Prediction device and prediction method

Abstract

The present invention relates to a prediction device and a prediction method. The prediction device includes: an acquisition unit that acquires, from a substrate processing apparatus, captured image data having an image captured by a camera and a supply condition of a processing liquid corresponding to the captured image data, the substrate processing apparatus including a substrate holding unit that holds and rotates a substrate, a liquid supply unit that supplies the processing liquid to the substrate from a nozzle, a cup that receives the processing liquid scattered from the rotating substrate, and the camera that captures an image of an upper surface of the cup and the nozzle; a determination unit that determines whether or not the processing liquid is attached to the upper surface of the cup or the nozzle based on the captured image data; a storage unit that stores association data in which a determination result from the determination unit and the supply condition of the processing liquid are associated with each other; and a prediction unit that predicts, based on the association data, whether or not the processing liquid is attached to the upper surface of the cup or the nozzle in a case where a scheduled recipe scheduled to be executed by the substrate processing apparatus is executed.

Description

Technical Field

[0001] This disclosure relates to prediction devices and prediction methods. Background Technology

[0002] Traditionally, techniques are known for supplying a processing liquid from a nozzle to a rotating substrate to perform liquid treatment on such a substrate. In such liquid treatment, for example, a rotating ring is arranged around the outer periphery of the rotating substrate, thereby reducing or preventing the spread of the processing liquid over a wide area inside the liquid treatment unit (see Japanese Patent 7438015). Summary of the Invention

[0003] This disclosure provides techniques for reducing or preventing spilled processing liquid from adhering to the upper surface of a nozzle or cup during liquid handling.

[0004] A prediction apparatus according to one aspect of this disclosure includes an acquisition unit, a determination unit, a storage unit, and a prediction unit. The acquisition unit acquires image data including images captured by a camera and corresponding supply conditions of a processing liquid from a substrate processing apparatus. The substrate processing apparatus includes: a substrate holding unit for holding and rotating a substrate; a liquid supply unit for supplying the processing liquid from a nozzle to the substrate; a cup for receiving processing liquid spilled from the rotating substrate; and the camera for capturing images of the upper surface of the cup and the nozzle. The determination unit determines whether the processing liquid adheres to the upper surface of the cup or the nozzle based on the captured image data. The storage unit stores correlation data in which the determination result from the determination unit is correlated with the supply conditions of the processing liquid. The prediction unit predicts, based on the correlation data, whether the processing liquid adheres to the upper surface of the cup or the nozzle when executing a scheduled formula that is scheduled to be executed by the substrate processing apparatus.

[0005] According to this disclosure, the amount of treatment fluid splashed during liquid handling can be reduced or prevented from adhering to the upper surface of the nozzle or cup. Furthermore, the effects described herein are not necessarily limiting and can be any effect as described in this disclosure. Attached Figure Description

[0006] Figure 1 This is a diagram illustrating an example configuration of a substrate processing system according to an embodiment.

[0007] Figure 2 This is a plan view illustrating an example configuration of a substrate processing apparatus according to an embodiment.

[0008] Figure 3 This is a cross-sectional view illustrating an example configuration of a liquid processing unit according to an embodiment.

[0009] Figure 4 This is a top view illustrating an example configuration of a liquid processing unit according to an embodiment.

[0010] Figure 5 This is a diagram illustrating an example of the functional configuration of a prediction device according to an embodiment.

[0011] Figure 6 This is a diagram that schematically illustrates an example of a data configuration for associated data according to an embodiment.

[0012] Figure 7 This is a diagram used to illustrate the determination process according to an embodiment.

[0013] Figure 8 This is a diagram used to illustrate the determination process according to an embodiment.

[0014] Figure 9 This is a flowchart illustrating an example of a process for preparing associated data performed by a prediction device according to an embodiment.

[0015] Figure 10 This is a flowchart illustrating an example of a prediction process performed by a prediction device according to an embodiment. Detailed Implementation

[0016] In the following description, one or more embodiments of the prediction apparatus and prediction method disclosed in this application will be detailed with reference to one or more accompanying drawings. However, this disclosure is not limited to the one or more embodiments illustrated below. Furthermore, the drawings are illustrative, and it should be noted that the relationships between the dimensions of the various elements, the ratios of the various elements, etc., may differ from reality. Additionally, components with different dimensional relationships and ratios may be included between the drawings.

[0017] Traditionally, techniques are known for supplying a processing liquid from a nozzle to a rotating substrate to perform liquid treatment on such a substrate. In such liquid treatment, for example, a rotating ring is arranged around the outer periphery of the rotating substrate to reduce or prevent the spread of the processing liquid over a wide area inside the liquid treatment unit.

[0018] On the other hand, in conventional technologies, when new processing formulations are introduced (e.g., to perform liquid processing under new processing conditions), liquid may be accidentally splashed from the substrate, resulting in the processing liquid adhering to the upper surface of the nozzle or cup.

[0019] Then, the processing liquid adhering to the upper surface of the nozzle or cup may contaminate the substrate or atmosphere in such equipment, thereby reducing the output of liquid processing.

[0020] Therefore, it is desirable to achieve a technology that overcomes one or more of the problems mentioned above and is able to reduce or prevent the spread of treatment liquid during liquid handling from adhering to the upper surface of the nozzle or cup (e.g., by introducing new treatment formulations, etc.).

[0021] <Configuration of the substrate processing system>

[0022] First, refer to Figure 1 The configuration of the substrate processing system 1 according to the embodiment is described. Figure 1 This is a diagram illustrating an example configuration of the substrate processing system 1 according to an embodiment. Figure 1 As illustrated, the substrate processing system 1 according to the embodiment includes a substrate processing apparatus 2 and a prediction device 3.

[0023] The substrate processing device 2 and the prediction device 3 are connected to the network N and can communicate with each other through the network N. As one aspect of such a network N, any kind of communication network can be used, such as mobile communication (e.g., mobile phones), the Internet, local area networks (LANs), and virtual private networks (VPNs), regardless of whether the connection is wired or wireless.

[0024] Substrate processing equipment 2 processes semiconductor wafers W (see [reference], which are substrates to be processed). Figure 2 (Hereinafter referred to as wafer W) is an apparatus that performs substrate processing. The prediction device 3 is, for example, a computer such as a server computer. The prediction device 3 predicts, for example, the quality of the processing recipe (hereinafter also referred to as "scheduled recipe") that is scheduled to be executed by the substrate processing apparatus 2.

[0025] Although the following (one or more) embodiments illustrate the case where the prediction device 3 is a single computer as an example, the prediction device 3 can be packaged as a computer system provided by multiple computers.

[0026] Furthermore, despite Figure 1 The examples illustrate a substrate processing system 1 having multiple substrate processing devices 2, but this disclosure is not limited to such examples, and the substrate processing system 1 may have a single substrate processing device 2.

