Display module and display device

Abstract

The display module and the display device are provided, and the display module comprises a display panel, a printed circuit board, and an adhesive layer and a filling layer. The display panel comprises a display part, a bending part and a binding part, the binding part is bent to the backlight side of the display part through the bending part; the printed circuit board is arranged on the backlight side of the display part, and a plurality of functional devices are connected to the side of the printed circuit board away from the display part; the adhesive layer is located on the side of the functional devices away from the display part and extends from the binding part to the end of the printed circuit board away from the binding part; and the filling layer is arranged in the gap between the adhesive layer and the backlight side of the display part.

Description

Technical Field

[0001] This invention relates to the field of display module technology, and in particular to a display module and display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are common display panels widely used in products such as mobile phones, tablets, televisions, and computer monitors. In related technologies, OLED display devices include a display panel and a flexible printed circuit board (FPC), with the FPC bonded to the display panel. FMLOC (Flexible Multi-Layer On Cell) technology is now widely used in the field of OLED display devices, effectively reducing the bezel width of products.

[0003] For OLED display panels, after the printed circuit board and functional components are prepared, the adhesive layer is finally attached to the functional components to complete the display module. However, for products with display devices larger than 10 inches, such as tablets, TVs, and computer monitors, due to the different heights of the functional components, the gap between the adhesive layer and the backlight side of the display unit deforms during the pressing of the display part. When the pressing ends, the deformation rebounds, which can easily produce abnormal noise. Summary of the Invention

[0004] The purpose of this invention is to provide a display module and display device to solve the problem of abnormal noise occurring during the pressing of the display panel in the display module. The specific technical solution is as follows:

[0005] A first aspect of this application provides a display module, comprising:

[0006] The display panel includes a display part, a bending part, and a binding part, wherein the binding part is bent to the backlight side of the display part via the bending part;

[0007] A printed circuit board is disposed on the backlight side of the display unit, and multiple functional devices are connected to the side of the printed circuit board away from the display unit.

[0008] An adhesive layer is located on the side of the functional device away from the display portion and extends from the bonding portion to the end of the printed circuit board away from the bonding portion;

[0009] A filler layer is disposed in the gap between the adhesive layer and the backlight side of the display unit.

[0010] In some embodiments, the functional devices include heights ranging from one end of the printed circuit board to the other end away from the printed circuit board, and a plurality of the functional devices are arranged in descending order of height, with the arrangement direction along the side of the printed circuit board closer to the bonding portion to the side away from the bonding portion.

[0011] In some embodiments, on the side of the printed circuit board away from the bonding portion, the side of the fill layer away from the display portion is flush with the side of the functional device away from the printed circuit board.

[0012] In some embodiments, the filling layer includes a first insulating layer, the first insulating layer having an array of through holes that penetrate any surface of the first insulating layer, and any two through holes communicating with each other inside the first insulating layer.

[0013] In some embodiments, the filling layer includes a first insulating layer, a buffer layer, and a first insulating layer stacked along a direction perpendicular to the backlight side of the display portion;

[0014] Alternatively, the filling layer may include a buffer layer and a first insulating layer stacked along a direction perpendicular to the backlight side of the display section;

[0015] Alternatively, the filling layer may include a first insulating layer and a buffer layer stacked along a direction perpendicular to the backlight side of the display unit. Both the first insulating layer and the buffer layer are provided with arrayed through holes. The through holes penetrate any surface of the first insulating layer and the buffer layer, and any two through holes are interconnected within the first insulating layer and the buffer layer.

[0016] In some embodiments, the filler layer is provided between the printed circuit board and the backlight side of the display.

[0017] In some embodiments, the first insulating layer is an inorganic non-metallic material, and the elastic modulus of the first insulating layer is greater than 200 kPa and less than 2000 kPa.

[0018] In some embodiments, the adhesive layer is provided with the first insulating layer on the side facing the functional device;

[0019] A second insulating layer is provided around the edge of the first insulating layer. The second insulating layer is made of the same material as the first insulating layer and does not have the through hole.

[0020] In some embodiments, a flexible circuit board is provided on the light-emitting side of the printed circuit board and the bonding portion away from the display portion, and the printed circuit board is connected to the bonding portion through the flexible circuit board;

[0021] The gap between the flexible circuit board and the backlight side of the display is provided with the filling layer.

[0022] A second aspect of this application provides a display device comprising the display module described in any one of the first aspects.

