Display module and display device

Abstract

Embodiments of the present disclosure provide a display module and a display device, and relate to the technical field of display, and are used to solve the problem of display panel display abnormality. The display module comprises a display panel, a cover plate, a grounding layer and a first adhesive layer. The display panel comprises opposite light-out and non-light-out sides. The cover plate is located on the light-out side of the display panel. The grounding layer is located on the non-light-out side of the display panel. The first adhesive layer comprises a first part and a second part connected with each other. The first part is located on the side of the display panel and the grounding layer. The second adhesive layer is located on the side of the grounding layer away from the display panel. The first adhesive layer is electrically connected with the display panel, the cover plate and the grounding layer respectively. The display module is used for displaying images.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] With the rapid iteration and upgrading of consumer electronics display technology, users have put forward increasingly higher requirements for the visual immersion and screen ratio of display devices, and the narrow bezel design of display devices has become the mainstream development direction of the industry.

[0003] However, as the bezels narrow, the space inside the display device that can be used to arrange functional structures is compressed, which may cause display abnormalities in the display panel. Summary of the Invention

[0004] The purpose of this disclosure is to provide a display module and display device to solve the problem of abnormal display on the display panel during production or use.

[0005] To achieve the above objectives, the embodiments of this disclosure provide the following technical solutions: On one hand, a display module is provided. The display module includes a display panel, a cover plate, a ground layer, and a first adhesive layer. The display panel includes opposing light-emitting and non-light-emitting sides. The cover plate is located on the light-emitting side of the display panel. The ground layer is located on the non-light-emitting side of the display panel. The first adhesive layer includes a first portion and a second portion connected together; the first portion is located on the periphery of the display panel and the ground layer, and the second portion is located on the side of the ground layer away from the display panel; the first adhesive layer is electrically connected to the display panel, the cover plate, and the ground layer respectively.

[0006] In the aforementioned display module, the first part of the first adhesive layer circumferentially surrounds the display panel and the grounding layer, while the second part is located on the side of the grounding layer away from the display panel. This provides a certain degree of protection for the display panel and the grounding layer, reducing the risk of the display panel being damaged by impact. The first adhesive layer is electrically connected to the display panel, the cover plate, and the grounding layer, respectively, and can conduct the static electricity accumulated on the cover plate and the display panel to the grounding layer for release, thereby alleviating display abnormalities caused by static electricity accumulation. At the same time, the first adhesive layer forms an overall wrap around the periphery and bottom of the display panel and the grounding layer, reducing the risk of moisture erosion of the display panel and the grounding layer, and improving the reliability of the display module.

[0007] In some embodiments, the display module further includes a second adhesive layer, which is located on the side of the first adhesive layer away from the display panel and covers the surface of the first adhesive layer away from the display panel; the elastic modulus of the second adhesive layer is less than that of the first adhesive layer.

[0008] In the aforementioned display module, a second adhesive layer with a smaller elastic modulus is wrapped around the side of the first adhesive layer away from the display panel. This provides a further buffer for the display panel and further improves the impact resistance of the display module. At the same time, it provides a certain degree of physical protection for the first adhesive layer, reducing the risk of wear or peeling damage to the first adhesive layer during assembly and use.

[0009] In some embodiments, the display module further includes a third adhesive layer located on the side of the second adhesive layer away from the first adhesive layer; the third adhesive layer is connected to the cover plate and the grounding layer to form a sealed cavity, wherein the first adhesive layer and the second adhesive layer are located in the sealed cavity.

[0010] In the aforementioned display module, the third adhesive layer, together with the cover plate and the grounding layer, forms a sealed cavity, which can isolate external moisture and reduce the risk of performance degradation caused by moisture erosion of the first and second adhesive layers. At the same time, the third adhesive layer can also provide physical constraints on the first and second adhesive layers, preventing them from shifting or peeling under impact or temperature change conditions.

[0011] In some embodiments, the display module further includes a positioning pin, the positioning pin having a first end and a second end opposite to each other; the first end is located in any one of the first adhesive layer, the second adhesive layer and the third adhesive layer, and the second end is located on the side of the third adhesive layer away from the second adhesive layer.

