Light emitting diode with improved soldering strength and method of manufacturing the same
By thickening the Al layer of the solder pads and forming a rough surface, combined with a multi-layer structure, the problem of unreliable soldering is solved, the soldering strength and mechanical stability are improved, the electrical performance is enhanced, the risk of cold solder joints is eliminated, and the packaging production yield is increased.
CN122121366APending Publication Date: 2026-05-29HC SEMITEK ZHEJIANG CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-09
- Publication Date
- 2026-05-29
Smart Images
Figure CN122121366A_ABST
Abstract
The present disclosure provides a light emitting diode with improved soldering strength and a preparation method thereof, and belongs to the technical field of optoelectronic manufacturing. The light emitting diode comprises an epitaxial layer, a passivation layer and a pad, the passivation layer is located on the surface of the epitaxial layer, the pad is located on the surface of the passivation layer away from the epitaxial layer, and the pad is electrically connected with the epitaxial layer through a via of the passivation layer; the pad comprises an Al layer, and the ratio of the thickness of the Al layer to the thickness of the pad is 60% to 70%. The present disclosure can improve the soldering stability of the pad and solder, prevent the occurrence of false soldering problems, and improve the packaging production efficiency.
Need to check novelty before this filing date? Find Prior Art