[0023] Beneficial effects of the embodiments of the present invention:

[0024] The display module and display device provided in this embodiment of the invention fill the gap between the adhesive layer and the backlight side of the display unit through a filling layer. The filling layer effectively prevents the display unit from undergoing large deformation at the gap during the pressing operation on the light-emitting side of the display unit. During the small deformation recovery and rebound process, the rebound generated is also relatively small. The small rebound reduces the problem of abnormal noise at the gap. At the same time, even if a slight abnormal noise is generated, the presence of the filling layer can effectively absorb the abnormal noise and effectively prevent the abnormal noise from being transmitted to the outside of the display module, thereby reducing the impact on the user experience.

[0025] Of course, implementing any product or method of the present invention does not necessarily require achieving all of the advantages described above at the same time. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other embodiments can be obtained based on these drawings.

[0027] Figure 1 This is a schematic diagram of the backlight side of the display module in some embodiments;

[0028] Figure 2 This is a schematic diagram of the functional component layout of a printed circuit board in some embodiments;

[0029] Figure 3 This is a schematic diagram of the display module in the first embodiment of this application;

[0030] Figure 4 This is a schematic diagram of the display module in the second embodiment of this application;

[0031] Figure 5 This is a schematic diagram of the through-hole layout of the filling layer in one embodiment of this application;

[0032] Figure 6 This is a schematic diagram of the through-hole layout of the filling layer in another embodiment of this application;

[0033] Figure 7 This is a schematic diagram of the cross-sectional shape of a through hole according to an embodiment of this application;

[0034] Figure 8 This is a schematic diagram of the cross-sectional shape of the through hole according to another embodiment of this application;

[0035] Figure 9 This is a schematic diagram of the display module in the third embodiment of this application;

[0036] Figure 10 This is a schematic diagram of the display module in the fourth embodiment of this application;

[0037] Figure 11 This is a schematic diagram of the display module in the fifth embodiment of this application.

[0038] The reference numerals in the attached drawings are as follows: display panel 1, display part 11, bonding part 12, printed circuit board 2, functional device 21, adhesive layer 3, filling layer 4, first insulating layer 41, buffer layer 42, through hole 43, gap 5, flexible circuit board 6. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art based on this application are within the scope of protection of the present invention.

[0040] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0041] As described in the background section above, refer to Figure 1 and Figure 2 As shown, after the fabrication of the printed circuit board 2 (PCB) and the functional devices 21 on the PCB are completed, the adhesive layer 3 is applied to the backlight side of the display unit 11. Figure 1As shown by the dashed line, the adhesive layer 3 is used for electromagnetic shielding, static electricity conduction and discharge protection. However, due to the different heights of the functional components 21, during the operation of pressing the display part 11, the gap between the adhesive layer 3 and the backlight side of the display part 11 deforms at the gap during the pressing process. When the pressing ends, the deformation rebounds, which can easily produce abnormal noise.

[0042] Based on this, refer to Figure 3 , Figure 9 , Figure 10 , Figure 11 As shown, this application embodiment provides a display module, including a display panel 1, the display panel 1 including a display part 11, a bending part (not shown in the figure) and a bonding part 12, the bonding part 12 being bent to the backlight side of the display part 11 through the bending part; a printed circuit board 2, disposed on the backlight side of the display part 11, with a plurality of functional devices 21 connected to the side of the printed circuit board 2 away from the display part 11; an adhesive layer 3, located on the side of the functional devices 21 away from the display part 11, the adhesive layer 3 extending from the bonding part 12 to the end of the printed circuit board 2 away from the bonding part 12; and a filling layer 4, disposed in the gap 5 between the adhesive layer 3 and the backlight side of the display part 11.

[0043] In an exemplary embodiment, the printed circuit board 2 is located on the side of the bonding portion 12 away from the bending portion.

[0044] In an exemplary embodiment, the display panel 1 can be a flexible panel, which is bent to form a display portion 11, a bent portion, and a bonding portion 12. The display panel 1 can also be a rigid panel and a flip-chip film connected to the rigid panel, where the rigid panel forms the display portion 11, and the bent portion and bonding portion 12 are formed by bending the flip-chip film.

[0045] In an exemplary embodiment, the functional device 21 may include an integrated circuit (IC), capacitors, inductors, resistors, etc., without being specifically limited here.

[0046] In an exemplary embodiment, a protective layer is provided on the backlight side of the display unit 11 to provide buffering and heat dissipation for the display unit 11.