[0012] In the aforementioned display module, the first end of the positioning pin is anchored to any one of the first, second, or third adhesive layers, and the second end extends outward to the side of the third adhesive layer away from the second adhesive layer, enabling it to be inserted into the preset positioning hole, providing a positioning reference for the installation of the display module, and facilitating the positioning and assembly of the display module.

[0013] In some embodiments, the first end of the positioning pin is located on the first adhesive layer and is electrically connected to the first adhesive layer.

[0014] In the aforementioned display module, the static electricity accumulated on the display panel and cover plate can be released to the outside of the display module through the positioning pins, further reducing the risk of display failure caused by static electricity accumulation on the display panel.

[0015] In some embodiments, the surface of the third adhesive layer away from the second adhesive layer has pits.

[0016] In the aforementioned display module, by setting a recess on the surface of the third adhesive layer away from the second adhesive layer, the bonding area between the display module and other components during assembly can be increased, thereby improving reliability. At the same time, the recess can form a space for adhesive during assembly, allowing the adhesive to fill and form a stable mechanical interlocking structure, further enhancing the long-term reliability of the bond. This effectively reduces the risk of adhesive interface debonding and displacement problems in the whole machine under high and low temperature cycles, drop impacts, and long-term vibration conditions, and improves the structural stability of the display module after assembly.

[0017] On the other hand, a display device is provided. The display device includes a display module and a mid-frame as described in any of the above embodiments. The mid-frame has an accommodating space; the display module is located within the accommodating space.

[0018] In some embodiments, the mid-frame further includes a positioning hole; the display module further includes a positioning pin, the positioning pin having a first end and a second end opposite to each other; the first end is located on the first adhesive layer, and the second end is located on the positioning hole.

[0019] In some embodiments, the positioning hole is located on the base plate, and the display device further includes an elastic element located in the positioning hole and connected to the positioning pin.

[0020] In some embodiments, the locating pin is electrically connected to the first adhesive layer and to the elastic element.

[0021] The above-described display device has the same structure and beneficial technical effects as the display panel provided in some of the above embodiments, and will not be described again here. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0023] Figure 1 This is a structural diagram of a display device according to some embodiments; Figure 2 for Figure 1 Cross-sectional view of the display device at AA'; Figure 3 This is a structural diagram of a display module according to some embodiments; Figure 4 This is a structural diagram of a display module based on related technologies; Figure 5 for Figure 4 The image shows a cross-sectional view of the module at BB'. Figure 6 This is a partial structural diagram of a display device according to some embodiments; Figure 7 This is a partial structural diagram of a display device based on related technologies; Figure 8 This is a partial structural diagram of a display device according to some other embodiments. Detailed Implementation

[0024] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0025] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0026] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0027] In describing some embodiments, the terms "coupled" and "connected," and their derivative expressions, may be used. The term "connected" should be interpreted broadly; for example, a "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection via an intermediate medium. The term "coupled," for example, indicates that two or more components have direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0028] In describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be interpreted broadly; for example, "connection" can be a mechanical connection or an electrical connection; it can be a fixed connection or a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art will understand the specific meaning of the above terms herein based on the specific circumstances.

[0029] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0030] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0031] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0032] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0033] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0034] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0035] like Figure 1 As shown, some embodiments of this disclosure provide a display device 1, which can be any device that displays text or images, whether moving (e.g., video) or fixed (e.g., still images). Exemplarily, the display device 1 can be a television, laptop computer, tablet computer, mobile phone (e.g., cell phone), personal digital assistant (PDA), camera, navigator, in-vehicle display, in-flight display, wearable device (e.g., watch), virtual reality (VR) device, augmented reality (AR) device, extended reality (XR) device, mixed reality (MR) device, projector, electronic billboard, or signage, or any other product or component with display functionality. For example, the display device 1 can be... Figure 1 The tablet computer shown is, of course, a television or other product or component with display function, but the embodiments disclosed herein are not specifically limited to it.

[0036] In some embodiments, such as Figure 2 As shown, the display device 1 includes a display module 10 and a middle frame 20. The middle frame 20 includes a base plate 21 and a side plate 22. The side plate 22 is located on one side of the base plate 21 and is arranged circumferentially around the base plate 21 to form an accommodating space 23. The display module 10 is located in the accommodating space 23 and is configured as a component for displaying images.