[0027] <Configuration of Substrate Processing Equipment>

[0028] Next, refer to Figure 2 The configuration of the substrate processing apparatus 2 according to the embodiment is described. Figure 2 This is a plan view illustrating an example configuration of the substrate processing apparatus 2 according to an embodiment. In the substrate processing apparatus 2, a predetermined process is performed on the wafer W. Furthermore, to clarify the positional relationships, the X-axis, Y-axis, and Z-axis, which are orthogonal to each other, are defined below, wherein the positive direction of such a Z-axis is provided as a vertically upward direction.

[0029] like Figure 2 As illustrated, the substrate processing apparatus 2 has an infeed / outfeed station 20 and a processing station 30. The infeed / outfeed station 20 and the processing station 30 are arranged adjacent to each other.

[0030] The feed / delivery station 20 includes a hoop placement area 21 and a transport area 22. Multiple hoops H are placed in the hoop placement area 21 to accommodate multiple substrates (in this embodiment, wafers W) in a horizontal position.

[0031] The transfer area 22 is positioned adjacent to the die expansion ring placement area 21 and includes a substrate transfer device 23 and a transport unit 24 within it. The substrate transfer device 23 includes a wafer holding mechanism for holding the wafer W. Furthermore, the substrate transfer device 23 is movable in both the horizontal and vertical directions and can rotate about a vertical axis centered thereon, and performs the transfer of the wafer W between the die expansion ring H and the transport unit 24 by using such a wafer holding mechanism.

[0032] Processing station 30 is configured to be adjacent to transfer zone 22. Processing station 30 includes transfer zone 31 and multiple liquid processing units 32. The multiple liquid processing units 32 are located side by side on both sides of transfer zone 31.

[0033] The transfer area 31 includes a substrate transfer device 33 within it. The substrate transfer device 33 includes a wafer holding mechanism for holding the wafer W. Furthermore, the substrate transfer device 33 is capable of moving in both the horizontal and vertical directions and rotating about a vertical axis that is its center, and performs the transfer of the wafer W between the transfer unit 24 and the liquid processing unit 32 by using such a wafer holding mechanism.

[0034] The liquid processing unit 32 performs a predetermined liquid processing on the wafer W conveyed by the substrate transfer device 33. The detailed configuration of the liquid processing unit 32 will be described later.

[0035] Furthermore, the substrate processing apparatus 2 includes a control device 40. The control device 40 is, for example, a computer connected to a network N, and includes a control unit 41 and a storage unit 42. The storage unit 42 stores programs for controlling various processes performed in the substrate processing apparatus 2. The control unit 41 reads and executes the programs stored in the storage unit 42 to control the operation of the substrate processing apparatus 2.

[0036] Alternatively, such a program can be recorded on a computer-readable storage medium and installed from such a storage medium into the storage unit 42 of the control device 40. Examples of computer-readable storage media include, for example, hard disks (HD), floppy disks (FD), compact discs (CD), magneto-optical discs (MO), and memory cards.

[0037] In the substrate processing apparatus 2 configured as described above, firstly, the substrate transfer device 23 in the feed / delivery station 20 removes the wafer W from the die expansion ring H placed in the die expansion ring placement area 21 and places the removed wafer W on the transport unit 24. The wafer W placed on the transport unit 24 is then removed from the transport unit 24 by the substrate transfer device 33 in the processing station 30 and sent to the liquid processing unit 32.

[0038] The wafer W fed into the liquid processing unit 32 is processed by the liquid processing unit 32, and then delivered from the liquid processing unit 32 by the substrate transfer device 33 and placed on the transport unit 24. Then, the processed wafer W placed on the transport unit 24 is returned by the substrate transfer device 23 to the expansion ring H in the expansion ring placement area 21.

[0039] <Configuration of the liquid handling unit>

[0040] Next, refer to Figure 3 and Figure 4 The configuration of the liquid processing unit 32 according to the embodiment is described. Figure 3 This is a cross-sectional view illustrating an example configuration of the liquid processing unit 32 according to an embodiment, and Figure 4 This is a top view illustrating an example of the configuration of the liquid processing unit 32 according to an embodiment.

[0041] like Figure 3 As illustrated, the liquid processing unit 32 includes a processing chamber 50, a substrate holding unit 60, a liquid supply unit 70, a lower supply unit 80, and a cup body 90. In addition to the units described above, such as... Figure 4 As illustrated, the liquid processing unit 32 also includes a plurality of cameras C.

[0042] The processing chamber 50 is configured to perform processing of the wafer W using a processing liquid within it. The processing chamber 50 houses a substrate holding unit 60, a liquid supply unit 70, a lower supply unit 80, a cup body 90, and multiple cameras C.

[0043] like Figure 3 As illustrated, the fan filter unit (FFU) 51 is attached in such a way that it covers an opening 50a formed in the top wall of the treatment chamber 50. The FFU 51 forms a downward flow in the treatment chamber 50.

[0044] like Figure 4 As illustrated, an inlet / outlet 52 is formed on the sidewall of the processing chamber 50. Wafer W (see...) Figure 3 ) by substrate transfer device 33 (see Figure 2 It is fed into the interior of the processing chamber 50 via the feed / outlet 52, and also discharged from the processing chamber 50 to the outside via the feed / outlet 52.

[0045] A baffle 53 is provided at the location where the feed / outlet 52 is blocked, and is configured to open or close the feed / outlet 52.

[0046] like Figure 3 As illustrated, the substrate holding unit 60 has a rotation shaft 61, a drive mechanism 62, a holding plate 63, and a plurality of holding members 64. The rotation shaft 61 is a hollow tubular member extending in a vertical direction. The rotation shaft 61 is configured to rotate about its central axis Ax.

[0047] Drive mechanism 62 is connected to rotating shaft 61. Drive mechanism 62 is based on the control unit 41 (see...). Figure 2 The drive mechanism 62 is operated by a signal and rotates the rotating shaft 61. The drive mechanism 62 can be, for example, a power source such as an electric motor.

[0048] A retaining plate 63 holds the wafer W horizontally. The retaining plate 63 is, for example, a flat plate that is annular in shape and extends horizontally. That is, a through hole 63a is formed in the center of the retaining plate 63. The inner periphery of the retaining plate 63 is connected to the front end of the rotating shaft 61. Therefore, as the rotating shaft 61 rotates, the retaining plate 63 rotates about the central axis Ax of the rotating shaft 61.

[0049] A holding member 64 is provided on the upper surface of the holding plate 63 to hold the wafer W on its side surface. The wafer W is held horizontally by such a holding member 64 in a state that is slightly separated from the upper surface of the holding plate 63.

[0050] Liquid supply unit 70 supplies processing liquid from the upper side of wafer W to the upper surface of wafer W. Liquid supply unit 70 includes supply sources 71a and 71b, nozzles 72a and 72b, arms 73a and 73b, and drive units 74a and 74b. In the following text, nozzles 72a and 72b will also be collectively referred to as "nozzle 72".