[0047] In an exemplary embodiment, the protective layer may be an SCF layer (Super Clean Foam), which may include a foam buffer layer (EMBO layer), a Foam layer, and a Cu (copper foil) layer stacked sequentially on the backlight side of the display unit 11.

[0048] In an exemplary embodiment, the printed circuit board 2 is bonded to the display panel 1 at the bonding point, and the functional device 21 provides the display panel 1 with corresponding control, sensing and other functions.

[0049] In an exemplary embodiment, the adhesive layer 3 can be a single-sided adhesive, such as a single-sided adhesive with polyethylene terephthalate as the substrate.

[0050] In an exemplary embodiment, the filling layer 4 has a certain elasticity to reduce the deformation of the display panel 1 during the pressing of the display part 11; or the filling layer 4 may also have a certain strength to effectively reduce the deformation of the display panel 1 during the pressing of the display part 11.

[0051] In an exemplary embodiment, the filler layer 4 can be made of an inorganic non-metallic material. Inorganic non-metallic materials can effectively prevent damage from water and oxygen.

[0052] In this embodiment, the gap between the adhesive layer 3 and the backlight side of the display unit 11 is filled by the filling layer 4. The filling layer 4 effectively prevents the display unit 11 from undergoing large deformation at the gap 5 during the pressing operation on the light-emitting side of the display unit 11. Correspondingly, during the small deformation reset and rebound process, the small rebound reduces the problem of abnormal noise at the gap 5. At the same time, even if a slight abnormal noise is generated, the presence of the filling layer 4 can effectively absorb the abnormal noise and effectively prevent the abnormal noise from being transmitted to the outside of the display module, thereby reducing the impact on the user experience.

[0053] In some embodiments, reference Figure 3 and Figure 4 As shown, the functional device 21 has a height from one end toward the printed circuit board 2 to the other end away from the printed circuit board 2. Multiple functional devices 21 are arranged in descending order of height, and the arrangement direction is along the side of the printed circuit board 2 near the bonding portion 12 to the side away from the bonding portion 12.

[0054] In some alternative embodiments, the printed circuit board 2 is located on the side of the bonding portion 12 away from the bending portion, and the arrangement direction can also be along the side of the printed circuit board 2 away from the bonding portion 12 to the side close to the bonding portion 12.

[0055] In some alternative embodiments, the printed circuit board 2 may also be arranged side by side with the bonding part 12 on one side of the bent part. The arrangement direction may be along the side of the printed circuit board 2 close to the bonding part 12 to the side away from the bonding part 12, or along the side of the printed circuit board 2 away from the bonding part 12 to the side close to the bonding part 12. It can be set according to the specific position of the printed circuit board 2 relative to the bonding part 12, and no specific limitation is made here.

[0056] It is understandable that traces are provided in the printed circuit board 2 to realize the control of the functional device 21 and the display panel 1. When the functional device 21 is arranged from large to small in height, the internal traces of the printed circuit board 2 can also be adapted accordingly.

[0057] In this embodiment, by arranging the functional components 21 according to their height from largest to smallest, the adhesive layer 3 can adhere to the height gradient of the functional components 21 during the bonding process, reducing the possibility of gaps between the side of the functional component 21 away from the printed circuit board 2 and the adhesive layer 3. That is, the adhesive layer 3 can effectively bond the side of the functional component 21 away from the printed circuit board 2. After pressing the light-emitting side of the display section 11 and after pressing, it reduces the abnormal noise caused by the bonding and separation of the functional component 21 and the adhesive layer 3. For example, if a lower functional component 21 is placed between two higher functional components 21, the adhesive layer 3 can bond the higher functional component... 21. Effective bonding is achieved. During the pressing process on the light-emitting side of the display unit 11, the display unit 11 deforms, causing the lower-height functional device 21 to approach and bond with the adhesive layer 3. After pressing, the lower-height functional device 21 separates from the adhesive layer 3, resulting in a sticking and unsticking noise. The functional devices 21 are arranged from high to low in height. During the bonding process, the adhesive layer 3 allows for a smooth transition of the functional devices 21, which is beneficial for bonding the adhesive layer according to the height gradient. Correspondingly, the adhesive layer 3 also has a smooth transition of the functional devices 21 from high to low, effectively reducing the sticking and unsticking situation caused by the bonding and separation of the functional devices 21 and the adhesive layer 3 during the pressing of the display unit 11, further reducing the possibility of abnormal noise.

