Chip testing apparatus

By introducing lifting components, translation components, and a tray support structure into the chip testing equipment, automated handling of chips and trays is achieved, solving the problem of low automation in existing equipment, improving testing efficiency, and simplifying the equipment structure.

CN122131116APending Publication Date: 2026-06-02KUNSHAN SMARTSENS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
KUNSHAN SMARTSENS TECH CO LTD
Filing Date
2024-12-02
Publication Date
2026-06-02

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    Figure CN122131116A_ABST
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Abstract

This invention provides a chip testing device, including a testing mechanism, a tray mechanism, and a chip and tray transport mechanism. The testing mechanism is used to test chips. The tray mechanism includes a first lifting component capable of outputting lifting motion, a first translation component capable of outputting translation motion, and a tray support structure for stacking trays. The tray is used to hold multiple chips. The first lifting component, the first translation component, and the tray support structure are sequentially connected. The chip and tray transport mechanism is used to transport the chips from the tray mechanism to the testing mechanism and to transport empty trays. The chip testing device provided by this invention uses the first translation component to remove the tray support structure, allowing operators to remove or place stacked trays, thus improving the automation level of the chip testing device.
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Description

Technical Field

[0001] This invention belongs to the field of chip testing technology, and more specifically, relates to a chip testing device. Background Technology

[0002] CMOS image sensors (CIS chips) are widely used in smartphones, automotive electronics, security monitoring, and under-display fingerprint sensors. After chip packaging, functional testing, performance testing, and reliability testing are required to eliminate defective products. Current chip testing equipment often suffers from low automation or complex structures. Summary of the Invention

[0003] The purpose of this invention is to provide a chip testing device to solve the technical problems of low automation and complex structure in existing chip testing devices.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is: to provide a chip testing device, comprising:

[0005] A testing facility having a test cavity for accommodating a chip, and the testing facility being used to test the chip;

[0006] The tray mechanism includes a first lifting component capable of outputting lifting motion, a first translation component capable of outputting translation motion, and a tray support structure for stacking trays. The trays are used to hold multiple chips. The first lifting component, the first translation component, and the tray support structure are sequentially connected by transmission.

[0007] A chip and tray transport mechanism is disposed above the tray mechanism and the testing mechanism. The chip and tray transport mechanism is used to transport the chip from the tray mechanism to the testing mechanism and to transport empty trays.

[0008] Optionally, there are two tray mechanisms, with the tops of the two tray mechanisms being a chip feeding station and a good product placement station, respectively. The tray mechanism is used to move the chips in the tray at the chip feeding station to the testing mechanism. After testing, the good chips are moved to the tray at the good product placement station by the chip and tray transport mechanism.

[0009] Optionally, the number of tray mechanisms is four, with the tops of the four tray mechanisms being a good product placement station, a tray feeding station, a chip feeding station, and a tray storage station, respectively. The tray mechanisms are used to move the chips in the trays at the feeding stations to the testing mechanism. After the trays at the feeding stations are empty, the empty trays are transported to the tray storage station by the chip and tray transport mechanism. After testing is completed, the good chips are moved to the trays at the good product placement station by the chip and tray transport mechanism. After the trays at the good product placement station are full of chips, the trays at the tray feeding station are moved to the good product placement station by the chip and tray transport mechanism.

[0010] Optionally, the four tray mechanisms are arranged at intervals along the first direction, such that the good product placement station, the tray feeding station, the chip feeding station, and the tray receiving station are arranged sequentially along the first direction.

[0011] Optionally, the first lifting assembly includes a lifting motor, a first lead screw, a first nut block, a lifting bracket, and a fixed bracket. The motion output end of the lifting motor is fixedly connected to the first lead screw. The first nut block is threadedly connected to the first lead screw. The lifting bracket is fixedly connected to the first nut block. The fixed bracket is fixedly installed, and the lifting motor is fixed to the fixed bracket. The fixed bracket includes a first support plate, a second support plate, and a fixed column connecting the first support plate and the second support plate. The two ends of the first lead screw are rotatably supported on the first support plate and the second support plate, respectively. The lifting motor is fixedly connected to the first support plate through a motor connecting column, and the first translation assembly is fixed to the second support plate.

[0012] Optionally, the lifting bracket includes a first lifting plate, two spaced-apart second lifting plates, and a lifting column connecting the first lifting plate and the second lifting plates. The material tray support structure is disposed between the two second lifting plates. The lifting column passes through the second support plate. The first lifting plate is fixedly connected to the first nut block. The second lifting plate is used to support stacked material trays.

[0013] Optionally, the testing mechanism includes a second translation component, a second lifting component, and a top cover component connected in sequence, and also includes a testing base having the testing cavity. The top cover component is used to cooperate with the testing base to press the chip.

[0014] Optionally, the testing mechanism includes a second translation component, a second lifting component, and a top cover component connected in sequence, and also includes a testing base having the testing cavity. The top cover component is used to cooperate with the testing base to press the chip.

[0015] Optionally, the chip and tray conveying mechanism includes a first moving module, a second moving module, a third moving module, and a suction nozzle assembly connected in sequence. The first moving module is used to output movement in a first direction, the second moving module is used to output movement in a second direction, and the third moving module is used to output movement in a vertical direction. The suction nozzle assembly is used to pick up and place chips and trays. The first direction, the second direction, and the vertical direction are arranged perpendicularly to each other. At least one of the first moving module and the second moving module includes a linear drive motor capable of outputting linear motion.

[0016] Optionally, the chip testing equipment further includes a testing rack, which has a worktable and a top plate disposed above the worktable. The chip and tray transport mechanism is fixed to the lower side of the top plate, the tray mechanism is fixed to the lower side of the worktable, and the worktable has a tray clearance opening for the trays on the tray mechanism to be exposed. The testing mechanism is fixed to the upper side of the worktable.

[0017] The beneficial effects of the chip testing equipment provided by this invention are as follows: Compared with the prior art, the chip testing equipment of this invention includes a testing mechanism, a tray mechanism, and a chip and tray transport mechanism. The chip and tray transport mechanism can transport chips from the chip feeding station of the tray mechanism to the testing mechanism for testing. Simultaneously, it can transport empty trays to the chip feeding station or remove used empty trays, eliminating the need for manual handling of empty trays and improving automation. Furthermore, the equipment structure is relatively simple. Moreover, the tray mechanism includes a first lifting component, a first translation component, and a tray support structure connected in sequence. After the top tray is no longer in use and is removed, the tray support structure can be raised to allow the next layer of trays to rise to a predetermined position for use. Additionally, the first translation component can remove the tray support structure, allowing workers to remove or place stacked trays, further improving the automation level of the chip testing equipment. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 The three-dimensional structure of the chip testing equipment provided in the embodiments of the present invention Figure 1 ;

[0020] Figure 2 The three-dimensional structure of the chip testing equipment provided in the embodiments of the present invention Figure 2;

[0021] Figure 3 This is a three-dimensional structural diagram of the tray mechanism provided in an embodiment of the present invention;

[0022] Figure 4 A perspective structural diagram of the first lifting component provided in an embodiment of the present invention;

[0023] Figure 5 A three-dimensional structural diagram of the testing mechanism provided in an embodiment of the present invention;

[0024] Figure 6 A three-dimensional structural diagram of the chip and tray handling mechanism provided in an embodiment of the present invention;

[0025] Figure 7 A three-dimensional structural diagram of the first mobile module provided in an embodiment of the present invention;

[0026] Figure 8 Exploded structure of linear drive mechanism provided in embodiments of the present invention Figure 1 ;

[0027] Figure 9 Exploded structure of linear drive mechanism provided in embodiments of the present invention Figure 2 ;

[0028] Figure 10 The three-dimensional structure of the third moving module and the suction nozzle assembly provided in the embodiments of the present invention Figure 1 ;

[0029] Figure 11 The three-dimensional structure of the third moving module and the suction nozzle assembly provided in the embodiments of the present invention Figure 2 .

