. Figure 7 The dashed box in the middle does not completely enclose the entire diagram.

[0091] In some embodiments, the subharmonic suppression unit 23 may include a fourth capacitor C5. The two ends of the fourth capacitor C5 are respectively connected to the two ends of the second inductor L2, that is, the fourth capacitor C5 is connected in parallel with the second inductor L2.

[0092] See Figure 8 As shown, in some embodiments, the impedance matching unit 31 includes a fifth capacitor C11, a third inductor L3, and a sixth capacitor C12. Specifically, the first terminal of the third inductor L3 is connected to the voltage standing wave ratio (VSWR) adjustment module 20, and the second terminal of the third inductor L3 is connected to the uplink RF follower unit 321. One terminal of the fifth capacitor C11 is connected to the first terminal of the third inductor L3, and the other terminal of the fifth capacitor C11 is grounded. One terminal of the sixth capacitor C12 is connected to the second terminal of the third inductor L3, and the other terminal of the sixth capacitor C12 is grounded. The impedance matching unit 31 is used to perform input and output impedance matching for uplink and downlink RF signals.

[0093] The uplink RF follower unit 321 includes a first operational amplifier follower U1 and a first thyristor Q1. The output terminal of the first operational amplifier follower U1 is connected to the first thyristor Q1. The control terminal of the first thyristor Q1 is connected to the downlink detection and control output unit 332.

[0094] The downlink RF follower unit 322 includes a second operational amplifier follower U2 and a second thyristor Q2. The output terminal of the second operational amplifier follower U2 is connected to the second thyristor Q2. The control terminal of the second thyristor Q2 is connected to the uplink detection and control input unit 331.

[0095] The first operational amplifier follower U1 and the second operational amplifier follower U2 are used to improve the driving capability of the transmitted and received radio frequency signals.

[0096] The uplink detection control input unit 331 includes a full-wave rectifier unit (also known as a comb rectifier unit), an amplification resonant filter unit, a buffer unit, and a control unit.

[0097] Specifically, the full-wave rectifier unit includes a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a first operational amplifier U3, a first diode D1, and a second diode D2. The inverting input of the first operational amplifier U3 is connected to the non-inverting input of the first operational amplifier follower U1 through the second resistor R2. The non-inverting input of the first operational amplifier U3 is grounded. The output of the first operational amplifier U3 is connected to the cathode of the first diode D1 and the anode of the second diode D2. The anode of the first diode D1 is connected between the third resistor R3 and the fourth resistor R4. The cathode of the second diode D2 is connected to the inverting input of the first operational amplifier U3. The first end of the third resistor R3 is connected to the inverting input of the first operational amplifier U3, and the second end of the third resistor R3 is connected to the first end of the fourth resistor R4. The second end of the fourth resistor R4 is connected to the amplification resonant filter unit. One end of the first resistor R1 is connected to the inverting input of the first operational amplifier U3 through the second resistor R2, and the other end of the first resistor R1 is connected to the second end of the fourth resistor R4.

[0098] The amplified resonant filter unit includes a fifth resistor R5, a second operational amplifier U4, a fourth inductor L4, and a seventh capacitor C13. Specifically, the inverting input of the second operational amplifier U4 is connected to the second terminal of the fourth resistor R4 in the full-wave rectifier unit, and the inverting input of the second operational amplifier U4 is also connected to the output of the second operational amplifier U4 through the fifth resistor R5. The non-inverting input of the second operational amplifier U4 is grounded. The output of the second operational amplifier U4 is also connected to the first terminal of the fourth inductor L4, the second terminal of the fourth inductor L4 is grounded through the first seventh capacitor C13, and the second terminal of the fourth inductor L4 is also connected to the buffer unit.

[0099] The buffer unit includes buffer U5 and an eighth capacitor C14. The input terminal of buffer U5 is connected to the second terminal of the fourth inductor L4, and the input terminal of buffer U5 is also grounded through the eighth capacitor C14. The output terminal of buffer U5 is connected to the control unit.

