Light-emitting substrate, backlight module and display device

Abstract

The application provides a light-emitting substrate, a backlight module and a display device, and relates to the technical field of display. The binding area of the light-emitting substrate comprises a chip setting sub-area and a wiring sub-area; the geometric center of the binding area does not overlap with the geometric center of the chip setting sub-area; in the wiring sub-area, the number of signal lines on the first side of the reference line is greater than the number of signal lines on the second side of the reference line; the line width of at least part of the signal lines on the second side of the reference line is greater than the line width of the signal lines on the first side of the reference line; the reference line extends along the first direction and is located on the side of the geometric center of the chip setting sub-area away from the geometric center of the binding area. The light-emitting substrate can improve the space design utilization rate, improve the current load of the signal lines in the binding area, and reduce the product cost.

Description

Light-emitting substrate, backlight module and display device TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a light-emitting substrate, a backlight module and a display device. BACKGROUND

[0002] With the rapid development of display technology, Mini LED (Mini Light Emitting Diode) and Micro LED (Micro Light Emitting Diode) display products have attracted widespread attention. However, due to the high cost of such display products, the range of use is limited; in the case of ensuring the use performance of the display product, it is difficult to propose a low-cost design scheme.

[0003] SUMMARY

[0004] Embodiments of the present application adopt the following technical solutions:

[0005] In a first aspect, the embodiments of the present application provide a light-emitting substrate, which comprises a light-emitting area and a binding area located on one side of the light-emitting area;

[0006] The binding area comprises a chip setting sub-area and a wiring sub-area, and the wiring sub-area is located between the chip setting sub-area and the light-emitting area; the geometric center of the binding area and the geometric center of the chip setting sub-area do not overlap;

[0007] The light-emitting area comprises a plurality of signal lines extending along a first direction, and the plurality of signal lines extend from the light-emitting area to the wiring sub-area; in the wiring sub-area, the number of signal lines located on a first side of a reference line is greater than the number of signal lines located on a second side of the reference line; the line width of at least part of the signal lines located on the second side of the reference line is greater than the line width of part of the signal lines located on the first side of the reference line;

[0008] The reference line extends along the first direction and is located on the side of the geometric center of the chip setting sub-area away from the geometric center of the binding area; the first direction is the direction of the binding area pointing to the light-emitting area.

[0009] In the light-emitting substrate provided by some embodiments of the present application, the signal lines comprise driving lines and ground lines;

[0010] In the wiring sub-area, the driving lines comprise a first line segment extending along the first direction and a second line segment extending along a second direction, and the ground lines comprise a third line segment extending along the first direction and a fourth line segment extending along the second direction;

[0011] The line width of the second line segment on the second side of the reference line is greater than the line width of the second line segment on the first side of the reference line; the line width of the fourth line segment on the second side of the reference line is greater than the line width of the fourth line segment on the first side of the reference line; and the second direction is perpendicular to the first direction.

[0012] In the light-emitting substrate provided in some embodiments of the present application, in the wiring sub-area, the line width of the driving line on the second side of the reference line is 1-2 times the line width of the driving line on the first side of the reference line, and the line width of the ground line on the second side of the reference line is 1-2 times the line width of the ground line on the first side of the reference line.

[0013] In the light-emitting substrate provided in some embodiments of the present application, the light-emitting area includes a plurality of light areas arranged in an array, and the light areas in the same row arranged along the first direction are respectively electrically connected to the same driving line and the same ground line.

[0014] In the light-emitting substrate provided in some embodiments of the present application, in the area between the first row of light areas and the second row of light areas, a first compensation structure is further arranged between two adjacent light areas along the first direction, the first compensation structure extends along the second direction and is directly connected to the driving line, and the first row of light areas is located between the binding area and the second row of light areas.

[0015] In the light-emitting substrate provided in some embodiments of the present application, in the area between the second row of light areas and the third row of light areas, a second compensation structure is further arranged between two adjacent light areas along the first direction, the second compensation structure extends along the second direction and is directly connected to the ground line.

[0016] In the light-emitting substrate provided in some embodiments of the present application, in the area between the second row of light areas and the third row of light areas, a bending structure is further arranged between two adjacent light areas along the first direction, the bending structure partially surrounds the second compensation structure and is electrically connected to the driving line.

[0017] In the light-emitting substrate provided in some embodiments of the present application, in the area between the nth row of light areas and the (n+1)th row of light areas, the first compensation structure is further arranged between two adjacent light areas along the first direction, the first compensation structure extends along the second direction and is directly connected to the driving line, and n is a positive integer.

[0018] In some embodiments provided by the present application, in the area between the nth+1 row of the light area and the nth+2 row of the light area, the second compensation structure is further arranged between two adjacent light areas along the first direction, and the second compensation structure extends along the second direction and is directly connected with the ground line.

[0019] In some embodiments provided by the present application, in the area between the nth+1 row of the light area and the nth+2 row of the light area, the second compensation structure is further arranged between two adjacent light areas along the first direction, and the second compensation structure extends along the second direction and is directly connected with the ground line.

[0020] In some embodiments provided by the present application, the first compensation structure is arranged in the area where the first column of the light area to the mth column of the light area, the second compensation structure is arranged in the area where the second column of the light area to the mth column of the light area, and the bending structure is arranged in the area where the second column of the light area to the mth column of the light area; m is a positive integer, and m>1.

[0021] In some embodiments provided by the present application, the first compensation structure arranged in the area where the m-1th column of the light area is electrically connected with the driving line arranged in the area where the m-1th column of the light area; the second compensation structure arranged in the area where the m+1th column of the light area is electrically connected with the ground line arranged in the area where the mth column of the light area; and the bending structure arranged in the area where the m+1th column of the light area is electrically connected with the driving line arranged in the area where the m+1th column of the light area.

[0022] In some embodiments provided by the present application, the line width of the second compensation structure along the first direction is less than the line width of the first compensation structure along the first direction.

[0023] In some embodiments provided by the present application, the maximum dimension of the bending structure along the first direction is equal to the line width of the first compensation structure along the first direction.

[0024] In some embodiments provided by the present application, in the area between the first row of the light area and the second row of the light area, two adjacent first compensation structures are electrically connected.

[0025] In the area between the second row of the light area and the third row of the light area, two adjacent second compensation structures are electrically connected.

[0026] In some embodiments provided by the present application, the two ends of the first compensation structure are respectively provided with a first conductive pad group, and the two ends of the second compensation structure are respectively provided with a second conductive pad group, the first conductive pad group is used to electrically connect two adjacent first compensation structures together, and the second conductive pad group is used to electrically connect two adjacent second compensation structures together.

[0027] In some embodiments provided by the present application, the plurality of signal lines are arranged on the same conductive layer.

[0028] In some embodiments provided by the present application, the light-emitting substrate comprises:

[0029] a substrate;

[0030] the conductive layer on the substrate; the conductive layer comprises the plurality of signal lines, a plurality of traces, a plurality of first conductive pad groups, a plurality of second conductive pad groups, a plurality of third conductive pad groups and a plurality of fourth conductive pad groups; the third conductive pad groups are used to connect light-emitting devices, and the fourth conductive pad groups are used to connect micro driving chips;

[0031] a reflective layer covering the conductive layer; the reflective layer is provided with a plurality of first openings and a plurality of second openings, in the case that two adjacent first compensation structures are electrically connected, the outer contour of the first opening in the orthographic projection on the substrate overlaps the orthographic projection of the first conductive pad group on the substrate; in the case that two adjacent second compensation structures are electrically connected, the outer contour of the second opening in the orthographic projection on the substrate overlaps the orthographic projection of the second conductive pad group on the substrate.