[0030] The following are the labeling elements in the figure:

[0031] 10-Testing mechanism; 11-Second translation component; 12-Second lifting component; 13-Upper cover component; 14-Control board; 15-Testing base;

[0032] 20-Package mechanism; 201-Good product placement station; 202-Package feeding station; 203-Chip feeding station; 204-Package storage station; 21-First lifting assembly; 211-Lifting motor; 212-First lead screw; 213-First nut block; 214-Lifting bracket; 2141-First lifting plate; 2142-Second lifting plate; 2143-Lifting column; 2144-First photoelectric baffle; 215-Fixed bracket; 2151-First support plate; 2152-Second support plate; 2153-Fixed support column; 216-Motor connecting column; 217-First photoelectric sensor; 22-First translation assembly; 221-First translation motor; 222-Second lead screw; 223-Second nut block; 224-Translation slide rail; 23-Package support structure; 231-Supporting base plate; 232-Positioning upright plate; 24-Connecting support column;

[0033] 30 - Chip and tray handling mechanism; 31 - First moving module; 311 - Linear drive motor; 3111 - Fixed base; 31111 - Vertical plate; 31112 - Buffer; 3112 - First slide rail; 3113 - First sliding structure; 31131 - First slider; 31132 - Connecting block; 3114 - Stator; 3115 - Mover; 3116 - Grating reader; 3117 - Second photoelectric sensor; 3118 - Second photoelectric baffle; 3119 - Dust cover; 312 - Auxiliary mechanism; 3121 - Auxiliary fixing 3122-Auxiliary slide rail; 3123-Auxiliary slider; 32-Second moving module; 33-Third moving module; 331-First stroke assembly; 3311-Third motor; 3312-Third lead screw; 3314-Second sliding structure; 3315-Second slide rail; 332-Second stroke assembly; 3321-Cylinder; 333-Fixing plate; 334-Safety cover; 3341-Air pipe connector; 335-Solenoid valve; 336-Vacuum generator; 34-Nose assembly; 341-First nozzle; 342-Second nozzle;

[0034] 40-Testing frame; 41-Workbench; 411-Defective product placement station; 42-Top plate; 43-Loading / unloading port. Detailed Implementation

[0035] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0036] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0037] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0039] CIS chips are widely used in smartphones, automotive electronics, security monitoring, and under-display fingerprint sensors. After chip packaging, functional testing, performance testing, and reliability testing are required to eliminate defective products. Current chip testing equipment often suffers from low automation or complex structures.

[0040] To alleviate and solve the above-mentioned technical problems, this invention proposes a novel chip testing device, including a testing mechanism 10, a tray mechanism 20, and a chip and tray transport mechanism 30. The tray mechanism 20 is used to hold multiple stacked trays. The chip and tray transport mechanism 30 can transport chips from the tray mechanism 20 to the testing mechanism 10 for testing, and can also transport used or unused empty trays to a predetermined position. Trays on the tray mechanism 20 can be moved via the chip and tray transport mechanism 30. Furthermore, the tray mechanism 20 can raise and lower the stacked trays. After the stacked trays have been used or stored, they can be removed from the tray support structure 23 for manual placement or removal. Thus, this chip testing device has a high degree of automation, fewer mechanisms, and is convenient for maintenance and management.

[0041] The chip testing equipment provided in the embodiments of the present invention will now be described.

[0042] Please refer to the following: Figure 1 and Figure 2 The chip testing equipment includes:

[0043] The testing mechanism 10 has a testing cavity for accommodating the chip, and the testing mechanism 10 is used to test the chip;

[0044] The tray mechanism 20 includes a first lifting component 21 capable of outputting lifting motion, a first translation component 22 capable of outputting translation motion, and a tray support structure 23 for stacking trays. The tray is used to hold multiple chips. The first lifting component 21, the first translation component 22, and the tray support structure 23 are sequentially connected by transmission.

[0045] The chip and tray transport mechanism 30 is disposed above the tray mechanism 20 and the testing mechanism 10. The chip and tray transport mechanism 30 is used to transport chips from the tray mechanism 20 to the testing mechanism 10, and is also used to transport empty trays.

[0046] The testing chamber 10 is mainly used for functional testing of chips, such as electrical testing and high-temperature testing. When the chip is placed in the testing chamber, the chip is electrically connected to the testing chamber 10, and the chip can then be tested through the testing chamber 10.

[0047] The tray mechanism 20 is used to place stacked trays (hereinafter referred to as stacked trays), and the stacked trays can be lifted and lowered when the first lifting component 21 is working, and can also be translated when the first translation component 22 is working. Specifically, after all the trays on the tray mechanism 20 are used up, the tray support structure 23 is empty. At this time, the tray support structure 23 can be pulled out by the first translation component 22, and the operator places the tray to be tested (containing chips) into the tray support structure 23, and then pushes the tray support structure 23 back in by the first translation component 22 for the first lifting component 21 to lift and lower. After the chips in the tray at the top of the stacked trays are used up, the trays can be moved away by the chip and tray transport mechanism 30, and the first lifting component 21 drives the stacked trays to rise to a predetermined position for the next chip retrieval.

[0048] The chip and tray transport mechanism 30 is used to transport chips and trays, specifically to transport chips from the tray mechanism 20 to the testing mechanism 10, and also to transport empty trays. After all the chips in the tray at the top of the tray mechanism 20 have been used up, the chip and tray transport mechanism 30 will transfer the empty tray.

[0049] When the chip testing equipment is in operation, the stacked trays are first placed on the tray support structure 23. The first lifting component 21 raises the tray support structure 23, and when the top tray reaches a predetermined position, the chip and tray transport mechanism 30 transports the chips from the tray mechanism 20 to the testing mechanism 10. After testing in the testing mechanism 10, good products are selected, and the chip and tray transport mechanism 30 transports the good products to a predetermined position. Then, defective products are transported to a predetermined position. When the top tray is empty, the chip and tray transport mechanism 30 moves the empty tray to a predetermined position, and then the first lifting component 21 raises the tray support structure 23, raising the top tray to a predetermined position. This process is repeated.