[0100] The control unit includes a comparator U6, a ninth capacitor C15, a first switch Q3, and a sixth resistor R6. The non-inverting input of comparator U6 is connected to the output of buffer U5, and the non-inverting input of comparator U6 is also connected to its output through the ninth capacitor C15. The inverting input of comparator U6 is grounded. The output of comparator U6 is connected to the control terminal of the first switch Q3. The first connection terminal of the first switch Q3 is connected to the power supply, and the second connection terminal of the first switch Q3 is grounded through the sixth resistor R6.

[0101] In this embodiment, the control terminal, the first connection terminal, and the second connection terminal of the first switch Q3 correspond to the base, collector, and emitter of the transistor, respectively.

[0102] Before the transmitted radio frequency signal (uplink radio frequency signal) enters the first follower amplifier U1, it undergoes detection processing (the transmitted signal is generally a small-signal sine wave with very low power). A full-wave rectifier unit rectifies the input signal to improve the DC signal level and suppress other amplified noise. The rectified DC signal then enters the amplification resonant filter unit for further processing. The processed signal is then processed by buffer U5 and output to comparator U6. After comparison, the comparator outputs a high-level signal with better driving capability to control the first switch Q3 to turn off, and outputs a low-level signal to control the thyristor Q2 to turn off, thereby closing the downlink system's signal transmission path.

[0103] It should be noted that the circuit structure of the downlink detection control output unit 332 is similar to or the same as that of the uplink detection control input unit 331, and will not be described in detail here.

[0104] See Figure 9 As shown, in some embodiments, the uplink DC component removal unit 3411 is used to remove the DC component of the transmitted and received radio frequency signals to facilitate processing by the back-end circuitry. Specifically, the uplink DC component removal unit 3411 includes a second switch Q4, a tenth capacitor C16, an eleventh capacitor C17, a seventh resistor R7, and an eighth resistor R8. The control terminal of the second switch Q4 is connected to the uplink RF follower unit 321 through the tenth capacitor C16. The first connection terminal of the second switch Q4 is connected to the power supply, and the first connection terminal of the second switch Q4 is also connected to the control terminal of the second switch Q4 through the seventh resistor R7. The second connection terminal of the second switch Q4 is grounded through the eighth resistor R8, and the second connection terminal of the second switch Q4 is also connected to the uplink LC frequency selection unit 3421 through the eleventh capacitor C17.

[0105] In this embodiment, the control terminal, the first connection terminal, and the second connection terminal of the second switch Q4 correspond to the base, collector, and emitter of the transistor, respectively.

[0106] The uplink LC frequency selection unit 3421 is used to increase the energy of the required transmit / receive RF signal frequency band and filter out frequency bands that are not at the center frequency (such as filtering out any frequency signals that do not belong to 13.56MHz). Specifically, the uplink LC frequency selection unit 3421 includes a third switch Q5, a twelfth capacitor C18, a thirteenth capacitor C19, a ninth resistor R9, a tenth resistor R10, an eleventh resistor, and a fifth inductor L5. The control terminal of the third switch Q5 is connected to the second connection terminal of the second switch Q2, and the control terminal of the third switch Q5 is also grounded through the eleventh resistor R11. The first connection terminal of the third switch Q5 is connected to the signal power output gain unit 3431. The first connection terminal of the third switch Q5 is also connected to the first terminal of the twelfth capacitor C18 and the first terminal of the fifth inductor L5. The second terminals of the twelfth capacitor C18 and the fifth inductor L5 are both connected to the control terminal of the third switch Q5 through the tenth resistor R10. That is, the twelfth capacitor C18 and the fifth inductor L5 are connected in parallel and then connected in series with the tenth resistor R10 between the first connection terminal and the control terminal of the third switch Q5. The second connection terminal of the third switch Q5 is grounded through the thirteenth capacitor C19 and the ninth resistor R9. That is, the thirteenth capacitor C19 and the ninth resistor R9 are connected in parallel between the second connection terminal of the third switch Q5 and ground.