[0032] In some embodiments provided by the present application, the light-emitting substrate further comprises a passivation layer between the conductive layer and the reflective layer, the passivation layer is provided with a plurality of first grooves and a plurality of second grooves, and the reflective layer extends into the first grooves and the second grooves;

[0033] In the case that two adjacent first compensation structures are electrically connected, the orthographic projection of the outer contour of the first opening and the outer contour of the first groove on the substrate overlaps, and in the case that two adjacent second compensation structures are electrically connected, the orthographic projection of the outer contour of the second opening and the outer contour of the second groove on the substrate overlaps.

[0034] In a second aspect, embodiments of the present application provide a backlight module, comprising the light-emitting substrate as any one of the first aspect, the light-emitting area of the light-emitting substrate comprises a plurality of light areas arranged in an array;

[0035] The lamp area is provided with at least one micro driving chip and a plurality of light emitting devices; the plurality of light emitting devices have the same light emitting color.

[0036] In a third aspect, the embodiments of the present application provide a display device, comprising the light emitting substrate as any one of the first aspect, wherein the light emitting area of the light emitting substrate comprises a plurality of lamp areas arranged in an array.

[0037] The lamp area is provided with at least one micro driving chip and a plurality of light emitting devices; the plurality of light emitting devices comprise a plurality of light emitting devices with different light emitting colors.

[0038] The above description is only a summary of the technical solutions of the present application. In order to enable one skilled in the art to better understand the technical means of the present application, and to implement the same according to the content of the description, and in order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following specific embodiments of the present application are described. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without any creative labor.

[0040] Fig. 1 is a structural schematic diagram of a light emitting substrate in the related art provided by the embodiments of the present application;

[0041] Fig. 2 is a structural schematic diagram of a light emitting substrate provided by the embodiments of the present application

[0042] Fig. 3 and Fig. 4 are structural schematic diagrams of the binding area of two light emitting substrates provided by the embodiments of the present application;

[0043] Fig. 5A is a structural schematic diagram of a ground line provided by the embodiments of the present application;

[0044] Fig. 5B is a structural schematic diagram of a driving line provided by the embodiments of the present application;

[0045] Fig. 6 and Fig. 7 are structural schematic diagrams of the wiring of a column of lamp areas in the light emitting area of a light emitting substrate provided by the embodiments of the present application;

[0046] Fig. 8 to Fig. 10 are structural schematic diagrams of the wiring in three light emitting areas provided by the embodiments of the present application;

[0047] Fig. 11 is an electrical connection structural schematic diagram of a second compensation structure provided by the embodiments of the present application;

[0048] Fig. 12 is a schematic view of an electrical connection structure of a first compensation structure according to an embodiment of the present application;

[0049] Figs. 13-16 are schematic views of cross-sectional structures of four light-emitting substrates according to embodiments of the present application;

[0050] Fig. 17 is a schematic view of a structure of a fourth group of conductive pads according to an embodiment of the present application. DETAILED DESCRIPTION

[0051] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of the present application.

[0052] In the embodiments of the present application, the terms “first”, “second”, “third”, “fourth” and the like are used to distinguish the same items or similar items with basically the same functions and effects, and are only for clearly describing the technical solutions in the embodiments of the present application, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0053] In the embodiments of the present application, the terms “upper”, “lower” and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and thus cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus cannot be understood as limiting the present application.

[0054] In the description of the specification, the terms “one embodiment”, “some embodiments”, “exemplary embodiments”, “example”, “specific example” or “some examples” are intended to indicate that a particular feature, structure, material or characteristic included in the embodiments or examples includes at least one embodiment or example of the present application. The illustrative representations of the above terms do not necessarily indicate the same embodiment or example. In addition, the specific features, structures, materials or characteristics can be included in any one or more embodiments or examples in any appropriate manner.

[0055] In the embodiments of the present application, “a plurality of” means two or more, and “at least one” means one or more, unless otherwise explicitly specified.

[0056] The features of "parallel", "perpendicular" and "same" used in the embodiments of the present application include the strict sense of "parallel", "perpendicular", "same" and the case of containing a certain tolerance, which is considered to be within the acceptable deviation range of the specific value determined by the person skilled in the art in view of the measurement and the tolerance related to the measurement of the specific quantity (for example, the limitation of the measurement system). For example, "approximately" can mean within one or more standard deviations, or within 10% or 5% of the value.

[0057] Unless otherwise required by context, the term "comprises" in the specification and claims is interpreted as open, inclusive, meaning "including, but not limited to".

[0058] The polygons in the specification are not strictly in the sense that they can be approximate triangles, parallelograms, trapezoids, pentagons or hexagons, etc., and there can be some small deformation caused by tolerance.

[0059] The embodiments of the present application provide a light-emitting substrate, as shown in FIG. 2, which includes a light-emitting area AA and a binding area BB located on one side of the light-emitting area AA;

[0060] The binding area BB includes a chip setting sub-area (the area marked with the driving chip IC) and a wiring sub-area (not marked in FIG. 2), which is located between the chip setting sub-area and the light-emitting area AA; the geometric center O1 of the binding area BB does not overlap with the geometric center O2 of the chip setting sub-area; the O1O2 direction intersects the first direction (for example, the BA direction);

[0061] The light-emitting area AA includes a plurality of signal lines (for example, including a plurality of driving lines VLED and a plurality of ground lines GND) extending along the first direction (for example, the BA direction), and the plurality of signal lines extend from the light-emitting area AA to the wiring sub-area; in the wiring sub-area, the number of signal lines on the first side of the reference line CK is greater than the number of signal lines on the second side of the reference line CK; the line width (for example, W2) of at least part of the signal lines on the second side of the reference line CK is greater than the line width (for example, W1) of part of the signal lines on the first side of the reference line CK;

[0062] Wherein, the reference line CK extends along the first direction (for example, the BA direction) and is located on the side of the geometric center O2 of the chip setting sub-area away from the geometric center O1 of the binding area; the first direction (for example, the BA direction) is the direction of the binding area BB pointing to the light-emitting area AA.

[0063] In the related art, the chip setting sub-area is usually arranged in the middle region of the bonding area BB, for example, so that the distance between the geometric center of the chip setting sub-area and the left side boundary of the bonding area is substantially equal to the distance between the geometric center of the chip setting sub-area and the right side boundary of the bonding area.

[0064] In the embodiments of the present application, the chip setting sub-area is arranged away from the middle region of the bonding area BB due to the special use scene requirements of the light-emitting substrate.

[0065] For example, as shown in FIG. 2, the distance H1 between the geometric center O1 of the chip setting sub-area and the left side boundary of the bonding area BB is greater than the distance H2 between the geometric center O2 of the chip setting sub-area and the right side boundary of the bonding area BB.

[0066] For another example, the distance between the geometric center of the chip setting sub-area and the left side boundary of the bonding area BB is less than the distance between the geometric center of the chip setting sub-area and the right side boundary of the bonding area BB.

[0067] In the exemplary embodiments, the above-mentioned signal lines include but are not limited to the driving line VLED, the ground line GNG, the input line DI, and the power supply line VCC.

[0068] In the wiring sub-area, for example, as shown in FIG. 2, since the geometric center O1 of the bonding area BB does not overlap the geometric center O2 of the chip setting sub-area, the distance H1 between the geometric center O1 of the chip setting sub-area and the left side boundary of the bonding area BB is greater than the distance H2 between the geometric center O2 of the chip setting sub-area and the right side boundary of the bonding area BB; in this way, the number of the plurality of signal lines arranged on the first side (for example, the left side) of the reference line CK in the wiring sub-area is greater than the number of the plurality of signal lines arranged on the second side (for example, the right side) of the reference line CK.