[0050] The chip testing equipment in the above embodiments includes a testing mechanism 10, a tray mechanism 20, and a chip and tray transport mechanism 30. The chip and tray transport mechanism 30 can transport chips from the chip feeding station 203 of the tray mechanism 20 to the testing mechanism 10 for testing. Simultaneously, it can transport empty trays to the chip feeding station 203 or remove used empty trays, eliminating the need for manual handling of empty trays and improving automation. Furthermore, the equipment structure is relatively simple. The tray mechanism 20 includes a first lifting component 21, a first translation component 22, and a tray support structure 23 connected in sequence. After the top tray is no longer in use and is removed, the tray support structure 23 can be raised to allow the next layer of trays to be used. Additionally, the first translation component 22 can move the tray support structure 23 out, allowing workers to remove or place stacked trays, further improving the automation level of the chip testing equipment.

[0051] In some embodiments of the present invention, please refer to Figure 1 and Figure 2 There are two tray mechanisms 20, with the tops of the two tray mechanisms 20 being a chip feeding station 203 and a good chip placement station 201, respectively. The tray mechanisms 20 are used to move the chips in the trays at the chip feeding station 203 to the testing unit 10. After testing, the good chips are moved to the trays at the good chip placement station 201 by the chip and tray transport mechanism 30. The tray mechanism 20 corresponding to the chip feeding station 203 is the third tray mechanism 20, and the tray mechanism 20 corresponding to the good chip placement station 201 is the first tray mechanism 20. The tray at the chip feeding station 203 is used to provide chips to be tested, and the tray at the good chip placement station 201 is used to place good chips.

[0052] When the chip testing equipment is working, the stacked trays are first placed on the tray support structure 23 of the third tray mechanism 20. The first lifting component 21 raises the tray support structure 23, so that the top tray rises to the chip feeding station 203. The chip and tray transport mechanism 30 then transports the chips from the chip feeding station 203 to the testing mechanism 10. After testing by the testing mechanism 10, good products are selected, and the chip and tray transport mechanism 30 transports the good products to the good product placement station 201. Then, defective products are transported to a predetermined position. When the tray at the chip feeding station 203 is empty, the chip and tray transport mechanism 30 moves the empty tray to a predetermined position. Then, the first lifting component 21 of the third tray mechanism 20 raises the tray support structure 23, so that the top tray rises to the chip feeding station 203. The above operation is repeated. After the tray at the good product placement station 201 is full, the first lifting component 21 of the first tray mechanism 20 lowers the tray support structure 23, and then places the empty tray at the good product placement station 201, so that subsequent good chips can be received.

[0053] In some embodiments of the present invention, please refer to Figure 1 and Figure 2 There are four tray mechanisms 20. The tops of the four tray mechanisms 20 are respectively a good product placement station 201, a tray feeding station 202, a chip feeding station 203, and a tray storage station 204. The tray mechanisms 20 are used to move the chips in the trays on the feeding station to the testing unit 10. After the trays on the feeding station are empty, the empty trays are moved to the tray storage station 204 by the chip and tray transport mechanism 30. After the test is completed, the good chips are moved to the trays on the good product placement station 201 by the chip and tray transport mechanism 30. After the trays on the good product placement station 201 are full of chips, the trays on the tray feeding station 202 are moved to the good product placement station 201 by the chip and tray transport mechanism 30. The tray mechanism 20 at the good product placement station 201 is the first tray mechanism 20, the tray mechanism 20 at the tray feeding station 202 is the second tray mechanism 20, the tray mechanism 20 at the chip feeding station 203 is the third tray mechanism 20, and the tray structure at the tray collection station 204 is the fourth tray mechanism 20. The tray at the good product placement station 201 is used to collect good chips, the tray at the tray feeding station 202 is used to supply empty trays to the good product placement station 201, the tray at the chip feeding station 203 is used to supply chips to be tested to the testing unit 10, and the tray collection station 204 is used to collect empty trays after the chip feeding station 203 has been used.

[0054] When the chip testing equipment is working, the stacked trays are first placed on the tray support structure 23 of the third tray mechanism 20. The first lifting component 21 raises the tray support structure 23, so that the top tray rises to the chip feeding station 203. The chip and tray transport mechanism 30 then transports the chips from the chip feeding station 203 to the testing mechanism 10. After testing by the testing mechanism 10, good products are selected, and the chip and tray transport mechanism 30 transports the good products to the good product placement station 201. Then, the defective products are transported to the predetermined position. When the tray at the chip feeding station 203 is empty, the chip and tray transport mechanism 30 moves the empty tray to the tray storage station 204. Then, the first lifting component 21 of the third tray mechanism 20 raises the tray support structure 23, so that the top tray rises to the chip feeding station 203. The above operation is repeated. After the tray at the good product placement station 201 is full, the first lifting component 21 of the first tray mechanism 20 lowers the tray support structure 23, and then places the empty tray at the good product placement station 201 from the tray feeding station 202, so that subsequent good chips can be received.

[0055] The first tray mechanism 20 is used to hold trays containing good-quality chips. After the trays in the first tray mechanism 20 are full, the first translation component 22 can be controlled to pull out the tray support structure 23 of the first tray mechanism 20, remove the stacked trays, and then push the tray support structure 23 back in. The second tray mechanism 20 is used to hold empty trays. After the trays in the second tray mechanism 20 are used up, the first translation component 22 can be controlled to pull out the tray support structure 23 of the first tray mechanism 20, place the empty stacked trays, and then push the tray support structure 23 back in. The third tray mechanism 20 is used to hold trays filled with chips to be tested. After the trays in the third tray mechanism 20 are used up, the first translation component 22 can be controlled to pull out the tray support structure 23 of the first tray mechanism 20, place the stacked trays filled with chips, and then push the tray support structure 23 back in. The fourth tray mechanism 20 is used to collect empty trays. After the trays in the fourth tray mechanism 20 are full, the first translation component 22 can be controlled to pull out the tray support structure 23 of the first tray mechanism 20, remove the empty stacked trays, and then push the tray support structure 23 back in.

[0056] The tray mechanism 20 has a working state and a loading / unloading state. When the tray support structure 23 is pushed in, the tray mechanism 20 is in the working state. When the tray support structure 23 is pulled out, the tray mechanism 20 is in the loading / unloading state.

[0057] In some embodiments of the present invention, the chip testing equipment includes a control device, and each tray mechanism 20, testing mechanism 10, and chip and tray transport mechanism 30 are electrically connected to the control device, which controls the movement displacement, stroke, etc. of each mechanism.

[0058] In some embodiments of the present invention, the chip testing equipment further includes a defective product placement station 411 for placing the screened defective products. The defective product placement station 411 includes a first-good product area, a second-good product area, etc. Different second-good product areas hold chips of different good grades, which can be shipped or scrapped as needed.

[0059] In some embodiments of the present invention, please refer to Figure 1 Four tray mechanisms 20 are arranged at intervals along a first direction, such that the good product placement station 201, the tray feeding station 202, the chip feeding station 203, and the tray receiving station 204 are arranged sequentially along the first direction. The first direction is a horizontal direction, and its specific direction is not limited here.

[0060] The adjacent arrangement of the good product placement station 201 and the tray feeding station 202 shortens the travel distance of empty trays to the good product placement station 201, improving work efficiency. Similarly, the adjacent arrangement of the chip feeding station 203 and the tray receiving station 204 shortens the travel distance of empty trays after chip removal to the tray receiving station 204, further improving work efficiency. The good product placement station 201 is located at the outermost edge of the four stations, preventing chips from falling and colliding with them during transport.