[0058] Furthermore, the arrangement direction extends from the side of the printed circuit board 2 closest to the bonding portion 12 to the side furthest from the bonding portion 12. That is, the height of the functional device 21 is lowest on the side of the printed circuit board 2 furthest from the bonding portion 12, which can effectively reduce the thickness of the filling layer 4 on that side, thus helping to reduce the overall thickness of the display module and achieve a thinner and lighter design.

[0059] It should be noted that the reference Figure 4 As shown, after the functional components 21 are arranged from largest to smallest in height and bonded together using the adhesive layer 3, a filling layer 4 can be provided in the gap between the adhesive layer 3 and the backlight side of the display unit 11, or the filling layer 4 can be omitted. Both methods can achieve the effect of eliminating abnormal noise. Relatively speaking, providing a filling layer 4 in the gap between the adhesive layer 3 and the backlight side of the display unit 11 will have a better effect in eliminating abnormal noise.

[0060] In some embodiments, reference Figure 3 , Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, the filling layer 4 includes a first insulating layer 41, which has an array of through holes 43. The through holes 43 penetrate any surface of the first insulating layer 41, and any two through holes 43 are interconnected inside the first insulating layer 41 to form a three-dimensional mesh channel structure.

[0061] In an exemplary embodiment, an XYZ spatial coordinate system is established, and the insulating layer is placed after the spatial coordinate system is established, so that any two through holes 43 can be interconnected in the three XYZ directions.

[0062] In an exemplary embodiment, the paths of the through holes 43 in any two directions can be adopted as follows: Figure 5 The perpendicular intersection path shown can also be adopted as follows: Figure 6 The intersection path of the straight line and the arc shown can also be the intersection path of the arc and the arc (not shown in the figure), and no specific limitation is made here.

[0063] In an exemplary embodiment, the aperture (inner diameter) of the through hole 43 may be less than or equal to 0.05 mm.

[0064] In an exemplary embodiment, the cross-sectional shape of the through hole 43 can be as follows: Figure 7 The pentagon shown can also be as follows: Figure 8 The rectangle shown can also be a circle, triangle, or other polygon; no specific limitation is made here.

[0065] In an exemplary embodiment, the first insulating layer 41 may be made of polyethylene terephthalate (PET).

[0066] In this embodiment, the first insulating layer 41 is used to fill the gap between the adhesive layer 3 and the backlight side of the display part 11. During the pressing process, the deformation of the display panel 1 at the gap is effectively reduced, which correspondingly reduces the abnormal noise generated during the deformation rebound process. Furthermore, the presence of the through hole 43 provides multiple channels for the abnormal noise to propagate. When the display panel 1 is pressed, it deforms. After the press is released, the slight abnormal noise generated during the deformation rebound process propagates in multiple channels. Sound is generated by vibration, that is, the abnormal noise itself has kinetic energy. During the propagation of the abnormal noise in multiple channels, the side walls of multiple channels bounce the abnormal noise and continue to propagate. During the bounce of the abnormal noise, the side walls of multiple channels gradually "absorb" the kinetic energy of the abnormal noise and convert it into heat energy acting on the side walls of the channels. In other words, during the back-and-forth propagation of the abnormal noise in multiple channels, multiple channels complete the "absorption" of the abnormal noise, which further effectively reduces the propagation of the abnormal noise to the outside of the filling layer 4, and also reduces the impact of the abnormal noise on the user's experience.

[0067] In some embodiments, reference Figure 3 , Figure 9 , Figure 10 and Figure 11As shown, on the side of the printed circuit board 2 away from the bonding portion 12, the side of the fill layer 4 away from the display portion 11 is flush with the side of the functional device 21 away from the printed circuit board 2.

[0068] In this embodiment, the functional devices 21 are arranged on the printed circuit board 2 in descending order away from the bonding portion 12, achieving a smooth transition in height from high to low. The adhesive layer 3 covers and bonds the side of the functional devices 21 away from the printed circuit board 2, ensuring a smooth transition from high to low. This effectively reduces the possibility of loose adhesion between some functional devices 21 and the adhesive layer 3. On the side of the printed circuit board 2 away from the bonding portion 12, the side of the filler layer 4 away from the display portion 11 is flush with the side of the lowest-height functional device 21 away from the printed circuit board 2, allowing the adhesive layer 3 to bond to the backlight side of the display portion 11 through the filler layer 4. This effectively prevents the adhesive layer 3 from extending towards the backlight side of the display portion 11. Furthermore, during the preparation of the filler layer 4, both the backlight side of the filler layer 4 and the backlight side away from the display portion 11 are flat, meaning the upper and lower surfaces of the filler layer 4 are flat, facilitating its preparation.