[0051] The supply source 71a includes liquid sources, valves, pumps, etc. (not shown), and supplies various types of processing liquids downward from the nozzle 72a based on signals from the control unit 41.

[0052] The processing liquid supplied from the supply source 71a may be, for example, SC1 (a mixture of ammonia, hydrogen peroxide solution and water), DHF (dilute hydrofluoric acid), BHF (a mixture of hydrofluoric acid and ammonium fluoride) and DSP (a mixture of pure water, sulfuric acid, hydrofluoric acid and hydrogen peroxide solution), etc.

[0053] Furthermore, the processing liquid supplied from the supply source 71a can be, for example, functional water such as ozone water, dilute ammonia water, and hydrogen-rich water. Additionally, the processing liquid supplied from the supply source 71a can be, for example, a drying aid such as (trimethylsilyl)dimethylamine (TMSDMA) and isopropanol (IPA) used in surface modified drying (SMD) technology.

[0054] The supply source 71b includes liquid sources (not illustrated), valves, pumps, etc., and supplies various types of processing liquids downward from the nozzle 72b based on signals from the control unit 41. The processing liquid supplied from the supply source 71b may be, for example, deionized water (DIW).

[0055] Nozzle 72a is attached to the front end of arm 73a. Arm 73a is located in the space above substrate holding unit 60. Drive unit 74a raises or lowers arm 73a in the upward and downward directions based on signals from control unit 41, and rotates arm 73a in the horizontal direction above substrate holding unit 60.

[0056] Nozzle 72b is attached to the front end of arm 73b. Arm 73b is located in the space above substrate holding unit 60. Drive unit 74b raises or lowers arm 73b in the upward and downward directions based on signals from control unit 41, and rotates arm 73b in the horizontal direction above substrate holding unit 60.

[0057] The lower supply unit 80 supplies processing liquid from the lower side of the wafer W to the lower surface of the wafer W. The lower supply unit 80 has a supply source 81 and a nozzle 82.

[0058] The supply source 81 includes liquid sources (not shown), valves, pumps, etc., and supplies various types of processing fluid upward from the nozzle 82 based on signals from the control unit 41. The processing fluid supplied from the supply source 81 is, for example, DIW. The nozzle 82 is inserted into the interior of a through-hole 63a passing through the retaining plate 63 and a rotating shaft 61 having a tubular shape.

[0059] The cup body 90 is positioned outside the holding plate 63 and surrounds the holding plate 63 to recover the processing liquid that spills from the wafer W held by the holding plate 63 of the substrate holding unit 60. The cup body 90 has, for example, a rotating ring 91, a drain cup 92, and an exhaust cup 93. The exhaust cup 93 is an example of a cup.

[0060] The rotating ring 91 is, for example, circular in shape and is positioned around the outside of the wafer W while the wafer W is supported by a plurality of holding members 64. The rotating ring 91 is supported, for example, by the upper surface 63b of the holding plate 63. Therefore, as the rotation shaft 61 rotates, the rotating ring 91 rotates about the central axis Ax of the rotation shaft 61.

[0061] Furthermore, a gap exists between the rotating ring 91 and the holding plate 63, allowing the processing liquid supplied to the wafer W to flow out through this gap to the outside of the rotating ring 91 and the holding plate 63. Additionally, the rotating ring 91 is not limited to being configured to rotate together with the holding plate 63, and can be fixed within the processing chamber 50.

[0062] The drain cup 92 is positioned outside the rotating ring 91, surrounding the rotating ring 91. The drain cup 92 forms a cylindrical space communicating with the gap between the rotating ring 91 and the retaining plate 63, and collects the processed liquid flowing out from such gap. A conduit located outside the liquid processing unit 32 for discharging the collected processed liquid to the drain unit DR is connected to the lower end of the drain cup 92.

[0063] An exhaust cup 93 is positioned outside the drain cup 92, surrounding it. The exhaust cup 93 forms a cylindrical space between itself and the drain cup 92, wherein this space is adjusted to a negative pressure. A conduit connected to the lower end of the exhaust cup 93 is used to draw in atmospheric air near the rotating ring 91 and discharge it to the exhaust unit EXH located outside the liquid handling unit 32.

[0064] like Figure 4 The illustrated plurality of cameras C capture images of the nozzle 72 and the upper surface 93a of the exhaust cup 93. (One or more) cameras C are, for example, (one or more) three-dimensional cameras. That is, (one or more) cameras C acquire three-dimensional images as three-dimensional information for indicating the situation in the liquid processing unit 32.

[0065] In addition, multiple cameras C include camera C1 and camera C2. Camera C1 captures images of, for example, the area adjacent to nozzle 72a on the upper surface 93a of the exhaust cup 93. For example, the field of view C1a of camera C1 includes the movable range of nozzle 72a.

[0066] Camera C2 captures images of, for example, the area adjacent to nozzle 72b on the upper surface 93a of exhaust cup 93. For example, the field of view C2a of camera C2 includes the movable range of nozzle 72b.

[0067] <Prediction Device Configuration>

[0068] Next, refer to Figures 5 to 8 The configuration of the prediction device 3 according to the embodiment is explained. Figure 5 This is a diagram illustrating an example of the functional configuration of the prediction device 3 according to an embodiment.

[0069] like Figure 5As illustrated, the prediction device 3 includes a communication unit 11, a storage unit 12, and a control unit 13. The storage unit 12 stores programs for controlling various processes performed in the prediction device 3. The control unit 13 reads and executes the programs stored in the storage unit 12 to control the operation of the prediction device 3.

[0070] Furthermore, such a program can be recorded on a computer-readable storage medium and installed from such a storage medium into the storage unit 12 of the predictive device 3. Examples of computer-readable storage media include hard disks, floppy disks, compact disks, magneto-optical disks, and memory cards.

[0071] Furthermore, the prediction device 3 may have an input unit (e.g., a keyboard and mouse, etc.) for receiving various types of operations from an administrator or other user utilizing such a prediction device 3, and a display unit (e.g., a liquid crystal display, etc.) for displaying various types of information.

[0072] [Communication Unit Configuration]

[0073] The communication unit 11 is implemented, for example, by a network interface card (NIC). The communication unit 11 is connected to the network N via a wired or wireless connection, and communicates with the board processing device 2 (see [link to network N]) through the network N. Figure 1 It can send or receive various types of information with other units. For example, communication unit 11 receives information from liquid processing unit 32 (see...). Figure 4 Camera C in ) (see Figure 4 The captured image data and the corresponding supply conditions of the processing liquid.

[0074] [Storage unit configuration]

[0075] Storage unit 12 may be implemented, for example, by semiconductor memory elements (such as random access memory (RAM) or flash memory) or storage devices (such as hard disk, solid-state drive (SSD) or optical disk).