[0069] It should be noted that the number of the plurality of signal lines arranged on the first side (for example, the left side) of the reference line CK in the wiring sub-area is greater than the number of the plurality of signal lines arranged on the second side (for example, the right side) of the reference line CK includes but is not limited to the following meanings:

[0070] First, the total number of various signal lines arranged on the first side (for example, the left side) of the reference line CK is greater than the total number of various signal lines arranged on the second side (for example, the right side) of the reference line CK.

[0071] Second, the number of the same type of signal lines arranged on the first side (for example, the left side) of the reference line CK is greater than the number of the same type of signal lines arranged on the second side (for example, the right side) of the reference line CK.

[0072] In the specification and the drawings, the total number of various signal lines arranged on the first side (e.g., the left side) of the reference line CK is greater than the total number of various signal lines arranged on the second side (e.g., the right side) of the reference line CK.

[0073] When the number of signal lines arranged in the wiring sub-area on the first side (e.g., the left side) of the reference line CK is greater than the number of signal lines arranged on the second side (e.g., the right side) of the reference line CK, the wiring space on the second side of the reference line CK is relatively large, and thus the line width of at least part of the line segments on the second side of the reference line CK can be increased to be greater than the line width (e.g., W1) of part of the line segments on the first side of the reference line CK.

[0074] For example, when the signal lines include driving lines and ground lines, the line width of at least part of the line segments on the second side of the reference line CK being greater than the line width of part of the line segments on the first side of the reference line CK includes but is not limited to the following cases:

[0075] First, for the same type of signal lines, as shown in FIG. 2, for example, ground lines GND, the line width (e.g., W4) of at least part of the line segments on the second side of the reference line CK of the plurality of ground lines GND is greater than the line width (e.g., W3) of part of the line segments on the first side of the reference line CK of the plurality of ground lines GND.

[0076] Second, for the same type of signal lines, as shown in FIG. 2, for example, driving lines VLED, the line width (e.g., W2) of at least part of the line segments on the second side of the reference line CK of the plurality of driving lines VLED is greater than the line width (e.g., W1) of part of the line segments on the first side of the reference line CK of the plurality of driving lines VLED.

[0077] Third, for different types of signal lines, for example, the line width of at least part of the line segments on the second side of the reference line CK of the plurality of driving lines VLED is greater than the line width of part of the line segments on the first side of the reference line CK of the plurality of ground lines GND.

[0078] Fourth, for different types of signal lines, for example, the line width of at least part of the line segments on the second side of the reference line CK of the plurality of ground lines GND is greater than the line width of part of the line segments on the first side of the reference line CK of the plurality of driving lines VLED.

[0079] In the light-emitting substrate provided in the embodiments of the present application, the chip setting sub-area is arranged away from the middle region of the binding area BB due to the special requirements of the use scenario; in addition, the number of the plurality of signal lines located on the first side of the reference line CK is greater than the number of the plurality of signal lines located on the second side of the reference line CK; the line width (for example, W2) of at least part of the plurality of signal lines located on the second side of the reference line CK is greater than the line width (for example, W1) of part of the plurality of signal lines located on the first side of the reference line CK; in this way, on the one hand, the design space of the wiring in the binding area BB can be significantly improved, and the space utilization of the wiring sub-area can be improved; on the other hand, by arranging the line width (for example, W2) of at least part of the plurality of signal lines located on the second side of the reference line CK to be greater than the line width (for example, W1) of part of the plurality of signal lines located on the first side of the reference line CK, the current load of the signal line in the binding area BB can be improved to a certain extent, the use performance of the light-emitting substrate can be improved, and the manufacturing cost can be reduced.

[0080] In the light-emitting substrate provided in some embodiments of the present application, as shown in FIGS. 2 and 3, the signal line includes a driving line VLED and a ground line GND; in the wiring sub-area, the driving line VLED includes a first line segment XD1 extending along a first direction (for example, the BA direction) and a second line segment XD2 extending along a second direction (for example, the BC direction), and the ground line GND includes a third line segment XD3 extending along the first direction (for example, the BA direction) and a fourth line segment XD4 extending along the second direction (for example, the BC direction).

[0081] In the light-emitting substrate provided in some embodiments of the present application, as shown in FIGS. 2 and 3, the signal line includes a driving line VLED and a ground line GND; in the wiring sub-area, the driving line VLED includes a first line segment XD1 extending along a first direction (for example, the BA direction) and a second line segment XD2 extending along a second direction (for example, the BC direction), and the ground line GND includes a third line segment XD3 extending along the first direction (for example, the BA direction) and a fourth line segment XD4 extending along the second direction (for example, the BC direction).

[0082] It should be noted that the first side and the second side of the reference line CK are defined by the number of signal lines on the two sides, wherein the side with a larger number of signal lines is defined as the first side of the reference line CK, and the side with a smaller number of signal lines is defined as the second side of the reference line CK.

[0083] In FIG. 2, the first side of the reference line CK is the left side, and the second side of the reference line CK is the right side; in FIG. 3, the second side of the reference line CK is the left side, and the first side of the reference line CK is the right side; the definition of the first side and the second side of the reference line CK in other drawings of the present specification is similar, and thus will not be described here.

[0084] In some examples, the line width W2 of the part of the second line segment XD2 located on the second side of the reference line CK is substantially equal to the line width W4 of the part of the fourth line segment XD4 located on the second side of the reference line CK.

[0085] In some examples, the line width of the portion of the second line segment XD2 on the first side of the reference line CK is substantially equal to the line width of the portion of the fourth line segment XD4 on the first side of the reference line CK.

[0086] In some examples, the line width of the portion of the first line segment XD1 on the first side of the reference line CK is substantially equal to the line width of the portion of the first line segment XD1 on the second side of the reference line CK.

[0087] In some examples, the line width of the portion of the third line segment XD3 on the first side of the reference line CK is substantially equal to the line width of the portion of the third line segment XD3 on the second side of the reference line CK.

[0088] In the light-emitting substrate provided by the embodiments of the present application, the line width of the at least part of the line segment of the plurality of signal lines on the second side of the reference line CK (e.g., W2) is greater than the line width of the part of the line segment of the plurality of signal lines on the first side of the reference line CK (e.g., W1); so that there is sufficient design space on the second side of the reference line CK in the binding area BB, and by increasing the line width (e.g., W2 and W4) of the line segment of the driving line VLED and the ground line GND extending in the second direction (e.g., the BC direction) on the second side, the current load of the signal line in the binding area BB can be improved to a certain extent, and the use performance of the light-emitting substrate is improved.

[0089] In the light-emitting substrate provided by some embodiments of the present application, as shown in FIGS. 2 and 3, in the wiring sub-area, the line width of the portion of the driving line VLED on the second side of the reference line CK is 1-2 times the line width of the portion of the driving line VLED on the first side of the reference line CK, and the line width of the portion of the ground line GND on the second side of the reference line CK is 1-2 times the line width of the portion of the ground line GND on the first side of the reference line CK.

[0090] In some embodiments, the line width of the portion of the first line segment XD1 of the driving line VLED on the second side of the reference line CK is substantially equal to the line width of the portion of the first line segment XD1 of the driving line VLED on the first side of the reference line CK; and the line width of the portion of the third line segment XD3 of the ground line GND on the second side of the reference line CK is substantially equal to the line width of the portion of the third line segment XD3 of the ground line GND on the first side of the reference line CK.