[0069] In some embodiments, the first insulating layer 41 is made of inorganic non-metallic material, and the elastic modulus of the first insulating layer 41 is greater than 200 kPa and less than 2000 kPa.

[0070] In an exemplary embodiment, the first insulating layer 41 is an inorganic non-metallic composite flexible material.

[0071] Understandably, the elastic modulus, also known as Young's modulus, is a value used to measure a material's ability to resist deformation during the elastic deformation stage. The larger the value, the "rigid" the material; the smaller the value, the "soft" the material. The elastic modulus can be expressed as the ratio of the stress (force per unit area) on a material to the deformation (relative deformation) within the applicable range of Hooke's Law.

[0072] In this embodiment, when the main body of the filling layer 4 is the first insulating layer 41, the elastic modulus of the first insulating layer 41 is greater than 200 kPa and less than 2000 kPa, so that the first insulating layer 41 has a certain degree of "softness". When the light-emitting side of the display panel 1 is pressed, the first insulating layer 41 can effectively absorb the pressing stress, reduce the stress transmission to the adhesive layer 3, effectively reduce the abnormal noise generated during the stress release and elastic deformation reset process after elastic deformation.

[0073] In some alternative embodiments, the elastic modulus of the first insulating layer 41 can also be very large so that the first insulating layer 41 has sufficient stiffness. When the light-emitting side of the display panel 1 is pressed, the stiffness of the first insulating layer 41 prevents the deformation of the display panel 1 from being transmitted to the backlight side, which can also reduce the occurrence of elastic deformation and the abnormal noise generated during the elastic deformation reset process.

[0074] In some embodiments, reference Figure 9 As shown, the filling layer 4 includes a first insulating layer 41, a buffer layer 42, and a first insulating layer 41 stacked along a direction perpendicular to the backlight side of the display unit 11; or the filling layer 4 includes a buffer layer 42 and a first insulating layer 41 stacked along a direction perpendicular to the backlight side of the display unit 11; or the filling layer 4 includes a first insulating layer 41 and a buffer layer 42 stacked along a direction perpendicular to the backlight side of the display unit 11. The first insulating layer 41 and the buffer layer 42 are each provided with arrayed through holes 43. The through holes 43 penetrate any surface of the first insulating layer 41 and the buffer layer 42, and any two through holes 43 are interconnected inside the first insulating layer 41 and the buffer layer 42.

[0075] In an exemplary embodiment, the buffer layer 42 may be made of foam material, and it is understood that the buffer layer 42 needs to have a certain degree of softness.

[0076] It is understandable that when the filling layer 4 includes the buffer layer 42, the elastic modulus of the first insulating layer 41 can be slightly larger. In this embodiment, the buffer layer 42 is mainly used to absorb the stress on the light-emitting side of the display panel 1. Accordingly, the first insulating layer 41 can be relatively harder.

[0077] In an exemplary embodiment, the filling layer 4 may include a first insulating layer 41 and a buffer layer 42 stacked along a direction perpendicular to the backlight side of the display unit 11, or it may include a buffer layer 42 and a first insulating layer 41 stacked along a direction perpendicular to the backlight side of the display unit 11, or it may include a first insulating layer 41 and a buffer layer 42 stacked along a direction perpendicular to the backlight side of the display unit 11. No specific limitation is made here.

[0078] In an exemplary embodiment, the elastic modulus of the first insulating layer 41 is greater than that of the buffer layer 42.

[0079] In an exemplary embodiment, the diameter of the through hole 43 may be less than 0.05 mm.

[0080] In this embodiment, the gap between the adhesive layer 3 and the backlight side of the display section 11 is first filled using the first insulating layer 41 and the buffer layer 42. During the pressing process, this effectively reduces the deformation of the display panel 1 at the gap, thereby reducing the abnormal noise generated during the deformation rebound process. Furthermore, during the pressing process, the hardness of the first insulating layer 41 effectively prevents the elastic deformation of the display panel 1 from being transmitted to the adhesive layer 3. Utilizing the buffering effect of the buffer layer 42, even if the deformation is transmitted to the buffer layer 42, the buffer layer 42 can effectively absorb the pressing stress, reducing the transmission of deformation to the adhesive layer 3. Consequently, this effectively reduces the stress release and elastic deformation recovery process after elastic deformation. The presence of through-hole 43 provides multiple channels for the transmission of abnormal noises. When the display panel 1 is pressed and deformed, the small abnormal noise generated during the rebound process after the press is released propagates in multiple channels. The side walls of multiple channels bounce off the abnormal noise and continue to propagate. During the bounce process, the side walls of multiple channels gradually "absorb" the kinetic energy of the abnormal noise and convert it into heat energy acting on the side walls of the channels. In other words, during the back-and-forth propagation of the abnormal noise in multiple channels, multiple channels complete the "absorption" of the abnormal noise, further effectively reducing the propagation of the abnormal noise to the outside of the filling layer 4, and also reducing the impact of the abnormal noise on the user's experience.