[0076] like Figure 5 As illustrated, storage unit 12 has associated data 121. Associated data 121 is a database used for processing such as predicting the quality of scheduled recipes. Figure 6 This is a diagram that schematically illustrates an example of the data configuration of associated data 121 according to an embodiment.

[0077] Associated data 121 stores the following data: used to indicate data from nozzle 72 (see...) Figure 4 Does the supplied treatment fluid adhere to nozzle 72 or exhaust cup 93 (see...) Figure 4 The upper surface 93a (see) Figure 4The determination of the result is related to the supply conditions of such treatment fluid.

[0078] like Figure 6 As illustrated, in the associated data 121, for example, data on the affinity of the wafer surface, data on the types of processing liquids 1 and 2, data on the supply flow rate of processing liquids 1 and 2, data on the supply location of processing liquids 1 and 2, data on the wafer rotation frequency, and data on the determination of processing liquid adhesion are registered as corresponding to each other.

[0079] Additionally, the treatment fluid 1 is, for example, dispensed from nozzle 72a (see...) Figure 3 To the wafer W (see Figure 3 The processing fluid 2 is supplied from nozzle 72b (see [link]). Figure 3 The processing solution supplied to wafer W.

[0080] The wafer surface affinity data relates to the affinity of the upper surface of the wafer W to water, to which the processing solution is supplied. This wafer surface affinity data, for example, registers whether the upper surface of the wafer W is hydrophilic or hydrophobic.

[0081] The data on the type of processing fluid 1 is related to the type of processing fluid supplied from nozzle 72a. The data on the supply flow rate of processing fluid 1 is related to the supply flow rate of the processing fluid supplied from nozzle 72a.

[0082] The supply position data of the processing liquid 1 is data related to the supply position of the processing liquid supplied from the nozzle 72a. For example, the horizontal distance between the center of the wafer W and the nozzle 72a is recorded in the supply position data of the processing liquid 1.

[0083] The data on the type of processing fluid 2 is related to the type of processing fluid supplied from nozzle 72b. The data on the supply flow rate of processing fluid 2 is related to the supply flow rate of the processing fluid supplied from nozzle 72b.

[0084] The supply position data of the processing fluid 2 is data related to the supply position of the processing fluid supplied from the nozzle 72b. For example, the horizontal distance between the center of the wafer W and the nozzle 72b is recorded in the supply position data of the processing fluid 2. The wafer rotation frequency data is data related to the rotation frequency (rotation speed) of the wafer W to which the processing fluid is supplied.

[0085] Furthermore, in the associated data 121, for example, in each cell of the matrix corresponding to the multiple supply locations of the processing fluid 2 and the multiple rotation frequencies of the wafer W, data is registered that indicates whether the processing fluid adheres to the upper surface 93a of the nozzle 72 or the exhaust cup 93.

[0086] For example, in cases where the supply position of the processing liquid 2 corresponding to the cell and the rotation frequency of the wafer W, and the processing liquid does not adhere to the upper surface 93a of the nozzle 72 or the exhaust cup 93, "OK" is registered in such a cell.

[0087] On the other hand, in cases where the supply position of the processing liquid 2 corresponding to the cell and the rotation frequency of the wafer W, and the processing liquid adheres to the upper surface 93a of the nozzle 72 or the exhaust cup 93, "NG" is registered in such a cell.

[0088] Furthermore, if the affinity data of the wafer surface, the type data of processing liquids 1 and 2, the supply flow data of processing liquids 1 and 2, or the supply location data of processing liquids 1 and 2 in the associated data 121 according to the embodiment are different from each other, other associated data 121 corresponding to such different data are registered in the associated data 121.

[0089] For example, even in the case of Figure 6 In the case where, compared to the example, only the affinity data of the wafer surface differs (that is, such data is "hydrophobic"), other associated data 121 with matrix data as follows are also registered in storage cell 12, which has different and different characteristics from the example. Figure 6 Examples of such affinity data content.

[0090] [Control Unit Configuration]

[0091] The control unit 13 is, for example, a controller and is implemented by a central processing unit (CPU) or microprocessor unit (MPU), wherein various types of programs stored in the storage device inside the prediction device 3 are executed in RAM, which serves as the working area.

[0092] Furthermore, the control unit 13 is, for example, a controller and is implemented by an integrated circuit such as an application-specific integrated circuit (ASIC) or a field-programmable gate array (FPGA).

[0093] like Figure 5 As illustrated, the control unit 13 includes an acquisition unit 131, a determination unit 132, a prediction unit 133, and a notification unit 134, and implements or performs the information processing functions and actions described below. Furthermore, the internal configuration of the control unit 13 is not limited to the following. Figure 5 The configuration shown is valid, but other configurations are possible, as long as such configurations perform the information processing described below.

[0094] The acquisition unit 131 acquires various types of information. For example, the acquisition unit 131 acquires image data captured by the camera C from the substrate processing apparatus 2. In addition, the acquisition unit 131 acquires information from the substrate processing apparatus 2 related to the supply conditions of the processing liquid corresponding to the image data captured by the camera C.

[0095] For example, the acquisition unit 131 acquires information relating to the supply conditions of the processing fluid, which have the same timestamp as the timestamp of the image data captured by the camera C. Furthermore, the supply conditions of the processing fluid acquired by the acquisition unit 131 may be, for example, any condition other than the definitive data regarding the attachment of the processing fluid, included in the various types of data registered in the associated data 121 as described above.

[0096] In addition, the acquisition unit 131 acquires the processing recipe (that is, the scheduled recipe) that has been scheduled to be executed by the substrate processing equipment 2 from the substrate processing equipment 2.

[0097] The determining unit 132 determines whether the processing fluid adheres to the upper surface 93a of the nozzle 72 or the exhaust cup 93 (also described in this disclosure as "nozzle 72, etc.") based on the image data acquired by the acquiring unit 131. (Refer to...) Figure 7 and Figure 8 An example illustrating the determination process performed by such a determination unit 132.

[0098] Figure 7 This is a diagram used to illustrate the determination process according to the embodiment, and is image data provided by taking an image of the vicinity of the outlet of nozzle 72a. Figure 7 (a) illustrates image data captured near nozzle 72a before a unit of time has elapsed, and Figure 7 (b) illustrates image data captured near nozzle 72a after a unit of time has elapsed.

[0099] Then, in Figure 7 (a) or Figure 7 An image of nozzle 72a was captured at the upper part of (b), and... Figure 7 (a) or Figure 7 (b) is an image of the flow L1 of the treatment liquid discharged from nozzle 72a, taken from the central part.

[0100] Here, in the embodiment, for example, determining unit 132 (see Figure 5 ) will be as Figure 7 The example in (a) shows the image data captured before a unit of time has elapsed, compared with... Figure 7 The image data captured after a unit of time has elapsed, as illustrated in (b), are compared.