[0091] In some embodiments, in the wiring sub-region, as shown in FIGS. 2, 3 and 4, the line width W2 of the portion of the second line segment XD2 of the driving line VLED located on the second side of the reference line CK is 1-2 times the line width W1 of the portion of the second line segment XD2 of the driving line VLED located on the first side of the reference line CK, and the line width W4 of the portion of the fourth line segment XD4 of the ground line GND located on the second side of the reference line CK is 1-2 times the line width W3 of the portion of the fourth line segment XD4 of the ground line GND located on the first side of the reference line CK.

[0092] For example, the line width W2 of the portion of the second line segment XD2 of the driving line VLED located on the second side of the reference line CK is 1.5±0.3 times the line width W1 of the portion of the second line segment XD2 of the driving line VLED located on the first side of the reference line CK, and the line width W4 of the portion of the fourth line segment XD4 of the ground line GND located on the second side of the reference line CK is 1.5±0.3 times the line width W3 of the portion of the fourth line segment XD4 of the ground line GND located on the first side of the reference line CK.

[0093] For example, the line width W1 of the portion of the second line segment XD2 of the driving line VLED located on the first side of the reference line CK is approximately 900 μm±200 μm, and the line width W2 of the portion of the second line segment XD2 of the driving line VLED located on the second side of the reference line CK is approximately 1600 μm±200 μm.

[0094] For example, the line width W1 of the portion of the second line segment XD2 of the driving line VLED located on the first side of the reference line CK can be 750 μm, 780 μm, 800 μm, 830 μm, 850 μm, 880 μm, 900 μm, 930 μm, 950 μm, 1000 μm, 1050 μm or 1100 μm.

[0095] For example, the line width W2 of the portion of the second line segment XD2 of the driving line VLED located on the second side of the reference line CK can be 1400 μm, 1450 μm, 1480 μm, 1550 μm, 1600 μm, 1620 μm, 1630 μm, 1650 μm, 1700 μm, 1750 μm or 1800 μm.

[0096] For example, the line width W3 of the portion of the fourth line segment XD4 of the ground line GND located on the first side of the reference line CK is approximately 900 μm±200 μm, and the line width W4 of the portion of the fourth line segment XD4 of the ground line GND located on the second side of the reference line CK is approximately 1600 μm±200 μm.

[0097] For example, the line width W3 of the fourth line segment XD4 of the ground line GND at the portion of the first side of the reference line CK can be 750 μm, 780 μm, 800 μm, 830 μm, 850 μm, 880 μm, 900 μm, 930 μm, 950 μm, 1000 μm, 1050 μm, or 1100 μm.

[0098] For example, the line width W4 of the fourth line segment XD4 of the ground line GND at the portion of the second side of the reference line CK can be 1400 μm, 1450 μm, 1480 μm, 1550 μm, 1600 μm, 1620 μm, 1630 μm, 1650 μm, 1700 μm, 1750 μm, or 1800 μm.

[0099] In the light-emitting substrate provided in some embodiments of the present application, as shown in FIG. 2, the light-emitting region AA includes a plurality of lamp regions D arranged in an array, and the same row of lamp regions D arranged along a first direction (for example, the BA direction) are respectively electrically connected to the same driving line VLED and the same ground line GND.

[0100] As shown in FIGS. 2, 6, and 8, in the region between the first row of lamp regions D and the second row of lamp regions D, a first compensation structure VLED-B is further arranged between two adjacent lamp regions D along the first direction (for example, the BA direction), the first compensation structure VLED-B extends along a second direction (for example, the BC direction) and is directly connected to the driving line VLED, and the first row of lamp regions D is located between the binding region BB and the second row of lamp regions D.

[0101] It should be noted that, since the first row of lamp regions D is located between the binding region BB and the second row of lamp regions D, it can be understood that the first row of lamp regions D refers to the first row from the direction of the binding region BB (for example, the direction from bottom to top in FIG. 2).

[0102] In the light-emitting substrate provided in the embodiments of the present application and the light-emitting substrate in the related art as shown in FIG. 1, for any column of lamp regions D of the light-emitting substrate, the same column of lamp regions D is provided with the driving line VLED on one side and the input line DI, the power line VCC, and the ground line GND on the other side, the light-emitting device Q1 of each lamp region D in the same column of lamp regions D is electrically connected to the driving line VLED, and all the light-emitting devices Q1 in the lamp region D are respectively electrically connected to the input line DI, the power line VCC, and the ground line GND through the micro driving chip Q2.

[0103] The number of the lamp regions D included in the light-emitting substrate is not limited herein. For example, when the light-emitting substrate is applied to a small-sized display product such as a mobile phone, an electronic watch, a computer screen, etc., the light-emitting substrate can include 9 lamp regions, 16 lamp regions, or 25 lamp regions; when the light-emitting substrate is applied to a large-sized display product such as a television or an outdoor display screen, the light-emitting substrate can include dozens, hundreds, or even thousands of lamp regions, for example, 1440 lamp regions or 1052 lamp regions; and the number of the lamp regions can be determined according to actual application requirements.

[0104] In an exemplary embodiment, one lamp region D can include one light-emitting device Q1 to realize independent control of each light-emitting device Q1; or one lamp region D can include a plurality of light-emitting devices Q1, for example, one lamp region D can include 4, 6, 8, or 9 light-emitting devices Q1, and all the light-emitting devices Q1 in the same lamp region D can be controlled by one micro drive chip Q2.

[0105] In an exemplary embodiment, the light-emitting device Q1 can be a Mini Light Emitting Diode (Mini LED) or a Micro Light Emitting Diode (Micro LED), which is not limited herein.

[0106] In an exemplary embodiment, one lamp region D can be provided with one micro drive chip Q2, and the overall light-emitting brightness of each lamp region D in the light-emitting substrate is controlled by the micro drive chip Q2 to realize the function of local dimming of the light-emitting substrate.

[0107] In the embodiments of the present application, as described above, the line width (e.g. W2) of the at least part of the line segments of the plurality of signal lines on the second side of the reference line CK is greater than the line width (e.g. W1) of the part of the line segments of the plurality of signal lines on the first side of the reference line CK, as shown in FIG. 2 and FIG. 8, by arranging a plurality of first compensation structures VLED-B in the area between the first row of lamp areas D and the second row of lamp areas D from one side of the binding area BB, on the one hand, when a larger current needs to be set in the light-emitting substrate, by electrically connecting the plurality of first compensation structures VLED-B, the current transmitted by the signal line (e.g. the driving line VLED) with a larger line width on the second side of the reference line CK can be delivered to the entire lamp area D of the light-emitting area AA of the light-emitting substrate, thereby improving the current intensity of each lamp area D in the light-emitting area AA, thereby improving the brightness of each lamp area, in addition, by arranging and electrically connecting only one row of first compensation structures VLED-B, the uniformity of the signals received by each lamp area D in the light-emitting area AA can be improved, thereby improving the brightness uniformity; on the other hand, when a smaller current needs to be set in the light-emitting substrate, the plurality of first compensation structures VLED-B can be used normally without electrical connection. In this way, the same kind of light-emitting substrate can be used in different types of products, expanding its application range, greatly reducing the production cost of the light-emitting substrate.

[0108] In the light-emitting substrate provided in some embodiments of the present application, as shown in FIG. 2, FIG. 6 and FIG. 8, a second compensation structure GND-B is further arranged between two adjacent lamp areas D in the first direction (e.g. BA direction) in the area between the 2nd row of lamp areas D and the 3rd row of lamp areas D, the second compensation structure GND-B extends in the second direction (e.g. BC direction) and is directly connected to the ground line GND.