[0081] It is understandable that, whether the filling layer 4 includes the first insulating layer 41 or the filling layer 4 includes the first insulating layer 41 and the buffer layer 42, the setting of the through holes 43 makes one of the functions of the filling layer 4 equivalent to a "sound insulation board". The multiple through holes 43 form a transmission channel to scatter and attenuate abnormal noise, and the sidewalls of the through holes 43 absorb the dispersed abnormal noise to achieve the effect of "noise reduction".

[0082] In some embodiments, reference Figure 10 As shown, a filler layer 4 is bonded between the printed circuit board 2 and the backlight side of the display unit 11.

[0083] In an exemplary embodiment, the filling layer 4 between the printed circuit board 2 and the backlight side of the display unit 11 may include a first insulating layer 41, or it may include a first insulating layer 41 and a buffer layer 42.

[0084] In an exemplary embodiment, the filling layer 4 disposed in the gap between the adhesive layer 3 and the backlight side of the display unit 11 includes only the first insulating layer 41. Correspondingly, the filling layer 4 between the printed circuit board 2 and the backlight side of the display unit 11 also includes only the first insulating layer 41. The filling layer 4 disposed in the gap between the adhesive layer 3 and the backlight side of the display unit 11 includes the first insulating layer 41 and the buffer layer 42. Correspondingly, the filling layer 4 between the printed circuit board 2 and the backlight side of the display unit 11 also includes the first insulating layer 41 and the buffer layer 42.

[0085] It is understood that the filler layer 4 between the printed circuit board 2 and the backlight side of the display unit 11 also has the through hole 43 described in the above embodiment.

[0086] It should be noted that, regardless of whether the filling layer 4 includes the first insulating layer 41 or includes the first insulating layer 41 and the buffer layer 42, neither the first insulating layer 41 nor the buffer layer 42 itself has adhesive properties. Therefore, double-sided adhesive can be provided on the opposite sides of the filling layer 4. That is, double-sided adhesive is applied to the surface of the filling layer 4 facing the printed circuit board 2 and the backlight side of the display unit 11. The double-sided adhesive is used to bond the printed circuit board 2 to the filling layer 4, as well as to bond the filling layer 4 to the backlight side of the display unit 11, thereby effectively fixing the printed circuit board 2.

[0087] In some embodiments, reference Figure 10 As shown, the filling layer 4 between the printed circuit board 2 and the backlight side of the display unit 11 can be connected to the filling layer 4 in the gap between the adhesive layer 3 and the backlight side of the display unit 11.

[0088] In this embodiment, by adding a filler layer 4 between the printed circuit board 2 and the backlight side of the display unit 11, and the filler layer 4 array having a plurality of through holes 43, during the pressing process on the light-emitting side of the display unit 11 corresponding to the position of the printed circuit board 2, the filler layer 4 absorbs the pressing stress, effectively preventing the pressing stress from being transmitted to the adhesive layer 3 through the printed circuit board 2, reducing the possibility of the adhesive layer 3 and the functional device 21 sticking and separating at the same time, further reducing the occurrence of abnormal noise. Furthermore, in the case of a small amount of abnormal noise, by adding more and longer abnormal noise propagation channels on the backlight side of the printed circuit board 2 and the display unit 11, that is, the propagation path of abnormal noise in the through holes 43 is more and longer, which is conducive to the sidewalls of the through holes 43 absorbing as much abnormal noise as possible.

[0089] In some embodiments, a filling layer 4 is attached to the side of the adhesive layer 3 facing the functional device 21, and a second insulating layer (not shown in the figure) is provided around the edge of the filling layer 4. The second insulating layer is made of the same material as the first insulating layer 41, and the second insulating layer does not have a through hole 43.

[0090] In an exemplary embodiment, the material of the second insulating layer may also be polyethylene terephthalate.