[0101] Then, as Figure 7 As illustrated in (c), the determining unit 132 extracts (one or more) pixels P of the initially detected object from the captured image data after a unit time elapsed, relative to the captured image data before a unit time elapsed, as its reference.

[0102] Then, the determining unit 132 determines whether the pixel P extracted from the captured image data after a unit time has elapsed (one or more) includes a pixel P1 adjacent to the nozzle 72a.

[0103] Then, as Figure 7 As illustrated in (c), when a pixel P1 adjacent to the nozzle 72a is included in the extracted (one or more) pixels P, the determining unit 132 considers such a pixel P1 as processing liquid attached to the nozzle 72a, and determines that such processing liquid is attached to the nozzle 72a when such a unit time has elapsed.

[0104] In addition, such as Figure 7 As illustrated in (c), among the (one or more) pixels P extracted from the captured image data after a unit of time has elapsed, pixels P2 that are not adjacent to nozzle 72a are considered as processing liquid that is only scattered in the air, rather than as processing liquid that is attached to nozzle 72a.

[0105] In other words, if the pixel P extracted from the captured image data after a unit of time has elapsed is a pixel P2 that is not adjacent to the nozzle 72a, then when such a unit of time has elapsed, the determining unit 132 determines that the processing liquid has not adhered to the nozzle 72a.

[0106] Figure 8 This is a diagram used to illustrate the determination process according to the embodiment, and is image data provided by taking an image of the vicinity of the upper surface 93a of the exhaust cup 93. Figure 8 (a) illustrates image data captured near the upper surface 93a before a unit time has elapsed, and Figure 8 (b) illustrates image data captured near the upper surface 93a after a unit of time has elapsed.

[0107] Then, in Figure 8 (a) or Figure 8 An image of the upper surface 93a of the exhaust cup 93 was captured in the lower part of (b), and... Figure 8 (a) or Figure 8 An image of droplet L2 is captured in the pixel adjacent to the upper surface 93a in (b), and this image of droplet L2 is used to indicate the droplet L2 in the image. Figure 8 The treatment fluid that adhered before time point (a).

[0108] Here, in the embodiment, for example, determining unit 132 (see Figure 5 ) will be as Figure 8 The example in (a) shows the image data captured before a unit of time has elapsed, compared with... Figure 8 The image data captured after a unit of time has elapsed, as illustrated in (b), are compared.

[0109] Then, as Figure 8 As illustrated in (c), the determining unit 132 extracts (one or more) pixels P of the initially detected object from the captured image data after a unit time elapsed, relative to the captured image data before a unit time elapsed, as its reference.

[0110] Then, the determining unit 132 determines whether the pixel P extracted from the captured image data after a unit time has elapsed (one or more) includes a pixel P1 adjacent to the upper surface 93a of the exhaust cup 93.

[0111] Then, as Figure 8 As illustrated in (c), when a pixel P1 adjacent to the upper surface 93a is included in the extracted (one or more) pixels P, the determining unit 132 considers such a pixel P1 as a processing liquid attached to the upper surface 93a, and determines that such a processing liquid is attached to the upper surface 93a when such a unit time has elapsed.

[0112] In addition, such as Figure 8 As illustrated in (c), among the (one or more) pixels P extracted from the captured image data after a unit time has elapsed, the pixel P that is only adjacent to the droplet L2 is considered to be the processing liquid that is attached to the upper surface 93a by such droplet L2, and is considered to be the processing liquid that is attached to the upper surface 93a.

[0113] Will return to Figure 5 The determination unit 132 associates the determination result of the treatment fluid adhesion obtained as described above with the corresponding supply conditions of the treatment fluid, and stores it in the association data 121 of the storage unit 12.

[0114] Based on the associated data 121, the prediction unit 133 predicts whether the processing liquid will adhere to the nozzle 72 or the upper surface 93a of the exhaust cup 93 in the liquid processing unit 32 when the scheduled formula is executed in the substrate processing equipment 2.

[0115] For example, the prediction unit 133 compares the supply conditions of the treatment fluid registered in the scheduled formula with the supply conditions of the treatment fluid registered in the association data 121. Then, the prediction unit 133 confirms the supply conditions of the treatment fluid that are equivalent to the supply conditions of the treatment fluid registered in the association data 121 and registered in the scheduled formula, whether the treatment fluid adheres to the nozzle 72, etc.

[0116] Then, under the same supply conditions as the supply conditions of the treatment liquid registered in the pre-scheduled formula, and when the treatment liquid adheres to the nozzle 72, the prediction unit 133 predicts that when such a pre-scheduled formula is executed, such a treatment liquid will adhere to the nozzle 72, etc.

[0117] In addition, if the pre-scheduled formula has multiple supply conditions for the treatment liquid and if the treatment liquid adheres to the nozzle 72 under at least one supply condition, the prediction unit 133 predicts that the treatment liquid will adhere to the nozzle 72 when such a pre-scheduled formula is executed.

[0118] On the other hand, under any supply conditions of the treatment liquid registered in the pre-scheduled formula, if the treatment liquid does not adhere to the nozzle 72, the prediction unit 133 predicts that if such a pre-scheduled formula is executed, such treatment liquid will not adhere to the nozzle 72.

[0119] The notification unit 134 provides a notification of the estimated results of the quality of the scheduled formula executed by the prediction unit 133. For example, if it is predicted that the processing liquid will adhere to the nozzle 72 when the scheduled formula is executed, the notification unit 134 notifies the user of the substrate processing equipment 2 of the possibility that such processing liquid will adhere to the nozzle 72 when such a scheduled formula is executed.

[0120] Therefore, the user of the substrate processing equipment 2 can check the scheduled formula before liquid processing is performed to prevent the processing liquid from adhering to the nozzle 72, etc. Thus, according to the embodiment, it is possible to reduce or prevent the processing liquid that splashes during liquid processing from adhering to the nozzle 72 or the upper surface 93a of the exhaust cup 93.

[0121] Furthermore, when multiple supply conditions for the processing liquid are registered in the scheduled formula, the notification unit 134 can notify the user of the substrate processing equipment 2 of the details of the specific supply condition of the processing liquid predicted to be attached to all the supply conditions of the processing liquid. Thus, the user of the substrate processing equipment 2 can efficiently perform checks on the scheduled formula.

[0122] <Specific Operation of the Prediction Device>

[0123] Next, refer to Figure 9 and Figure 10The specific operation of the prediction device 3 according to the embodiment is explained. Figure 9 This is a flowchart illustrating an example of the preparation process of associated data 121 performed by the prediction device 3 according to an embodiment.

[0124] First, substrate processing equipment 2 (see Figure 1 Control unit 41 (see) Figure 2 Control liquid handling unit 32 (see) Figure 2 The liquid treatment unit 32 is used to perform liquid treatment according to the treatment formulation used for evaluation in order to obtain determination data on the adhesion of the treatment liquid (step S101).