[0061] In some embodiments, the motion output direction of the first translation component 22 is the second direction, so that the tray support structure 23 moves in the second direction and will not interfere with the adjacent tray mechanism 20.

[0062] In some embodiments of the present invention, please refer to Figure 3 and Figure 4 The first lifting assembly 21 includes a lifting motor 211, a first lead screw 212, a first nut block 213, a lifting bracket 214, and a fixed bracket 215. The motion output end of the lifting motor 211 is fixedly connected to the first lead screw 212. The first nut block 213 is threadedly connected to the first lead screw 212. The lifting bracket 214 is fixedly connected to the first nut block 213. The fixed bracket 215 is fixedly installed, and the lifting motor 211 is fixed to the fixed bracket 215. The fixed bracket 215 includes a first support plate 2151, a second support plate 2152, and a fixed column 2153 connecting the first support plate 2151 and the second support plate 2152. The two ends of the first lead screw 212 are rotatably supported on the first support plate 2151 and the second support plate 2152, respectively. The lifting motor 211 is fixedly connected to the first support plate 2151 through a motor connecting column 216. The first translation assembly 22 is fixed to the second support plate 2152.

[0063] The lifting motor 211 is capable of outputting rotational motion, and the outer periphery of the first lead screw 212 has external threads that engage with the first nut block 213. The lifting motor 211 is fixedly connected to the first support plate 2151 of the fixed bracket 215 via the motor connecting column 216, and the two ends of the first lead screw 212 are supported by the first support plate 2151 and the second support plate 2152, respectively. During operation, the lifting motor 211 operates, and the first lead screw 212 rotates under the drive of the lifting motor 211, thereby causing the first nut block 213 to move vertically up and down. The first nut block 213 moves synchronously with the lifting bracket 214.

[0064] The lifting bracket 214 moves up and down through the cooperation of the first lead screw 212 and the first nut block 213, thereby enabling the material tray support structure 23 to move up and down. The fixed bracket 215 provides more stable support for the first lead screw 212, making its rotation more stable.

[0065] In some embodiments, the number of motor connecting posts 216 is multiple, and the multiple motor connecting posts 216 can be arranged around the motion output shaft of the lifting motor 211.

[0066] In some embodiments, the number of fixed supports 2153 is multiple, and the multiple fixed supports 2153 may be arranged around the first lead screw 212.

[0067] In some embodiments of the present invention, please refer to Figure 3 and Figure 4 The lifting bracket 214 includes a first lifting plate 2141, two spaced-apart second lifting plates 2142, and a lifting column 2143 connecting the first lifting plate 2141 and the second lifting plate 2142. The material tray support structure 23 is disposed between the two second lifting plates 2142. The lifting column 2143 passes through the second support plate 2152. The first lifting plate 2141 is fixedly connected to the first nut block 213. The second lifting plate 2142 is used to support the stacked material trays.

[0068] The second lifting plate 2142 is positioned above the first lifting plate 2141. Since multiple lifting columns 2143 pass through the second support plate 2152, the lifting bracket 214 can guide the first nut block 213, allowing the first nut block 213 and the lifting bracket 214 to move only in the vertical direction. In the working state, the stacked trays of the tray mechanism 20 are located within the tray support structure 23, supported by the two second lifting plates 2142. As the second lifting plates 2142 move up and down, they drive the stacked trays to rise and fall (at this time, the trays are not supported by the tray support structure 23). In the loading and unloading state, the second lifting plate 2142 is at its lowest point, and the trays are supported by the tray support structure 23. The first translation component 22 can push the tray support structure 23 and the trays in or out.

[0069] In some embodiments, there are multiple lifting columns 2143 arranged around the first nut block 213, which makes the up-and-down movement of the lifting bracket 214 more stable.

[0070] In some embodiments, the fixed support column 2153 is disposed through the first lifting plate 2141, thereby making the overall integrity of the lifting bracket 214 and the fixed support 215 stronger and the lifting movement of the lifting bracket 214 more stable.

[0071] In some embodiments, please refer to Figure 3 A second photoelectric baffle 3118 is fixedly installed on the lifting bracket 214, and two first photoelectric sensors 217 are fixedly installed on the fixed bracket 215. The two first photoelectric sensors 217 are located at the two extreme positions of the first photoelectric baffle 2144. When the lifting bracket 214 drives the first photoelectric baffle 2144 to trigger the first photoelectric sensor 217, it means that the lifting bracket 214 has reached the extreme position (there is no material tray or the material tray is full). It is necessary to control the first translation component 22 to pull out the material tray support structure 23, remove the material tray or put in a new material tray.

[0072] In some embodiments of the present invention, please refer to Figure 3The first translation component 22 includes a first translation motor 221, a second lead screw 222, a second nut block 223, and a translation slide rail 224. The motion output end of the first translation motor 221 is connected to the second lead screw 222. The second nut block 223 is threadedly connected to the second lead screw 222, and the sliding rod of the second nut block 223 is connected to the translation slide rail 224. The tray support structure 23 is fixed on the second nut block 223. Both the first translation motor 221 and the translation slide rail 224 are fixed to the second support plate 2152. Both ends of the second lead screw 222 are rotatably supported on the second support plate 2152. When the first translation motor 221 is working, the second lead screw 222 rotates, causing the second nut block 223 to move linearly along the translation slide rail 224, thereby driving the tray support structure 23 and the tray inside it to translate, realizing the pushing in and pulling out of the tray support structure 23.

[0073] In some embodiments of the present invention, please refer to Figure 3 The tray support structure 23 includes a support base plate 231 and a positioning upright plate 232. The positioning upright plate 232 is fixed to the support base plate 231. The support base plate 231 supports the trays, and the positioning upright plate 232 positions the sides of the stacked trays to ensure they are neatly stacked. The width of the support base plate 231 is less than the distance between the two second lifting plates 2142, allowing the second lifting plates 2142 to rise and fall without interfering with the support base plate 231 when the support base plate 231 is positioned between them.

[0074] In some embodiments, the number of positioning plates 232 is four, which are respectively connected to the four corners of the supporting base plate 231.

[0075] In some embodiments of the present invention, please refer to Figure 5 The testing mechanism 10 includes a second translation component 11, a second lifting component 12, and a top cover component 13 connected in sequence, and a testing base 15 with a testing cavity. The top cover component 13 is used to cooperate with the testing base 15 to press the chip. When the second translation component 11 is working, it outputs a horizontal translation movement, causing both the second lifting component 12 and the top cover component 13 to move horizontally. When the second lifting component 12 is working, it drives the top cover component 13 to move up and down. When the chip needs to be tested, the second translation component 11 moves the top cover component 13 away from the testing base 15. The chip and tray transport mechanism 30 transports the chip to the testing base 15. Then, the second translation component 11 moves the top cover component 13 directly above the testing base 15, and the second lifting component 12 moves the top cover component 13 down to press the chip, thereby testing the chip.

[0076] It should be noted that the specific structure and testing principle of the top cover assembly 13 and the test base 15 will not be described in detail here, but can be any chip testing structure and testing principle in the prior art.

[0077] By setting the second translation component 11, the horizontal position of the upper cover component 13 can be changed, thereby facilitating the chip and tray transport mechanism 30 to transport the chip to the test base 15.