[0091] In this embodiment, a filling layer 4 is first provided on the side of the adhesive layer 3 facing the functional device 21, and the filling layer 4 array is provided with a number of through holes 43. During the pressing process on the light-emitting side of the display part 11 corresponding to the printed circuit board 2, the possibility of the adhesive layer 3 and the functional device 21 sticking and separating is reduced, further reducing the occurrence of abnormal noise. Furthermore, in the case of a small amount of abnormal noise, more and longer abnormal noise propagation channels are added on the side of the adhesive layer 3 facing the functional device 21, that is, the propagation path of the abnormal noise in the through holes 43 is more and longer, which is conducive to the sidewall of the through holes 43 absorbing as much abnormal noise as possible. A second insulating layer without through holes is provided around the edge of the filling layer 4. After a small amount of abnormal noise is propagated in the propagation channel formed by the through holes 43 and absorbed by the sidewall of the through holes 43, the remaining abnormal noise will be blocked by the second insulating layer, so that the abnormal noise is absorbed as much as possible in the propagation channel formed by the through holes 43, effectively preventing the abnormal noise from spreading out from the propagation channel and affecting the user experience.

[0092] In an exemplary embodiment, the filling layer 4 disposed on the side of the adhesive layer 3 facing the functional device 21 may include a first insulating layer 41, or may include a first insulating layer 41, a buffer layer 42 and a first insulating layer 41 stacked together, or may include a buffer layer 42 and a first insulating layer 41 stacked together, or may include a first insulating layer 41 and a buffer layer 42 stacked together. In this embodiment, the filling layer 4 includes a first insulating layer 41. It can be understood that by disposing of a first insulating layer 41 as a filling layer 4 on the side of the adhesive layer 3 facing the functional device 21, the design of the buffer layer 42 is reduced. This effectively alleviates the problem of abnormal noise while avoiding increasing the thickness of the display module, which is conducive to achieving a thinner and lighter design of the product.

[0093] In some embodiments, reference Figure 4 , Figure 9 , Figure 10 and Figure 11 As shown, a flexible circuit board 6 is provided on the side of the printed circuit board 2 and the bonding part 12 away from the light-emitting side of the display part 11. The printed circuit board 2 is connected to the bonding part 12 through the flexible circuit board 6. A filling layer 4 is provided in the gap between the flexible circuit board 6 and the backlight side of the display part 11.

[0094] In an exemplary embodiment, the flexible circuit board 6 and the bonding part 12 are connected by FOF (Flex On Film, a technology for bonding flexible circuit boards and flexible films), and the flexible circuit board 6 and the printed circuit board 2 are also connected by FOF bonding.

[0095] It is understood that the printed circuit board 2 is connected to the bonding part 12 through the flexible circuit board 6, that is, the printed circuit board 2 is connected to the display panel 1 through the flexible circuit board 6. This connection can be at least one of electrical connection and signal connection. Correspondingly, multiple functional devices 21 are respectively connected to the display panel 1.

[0096] In an exemplary embodiment, the filling layer 4 between the flexible circuit board 6 and the backlight side of the display unit 11 may include a first insulating layer 41, or may include a first insulating layer 41, a buffer layer 42 and a first insulating layer 41 stacked together, or may include a buffer layer 42 and a first insulating layer 41 stacked together, or may include a first insulating layer 41 and a buffer layer 42 stacked together, without being specifically limited here.

[0097] In this embodiment, by connecting the printed circuit board 2 and the display panel 1 through the flexible circuit board 6, and providing a filling layer 4 in the gap between the flexible circuit board 6 and the backlight side of the display part 11, a smooth transition of the adhesive layer 3 in the gap between the printed circuit board 2 and the bonding part 12 is effectively achieved. This eliminates the need for bending of the adhesive layer 3 and the flexible circuit board 6 in the gap between the printed circuit board 2 and the bonding part 12, effectively preventing the adhesive layer 3 in the gap from sticking and opening due to unevenness when the corresponding light-emitting side of the display panel 1 is pressed. In other words, it effectively avoids abnormal noise in the gap. Even if slight elastic deformation occurs during the pressing process, and a small amount of abnormal noise occurs during the elastic deformation reset process, the abnormal noise will be absorbed by the filling layer 4 on the backlight side of the flexible circuit board 6 and the display part 11, reducing the impact on the user experience.

[0098] In some embodiments, reference Figure 10 As shown, the filling layer 4 between the printed circuit board 2 and the backlight side of the display unit 11 can be connected to the filling layer 4 in the gap between the flexible circuit board 6 and the backlight side of the display unit 11.