[0107] It should be noted that the specific circuit structure of the downlink DC component removal unit 3412 is the same as or similar to that of the uplink DC component removal unit 3411. For details, please refer to the description of the uplink DC component removal unit 3411, which will not be repeated here. Similarly, the circuit of the downlink LC frequency selection unit 3422 is the same as or similar to that of the uplink LC frequency selection unit 3421, which will not be repeated here.

[0108] See Figure 10As shown, in some embodiments, the signal power output gain unit 3431 is used to amplify low-power signals by a power gain factor to improve the transmission and reception power of the signal. The signal power output gain unit 3431 may include a third operational amplifier U7, a twelfth resistor R12, a thirteenth resistor R13, a fourteenth resistor R14, a fifteenth resistor R15, a fourteenth capacitor C20, a fifteenth capacitor C21, and a sixteenth capacitor C22. The non-inverting input terminal of the third operational amplifier U7 is connected to one end of the fourteenth capacitor C20, the twelfth resistor R12, and the thirteenth resistor R13, respectively. The other end of the fourteenth capacitor C20 is connected to the uplink LC frequency selection unit 3421, the other end of the twelfth resistor R12 is connected to the power supply, and the other end of the thirteenth resistor R13 is grounded. The inverting input of the third operational amplifier U7 is connected to one end of the fourteenth resistor R14, the fifteenth resistor R15, and the sixteenth capacitor C22, respectively. The other end of the fourteenth resistor R14 is grounded through the fifteenth capacitor C21. The other ends of the fifteenth resistor R15 and the sixteenth capacitor C22 are both connected to the output of the third operational amplifier U7. The output of the third operational amplifier U7 is also connected to the uplink frequency selective amplifier unit 3441.

[0109] The uplink frequency selective amplifier unit 3441 includes a fourth switch Q6, an eighth inductor L8, a sixteenth resistor R16, a seventeenth resistor R17, an eighteenth resistor R18, a seventeenth capacitor C23, an eighteenth capacitor C24, and a nineteenth capacitor C25. The control terminal of the fourth switch Q6 is connected to the output terminal of the third operational amplifier U7 via the seventeenth capacitor C23. The first connection terminal of the fourth switch Q6 is connected to the power supply via the eighth inductor L8 and the eighteenth capacitor C24; that is, the eighth inductor L8 and the eighteenth capacitor C24 are connected in parallel between the first connection terminal of the fourth switch Q6 and the power supply. The second connection terminal of the fourth switch Q6 is grounded via the eighteenth resistor R18 and the nineteenth capacitor C25; that is, the eighteenth resistor R18 and the nineteenth capacitor C25 are grounded and connected in parallel between the second connection terminal of the fourth switch Q6 and ground. Furthermore, the first connection terminal of the fourth switch Q6 is also connected to the transceiver antenna module 40. The control terminal of the fourth switch Q6 is also connected to the power supply via the sixteenth resistor R16. The control terminal of the sixteenth resistor R16 is also grounded through the seventeenth resistor R17.

[0110] It should be noted that the specific circuit structure of the signal power input gain unit 3432 is the same as or similar to that of the signal power output gain unit 3431, and will not be described again here. Similarly, the circuit of the downlink frequency selective amplifier unit 3442 is the same as or similar to that of the uplink frequency selective amplifier unit 3441, and will not be described again here.

[0111] The transceiver antenna module 40 includes an impedance matching system and an antenna coil. The impedance matching system is used to match the impedance at the transmitting end and the impedance at the antenna end, thereby reducing signal loss during transmission. The antenna coil is used to transmit radio frequency signals to the surrounding space in wireless mode.

[0112] Specifically, such as Figure 11 As shown, the impedance matching system includes a nineteenth resistor R19, a twentieth resistor R20, a twentieth capacitor C26, a twenty-first capacitor C27, a twenty-second capacitor C28, and a twenty-ninth capacitor C29. Specifically, one end of each of the nineteenth resistor R19, the twenty-second capacitor C28, and the twenty-ninth capacitor C29 is connected to the antenna coil, and the other end of each is connected to the uplink / downlink selective amplifier unit via the twentieth capacitor C26 and the twenty-first capacitor C27, respectively. Furthermore, one end of the twentieth resistor R20 is connected to the antenna coil, and the other end is connected to the uplink / downlink selective amplifier unit.