[0125] In such an evaluation process formulation (hereinafter also referred to as the "evaluation formulation"), for example, multiple supply conditions of the processing liquid are registered in a manner that fully covers the various types of processing conditions expected to be performed in the substrate processing apparatus 2.

[0126] Then, the control unit 41 of the substrate processing device 2 controls multiple cameras C (see...) Figure 4 This allows the multiple cameras C to capture images of the nozzle 72 and the upper surface 93a of the exhaust cup 93 in the liquid processing unit 32 where liquid processing is performed (step S102). Such captured image data is stored, for example, in the storage unit 42 of the substrate processing apparatus 2 (see...). Figure 2 )middle.

[0127] Then, prediction device 3 (see Figure 5 The acquisition unit 131 (see) Figure 5 (Step S103) Obtain image data containing the image captured in step S102 and the supply conditions of the processing liquid corresponding to such image data from the substrate processing device 2.

[0128] In such a process as step S103, for example, the acquisition unit 131 acquires information related to the processing formula used for evaluation set in the process of step S101, as the supply conditions of the processing liquid corresponding to the captured image data.

[0129] Then, the determination unit 132 of the prediction device 3 (see Figure 5 For each of the image data acquired in step S103, determine whether the processing liquid adheres to the nozzle 72, etc., according to each unit time (step S104).

[0130] Finally, the determination unit 132 of the prediction device 3 uses the following data as the associated data 121 (see Figure 5 ) stored in storage unit 12 (see Figure 5In step S105, the data correlates the determination result from step S104 with the supply conditions of the processing liquid corresponding to such determination result. Thus, the series of preparatory processes for the correlated data 121 is completed.

[0131] Figure 10 This is a flowchart illustrating an example of a prediction process performed by the prediction device 3 according to an embodiment.

[0132] First, obtain unit 131 (see Figure 5 From substrate processing device 2 (see Figure 2 (Step S201) Obtain the processing recipe (that is, the scheduled recipe) that is scheduled to be executed by such substrate processing equipment 2.

[0133] Then, prediction unit 133 (see Figure 5 Predict whether the processing liquid will adhere to the upper surface 93a of the nozzle 72 or the exhaust cup 93 if the scheduled formula is obtained in the process of performing step S201 (step S202).

[0134] Then, if it is predicted that the treatment fluid will adhere to the nozzle 72, etc. ("Yes" in step S203), the notification unit 134 (see Figure 5 The user of the substrate processing equipment 2 is notified of the possibility that such processing liquid may adhere to the nozzle 72, etc. (step S204). Then, a series of predictive processes are completed.

[0135] On the other hand, if it is predicted that the processing liquid has not adhered to the nozzle 72, etc. (No in step S203), the substrate processing equipment 2 (see Figure 1 Control unit 41 (see) Figure 2 Liquid processing is performed in liquid processing unit 32 according to the scheduled formula (step S205).

[0136] Then, the control unit 41 of the substrate processing device 2 controls multiple cameras C (see...) Figure 4 This allows the multiple cameras C to capture images of the nozzle 72 and the upper surface 93a of the exhaust cup 93 in the liquid processing unit 32 where liquid processing is performed (step S206). Such captured image data is stored, for example, in the storage unit 42 of the substrate processing apparatus 2 (see...). Figure 2 )middle.

[0137] Then, prediction device 3 (see Figure 5 The acquisition unit 131 (see) Figure 5 (Step S207) Obtain image data containing the image captured in step S206 and the supply conditions of the processing liquid corresponding to such image data from the substrate processing device 2.

[0138] In a process such as step S207, for example, the acquisition unit 131 acquires information related to the scheduled formula as the supply conditions of the processing liquid corresponding to the captured image data.

[0139] Then, the determination unit 132 of the prediction device 3 (see Figure 5 For each of the image data acquired in step S207, determine whether the processing liquid adheres to the nozzle 72, etc., according to each unit time (step S208).

[0140] Finally, the determination unit 132 of the prediction device 3 adds the following data to the storage unit 12 (see...). Figure 5 Related data 121 (see) Figure 5 (Step S209) In this data, the determination results from the processing in step S208 and the supply conditions of the processing liquid corresponding to such determination results are correlated with each other. Then, the series of predictive processes ends.

[0141] As explained so far, in the embodiments, based on pre-generated correlation data 121, it is predicted whether the processing liquid will adhere to the nozzle 72, etc., when executing a scheduled recipe that is scheduled to be executed in the substrate processing apparatus 2.

[0142] Therefore, the user of the substrate processing apparatus 2 can check the scheduled formula based on such prediction results before liquid processing is performed, so that the processing liquid does not adhere to the nozzle 72, etc. Thus, according to the embodiment, it is possible to reduce or prevent the processing liquid that splashes during liquid processing from adhering to the nozzle 72 or the upper surface 93a of the exhaust cup 93.

[0143] Furthermore, in this embodiment, the association data 121 used for predictive processing is generated based on the image data captured by the camera C, which makes it more efficient to generate accurate association data 121 compared to generating association data 121 based on the user's view.

[0144] Furthermore, in this embodiment, the acquisition unit 131 can acquire image data taken when the treatment liquid is supplied according to the evaluation formula generated for acquiring the association data 121. This allows for the efficient generation of the association data 121.

[0145] Furthermore, in the embodiments, the supply conditions of the processing liquid registered in the associated data 121 may include the type of processing liquid, the supply flow rate of the processing liquid, the supply position of the processing liquid relative to the wafer W, the rotation frequency of the wafer W, and the affinity of the wafer W for water.

[0146] Therefore, it is possible to accurately predict whether the processing liquid will adhere to the upper surface 93a of the nozzle 72 or the exhaust cup 93 when the scheduled formula is executed in the substrate processing apparatus 2. Furthermore, the supply conditions of the processing liquid used in the predictive processing according to the embodiment are not limited to the examples described above, and a wide variety of supply conditions can be used.

[0147] Furthermore, in an embodiment, DIW can be supplied from at least one nozzle 72b of a plurality of nozzles 72 according to a scheduled recipe that is scheduled to be executed in the substrate processing apparatus 2.

[0148] Therefore, it is possible to accurately predict whether the treatment liquid will adhere to the upper surface 93a of the nozzle 72 or the exhaust cup 93 during the simultaneous supply of DIW and another chemical liquid, which are prone to causing liquid splashing.

[0149] Furthermore, the predictive processing in this disclosure is not limited to the simultaneous supply of two processing liquids, but can be applied to the supply of one processing liquid or the simultaneous supply of three or more processing liquids. Therefore, it is also possible to accurately predict whether the processing liquid will adhere to the upper surface 93a of the nozzle 72 or the exhaust cup 93.

[0150] Furthermore, in this embodiment, multiple cameras C may be disposed in the liquid processing unit 32 of the substrate processing apparatus 2, wherein these multiple cameras C can each and individually capture images of a pre-defined specific area. For example, in this embodiment, camera C1 can be used to capture an image of the area adjacent to nozzle 72a, and camera C2 can be used to capture an image of the area adjacent to nozzle 72b.