[0037] like Figure 3As shown, the display module 10 includes a display panel 11 and a cover plate 12. The display panel 11 includes opposing light-emitting and non-light-emitting sides, and the cover plate 12 is located on the light-emitting side of the display panel 11. Depending on the display principle, the display panel 11 can be any of the following: a liquid crystal display (LCD) panel, an organic light-emitting diode (OLED) display panel, a quantum dot light-emitting diode (QLED) display panel, or a mini-LED or micro-LED display panel. The cover plate 12 has good light transmittance; for example, the cover plate 12 can be made of glass. Its purpose is to provide some protection for the display panel 11 without affecting its display, thus preventing direct impact or scratches from external sources.

[0038] In some possible implementations, the cover plate 12 and the display panel 11 can be bonded together using optically clear adhesive (OCA). OCA is a special adhesive used for bonding transparent optical elements. OCA is colorless and transparent, has high light transmittance, good bonding strength, can be cured at room temperature or medium temperature, and has low curing shrinkage. It can provide controlled thickness, which is beneficial to improving the display effect of the display module 10.

[0039] In recent years, with the further narrowing of bezels in display devices, the internal space of display devices has been greatly compressed. To ensure the reliability of display devices, related technologies, such as... Figure 4 and Figure 5As shown, a frame 13' is arranged circumferentially around the display panel 11' to reduce the risk of the display panel 11' breaking when the display device is subjected to impact. However, although the frame 13' can provide effective cushioning and protection, its function is relatively simple and it is difficult to deal with other common abnormal problems in the display module, such as display abnormalities caused by the accumulation of static electricity on the display panel 11' and the cover plate 12'. Since the display panel 11' contains a large number of thin film transistors (TFTs) that are highly sensitive to static electricity, when static charge accumulates to a certain extent on the surface of the display panel 11' or the cover plate 12', it may form a momentary high voltage on the gate, source, or drain of the TFT through capacitive coupling or direct discharge. This high voltage may break down the gate insulating layer of the TFT, causing permanent damage to the TFT; it may also change the threshold voltage of the TFT, causing the pixel brightness to deviate from the expected value, resulting in uneven brightness or even black screen and other display abnormalities. In addition, the strong electromagnetic field generated during the electrostatic discharge process may also interfere with the transmission of drive signals inside the display panel 11', causing display logic errors.

[0040] In view of this, the present disclosure provides a display module 10 to solve the above-mentioned technical problems.

[0041] like Figure 3 As shown in the embodiment of this disclosure, a display module 10 is provided. The display module 10 further includes a ground layer 13 and a first adhesive layer 14. The ground layer 13 is located on the non-light-emitting side of the display panel 11; the first adhesive layer 14 includes a first portion 14A and a second portion 14B connected to each other. The first portion 14A is located on the periphery of the display panel 11 and the ground layer 13, and the second portion 14B is located on the side of the ground layer 13 away from the display panel 11; the first adhesive layer 14 is electrically connected to the display panel 11, the cover plate 12 and the ground layer 13 respectively.

[0042] The first adhesive layer 14 surrounds the display panel 11 and the grounding layer 13 circumferentially with its first portion 14A, and the second portion 14B is disposed on the side of the grounding layer 13 away from the display panel 11. The first adhesive layer 14 can provide a certain degree of protection for the display panel 11 and the grounding layer 13, reducing the risk of damage to the display panel 11 when the display module 10 is subjected to impact. Furthermore, the first adhesive layer 14 is electrically connected to the display panel 11, the cover plate 12, and the grounding layer 13 respectively, which can quickly conduct the static electricity accumulated on the display panel 11 and the cover plate 12 to the grounding layer 13 for release, alleviating the display abnormality problem of the display panel 11 caused by static electricity accumulation. At the same time, the first adhesive layer 14 forms an overall wrap around the periphery and bottom of the display panel 11 and the grounding layer 13, reducing the risk of moisture erosion of the display panel 11 and the grounding layer 13, and improving the reliability of the display module 10.