[0113] See Figure 12 As shown in some embodiments of this application, a gene sequencer 300 is also provided. The gene sequencer 300 includes a radio frequency identification (RFID)-based data read / write device 100, sequencing consumables 320, a processor 330, and a display 340. The sequencing consumables 320 are equipped with an RFID tag carrying basic information about the sequencing consumables 320. The data read / write device 100 is configured to read the basic information about the sequencing consumables from the RFID tag after the sequencing consumables 340 are loaded onto the gene sequencer 300, and then upload this information to the processor 330. The processor 330 is used to display the basic information about the sequencing consumables 320 on the display 340.

[0114] The sequencing consumable 320 and its basic information are as described in the previous embodiments and will not be repeated here. The processor 330 can be the aforementioned... Figure 1-c The host computer or central control module in the system.

[0115] It should be noted that the aforementioned modules and units may include corresponding circuits or chips, etc. In this embodiment, the specific circuits of the aforementioned modules are not limited, as long as each module and unit can achieve the corresponding function. In addition, the modules can be integrated on the same circuit board and disposed in the same housing, or they can be integrated on different circuit boards and disposed in different housings. The specific combination can be made according to the actual situation, and no specific limitation is made here.

[0116] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the disclosed product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the electric vehicle or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0117] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0118] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The protection scope of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the scope of the technology disclosed in this application; and these modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application. All should be covered within the protection scope of this application. Therefore, the protection scope of this application should be determined by the protection scope of the claims.

Claims

1. A data read / write device based on radio frequency identification, characterized in that, The data reading and writing device is used for identifying and processing data information of target objects, and includes: The radio frequency modulation transceiver processing module is configured to transmit and receive uplink and downlink radio frequency signals carrying data information, wherein the radio frequency signals are high-frequency analog wave signals. A voltage standing wave ratio (VSWR) adjustment module is connected to the radio frequency modulation and transceiver processing module and is configured to adjust the VSWR of uplink and downlink radio frequency signals. A power matching amplifier module is connected to the voltage standing wave ratio adjustment module and is configured to perform power matching and amplification processing on uplink and downlink radio frequency signals. The transceiver antenna module is connected to the power matching amplifier module and is configured to transmit uplink radio frequency signals after power matching and amplification, and to receive downlink radio frequency signals transmitted by the target object.

2. The data read / write device according to claim 1, characterized in that, The radio frequency modulation transceiver processing module is provided with a signal transmission interface, an amplitude modulation reception interface and / or a phase modulation reception interface. The voltage standing wave ratio adjustment module includes: a standing wave phase adjustment unit and / or a standing wave amplitude adjustment unit; The standing wave phase adjustment unit is connected to the signal transmission interface and the phase modulation receiving interface, respectively, and is configured to adjust the reflection phase coefficient of the uplink and downlink radio frequency signals in order to adjust the voltage standing wave ratio of the uplink and downlink radio frequency signals. The standing wave amplitude adjustment unit is connected to the standing wave phase adjustment unit and the amplitude modulation receiving interface, respectively, and is configured to adjust the reflection attenuation amplitude of the uplink and downlink radio frequency signals in order to adjust the voltage standing wave ratio of the uplink and downlink radio frequency signals.

3. The data read / write device according to claim 2, characterized in that, The voltage standing wave ratio adjustment module also includes: A resonant frequency adjustment unit is connected between the signal transmission interface and the standing wave phase adjustment unit, and is configured to tune the resonant frequency of the uplink and downlink radio frequency signals to match the transmission and reception signal frequency of the radio frequency modulation and transceiver processing module.

4. The data read / write device according to claim 2 or 3, characterized in that, The voltage standing wave ratio adjustment module also includes: The subharmonic suppression unit is configured to filter out the harmonic components of the uplink and downlink radio frequency signals.