[0109] In the embodiments of the present application, as described above, the line width (e.g. W2) of the plurality of signal lines on the at least part of the line segment on the second side of the reference line CK is greater than the line width (e.g. W1) of the plurality of signal lines on the part of the line segment on the first side of the reference line CK, as shown in FIG. 2 and FIG. 8, by arranging a plurality of second compensation structures GND-B in the area between the second row of lamp areas D and the third row of lamp areas D from one side of the binding area BB, on the one hand, when a larger current needs to be set in the light-emitting substrate, by electrically connecting the plurality of second compensation structures GND-B, the current transmitted by the signal line (e.g. ground line GND) with a larger line width on the second side of the reference line CK can be delivered to the entire lamp area D of the light-emitting area AA of the light-emitting substrate, thereby improving the current intensity of each lamp area D in the light-emitting area AA, thereby improving the brightness of each lamp area, in addition, by arranging and electrically connecting only one row of second compensation structures GND-B, the uniformity of the signals received by each lamp area D in the light-emitting area AA can be improved, thereby improving the brightness uniformity; on the other hand, when a smaller current needs to be set in the light-emitting substrate, the plurality of second compensation structures GND-B can be normally used without electrical connection. In this way, the same kind of light-emitting substrate can be used in different types of products, thereby expanding its application range and greatly reducing the production cost of the light-emitting substrate.

[0110] In the light-emitting substrate provided in some embodiments of the present application, as shown in FIG. 2, FIG. 6 and FIG. 8, after the second compensation structure GND-B is arranged, a bending structure VLED-W is further arranged between two adjacent lamp areas D in the first direction (e.g. BA direction) in the area between the 2nd row of lamp areas D and the 3rd row of lamp areas D.

[0111] In the embodiments of the present application, after the second compensation structure GND-B is arranged, the bending structure VLED-W needs to be arranged in the area where the second compensation structure GND-B is located to connect the line segments of the two driving lines VLED at the upper and lower positions of the second compensation structure GND-B.

[0112] In the light-emitting substrate provided in some embodiments of the present application, as shown in FIG. 2, FIG. 8, FIG. 9 and FIG. 10, the first compensation structure VLED-B is arranged in the area where the 1st column of lamp areas D to the mth column of lamp areas D are located, the second compensation structure GND-B is arranged in the area where the 2nd column of lamp areas to the mth column of lamp areas are located, and the bending structure VLED-W is arranged in the area where the 2nd column of lamp areas to the mth column of lamp areas are located; m is a positive integer, m>1.

[0113] For example, m=2, 3, 4, 5, 6, 7, 8, 9……

[0114] As shown in Figures 2, 8, 9, and 10, the first compensation structure VLED-B, located in the area where the (m-1)th column of lamps is located, is electrically connected to the drive line VLED located in the area where the (m-1)th column of lamps is located; the second compensation structure GND-B, located in the area where the (m+1)th column of lamps is located, is electrically connected to the grounding line GND located in the area where the (m)th column of lamps is located; and the bending structure located in the area where the (m+1)th column of lamps is located is electrically connected to the drive line located in the area where the (m+1)th column of lamps is located.

[0115] In an exemplary embodiment, when m=2, a first compensation structure VLED-B is provided in the area where the first and second column lamp areas D are located, a second compensation structure GND-B is provided in the second column lamp area, and a bent structure VLED-W is provided in the second column lamp area; in addition, the first compensation structure VLED-B provided in the area where the first column lamp area is located is electrically connected to the drive line VLED provided in the area where the first column lamp area is located; the second compensation structure GND-B provided in the area where the third column lamp area D is located is electrically connected to the grounding line GND provided in the area where the second column lamp area is located; and the bent structure provided in the area where the third column lamp area is located is electrically connected to the drive line provided in the area where the third column lamp area is located.

[0116] In an embodiment of this application, as shown in FIG5B, a layout design of the drive line VLED and the ground line GND in the area where the first and second column lamp areas D are located is provided. Referring to FIG5B and FIG8, in the area where the first column lamp area D is located, a first compensation structure VLED-B and a first connection trace VLED-L are provided, which are electrically connected to the first drive line VLED.

[0117] For example, the length H1 of the first connection trace VLED-L along the second direction is less than the length H2 of the first compensation structure VLED-B along the second direction.

[0118] In some embodiments, as shown in FIG5B, the linewidth W5 of the first connecting trace VLED-L is approximately equal to the linewidth W6 of the first compensation structure VLED-B.

[0119] In some embodiments, as shown in FIG5B, the length H2 of the first compensation structure VLED-B along the second direction is approximately equal to the length H3 of the bending structure VLED-W along the second direction.

[0120] In the embodiments of the present application, as shown in FIG. 5A, a layout design of the ground lines GND in the area where the last column (for example, the mth column) of the light zones D is provided. Among them, the m-1th ground line GND (provided in the area where the mth column of the light zones is located) is connected with the second compensation structure GND-B, the mth ground line GND is located at the right side of the mth column of the light zones, and the mth ground line GND is not provided (not connected) with the second compensation structure GND-B.

[0121] In some embodiments, as shown in FIG. 5B, the mth ground line GND is provided with a connection structure GND-Z, and the second conductive pad group G2 is provided on the connection structure GND-Z, so as to connect the plurality of ground lines GND in parallel.

[0122] In the exemplary embodiments, the line width of the connection structure GND-Z along the first direction is substantially equal to the line width of the second compensation structure GND-B along the first direction.

[0123] In the light-emitting substrate provided in some embodiments of the present application, as shown in FIGS. 7, 9 and 10, in the area between the nth row of light zones and the (n+1)th row of light zones D, a first compensation structure VLED-B is further provided between two adjacent light zones D along the first direction (for example, the BA direction), the first compensation structure VLED-B extends along the second direction (for example, the BC direction) and is directly connected with the driving line VLED; n is a positive integer.

[0124] For example, n is the number of rows of the light zones D, for example, n = 1, 2, 3, 4, 5, 6, 7, 8, 9, ….

[0125] In the embodiments of the present application, by providing a plurality of first compensation structures VLED-B between the plurality of rows of light zones D in the light-emitting area AA, when a larger current needs to be set in the light-emitting substrate, the current transmitted by the signal line (for example, the driving line VLED) with a larger line width on the second side of the reference line CK can be transmitted to the entire light zone D in the light-emitting area AA of the light-emitting substrate by electrically connecting a plurality of first compensation structures VLED-B in the same row, thereby improving the current intensity of each light zone D in the light-emitting area AA, thereby improving the brightness of each light zone; it can also greatly provide the brightness uniformity between each light zone D, and improve the display effect of the back device or display device prepared by the light-emitting substrate.

[0126] In the light-emitting substrate provided in some embodiments of the present application, as shown in FIGS. 7, 9 and 10, in the area between the (n+1)th row of light zones D and the (n+2)th row of light zones D, a second compensation structure GND-B is further provided between two adjacent light zones D along the first direction (for example, the BA direction), the second compensation structure GND-B extends along the second direction (for example, the BC direction) and is directly connected with the ground line GND.

[0127] In the embodiment of the present application, by arranging the second compensation structure GND-B between the multiple rows of lamp areas D in the light-emitting area AA, when a larger current needs to be set in the light-emitting substrate, by means of electrically connecting multiple second compensation structures GND-B in the same row, the current transmitted by the signal line (for example, the ground line GND) with a larger line width on the second side of the reference line CK can be transmitted to the entire lamp area D of the light-emitting area AA of the light-emitting substrate, thereby improving the current intensity of each lamp area D in the light-emitting area AA, and thus improving the brightness of each lamp area. The brightness uniformity between each lamp area D can also be greatly improved, thereby improving the display effect of the back surface device or the display device prepared by the light-emitting substrate.