[0043] As an example, the first adhesive layer 14 can be made of anisotropic conductive film (ACF) or isotropic conductive film. Taking ACF as an example, conductive particles (e.g., gold-plated polymer spheres or nickel spheres) are uniformly distributed inside the first adhesive layer 14. In the unpressurized state, the conductive particles are isolated by the resin matrix, and the adhesive layer is non-conductive; when pressure is applied (e.g., during assembly), the conductive particles are compressed in the pressure direction and come into contact with each other, forming a conductive path. Of course, the first adhesive layer 14 can also be made of any other feasible material, and this embodiment does not specifically limit it.

[0044] In some embodiments, such as Figure 3 As shown, the display module 10 includes a support assembly 30, which includes an adhesive layer 31, a buffer layer 32, and a grounding layer 13 stacked sequentially in the direction away from the display panel. The support assembly 30 can provide certain support for the display panel 11 and buffer the stress acting on the display panel 11, thus providing a certain degree of protection for the display panel 11.

[0045] As an example, the adhesive layer 31 can be made of acrylic or silicone pressure-sensitive adhesive, which has good initial tack and holding power, and can firmly adhere to the non-light-emitting side of the display panel 11. The buffer layer 32 can be made of closed-cell foam material, which contains a large number of independent closed bubble structures. When subjected to impact, the bubbles absorb energy through compression deformation, thereby significantly reducing the peak stress transmitted to the display panel 11. The grounding layer 13 is made of metal, such as copper (Cu). Cu has high thermal conductivity, which can quickly dissipate the heat generated by the display panel 11 during operation, avoiding local overheating that may affect the display effect or accelerate material aging. In addition, the high modulus of Cu can effectively improve the overall bending stiffness of the support component 30, providing additional structural support for the display panel 11 and protecting the display panel 11 from damage in the event of a drop or bending. Of course, the adhesive layer 31, buffer layer 32 and grounding layer 13 can also be made of any other feasible materials, and this embodiment does not specifically limit them.

[0046] In some possible implementations, such as Figure 3 As shown, the display module 10 also includes a second adhesive layer 15, which is located on the side of the first adhesive layer 14 away from the display panel 11 and covers the surface of the first adhesive layer 14 away from the display panel 11. The elastic modulus of the second adhesive layer 15 is less than that of the first adhesive layer 14.

[0047] By covering the side of the first adhesive layer 14 away from the display panel 11 with a second adhesive layer 15, which has a lower elastic modulus, the display panel 11 is further cushioned, improving the impact resistance of the display module 10 and reducing the risk of the display panel 11 breaking due to external impact. At the same time, the second adhesive layer 15 can also provide a certain degree of physical protection for the first adhesive layer 14, reducing the risk of wear or peeling damage to the first adhesive layer 14 during assembly and use.

[0048] As an example, the second adhesive layer 15 can be made of a matrix resin with a lower elastic modulus (e.g., polyurethane, modified silicone, etc.). The dual-layer buffer structure of the first adhesive layer 14 and the second adhesive layer 15 allows each layer to be optimized for its core function, avoiding the performance trade-offs that may occur when a single material simultaneously balances conductivity and buffering properties. When an external impact force is transmitted to the display module 10, the second adhesive layer 15 first undergoes significant deformation to absorb most of the impact energy; the remaining impact energy is then shared by the first adhesive layer 14 and the internal structure of the display panel 11. This gradient buffering mechanism provides more effective protection for the display panel 11 compared to a single buffer layer. Of course, the second adhesive layer 15 can also be made of any other feasible material; this embodiment does not impose specific limitations.

[0049] In some possible implementations, such as Figure 3 As shown, the display module 10 also includes a third adhesive layer 16, which is located on the side of the second adhesive layer 15 away from the first adhesive layer 14; the third adhesive layer 16 forms a sealed cavity with the cover plate 12 and the grounding layer 13, and the first adhesive layer 14 and the second adhesive layer 15 are located in the sealed cavity.

