A chute type vertical pressing mechanism for a multi-layer sheet
The slanted vertical clamping mechanism of the multi-layer thin plate enables rapid and accurate clamping and positioning of PCB boards, solving the problems of hole position misalignment and low production efficiency caused by manual fixing. It is suitable for PCB boards of different sizes, simplifies drive control, and reduces costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NANTONG XINKE INTELLIGENT TECH CO LTD
- Filing Date
- 2026-04-14
- Publication Date
- 2026-05-29
AI Technical Summary
In the existing PCB board drilling process, manual fixing can easily lead to displacement, affecting the accuracy and consistency of the hole positions. Traditional positioning mechanisms are complex and not suitable for PCB boards of different sizes, resulting in low production efficiency and frequent tape replacements, which is costly.
A slanted groove vertical clamping mechanism for multi-layer thin boards is designed. Synchronous clamping and positioning are achieved through a slanted linkage assembly of the main slider, the secondary slider, and the pressure tongue. Elastic elements are used to provide clamping force and simplify drive control. It is suitable for PCB boards of different sizes.
It enables rapid and precise clamping and positioning of PCB boards, improves production cycle time, reduces system complexity and cost, is applicable to all drilling machines on the market, and has strong clamping and positioning reliability and consistency.
Smart Images

Figure CN122121064A_ABST