[0128] The light-emitting substrate provided by the embodiment of the present application can be used to prepare display devices (or backlight modules) with different current gradients, so as to meet different brightness setting requirements.

[0129] In some embodiments, after the first compensation structure VLED-B is connected in parallel with the driving line VLED and the second compensation structure GND-B is connected in parallel with the ground line GND, the current intensity can be improved by 30%, for example, the current is improved from 4.5 mA to 5.8 mA, which greatly improves the brightness of the display device (or backlight module).

[0130] In the light-emitting substrate provided by some embodiments of the present application, as shown in FIGS. 7, 9 and 10, in the area between the nth+1 row of lamp areas D and the nth+2 row of lamp areas D, a bending structure VLED-W is further arranged between two adjacent lamp areas D along the first direction (for example, the BA direction), and the bending structure VLED-W partially surrounds the second compensation structure VLED-B and is electrically connected with the driving line VLED.

[0131] In the embodiment of the present application, after the second compensation structure GND-B is arranged, the bending structure VLED-W needs to be arranged in the area where the second compensation structure GND-B is located, so as to connect the line segments of the two driving lines VLED at the upper and lower positions of the second compensation structure GND-B.

[0132] In the light-emitting substrate provided by some embodiments of the present application, as shown in FIG. 5B, the line width W7 of the second compensation structure GND-B along the first direction is smaller than the line width W6 of the first compensation structure VLED-B along the first direction.

[0133] In the light-emitting substrate provided by some embodiments of the present application, as shown in FIG. 5B, the maximum dimension W8 of the bending structure VLED-W along the first direction is equal to the line width W6 of the first compensation structure VLED-B along the first direction.

[0134] In the embodiments of the present application, by setting the maximum size W8 of the bending structure VLED-W along the first direction equal to the line width W6 of the first compensation structure VLED-B along the first direction, the designed compensation structure and bending structure do not compress the design space of the lamp area, so that the space between the lamp area D between the bending structure VLED-W and the first compensation structure VLED-B and the space size of other lamp areas D tend to be consistent, thereby being able to guarantee the consistency of the light emitting area of each lamp area D as much as possible, simplify the design difficulty, and thereby improve the brightness uniformity of the backlight module or display device prepared from the light emitting substrate.

[0135] In the light emitting substrate provided in some embodiments of the present application, when a larger current intensity is required for the light emitting substrate, two adjacent first compensation structures VLED-B can be electrically connected in the area between the first row of lamp areas and the second row of lamp areas, so as to connect multiple driving lines VLED in parallel; two adjacent second compensation structures GND-B can be electrically connected in the area between the second row of lamp areas and the third row of lamp areas, so as to connect multiple ground lines GND in parallel.

[0136] In the light emitting substrate provided in some embodiments of the present application, as shown in FIG. 12, the two ends of the first compensation structure VLED-B are respectively provided with a first conductive pad group G1, and as shown in FIG. 11, the two ends of the second compensation structure GND-B are respectively provided with a second conductive pad group G2, the first conductive pad group G1 is used to electrically connect two adjacent first compensation structures VLED-B together, and the second conductive pad group G2 is used to electrically connect two adjacent second compensation structures GND-B together.

[0137] For example, as shown in FIG. 12, a first conductive pattern is arranged between the first conductive pad groups G1 to electrically connect two adjacent first compensation structures VLED-B together.

[0138] For example, as shown in FIG. 11, a second conductive pattern is arranged between the second conductive pad groups G2 to electrically connect two adjacent second compensation structures GND-B together.

[0139] For example, the first conductive pattern and the second conductive pattern can be a long strip or a rectangular pattern, and the size range thereof can be (0.5-1)*(6-9.6) mm.

[0140] In the exemplary embodiments, the first conductive pad group G1 can include a first solder pad, and the second conductive pad group G2 can include a second solder pad; when a larger current intensity is required for the light emitting substrate, two adjacent first solder pads along the second direction can be electrically connected by a soldering process (including but not limited to a soldering process) to realize the parallel connection of multiple driving lines VLED, and two adjacent second solder pads along the second direction can be electrically connected to realize the parallel connection of multiple ground lines GND.

[0141] For example, the first pad and the second pad can each be a rectangle or a rectangle with rounded corners, and the size of the first pad and the second pad can range from (0.5-1)*(0.75-1.5) mm.

[0142] In the light-emitting substrate provided in some embodiments of the present application, the plurality of signal lines are arranged in the same layer.

[0143] In the present application, the "same layer" refers to the relationship between a plurality of film layers formed by the same material after the same step (for example, one patterning process).

[0144] Here, the "same layer" does not always mean that the thickness of the plurality of film layers is the same or that the height of the plurality of film layers in a cross-sectional view is the same.

[0145] For example, the plurality of signal lines can include a driving line VLED, a ground line GND, an input line DI, and a power supply line VCC.

[0146] In an exemplary embodiment, before the plurality of driving lines are connected in parallel (or the plurality of ground lines are connected in parallel), the light-emitting substrate can include a single-layer conductive layer, for example, a single-layer metal. By arranging each signal line and conductive structure on the same conductive layer, the process of the light-emitting substrate can be greatly reduced, and the preparation cost can be reduced.

[0147] In the light-emitting substrate provided in some embodiments of the present application, as shown in FIGS. 13 and 14, the light-emitting substrate includes:

[0148] a substrate 1;

[0149] a conductive layer 2 on the substrate 1; the conductive layer 2 includes a plurality of signal lines, a plurality of traces, a plurality of first conductive pad groups G1, a plurality of second conductive pad groups G2, a plurality of third conductive pad groups G3, and a plurality of fourth conductive pad groups G4 as shown in FIGS. 5A and 5B; the third conductive pad groups G3 are used to connect light-emitting devices Q1, and the fourth conductive pad groups G4 are used to connect micro driving chips Q2;

[0150] a reflective layer 4 covering the conductive layer 2; as shown in FIGS. 15 and 16, the reflective layer 4 is provided with a plurality of first openings Via1 and a plurality of second openings Via2, and the outer contour of the first opening Via1 has a projection on the substrate 1 that overlaps the projection of the first conductive pad group G1 on the substrate 1, and the outer contour of the second opening Via2 has a projection on the substrate 1 that overlaps the projection of the second conductive pad group G2 on the substrate 1.

[0151] In the case where two adjacent first compensation structures VLED-B are electrically connected, the outer contour of the first opening Via1 has a projection on the substrate 1 that overlaps the projection of the first conductive pad group G1 on the substrate 1.

[0152] When it is needed to electrically connect two adjacent first compensation structures VLED-B, a first via Via1 can be opened on the substrate, so that the first via Via1 exposes the first conductive pad group G1, and then the two adjacent first conductive pad groups G1 are connected together by a conductive structure.

[0153] When it is needed to electrically connect two adjacent first compensation structures VLED-B, a first via Via1 can be opened on the substrate, so that the first via Via1 exposes the first conductive pad group G1, and then the two adjacent first conductive pad groups G1 are connected together by a conductive structure.

[0154] When it is needed to electrically connect two adjacent first compensation structures VLED-B, a first via Via1 can be opened on the substrate, so that the first via Via1 exposes the first conductive pad group G1, and then the two adjacent first conductive pad groups G1 are connected together by a conductive structure.