[0050] The third adhesive layer 16, together with the cover plate 12 and the ground layer 13, forms a sealed cavity, which can isolate external moisture and reduce the risk of performance degradation caused by moisture erosion of the first adhesive layer 14 and the second adhesive layer 15. It can also prevent the buffer layer in the support component 30 from absorbing water, which would cause a large difference in moisture content between the edge and center areas of the support component 30. This would result in a large difference in stress between the edge and center areas of the display panel 11, which would then have different effects on the characteristics (e.g., threshold voltage or mobility) of the TFTs in the pixels at different positions in the display panel 11, thus causing uneven brightness of the TFTs in the pixels at different positions in the display panel 11 and improving the display uniformity of the display panel 11. It can also prevent the ground layer 13 (metal layer) from oxidizing and turning green in a humid environment, which would reduce its conductivity and affect the electrostatic discharge of the display panel 11 and the cover plate 12, thereby reducing the risk of display abnormalities in the display panel 11. In addition, the third adhesive layer 16 can also physically constrain the first adhesive layer 14 and the second adhesive layer 15, preventing the first adhesive layer 14 and the second adhesive layer 15 from shifting and peeling under impact and temperature change conditions.

[0051] As an example, the material of the third adhesive layer 16 can be selected from epoxy resin, acrylate, or polyurethane materials with excellent weather resistance. It has good interfacial bonding performance with both the cover plate 12 and the grounding layer 13, and can firmly adhere to form a reliable sealing structure. Of course, the third adhesive layer 16 can also be selected from any other feasible materials, and this embodiment does not specifically limit it.

[0052] In some possible implementations, such as Figure 6 As shown, the display module 10 also includes a positioning pin 17, which includes a first end 171 and a second end 172 opposite to each other. The first end 171 is located in any one of the first adhesive layer 14, the second adhesive layer 15 or the third adhesive layer 16. The middle frame 20 also includes a positioning hole 23. The second end 172 is located on the side of the third adhesive layer 16 away from the second adhesive layer 15 and is located in the positioning hole 23.

[0053] In this embodiment, the positioning pin 17 and the pre-set positioning hole 23 on the middle frame 20 are used to achieve a plug-in engagement, providing a positioning reference for the installation of the display module 10 and facilitating the positioning and assembly of the display module 10. This alleviates the technical problem that the positioning accuracy of the display module 10 is limited by the manufacturing tolerance of the middle frame 20 and the assembly tolerance of the display module 10 due to the reliance on the side plate 22 of the middle frame 20 or the setting of independent steps for coarse positioning, resulting in a large cumulative error. This improves the assembly accuracy of the display device 1.

[0054] In addition, such as Figure 7 As shown, when the assembly of the display module 10 and the middle frame 20 is uneven, the orthographic projection of at least one side boundary of the cover plate 12 onto the base plate 21 may fall outside the range of the orthographic projection of the side plate 22 onto the base plate 21. That is, the edge of the cover plate 12 extends beyond the range of the middle frame 20. When subjected to external impact, this extended portion is prone to local stress concentration, leading to the breakage of the cover plate 12. In this embodiment, the accurate positioning of the positioning pin 17 and the positioning hole 23 ensures that the orthographic projection of the boundary of the cover plate 12 onto the base plate 21 is within the boundary of the orthographic projection of the side plate 22 onto the base plate 21. By pre-setting the positions of the positioning pin 17 and the positioning hole 23, the installation position of the display module 10 is strictly limited, effectively reducing the risk of the above-mentioned problem.

[0055] In some possible implementations, such as Figure 6 As shown, the positioning hole 23 is located on the base plate 21. The display device 1 also includes an elastic element 24, which is located in the positioning hole 23 and connected to the positioning pin 17. Thus, the positioning pin 17 cooperates with the elastic element 24 to provide a buffer stroke when the display device 1 is dropped, absorbing the relative displacement between the display module 10 and the middle frame 20, reducing the impact on the display panel 11, and reducing the probability of the display panel 11 breaking. The elastic element 24 is, for example, a spring.

[0056] For some possible implementations, please refer to [link / reference]. Figure 6 The first end 171 of the positioning pin 17 is located in the first adhesive layer 14 and is electrically connected to the first adhesive layer 14, and the second end 172 is located in the positioning hole 23 and is electrically connected to the elastic member 24.

[0057] In this way, the static electricity accumulated on the display panel 11 and the cover plate 12 can also be discharged to the outside of the display module 10 through the positioning pin 17, providing an additional static electricity discharge channel and further reducing the risk of display failure of the display panel 11 due to static electricity accumulation.

[0058] In some possible implementations, such as Figure 8 As shown, the surface of the third adhesive layer 16 away from the second adhesive layer 15 has a pit 161.