[0078] In some embodiments, the second translation component 11 and the second lifting component 12 are both cylinder components, which have a relatively simple structure.

[0079] In some embodiments, a control plate 14 is fixedly provided on the second lifting assembly 12, and the control plate 14 is used to control the intensity of the light source in the upper cover assembly 13, etc.

[0080] In some embodiments of the present invention, please refer to Figure 1 and Figure 2 The number of tray mechanisms 20 and testing mechanisms 10 is the same, and they are arranged sequentially at intervals along the first direction. The first translation component 22 and the second translation component 11 both output movement in the second direction, which are perpendicular to each other. Because multiple tray mechanisms 20 are arranged along the first direction, the extended tray support structure 23 will not interfere with adjacent tray mechanisms 20 when the first translation component 22 moves in the second direction. Similarly, because multiple testing mechanisms 10 are arranged along the first direction, the second translation component 11 will not interfere with adjacent testing mechanisms 10 when moving in the second direction.

[0081] The tray mechanism 20 and the testing mechanism 10 are arranged in the second direction, and multiple tray mechanisms 20 and multiple testing mechanisms 10 can be set up one-to-one, which can save space in the second direction and make the chip testing equipment more miniaturized.

[0082] In some embodiments of the present invention, please refer to Figure 1 and Figure 2 The chip testing equipment also includes a test rack 40, which has a worktable 41 and a top plate 42 disposed above the worktable 41. The chip and tray conveying mechanism 30 is fixed to the lower side of the top plate 42, the tray mechanism 20 is fixed to the lower side of the worktable 41, and the worktable 41 has a tray clearance opening for the tray exposed on the tray mechanism 20. The testing mechanism 10 is fixed to the upper side of the worktable 41.

[0083] By setting up the test rack 40, the chip and tray handling mechanism 30, the tray mechanism 20 and the test mechanism 10 are integrated into a single structure, making it easier to install, maintain and move.

[0084] In some embodiments, the test frame 40 has loading and unloading ports 43, which allow the tray support structure 23 to extend from the loading and unloading ports 43.

[0085] In some embodiments, in the tray mechanism 20, the second support plate 2152 is fixed to the lower side of the worktable 41 by connecting pillars 24, and there are multiple connecting pillars 24, so that the tray mechanism 20 is stably installed on the lower side of the worktable 41. In the testing mechanism 10, the testing base 15 and the second translation component 11 are both fixed to the upper side of the worktable 41. In the chip and tray handling mechanism 30, the first moving module 31 is fixed to the lower side of the top plate 42.

[0086] In some embodiments of the present invention, please refer to Figure 6 The chip and tray handling mechanism 30 includes a first moving module 31, a second moving module 32, a third moving module 33, and a suction nozzle assembly 34 connected in sequence. The first moving module 31 is used to output movement in a first direction, the second moving module 32 is used to output movement in a second direction, and the third moving module 33 is used to output movement in the vertical direction. The suction nozzle assembly 34 is used to pick up and put in chips and trays. The first direction, the second direction, and the vertical direction are arranged perpendicularly to each other. At least one of the first moving module 31 and the second moving module 32 includes a linear drive motor 311 capable of outputting linear motion.

[0087] The first moving module 31 has a motion output end, the motion direction of which is a first direction, and the first moving module 31 is used to drive the nozzle assembly 34 to move in the first direction. When the first moving module 31 is working, it drives the second moving module 32, the third moving module 33 and the nozzle assembly 34 to move simultaneously in the first direction.

[0088] The second moving module 32 has a motion output end, the motion direction of which is the second direction, and the second moving module 32 is used to drive the nozzle assembly 34 to move in the second direction. When the second moving module 32 is working, it drives the third moving module 33 and the nozzle assembly 34 to move simultaneously in the second direction.

[0089] The third moving module 33 has a motion output end, the motion direction of which is vertical, and the second moving module 32 is used to drive the nozzle assembly 34 to move in the vertical direction.

[0090] The first direction, the second direction, and the vertical direction are intersecting in pairs, meaning that neither the first direction nor the second direction is vertical, and the first direction and the second direction are not the same. Through the cooperation of the first moving module 31, the second moving module 32, and the third moving module 33, the suction nozzle assembly 34 can be moved to any position in the preset space.

[0091] The linear drive motor 311 can directly convert electrical energy into linear motion mechanical energy without any intermediate conversion mechanism or transmission device. Also known as a linear motor, linear actuator, or pushrod motor, its working principle is primarily based on the Lorentz force, that is, the force exerted on a current-carrying conductor in a magnetic field, causing it to move. Specifically, when current is passed through the primary winding of the linear drive motor 311 (equivalent to the stator 3114 of a rotary motor), a traveling wave magnetic field is generated in the air gap between the primary and secondary windings. The driving force is generated under the action of the traveling wave magnetic field and the secondary permanent magnet, thereby achieving the linear motion of the moving parts. The linear drive motor 311 is relatively stable, has fewer parts, and operates with less noise.

[0092] At least one of the first moving module 31 and the second moving module 32 includes a linear drive motor 311. The linear drive motor 311 can directly convert electrical energy into linear motion mechanical energy without any intermediate conversion mechanism. Therefore, the hardware structure of the first moving module 31 and the second moving module 32 can be reduced, the maintenance cost can be reduced, and the linear motor moves smoothly with less vibration.

[0093] In some embodiments of the present invention, please refer to Figures 7 to 9 The linear drive motor 311 includes a fixed base 3111, a plurality of stators 3114 arranged sequentially along the output direction of the linear drive motor 311, a mover 3115 that moves linearly relative to the stators 3114, a first sliding structure 3113, and a first slide rail 3112. The magnetic poles of adjacent stators 3114 are opposite in direction. The mover 3115 is an energized coil. The stators 3114 are fixed to the fixed base 3111. The first sliding structure 3113 is fixedly connected to the mover 3115 and is slidably disposed on the first slide rail 3112.

[0094] The fixed base 3111 is the basic structure of the linear drive motor 311. Functional components of the linear drive motor 311, such as the stator 3114, can all be mounted on the fixed base 3111. The fixed base 3111 can be an integral structure or a structure in which multiple parts are fixedly connected to each other. The specific structure and shape of the fixed base 3111 are not limited here.

[0095] The stator 3114 is a magnet, and the arrangement direction of the multiple stators 3114 is the same as the output direction of the linear drive motor 311. When the first moving module 31 includes the linear drive motor 311, the output direction of the linear drive motor 311 is the first direction, and the multiple stators 3114 are arranged sequentially along the first direction. The magnetic pole direction of the stator 3114 is parallel to the second direction. For example, one stator 3114 has a first end with an N pole and a second end with an S pole along the second direction, and the adjacent stator 3114 has a first end with an S pole and a second end with an N pole along the second direction. When the second moving module 32 includes the linear drive motor 311, the output direction of the linear drive motor 311 is the second direction, and the multiple stators 3114 are arranged sequentially along the second direction. The magnetic pole direction of the stator 3114 is parallel to the first direction. For example, one stator 3114 has a first end with an N pole and a second end with an S pole along the first direction, and the adjacent stator 3114 has a first end with an S pole and a second end with an N pole along the first direction.