[0155] In some embodiments, the material of the substrate can be any one of glass, silicon, quartz, and PET (Polyethylene terephthalate). The thickness of the substrate can range from 0.2 mm to 1 mm. For example, the thickness of the substrate can be 0.2 mm, 0.4 mm, 0.5 mm, 0.7 mm, or 1 mm.

[0156] In an exemplary embodiment, the conductive layer 2 includes a copper metal layer, a molybdenum-niobium alloy layer, and a copper metal layer arranged in layers; or the conductive layer 2 can include a copper metal layer, a molybdenum-niobium alloy layer, a copper metal layer, a molybdenum-niobium alloy layer, and a copper metal layer arranged in layers.

[0157] For example, the third conductive pad group G3 is used to connect the light emitting device Q1, and the third conductive pad group G3 can include two conductive pads (e.g., two pads). One of the conductive pads in the third conductive pad group G3 is electrically connected to the driving line VLED, and the other is electrically connected to the micro drive chip Q2.

[0158] For example, the fourth conductive pad group G4 is used to connect the micro drive chip Q2. As shown in FIG. 17, the fourth conductive pad group G4 can include twelve conductive pads, wherein eight conductive pads marked with numbers 1-8 are respectively electrically connected to eight light emitting devices Q1 in the same light area, and the other conductive pads are respectively connected to the ground line GND, the DI line input, the DI line output, the VCC line output, and the VCC line output. Of course, in some other embodiments, the fourth conductive pad group G4 can also be different according to the number of light emitting devices Q1 in the same light area, and can be designed according to actual conditions.

[0159] The plurality of traces in the conductive layer 2 includes, but is not limited to, traces between the conductive pad group and the driving line VLED, traces between the conductive pad group and the ground line GND, and traces between different types of conductive pad groups. For details, refer to the design in the related art, which will not be described herein.

[0160] Since the light emitted by the light emitting device Q2 is emitted in all directions, the reflective layer 4 can reflect the light emitted by the light emitting device to the light emitting surface of the light emitting panel, so as to improve the light utilization rate of the light emitting device.

[0161] In some embodiments, the reflective layer 4 is white in color, so as to have a high reflectivity.

[0162] For example, the material of the reflective layer 4 can include white ink, and the components of the white ink can include resin (e.g., epoxy resin, polytetrafluoroethylene resin), titanium dioxide (chemical formula TiO2), and organic solvent (e.g., dipropylene glycol methyl ether), etc.

[0163] For example, the material of the reflective layer 4 can also include silicon-based white glue.

[0164] For example, the material of the reflective layer 4 can also include reflective sheet.

[0165] For example, the material of the reflective layer 4 can include light-cured resin.

[0166] In some embodiments, the reflective layer 4 can also be made on the light emitting substrate by sputtering, plating, coating, etc., or in some other embodiments, the reflective layer 4 can be made on the light emitting substrate by printing process.

[0167] For example, the light emitting device can be a mini light emitting diode (Mini LED) or a micro light emitting diode (Micro LED), which is not limited herein.

[0168] For example, the plurality of light emitting devices can all be blue light emitting mini light emitting diodes or micro light emitting diodes, or the plurality of light emitting devices can simultaneously include red light emitting, green light emitting, and blue light emitting light emitting diodes or micro light emitting diodes.

[0169] In the example embodiment, the size of the first opening Via1 can be determined according to the size of the first conductive pad group G1, and generally, the size of the first opening Via1 is larger than the size of the first conductive pad group G1.

[0170] Exemplarily, the first conductive pad group G1 includes one first conductive pad, and a planar shape of the first conductive pad can be a rectangle or a rectangle with rounded corners, and a size range of the first conductive pad can be (0.5-1)*(0.75-1.5) mm. A planar shape of the first opening Via1 is the same as that of the first conductive pad, and a side length of the planar shape of the first opening Via1 is 50-100 μm larger than that of the planar shape of the first conductive pad.

[0171] In the light-emitting substrate provided in some embodiments of the present application, as shown in FIG. 13, the light-emitting substrate further includes a passivation layer 3 located between the conductive layer 2 and the reflective layer 4, and the passivation layer 3 is provided with a plurality of first grooves C1 and a plurality of second grooves C2, and the reflective layer 4 extends into the first grooves C1 and the second grooves C2; wherein, in FIG. 13, the structure at the position of the first groove C1 is taken as an example for drawing, and the structure at the position of the second groove C2 is similar to that at the position of the first groove C1.

[0172] As shown in FIG. 15, when two adjacent first compensation structures VLED-B are electrically connected, the outer contour of the first opening Via1 and the outer contour of the first groove C1 overlap in the orthographic projection on the substrate 1.

[0173] When it is necessary to electrically connect two adjacent first compensation structures VLED-B, the first opening Via1 and the first groove C1 can be formed on the substrate, so that the first opening Via1 and the first groove C1 expose the first conductive pad group G1, and then the two adjacent first conductive pad groups G1 are connected together through a conductive structure.

[0174] When two adjacent second compensation structures GND-B are electrically connected, the outer contour of the second opening Via2 and the outer contour of the second groove C2 overlap in the orthographic projection on the substrate 1.

[0175] When it is necessary to electrically connect two adjacent second compensation structures GND-B, the second opening Via2 and the second groove C2 can be formed on the substrate, so that the second opening Via2 and the second groove C2 expose the second conductive pad group G2, and then the two adjacent second conductive pad groups G2 are connected together through a conductive structure.

[0176] In FIGS. 13-16, the structure at the position of the first conductive pad group G1 provided with the first opening Via1 and the first groove C1 is taken as an example for drawing; the structure at the position of the second conductive pad group G2 provided with the second opening Via2 and the second groove C2 is similar to that at the position of the first conductive pad group G1, and thus is not described herein.

[0177] When the two adjacent first compensation structures VLED-B need to be electrically connected, and the two adjacent second compensation structures GND-B need to be electrically connected, a new reflecting layer 4 is updated in the actual production process. For example, when the reflecting layer 4 is white oil, a new white oil screen plate is updated, and other production equipment can be used universally, thereby minimizing the use cost of consumables and equipment.

[0178] In actual application, the light emitting substrate can be applied in a backlight module or a display device according to different types of light emitting devices. Specifically, if the plurality of light emitting devices Q1 are all blue light emitting devices, the light emitting substrate can be applied in a backlight module; if the plurality of light emitting devices Q1 include red light emitting devices, green light emitting devices and blue light emitting devices, the light emitting substrate can be applied in a display device.

[0179] Embodiments of the present application provide a backlight module comprising the light emitting substrate according to any one of the preceding embodiments, wherein the light emitting area AA of the light emitting substrate comprises a plurality of lamp areas D arranged in an array;

[0180] The lamp area D is provided with at least one micro driving chip Q2 and a plurality of light emitting devices Q1; the plurality of light emitting devices Q1 have the same light emitting color.

[0181] In exemplary embodiments, the backlight module can further comprise a diffusion plate, a quantum dot film, a diffusion sheet and a composite film, wherein the diffusion plate and the diffusion sheet are mainly used to eliminate lamp shadows and improve picture uniformity, the composite film is mainly used to increase brightness, and the quantum dot film can convert blue light into white light through excitation of blue light when the light emitting color of the light emitting device is blue light.

[0182] Embodiments of the present application provide a display device comprising the light emitting substrate according to any one of the preceding embodiments, wherein the light emitting area AA of the light emitting substrate comprises a plurality of lamp areas D arranged in an array;

[0183] The lamp area D is provided with at least one micro driving chip Q2 and a plurality of light emitting devices Q1; the plurality of light emitting devices Q1 include a plurality of light emitting devices with different light emitting colors.