[0059] In some embodiments, the display module 10 and the middle frame 20 are connected by structural adhesive 40 to achieve the assembly of the display device 1. A recess 161 is provided on the surface of the third adhesive layer 16 away from the second adhesive layer 15, which can increase the bonding area between the display module 10 and the structural adhesive 40 during assembly and improve the bonding reliability. At the same time, the recess 161 can form a space for adhesive during assembly, so that the structural adhesive 40 can fill the recess 161 to form a stable mechanical interlocking structure, further enhancing the long-term reliability of the bonding and reducing the risk of problems such as adhesive interface debonding and displacement of the display device 1 under harsh working conditions such as high and low temperature cycling, drop impact, and long-term vibration, thereby improving the structural stability of the display device 1.

[0060] In some embodiments, see further reference. Figure 8 Multiple pits 161 are arrayed on the surface of the third adhesive layer 16 away from the second adhesive layer 15. The multiple pits 161 form a grid, which can form a continuous and regular cross-linked bonding interface on the surface of the third adhesive layer 16. This increases the bonding area and allows the adhesive to form an overall interlocking grid reinforcement structure after filling. This effectively constrains the multidimensional stress of the adhesive layer in the shear and peel directions, and improves the bonding strength. In addition, the grid structure can make the adhesive distribution more uniform, avoid the weak bonding points caused by local adhesive accumulation or absence, and further improve the reliability of the display device 1.

[0061] As an example, the entire surface of the third adhesive layer 16 away from the second adhesive layer 15 is bonded to the middle frame 20. In this case, the recess 161 can be provided on the entire surface of the third adhesive layer 16 away from the second adhesive layer 15. Alternatively, the portion of the third adhesive layer 16 on the surface away from the second adhesive layer 15, parallel to the cover plate 12, is bonded to the bottom plate 21. In this case, the recess 161 can be provided only on the surface of the third adhesive layer 16 away from the second adhesive layer 15 and parallel to the cover plate 12. This embodiment does not specifically limit the application of this method.

[0062] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, include: The display panel includes opposing light-emitting and non-light-emitting sides; A cover plate is located on the light-emitting side of the display panel; The grounding layer is located on the non-light-emitting side of the display panel; The first adhesive layer includes a first portion and a second portion connected together; the first portion is located on the periphery of the display panel and the ground layer, and the second adhesive layer is located on the side of the ground layer away from the display panel; the first adhesive layer is electrically connected to the display panel, the cover plate and the ground layer respectively.

2. The display module according to claim 1, characterized in that, Also includes: The second adhesive layer is located on the side of the first adhesive layer away from the display panel, and covers the surface of the first adhesive layer away from the display panel. The elastic modulus of the second adhesive layer is less than that of the first adhesive layer.

3. The display module according to claim 2, characterized in that, Also includes: The third adhesive layer is located on the side of the second adhesive layer that is away from the first adhesive layer; The third adhesive layer is connected to the cover plate and the grounding layer to form a sealed cavity; The first adhesive layer and the second adhesive layer are located in the sealed cavity.

4. The display module according to claim 3, characterized in that, Also includes: The locating pin includes a first end and a second end opposite to each other; the first end is located in any one of the first adhesive layer, the second adhesive layer and the third adhesive layer, and the second end is located on the side of the third adhesive layer away from the second adhesive layer.

5. The display module according to claim 4, characterized in that, The first end of the positioning pin is located on the first adhesive layer and is electrically connected to the first adhesive layer.

6. The display module according to claim 3, characterized in that, The surface of the third adhesive layer away from the second adhesive layer has pits.

7. A display device, characterized in that, include: The display module as described in any one of claims 1 to 6; The middle frame has storage space; The display module is located within the accommodating space.

8. The display device according to claim 7, characterized in that, The mid-frame also includes a positioning hole; the display module also includes a positioning pin, the positioning pin having a first end and a second end opposite to each other; the first end is located on the first adhesive layer, and the second end is located on the positioning hole.

9. The display device according to claim 8, characterized in that, The positioning hole is located on the base plate, and the display device further includes an elastic element, which is located in the positioning hole and connected to the positioning pin.

10. The display device according to claim 9, characterized in that, The positioning pin is electrically connected to the first adhesive layer and to the elastic element.

Images