[0151] Therefore, compared to using a camera C to capture an image of the entire interior of the liquid processing unit 32, images of the nozzle 72 and the upper surface 93a of the exhaust cup 93 can be captured at a higher resolution.

[0152] Therefore, according to the embodiment, the determination process for the adhesion of the treatment liquid, performed by the determination unit 132, can be accurately executed.

[0153] Furthermore, this disclosure is not limited to the case where multiple cameras C are provided in the liquid processing unit 32, but can also include only one camera C in the liquid processing unit 32. This reduces the manufacturing cost of the liquid processing unit 32.

[0154] Furthermore, in the embodiments, the camera C (one or more) can be a three-dimensional camera (one or more). Thus, the captured image data has three-dimensional information, enabling the accurate execution of the determination process for the adhesion of the processing liquid performed by the determination unit 132.

[0155] Furthermore, this disclosure is not limited to the case where (one or more) cameras C are (one or more) three-dimensional cameras, and (one or more) cameras C can be (one or more) two-dimensional cameras. This reduces the manufacturing cost of the liquid processing unit 32.

[0156] Furthermore, in the embodiments, such as Figure 7 and Figure 8 As illustrated, the determining unit 132 can compare the image data captured before the unit time has elapsed with the image data captured after the unit time has elapsed to determine whether the treatment fluid has adhered to the nozzle 72, etc. Therefore, the determination process for treatment fluid adhesion performed by the determining unit 132 can be executed accurately.

[0157] Furthermore, in this embodiment, the prediction unit 133 can input the scheduled formula into a rule-based algorithm to predict whether the treatment fluid will adhere to the nozzle 72, etc. That is, in this embodiment, the prediction unit 133 can predict whether the treatment fluid will adhere to the nozzle 72, etc., by directly using data registered in the associated data 121.

[0158] Therefore, it is possible to accurately predict whether the treatment fluid will adhere to the nozzle 72, etc.

[0159] Furthermore, in this embodiment, the prediction unit 133 can input the scheduled formula into a prediction model generated by machine learning to predict whether the treatment liquid will adhere to the nozzle 72, etc.

[0160] For example, in one embodiment, the prediction unit 133 can input the scheduled formula into a prediction model generated using machine learning with associated data 121 to predict whether the treatment fluid will adhere to the nozzle 72, etc. Thus, it is possible to accurately predict whether the treatment fluid will adhere to the nozzle 72, etc.

[0161] Furthermore, there are no particular restrictions on the machine learning algorithms permitted to be used in this disclosure, and existing learning algorithms are sufficient. Such learning algorithms may include, for example, random forests, support vector machines, Naive Bayes, neural networks, etc.

[0162] Furthermore, in the embodiments, such as Figure 10 As illustrated in step S206 and subsequent steps, the determining unit 132 can determine whether the treatment liquid adheres to the nozzle 72, etc., based on image data captured during the execution of the scheduled formula, and add such determination results to the associated data 121.

[0163] This allows for a further increase in the amount of associated data 121, enabling accurate prediction of whether the treatment fluid adheres to the nozzle 72, etc.

[0164] The prediction device 3 according to the embodiment includes an acquisition unit 131, a determination unit 132, a storage unit 12, and a prediction unit 133. The acquisition unit 131 acquires image data from the substrate processing apparatus 2, including images captured by the camera C and corresponding supply conditions of the processing liquid. The substrate processing apparatus 2 includes a substrate holding unit 60, a liquid supply unit 70, a cup (exhaust cup 93), and a camera C. The substrate holding unit 60 holds and rotates the substrate (wafer W). The liquid supply unit 70 supplies processing liquid to the substrate (wafer W) from a nozzle 72. The cup (exhaust cup 93) receives processing liquid that splashes from the rotating substrate (wafer W). The camera C captures images of the nozzle 72 and the upper surface 93a of the cup (exhaust cup 93).

[0165] The determining unit 132 determines whether the processing liquid adheres to the upper surface 93a of the nozzle 72 or the cup (exhaust cup 93) based on the captured image data. The storage unit 12 stores correlation data 121, in which the determination result from the determining unit 132 is correlated with the supply conditions of the processing liquid. Based on the correlation data 121, the prediction unit 133 predicts whether the processing liquid will adhere to the upper surface 93a of the nozzle 72 or the cup (exhaust cup 93) when executing a scheduled formula that is scheduled to be executed by the substrate processing apparatus 2. This reduces or prevents the processing liquid that may splash during liquid processing from adhering to the upper surface 93a of the nozzle 72 or the exhaust cup 93.

[0166] Furthermore, in the prediction device 3 according to the embodiment, the acquisition unit 131 acquires image data captured when the treatment liquid is supplied according to the evaluation formula generated for acquiring the correlation data 121. Thus, the correlation data 121 can be generated efficiently.

[0167] Furthermore, in the prediction device 3 according to the embodiment, the supply conditions of the processing liquid include the type of processing liquid supplied from the nozzle 72, the supply flow rate of the processing liquid, the supply position of the processing liquid relative to the substrate (wafer W), the rotation frequency of the substrate, and the substrate's affinity for water. Therefore, it is possible to accurately predict whether the processing liquid will adhere to the nozzle 72 or the upper surface 93a of the exhaust cup 93 when a pre-scheduled formula is executed in the substrate processing apparatus 2.

[0168] Furthermore, in the prediction device 3 according to the embodiment, the liquid supply unit 70 has a plurality of nozzles 72, and DIW is supplied from at least one nozzle 72b according to a pre-scheduled formula. Thus, it is possible to accurately predict whether the treatment liquid will adhere to the nozzle 72 or the upper surface 93a of the exhaust cup 93 during the simultaneous supply of DIW, which is prone to splashing, and another chemical liquid.

[0169] Furthermore, in the prediction device 3 according to the embodiment, a plurality of cameras C are provided in the substrate processing apparatus 2, and each of these cameras C captures images of a pre-set specific area individually. Therefore, compared to using a single camera C to capture images of the interior of the liquid processing unit 32, images of the nozzle 72 and the upper surface 93a of the exhaust cup 93 can be captured at a higher resolution.

[0170] Furthermore, in the prediction device 3 according to the embodiment, the camera C (one or more) is a three-dimensional camera (one or more). Therefore, the determination process for the adhesion of the processing liquid, performed by the determination unit 132, can be accurately executed.

[0171] Furthermore, in the prediction device 3 according to the embodiment, the determination unit 132 compares the image data captured before the unit time has elapsed with the image data captured after the unit time has elapsed to determine whether the treatment fluid has adhered to the upper surface 93a of the nozzle 72 or the cup (exhaust cup 93). Thus, the determination process for treatment fluid adhesion performed by the determination unit 132 can be accurately executed.