[0099] In this embodiment, by adding a filling layer 4 between the flexible circuit board 6 and the backlight side of the display unit 11, and the filling layer 4 array having a plurality of through holes 43, during the pressing process on the light-emitting side of the display unit 11 corresponding to the position of the flexible circuit board 6, the filling layer 4 absorbs the pressing stress, effectively preventing the pressing stress from passing through the gap between the flexible circuit board 6 and the backlight side of the display unit 11, which would cause large elastic deformation of the display unit 11 and generate abnormal noise during the elastic deformation recovery and rebound process. Furthermore, in the case of a small amount of abnormal noise, by adding more and longer abnormal noise propagation channels on the backlight side of the flexible circuit board 6 and the display unit 11, that is, the abnormal noise propagation path in the through holes 43 is more and longer, which is conducive to the sidewalls of the through holes 43 absorbing as much abnormal noise as possible.

[0100] In some embodiments, reference Figure 3 , Figure 9 , Figure 10 and Figure 11 As shown, the gap between the adhesive layer 3 and the backlight side of the display part 11 also includes: the gap between the adhesive layer 3 and the flexible circuit board 6, and the gap between the adhesive layer 3 and the bonding part 12. The gaps are filled with a filling layer 4, so that the adhesive layer 3 forms a smooth transition and achieves a tight overall fit.

[0101] Based on the same inventive concept, this application provides a display device, including the display module provided in any of the above embodiments. In some examples, the display device can be a large-sized television, monitor, laptop, etc., or it can be any product or component such as a small-sized mobile phone or tablet computer. This embodiment does not specifically limit it in this way.

[0102] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in detail for the sake of brevity.

[0103] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0104] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description.

[0105] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention are included within the scope of protection of the present invention.

Claims

1. A display module, characterized in that, include: The display panel includes a display part, a bending part, and a binding part, wherein the binding part is bent to the backlight side of the display part via the bending part; A printed circuit board is disposed on the backlight side of the display unit, and multiple functional devices are connected to the side of the printed circuit board away from the display unit. An adhesive layer is located on the side of the functional device away from the display portion and extends from the bonding portion to the end of the printed circuit board away from the bonding portion; A filler layer is disposed in the gap between the adhesive layer and the backlight side of the display unit.

2. The display module according to claim 1, characterized in that, The functional components include components with heights ranging from one end toward the printed circuit board to the other end away from the printed circuit board. A plurality of the functional components are arranged in descending order of height, and the arrangement direction is along the side of the printed circuit board closest to the bonding portion to the side away from the bonding portion.

3. The display module according to claim 2, characterized in that, On the side of the printed circuit board away from the bonding portion, the side of the fill layer away from the display portion is flush with the side of the functional device away from the printed circuit board.

4. The display module according to claim 1, characterized in that, The filling layer includes a first insulating layer, which has an array of through holes. The through holes penetrate any surface of the first insulating layer, and any two through holes are interconnected inside the first insulating layer.

5. The display module according to claim 1, characterized in that, The filling layer includes a first insulating layer, a buffer layer, and a first insulating layer stacked along a direction perpendicular to the backlight side of the display unit; Alternatively, the filling layer may include a buffer layer and a first insulating layer stacked along a direction perpendicular to the backlight side of the display section; Alternatively, the filling layer may include a first insulating layer and a buffer layer stacked along a direction perpendicular to the backlight side of the display unit. Both the first insulating layer and the buffer layer are provided with arrayed through holes. The through holes penetrate any surface of the first insulating layer and the buffer layer, and any two through holes are interconnected within the first insulating layer and the buffer layer.

6. The display module according to claim 4 or 5, characterized in that, The filler layer is bonded between the printed circuit board and the backlight side of the display unit.

7. The display module according to claim 4, characterized in that, The first insulating layer is made of inorganic non-metallic material, and the elastic modulus of the first insulating layer is greater than 200 kPa and less than 2000 kPa.

8. The display module according to claim 4 or 5, characterized in that, The adhesive layer is bonded to the side facing the functional device with the filling layer; A second insulating layer is provided around the edge of the filling layer. The second insulating layer is made of the same material as the first insulating layer, and the second insulating layer does not have the through hole.

9. The display module according to claim 4 or 5, characterized in that, The printed circuit board and the bonding portion are provided with a flexible circuit board on the light-emitting side away from the display portion, and the printed circuit board is connected to the bonding portion through the flexible circuit board; The gap between the flexible circuit board and the backlight side of the display is provided with the filling layer.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 9.

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