[0096] The mover 3115 is an energized coil and is located adjacent to the stator 3114. When energized, the mover 3115 generates a changing magnetic field, which interacts with the magnetic field of the stator 3114 to create a pushing force on the mover 3115, causing it to move along a first direction or a second direction. The driving principle of the linear drive motor 311 can be found in the principles of current linear motors, and will not be elaborated upon here.

[0097] When the mover 3115 moves, the mover 3115 drives the first sliding structure 3113 to move on the first slide rail 3112, so that the mover 3115 is restricted by the first slide rail 3112 and maintains linear motion.

[0098] When the first moving module 31 includes a linear drive motor 311, the length direction of the first slide rail 3112 is the first direction; when the second moving module 32 includes a linear drive motor 311, the length direction of the first slide rail 3112 is the second direction.

[0099] By setting multiple alternating magnetic poles in the stator 3114 and the moving part 3115 with an energized coil, the first sliding structure 3113 slides on the first slide rail 3112, which can directly convert electrical energy into linear motion mechanical energy without the need for an intermediate transmission mechanism (to convert rotational motion into linear motion), and the number of parts is relatively small.

[0100] In some embodiments, please refer to Figures 7 to 9 The stator 3114 has connection holes on both sides. Screws and other fasteners pass through the connection holes and connect to the fixed base 3111, thereby fixing the stator 3114 to the fixed base 3111.

[0101] In some embodiments, please refer to Figures 7 to 9The first sliding structure 3113 includes a connecting block 31132 and a first slider 31131. The connecting block 31132 is used to fix the first slider 31131 and the next moving module, and the first slider 31131 is used to slide in cooperation with the first slide rail 3112. For example, in the first moving module 31, the connecting block 31132 is used to fix the first slider 31131 and the fixed seat of the second moving module 32; in the second moving module 32, the connecting block 31132 is used to fix the first slider 31131 and the fixed part of the third moving module 33.

[0102] Optionally, the first slider 31131 and the first slide rail 3112 can be standard parts, which do not require redesign and can reduce design and production costs.

[0103] Optionally, there are two first slide rails 3112, and correspondingly, there are an even number of first sliders 31131. The same number of first sliders 31131 can be set on each first slide rail 3112, so that the first sliding structure 3113 is more stable when sliding relative to the first slide rail 3112.

[0104] Optionally, the cross-section of the connecting block 31132 is U-shaped, the bottom of the U-shape of the connecting block 31132 can be fixedly connected to the first slider 31131, and the two tops of the U-shape of the connecting block 31132 are fixedly connected to the next moving module.

[0105] In some embodiments, please refer to Figures 7 to 9 The linear drive motor 311 also includes a dust cover 3119, which is placed on the fixed base 3111 and can cover the internal structure of the linear drive motor 311 (such as stator 3114, mover 3115, first slider 31131, first slide rail 3112, etc.) to prevent dust.

[0106] Optionally, the fixed base 3111 has upright plates 31111 at both ends, so that the interior of the fixed base 3111 forms a receiving space to accommodate the stator 3114, the mover 3115, the first slider 31131, the first slide rail 3112 and other structures. The dust cover 3119 is fixed to the two upright plates 31111 at both ends, which can reduce dust falling into the interior of the fixed base 3111.

[0107] In some embodiments of the present invention, please refer to Figure 8 and Figure 9The linear drive motor 311 also includes a second photoelectric sensor 3117 fixed to the fixed base 3111, a second photoelectric baffle 3118 fixed to the first sliding structure 3113, a scale grating fixed to the fixed base 3111, and a grating reading head 3116 fixed to the first sliding structure 3113. The second photoelectric baffle 3118 is used to trigger the second photoelectric sensor 3117, and the grating reading head 3116 cooperates with the scale grating to obtain the displacement of the first sliding structure 3113.

[0108] The second photoelectric sensor 3117 is fixedly installed, and the second photoelectric baffle 3118 moves synchronously with the first sliding structure 3113. The second photoelectric sensor 3117 can convert light signals into electrical signals. When the second photoelectric sensor 3117 is blocked by the second photoelectric baffle 3118, the second photoelectric sensor 3117 is triggered. The trigger signal can be transmitted to the controller, and the controller sends a control signal to control the start and stop of the linear drive motor 311.

[0109] The scale grating is fixedly installed, and the grating reading head 3116 moves synchronously with the first sliding structure 3113. The scale grating and the grating reading head 3116 are collectively referred to as a grating ruler, also known as a grating ruler displacement sensor (grating ruler sensor), which is a measurement feedback device that works using the optical principle of a grating. Through the cooperation of the scale grating and the grating reading head 3116, the position of the first sliding structure 3113 can be measured in real time.

[0110] By setting the second photoelectric sensor 3117 and the grating ruler, the start and stop of the linear drive motor 311 can be controlled to prevent the linear drive motor 311 from malfunctioning and exceeding the preset stroke during operation. By setting the scale grating and the grating reading head 3116, the position of the first sliding structure 3113 can be detected, realizing automatic control of the position of the suction nozzle assembly 34.

[0111] In some embodiments, a second photoelectric sensor 3117 is provided at both ends of the fixed base 3111. When the second photoelectric baffle 3118 moves to block the second photoelectric sensor 3117, that is, when the first sliding structure 3113 has moved to the limit position, the second photoelectric sensor 3117 is triggered. After the trigger signal is transmitted to the controller, the controller controls the linear drive motor 311 to stop moving to prevent the first sliding structure 3113 from colliding with the fixed base 3111.

[0112] Optionally, the first sliding structure 3113 has an initial position, and a second photoelectric sensor 3117 is provided at the initial position to detect whether the first sliding structure 3113 has returned to the initial position.

[0113] In some embodiments of the present invention, please refer to Figure 7 and Figure 9The linear drive motor 311 also includes buffer members 31112 fixed to both ends of the fixed base 3111. The buffer members 31112 are deformable structures under stress, used to reduce the impact on the first sliding structure 3113. If a malfunction occurs after the first sliding structure 3113 has moved to its limit position, the first sliding structure 3113 will continue to move and collide with the buffer members 31112.

[0114] The buffer 31112 can buffer the impact force when the first sliding structure 3113 collides with the fixed base 3111, so as to avoid damage to the first sliding structure 3113 and the fixed base 3111.

[0115] In some embodiments, the buffer 31112 is made of sponge, rubber, silicone, etc.

[0116] In some embodiments of the present invention, please refer to Figure 7 The first moving module 31 includes a linear drive motor 311 and an auxiliary mechanism 312. The auxiliary mechanism 312 includes an auxiliary fixed base 3121, an auxiliary slide rail 3122 parallel to the first slide rail 3112, and an auxiliary slider 3123 slidably disposed on the auxiliary slide rail 3122. The second moving module 32 includes a linear drive motor 311. The first sliding structure 3113 and the auxiliary slider 3123 of the first moving module 31 are both fixedly connected to the fixed base 3111 of the second moving module 32.

[0117] The auxiliary mechanism 312 is used to assist the motion output of the first moving module 31, making the transport output of the first moving module 31 in the first direction more stable. The auxiliary mechanism 312 includes an auxiliary fixed base 3121, an auxiliary slide rail 3122, and an auxiliary slider 3123. The auxiliary fixed base 3121 is a fixed structure, the auxiliary slide rail 3122 is fixed on the auxiliary fixed base 3121, and the auxiliary slider 3123 is slidably disposed on the auxiliary slide rail 3122.