[0172] Furthermore, in the prediction device 3 according to the embodiment, the prediction unit 133 inputs the scheduled formula into a rule-based algorithm to predict whether the treatment liquid will adhere to the upper surface 93a of the nozzle 72 or the cup (exhaust cup 93). Thus, it is possible to accurately predict whether the treatment liquid will adhere to the nozzle 72, etc.

[0173] Furthermore, in the prediction device 3 according to the embodiment, the prediction unit 133 inputs the scheduled formula into a prediction model generated by machine learning to predict whether the treatment liquid will adhere to the upper surface 93a of the nozzle 72 or the cup (exhaust cup 93). Thus, it is possible to accurately predict whether the treatment liquid will adhere to the nozzle 72, etc.

[0174] Furthermore, in the prediction device 3 according to the embodiment, the acquisition unit 131 acquires image data captured during the execution of the scheduled formula and the supply conditions of the processing liquid corresponding to such image data. Furthermore, the determination unit 132 determines whether the processing liquid adheres to the nozzle 72 or the upper surface 93a of the cup (exhaust cup 93) based on the image data captured during the execution of the scheduled formula. This further increases the amount of associated data 121, enabling accurate prediction of whether the processing liquid adheres to the nozzle 72, etc.

[0175] Furthermore, the prediction method according to the embodiment includes an acquisition step (step S103), a determination step (step S104), a storage step (step S105), and a prediction step (step S202). The acquisition step (step S103) acquires image data having an image captured by the camera C and the corresponding supply conditions of the processing liquid from the substrate processing apparatus 2 as described above. The determination step (step S104) determines, based on the image data, whether the processing liquid adheres to the upper surface 93a of the nozzle 72 or the cup (exhaust cup 93). The storage step (step S105) stores associated data 121, wherein the determination result from the determination step (step S104) is associated with the supply conditions of the processing liquid. The prediction step (step S202) predicts, based on the associated data 121, whether the processing liquid adheres to the upper surface 93a of the nozzle 72 or the cup (exhaust cup 93) when executing a scheduled formula that is scheduled to be executed by the substrate processing apparatus 2. This reduces or prevents the spilled processing liquid from adhering to the upper surface 93a of the nozzle 72 or the exhaust cup 93 during liquid handling.

[0176] Although one or more embodiments of the present disclosure have been described above, the present disclosure is not limited to one or more embodiments as described above, and various modifications may be made without departing from the spirit of the present disclosure.

[0177] For example, although the embodiments described above illustrate an example of estimating the quality of the scheduled recipe in a prediction device 3, which is different from the substrate processing apparatus 2, this disclosure is not limited to such an example. For example, the quality of the scheduled recipe can be estimated in the control device 40 of the substrate processing apparatus 2. This can also reduce or prevent the adhering of spilled processing liquid to the upper surface 93a of the nozzle 72 or the exhaust cup 93 during liquid processing.

[0178] It should be understood that the embodiments disclosed herein (one or more) are not limiting, but illustrative in all respects. In practice, the embodiments described above (one or more) can be implemented in various modes. Furthermore, the embodiments described above (one or more) can be omitted, substituted, or modified in various modes without departing from the scope and spirit of the appended claims (one or more).

Claims

1. A prediction device, comprising: An acquisition unit is configured to acquire image data containing images captured by a camera and supply conditions of a processing liquid corresponding to the image data from a substrate processing apparatus. The substrate processing apparatus includes: a substrate holding unit for holding and rotating a substrate; a liquid supply unit for supplying the processing liquid to the substrate from a nozzle; a cup for receiving the processing liquid splashed from the rotating substrate; and the camera for capturing images of the upper surface of the cup and the nozzle. A determining unit is used to determine, based on the captured image data, whether the treatment liquid adheres to the upper surface of the cup or the nozzle; A storage unit for storing associated data, in which the determination result from the determining unit is correlated with the supply conditions of the processing liquid; and A prediction unit is configured to predict, based on the associated data, whether the processing liquid will adhere to the upper surface of the cup or the nozzle when executing a scheduled formula that is scheduled to be executed by the substrate processing equipment.

2. The prediction device according to claim 1, wherein, The acquisition unit acquires the captured image data when the treatment liquid is supplied according to the evaluation formula generated for acquiring the associated data.

3. The prediction device according to claim 1 or 2, wherein, The supply conditions of the treatment liquid include: the type of treatment liquid supplied from the nozzle, the supply flow rate of the treatment liquid, the supply position of the treatment liquid relative to the substrate, the rotation frequency of the substrate, and the affinity of the substrate for water.

4. The prediction device according to any one of claims 1 to 3, wherein, The liquid supply unit has a plurality of the nozzles, and supplies deionized water, i.e., DIW, from at least one of the nozzles according to the pre-scheduled formula.

5. The prediction device according to any one of claims 1 to 4, wherein, The substrate processing apparatus is equipped with a plurality of the aforementioned cameras, and The multiple cameras each and individually capture images of a pre-defined specific area.

6. The prediction device according to any one of claims 1 to 5, wherein, One or more of the cameras is one or more three-dimensional cameras.

7. The prediction device according to any one of claims 1 to 6, wherein, The determining unit compares the image data captured before a unit time has elapsed with the image data captured after a unit time has elapsed to determine whether the treatment liquid has adhered to the upper surface of the cup or the nozzle.

8. The prediction device according to any one of claims 1 to 7, wherein, The prediction unit inputs the scheduled formula into a rule-based algorithm to predict whether the treatment liquid will adhere to the upper surface of the cup or the nozzle.

9. The prediction device according to any one of claims 1 to 7, wherein, The prediction unit inputs the scheduled formula into a prediction model generated by machine learning to predict whether the treatment liquid will adhere to the upper surface of the cup or the nozzle.

10. The prediction device according to any one of claims 1 to 9, wherein, The acquisition unit acquires image data captured during the execution of the scheduled formula and the supply conditions of the treatment liquid corresponding to the image data. The determining unit determines whether the treatment liquid adheres to the upper surface of the cup or the nozzle based on image data captured during the execution of the scheduled formula.

11. A prediction method, comprising: The acquisition step is used to acquire image data containing images captured by a camera and supply conditions of a processing liquid corresponding to the image data from a substrate processing device. The substrate processing device includes: a substrate holding unit for holding and rotating a substrate; a liquid supply unit for supplying the processing liquid to the substrate from a nozzle; a cup for receiving the processing liquid splashed from the rotating substrate; and the camera for capturing images of the upper surface of the cup and the nozzle. The determination step is used to determine, based on the captured image data, whether the treatment liquid adheres to the upper surface of the cup or the nozzle; A storage step for storing associated data, in which the determination result from the determining step is correlated with the supply conditions of the processing liquid; and A prediction step, based on the associated data, predicts whether the processing liquid will adhere to the upper surface of the cup or the nozzle when a scheduled formula, which is scheduled to be executed by the substrate processing equipment, is being performed.

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