5. The data read / write device according to claim 1, characterized in that, The power matching amplifier module includes an impedance matching unit, an uplink and downlink RF follower unit, an uplink and downlink detection and control unit, and a signal amplification and processing unit. One end of the impedance matching unit is connected to the voltage standing wave ratio adjustment module, and the other end of the impedance matching unit is connected to the uplink and downlink RF follower unit. The impedance matching unit is configured to match the input and output impedances of the uplink and downlink RF signals. The uplink and downlink radio frequency follower unit is configured to improve the driving capability of uplink and downlink radio frequency signals; The uplink and downlink detection control unit is connected to the uplink and downlink radio frequency follower unit and is configured to control the transmission link of the other of the uplink and downlink radio frequency signals to be shut down when one of the uplink radio frequency signal and the downlink radio frequency signal is detected. One end of the signal amplification and processing unit is connected to the uplink and downlink RF follower unit, and the other end is connected to the transceiver antenna module. It is configured to amplify the power and perform frequency selection processing on the uplink and downlink RF signals.

6. The data read / write device according to claim 5, characterized in that, The uplink and downlink radio frequency follower unit includes an uplink radio frequency follower unit and a downlink radio frequency follower unit; the uplink and downlink detection control unit includes an uplink detection control input unit and a downlink detection control output unit. The input terminal of the uplink RF follower unit is connected to the impedance matching unit, and the output terminal of the uplink RF follower unit is connected to the signal amplification and processing unit; the input terminal of the downlink RF follower unit is connected to the signal amplification and processing unit, and the output terminal of the downlink RF follower unit is connected to the impedance matching unit. The detection terminal of the uplink detection control input unit is connected to the input terminal of the uplink RF follower unit, and the control terminal of the uplink detection control input unit is connected to the output terminal of the downlink RF follower unit; the uplink detection control input unit is configured to control the output terminal of the downlink RF follower unit to turn off when it detects that the input terminal of the uplink RF follower unit receives the uplink RF signal. The detection terminal of the downlink detection control output unit is connected to the input terminal of the downlink radio frequency follower unit, and the control terminal of the downlink detection control output unit is connected to the output terminal of the uplink radio frequency follower unit. The downlink detection control output unit is configured to control the output terminal of the uplink radio frequency follower unit to turn off when it detects that the input terminal of the downlink radio frequency follower unit receives the downlink radio frequency signal.

7. The data read / write device according to claim 6, characterized in that, The signal amplification and processing unit includes: A DC component removal unit is connected to the uplink and downlink RF follower unit and is configured to remove the DC component of the uplink and downlink RF signals; The signal amplification unit is connected between the DC component removal unit and the transceiver antenna module, and is configured to amplify the power and perform frequency selection processing on the uplink and downlink radio frequency signals.

8. The data read / write device according to claim 7, characterized in that, The signal amplification unit includes: The LC frequency selection unit, connected to the DC component removal unit, is configured to increase the energy of the target frequency band of the uplink and downlink radio frequency signals and filter out frequency signals in the uplink and downlink radio frequency signals that do not belong to the target frequency band. The target frequency band refers to the transmission or reception frequency band of the radio frequency modulation transceiver processing module.

9. The data read / write device according to claim 8, characterized in that, The signal amplification unit further includes: The signal power input / output gain unit is connected to the LC frequency selection unit and is configured to perform power gain amplification processing on the uplink and downlink radio frequency signals to improve the transmission and reception power of the uplink and downlink radio frequency signals.

10. The data read / write device according to claim 9, characterized in that, The signal amplification unit further includes: The uplink and downlink frequency selective amplification unit is connected to the signal power input and output gain unit and is configured to perform target frequency band filtering on the uplink and downlink radio frequency signals in order to reduce the noise frequency of the uplink and downlink radio frequency signals.

11. A gene sequencer, characterized in that, Includes a data reading and writing device based on radio frequency identification, sequencing consumables, a processor, and a display as described in any one of claims 1-10, wherein the sequencing consumables are provided with radio frequency tags, and the radio frequency tags carry basic information about the sequencing consumables; The data reading and writing device is configured to read basic information about the sequencing consumables from the RFID tag and upload it to the processor after the sequencing consumables are loaded onto the gene sequencer. The processor is configured to display basic information about the sequencing consumables on the display.

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