[0118] By fixing the first sliding structure 3113 of the first moving module 31 and the auxiliary slider 3123 of the auxiliary mechanism 312 to the fixed base 3111 of the second moving module 32, the first sliding structure 3113 and the auxiliary slider 3123 of the first moving module 31 can move synchronously. Even if the length of the second moving module 32 in the second direction is long, it can be stably connected to the second moving module 32, making the motion output of the first moving module 31 in the first direction more stable.

[0119] In some embodiments of the present invention, please refer to Figure 10 and Figure 11The third moving module 33 includes a fixed plate 333, a first stroke component 331 and a second stroke component 332 fixed to the fixed plate 333. Both the first stroke component 331 and the second stroke component 332 can output linear motion, and the first stroke component 331, the second stroke component 332 and the suction nozzle component 34 are sequentially connected by transmission. The second stroke component 332 includes a cylinder 3321 and a solenoid valve 335. The solenoid valve 335 is connected to the air input end and the air output end of the cylinder 3321 respectively.

[0120] The fixed plate 333 serves as the fixing and mounting structure for the third moving module 33. The first stroke component 331 and the second stroke component 332 are both mounted on the fixed plate 333. The fixed plate 333 is fixedly connected to the motion output structure of the second moving module 32 (such as the first sliding structure 3113 of the second moving module 32). The first stroke component 331, the second stroke component 332, and the nozzle component 34 are sequentially connected, meaning that when the first stroke component 331 is working, the second stroke component 332 and the nozzle component 34 move up and down simultaneously; when the second stroke component 332 is working, the nozzle component 34 moves up and down. When adjusting the height of the nozzle component 34, the first stroke component 331 is used for initial adjustment, and then the second stroke component 332 is used for fine adjustment. In the second stroke assembly 332, the cylinder 3321 is a mechanism for driving the nozzle assembly 34 to move up and down, and the solenoid valve 335 is an air circuit switch. When the solenoid valve 335 is open, it can provide airflow to the cylinder 3321 to drive the nozzle assembly 34 to move up and down. Specifically, when the nozzle assembly 34 descends, air is input into the cylinder 3321 from the air circuit input end through the solenoid valve 335 to generate positive pressure; when the nozzle assembly 34 rises, air is output from the cylinder 3321 to the solenoid valve 335 from the air circuit output end.

[0121] The height of the nozzle assembly 34 is initially adjusted by the first stroke component 331, and then precisely adjusted by the second stroke component 332, making the height adjustment of the nozzle assembly 34 more accurate. Furthermore, the second stroke component 332 is controlled by the cylinder 3321, which minimizes the impact on the material tray or chip when the nozzle assembly 34 moves downwards to pick up the material tray or chip, thus preventing damage to the material tray or chip.

[0122] In some embodiments of the present invention, please refer to Figure 10 and Figure 11The cylinder 3321 has a first regulating element at its air inlet for adjusting the intake air flow and a second regulating element at its air outlet for adjusting the outlet air flow. When the nozzle assembly 34 descends, gas is input into the cylinder 3321 from the air inlet via the solenoid valve 335. Adjusting the first regulating element adjusts the intake air flow at the air inlet; a higher intake air flow results in a faster descent of the nozzle assembly 34, while a lower flow results in a slower descent. When the nozzle assembly 34 ascends, air from inside the cylinder 3321 is output to the solenoid valve 335 via the air outlet. Adjusting the second regulating element adjusts the outlet air flow; a higher outlet air flow results in a faster ascent of the nozzle assembly 34, while a lower flow results in a slower ascent. In essence, the first regulating element adjusts the descent speed of the nozzle assembly 34, and the second regulating element adjusts the ascent speed.

[0123] The descent speed and ascent speed of the nozzle assembly 34 can be adjusted by setting the first and second adjustment components, respectively.

[0124] In some embodiments, the first adjusting element is an adjusting screw, and the intake airflow can be adjusted by rotating the first adjusting element.

[0125] In some embodiments, the second adjusting member is an adjusting screw, and the air flow rate can be adjusted by rotating the second adjusting member.

[0126] In some embodiments of the present invention, please refer to Figure 10 and Figure 11 The first stroke assembly 331 includes a third motor 3311 capable of outputting rotary motion, a third lead screw 3312 connected to the third motor 3311, a third nut block threadedly connected to the third lead screw 3312, a second sliding structure 3314 fixedly connected to the third nut block, and a second slide rail 3315. The second sliding structure 3314 is slidably disposed on the second slide rail 3315, and the cylinder 3321 is fixed to the second sliding structure 3314.

[0127] The third motor 3311 is the power mechanism. The rotational motion of the third motor 3311 drives the rotation of the third lead screw 3312. The rotational motion of the third lead screw 3312 is converted into linear motion of the third nut block along the length direction of the second slide rail 3315. The third nut block is fixedly connected to the second sliding structure 3314. Therefore, the second sliding structure 3314 also moves along the length direction of the second slide rail 3315, thereby driving the cylinder 3321 and the suction nozzle assembly 34 to move. It should be noted that the length direction of the second slide rail 3315 is vertical, and the movement of the second sliding structure 3314 and the third nut block is also vertical.

[0128] The first stroke component 331 is a lead screw assembly, which has high motion accuracy and runs smoothly.

[0129] In some embodiments, the second sliding structure 3314 includes a second slider and a mounting plate that are fixedly connected. The second slider is slidably connected to the second slide rail 3315, and the mounting plate is used to connect the second slider and the second stroke assembly 332.

[0130] Optionally, there are two second slide rails 3315 and two or more second sliders, with at least one second slider on each second slide rail 3315. By setting two second slide rails 3315, the vertical movement of the second sliding structure 3314 and the third nut block is made more stable.

[0131] In some embodiments of the present invention, please refer to Figure 10 and Figure 11 The nozzle assembly 34 includes a first nozzle 341 disposed on the first side of the fixing plate 333 and a second nozzle 342 disposed on the second side of the fixing plate 333. The first nozzle 341 is used to pick up chips, and the second nozzle 342 is used to pick up trays. Thus, the conveying device can pick up both chips and trays.

[0132] In some embodiments of the present invention, please refer to Figure 10 and Figure 11 The fixing plate 333 has a first side and a second side arranged opposite to each other. There are two first stroke components 331, which are fixed to the first side and the second side of the fixing plate 333 respectively. There are two second stroke components 332, which are fixed to the first side and the second side of the fixing plate 333 respectively. The suction nozzle assembly 34 includes a first suction nozzle 341 for adsorbing chips and a second suction nozzle 342 for adsorbing material trays. The second stroke component 332 located on the first side of the fixing plate 333 is connected to the first suction nozzle 341, and the second stroke component 332 located on the second side of the fixing plate 333 is connected to the second suction nozzle 342.