[0184] The above merely provides a specific implementation of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A light-emitting substrate, wherein, The light-emitting substrate comprises a light-emitting region and a binding region located on one side of the light-emitting region; The binding region comprises a chip setting sub-region and a wiring sub-region, and the wiring sub-region is located between the chip setting sub-region and the light-emitting region; the geometric center of the binding region does not overlap with the geometric center of the chip setting sub-region; The light-emitting region comprises a plurality of signal lines extending along a first direction, and the plurality of signal lines extend from the light-emitting region to the wiring sub-region; in the wiring sub-region, the number of signal lines located on the first side of a reference line is greater than the number of signal lines located on the second side of the reference line; the line width of at least part of the signal lines located on the second side of the reference line is greater than the line width of part of the signal lines located on the first side of the reference line; The reference line extends along the first direction and is located on the side of the geometric center of the chip setting sub-region away from the geometric center of the binding region; the first direction is the direction of the binding region pointing to the light-emitting region.

2. The light-emitting substrate according to claim 1, wherein The signal lines comprise driving lines and ground lines; In the wiring sub-region, the driving lines comprise first line segments extending along the first direction and second line segments extending along a second direction, and the ground lines comprise third line segments extending along the first direction and fourth line segments extending along the second direction; The line width of part of the second line segments located on the second side of the reference line is greater than the line width of part of the second line segments located on the first side of the reference line; the line width of part of the fourth line segments located on the second side of the reference line is greater than the line width of part of the fourth line segments located on the first side of the reference line; and the second direction is perpendicular to the first direction.

3. The light-emitting substrate of claim 2, wherein, In the wiring sub-region, the line width of part of the driving lines located on the second side of the reference line is 1-2 times the line width of part of the driving lines located on the first side of the reference line, and the line width of part of the ground lines located on the second side of the reference line is 1-2 times the line width of part of the ground lines located on the first side of the reference line.

4. The light-emitting substrate of claim 2, wherein, The light-emitting region comprises a plurality of light regions arranged in an array, and the same row of light regions arranged along the first direction are respectively electrically connected to the same driving line and the same ground line; In the region between the first row of light regions and the second row of light regions, a first compensation structure is further arranged between two adjacent light regions along the first direction, the first compensation structure extends along the second direction and is directly connected to the driving line; and the first row of light regions is located between the binding region and the second row of light regions.

5. The light-emitting substrate of claim 4, wherein, In the region between the second row of light regions and the third row of light regions, a second compensation structure is further arranged between two adjacent light regions along the first direction, the second compensation structure extends along the second direction and is directly connected to the ground line.

6. The light-emitting substrate of claim 5, wherein, In the region between the second row of light regions and the third row of light regions, a bending structure is further arranged between two adjacent light regions along the first direction, the bending structure partially surrounds the second compensation structure and is electrically connected to the driving line.

7. The light-emitting substrate of claim 6, wherein, The first compensation structure is arranged in the area where the lamp area in the first column is located, the second compensation structure is arranged in the area where the lamp area in the second column is located, and the bending structure is arranged in the area where the lamp area in the second column is located; m is a positive integer, and m > 1. The first compensation structure arranged in the area where the lamp area in the m-1th column is located is electrically connected with the driving line arranged in the area where the lamp area in the m-1th column is located; the second compensation structure arranged in the area where the lamp area in the m+1th column is located is electrically connected with the ground line arranged in the area where the lamp area in the mth column is located; and the bending structure arranged in the area where the lamp area in the m+1th column is located is electrically connected with the driving line arranged in the area where the lamp area in the m+1th column is located.

8. The light-emitting substrate of claim 7, wherein, The first compensation structure is arranged between two adjacent lamp areas in the area between the lamp area in the nth row and the lamp area in the (n+1)th row in the first direction; the first compensation structure extends in the second direction and is directly connected with the driving line; and n is a positive integer.

9. The light-emitting substrate of claim 7, wherein, The second compensation structure is arranged between two adjacent lamp areas in the area between the lamp area in the (n+1)th row and the lamp area in the (n+2)th row in the first direction; the second compensation structure extends in the second direction and is directly connected with the ground line.

10. The light-emitting substrate of claim 9, wherein, The bending structure is arranged between two adjacent lamp areas in the area between the lamp area in the (n+1)th row and the lamp area in the (n+2)th row in the first direction; the bending structure partially surrounds the second compensation structure and is electrically connected with the driving line.

11. The light-emitting substrate of claim 10, wherein, The line width of the second compensation structure in the first direction is smaller than the line width of the first compensation structure in the first direction.

12. The light-emitting substrate of claim 10, wherein, The maximum dimension of the bending structure in the second direction is equal to the line width of the first compensation structure in the second direction.

13. The light emitting substrate of claim 10, wherein, Two adjacent first compensation structures are electrically connected in the area between the lamp area in the first row and the lamp area in the second row. Two adjacent second compensation structures are electrically connected in the area between the lamp area in the second row and the lamp area in the third row.

14. The light emitting substrate of claim 10, wherein, Two ends of the first compensation structure are respectively provided with a first conductive pad group, and two ends of the second compensation structure are respectively provided with a second conductive pad group; the first conductive pad group is used for electrically connecting two adjacent first compensation structures together, and the second conductive pad group is used for electrically connecting two adjacent second compensation structures together.

15. The light-emitting substrate according to any one of claims 1 to 6, 8 to 9, 11 to 14, wherein The plurality of signal lines are arranged in the same layer.

16. The light-emitting substrate of claim 14, wherein, The light-emitting substrate comprises: a substrate; the conductive layer on the substrate; the conductive layer comprises the plurality of signal lines, a plurality of traces, a plurality of first conductive pad groups, a plurality of second conductive pad groups, a plurality of third conductive pad groups, and a plurality of fourth conductive pad groups; the third conductive pad groups are used for connecting light-emitting devices, and the fourth conductive pad groups are used for connecting micro driving chips; a reflective layer covering the conductive layer; the reflective layer is provided with a plurality of first openings and a plurality of second openings. In the case that two adjacent first compensation structures are electrically connected, the outer contour of the first opening and the outer contour of the first recess have a projection on the substrate that overlaps the projection of the first group of conductive pads on the substrate; in the case that two adjacent second compensation structures are electrically connected, the outer contour of the second opening and the outer contour of the second recess have a projection on the substrate that overlaps the projection of the second group of conductive pads on the substrate.

17. The light-emitting substrate of claim 16, wherein, The light-emitting substrate further comprises a passivation layer between the conductive layer and the reflective layer, the passivation layer is provided with a plurality of first recesses and a plurality of second recesses, and the reflective layer extends into the first recesses and the second recesses. In the case that two adjacent first compensation structures are electrically connected, the outer contour of the first opening and the outer contour of the first recess have a projection on the substrate that overlaps the projection of the first group of conductive pads on the substrate; in the case that two adjacent second compensation structures are electrically connected, the outer contour of the second opening and the outer contour of the second recess have a projection on the substrate that overlaps the projection of the second group of conductive pads on the substrate.

18. A backlight module, comprising: The light-emitting substrate comprises a plurality of light-emitting areas arranged in an array, and each light-emitting area comprises a plurality of light-emitting regions. The light-emitting regions are provided with at least one micro driving chip and a plurality of light-emitting devices, and the light-emitting devices have the same color.

19. A display device comprising: The light-emitting substrate comprises a plurality of light-emitting areas arranged in an array, and each light-emitting area comprises a plurality of light-emitting regions. The light-emitting regions are provided with at least one micro driving chip and a plurality of light-emitting devices, and the light-emitting devices comprise a plurality of light-emitting devices with different colors.

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