[0133] On the first side of the fixed plate 333, the first first stroke assembly 331, the first second stroke assembly 332, and the first suction nozzle 341 are sequentially connected by a transmission mechanism. The cooperation of the various components on the first side of the fixed plate 333 enables control over the lifting and lowering movement of the first suction nozzle 341. On the second side of the fixed plate 333, the second first stroke assembly 331, the second second stroke assembly 332, and the second suction nozzle 342 are sequentially connected by a transmission mechanism. The cooperation of the various components on the second side of the fixed plate 333 enables control over the lifting and lowering movement of the second suction nozzle 342.

[0134] In this embodiment, the first suction nozzle 341 and the second suction nozzle 342 are controlled separately by different first stroke components 331 and second stroke components 332, so the adsorption of the chip and the adsorption of the tray are independent of each other and do not affect each other.

[0135] In some embodiments, there are multiple first suction nozzles 341 and multiple second suction nozzles 342.

[0136] In some embodiments of the present invention, please refer to Figure 10 and Figure 11 The suction nozzle assembly 34 generates negative pressure through the vacuum generator 336. The vacuum generator 336 and the solenoid valve 335 are both fixed to the fixing plate 333, and both the vacuum generator 336 and the solenoid valve 335 are connected to the air source. A safety cover 334 is fixed on the fixing plate 333. The vacuum generator 336 and the solenoid valve 335 are both located inside the safety cover 334. Multiple air pipe connectors 3341 are fixed at the bottom of the safety cover 334. Some air pipe connectors 3341 are used to connect the vacuum generator 336 and the suction nozzle assembly 34, and some air pipe connectors 3341 are used to connect the solenoid valve 335 and the cylinder 3321.

[0137] The air source simultaneously provides air pressure to both the solenoid valve 335 and the vacuum generator 336. Specifically, the air source provides positive pressure to the solenoid valve 335 and negative pressure to the vacuum generator 336. The vacuum generator 336 is a device that generates negative pressure. The vacuum generator 336 is connected to the suction nozzle assembly 34, causing the suction nozzle assembly 34 to generate negative pressure, thereby adsorbing the material tray or chip. The air pipe connector 3341 used to connect the vacuum generator 336 and the suction nozzle assembly 34 is a first air pipe connector, with air pipes connected to both ends of the first air pipe connector. The two air pipes are respectively connected to the vacuum generator 336 and the suction nozzle assembly 34. The air pipe connector 3341 used to connect the solenoid valve 335 and the cylinder 3321 is a second air pipe connector, with air pipes connected to both ends of the second air pipe connector. The two air pipes are respectively connected to the solenoid valve 335 and the cylinder 3321.

[0138] The safety cover 334 serves two purposes: first, it protects the vacuum generator 336 and the solenoid valve 335; second, the safety cover 334 has multiple air pipe connectors 3341, and the pipes connecting to the solenoid valve 335 and the vacuum generator 336 all extend to the air pipe connectors 3341. The pipes of the cylinder 3321 and the suction assembly can be directly connected to the air pipe connectors 3341, thereby making the air pipes more neatly distributed and easier to install and maintain.

[0139] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A chip testing device, characterized in that, include: A testing facility having a test cavity for accommodating a chip, and the testing facility being used to test the chip; The tray mechanism includes a first lifting component capable of outputting lifting motion, a first translation component capable of outputting translation motion, and a tray support structure for stacking trays. The trays are used to hold multiple chips. The first lifting component, the first translation component, and the tray support structure are sequentially connected by transmission. A chip and tray transport mechanism is disposed above the tray mechanism and the testing mechanism. The chip and tray transport mechanism is used to transport the chip from the tray mechanism to the testing mechanism and to transport empty trays.

2. The chip testing equipment as described in claim 1, characterized in that, There are two material tray mechanisms, with the top of each material tray mechanism being a chip feeding station and a good product placement station, respectively. The material tray mechanism is used to move the chips in the material tray at the chip feeding station to the testing mechanism. After the testing is completed, the good chips are moved to the material tray at the good product placement station by the chip and material tray transport mechanism.

3. The chip testing equipment as described in claim 1, characterized in that, The number of tray mechanisms is four, and the tops of the four tray mechanisms are respectively a good product placement station, a tray feeding station, a chip feeding station, and a tray storage station. The tray mechanisms are used to move the chips in the trays at the feeding stations to the testing mechanism. When the trays at the feeding stations are empty, the empty trays are transported to the tray storage station by the chip and tray transport mechanism. After the test is completed, the good chips are moved to the trays at the good product placement station by the chip and tray transport mechanism. When the trays at the good product placement station are full of chips, the trays at the tray feeding station are moved to the good product placement station by the chip and tray transport mechanism.

4. The chip testing equipment as described in claim 3, characterized in that, The four tray mechanisms are arranged at intervals along the first direction, so that the good product placement station, the tray feeding station, the chip feeding station and the tray receiving station are arranged in sequence along the first direction.

5. The chip testing equipment as described in claim 1, characterized in that, The first lifting assembly includes a lifting motor, a first lead screw, a first nut block, a lifting bracket, and a fixed bracket. The motion output end of the lifting motor is fixedly connected to the first lead screw. The first nut block is threadedly connected to the first lead screw. The lifting bracket is fixedly connected to the first nut block. The fixed bracket is fixedly installed, and the lifting motor is fixed to the fixed bracket. The fixed bracket includes a first support plate, a second support plate, and a fixed column connecting the first support plate and the second support plate. The two ends of the first lead screw are rotatably supported on the first support plate and the second support plate, respectively. The lifting motor is fixedly connected to the first support plate through a motor connecting column. The first translation assembly is fixed to the second support plate.

6. The chip testing equipment as described in claim 5, characterized in that, The lifting bracket includes a first lifting plate, two spaced-apart second lifting plates, and a lifting column connecting the first lifting plate and the second lifting plates. The material tray support structure is disposed between the two second lifting plates. The lifting column passes through the second support plate. The first lifting plate is fixedly connected to the first nut block. The second lifting plate is used to support stacked material trays.

7. The chip testing equipment according to any one of claims 1-6, characterized in that, The testing mechanism includes a second translation component, a second lifting component, and a top cover component that are connected in sequence, and also includes a test base with the test cavity. The top cover component is used to cooperate with the test base to press the chip.

8. The chip testing equipment as described in claim 7, characterized in that, The testing mechanism includes a second translation component, a second lifting component, and a top cover component that are connected in sequence, and also includes a test base with the test cavity. The top cover component is used to cooperate with the test base to press the chip.

9. The chip testing equipment according to any one of claims 1-6, characterized in that, The chip and tray handling mechanism includes a first moving module, a second moving module, a third moving module, and a suction nozzle assembly connected in sequence. The first moving module is used to output movement in a first direction, the second moving module is used to output movement in a second direction, and the third moving module is used to output movement in a vertical direction. The suction nozzle assembly is used to pick up and put in chips and trays. The first direction, the second direction, and the vertical direction are arranged perpendicularly to each other. At least one of the first moving module and the second moving module includes a linear drive motor capable of outputting linear motion.

10. The chip testing equipment according to any one of claims 1-6, characterized in that, The chip testing equipment also includes a testing frame, which has a worktable and a top plate disposed above the worktable. The chip and tray transport mechanism is fixed to the lower side of the top plate, the tray mechanism is fixed to the lower side of the worktable, and the worktable has a tray clearance opening for the trays on the tray mechanism to be exposed. The testing mechanism is fixed to the upper side of the worktable.